JP2020529630A - How to repair display devices, boards for display devices, and display devices - Google Patents
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
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- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
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- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/22—Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement
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- H—ELECTRICITY
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Abstract
本発明は、ディスプレイ装置、ディスプレイ装置用基板およびディスプレイ装置の修理方法に関するものであり、本発明の一実施例にかかるディスプレイ装置用基板は、ベース；前記ベース上に配置された複数の第１配線部；および前記複数の第１配線部と交差するように前記ベース上に配置された複数の第２配線部を含み、前記複数の第１および第２配線部の一部を含んで前記ベース上に複数のサブピクセルが形成され、前記複数のサブピクセルのそれぞれには、前記複数の第２配線部から少なくとも一側方向に突出して前記ベース上に配置された一つ以上の配線延長部が形成され、前記一つ以上の配線延長部と前記複数の第１配線部間に発光ダイオードを実装するための第１実装部および第２実装部が形成され、前記第１実装部に発光ダイオードを実装することができる。The present invention relates to a display device, a substrate for a display device, and a method for repairing the display device, and the substrate for a display device according to an embodiment of the present invention is a base; a plurality of first wirings arranged on the base. A unit; and a plurality of second wiring portions arranged on the base so as to intersect the plurality of first wiring portions, and including a part of the plurality of first and second wiring portions on the base. A plurality of sub-pixels are formed in the base, and each of the plurality of sub-pixels is formed with one or more wiring extension portions that project from the plurality of second wiring portions in at least one side and are arranged on the base. A first mounting portion and a second mounting portion for mounting the light emitting diode are formed between the one or more wiring extension portions and the plurality of first wiring portions, and the light emitting diode is mounted on the first mounting portion. can do.
Description
本発明は、ディスプレイ装置、ディスプレイ装置用基板およびディスプレイ装置の修理方法に関するものであり、さらに詳しくは、発光ダイオードチップを用いたディスプレイ装置用基板およびディスプレイ装置の修理方法に関する。 The present invention relates to a method for repairing a display device, a substrate for a display device, and a display device, and more particularly, to a method for repairing a substrate for a display device and a display device using a light emitting diode chip.
発光ダイオードは、電子と正孔の再結合を通じて発生する光を放出する無機半導体素子である。近年、発光ダイオードは、ディスプレイ装置、車両用ランプ、一般照明のような様々な分野に多様に用いられている。そして、発光ダイオードは寿命が長く、消費電力が低く、且つ応答速度が速いという長所がある。このような長所を十分に活用して既存の光源を速い速度で入れ替えている。 A light emitting diode is an inorganic semiconductor device that emits light generated through the recombination of electrons and holes. In recent years, light emitting diodes have been widely used in various fields such as display devices, vehicle lamps, and general lighting. The light emitting diode has the advantages of long life, low power consumption, and high response speed. Taking full advantage of these advantages, existing light sources are being replaced at high speed.
近年販売されているテレビ、モニター又は電光掲示板等のディスプレイ装置は、主に発光ダイオードを用いている。従来の液晶ディスプレイ装置は、ＴＦＴ−ＬＣＤパネルを用いて色を再現し、再現された色を外部に放出するためにバックライト光源を用いるが、このとき、バックライト光源として発光ダイオードを用いる。また、別途のＬＣＤを用いず、発光ダイオードを用いて直接色を再現するディスプレイ装置に対する研究も持続して行われている。また、ＯＬＥＤを用いてディスプレイ装置を製造する場合もある。 Display devices such as televisions, monitors, and electric bulletin boards sold in recent years mainly use light emitting diodes. A conventional liquid crystal display device uses a TFT-LCD panel to reproduce colors and uses a backlight source to emit the reproduced colors to the outside. At this time, a light emitting diode is used as the backlight source. In addition, research on a display device that directly reproduces colors using a light emitting diode without using a separate LCD is being continuously conducted. In some cases, a display device is manufactured using an OLED.
ＴＦＴ−ＬＣＤパネルにバックライト光源として発光ダイオードが用いられる場合、一つの発光ダイオードはＴＦＴ−ＬＣＤパネルのたくさんのピクセルに光を照射する光源として用いられる。よって、ＴＦＴ−ＬＣＤパネルの画面にどのような色が表示されても、バックライト光源は常に点いている状態を維持しなければならないため、それにより表示される画面の明るさに関係なく一定の消費電力を消費するという問題がある。 When a light emitting diode is used as a backlight source in the TFT-LCD panel, one light emitting diode is used as a light source for irradiating many pixels of the TFT-LCD panel with light. Therefore, no matter what color is displayed on the screen of the TFT-LCD panel, the backlight source must always be kept on, and it is constant regardless of the brightness of the displayed screen. There is a problem of consuming power consumption.
また、ＯＬＥＤを用いたディスプレイ装置の場合、技術発展により持続的に消費電力が低くなっているが、未だ無機半導体素子である発光ダイオードと比べるとかなり大きい消費電力が消費されているため、効率性に劣るという問題がある。 Further, in the case of a display device using an OLED, the power consumption is continuously reduced due to technological development, but the power consumption is still considerably larger than that of a light emitting diode which is an inorganic semiconductor element, so that the efficiency is high. There is a problem that it is inferior to.
さらに、ＴＦＴを駆動するための方式のうち、ＰＭ（ｐａｓｓｉｖｅ ｍａｔｒｉｘ）駆動方式を用いたＯＬＥＤディスプレイ装置は、大きな容量を有する有機ＥＬをＰＡＭ（ｐｕｌｓｅ ａｍｐｌｉｆｉｅｒ ｍｏｄｕｌａｔｉｏｎ）方式で制御することにより、応答速度が遅くなる問題が発生し得る。そして低いデューティ（ｄｕｔｙ）を具現するために、ＰＷＭ（ｐｕｌｓｅ ｗｉｄｔｈ ｍｏｄｕｌａｔｉｏｎ）方式で制御する場合は、高電流駆動が要求されて寿命低下が発生する問題がある。 Further, among the methods for driving the TFT, the OLED display device using the PM (passive matrix) drive method controls the organic EL having a large capacity by the PAM (pulse amplifier modulation) method, so that the response speed can be increased. Problems that slow down can occur. When controlling by a PWM (pulse width modulation) method in order to realize a low duty, there is a problem that a high current drive is required and the life is shortened.
図１は、従来のディスプレイ装置用基板を図示した平面図である。 FIG. 1 is a plan view showing a conventional display device substrate.
このように発光ダイオードを用いてディスプレイ装置を具現する際、図１に図示したように、基板上に水平配線部および垂直配線部が形成され、第１および第２配線に発光ダイオードチップを実装するための実装部をそれぞれ形成することができる。つまり、一つのピクセル内に少なくとも三つの実装部が形成されるが、それぞれ、青色発光ダイオードチップを実装するための青色チップ実装部、緑色発光ダイオードチップを実装するための緑色チップ実装部、および赤色発光ダイオードチップを実装するための赤色チップ実装部が形成される。 When the display device is embodied using the light emitting diode in this way, as shown in FIG. 1, a horizontal wiring portion and a vertical wiring portion are formed on the substrate, and the light emitting diode chips are mounted on the first and second wirings. Each mounting part can be formed. That is, at least three mounting parts are formed in one pixel, which are a blue chip mounting part for mounting a blue light emitting diode chip, a green chip mounting part for mounting a green light emitting diode chip, and a red color, respectively. A red chip mounting portion for mounting the light emitting diode chip is formed.
それにより、青色チップ実装部、緑色チップ実装部および赤色チップ実装部に、それぞれ青色発光ダイオードチップ、緑色発光ダイオードチップおよび赤色発光ダイオードチップが実装され得る。 As a result, the blue light emitting diode chip, the green light emitting diode chip, and the red light emitting diode chip can be mounted on the blue chip mounting portion, the green chip mounting portion, and the red chip mounting portion, respectively.
ところが、ピクセル内に実装された複数の発光ダイオードチップ中のいずれか一つ以上に問題が生じた場合、問題が生じた発光ダイオードチップを取り除き、該当位置に正常に作動する発光ダイオードチップを再度実装して修理することができる。このように問題が生じた発光ダイオードチップを取り除く際、使用された接着部が基板から完全に取り除かれない場合がある。接着部が完全に取り除かれていない状態で該当位置に正常の発光ダイオードチップを再度実装すると、汚れ等によりまた別の不良が発生し得る。これを防ぐために、取り除かれた実装部に残存する接着部を完全に取り除き、該当位置に発光ダイオードチップを実装しなければならない。ところが、このような工程は、時間とコストを多く消費するという問題がある。 However, if a problem occurs in any one or more of the multiple light emitting diode chips mounted in the pixel, the problematic light emitting diode chip is removed and the light emitting diode chip that operates normally is mounted again in the corresponding position. Can be repaired. When removing the problematic light emitting diode chip in this way, the used adhesive may not be completely removed from the substrate. If a normal light emitting diode chip is remounted at the corresponding position in a state where the bonded portion is not completely removed, another defect may occur due to dirt or the like. In order to prevent this, the adhesive portion remaining on the removed mounting portion must be completely removed, and the light emitting diode chip must be mounted at the corresponding position. However, such a process has a problem that it consumes a lot of time and cost.
また、ピクセル内に必要な発光ダイオードチップの数よりも多い発光ダイオードチップを事前に実装して、発光ダイオードチップに問題が生じることを容易に解決することができる。つまり、一つのピクセル内に一つの青色発光ダイオードチップ、一つの緑色発光ダイオードチップ、及び一つの赤色発光ダイオードチップが実装されれば十分な状況で、それぞれ二つ以上を事前に実装することができる。そして、実装された二つ以上の発光ダイオードチップのうち、一つずつのみ発光するように設定することができる。この状態で、不良が発生した発光ダイオードチップはショートさせ、同一ピクセル内の正常な発光ダイオードチップを電気的に接続してピクセル内で発生した問題を解決することができる。 In addition, it is possible to mount in advance more light emitting diode chips than the number of light emitting diode chips required in the pixel to easily solve the problem of the light emitting diode chips. That is, in a situation where it is sufficient to mount one blue light emitting diode chip, one green light emitting diode chip, and one red light emitting diode chip in one pixel, two or more of each can be mounted in advance. .. Then, it can be set so that only one of the two or more mounted light emitting diode chips emits light. In this state, the defective light emitting diode chip can be short-circuited, and the normal light emitting diode chip in the same pixel can be electrically connected to solve the problem generated in the pixel.
ところが、このように予備として発光ダイオードチップを実装する場合は、問題をより簡単に解決できるが、ディスプレイ装置に必要な発光ダイオードチップの数が必要な数の最低でも二倍以上になるため、製造原価が大きく上昇するという問題がある。 However, when the light emitting diode chip is mounted as a spare in this way, the problem can be solved more easily, but since the number of light emitting diode chips required for the display device is at least double the required number, it is manufactured. There is a problem that the cost rises significantly.
本発明が解決しようとする課題は、ディスプレイ装置の発光ダイオードチップに問題が生じた際に、簡単に修理できるディスプレイ装置、ディスプレイ装置用基板およびディスプレイ装置の修理方法を提供することである。 An object to be solved by the present invention is to provide a display device, a substrate for a display device, and a method for repairing the display device, which can be easily repaired when a problem occurs in a light emitting diode chip of the display device.
本発明の一実施例にかかるディスプレイ装置用基板は、ベース；前記ベース上に配置された複数の第１配線部；および前記複数の第１配線部と交差するように前記ベース上に配置された複数の第２配線部を含み、前記複数の第１および第２配線部の一部を含んで前記ベース上に複数のサブピクセルが形成され、前記複数のサブピクセルのそれぞれには、前記複数の第２配線部から少なくとも一側方向に突出して前記ベース上に配置された一つ以上の配線延長部が形成され、前記一つ以上の配線延長部と前記複数の第１配線部間に発光ダイオードを実装するための第１実装部および第２実装部が形成され、前記第１実装部に発光ダイオードが実装できる。 The substrate for a display device according to an embodiment of the present invention is arranged on the base so as to intersect with the base; a plurality of first wiring portions arranged on the base; and the plurality of first wiring portions. A plurality of sub-pixels are formed on the base including a plurality of second wiring portions and a part of the plurality of first and second wiring portions, and each of the plurality of sub-pixels has the plurality of sub-pixels. One or more wiring extension portions arranged on the base are formed so as to project from the second wiring portion in at least one side, and a light emitting diode is formed between the one or more wiring extension portions and the plurality of first wiring portions. A first mounting portion and a second mounting portion for mounting the above are formed, and a light emitting diode can be mounted on the first mounting portion.
このとき、前記第２実装部は、前記第１実装部に実装された発光ダイオードが正常に作動しない際に発光ダイオードを実装するための予備実装部になり得る。 At this time, the second mounting portion can be a preliminary mounting portion for mounting the light emitting diode when the light emitting diode mounted on the first mounting portion does not operate normally.
このとき、前記第１実装部に実装された発光ダイオードは、第１接着部によって前記第１実装部に実装され、前記第２実装部に実装される発光ダイオードは、第２接着部によって前記第２実装部に実装され、前記第２接着部は前記第１接着部に比べて溶融点が低くなり得る。 At this time, the light emitting diode mounted on the first mounting portion is mounted on the first mounting portion by the first bonding portion, and the light emitting diode mounted on the second mounting portion is mounted on the first mounting portion by the second bonding portion. It is mounted on two mounting portions, and the second bonding portion may have a lower melting point than the first bonding portion.
そして、前記ベース上に形成された複数のサブピクセルのいずれかは、前記第１実装部だけに発光ダイオードが実装され得る。 Then, in any one of the plurality of subpixels formed on the base, the light emitting diode can be mounted only on the first mounting portion.
また、前記ベース上に形成された複数のサブピクセルのいずれかは、前記第２実装部だけに発光ダイオードが実装され得る。 Further, in any of the plurality of subpixels formed on the base, the light emitting diode may be mounted only on the second mounting portion.
また、前記ベース上に形成された複数のサブピクセルのいずれかは、前記第１および第２実装部のそれぞれに発光ダイオードが実装され得る。 In addition, a light emitting diode may be mounted on each of the first and second mounting portions of any of the plurality of subpixels formed on the base.
そして、前記第１実装部および第２実装部のそれぞれには、前記第１配線部と電気的に接続された第１基板電極および前記配線延長部と電気的に接続された第２基板電極が配置され、前記発光ダイオードは前記第１および第２基板電極と電気的に接続されるように前記第１および第２実装部のいずれかに実装され得る。 Then, each of the first mounting portion and the second mounting portion has a first substrate electrode electrically connected to the first wiring portion and a second substrate electrode electrically connected to the wiring extension portion. Arranged, the light emitting diode may be mounted in any of the first and second mounts so as to be electrically connected to the first and second substrate electrodes.
本発明のまた別の実施例にかかるディスプレイ装置用基板は、ベース；前記ベース上に配置された複数の第１配線部；前記複数の第１配線部と交差するように前記ベース上に配置された複数の第２配線部；前記複数の第２配線部からそれぞれ一側方向に延びて、発光ダイオードを実装するための第１実装部を形成する配線延長部；前記複数の第２配線部間に配置され、発光ダイオードを実装するための第２実装部を形成する断絶配線部；および前記第１実装部のうち少なくとも一つに実装された発光ダイオードを含み、前記断絶配線部は前記第２配線部から離隔される。 The substrate for a display device according to another embodiment of the present invention is arranged on the base; a plurality of first wiring portions arranged on the base; and the plurality of first wiring portions so as to intersect with the base. A plurality of second wiring portions; a wiring extension portion extending in one side from each of the plurality of second wiring portions to form a first mounting portion for mounting a light emitting diode; between the plurality of second wiring portions. The disconnected wiring portion is arranged in the above and forms a second mounting portion for mounting the light emitting diode; and includes a light emitting diode mounted on at least one of the first mounting portions, and the disconnected wiring portion is the second. Separated from the wiring section.
前記基板はまた、前記第２実装部のうち少なくとも一つに実装された発光ダイオード；および前記発光ダイオードが実装された第２実装部の断絶配線部と第２配線部を電気的に接続する配線接続部をさらに含むことができる。 The board also has a light emitting diode mounted on at least one of the second mounting portions; and a wiring that electrically connects the disconnection wiring portion and the second wiring portion of the second mounting portion on which the light emitting diode is mounted. Connections can be further included.
幾つかの実施例において、前記断絶配線部は、第２配線部間の中央に位置することができる。 In some embodiments, the disconnected wiring portion can be located in the center between the second wiring portions.
一方、本発明の一実施例にかかるディスプレイ装置の修理方法は、複数の第１配線部および前記複数の第１配線部と交差するように配置された複数の第２配線部が配置された基板上に複数のサブピクセルが形成され、前記複数のサブピクセル内に発光ダイオードを実装するために形成された第１および第２実装部のうち、前記第１実装部に発光ダイオードを第１接着部を用いて実装する段階；前記第１実装部に実装された発光ダイオードが正常に作動するかをテストする段階；および前記第１実装部に実装された発光ダイオードのうち正常に作動しない発光ダイオードを替えるために前記第２実装部に別途の発光ダイオードを第２接着部を用いて実装する段階を含み、前記第２接着部の溶融点は前記第１接着部の溶融点よりも低くなり得る。 On the other hand, the method of repairing the display device according to the embodiment of the present invention is a substrate in which a plurality of first wiring portions and a plurality of second wiring portions arranged so as to intersect the plurality of first wiring portions are arranged. A plurality of subpixels are formed on the top, and of the first and second mounting portions formed for mounting the light emitting diode in the plurality of subpixels, the light emitting diode is attached to the first mounting portion. The stage of mounting using the above; the stage of testing whether the light emitting diode mounted on the first mounting part operates normally; and the stage of testing whether the light emitting diode mounted on the first mounting part operates normally; The second mounting portion includes a step of mounting a separate light emitting diode on the second mounting portion using the second bonding portion, and the melting point of the second bonding portion may be lower than the melting point of the first bonding portion.
ここで、前記正常に作動しない発光ダイオードの電気的接続を遮断する段階をさらに含み、前記遮断する段階は、前記発光ダイオードを前記第１実装部から取り除くものになり得る。 Here, the step of cutting off the electrical connection of the light emitting diode that does not operate normally is further included, and the step of breaking the light emitting diode may be a step of removing the light emitting diode from the first mounting portion.
そして、前記発光ダイオードは、前記第１接着部が前記発光ダイオードに塗布された状態で前記第１実装部に実装されてもよい。 Then, the light emitting diode may be mounted on the first mounting portion in a state where the first adhesive portion is applied to the light emitting diode.
また、前記発光ダイオードは、前記第１接着部が前記第１実装部に塗布された状態で前記第１実装部に実装されてもよい。 Further, the light emitting diode may be mounted on the first mounting portion in a state where the first bonding portion is applied to the first mounting portion.
このとき、前記第１および第２接着部は、ＡｕＳｎ、ＡｇＳｎ、Ｓｎ、ＩｎＡｕおよびＩｎのいずれかになり得る。 At this time, the first and second adhesive portions can be any of AuSn, AgSn, Sn, InAu and In.
そして、前記修理方法は、前記第２実装部を前記複数の第２配線部のうちの一つに電気的に接続することをさらに含んでもよい。 The repair method may further include electrically connecting the second mounting portion to one of the plurality of second wiring portions.
他方、本発明の一実施例にかかるディスプレイ装置は、基板；および前記基板上に配置された複数の発光ダイオードを含み、前記基板は、ベース；前記ベース上に配置された複数の第１配線部；および前記複数の第１配線部と交差するように前記ベース上に配置された複数の第２配線部を含み、前記複数の第１および第２配線部の一部を含んで前記ベース上に複数のサブピクセルが形成され、前記複数のサブピクセルのそれぞれには、前記複数の第２配線部から少なくとも一側方向に突出して前記ベース上に配置された一つ以上の配線延長部が形成され、前記一つ以上の配線延長部と前記複数の第１配線部間に発光ダイオードを実装するための第１実装部および第２実装部が形成され、前記第１実装部に発光ダイオードが実装されてもよい。 On the other hand, the display device according to an embodiment of the present invention includes a substrate; and a plurality of light emitting diodes arranged on the substrate, and the substrate is a base; a plurality of first wiring portions arranged on the base. ; And includes a plurality of second wiring portions arranged on the base so as to intersect the plurality of first wiring portions, and includes a part of the plurality of first and second wiring portions on the base. A plurality of sub-pixels are formed, and each of the plurality of sub-pixels is formed with one or more wiring extension portions that protrude in at least one side from the plurality of second wiring portions and are arranged on the base. A first mounting portion and a second mounting portion for mounting the light emitting diode are formed between the one or more wiring extension portions and the plurality of first wiring portions, and the light emitting diode is mounted on the first mounting portion. You may.
このとき、前記第２実装部は、前記第１実装部に実装された発光ダイオードが正常に作動しない際に発光ダイオードを実装するための予備実装部になり得る。 At this time, the second mounting portion can be a preliminary mounting portion for mounting the light emitting diode when the light emitting diode mounted on the first mounting portion does not operate normally.
本発明のまた別の実施例にかかるディスプレイ装置は、基板；および前記基板上に配置された複数の発光ダイオードを含み、前記基板は、ベース；前記ベース上に配置された複数の第１配線部；前記複数の第１配線部と交差するように前記ベース上に配置された複数の第２配線部；前記複数の第２配線部からそれぞれ一側方向に延びて発光ダイオードを実装するための第１実装部を形成する配線延長部；前記複数の第２配線部間に配置され、発光ダイオードを実装するための第２実装部を形成する断絶配線部；および前記第１実装部のうち少なくとも一つに実装された発光ダイオードを含み、前記断絶配線部は前記第２配線部から離隔される。 The display device according to another embodiment of the present invention includes a substrate; and a plurality of light emitting diodes arranged on the substrate, and the substrate is a base; a plurality of first wiring portions arranged on the base. A plurality of second wiring portions arranged on the base so as to intersect the plurality of first wiring portions; a first for mounting a light emitting diode extending in one side from each of the plurality of second wiring portions. A wiring extension portion forming one mounting portion; a disconnected wiring portion arranged between the plurality of second wiring portions and forming a second mounting portion for mounting a light emitting diode; and at least one of the first mounting portions. The disconnection wiring portion is separated from the second wiring portion, including a light emitting diode mounted therein.
前記基板は、前記第２実装部のうち少なくとも一つに実装された発光ダイオード；および前記断絶配線部のうち少なくとも一つと前記第２配線部を接続する接続配線部をさらに含んでもよい。 The substrate may further include a light emitting diode mounted on at least one of the second mounting portions; and a connecting wiring portion that connects at least one of the disconnected wiring portions to the second wiring portion.
本発明によると、発光ダイオードチップを用いてディスプレイ装置を製造する際にはたくさんの発光ダイオードチップが用いられるが、そのうち不良が発生した発光ダイオードチップを交換する修理工程が簡単だという効果がある。 According to the present invention, many light emitting diode chips are used when manufacturing a display device using the light emitting diode chips, but there is an effect that the repair process for replacing the defective light emitting diode chips is simple.
また、不良が発生した発光ダイオードチップを取り除かず、電気的にショートさせるだけでもよいため、修理工程時間を短縮できる効果がある。 Further, since the light emitting diode chip in which the defect has occurred may not be removed but only electrically short-circuited, there is an effect that the repair process time can be shortened.
以下、添付の図面を参照して本発明の実施例を詳しく説明する。以下で紹介する実施例は、当業者に本発明の思想が十分に伝わるようにするために例として提供するものである。よって、本発明は以下で説明する実施例に限定されるのではなく、他の形態に具体化される場合もある。そして、図面において、構成要素の幅、長さ、厚さ等は便宜のために誇張して表現する場合もある。明細書全体にわたり、同じ参照番号は同じ構成要素を表す。 Hereinafter, examples of the present invention will be described in detail with reference to the accompanying drawings. The examples introduced below are provided as examples so that those skilled in the art can fully understand the idea of the present invention. Therefore, the present invention is not limited to the examples described below, and may be embodied in other forms. Then, in the drawings, the width, length, thickness, etc. of the constituent elements may be exaggerated for convenience. Throughout the specification, the same reference number represents the same component.
図２は、本発明の第１実施例にかかるディスプレイ装置用基板を図示した平面図である。 FIG. 2 is a plan view showing a substrate for a display device according to a first embodiment of the present invention.
図２を参照すると、本発明の第１実施例にかかるディスプレイ装置１００用基板１１０は、水平配線部１１２、垂直配線部１１４、配線延長部１１６、第１基板電極１１７ａ、第２基板電極１１７ｂおよび絶縁部１１８を含む。ここで、図２は複数のピクセルＰが形成された基板１１０の一部を図示した図面である。 Referring to FIG. 2, the substrate 110 for the display device 100 according to the first embodiment of the present invention includes a horizontal wiring portion 112, a vertical wiring portion 114, a wiring extension portion 116, a first substrate electrode 117a, a second substrate electrode 117b, and Includes insulation 118. Here, FIG. 2 is a drawing illustrating a part of the substrate 110 on which a plurality of pixels P are formed.
基板１１０は、ディスプレイ装置１００の発光ダイオードを支持する。本実施例において、基板１１０は絶縁性素材のベースを有してもよく、ベースは所定の厚みを有してもよい。そして、ベース上に水平配線部１１２、垂直配線部１１４、配線延長部１１６、第１基板電極１１７ａおよび第２基板電極１１７ｂが形成されてもよい。 The substrate 110 supports the light emitting diode of the display device 100. In this embodiment, the substrate 110 may have a base made of an insulating material, and the base may have a predetermined thickness. Then, the horizontal wiring portion 112, the vertical wiring portion 114, the wiring extension portion 116, the first substrate electrode 117a, and the second substrate electrode 117b may be formed on the base.
水平配線部１１２および垂直配線部１４４は、それぞれ基板１１０に実装される発光ダイオードチップに電源を供給し、映像信号を伝達するために備えられる。 The horizontal wiring unit 112 and the vertical wiring unit 144 are provided to supply power to the light emitting diode chip mounted on the substrate 110 and transmit a video signal.
水平配線部１１２は、図示したように、基板１１０上に水平方向に配置され、垂直方向に所定の間隔で離隔されて配置される。一つの水平配線部１１２は、基板１１０に水平方向に形成された複数のピクセルＰに沿って配置できる。つまり、基板１１０に複数のピクセルＰが列と行に沿って形成されると、水平配線部１１２は複数のピクセルＰの列の個数と同じ個数だけ配置される。 As shown in the drawing, the horizontal wiring portions 112 are arranged horizontally on the substrate 110 and vertically separated from each other at predetermined intervals. One horizontal wiring unit 112 can be arranged along a plurality of pixels P formed horizontally on the substrate 110. That is, when a plurality of pixels P are formed on the substrate 110 along the columns and rows, the horizontal wiring portions 112 are arranged in the same number as the number of columns of the plurality of pixels P.
垂直配線部１１４は、図示したように、基板１１０上に垂直方向に配置され、水平方向に所定の間隔で離隔されて配置される。図示したように、垂直配線部１１４は一つのピクセルＰに三つ配置でき、基板１１０に垂直方向に形成された複数のピクセルＰに沿って配置することができる。 As shown in the drawing, the vertical wiring portions 114 are arranged vertically on the substrate 110, and are arranged horizontally separated from each other at predetermined intervals. As shown in the figure, three vertical wiring portions 114 can be arranged in one pixel P, and can be arranged along a plurality of pixels P formed in the direction perpendicular to the substrate 110.
配線延長部１１６は、垂直配線部１１４において側面方向に突出した形態で基板１１０上に配置される。本実施例においては、配線延長部１１６は一つの垂直配線部１１４を基準に両側に突出した形状で配置されていることを説明するが、垂直配線部１１４において一側に相対的に長く突出した形状で配置されてもよい。このとき、一つの垂直配線部１１４から突出した配線延長部１１６は、隣接する垂直配線部１１４に当たらない程度の長さを有する。 The wiring extension portion 116 is arranged on the substrate 110 in a form protruding in the side surface direction in the vertical wiring portion 114. In this embodiment, it will be described that the wiring extension portion 116 is arranged so as to project on both sides with respect to one vertical wiring portion 114, but the vertical wiring portion 114 projects relatively long to one side. It may be arranged in a shape. At this time, the wiring extension portion 116 protruding from one vertical wiring portion 114 has a length that does not hit the adjacent vertical wiring portion 114.
図３は、本発明の第１実施例にかかるディスプレイ装置用基板の一つのピクセルを図示した平面図であり、図４は、本発明の第１実施例にかかるディスプレイ装置用基板に発光ダイオードチップが実装されたものを図示した平面図である。そして図５は、図３の切り取り線ＡＡ’に沿って切り取った断面図である。 FIG. 3 is a plan view illustrating one pixel of the display device substrate according to the first embodiment of the present invention, and FIG. 4 is a light emitting diode chip on the display device substrate according to the first embodiment of the present invention. It is a top view which illustrated what was implemented. FIG. 5 is a cross-sectional view cut along the cut line AA'of FIG.
上で説明したように、水平方向に水平配線部１１２が配置され、垂直方向に三つの垂直配線部１１４ａ，１１４ｂ，１１４ｃが配置される。そして、各垂直配線部１１４ａ，１１４ｂ，１１４ｃに両側方向に突出した配線延長部１１６が配置される。そして、配線延長部１１６と水平配線部１１２間に発光ダイオードが実装される実装部が配置される。本実施例において、一つの垂直配線部１１４に二つの配線延長部１１６が配置され、それによって一つの垂直配線部１１４に二つの発光ダイオード実装部が配置される。ここで、発光ダイオード実装部は、配線延長部１１６と水平配線部１１２間に配置される。 As described above, the horizontal wiring portions 112 are arranged in the horizontal direction, and the three vertical wiring portions 114a, 114b, 114c are arranged in the vertical direction. Then, wiring extension portions 116 projecting in both sides are arranged in the vertical wiring portions 114a, 114b, 114c. Then, a mounting portion on which the light emitting diode is mounted is arranged between the wiring extension portion 116 and the horizontal wiring portion 112. In this embodiment, two wiring extension portions 116 are arranged in one vertical wiring portion 114, whereby two light emitting diode mounting portions are arranged in one vertical wiring portion 114. Here, the light emitting diode mounting portion is arranged between the wiring extension portion 116 and the horizontal wiring portion 112.
図３を参照してより詳しく説明すると、水平配線部１１２は、ピクセルＰの中心部を通って水平方向に配置される。そして第１〜第３垂直配線部１１４ａ，１１４ｂ，１１４ｃが垂直方向に互いに離隔された状態で配置される。このとき、水平配線部１１２と第１〜第３垂直配線部１１４ａ，１１４ｂ，１１４ｃは互いに絶縁された状態で配置される。 More specifically with reference to FIG. 3, the horizontal wiring portion 112 is arranged in the horizontal direction through the central portion of the pixel P. Then, the first to third vertical wiring portions 114a, 114b, and 114c are arranged in a state of being vertically separated from each other. At this time, the horizontal wiring portions 112 and the first to third vertical wiring portions 114a, 114b, 114c are arranged in a state of being insulated from each other.
そして、第１垂直配線部１１４ａの両側に突出した配線延長部１１６は、水平配線部１１２の一側に配置され、水平配線部１１２と所定の間隔だけ離隔された状態で配置される。そして、第１垂直配線部１１４ａの配線延長部１１６と水平配線部１１２間に、例えば、第１および第２青色チップ実装部１２２，１２４がそれぞれ配置される。このような第１および第２青色チップ実装部１２２，１２４は、第１垂直配線部１１４ａの配線延長部１１６と水平配線部１１２にそれぞれ一部が掛かった状態で配置される。それによって、図４に図示したように、第１青色チップ実装部１２２に青色発光ダイオードチップ１５０が実装されると、水平配線部１１２と第１垂直配線部１１４ａの配線延長部１１６に電気的に接続され得る。 The wiring extension portions 116 protruding from both sides of the first vertical wiring portion 114a are arranged on one side of the horizontal wiring portion 112, and are arranged in a state of being separated from the horizontal wiring portion 112 by a predetermined distance. Then, for example, the first and second blue chip mounting portions 122 and 124 are arranged between the wiring extension portion 116 and the horizontal wiring portion 112 of the first vertical wiring portion 114a, respectively. Such first and second blue chip mounting portions 122 and 124 are arranged in a state in which a part of the wiring extension portion 116 and the horizontal wiring portion 112 of the first vertical wiring portion 114a are respectively hung. As a result, as shown in FIG. 4, when the blue light emitting diode chip 150 is mounted on the first blue chip mounting portion 122, the wiring extension portion 116 of the horizontal wiring portion 112 and the first vertical wiring portion 114a is electrically mounted. Can be connected.
また、第２垂直配線部１１４ｂの両側に突出した配線延長部１１６は、水平配線部１１２の他側に配置される。このとき、水平配線部１１２の他側とは、第１垂直配線部１１４ａの配線延長部１１６が配置されていない側である。そして、第２垂直配線部１１４ｂの配線延長部１１６は、水平配線部１１２と所定の間隔だけ離隔された状態で配置される。第２垂直配線部１１４ｂの配線延長部１１６と水平配線部１１２間に、例えば、第１および第２緑色チップ実装部１３２，１３４がそれぞれ配置される。このような第１および第２緑色チップ実装部１３２，１３４は、第２垂直配線部１１４ｂの配線延長部１１６と水平配線部１１２にそれぞれ一部が掛かった状態で配置される。これにより、図４に図示したように、第１緑色チップ実装部１３２に実装された緑色発光ダイオードチップ１６０は、水平配線部１１２と第２垂直配線部１１４ｂの配線延長部１１６に電気的に接続され得る。 Further, the wiring extension portions 116 protruding on both sides of the second vertical wiring portion 114b are arranged on the other side of the horizontal wiring portion 112. At this time, the other side of the horizontal wiring portion 112 is the side where the wiring extension portion 116 of the first vertical wiring portion 114a is not arranged. Then, the wiring extension portion 116 of the second vertical wiring portion 114b is arranged in a state of being separated from the horizontal wiring portion 112 by a predetermined distance. For example, the first and second green chip mounting portions 132 and 134 are arranged between the wiring extension portion 116 and the horizontal wiring portion 112 of the second vertical wiring portion 114b, respectively. Such first and second green chip mounting portions 132 and 134 are arranged in a state in which a part of the wiring extension portion 116 and the horizontal wiring portion 112 of the second vertical wiring portion 114b are respectively hung. As a result, as shown in FIG. 4, the green light emitting diode chip 160 mounted on the first green chip mounting portion 132 is electrically connected to the horizontal wiring portion 112 and the wiring extension portion 116 of the second vertical wiring portion 114b. Can be done.
そして、第３垂直配線部１１４ｃ両側に突出した配線延長部は、水平配線部１１２の一側に配置され、第３垂直配線部１１４ｃの配線延長部１１６は水平配線部１１２と所定の間隔だけ離隔された状態で配置される。第３垂直配線部１１４ｃの配線延長部１１６と水平配線部１１２間に、例えば、第１および第２赤色チップ実装部１４２，１４４がそれぞれ配置される。このような第１および第２赤色チップ実装部１４２，１４４は、第３垂直配線部１１４ｃの配線延長部１１６と水平配線部１１２にそれぞれ一部が掛かった状態で配置される。これにより、図４に図示したように、第１赤色チップ実装部１４２に実装された赤色発光ダイオードチップ１７０は水平配線部１１２と第３垂直配線部１１４ｃの配線延長部１１６に電気的に接続され得る。 The wiring extension portions protruding on both sides of the third vertical wiring portion 114c are arranged on one side of the horizontal wiring portion 112, and the wiring extension portion 116 of the third vertical wiring portion 114c is separated from the horizontal wiring portion 112 by a predetermined distance. It is placed in the state of being. For example, the first and second red chip mounting portions 142 and 144 are arranged between the wiring extension portion 116 and the horizontal wiring portion 112 of the third vertical wiring portion 114c, respectively. Such first and second red chip mounting portions 142 and 144 are arranged in a state in which a part of the wiring extension portion 116 and the horizontal wiring portion 112 of the third vertical wiring portion 114c are respectively hung. As a result, as shown in FIG. 4, the red light emitting diode chip 170 mounted on the first red chip mounting portion 142 is electrically connected to the horizontal wiring portion 112 and the wiring extension portion 116 of the third vertical wiring portion 114c. obtain.
このとき、第１および第２青色チップ実装部１２２，１２４と第１および第２赤色チップ実装部１４２，１４４は、水平配線部１１２の一側に配置され、第１および第２緑色チップ実装部１３２，１３４は水平配線部１１２の他側に配置されるが、このような配置はピクセルＰ内の空間を効率的に使用するためのものである。 At this time, the first and second blue chip mounting portions 122 and 124 and the first and second red chip mounting portions 142 and 144 are arranged on one side of the horizontal wiring portion 112, and the first and second green chip mounting portions are arranged. The 132 and 134 are arranged on the other side of the horizontal wiring portion 112, and such an arrangement is for efficiently using the space in the pixel P.
ここで、第１および第２青色チップ実装部１２２，１２４が形成された空間は第１サブピクセルになり得、第１および第２緑色チップ実装部１４２，１４４が形成された空間は第２サブピクセルになり得、第１および第２赤色チップ実装部１３２，１３４が形成された空間は第３サブピクセルになり得る。つまり、一つのピクセルＰは三つのサブピクセルを含み、三つのサブピクセルは、青色光、緑色光および赤色光を放出する領域になり得る。第２青色チップ実装部、第２緑色チップ実装部および第２赤色チップ実装部１２４，１４４，１３４は、予備実装部になり得る。 Here, the space in which the first and second blue chip mounting portions 122 and 124 are formed can be the first subpixel, and the space in which the first and second green chip mounting portions 142 and 144 are formed is the second subpixel. It can be a pixel, and the space in which the first and second red chip mounts 132, 134 are formed can be a third subpixel. That is, one pixel P contains three subpixels, and the three subpixels can be regions that emit blue light, green light, and red light. The second blue chip mounting unit, the second green chip mounting unit, and the second red chip mounting unit 124, 144, 134 can be preliminary mounting units.
このとき、図３および図４に図示された水平配線部１１２、第１〜第３垂直配線部１１４ａ，１１４ｂ，１１４ｃおよび配線延長部１１６は、基板１１０上部に配置されても外部に露出しない。 At this time, the horizontal wiring portions 112, the first to third vertical wiring portions 114a, 114b, 114c and the wiring extension portions 116 shown in FIGS. 3 and 4 are not exposed to the outside even if they are arranged on the upper part of the substrate 110.
そして、図５を参照して、第１および第２青色チップ実装部１２２，１２４の垂直構造について説明する。基板１１０上に第１および第２基板電極１１７ａ，１１７ｂが配置される。そして、第１および第２基板電極１１７ａ，１１７ｂ間に絶縁部１１８が配置される。絶縁部１１８は、第１および第２基板電極１１７ａ，１１７ｂが互いにショートすることを防止するために配置される。また、図５に図示してはいないが、基板１１０上部に水平配線部１１２、第１〜第３垂直配線部１１４ａ，１１４ｂ，１１４ｃおよび配線延長部１１６の上部に絶縁部１１８が配置されてもよい。それにより、絶縁部１１８によって水平配線部１１２、第１〜第３垂直配線部１１４ａ，１１４ｂ，１１４ｃおよび配線延長部１１６が外部から保護され得る。そして、第１基板電極１１７ａは第１垂直配線部１１４ａの配線延長部１１６と電気的に接続され、第２基板電極１１７ｂは水平配線部１１２と電気的に接続することができる。 Then, with reference to FIG. 5, the vertical structures of the first and second blue chip mounting portions 122 and 124 will be described. The first and second substrate electrodes 117a and 117b are arranged on the substrate 110. Then, the insulating portion 118 is arranged between the first and second substrate electrodes 117a and 117b. The insulating portion 118 is arranged to prevent the first and second substrate electrodes 117a and 117b from being short-circuited with each other. Further, although not shown in FIG. 5, even if the horizontal wiring portion 112 is arranged on the upper part of the substrate 110, the first to third vertical wiring portions 114a, 114b, 114c and the insulating portion 118 are arranged on the upper part of the wiring extension portion 116. Good. Thereby, the horizontal wiring portion 112, the first to third vertical wiring portions 114a, 114b, 114c and the wiring extension portion 116 can be protected from the outside by the insulating portion 118. Then, the first substrate electrode 117a can be electrically connected to the wiring extension portion 116 of the first vertical wiring portion 114a, and the second substrate electrode 117b can be electrically connected to the horizontal wiring portion 112.
このように配置された第１および第２基板電極１１７ａ，１１７ｂの一対が第１青色チップ実装部１２２を形成し、第１青色チップ実装部１２２の側面に第２青色チップ実装部１２４が配置される。 A pair of the first and second substrate electrodes 117a and 117b arranged in this way forms the first blue chip mounting portion 122, and the second blue chip mounting portion 124 is arranged on the side surface of the first blue chip mounting portion 122. To.
図６は、本発明の第１実施例にかかるディスプレイ装置用基板に発光ダイオードチップを実装し、修理する工程を説明するための図面である。 FIG. 6 is a drawing for explaining a process of mounting a light emitting diode chip on a substrate for a display device according to a first embodiment of the present invention and repairing the chip.
次に、図６を参照して、ディスプレイ装置１００用基板１１０に青色発光ダイオードチップ１５０を実装し、修理する過程について説明する。図６ａを参照すると、基板１１０上に形成された第１青色チップ実装部１２２に青色発光ダイオードチップ１５０を実装する。このとき、青色発光ダイオードチップ１５０は上部の発光構造体が配置され、発光構造体の下部に第１電極パッド１５２および第２電極パッド１５４が配置される。 Next, the process of mounting the blue light emitting diode chip 150 on the substrate 110 for the display device 100 and repairing it will be described with reference to FIG. Referring to FIG. 6a, the blue light emitting diode chip 150 is mounted on the first blue chip mounting portion 122 formed on the substrate 110. At this time, the upper light emitting structure of the blue light emitting diode chip 150 is arranged, and the first electrode pad 152 and the second electrode pad 154 are arranged below the light emitting structure.
発光構造体は、ｎ型半導体層、活性層およびｐ型半導体層を含み、ｎ型半導体層、活性層およびｐ型半導体層は、それぞれＩＩＩ−Ｖ族系列の化合物半導体を含み得る。一例として、（Ａｌ，Ｇａ，Ｉｎ）Ｎのような窒化物半導体を含み得る。そして、ｎ型半導体層とｐ型半導体層間に活性層が介在してもよい。 The light emitting structure includes an n-type semiconductor layer, an active layer and a p-type semiconductor layer, and the n-type semiconductor layer, the active layer and the p-type semiconductor layer may each include a compound semiconductor of the III-V series. As an example, a nitride semiconductor such as (Al, Ga, In) N may be included. Then, an active layer may be interposed between the n-type semiconductor layer and the p-type semiconductor layer.
ｎ型半導体層は、ｎ型不純物（例えば、Ｓｉ）を含む導電型半導体層になり得、ｐ型半導体層は、ｐ型不純物（例えば、Ｍｇ）を含む導電型半導体層になり得る。そして、活性層は多重量子井戸構造（ＭＱＷ）を含み得、目的とするピーク波長の光を放出できるように活性層の組成比が決定され得る。 The n-type semiconductor layer can be a conductive semiconductor layer containing n-type impurities (for example, Si), and the p-type semiconductor layer can be a conductive semiconductor layer containing p-type impurities (for example, Mg). Then, the active layer may contain a multiple quantum well structure (MQW), and the composition ratio of the active layer can be determined so as to emit light having a target peak wavelength.
青色発光ダイオードチップ１５０は、青色光帯域のピーク波長を放出できるように活性層の組成比が決定され得る。そして、本実施例において、青色発光ダイオードチップ１５０が用いられたことについて説明するが、青色発光ダイオードチップ１５０以外に緑色発光ダイオードチップ１６０や赤色発光ダイオードチップ１７０を用いることができる。また、必要に応じて、青色発光ダイオードチップを含む赤色発光ダイオードパッケージを赤色発光ダイオードチップ１７０の代わりに利用することもできる。例えば、赤色発光ダイオードパッケージは、青色発光ダイオードチップ１５０を覆うように形成された蛍光体部、および蛍光体部を覆うように形成されたカラーフィルター部を含んでもよい。このとき、蛍光体部は青色発光ダイオードチップ１５０から放出された青色光を波長変換して赤色光を外部に放出するための蛍光体を含むことができる。そして、カラーフィルター部は、蛍光体部を通じて放出される光において赤色光を除いた他の波長帯域の光を遮断するために備えられる。 The composition ratio of the active layer of the blue light emitting diode chip 150 can be determined so as to emit the peak wavelength in the blue light band. Then, although it will be described that the blue light emitting diode chip 150 is used in this embodiment, a green light emitting diode chip 160 and a red light emitting diode chip 170 can be used in addition to the blue light emitting diode chip 150. Further, if necessary, a red light emitting diode package including a blue light emitting diode chip can be used instead of the red light emitting diode chip 170. For example, the red light emitting diode package may include a phosphor portion formed so as to cover the blue light emitting diode chip 150 and a color filter portion formed so as to cover the phosphor portion. At this time, the phosphor unit can include a phosphor for wavelength-converting the blue light emitted from the blue light emitting diode chip 150 and emitting the red light to the outside. The color filter unit is provided to block light in a wavelength band other than red light in the light emitted through the phosphor unit.
本実施例において、青色発光ダイオードチップ１５０の第１および第２電極パッド１５２，１５４の下部にそれぞれ第１接着部Ｓ１を塗布することができる。 In this embodiment, the first adhesive portion S1 can be applied to the lower portions of the first and second electrode pads 152 and 154 of the blue light emitting diode chip 150, respectively.
このように第１接着部Ｓ１が第１および第２電極パッド１５２，１５４に塗布された状態で、図６ｂに図示したように、基板１１０の第１青色チップ実装部１２２に青色発光ダイオードチップ１５０が実装される。このとき、第１電極パッド１５２は第１基板電極１１７ａと電気的に接続され、第２電極パッド１５４は第２基板電極１１７ｂと電気的に接続される。このとき、第２青色チップ実装部１２４には如何なる発光ダイオードチップも実装されない。 As shown in FIG. 6b, the blue light emitting diode chip 150 is mounted on the first blue chip mounting portion 122 of the substrate 110 in a state where the first adhesive portion S1 is applied to the first and second electrode pads 152 and 154. Is implemented. At this time, the first electrode pad 152 is electrically connected to the first substrate electrode 117a, and the second electrode pad 154 is electrically connected to the second substrate electrode 117b. At this time, no light emitting diode chip is mounted on the second blue chip mounting unit 124.
このように第１青色チップ実装部１２２に青色発光ダイオードチップ１５０が実装された状態で、青色発光ダイオードチップ１５０が正常に作動すると、この状態で、青色発光ダイオードチップ１５０を実際にディスプレイ装置に使用できる。ところが、第１青色チップ実装部１２２に実装された青色発光ダイオードチップ１５０が不良で正常に作動しない場合は、青色発光ダイオードチップ１５０を取り除く必要がある。それにより、図６ｃに図示したように、第１青色チップ実装部１２２に実装された青色発光ダイオードチップ１５０を取り除くことができる。このとき、第１青色チップ実装部１２２には第１接着部Ｓ１の一部または全体が残り得る。 When the blue light emitting diode chip 150 operates normally in the state where the blue light emitting diode chip 150 is mounted on the first blue chip mounting portion 122 in this way, the blue light emitting diode chip 150 is actually used in the display device in this state. it can. However, if the blue light emitting diode chip 150 mounted on the first blue chip mounting portion 122 is defective and does not operate normally, it is necessary to remove the blue light emitting diode chip 150. As a result, as shown in FIG. 6c, the blue light emitting diode chip 150 mounted on the first blue chip mounting portion 122 can be removed. At this time, a part or the whole of the first adhesive portion S1 may remain in the first blue chip mounting portion 122.
そして、第１青色チップ実装部１２２において青色発光ダイオードチップ１５０を取り除いた後、図６ｄに図示したように、第２青色チップ実装部１２４に別の青色発光ダイオードチップ１５０を実装する。このとき、第２青色チップ実装部１２４に実装する青色発光ダイオードチップ１５０の第１および第２電極パッド１５２，１５４に第２接着部Ｓ２を塗布することができる。第２接着部Ｓ２は、第１接着部Ｓ１と異なる種類の成分を有してもよい。本実施例において、第２接着部Ｓ２の溶融点は第１接着部Ｓ１の溶融点よりも低くなり得る。 Then, after the blue light emitting diode chip 150 is removed from the first blue chip mounting unit 122, another blue light emitting diode chip 150 is mounted on the second blue chip mounting unit 124 as shown in FIG. 6d. At this time, the second adhesive portion S2 can be applied to the first and second electrode pads 152 and 154 of the blue light emitting diode chip 150 mounted on the second blue chip mounting portion 124. The second adhesive portion S2 may have a different kind of component from the first adhesive portion S1. In this embodiment, the melting point of the second adhesive portion S2 can be lower than the melting point of the first adhesive portion S1.
第２接着部Ｓ２の溶融点が第１接着部Ｓ１の溶融点よりも低いのは、第２青色チップ実装部１２４に青色発光ダイオードチップ１５０を実装する過程において、同一ピクセルＰや隣接する別のピクセルＰに既に実装された発光ダイオードチップが基板１１０から外れることを防ぐためである。同一ピクセルＰや隣接する別のピクセルＰに実装された発光ダイオードチップは、上で説明したように、第１接着部Ｓ１によって基板１１０に実装することができる。これにより、第１接着部Ｓ１の溶融点よりも低い溶融点を有する第２接着部Ｓ２を用いて第２青色チップ実装部１２４に青色発光ダイオードチップ１５０を実装することにより、第１接着部Ｓ１が溶けることを防ぐことができる。 The melting point of the second bonding portion S2 is lower than the melting point of the first bonding portion S1 because the same pixel P or another adjacent pixel P is mounted in the process of mounting the blue light emitting diode chip 150 on the second blue chip mounting portion 124. This is to prevent the light emitting diode chip already mounted on the pixel P from coming off the substrate 110. The light emitting diode chip mounted on the same pixel P or another adjacent pixel P can be mounted on the substrate 110 by the first adhesive portion S1 as described above. As a result, the blue light emitting diode chip 150 is mounted on the second blue chip mounting portion 124 by using the second adhesive portion S2 having a melting point lower than the melting point of the first adhesive portion S1, so that the first adhesive portion S1 Can be prevented from melting.
本実施例において、第１および第２接着部Ｓ１，Ｓ２は、それぞれＡｕＳｎ、ＡｇＳｎ、Ｓｎ、ＩｎＡｕおよびＩｎのいずれかを用いることができ、第２接着部Ｓ２の溶融点が第１接着部Ｓ１よりも低いものを用いるのであれば、どれを用いてもよい。 In this embodiment, any of AuSn, AgSn, Sn, InAu and In can be used for the first and second adhesive portions S1 and S2, respectively, and the melting point of the second adhesive portion S2 is the first adhesive portion S1. Any lower one may be used as long as it is used.
また、本実施例において、不良が発生した第１青色チップ実装部１２２に実装された青色発光ダイオードチップ１５０を取り除かず、第１青色チップ実装部１２２と電気的に接続された配線延長部１１６を切って青色発光ダイオードチップ１５０との電気的な接続を遮断することもできる。 Further, in this embodiment, the blue light emitting diode chip 150 mounted on the first blue chip mounting portion 122 in which the defect has occurred is not removed, and the wiring extension portion 116 electrically connected to the first blue chip mounting portion 122 is provided. It can also be cut to cut off the electrical connection with the blue light emitting diode chip 150.
図７は、本発明の第２実施例にかかるディスプレイ装置用基板に発光ダイオードチップを実装し、修理する工程を説明するための図面である。 FIG. 7 is a drawing for explaining a process of mounting a light emitting diode chip on a substrate for a display device according to a second embodiment of the present invention and repairing the chip.
また、図７を参照して、本発明の第２実施例にかかるディスプレイ装置１００用基板１１０に発光ダイオードチップを実装し、修理する工程を説明する。図７ａを参照すると、基板１１０上に形成された第１青色チップ実装部１２２に青色発光ダイオードチップ１５０を実装する。このとき、第１実施例とは異なり、第１接着部Ｓ１が基板１１０の第１および第２基板電極１１７ａ，１１７ｂに塗布された状態である。それにより、第１および第２基板電極１１７ａ，１１７ｂ上に塗布された第１接着部Ｓ１が溶融した状態で青色発光ダイオードチップ１５０を第１青色チップ実装部１２２に実装する。 Further, with reference to FIG. 7, a step of mounting the light emitting diode chip on the substrate 110 for the display device 100 according to the second embodiment of the present invention and repairing it will be described. Referring to FIG. 7a, the blue light emitting diode chip 150 is mounted on the first blue chip mounting portion 122 formed on the substrate 110. At this time, unlike the first embodiment, the first adhesive portion S1 is applied to the first and second substrate electrodes 117a and 117b of the substrate 110. As a result, the blue light emitting diode chip 150 is mounted on the first blue chip mounting portion 122 in a state where the first adhesive portion S1 coated on the first and second substrate electrodes 117a and 117b is melted.
それにより、図７ｂに図示したように、第１青色チップ実装部１２２に青色発光ダイオードチップ１５０が実装され、第２青色チップ実装部１２４には如何なる発光ダイオードチップも実装されない。 As a result, as illustrated in FIG. 7b, the blue light emitting diode chip 150 is mounted on the first blue chip mounting unit 122, and no light emitting diode chip is mounted on the second blue chip mounting unit 124.
この状態で、青色発光ダイオードチップ１５０が正常に作動する場合は、そのまま使用する。しかし、青色発光ダイオードチップ１５０が正常に作動しない場合は、図７ｃに図示したように、青色発光ダイオードチップ１５０を取り除く。そして、図７ｄに図示したように、第２接着部Ｓ２が第１および第２電極パッド１５２，１５４に塗布された青色発光ダイオードチップ１５０を第２青色チップ実装部１２４に実装する。 If the blue light emitting diode chip 150 operates normally in this state, it is used as it is. However, if the blue light emitting diode chip 150 does not operate normally, the blue light emitting diode chip 150 is removed as shown in FIG. 7c. Then, as shown in FIG. 7d, the blue light emitting diode chip 150 in which the second adhesive portion S2 is applied to the first and second electrode pads 152 and 154 is mounted on the second blue chip mounting portion 124.
本実施例において、第１および第２接着部Ｓ１，Ｓ２は第１実施例と同一なため、それに対する説明は省略する。 In this embodiment, since the first and second adhesive portions S1 and S2 are the same as those in the first embodiment, the description thereof will be omitted.
図８は、本発明の第３実施例にかかるディスプレイ装置用基板の一つのピクセルを図示した平面図である。図９は、本発明の第３実施例にかかるディスプレイ装置用基板に発光ダイオードチップが実装されたものを図示した平面図であり、図１０は、本発明の第３実施例にかかるディスプレイ装置用基板に発光ダイオードチップの一つを修理したものを図示した平面図である。 FIG. 8 is a plan view illustrating one pixel of the display device substrate according to the third embodiment of the present invention. FIG. 9 is a plan view showing a substrate for a display device according to a third embodiment of the present invention on which a light emitting diode chip is mounted, and FIG. 10 is a plan view for a display device according to a third embodiment of the present invention. It is the top view which illustrated the one which repaired one of the light emitting diode chips on the substrate.
図８を参照すると、本発明の第３実施例にかかるディスプレイ装置１００用基板１１０は、水平配線部１１２、垂直配線部１１４、配線延長部１１６、第１基板電極１１７ａ、第２基板電極１１７ｂおよび絶縁部１１８を含む。このとき、図８に図示した図面は、基板１１０に形成された複数のピクセルの一つを図示した図面である。 Referring to FIG. 8, the substrate 110 for the display device 100 according to the third embodiment of the present invention includes a horizontal wiring portion 112, a vertical wiring portion 114, a wiring extension portion 116, a first substrate electrode 117a, a second substrate electrode 117b, and Includes insulation 118. At this time, the drawing shown in FIG. 8 is a drawing showing one of a plurality of pixels formed on the substrate 110.
以下では、本実施例について説明すると共に、第１実施例で説明したものと同じ事項についての詳しい説明は省略する。 Hereinafter, the present embodiment will be described, and detailed description of the same matters as those described in the first embodiment will be omitted.
図示したように、水平配線部１１２および三つの垂直配線部１１４ａ，１１４ｂ，１１４ｃが配置される。そして、各垂直配線部１１４ａ，１１４ｂ，１１４ｃはそれぞれ一側方向に突出した配線延長部１１６が形成される。このように形成された配線延長部１１６と水平配線部１１２間に発光ダイオードが実装される実装部が配置される。本実施例において、配線延長部１１６はそれぞれ三つの配線部１１４ａ，１１４ｂ，１１４ｃの左側に形成されているとして図示したが、これに限定されるのではなく、三つの配線部１１４ａ，１１４ｂ，１１４ｃの右側に形成される場合もある。また、配線延長部１１６中の一部は垂直配線部１１４ａ，１１４ｂ，１１４ｃの左側に配置され、残りは垂直配線部１１４ａ，１１４ｂ，１１４ｃの右側に配置される場合もある。 As shown, the horizontal wiring portion 112 and the three vertical wiring portions 114a, 114b, 114c are arranged. Then, each of the vertical wiring portions 114a, 114b, 114c is formed with a wiring extension portion 116 protruding in one side direction. A mounting portion on which the light emitting diode is mounted is arranged between the wiring extension portion 116 and the horizontal wiring portion 112 formed in this way. In this embodiment, the wiring extension portion 116 is shown as being formed on the left side of the three wiring portions 114a, 114b, 114c, respectively, but the present invention is not limited to this, and the three wiring portions 114a, 114b, 114c are not limited thereto. It may be formed on the right side of. Further, a part of the wiring extension portion 116 may be arranged on the left side of the vertical wiring portions 114a, 114b, 114c, and the rest may be arranged on the right side of the vertical wiring portions 114a, 114b, 114c.
また、三つの垂直配線部１１４ａ，１１４ｂ，１１４ｃ間にはそれぞれ断絶配線部１１５が配置され得る。特定実施例において、断絶配線部１１５は垂直配線部１１４ａ，１１４ｂ，１１４ｃ間の中央に配置することができる。また、断絶配線部１１５は配線延長部１１６の垂直方向位置と並んだ位置に配置され得る。つまり、配線延長部１１６から長さ方向に延びた位置に断絶配線部１１５が配置され得る。しかし、本実施例はこれに限定されるのではなく、断絶配線部１１５の垂直方向の位置は配線延長部１１６の垂直方向位置と関係なく配置されもよい。 Further, a disconnection wiring portion 115 may be arranged between the three vertical wiring portions 114a, 114b, and 114c, respectively. In a specific embodiment, the disconnection wiring portion 115 can be arranged at the center between the vertical wiring portions 114a, 114b, 114c. Further, the disconnection wiring portion 115 may be arranged at a position aligned with the vertical position of the wiring extension portion 116. That is, the disconnection wiring portion 115 may be arranged at a position extending in the length direction from the wiring extension portion 116. However, this embodiment is not limited to this, and the vertical position of the disconnection wiring portion 115 may be arranged regardless of the vertical position of the wiring extension portion 116.
そして、断絶配線部１１５は両側に位置した垂直配線部１１４ａ，１１４ｂ，１１４ｃと離隔した状態で配置され得る。つまり、断絶配線部１１５は垂直配線部１１４ａ，１１４ｂ，１１４ｃから電気的に離隔された状態で形成することができる。 Then, the disconnection wiring portion 115 may be arranged in a state of being separated from the vertical wiring portions 114a, 114b, 114c located on both sides. That is, the disconnected wiring portion 115 can be formed in a state of being electrically separated from the vertical wiring portions 114a, 114b, 114c.
断絶配線部１１５は、水平配線部１１２と一定距離離隔された位置に形成されるが、断絶配線部１１５と水平配線部１１２間に発光ダイオードが実装される予備実装部Ｍが配置され得る。予備実装部Ｍは、断絶配線部１１５と水平配線部１１２間において断絶配線部１１５および水平配線部１１２にそれぞれ一部が掛かった状態で配置され得る。 The disconnection wiring unit 115 is formed at a position separated from the horizontal wiring unit 112 by a certain distance, but a spare mounting unit M on which a light emitting diode is mounted may be arranged between the disconnection wiring unit 115 and the horizontal wiring unit 112. The spare mounting portion M may be arranged between the disconnected wiring portion 115 and the horizontal wiring portion 112 in a state in which the disconnected wiring portion 115 and the horizontal wiring portion 112 are partially hooked.
つまり、第１垂直配線部１１４ａを基準に一側に第１青色チップ実装部１２２が配置され、他側に予備実装部Ｍが配置され得る。そして、第２垂直配線部１１４ｂを基準に一側に第１緑色チップ実装部１３２が配置され、他側に予備実装部Ｍが配置され得る。また、第３垂直配線部１１４ｃを基準に一側に第１赤色チップ実装部１４２が配置され、他側に予備実装部Ｍが配置され得る。 That is, the first blue chip mounting portion 122 may be arranged on one side and the preliminary mounting portion M may be arranged on the other side with respect to the first vertical wiring portion 114a. Then, the first green chip mounting portion 132 may be arranged on one side and the preliminary mounting portion M may be arranged on the other side with respect to the second vertical wiring portion 114b. Further, the first red chip mounting portion 142 may be arranged on one side and the preliminary mounting portion M may be arranged on the other side with reference to the third vertical wiring portion 114c.
よって、図９に図示したように、第１青色チップ実装部１２２に青色発光ダイオードチップ１５０が実装され、第１緑色チップ実装部１３２に緑色発光ダイオードチップ１６０が実装され、第１赤色チップ実装部１４２に赤色発光ダイオードチップ１７０が実装され得る。 Therefore, as shown in FIG. 9, the blue light emitting diode chip 150 is mounted on the first blue chip mounting portion 122, the green light emitting diode chip 160 is mounted on the first green chip mounting portion 132, and the first red chip mounting portion is mounted. A red light emitting diode chip 170 may be mounted on the 142.
この状態で、一例として、第１緑色チップ実装部１３２に実装された緑色発光ダイオードチップ１６０に問題が生じた場合、図１０に図示したように、第１緑色チップ実装部１３２に隣接するように配置された予備実装部Ｍに新たな緑色発光ダイオードチップ１６０を実装することができる。 In this state, as an example, when a problem occurs in the green light emitting diode chip 160 mounted on the first green chip mounting portion 132, the green light emitting diode chip 160 is adjacent to the first green chip mounting portion 132 as shown in FIG. A new green light emitting diode chip 160 can be mounted on the arranged spare mounting portion M.
一方、問題が生じた緑色発光ダイオードチップ１６０の作動を防ぐために、第１緑色チップ実装部１３２に電気的に接続された配線延長部１１６の電気的接続を第２垂直配線部１１４ｂから遮断する。配線延長部１１６の一部を切って第２垂直配線部１１４ｂと電気的な接続を遮断することができる。そして、断絶配線部１１５と第２垂直配線部１１４ｂが電気的に接続されるように、断絶配線部１１５と第２垂直配線部１１４ｂ間に配線接続部１１５ａを形成することができる。ここで、配線接続部１１５ａは、例えば、基板１１０上にＩＴＯを蒸着したり、めっき層を形成することにより形成することができ、ボンディングワイヤを用いて形成することもできる。また、第２垂直配線部１１４ｂと断絶配線部１１５はそれ以外にも多様な方法で電気的に接続できる。 On the other hand, in order to prevent the operation of the green light emitting diode chip 160 in which the problem occurs, the electrical connection of the wiring extension portion 116 electrically connected to the first green chip mounting portion 132 is cut off from the second vertical wiring portion 114b. A part of the wiring extension portion 116 can be cut to cut off the electrical connection with the second vertical wiring portion 114b. Then, the wiring connection portion 115a can be formed between the disconnection wiring portion 115 and the second vertical wiring portion 114b so that the disconnection wiring portion 115 and the second vertical wiring portion 114b are electrically connected. Here, the wiring connection portion 115a can be formed, for example, by depositing ITO on the substrate 110 or forming a plating layer, or can be formed by using a bonding wire. Further, the second vertical wiring portion 114b and the disconnection wiring portion 115 can be electrically connected by various other methods.
本実施例において、図１０に図示したように、第１緑色チップ実装部１３２の右側に配置された予備実装部Ｍに新たな緑色発光ダイオードチップ１６０を実装したことについて説明したが、必要に応じて、第１青色チップ実装部１２２の右側に配置された予備実装部Ｍに緑色発光ダイオードチップ１６０を実装することができる。 In this embodiment, as shown in FIG. 10, it has been described that a new green light emitting diode chip 160 is mounted on the preliminary mounting portion M arranged on the right side of the first green chip mounting portion 132, but if necessary. Therefore, the green light emitting diode chip 160 can be mounted on the preliminary mounting portion M arranged on the right side of the first blue chip mounting portion 122.
上で説明した通り、予備実装部Ｍは垂直配線部１１４ａ，１１４ｂ，１１４ｃから電気的に離隔した状態で修理工程を通じて選択的に特定垂直配線部１１４ａ，１１４ｂ，１１４ｃに電気的に接続することができる。よって、第１垂直配線部１１４ａと第２垂直配線部１１４ｂ間に配置された予備実装部Ｍには新たな青色発光ダイオードチップ１５０、又は緑色発光ダイオードチップ１６０を実装することができ、第２垂直配線部１１４ｂと第３垂直配線部１１４ｃ間の予備実装部Ｍには新たな緑色発光ダイオードチップ１６０、又は赤色発光ダイオードチップ１７０を実装することができる。これにより、一つの予備実装部Ｍを用いて、必要に応じて、２種類の発光ダイオードチップのうち、一つの不良となった発光ダイオードチップを修理することができる。 As described above, the spare mounting unit M can be selectively electrically connected to the specific vertical wiring units 114a, 114b, 114c through the repair process in a state of being electrically separated from the vertical wiring units 114a, 114b, 114c. it can. Therefore, a new blue light emitting diode chip 150 or a green light emitting diode chip 160 can be mounted on the preliminary mounting portion M arranged between the first vertical wiring portion 114a and the second vertical wiring portion 114b, and the second vertical A new green light emitting diode chip 160 or a red light emitting diode chip 170 can be mounted on the preliminary mounting portion M between the wiring portion 114b and the third vertical wiring portion 114c. As a result, one of the two types of light emitting diode chips, one of the defective light emitting diode chips, can be repaired by using one spare mounting unit M, if necessary.
一方、第２垂直配線部１１４ｂの右側に配置された予備実装部Ｍは、新たな赤色発光ダイオードチップ１７０を実装するために使用することができる。本実施例において、第２垂直配線部１１４ｂの右側に配置された予備実装部Ｍが第３垂直配線部１１４ｃから離隔したものを図示しているが、これは第３垂直配線部１１４ｃに電気的に接続されるように提供することができる。つまり、第２垂直配線部１１４ｂの右側に位置したサブピクセル領域には、断絶配線部１１５の代わりに配線延長部１１６が配置されてもよい。 On the other hand, the preliminary mounting portion M arranged on the right side of the second vertical wiring portion 114b can be used for mounting a new red light emitting diode chip 170. In this embodiment, the preliminary mounting portion M arranged on the right side of the second vertical wiring portion 114b is shown separated from the third vertical wiring portion 114c, which is electrically connected to the third vertical wiring portion 114c. Can be provided to be connected to. That is, the wiring extension portion 116 may be arranged in place of the disconnection wiring portion 115 in the subpixel region located on the right side of the second vertical wiring portion 114b.
さらに、第１垂直配線部１１４ａの左上側および第３垂直配線部１１４ｃの右上側のサブピクセル領域は、予備実装部Ｍがなく空いていることを図示しているが、これらサブピクセル領域にも予備実装部Ｍが配置されるようにすることができる。例えば、第１垂直配線部１１４ａの左上側のサブピクセル領域には、青色発光ダイオードチップ１５０を実装できる予備実装部を配置することができ、第３垂直配線部１１４ｃの右上側のサブピクセル領域には、赤色発光ダイオードチップ１７０を実装できる予備実装部を配置することができる。また、これらサブピクセル領域には、断絶配線部１１５又は配線延長部１１６を配置することができる。 Further, although it is shown that the sub-pixel area on the upper left side of the first vertical wiring portion 114a and the upper right side of the third vertical wiring portion 114c is empty without the pre-mounting portion M, these sub-pixel regions are also shown. The pre-mounting unit M can be arranged. For example, a spare mounting portion on which the blue light emitting diode chip 150 can be mounted can be arranged in the subpixel region on the upper left side of the first vertical wiring portion 114a, and the subpixel region on the upper right side of the third vertical wiring portion 114c can be arranged. Can arrange a spare mounting portion on which the red light emitting diode chip 170 can be mounted. Further, a disconnection wiring portion 115 or a wiring extension portion 116 can be arranged in these subpixel regions.
本実施例によると、上で説明した実施例に比べて新たな発光ダイオードチップを実装できるサイトをさらに多く提供することができる。さらに、一つの予備実装部Ｍを２種類の発光ダイオードチップを実装できるようにすることにより、故障時の修理に弾力的に対応することができる。 According to this embodiment, it is possible to provide more sites on which a new light emitting diode chip can be mounted as compared with the embodiment described above. Further, by enabling one spare mounting portion M to mount two types of light emitting diode chips, it is possible to flexibly respond to repairs in the event of a failure.
上で説明したように、本発明に対する具体的な説明は、添付の図面を参照した実施例によって行ったが、上述の実施例は本発明の好ましい例を挙げて説明しただけであり、本発明が前記実施例だけに局限されると理解してはならなく、本発明の権利範囲は後述する請求の範囲およびその等価概念によって理解しなければならない。 As described above, the specific description of the present invention has been given by reference to the accompanying drawings, but the above-mentioned examples have only been described with reference to preferred examples of the present invention, and the present invention has been described. It should not be understood that is limited to the above embodiments, and the scope of rights of the present invention must be understood by the claims and their equivalent concepts described below.
１００：ディスプレイ装置
１１０：基板
１１２：水平配線部 １１４：垂直配線部
１１４ａ：第１垂直配線部 １１４ｂ：第２垂直配線部
１１４ｃ：第３垂直配線部
１１５：断絶配線部 １１５ａ：配線接続部
１１６：配線延長部
１１７ａ：第１基板電極 １１７ｂ：第２基板電極
１１８：絶縁部
１２２：第１青色チップ実装部 １２４：第２青色チップ実装部
１３２：第１緑色チップ実装部 １３４：第２緑色チップ実装部
１４２：第１赤色チップ実装部 １４４：第２赤色チップ実装部
１５０：青色発光ダイオードチップ
１５２：第１電極パッド １５４：第２電極パッド
１６０：緑色発光ダイオードチップ １７０：赤色発光ダイオードチップ
Ｓ１：第１接着部 Ｓ２：第２接着部
Ｍ：予備実装部 Ｐ：ピクセル
100: Display device 110: Board 112: Horizontal wiring part 114: Vertical wiring part 114a: First vertical wiring part 114b: Second vertical wiring part 114c: Third vertical wiring part 115: Disconnected wiring part 115a: Wiring connection part 116: Wiring extension 117a: 1st substrate electrode 117b: 2nd substrate electrode 118: Insulation 122: 1st blue chip mounting part 124: 2nd blue chip mounting part 132: 1st green chip mounting part 134: 2nd green chip mounting Part 142: 1st red chip mounting part 144: 2nd red chip mounting part 150: Blue light emitting diode chip 152: 1st electrode pad 154: 2nd electrode pad 160: Green light emitting diode chip 170: Red light emitting diode chip S1: 1st 1 Adhesive part S2: 2nd adhesive part M: Pre-mounting part P: Pixel
Claims (20)
前記ベース上に配置された複数の第１配線部；および
前記複数の第１配線部と交差するように前記ベース上に配置された複数の第２配線部を含み、
前記複数の第１および第２配線部の一部を含んで前記ベース上に複数のサブピクセルが形成され、
前記複数のサブピクセルのそれぞれには、
前記複数の第２配線部から少なくとも一側方向に突出して前記ベース上に配置された一つ以上の配線延長部が形成され、
前記一つ以上の配線延長部と前記複数の第１配線部間に発光ダイオードを実装するための第１実装部および第２実装部が形成され、
前記第１実装部に発光ダイオードが実装されたディスプレイ装置用基板。 base;
A plurality of first wiring portions arranged on the base; and a plurality of second wiring portions arranged on the base so as to intersect the plurality of first wiring portions.
A plurality of subpixels are formed on the base including a part of the plurality of first and second wiring portions.
Each of the plurality of subpixels
One or more wiring extension portions arranged on the base are formed so as to project from the plurality of second wiring portions in at least one side direction.
A first mounting portion and a second mounting portion for mounting a light emitting diode are formed between the one or more wiring extension portions and the plurality of first wiring portions.
A substrate for a display device in which a light emitting diode is mounted on the first mounting portion.
前記第２実装部に実装される発光ダイオードは、第２接着部によって前記第２実装部に実装され、
前記第２接着部は前記第１接着部に比べて溶融点が低い、請求項２に記載のディスプレイ装置用基板。 The light emitting diode mounted on the first mounting portion is mounted on the first mounting portion by the first adhesive portion.
The light emitting diode mounted on the second mounting portion is mounted on the second mounting portion by the second adhesive portion.
The substrate for a display device according to claim 2, wherein the second adhesive portion has a lower melting point than the first adhesive portion.
前記発光ダイオードは前記第１および第２基板電極と電気的に接続されるように前記第１および第２実装部のいずれかに実装される、請求項１に記載のディスプレイ装置用基板。 A first substrate electrode electrically connected to the first wiring portion and a second substrate electrode electrically connected to the wiring extension portion are arranged in each of the first mounting portion and the second mounting portion. ,
The substrate for a display device according to claim 1, wherein the light emitting diode is mounted on any of the first and second mounting portions so as to be electrically connected to the first and second substrate electrodes.
前記ベース上に配置された複数の第１配線部；
前記複数の第１配線部と交差するように前記ベース上に配置された複数の第２配線部；
前記複数の第２配線部からそれぞれ一側方向に延びて、発光ダイオードを実装するための第１実装部を形成する配線延長部；
前記複数の第２配線部間に配置され、発光ダイオードを実装するための第２実装部を形成する断絶配線部；および
前記第１実装部のうち少なくとも一つに実装された発光ダイオードを含み、
前記断絶配線部は前記第２配線部から離隔されたディスプレイ装置用基板。 base;
A plurality of first wiring portions arranged on the base;
A plurality of second wiring portions arranged on the base so as to intersect the plurality of first wiring portions;
A wiring extension portion extending in one side from each of the plurality of second wiring portions to form a first mounting portion for mounting a light emitting diode;
A discontinuous wiring portion arranged between the plurality of second wiring portions and forming a second mounting portion for mounting a light emitting diode; and a light emitting diode mounted on at least one of the first mounting portions.
The disconnected wiring portion is a substrate for a display device separated from the second wiring portion.
前記発光ダイオードが実装された第２実装部の断絶配線部と第２配線部を電気的に接続する配線接続部をさらに含む、請求項８に記載のディスプレイ装置用基板。 A light emitting diode mounted on at least one of the second mounting portions; and a wiring connecting portion for electrically connecting the disconnected wiring portion and the second wiring portion of the second mounting portion on which the light emitting diode is mounted are further included. , The substrate for a display device according to claim 8.
前記第１実装部に実装された発光ダイオードが正常に作動するかをテストする段階；および
前記第１実装部に実装された発光ダイオードのうち正常に作動しない発光ダイオードを替えるために前記第２実装部に別途の発光ダイオードを第２接着部を用いて実装する段階を含み、
前記第２接着部の溶融点は前記第１接着部の溶融点よりも低いディスプレイ装置の修理方法。 A plurality of subpixels are formed on a substrate on which a plurality of first wiring portions and a plurality of second wiring portions arranged so as to intersect the plurality of first wiring portions are arranged, and within the plurality of subpixels. Of the first and second mounting portions formed for mounting the light emitting diode, the stage of mounting the light emitting diode on the first mounting portion using the first bonding portion;
The stage of testing whether the light emitting diode mounted on the first mounting portion operates normally; and the second mounting to replace the light emitting diode mounted on the first mounting portion which does not operate normally. Including the step of mounting a separate light emitting diode on the part using the second adhesive part,
A method of repairing a display device in which the melting point of the second adhesive portion is lower than the melting point of the first adhesive portion.
前記基板上に配置された複数の発光ダイオードを含み、
前記基板は、
ベース；
前記ベース上に配置された複数の第１配線部；および
前記複数の第１配線部と交差するように前記ベース上に配置された複数の第２配線部を含み、
前記複数の第１および第２配線部の一部を含んで前記ベース上に複数のサブピクセルが形成され、
前記複数のサブピクセルのそれぞれには、
前記複数の第２配線部から少なくとも一側方向に突出して前記ベース上に配置された一つ以上の配線延長部が形成され、
前記一つ以上の配線延長部と前記複数の第１配線部間に発光ダイオードを実装するための第１実装部および第２実装部が形成され、
前記第１実装部に発光ダイオードが実装されたディスプレイ装置。 Substrate; and includes multiple light emitting diodes located on the substrate.
The substrate is
base;
A plurality of first wiring portions arranged on the base; and a plurality of second wiring portions arranged on the base so as to intersect the plurality of first wiring portions.
A plurality of subpixels are formed on the base including a part of the plurality of first and second wiring portions.
Each of the plurality of subpixels
One or more wiring extension portions arranged on the base are formed so as to project from the plurality of second wiring portions in at least one side direction.
A first mounting portion and a second mounting portion for mounting a light emitting diode are formed between the one or more wiring extension portions and the plurality of first wiring portions.
A display device in which a light emitting diode is mounted on the first mounting portion.
前記基板上に配置された複数の発光ダイオードを含み、
前記基板は、
ベース；
前記ベース上に配置された複数の第１配線部；
前記複数の第１配線部と交差するように前記ベース上に配置された複数の第２配線部；
前記複数の第２配線部からそれぞれ一側方向に延びて発光ダイオードを実装するための第１実装部を形成する配線延長部；
前記複数の第２配線部間に配置され、発光ダイオードを実装するための第２実装部を形成する断絶配線部；および
前記第１実装部のうち少なくとも一つに実装された発光ダイオードを含み、
前記断絶配線部は前記第２配線部から離隔されたディスプレイ装置。 Substrate; and includes multiple light emitting diodes located on the substrate.
The substrate is
base;
A plurality of first wiring portions arranged on the base;
A plurality of second wiring portions arranged on the base so as to intersect the plurality of first wiring portions;
A wiring extension portion that extends from each of the plurality of second wiring portions in one side direction and forms a first mounting portion for mounting a light emitting diode;
A discontinuous wiring portion arranged between the plurality of second wiring portions and forming a second mounting portion for mounting a light emitting diode; and a light emitting diode mounted on at least one of the first mounting portions.
The disconnection wiring unit is a display device separated from the second wiring unit.
前記断絶配線部のうち少なくとも一つと前記第２配線部を接続する接続配線部をさらに含む、請求項１９に記載のディスプレイ装置。 19. The substrate further includes a light emitting diode mounted on at least one of the second mounting portions; and a connecting wiring portion that connects at least one of the disconnected wiring portions to the second wiring portion. The display device described.
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| KR20170098212 | 2017-08-02 | ||
| PCT/KR2018/008732 WO2019027248A1 (en) | 2017-08-02 | 2018-08-01 | Display device, substrate for display device and method for repairing display device |
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| KR20200138479A (en) * | 2019-05-29 | 2020-12-10 | 삼성디스플레이 주식회사 | Display device |
| KR20210044430A (en) * | 2019-10-15 | 2021-04-23 | 삼성전자주식회사 | Method for manufacturing display apparatus, interposer substrate and computer program stored in a recording medium |
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