JP2020523551A - 集積防食回路を有するセンサ - Google Patents
集積防食回路を有するセンサ Download PDFInfo
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- JP2020523551A JP2020523551A JP2018568256A JP2018568256A JP2020523551A JP 2020523551 A JP2020523551 A JP 2020523551A JP 2018568256 A JP2018568256 A JP 2018568256A JP 2018568256 A JP2018568256 A JP 2018568256A JP 2020523551 A JP2020523551 A JP 2020523551A
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Classifications
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Abstract
Description
本願は、米国特許仮出願第62/489840号、2017年4月25日出願、及びオランダ国特許出願第N2019043号、2017年6月9日出願により優先権を主張し;これらの特許出願の各々の内容はその全体を参照することによって本明細書に含める。
本明細書中に開示するセンサの例は、相補型金属酸化物半導体(CMOS)検出デバイスの構成要素の少なくとも一部の二重防食を統合し、この検出デバイスはセンサの一部分である。CMOSの金属構成要素は、例えば、強酸性または強塩基性である環境に触れた場合に腐食が生じやすい。本明細書中に開示する例では、防食(腐食防止)の1つのレベルは、CMOS検出デバイスと、このCMOS検出デバイスに結合されたフローセル内に導入される試薬との間に配置されたパシベーション層によって提供する。防食の他のレベルは防食回路によって提供する。本明細書中に開示する例の一部では、防食回路が、CMOS検出デバイスにおいて試薬に晒され得る少なくとも金属含有構成要素の陰極防食または陽極防食を行うように構成されている。一例として、陰極または陽極防食バイアスを印加すると、CMOSの腐食速度を、代表的な腐食速度(例えば、陰極防食または陽極防食なしで同じ試薬に晒すこと)から約5,000分の1〜約10、000分の1に低減することができる。本明細書中に開示する他の例では、上記防食回路が、CMOS検出デバイスにおいて試薬に晒され得る少なくとも金属含有構成要素の受動的防食または半受動的防食を行うように構成されている。一例では、受動的または半受動的防食バイアスを印加すると、CMOSの腐食速度を、代表的な腐食速度(例えば、受動的または半受動的防食なしで同じ試薬に晒すこと)から約500分の1〜約1,000分の1に低減することができる。
R1はHまたは任意で置換されたアルキル基;
R4はアジド基;
R5、R6、及びR8は、H及び任意で置換されたアルキル基から成るグループから独立して選択したもの;
−(CH2)p−の各々は任意に置換することができる;
pは1〜50の範囲内の整数;
nは1〜50,000の範囲内の整数;及び
mは1〜100,000の範囲内の整数である。
例1
から出力された画像中に痕跡の特徴が観測された際に、腐食損傷が観測された。これらの痕跡の特徴は事前に知られており、腐食欠陥に直接関係付けられているイメージセンサの特徴を特性化している。
Claims (35)
- フローセルと、
検出デバイスと、
コントローラとを具えたセンサであって、
前記フローセルは、
パシベーション層と、
蓋とを含み、
前記パシベーション層は、一対の対向面を有し、第1の該対向面に反応部位を有し、
前記蓋は、前記パシベーション層に動作的に接続されて、当該蓋と前記反応部位との間に流路を規定し、
前記検出デバイスは、前記パシベーション層の第2の前記対向面に接触し、前記検出デバイスは埋め込み金属層を含み、該埋め込み金属層は、前記検出デバイスの他の検出回路から電気絶縁され、
前記コントローラは前記埋め込み金属層を接地する、センサ。 - 前記検出デバイスが、
当該検出デバイスの前記他の検出回路に電気接続された光センサであって、当該光センサが検出した光子に応答したデータ信号を送信する光センサと、
前記埋め込み金属層と前記他の検出回路との間の非導電性ギャップと
をさらに含む、請求項1に記載のセンサ。 - 前記光センサを前記他の検出回路に電気接続する第2コントローラをさらに含む、請求項2に記載のセンサ。
- 前記流路内に導入される試薬をさらに含み、該試薬は、約6.5から約10までの範囲のpH、及び約45mS/cm〜約85mS/cmまでの範囲の導電率を有する、請求項1に記載のセンサ。
- 検出デバイスと、
蓋と、
第1コントローラと、
第2コントローラとを具えたセンサであって、
前記検出デバイスは、
光導波路と、
前記光導波路に動作的に関連する光センサと、
デバイス回路とを含み、
該デバイス回路は、
第1埋め込み金属層と、
前記光センサに電気接続された第2埋め込み金属層とを含み、
前記第1埋め込み金属層は、前記第2埋め込み金属層から電気絶縁ギャップ分の間隔をおき、
パシベーション層の少なくとも一部分が、前記第1埋め込み金属層、及び前記光導波路の入力領域に接触し、前記パシベーション層の前記少なくとも一部分は、前記光導波路の前記入力領域に少なくとも部分的に隣接する反応部位を有し、
前記蓋は、前記パシベーション層に動作的に接続されて、当該蓋と前記反応部位との間に流路を部分的に規定し、
前記第1コントローラは、前記第1埋め込み金属層に電気接続されて、前記第1埋め込み金属層を選択的に接地し、
前記第2コントローラは、前記第2埋め込み金属層を前記光センサに電気接続して、前記光センサによって検出された光子に応答したデータ信号を送信する、センサ。 - 試薬をセンサの流路に導入するステップを含む方法であって、該センサは、
フローセルと、
検出デバイスとを含み、
前記フローセルは、
パシベーション層と、
蓋とを含み、
前記パシベーション層は、一対の対向面を有し、第1の該対向面に反応部位を有し、
前記蓋は、前記パシベーション層に動作的に接続されて、当該蓋と前記反応部位との間に前記流路を部分的に規定し、
前記検出デバイスは、前記パシベーション層の第2の前記対向面に接触し、前記検出デバイスは、当該検出デバイスの他の検出回路から電気絶縁された埋め込み金属層を含み、
前記方法は、
前記反応部位における、前記試薬の少なくとも一部の反応成分が関与する反応に応答してセンシング動作を実行するステップと、
前記センシング動作中に前記埋め込み金属層を接地し、これにより前記埋め込み金属層の受動的防食を行うステップと
をさらに含む方法。 - 前記検出デバイスが、前記他の検出回路に電気接続された光センサをさらに含み、
前記埋め込み金属層が、前記光センサに電気接続された前記他の検出回路から電気絶縁ギャップ分の間隔をおき、
前記埋め込み金属層を接地することが、前記センシング動作と直交性がある、請求項6に記載の方法。 - フローセルと、
検出デバイスと、
試薬電極と、
コントローラとを具えたセンサであって、
前記フローセルは、
パシベーション層と、
蓋とを含み、
前記パシベーション層は、一対の対向面を有し、第1の該対向面に反応部位を有し、
前記蓋は、前記パシベーション層に動作的に接続されて、当該蓋と前記反応部位との間に流路を規定し、
前記検出デバイスは、前記パシベーション層の第2の前記対向面に接触し、前記検出デバイスは埋め込み金属層を含み、
前記試薬電極は、前記流路内に導入される試薬に接触するように位置決めされ、
前記コントローラは、前記試薬電極及び前記埋め込み金属層に電気接続されて電気的バイアスを選択的に印加し、該電気的バイアスは、前記試薬電極を陽極または陰極の一方にし、前記埋め込み金属層を陰極または陽極の他方にする、センサ。 - 前記試薬電極が、前記蓋の内面の少なくとも一部分に接続されている、請求項8に記載のセンサ。
- 前記試薬電極が、前記蓋の内面の一部分に接続されて、前記流路の内壁を形成する、請求項8に記載のセンサ。
- 前記側壁が、金属導体または金属コネクタに電気接続され、かつ機械的に直接接続され、前記金属導体または金属コネクタが前記コントローラに電気接続されている、請求項10に記載のセンサ。
- 前記側壁が、前記蓋の内面の前記一部分に接続された前記試薬電極の一部分を通して、かつ導体構成要素を通して前記コントローラに電気接続されている、請求項10に記載のセンサ。
- 前記蓋が、前記流路の側壁を規定する特徴部分を含み、
前記試薬電極が、該特徴部分上に配置された層を含む、請求項8に記載のセンサ。 - 前記試薬電極が層を含み、該層は、
前記蓋の内面の一部分に接続され、
前記蓋内に規定される流体ポートの少なくとも一部分上に配置されている、請求項8に記載のセンサ。 - 前記試薬電極が層を含み、該層は、
前記蓋の外面の一部分に接続され、
前記蓋内に規定される流体ポートの少なくとも一部分上に配置されている、請求項8に記載のセンサ。 - 前記パシベーション層の一部分が、当該パシベーション層上に規定された前記試薬電極、または当該パシベーション層内に埋め込まれた前記試薬電極を有する、請求項8に記載のセンサ。
- 前記パシベーション層の一部分が、当該一部分内に規定された開口を有し、前記試薬電極が該開口を通して露出する、請求項8に記載のセンサ。
- 前記検出デバイスが、
光センサと、
前記光センサに電気接続されて、前記光センサによって検出された光子に応答したデータ信号を送信するデバイス回路と、
前記デバイス回路と前記埋め込み金属層との間の非導電性ギャップと
をさらに含む、請求項8に記載のセンサ。 - 前記検出デバイスが、
光センサと、
前記光センサに電気接続され、かつ前記埋め込み金属層に電気接続されたデバイス回路と
をさらに含む、請求項8に記載のセンサ。 - 前記検出デバイスが、
前記反応部位を光センサに光学的に接続する光導波路と、
前記パシベーション層の第2の前記対向面の少なくとも一部分に接触し、前記光導波路の入力領域に少なくとも部分的に隣接する開口部を有するシールド層と
をさらに含む、請求項8に記載のセンサ。 - 前記流路内に導入される試薬をさらに含み、該試薬は、約6.5から約10までの範囲のpHを有し、約45mS/cmから約85mS/cmまでの範囲の導電率を有する、請求項8に記載のセンサ。
- 検出デバイスと、
蓋とを具えたセンサであって、
前記検出デバイスは、
光導波路と、
光センサと、
デバイス回路とを含み、該デバイス回路は、
試薬電極と、
前記試薬電極に電気接続された第1埋め込み金属層と、
前記光センサに電気接続された第2埋め込み金属層とを含み、
前記第1埋め込み金属層は、前記第2埋め込み金属層から電気絶縁ギャップ分の間隔をおき、
パシベーション層の少なくとも一部分が、前記第1埋め込み金属層、及び前記光導波路の入力領域に接触し、前記パシベーション層の前記少なくとも一部分は、前記光導波路の前記入力領域に少なくとも部分的に隣接する反応部位を有し、
前記蓋は、前記パシベーション層に接続されて、当該蓋と前記反応部位との間に流路を規定し、
前記試薬電極は、前記流路内に導入される試薬に接触するように位置決めされている、センサ。 - 第1コントローラと、
第2コントローラとをさらに具え、
前記第1コントローラは、前記試薬電極及び前記第1埋め込み金属層に電気接続されて、電気的バイアスを選択的に印加し、該電気的バイアスは、前記試薬電極を陽極にし、前記第1埋め込み金属層を陰極にし、
前記第2コントローラは、前記第2埋め込み金属層を前記光センサに電気接続して、前記光センサによって検出された光子に応答したデータ信号を送信する、請求項22に記載のセンサ。 - 前記試薬電極が、前記蓋の内面の一部分に接続されて、前記流路の側壁を形成する、請求項23に記載のセンサ。
- 前記側壁が、金属導体または金属コネクタに電気接続され、かつ機械的に直接接続され、前記金属導体または金属コネクタは前記第1コントローラに電気接続されている、あるいは、
前記側壁が、前記蓋の内面の前記一部分に接続された前記試薬電極の一部分、及び導体構成要素を通して、前記第1コントローラに電気接続されている、
のうちの一方である、請求項24に記載のセンサ。 - 前記試薬電極が前記蓋の内面の少なくとも一部分に接続されている、請求項22に記載のセンサ。
- 前記蓋が、前記流路の側壁を規定する特徴部分を含み、
前記試薬電極が、前記特徴部分上に配置された層を含む、請求項22に記載のセンサ。 - 前記試薬電極が層を含み、該層は、
前記蓋の内面の一部分に接続され、
前記蓋内に規定される流体ポートの少なくとも一部分上に配置されている、請求項22に記載のセンサ。 - 前記試薬電極が層を含み、該層は、
前記蓋の外面の一部分に接続され、
前記蓋内に規定される流体ポートの少なくとも一部分上に配置されている、請求項22に記載のセンサ。 - 前記パシベーション層の他の部分が、前記パシベーション層の開口上に規定された、あるいは前記パシベーション層の開口内に埋め込まれた前記試薬電極を有する、請求項22に記載のセンサ。
- 前記パシベーション層の他の部分が、当該他の部分内に規定された開口を有し、前記試薬電極が該開口を通して露出する、請求項22に記載のセンサ。
- 試薬をセンサの流路に導入するステップを含む方法であって、該センサは、
フローセルと、
検出デバイスと、
試薬電極とを含み
前記フローセルは、
パシベーション層と、
蓋とを含み、
前記パシベーション層は、一対の対向面を有し、第1の該対向面に反応部位を有し、
前記蓋は、前記パシベーション層に動作的に接続されて、当該蓋と前記反応部位との間に前記流路を部分的に規定し、
前記検出デバイスは、前記パシベーション層の第2の前記対向面に接触し、前記検出デバイスは埋め込み金属層を含み、
前記試薬電極は、前記埋め込み金属層に電気接続され、前記流路内に導入される前記試薬に接触するように位置決めされ、
前記方法は、
前記反応部位における、前記試薬の少なくとも一部の反応成分が関与する反応に応答して、前記センサのセンシング動作を実行するステップと、
前記センシング動作中に電気的バイアスを印加するステップであって、該電気的バイアスは、前記試薬電極を陽極または陰極の一方にし、前記埋め込み金属層を陰極または陽極の他方にし、これにより前記埋め込み金属層の陰極防食または陽極防食を行うステップと
をさらに含む、方法。 - 前記検出デバイスが、光センサと、該光センサに電気接続されたデバイス回路とをさらに含み、
前記埋め込み金属層が前記デバイス回路に電気接続され、
前記センシング動作を実行するステップにおいて、前記埋め込み金属層が機能し、
前記電気的バイアスを前記埋め込み金属層に印加する、請求項32に記載の方法。 - 前記検出デバイスが、光センサと、該光センサに電気接続されたデバイス回路とをさらに含み、
前記埋め込み金属層は、前記光センサに電気接続された前記デバイス回路から、電気絶縁ギャップ分の間隔をおき、
前記電気バイアスを印加することが、前記センシング動作と直交性がある、請求項32に記載の方法。 - 前記電気的バイアスを、前記センサの前記流路に導入される前記試薬のpHに基づいて調整するステップをさらに含む、請求項32に記載の方法。
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