JP2021002625A - Manufacturing method of package device chip - Google Patents

Abstract

To provide a manufacturing method of a package device chip capable of appropriately covering a side surface of a chip obtained by dividing a wafer.SOLUTION: A manufacturing method of a package device chip, comprises: making a cutting blade cut into a wafer having devices in a plurality of regions on the surface side partitioned by a planned division line to form a groove in the planned division line; attaching a resin sheet to the surface of the wafer such that the resin sheet is embedded in the groove to cover the front surface of the wafer with the resin sheet; grinding the back surface opposite to the front surface of the wafer to divide the wafer into a plurality of chips at the planned division line; exposing a portion embedded in the groove of the resin sheet to the back surface side; and cutting the resin sheet at the portion embedded by the groove.SELECTED DRAWING: Figure 2

Description

The present invention relates to a method for manufacturing a packaged device chip.

In recent years, a technique called WL-CSP (Wafer Level Chip Size Package), which performs packaging in the state of a wafer, has attracted attention. In WL-CSP, a plurality of devices formed on the surface side of the wafer are coated with a liquid resin, the liquid resin is cured, and then the wafer is cut together with the resin at a planned division line (street) to make each device. Obtain multiple packaged device chips corresponding to.

By the way, when a wafer whose surface side is coated with resin is cut together with resin along a planned division line, the side surface (cut surface of the wafer) of the chip cut out from the wafer is exposed. Therefore, before coating the surface side of the wafer with the liquid resin, a technique is used in which a groove is formed along the planned division line and the groove is also filled with the liquid resin to coat the side surface of the chip with the resin. It has been proposed (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2006-100535

However, in the above-mentioned technique, a groove is formed so as to traverse the entire wafer. Therefore, when the liquid resin is supplied to the groove, there is a high possibility that the liquid resin leaks from both ends of the groove. If the liquid resin leaks out of the groove, the amount of resin filled in the groove is insufficient, and the side surface of the chip cannot be sufficiently covered with the resin.

The present invention has been made in view of such problems, and an object of the present invention is to provide a method for manufacturing a package device chip capable of appropriately covering the side surface of the chip obtained by dividing a wafer. That is.

According to one aspect of the present invention, a cutting blade is cut from the surface side of a wafer having a device in a plurality of regions on the surface side partitioned by the planned division line to form a groove in the planned division line. A groove forming step, a coating step in which the resin sheet is attached to the surface of the wafer so as to embed a resin sheet in the groove, and the surface of the wafer is coated with the resin sheet, and the surface of the wafer. By grinding the back surface on the opposite side to thin the wafer, the wafer is divided into a plurality of chips at the planned division line, and the portion of the resin sheet embedded in the groove is exposed on the back surface side. A plurality of packages separated from each other by cutting the grinding step, the support member sticking step of sticking the support member to the wafer or the resin sheet whose back surface is ground, and the portion embedded in the groove. A method for manufacturing a packaged device chip including a resin sheet cutting step for forming a device chip is provided.

According to another aspect of the present invention, a cutting blade is cut from the surface side of a wafer having a device in a plurality of regions on the surface side partitioned by the planned division line, and a groove is formed in the planned division line. A groove forming step to be formed, a coating step in which the resin sheet is attached to the surface of the wafer so as to embed a resin sheet in the groove, and the surface of the wafer is coated with the resin sheet, and the resin sheet. A resin sheet cutting step for cutting the resin sheet at a portion embedded in the groove, a support member attaching step for attaching a support member to the surface of the resin sheet opposite to the wafer, and a side opposite to the surface of the wafer. By grinding the back surface of the wafer to make the wafer thinner, the wafer is divided into a plurality of chips at the planned division line, and the portion of the resin sheet embedded in the groove is exposed on the back surface side and separated from each other. A method for manufacturing a packaged device chip including a grinding step for forming a plurality of packaged device chips is provided.

According to still another aspect of the present invention, a grinding step of grinding the back surface of a wafer having devices in a plurality of regions on the front surface side partitioned by a planned division line on the opposite side to the front surface to thin the wafer. A support member attachment step of attaching a support member to the wafer whose back surface has been ground, and a wafer division step of cutting a cutting blade into the wafer and dividing the wafer into a plurality of chips on the planned division line. A coating step of attaching the resin sheet to the surface of the wafer so as to embed the resin sheet in the gap between two adjacent chips and covering the surface of the wafer with the resin sheet, and the resin sheet. A method of manufacturing a package device chip comprising a resin sheet cutting step of cutting at a portion embedded in a gap to form a plurality of package device chips separated from each other is provided.

The method for manufacturing a package device chip according to each aspect of the present invention is a resin sheet removing step of removing a part of the resin sheet covering the surface of the wafer to expose a part of the surface side of the wafer. May further be included.

In the method for manufacturing a packaged device chip according to each aspect of the present invention, there are two obtained by cutting a cutting blade into a groove formed by cutting a cutting blade into a planned dividing line of a wafer or by cutting a cutting blade into a planned dividing line of a wafer. A resin sheet is attached to the surface of the wafer so as to embed the resin sheet in the gap between the chips, and the resin sheet is cut at a portion embedded in the groove or a portion embedded in the gap.

Therefore, the side surface of the chip obtained by dividing the wafer can be appropriately covered with this resin sheet. That is, unlike the case where the groove or gap is filled with the liquid resin, the liquid resin does not leak from the groove or gap, so that the side surface of the chip obtained by dividing the wafer may be exposed. Can be kept low.

FIG. 1 (A) is a perspective view of the wafer, and FIG. 1 (B) is a cross-sectional view of the wafer. FIG. 2A is a cross-sectional view schematically showing how a groove is formed on the wafer, and FIG. 2B is a cross-sectional view schematically showing how a resin sheet is attached to the surface of the wafer. Is. FIG. 3A is a cross-sectional view schematically showing how the resin sheet is cured, and FIG. 3B is a cross-sectional view schematically showing how the back surface of the wafer is ground. FIG. 4A is a cross-sectional view schematically showing a state in which a dicing tape (support member) is attached to the wafer, and FIG. 4B is a cross-sectional view schematically showing a state in which the resin sheet is cut. It is a figure. It is sectional drawing which shows the state after the resin sheet is cut. FIG. 6A is a cross-sectional view schematically showing how the resin sheet is cut by the method for manufacturing the package device chip according to the first modification, and FIG. 6B is the first modification. It is sectional drawing which shows typically the state that the back surface of a wafer is ground by the manufacturing method of a package device chip. It is sectional drawing which shows the state after the wafer 11 was ground by the manufacturing method of the package device chip which concerns on 1st modification. FIG. 8A is a cross-sectional view schematically showing how the back surface of the wafer is ground by the method for manufacturing a package device chip according to a second modification, and FIG. 8B is a second modification. It is sectional drawing which shows the state after the wafer is ground by the manufacturing method of the package device chip. FIG. 9A is a cross-sectional view schematically showing how the wafer is divided into a plurality of chips, and FIG. 9B schematically shows how the resin sheet is attached to the surface of the wafer. It is a sectional view. FIG. 10 (A) is a cross-sectional view schematically showing how the resin sheet is cut by the method for manufacturing the package device chip according to the second modification, and FIG. 10 (B) shows the second modification. It is sectional drawing which shows the state after the resin sheet is cut by the manufacturing method of a package device chip.

Embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1A is a perspective view of a wafer 11 used in the method for manufacturing a package device chip according to the present embodiment, and FIG. 1B is a cross-sectional view of the wafer 11.

As shown in FIGS. 1A and 1B, the wafer 11 of the present embodiment is formed in a disk shape using, for example, a semiconductor material such as silicon, and the surface 11a and the surface 11a are Includes the back surface 11b on the opposite side. The surface 11a side of the wafer 11 is divided into a plurality of small regions by a plurality of intersecting scheduled division lines (streets) 13, and a device 15 such as an electronic circuit is formed in each small region.

In the present embodiment, a disk-shaped wafer 11 containing a semiconductor material such as silicon is used, but the material, shape, structure, size, etc. of the wafer 11 are not limited. For example, a substrate containing other materials such as semiconductors, ceramics, resins, and metals can be used as the wafer 11. Similarly, there are no restrictions on the type, quantity, shape, structure, size, arrangement, etc. of the device 15 included in the wafer 11.

In the method for manufacturing a package device chip according to the present embodiment, first, a cutting blade (first cutting blade) is cut into the wafer 11 from the surface 11a side to form a groove in the planned division line 13 (groove formation). Step). FIG. 2A is a cross-sectional view schematically showing how a groove 17 is formed in the wafer 11. In the present embodiment, the groove 17 is formed in the wafer 11 by using the cutting device 2 shown in FIG. 2 (A).

The cutting device 2 includes a chuck table 4 used for holding the wafer 11. The chuck table 4 includes, for example, a cylindrical frame body 6 made of a metal material typified by stainless steel, and a holding plate 8 formed of a porous material and arranged on the upper part of the frame body 6. The upper surface of the holding plate 8 serves as a holding surface 8a for holding the wafer 11.

The lower surface side of the holding plate 8 is connected to a suction source (not shown) via a flow path 6a or the like provided inside the frame body 6. A valve (not shown) for controlling the flow of fluid is provided in the flow path 6a or the like. Therefore, when the valve is opened, the negative pressure of the suction source is applied to the holding surface 8a to suck the wafer 11.

The frame body 6 is connected to a rotation drive source (not shown) such as a motor, and is rotated around a rotation axis substantially perpendicular to the holding surface 8a described above by the force generated by the rotation drive source. Further, the frame body 6 is supported by a moving mechanism (not shown) and moves in the first direction (machining feed direction) substantially parallel to the holding surface 8a described above.

A cutting unit 10 is arranged above the chuck table 4. The cutting unit 10 includes, for example, a tubular spindle housing (not shown). In the space inside the spindle housing, a spindle 12 which is a rotation axis substantially parallel to the holding surface 8a of the chuck table 4 and substantially perpendicular to the first direction is housed.

An annular cutting blade (first cutting blade) 14 formed by fixing abrasive grains such as diamond with a binder such as resin or metal is mounted on one end side of the spindle 12. A nozzle (not shown) for supplying a cutting liquid (typically water) to the wafer 11 and the cutting blade 14 is provided at a position adjacent to the cutting blade 14.

A rotary drive source (not shown) such as a motor is connected to the other end side of the spindle 12, and the cutting blade 14 mounted on one end side of the spindle 12 rotates by the force generated by the rotary drive source. The cutting unit 10 is supported by, for example, a moving mechanism (not shown), and is substantially parallel to the holding surface 8a of the chuck table 4 in the height direction substantially perpendicular to the holding surface 8a of the chuck table 4. Moves to the second direction (indexing feed direction), which is substantially perpendicular to the first direction.

When forming the groove 17 in the planned division line 13 of the wafer 11, first, the back surface 11b of the wafer 11 is brought into contact with the holding surface 8a of the chuck table 4. Then, the valve is opened to apply the negative pressure of the suction source to the holding surface 8a. As a result, the back surface 11b is attracted to the holding surface 8a, and the wafer 11 is held on the chuck table 4 with the front surface 11a side exposed upward. Before holding the wafer 11 on the chuck table 4, a protective member such as an adhesive tape may be attached to the back surface 11b of the wafer 11.

Next, the orientation of the chuck table 4 is adjusted so that the scheduled division line 13 to be machined and the first direction are parallel to each other. Then, the positional relationship between the chuck table 4 and the cutting unit 10 is adjusted so that the cutting blade 14 is positioned above the extension line of the planned division line 13.

Further, the height of the cutting unit 10 is adjusted so that the height of the lower end of the cutting blade 14 is lower than the height of the surface 11a of the wafer 11. More specifically, the height of the cutting unit 10 is set so that the height of the lower end of the cutting blade 14 is equal to or lower than the height of the back surface portion of the chip obtained by dividing the wafer 11. adjust. Further, the height of the cutting unit 10 is adjusted so that the height of the lower end of the cutting blade 14 is higher than the height of the back surface 11b of the wafer 11.

After that, the chuck table 4 is moved in the first direction while rotating the spindle 12. As a result, the rotating cutting blade 14 can be cut into the target division scheduled line 13 from the surface 11a side of the wafer 11, and a groove 17 having a depth that does not cut the wafer 11 can be formed. The groove 17 reaches a depth corresponding to the back surface of the chip obtained by dividing the wafer 11 (that is, a depth corresponding to the finishing thickness). After forming the groove 17 on the target division scheduled line 13, the groove 17 is formed on all the other scheduled division lines 13 in the same procedure.

After forming the groove 17 in the planned division line 13 of the wafer 11, a resin sheet is attached to the surface 11a of the wafer 11 so as to embed a resin sheet in the groove 17, and the resin sheet is used to attach the resin sheet to the surface 11a of the wafer 11. (Coating step). FIG. 2B is a cross-sectional view schematically showing how the resin sheet 19 is attached to the surface 11a of the wafer 11. In the present embodiment, the resin sheet 19 is attached to the wafer 11 by using the attachment device 22 shown in FIG. 2B.

The sticking device 22 includes a chuck table 24 used for holding the wafer 11. The configuration of the chuck table 24 may be the same as the configuration of the chuck table 4 provided in the cutting device 2. That is, the chuck table 24 includes a cylindrical frame body 26 made of a metal material typified by stainless steel, and a holding plate 28 formed of a porous material and arranged on the upper part of the frame body 26. The upper surface of the holding plate 28 serves as a holding surface 28a for holding the wafer 11.

The lower surface side of the holding plate 28 is connected to a suction source (not shown) via a flow path 26a or the like provided inside the frame body 26. A valve (not shown) for controlling the flow of fluid is provided in the flow path 26a or the like. Therefore, when the valve is opened, the negative pressure of the suction source is applied to the holding surface 28a to suck the wafer 11. Above the chuck table 24, for example, a press plate (not shown) made of a material that transmits ultraviolet rays is arranged. The lower surface of this press plate is generally flat.

When the resin sheet 19 is attached to the front surface 11a of the wafer 11, the back surface 11b of the wafer 11 is first brought into contact with the holding surface 28a of the chuck table 24. Then, the valve is opened to apply the negative pressure of the suction source to the holding surface 28a. As a result, the back surface 11b is attracted to the holding surface 28a, and the wafer 11 is held on the chuck table 24 with the front surface 11a side exposed upward. Before holding the wafer 11 on the chuck table 24, a protective member such as an adhesive tape may be attached to the back surface 11b of the wafer 11.

After that, the resin sheet 19 is attached to the surface 11a of the wafer 11. The resin sheet 19 contains, for example, a curable resin that is cured by ultraviolet rays or the like, and has high flexibility to the extent that it is embedded in the groove 17. On the other hand, the form of the resin sheet 19 is stable so that the resin sheet 19 does not flow out from the groove 17. That is, the fluidity of the resin sheet 19 is high enough to be embedded in the groove 17, and low enough not to flow out of the groove 17. As such a resin sheet 19, for example, DAF (Die Attach Film) can be used.

Specifically, for example, one surface 19a of the resin sheet 19 is brought into contact with the surface 11a of the wafer 11, and then the lower surface of the press plate is pressed against the other surface 19b of the resin sheet 19. As a result, the resin sheet 19 is attached to the surface 11a of the wafer 11. That is, the surface 11a of the wafer 11 is covered with the resin sheet 19. Further, a part of the resin sheet 19 is embedded in the groove 17 by the pressure from the press plate.

After covering the surface 11a of the wafer 11 with the resin sheet 19, the resin sheet 19 is cured (curing step). FIG. 3A is a cross-sectional view schematically showing how the resin sheet 19 is cured. In the present embodiment, the resin sheet 19 is cured by using the sticking device 22 described above.

For example, an ultraviolet light source (not shown) is arranged above the press plate. When the resin sheet 19 is irradiated with ultraviolet rays 21 from this ultraviolet light source via a press plate, the resin sheet 19 is cured. Since the lower surface of the press plate is generally flat, if the resin sheet 19 is irradiated with ultraviolet rays 21 while the lower surface of the press plate is pressed against the other surface 19b of the resin sheet 19, the other surface of the cured resin sheet 19 can be left. The surface 19b is also substantially flat.

After the resin sheet 19 is cured, the back surface 11b of the wafer 11 is ground, and the wafer 11 is divided into a plurality of chips along the scheduled division line 13 (grinding step). FIG. 3B is a partial cross-sectional side view schematically showing how the back surface 11b of the wafer 11 is ground. In this embodiment, the back surface 11b of the wafer 11 is ground using the grinding device 32 of FIG. 3 (B).

The grinding device 32 includes a chuck table 34 used for holding the wafer 11. The chuck table 34 includes, for example, a cylindrical frame 36 formed of a metal material typified by stainless steel, and a holding plate 38 formed of a porous material and arranged on the upper portion of the frame 36. The upper surface of the holding plate 38 serves as a holding surface 38a for holding the wafer 11.

The lower surface side of the holding plate 38 is connected to a suction source (not shown) via a flow path 36a or the like provided inside the frame body 36. A valve (not shown) for controlling the flow of fluid is provided in the flow path 36a or the like. Therefore, when the valve is opened, the negative pressure of the suction source is applied to the holding surface 38a to suck the wafer 11.

The frame body 36 is connected to a rotation drive source (not shown) such as a motor, and is rotated around a rotation axis substantially perpendicular to the holding surface 38a described above by the force generated by the rotation drive source. Further, the frame body 36 is supported by a moving mechanism (not shown) and moves in a direction substantially parallel to the holding surface 38a described above.

A grinding unit 40 is arranged above the chuck table 34. The grinding unit 40 includes a tubular spindle housing (not shown). In the space inside the spindle housing, the spindle 42, which is a rotation axis substantially perpendicular to the holding surface 38a of the chuck table 34, is housed.

A disk-shaped mount 44 is fixed to the lower end of the spindle 42. A disk-shaped grinding wheel 46 having a diameter substantially equal to that of the mount 44 is mounted on the lower surface of the mount 44. The grinding wheel 46 includes a wheel base 48 made of a metal material such as stainless steel or aluminum. A plurality of grinding wheels 50 are arranged in an annular shape on the lower surface of the wheel base 48.

A rotary drive source (not shown) such as a motor is connected to the upper end side of the spindle 42, and the grinding wheel 46 rotates by the force generated by the rotary drive source. A nozzle (not shown) for supplying a grinding liquid (typically water) to the wafer 11 and the grinding wheel 50 is provided at a position adjacent to the grinding wheel 46 or inside the grinding wheel 46. It is provided. The grinding unit 40 is supported by, for example, a moving mechanism (not shown) and moves in a direction substantially perpendicular to the holding surface 38a of the chuck table 34.

When grinding the back surface 11b of the wafer 11, first, the other surface 19b of the cured resin sheet 19 is brought into contact with the holding surface 38a of the chuck table 34. Then, the valve is opened to apply the negative pressure of the suction source to the holding surface 38a. As a result, the other surface 19b of the resin sheet 19 is attracted to the holding surface 38a. That is, the wafer 11 is held on the chuck table 34 via the resin sheet 19 with the back surface 11b side exposed upward.

Next, the chuck table 34 is moved below the grinding unit 40. After that, as shown in FIG. 3B, the chuck table 34 and the spindle 42 (grinding wheel 46) are rotated, respectively, and the grinding unit 40 (grinding unit 40 (grinding wheel 46) is supplied to the back surface 11b side of the wafer 11 with a liquid for grinding. The grinding wheel 46) is lowered. The speed at which the grinding unit 40 is lowered is adjusted within a range in which the grinding wheel 50 is appropriately pressed against the back surface 11b of the wafer 11.

As a result, the back surface 11b side of the wafer 11 can be ground to make the wafer 11 thinner. In the present embodiment, at least the portion of the resin sheet 19 embedded in the groove 17 is exposed on the back surface 11b side, and the wafer 11 has a plurality of chips 31 (FIG. 4A) with the groove 17 (scheduled division line 13) as a boundary. The wafer 11 is thinned until it is divided into a scrap 33 (see FIG. 4A).

After grinding the back surface 11b of the wafer 11, a dicing tape (support member) is attached to the wafer 11 (support member attachment step). FIG. 4A is a cross-sectional view schematically showing a state in which the dicing tape (support member) 35 is attached to the wafer 11. The dicing tape 35 is typically a circular film formed of a material such as resin, and an adhesive layer (not shown) containing an adhesive is provided on one surface 35a of the dicing tape 35.

The dicing tape 35 is attached to the wafer 11 by bringing one surface 35a of the dicing tape 35 into close contact with the back surface 11b of the ground wafer 11. In the present embodiment, the annular frame 37 surrounding the wafer 11 is fixed to the outer peripheral portion of the dicing tape 35. Therefore, the wafer 11 is supported by the frame 37 via the dicing tape 35.

After the dicing tape 35 is attached to the wafer 11, the resin sheet 19 is cut at the portion embedded in the groove 17 (resin sheet cutting step). Specifically, a cutting blade (second cutting blade) thinner than the cutting blade 14 is cut into the portion embedded in the groove 17 of the resin sheet 19, and the resin sheet 19 is cut. FIG. 4B is a cross-sectional view schematically showing how the resin sheet 19 is cut. In this embodiment, the resin sheet 19 is cut using the cutting device 62 shown in FIG. 4 (B).

The basic structure of the cutting device 62 is the same as that of the cutting device 2. That is, the cutting device 62 includes a chuck table 64 used for holding the wafer 11. The chuck table 64 includes, for example, a cylindrical frame 66 formed of a metal material typified by stainless steel, and a holding plate 68 formed of a porous material and arranged above the frame 66. The upper surface of the holding plate 68 serves as a holding surface 68a for holding the wafer 11.

The lower surface side of the holding plate 68 is connected to a suction source (not shown) via a flow path 66a or the like provided inside the frame body 66. A valve (not shown) for controlling the flow of fluid is provided in the flow path 66a or the like. Therefore, if the valve is opened, the negative pressure of the suction source can be applied to the holding surface 68a to suck the wafer 11.

The frame body 66 is connected to a rotation drive source (not shown) such as a motor, and is rotated around a rotation axis substantially perpendicular to the holding surface 68a described above by the force generated by the rotation drive source. Further, the frame body 66 is supported by a moving mechanism (not shown) and moves in the first direction (machining feed direction) substantially parallel to the holding surface 68a described above. A plurality of clamps 70 for fixing the annular frame 37 are arranged on the side of the frame body 66.

A cutting unit 72 is arranged above the chuck table 64. The cutting unit 72 includes, for example, a tubular spindle housing (not shown). In the space inside the spindle housing, a spindle 74 which is a rotation axis substantially parallel to the holding surface 68a of the chuck table 64 and substantially perpendicular to the first direction is housed.

An annular cutting blade (second cutting blade) 76 formed by fixing abrasive grains such as diamond with a binder such as resin or metal is mounted on one end side of the spindle 74. The thickness of the cutting blade 76 (that is, the distance between the pair of side surfaces) is smaller than the thickness of the cutting blade 14 used to form the groove 17. A nozzle (not shown) for supplying a cutting liquid (typically water) to the wafer 11 and the cutting blade 76 is provided at a position adjacent to the cutting blade 76.

A rotary drive source (not shown) such as a motor is connected to the other end side of the spindle 74, and the cutting blade 76 mounted on one end side of the spindle 74 rotates by the force generated by the rotary drive source. The cutting unit 72 is supported by, for example, a moving mechanism (not shown), and is substantially parallel to the holding surface 68a of the chuck table 64 in the height direction substantially perpendicular to the holding surface 68a of the chuck table 64. Moves to the second direction (indexing feed direction), which is substantially perpendicular to the first direction.

When cutting the resin sheet 19, first, the other surface 35b of the dicing tape 35 attached to the wafer 11 is brought into contact with the holding surface 68a of the chuck table 64. Then, the valve is opened to apply the negative pressure of the suction source to the holding surface 68a. As a result, the other surface 35b of the dicing tape 35 is attracted to the holding surface 68a. That is, the wafer 11 is held on the chuck table 64 via the dicing tape 35 with the resin sheet 19 exposed upward. The annular frame 37 is fixed to the clamp 70.

Next, the orientation of the chuck table 64 is adjusted so that the portion (the portion corresponding to one scheduled division line 13) embedded in the groove 17 of the resin sheet 19 and the first direction are parallel to each other. Then, the positional relationship between the chuck table 64 and the cutting unit 72 is adjusted so that the cutting blade 76 is positioned above the extension line of the portion of the resin sheet 19 to be machined.

That is, the positional relationship between the chuck table 64 and the cutting unit 72 is adjusted so that the cutting blade 76 can be cut into a portion of the resin sheet 19 away from the side surface of the chip 31 (a position that does not contact the side surface of the chip 31). Further, the height of the cutting unit 72 is adjusted so that the height of the lower end of the cutting blade 76 is equal to or lower than the height of the back surface 11b of the wafer 11 after being ground.

After that, the chuck table 64 is moved in the first direction while rotating the spindle 74. As a result, the rotating cutting blade 76 can be cut from the surface 11a side of the wafer 11 into the portion to be processed of the resin sheet 19, and the resin sheet 19 can be cut. After cutting a part of the resin sheet 19 to be processed, all the remaining parts (the part corresponding to the remaining planned division line 13) embedded in the groove 17 of the resin sheet 19 are cut by the same procedure. To do. FIG. 5 is a cross-sectional view showing a state after the resin sheet 19 is cut.

As shown in FIG. 5, when the resin sheet 19 is cut, the plurality of chips 31 are each sealed with a sealing material 39 obtained by cutting the resin sheet 19. That is, a plurality of package device chips 41 each including the chip 31 and the sealing material 39 and separated from each other are completed. In the present embodiment, since the resin sheet 19 is embedded in the groove 17 of the wafer 11 and the resin sheet 19 is cut at a position away from the side surface of the chip 31, the side surface of the chip 31 is a sealing material. Covered with 39 and not exposed.

As described above, in the method for manufacturing the package device chip according to the present embodiment, the resin sheet is formed in the groove 17 formed by cutting the cutting blade (first cutting blade) 14 into the planned division line 13 of the wafer 11. A resin sheet 19 is attached to the surface 11a of the wafer 11 so as to embed 19, and a cutting blade (second cutting blade) 76 thinner than the cutting blade 14 cuts a portion embedded in the groove 17 of the resin sheet 19.

Therefore, the side surface of the chip 31 obtained by dividing the wafer 11 can be appropriately covered with the resin sheet 19. That is, unlike the case where the groove is filled with the liquid resin, the liquid resin does not leak from the groove, so that the side surface of the chip 31 obtained by dividing the wafer 11 is less likely to be exposed. It can be suppressed.

It should be noted that the series of procedures of the above-described embodiment can be partially replaced, omitted, or changed without causing a contradiction. For example, in the above-described embodiment, the resin sheet 19 is cut after the back surface 11b of the wafer 11 is ground, but the back surface 11b of the wafer 11 may be ground after the resin sheet 19 is cut (the first). 1 variant).

In the method for manufacturing a package device chip according to the first modification, a groove 17 is formed in the wafer 11 (groove formation step) in the same procedure as in the above-described embodiment, and the surface 11a of the wafer 11 is covered with the resin sheet 19. (Coating step), and then the resin sheet 19 is cured (curing step).

After the resin sheet 19 is cured, a cutting blade (first cutting blade) thinner than the cutting blade (first cutting blade) used for forming the groove 17 with respect to the portion embedded in the groove 17 of the resin sheet 19 ( The second cutting blade) is cut, and the resin sheet 19 is cut (resin sheet cutting step). FIG. 6A is a cross-sectional view schematically showing how the resin sheet 19 is cut by the method for manufacturing the package device chip according to the first modification. In this first modification, the resin sheet 19 is cut using the cutting device 82 shown in FIG. 6 (A).

The basic structure of the cutting device 82 is the same as that of the cutting device 62. That is, the cutting device 82 includes a chuck table 84 used for holding the wafer 11. The chuck table 84 includes, for example, a cylindrical frame 86 formed of a metal material typified by stainless steel, and a holding plate 88 formed of a porous material and arranged on the upper portion of the frame 86. The upper surface of the holding plate 88 serves as a holding surface 88a for holding the wafer 11.

The lower surface side of the holding plate 88 is connected to a suction source (not shown) via a flow path 86a or the like provided inside the frame body 86. A valve (not shown) for controlling the flow of fluid is provided in the flow path 86a or the like. Therefore, when the valve is opened, the negative pressure of the suction source is applied to the holding surface 88a to suck the wafer 11.

The frame body 86 is connected to a rotation drive source (not shown) such as a motor, and is rotated around a rotation axis substantially perpendicular to the holding surface 88a described above by the force generated by the rotation drive source. Further, the frame body 86 is supported by a moving mechanism (not shown) and moves in the first direction (machining feed direction) substantially parallel to the holding surface 88a described above.

A cutting unit 90 is arranged above the chuck table 84. The cutting unit 90 includes, for example, a tubular spindle housing (not shown). In the space inside the spindle housing, a spindle 92 which is a rotation axis substantially parallel to the holding surface 88a of the chuck table 84 and substantially perpendicular to the first direction is housed.

An annular cutting blade (second cutting blade) 94 formed by fixing abrasive grains such as diamond with a binder such as resin or metal is mounted on one end side of the spindle 92. The thickness of the cutting blade 94 (that is, the distance between the pair of side surfaces) is smaller than the thickness of the cutting blade used to form the groove 17. A nozzle (not shown) for supplying a cutting liquid (typically water) to the wafer 11 and the cutting blade 94 is provided at a position adjacent to the cutting blade 94.

A rotary drive source (not shown) such as a motor is connected to the other end side of the spindle 92, and the cutting blade 94 mounted on one end side of the spindle 92 rotates by the force generated by the rotary drive source. The cutting unit 90 is supported by, for example, a moving mechanism (not shown), and is substantially parallel to the holding surface 88a of the chuck table 84 in the height direction substantially perpendicular to the holding surface 88a of the chuck table 84. Moves to the second direction (indexing feed direction), which is substantially perpendicular to the first direction.

The procedure for cutting the resin sheet 19 is also the same as the procedure for the above-described embodiment. Specifically, first, the back surface 11b of the wafer 11 is brought into contact with the holding surface 88a of the chuck table 84. Then, the valve is opened to apply the negative pressure of the suction source to the holding surface 88a. As a result, the back surface 11b is attracted to the holding surface 88a, and the wafer 11 is held on the chuck table 84 with the other surface 19b of the resin sheet 19 exposed upward. Before holding the wafer 11 on the chuck table 84, a protective member such as an adhesive tape may be attached to the back surface 11b of the wafer 11.

Next, the orientation of the chuck table 84 is adjusted so that the portion (the portion corresponding to one scheduled division line 13) embedded in the groove 17 of the resin sheet 19 and the first direction are parallel to each other. Then, the positional relationship between the chuck table 84 and the cutting unit 90 is adjusted so that the cutting blade 94 is positioned above the extension line of the portion of the resin sheet 19 to be processed.

That is, the positional relationship between the chuck table 84 and the cutting unit 90 is adjusted so that the cutting blade 94 can be cut into a portion of the resin sheet 19 away from the side surface of the groove 17 (a position that does not contact the side surface of the groove 17). Further, the height of the cutting unit 90 is such that the height of the lower end of the cutting blade 94 is equal to or lower than the height of the lower end (bottom of the groove 17) of the resin sheet 19 embedded in the groove 17. To adjust.

After that, the chuck table 84 is moved in the first direction while rotating the spindle 92. As a result, the rotating cutting blade 94 can be cut from the surface 11a side of the wafer 11 into the portion to be processed of the resin sheet 19, and the resin sheet 19 can be cut. After cutting a part of the resin sheet 19 to be processed, all the remaining parts (the part corresponding to the remaining planned division line 13) embedded in the groove 17 of the resin sheet 19 are cut by the same procedure. To do.

After cutting the resin sheet 19, the support member 51 (see FIG. 6B) is attached to the other surface 19b (the surface opposite to the wafer 11) of the resin sheet 19 (support member attachment step). As the support member 51, for example, a dicing tape, an arbitrary substrate, or the like can be used.

After the support member 51 is attached to the resin sheet 19, the back surface 11b of the wafer 11 is ground, and the wafer 11 is divided into a plurality of chips 31 along the scheduled division line 13 (grinding step). FIG. 6B is a cross-sectional view schematically showing how the back surface 11b of the wafer 11 is ground by the method for manufacturing the package device chip according to the first modification. In this first modification, the back surface 11b of the wafer 11 is ground using the grinding device 32 described above.

Specifically, first, the exposed surface of the support member 51 attached to the resin sheet 19 is brought into contact with the holding surface 38a of the chuck table 34. Then, the valve is opened to apply the negative pressure of the suction source to the holding surface 38a. As a result, the surface of the support member 51 is attracted to the holding surface 38a. That is, the wafer 11 is held on the chuck table 34 via the resin sheet 19 and the support member 51 with the back surface 11b side exposed upward.

Next, the chuck table 34 is moved below the grinding unit 40. After that, as shown in FIG. 6B, the chuck table 34 and the spindle 42 (grinding wheel 46) are rotated, respectively, and the grinding unit 40 (grinding unit 40 (grinding wheel 46) is supplied to the back surface 11b side of the wafer 11 with a liquid for grinding. The grinding wheel 46) is lowered. The speed at which the grinding unit 40 is lowered is adjusted within a range in which the grinding wheel 50 is appropriately pressed against the back surface 11b of the wafer 11.

As a result, the back surface 11b side of the wafer 11 can be ground to make the wafer 11 thinner. In the first modification, at least the portion of the resin sheet 19 embedded in the groove 17 is exposed on the back surface 11b side, and the wafer 11 is formed by the plurality of chips 31 and the end material 33 with the groove 17 (scheduled division line 13) as a boundary. The wafer 11 is thinned until it is divided into two. FIG. 7 is a cross-sectional view showing a state after the wafer 11 is ground by the method for manufacturing the package device chip according to the first modification.

As shown in FIG. 7, when the wafer 11 is divided into a plurality of chips 31, each chip 31 is in a state of being sealed by a sealing material 39 obtained by cutting the resin sheet 19. That is, a plurality of package device chips 41 each including the chip 31 and the sealing material 39 and separated from each other are completed. In the first modification, since the resin sheet 19 is embedded in the groove 17 of the wafer 11 and the resin sheet 19 is cut at a position away from the side surface of the chip 31, the side surface of the chip 31 is sealed. It is covered with material 39 and is not exposed.

As described above, also in the method for manufacturing the package device chip according to the first modification, the resin sheet is formed in the groove 17 formed by cutting the cutting blade (first cutting blade) into the planned division line 13 of the wafer 11. A cutting blade (second cutting blade) 94 thinner than the cutting blade used when the resin sheet 19 is attached to the surface 11a of the wafer 11 so as to embed the 19 and used to form the groove 17, and the groove 17 of the resin sheet 19 is formed. Cut the part embedded in.

Therefore, the side surface of the chip 31 obtained by dividing the wafer 11 can be appropriately covered with the resin sheet 19. That is, unlike the case where the groove is filled with the liquid resin, the liquid resin does not leak from the groove, so that the side surface of the chip 31 obtained by dividing the wafer 11 is less likely to be exposed. It can be suppressed.

Further, for example, the back surface 11b of the wafer 11 can be ground without forming the groove 17 in the wafer 11 (second modification). In the method for manufacturing a package device chip according to this second modification, the back surface 11b of the wafer 11 is ground (grinding step), a support member is attached to the wafer 11 (support member attachment step), and then a cutting blade is attached to the wafer 11. (The first cutting blade) is cut and the wafer 11 is divided into a plurality of chips 31 along the scheduled division line 13 (wafer division step).

After that, the resin sheet 19 is attached to the surface 11a of the wafer 11 so as to embed the resin sheet 19 in the gap between the two adjacent chips 31 (coating step), and the resin sheet 19 is cured (curing step), and the wafer 11 is cured. A cutting blade (second cutting blade) thinner than the cutting blade used for the division is cut into the portion embedded in the gap of the resin sheet 19 to cut the resin sheet 19 (resin sheet cutting step).

FIG. 8A is a cross-sectional view schematically showing how the back surface 11b of the wafer 11 is ground by the method for manufacturing the package device chip according to the second modification. Also in this second modification, the back surface 11b of the wafer 11 is ground using the grinding device 32 described above.

Specifically, first, a protective member 61 such as an adhesive tape is attached to the surface 11a side of the wafer 11, and the exposed surface of the protective member 61 is brought into contact with the holding surface 38a of the chuck table 34. Then, the valve is opened to apply the negative pressure of the suction source to the holding surface 38a. As a result, the surface of the protective member 61 is attracted to the holding surface 38a. That is, the wafer 11 is held on the chuck table 34 via the protective member 61 with the back surface 11b side exposed upward.

Next, the chuck table 34 is moved below the grinding unit 40. After that, as shown in FIG. 8A, the chuck table 34 and the spindle 42 (grinding wheel 46) are rotated, respectively, and the grinding unit 40 (grinding unit 40 (grinding wheel 46) is supplied to the back surface 11b side of the wafer 11 with a liquid for grinding. The grinding wheel 46) is lowered. The speed at which the grinding unit 40 is lowered is adjusted within a range in which the grinding wheel 50 is appropriately pressed against the back surface 11b of the wafer 11.

As a result, the back surface 11b side of the wafer 11 can be ground to make the wafer 11 thinner. In the second modification, the wafer 11 is thinned to a thickness corresponding to the finishing thickness of the chip 31. FIG. 8B is a cross-sectional view showing a state after the wafer 11 is ground by the method for manufacturing the package device chip according to the second modification.

After the back surface 11b of the wafer 11 is ground, the support member 63 (see FIG. 9A) is attached to the back surface 11b of the wafer 11 after being ground (support member attachment step). As the support member 63, for example, a dicing tape, an arbitrary substrate, or the like can be used. At the same time, the protective member 61 is peeled off from the surface 11a of the wafer 11 and removed.

After the support member 63 is attached to the back surface 11b of the wafer 11, a cutting blade (first cutting blade) is cut into the wafer 11 from the front surface 11a side, and the wafer 11 is divided into a plurality of chips along the scheduled division line 13. Divide into 31 (wafer division step). FIG. 9A is a cross-sectional view schematically showing how the wafer 11 is divided into a plurality of chips 31. In the second modification, the wafer 11 is divided into a plurality of chips 31 by using the cutting device 2 described above.

Specifically, first, the exposed surface of the support member 63 attached to the wafer 11 is brought into contact with the holding surface 8a of the chuck table 4. Then, the valve is opened to apply the negative pressure of the suction source to the holding surface 8a. As a result, the surface of the support member 63 is attracted to the holding surface 8a, and the wafer 11 is held on the chuck table 4 with the surface 11a side exposed upward.

Next, the orientation of the chuck table 4 is adjusted so that the scheduled division line 13 to be machined and the first direction are parallel to each other. Then, the positional relationship between the chuck table 4 and the cutting unit 10 is adjusted so that the cutting blade 14 is positioned above the extension line of the planned division line 13.

Further, the height of the cutting unit 10 is adjusted so that the height of the lower end of the cutting blade 14 is equal to or lower than the height of the back surface 11b of the wafer 11 after being ground. After that, the chuck table 4 is moved in the first direction while rotating the spindle 12. As a result, the rotating cutting blade 14 can be cut into the target split line 13 from the surface 11a side of the wafer 11, and the wafer 11 can be cut at the scheduled split line 13.

After cutting the wafer 11 on the target planned division line 13, the wafer 11 is cut on all the other scheduled division lines 13 by the same procedure. As a result, the wafer 11 is divided into a plurality of chips 31 and scraps 33. That is, a gap 65 (see FIG. 9B) corresponding to the thickness of the cutting blade 14 is formed between the two adjacent chips 31 and between the insert 31 and the end material 33.

After the wafer 11 is divided into a plurality of chips 31 on the scheduled division line 13, the resin sheet 19 is attached to the surface 11a of the wafer 11 so as to embed the resin sheet 19 in the gap 65 between the two adjacent chips 31. The surface 11a of the wafer 11 is coated with the resin sheet 19 (coating step). FIG. 9B is a cross-sectional view schematically showing how the resin sheet 19 is attached to the surface 11a of the wafer 11. In the second modification, the resin sheet 19 is attached to the wafer 11 by using the attachment device 22 described above.

Specifically, first, the exposed surface of the support member 63 attached to the wafer 11 is brought into contact with the holding surface 28a of the chuck table 24. Then, the valve is opened to apply the negative pressure of the suction source to the holding surface 28a. As a result, the surface of the support member 63 is attracted to the holding surface 28a, and the wafer 11 is held on the chuck table 24 with the surface 11a side exposed upward.

After that, the resin sheet 19 is attached to the surface 11a of the wafer 11. Specifically, for example, one surface 19a of the resin sheet 19 is brought into contact with the surface 11a of the wafer 11, and then the lower surface of the press plate is pressed against the other surface 19b of the resin sheet 19. As a result, the resin sheet 19 is attached to the surface 11a of the wafer 11. That is, the surface 11a of the wafer 11 is covered with the resin sheet 19. Further, a part of the resin sheet 19 is embedded in the gap 65 by the pressure from the press plate.

After covering the surface 11a of the wafer 11 with the resin sheet 19, the resin sheet 19 is cured (curing step). Also in the second modification, the resin sheet 19 is cured by using the sticking device 22 described above. That is, the resin sheet 19 is cured by irradiating the resin sheet 19 with ultraviolet rays from the ultraviolet light source of the sticking device 22 via the press plate.

After the resin sheet 19 is cured, a cutting blade (second cutting blade) thinner than the cutting blade 14 is cut into the portion embedded in the gap 65 of the resin sheet 19, and the resin sheet 19 is formed. Cut (resin sheet cutting step). FIG. 10A is a cross-sectional view schematically showing how the resin sheet 19 is cut by the method for manufacturing the package device chip according to the second modification. In this second modification, the resin sheet 19 is cut using the cutting device 82 described above.

The specific procedure is the same as the procedure related to the above-described embodiment and the first modification. First, the exposed surface of the support member 63 attached to the wafer 11 is brought into contact with the holding surface 88a of the chuck table 84. Then, the valve is opened to apply the negative pressure of the suction source to the holding surface 88a. As a result, the surface of the support member 63 is attracted to the holding surface 88a. That is, the wafer 11 is held on the chuck table 84 via the support member 63 with the resin sheet 19 exposed upward.

Next, the orientation of the chuck table 84 is adjusted so that the portion (the portion corresponding to one scheduled division line 13) embedded in the gap 65 of the resin sheet 19 and the first direction are parallel to each other. Then, the positional relationship between the chuck table 84 and the cutting unit 90 is adjusted so that the cutting blade 94 is positioned above the extension line of the portion of the resin sheet 19 to be processed.

That is, the positional relationship between the chuck table 84 and the cutting unit 90 is adjusted so that the cutting blade 94 can be cut into a portion of the resin sheet 19 away from the side surface of the chip 31 (a position that does not contact the side surface of the chip 31). Further, the height of the cutting unit 90 is adjusted so that the height of the lower end of the cutting blade 94 is equal to or lower than the height of the lower end of the resin sheet 19 embedded in the gap 65.

After that, the chuck table 84 is moved in the first direction while rotating the spindle 92. As a result, the rotating cutting blade 94 can be cut from the surface 11a side of the wafer 11 into the portion to be processed of the resin sheet 19, and the resin sheet 19 can be cut.

After cutting a part of the resin sheet 19 to be processed, all the remaining parts (the part corresponding to the remaining planned division line 13) embedded in the gap 65 of the resin sheet 19 are cut by the same procedure. To do. FIG. 10B is a cross-sectional view showing a state after the resin sheet 19 is cut by the method for manufacturing the package device chip according to the second modification.

As shown in FIG. 10B, when the resin sheet 19 is cut, each chip 31 is in a state of being sealed by the sealing material 39. That is, a plurality of package device chips 41 each including the chip 31 and the sealing material 39 and separated from each other are completed. In the second modification, the resin sheet 19 is embedded in the gap 65 between the two adjacent chips 31, and the resin sheet 19 is cut at a position away from the side surface of the chip 31, so that the chip 31 The side surface is covered with the sealing material 39 and is not exposed.

As described above, also in the method for manufacturing the package device chip according to the second modification, the gap between the two chips 31 obtained by cutting the cutting blade (first cutting blade) 14 into the planned division line 13 of the wafer 11. A resin sheet 19 is attached to the surface 11a of the wafer 11 so as to embed the resin sheet 19 with respect to 65, and a cutting blade (second cutting blade) 94 thinner than the cutting blade 14 is used in the gap 65 of the resin sheet 19. Cut the embedded part.

Therefore, the side surface of the chip 31 obtained by dividing the wafer 11 can be appropriately covered with the resin sheet 19. That is, unlike the case where the liquid resin is filled in the gap between the chips, the liquid resin does not leak from the gap, so that the side surface of the chip 31 obtained by dividing the wafer 11 may be exposed. Can be kept low.

The present invention is not limited to the description of the above-described embodiment and each modification, and can be modified in various ways. For example, in the above-described embodiment and each modification, the resin sheet 19 is cut by using a cutting device different from the cutting device used to form the groove 17, but for example, one unit including two sets of cutting units. The groove 17 may be formed by a cutting device, and the resin sheet 19 may be cut.

Further, in the above-described embodiment and each modification, the resin sheet 19 is cut at a portion embedded in the groove 17 or a portion embedded in the gap 65 by a method (cutting process) using the cutting blade 76 or the cutting blade 94. However, there are no particular restrictions on the method of cutting the resin sheet 19. For example, the resin sheet 19 may be cut by a method of irradiating a laser beam (ablation processing). Further, the resin sheet 19 can also be cut by a method (expanding) of expanding the dicing tape 35 or the like attached to the wafer 11.

Further, in the above-described embodiment and each modification, the surface 11a side of the wafer 11 is completely covered with the resin sheet 19, but a part of the resin sheet 19 is removed at an arbitrary timing to remove the surface 11a side of the wafer 11. The electrodes and the like (a part of the surface 11a side of the wafer 11) provided on the wafer 11 may be exposed (resin sheet removing step). Specifically, for example, by cutting the resin sheet 19 with a tool such as a cutting tool, a part of the resin sheet 19 on the other surface 19b side is removed, and a part of the surface 11a side of the wafer 11 is removed. Can be exposed.

Further, in the above-described embodiment, the dicing tape 35 is attached to the back surface 11b of the wafer 11 after grinding the back surface 11b of the wafer 11, but the dicing tape 35 may be attached to the other surface 19b of the resin sheet 19. it can. In this case, the cutting blade 76 is cut into the resin sheet 19 from the back surface 11b side of the wafer 11. Then, instead of the dicing tape 35, an arbitrary substrate or the like that functions as a support member may be attached to the wafer 11 or the resin sheet 19.

In addition, the above-described embodiments, structures, methods, and the like according to each modification can be modified and implemented without departing from the scope of the object of the present invention.

11: Wafer 11a: Front surface 11b: Back surface 13: Scheduled division line (street)
15: Device 17: Groove 19: Resin sheet 19a: One side 19b: The other side 21: Ultraviolet rays 31: Chip 33: Scrap 35: Dicing tape (support member)
35a: One side 35b: The other side 37: Frame 39: Encapsulant 41: Package device chip 51: Support member 61: Protective member 63: Support member 65: Gap 2: Cutting device 4: Chuck table 6: Frame 6a: Flow path 8: Holding plate 8a: Holding surface 10: Cutting unit 12: Spindle 14: Cutting blade (first cutting blade)
22: Pasting device 24: Chuck table 26: Frame body 26a: Flow path 28: Holding plate 28a: Holding surface 32: Grinding device 34: Chuck table 36: Frame body 36a: Flow path 38: Holding plate 38a: Holding surface 40: Grinding unit 42: Spindle 44: Mount 46: Grinding wheel 48: Wheel base 50: Grinding grinding stone 62: Cutting device 64: Chuck table 66: Frame body 66a: Flow path 68: Holding plate 68a: Holding surface 70: Clamp 72: Cutting unit 74: Spindle 76: Cutting blade (second cutting blade)
82: Cutting device 84: Chuck table 86: Frame body 86a: Flow path 88: Holding plate 88a: Holding surface 90: Cutting unit 92: Spindle 94: Cutting blade (second cutting blade)

Claims (4)

A groove forming step in which a cutting blade is cut from the surface side of a wafer having devices in a plurality of regions on the surface side partitioned by the planned division line to form a groove in the planned division line.
A coating step of attaching the resin sheet to the surface of the wafer so as to embed the resin sheet in the groove and covering the surface of the wafer with the resin sheet.
By grinding the back surface of the wafer opposite to the front surface to make the wafer thinner, the wafer is divided into a plurality of chips along the planned division line, and the portion of the resin sheet embedded in the groove is divided into the same. Grinding steps to expose on the back side,
A support member attachment step for attaching a support member to the wafer or the resin sheet whose back surface is ground, and
A method for manufacturing a package device chip, which comprises a resin sheet cutting step of cutting the resin sheet at a portion embedded in the groove to form a plurality of package device chips separated from each other. A groove forming step in which a cutting blade is cut from the surface side of a wafer having devices in a plurality of regions on the surface side partitioned by the planned division line to form a groove in the planned division line.
A coating step of attaching the resin sheet to the surface of the wafer so as to embed the resin sheet in the groove and covering the surface of the wafer with the resin sheet.
A resin sheet cutting step of cutting the resin sheet at a portion embedded in the groove, and
A support member attaching step of attaching the support member to the surface of the resin sheet opposite to the wafer, and
By grinding the back surface of the wafer opposite to the front surface to make the wafer thinner, the wafer is divided into a plurality of chips along the planned division line, and the portion of the resin sheet embedded in the groove is divided into the same. A method for manufacturing a package device chip, which comprises a grinding step of exposing to the back surface side to form a plurality of package device chips separated from each other. A grinding step of grinding the back surface of a wafer having devices in a plurality of regions on the front surface side partitioned by a planned division line on the opposite side to the front surface to make the wafer thinner.
A support member attachment step for attaching a support member to the wafer whose back surface has been ground, and a support member attachment step.
A wafer division step in which a cutting blade is cut into the wafer and the wafer is divided into a plurality of chips on the planned division line.
A coating step of attaching the resin sheet to the surface of the wafer so as to embed the resin sheet in the gap between two adjacent chips and covering the surface of the wafer with the resin sheet.
A method for manufacturing a package device chip, which comprises a resin sheet cutting step of cutting the resin sheet at a portion embedded in the gap to form a plurality of package device chips separated from each other. Claims 1 to 3 further include a resin sheet removing step of removing a part of the resin sheet covering the surface of the wafer to expose a part of the surface side of the wafer. The method for manufacturing a packaged device chip according to any one of.