JP2020509100A - Thermosetting epoxy resin composition for production of electrical engineering products and products obtained therefrom - Google Patents

Abstract

(A) at least one epoxy resin and (B) (b1) a polyetheramine of formula (1) (formula (1)), wherein x is a number from 2 to 8, and (b2) at least Multicomponent anhydride-free heat containing at least one curing agent selected from the group of polyetheramines having one end group of formula (2) (formula (2)) and (C) at least one epoxysilane The curable epoxy resin composition is particularly suitable for the manufacture of instrument transformers or dry transformers by casting, casting encapsulation and encapsulation methods, wherein the product has excellent mechanical, electrical and dielectric properties. Is shown. Embedded image

Description

CROSS REFERENCE TO RELATED APPLICATIONS This application claims the benefit of European Patent Application No. 17153300.3, filed January 26, 2017, the entire disclosure of which is incorporated herein by reference. Becomes

Federally funded R & D statement Not applicable

The present invention relates to a method for producing an anhydride-free thermosetting epoxy resin composition, a product for electrical engineering such as an insulating system using the epoxy resin composition, and an encapsulated article obtained by the method. ). The compositions are distinguished by the chosen polyetheramine and epoxysilane. The resulting insulation-encased products exhibit excellent mechanical, electrical and dielectric properties and are used, for example, as insulators, bushings, switchgears, instrument transformers and dry transformers. obtain.

BACKGROUND Epoxy resin compositions are commonly used for the production of insulating systems for electrical engineering. However, most of these epoxy resin compositions use an anhydride as a curing agent. Due to the growing regulatory framework for chemicals, the use of anhydrides in epoxy resins is likely to be limited in the near future due to their R42 label (respiratory sensitizer). . Therefore, some anhydrides are already on the SVHC candidate list under REACH (a substance of very high concern). Perhaps within a few years these substances will no longer be available without special approval. Since methylhexahydrophthalic anhydride (MHHPA) and hexahydrophthalic anhydride (HHPA) are widely used as primary curing agents for epoxy resins for electrical insulation applications, alternatives not considered as SVHC are needed in the future. is there. Since all known anhydrides are R42 labeled, and even unknown anhydrides are expected by toxicologists to still be R42 labeled, an anhydride free solution is desirable.

  Curable epoxy resin compositions containing polyetheramines for the production of packaged appliances by casting applications are suggested in US Pat. Prior art systems use an anhydride as an additional hardener.

  Accordingly, there is a need for new thermosetting anhydride-free epoxy resin compositions that can be advantageously used in cast encapsulation or encapsulation applications for the manufacture of electrical insulation systems, such as switchgear or transformer applications.

US-A-6002002 US-A-8399577

Detailed Description It is an object of the present invention to provide an anhydride-free thermosetting epoxy resin composition suitable for the manufacture of insulation systems for electrical engineering by casting, casting or encapsulation. The epoxy resin composition must be R42 free and SVHC free and must be distinguished by high fracture toughness and excellent thermal cycling crack resistance. The epoxy resin composition must be particularly suitable for processing by automatic pressure gelation (APG) and vacuum casting, especially vacuum casting. Yet another object of the present invention is to provide casting, casting which exhibits excellent mechanical, electrical and dielectric properties and can be used, for example, as insulators, bushing tubes, switchgears, instrument transformers and dry transformers. It is to provide a packaged product obtained from the encapsulation or sealing method.

  Surprisingly, it has been found that the use of epoxy resin compositions distinguished by selected polyetheramines and epoxysilanes as curing agent components fulfills the above objects.

Therefore, the present invention
(A) at least one epoxy resin, and (B)
Equation (b1)

[Where,
x is a number from 2 to 8]
And a polyetheramine of the formula (b2)

At least one curing agent selected from the group of polyetheramines having at least one terminal group, and (C) at least one epoxy silane;
And a thermosetting epoxy resin composition containing no anhydride.

The at least one epoxy resin (A) is a compound containing at least one glycidyl ether group, preferably more than one glycidyl ether group, for example two or three glycidyl ether groups. Epoxy resins may be saturated or unsaturated aliphatic, saturated or unsaturated alicyclic, aromatic or heterocyclic, and may be substituted. Epoxy resins may be monomeric or polymeric compounds. A review of epoxy resins useful for use in the present invention can be found, for example, in Lee, H .; and Neville, Handbook of Epoxy Resins, McGraw-Hill Book Company, New
York (1982).

  The epoxy resin (A) may vary, including conventional and commercially available epoxy resins, which may be used alone or in combinations of two or more. In selecting an epoxy resin for the composition according to the present invention, not only the properties of the final product, but also other properties that may affect the processing of the viscosity and resin composition must be considered.

  The epoxy resin (A) has an epoxy equivalent of, for example, about 160 to about 400 g / equivalent, preferably about 170 to about 250 g / equivalent. If the epoxy resin is halogenated, the equivalent weight may be somewhat higher.

  If necessary, the epoxy resin (A) contains an epoxy diluent. The epoxy diluent component is, for example, a glycidyl-terminated compound. Particularly preferred are compounds containing a glycidyl or β-methylglycidyl group bonded directly to an oxygen, nitrogen or sulfur atom. Such resins may be obtained by the reaction of epichlorohydrin, glycerol dichlorohydrin or β-methyl epichlorohydrin with a substance containing more than one carboxylic acid group per molecule in the presence of an alkali. Includes polyglycidyl and poly (β-methylglycidyl) esters. Polyglycidyl esters can be used in aliphatic carboxylic acids such as oxalic acid, succinic acid, adipic acid, sebacic acid or dimerized or trimerized linoleic acid, hexahydrophthalic acid, 4-methylhexahydrophthalic acid, tetrahydrophthalic acid and It may be derived from cycloaliphatic carboxylic acids such as methyltetrahydrophthalic acid or from aromatic carboxylic acids such as phthalic acid, isophthalic acid and terephthalic acid.

  Particularly suitable epoxy resins (A) known to the person skilled in the art are based on the reaction products of epichlorohydrin with polyfunctional alcohols, phenols, cycloaliphatic carboxylic acids, aromatic amines or aminophenols.

  Aliphatic alcohols considered for reaction with epichlorohydrin to form suitable polyglycidyl ethers include, for example, ethylene glycol and poly (oxyethylene) glycols such as diethylene glycol and triethylene glycol, propylene glycol and Poly (oxypropylene) glycol, propane-1,3-diol, butane-1,4-diol, pentane-1,5-diol, hexane-1,6-diol, hexane-2,4,6-triol, glycerol , 1,1,1-trimethylolpropane and pentaerythritol.

  Cycloaliphatic alcohols which are considered for reaction with epichlorohydrin to form suitable polyglycidyl ethers are, for example, 1,4-cyclohexanediol (quinitol), 1,1-bis (hydroxymethyl) cyclohexe -3-ene, bis (4-hydroxycyclohexyl) methane and 2,2-bis (4-hydroxycyclohexyl) -propane.

Alcohols containing aromatic nuclei which are considered for reaction with epichlorohydrin for the formation of suitable polyglycidyl ethers are, for example, N, N-bis- (2-hydroxyethyl) aniline and 4,4 ′ -Bis (2-hydroxyethylamino) diphenylmethane.

  Preferably, the polyglycidyl ether is a substance containing two or more phenolic hydroxy groups per molecule, such as resorcinol, catechol, hydroquinone, bis (4-hydroxyphenyl) methane (bisphenol F), 1,1,2,2. -Tetrakis (4-hydroxyphenyl) ethane, 4,4'-dihydroxydiphenyl, bis (4-hydroxyphenyl) sulfone (bisphenol S), 1,1-bis (4-hydroxyphenyl) -1-phenylethane (bisphenol AP ), 1,1-bis (4-hydroxyphenyl) ethylene (bisphenol AD), phenol-formaldehyde or cresol-formaldehyde novolak resin, 2,2-bis (4-hydroxyphenyl) propane (bisphenol A) and 2,2- Bi (3,5-dibromo-4-hydroxyphenyl) propane, from 2,2-bis (4-hydroxyphenyl) propane (bisphenol A).

  In certain embodiments, the at least one epoxy resin (A) is a diglycidyl ether of bisphenol A having an epoxy equivalent of about 170 to about 250 g / equivalent, preferably about 180 to about 190 g / equivalent.

  Some other non-limiting embodiments include, for example, triglycidyl ethers of para-aminophenol. It is also possible to use a mixture of two or more epoxy resins.

  The at least one epoxy resin component (A) is commercially available or can be prepared according to methods known per se. Commercially available products include, for example, D.C. available from the Dow Chemical Company. E. FIG. R. 330, D.I. E. FIG. R. 331; E. FIG. R. 332; E. FIG. R. 334, D.A. E. FIG. R. 354, D.C. E. FIG. R. 580; E. FIG. N. 431; E. FIG. N. 438; E. FIG. R. 736 or D.E. E. FIG. R. 732 or ARALDITE® MY740 or ARALDITE® CY228 from Huntsman Corporation.

  The amount of epoxy resin (A) in the final composition can vary within wide limits and depends on the use of the composition. In some embodiments, the amount of epoxy resin (A) is, for example, from 50 weight percent (wt%) to 95 wt%, preferably from 60 wt%, based on the total weight of components (A) and (B) in the composition. Up to 90% by weight. In certain embodiments, the amount of epoxy resin (A) is from 70% to 80% by weight based on the combined weight of components (A) and (B) in the composition.

  The curing agent (B) may be applied alone. Alternatively, the curing agent (B) is one or more other suitable curing agents that are not anhydride curing agents known in the art for curing epoxy resins, such as primary or secondary amines, polyetheramines, acids. , A Lewis acid, a Lewis base and phenol in some cases. The identification of many of these curing agents and their curing mechanism is discussed in Lee and Neville, Handbook of Epoxy Resins, McGraw-Hill (1982). Preferably, the curing agent (B) is applied alone. At least two, for example, two, three or four, polyetheramines selected from the group of (b1) and (b2), such as one polyetheramine (b1) and one polyetheramine (b2) Mixtures may be used. In certain embodiments, either polyetheramine (b1) or polyetheramine (b2) is applied as a curing agent (B) in the compositions of the present disclosure, and no additional curing agent is applied. Preferably, polyetheramine (b2) is applied as curing agent (B) and no additional curing agent is used.

  The polyetheramines (b1) and (b2) of the curing agent (B) are known. Suitable polyetheramines (b2) can be prepared, for example, by amination of a butylene oxide capped alcohol as described in US-A-7550550. Examples of such polyetheramines include JEFFAMINE® polyetheramine, commercially available from Huntsman Corporation. JEFFAMINE® polyetheramine typically has oxypropylene units or a mixture of oxyethylene and oxypropylene units. Preferred JEFFAMINE® polyetheramines as curing agent components (b1) and (b2) are JEFFAMINE® D- and JEFFAMINE® XTJ-series polyetheramines, respectively.

  JEFFAMINE® D-series polyetheramines have the general formula

Wherein x is a number from 2 to 8, preferably a number from 2 to 6, more preferably a number from 2 to 5, especially about 2.5.
Amine-terminated polypropylene glycol (PPG). In one embodiment, JEFFAMINE® D-230 is used as polyetheramine (b1).

  JEFFAMINE® XTJ-series polyetheramines are similar to JEFFAMINE® D-230 polyetheramine and are referred to as JEFFAMINE® XTJ-568 and JEFFAMINE® XTJ-566, respectively. Available, they give a relatively slow cure. JEFFAMINE® XTJ polyetheramine is a primary amine, which may be produced by amination of butylene oxide-capped alcohol. The reaction is an equation

Yields a primary amine having a terminal group of

  In one embodiment, JEFFAMINE® XTJ-568 is used as polyetheramine (b2).

The amount of curing agent (B) in the final composition can vary within wide limits and will be determined by the desired properties of the curable composition and the desired properties of the cured product. For example, 0.75 to 1.25 equivalents of active hydrogen bonded to the amino nitrogen atom of the curing agent (B) per epoxy equivalent of the epoxy resin (A) is used. In some embodiments, the total amount of curing agent (B), including other curing agents, is, for example, 5 weight percent (% by weight) based on the total weight of components (A) and (B) in the composition.
To 50% by weight, preferably 10% to 40% by weight. In certain embodiments, the total amount of curing agent (B), including other curing agents, is, for example, from 20% to 30% by weight based on the total weight of components (A) and (B) in the composition. .

  The at least one epoxysilane (C) is, for example, [3- (2,3-epoxypropoxy) propyl] trimethoxysilane.

  The amount of epoxysilane (C) in the final composition may be, for example, from 0.1 weight percent (wt%) to 2 wt% based on the total weight of components (A) and (C) in the composition. Preferably it is from 0.5% to 1.5% by weight. In certain embodiments, the amount of epoxysilane (C) is, for example, from 0.8% to 1.2% by weight based on the total weight of components (A) and (C) in the composition.

  In many applications of the present invention, optional at least one filler (D) is optionally added. Filler (D) may be coated, ie, surface-treated or uncoated. Uncoated and coated fillers are commercially available or can be prepared according to methods known per se, for example by silanization. In some embodiments, filler (D) is uncoated. Suitable fillers include, for example, metal powders, wood powders, glass powders, glass beads, metalloid oxides, metal oxides, metal hydroxides, metalloids and metal nitrides, metalloids and metal carbides, metal carbonates, Metal sulfates and natural or synthetic minerals.

In certain embodiments, suitable filler (D) is silica sand, quartz powder, silica, aluminum oxide, titanium oxide, zirconium _{oxide, Mg (OH) 2, Al} (OH) 3, dolomite [CaMg (CO _{3) 2} ], Al (OH) ₃ , AlO (OH), silicon nitride, boron nitride, aluminum nitride, silicon carbide, boron carbide, dolomite, chalk, calcium carbonate, barite, gypsum, hydromagnesite, zeolite, talc, mica, kaolin And wollastonite. Preferred are quartz, silica, wollastonite or calcium carbonate, especially quartz or silica. Suitable silicas are, for example, crystalline or amorphous silicas, especially fused silica.

  Optionally, the amount of at least one filler (D) in the final composition is, for example, from 30% by weight (% by weight) to 75% by weight, based on the total weight of the thermosetting epoxy resin composition, preferably Is from 50% to 70% by weight, in particular from 55% to 65% by weight.

  Further additives are processing aids for improving the rheological properties of the resin composition, hydrophobic compounds including silicones, wetting / dispersing agents, plasticizers, dyes, pigments, reactive or non-reactive diluents, Softeners, accelerators, antioxidants, light stabilizers, pigments, flame retardants, fibers, fungicides, thixotropic agents, toughness improvers, defoamers, antistatic agents, lubricants It may be selected from bulking agents, antisettling agents, wetting agents and mold release agents and other additives commonly used in electrical applications. These additives are known to those skilled in the art.

Preferred is:
(A) at least one diglycidyl ether of bisphenol A having an epoxy equivalent of from about 170 to about 250;
(B1) at least one cure selected from the group of polyetheramines of formula (1) wherein x is a number from 2 to 6 and (b2) polyetheramines having at least one terminal group of formula (2) And (C) [3- (2,3-epoxypropoxy) propyl] trimethoxysilane.

In certain embodiments, the thermosetting epoxy resin composition comprises:
(A) 70% to 80% by weight, based on the total weight of components (A) and (B) in the composition, of at least one diglycidyl ether of bisphenol A having an epoxy equivalent of about 170 to about 250; And (B) 20 to 30% by weight, based on the total weight of components (A) and (B) in the composition, of (b1) a polyether of the formula (1) wherein x is a number from 2 to 6 Amine and (b2) at least one curing agent selected from the group of polyetheramines having at least one terminal group of formula (2), and the sum of components (A) and (C) in the composition (C) 0.5-1.5% by weight, based on weight, of [3- (2,3-epoxypropoxy) propyl] trimethoxysilane;
And

  The compositions of the present disclosure are useful for making products for electrical engineering, such as insulating systems.

Therefore, the present invention is also directed to a method for producing a product for electrical engineering in which an anhydride-free thermosetting resin composition is used, wherein the resin composition comprises (A) at least one epoxy resin, and (B)
Equation (b1)

[Where,
x is a number from 2 to 8]
And a polyetheramine of the formula (b2)

At least one curing agent selected from the group of polyetheramines having at least one terminal group, and (C) at least one epoxy silane;
Wherein the definitions, aspects and preferences set forth above apply.

  Products for electrical engineering, such as insulation systems, are typically cast, such as gravity casting, vacuum casting, automatic pressure gelling (APG), vacuum gelling (VPG), casting encapsulation, or the like. It is manufactured by the encapsulation method. Such methods typically cure in a mold for a time sufficient to mold the epoxy resin composition into its final insoluble three-dimensional structure, typically up to 10 hours. And post-curing of the release product at an elevated temperature in a separate curing oven to develop the desired physical and mechanical properties of the cured epoxy resin composition.

  Preferably, the epoxy resin composition of the present disclosure is processed by APG or vacuum casting to provide a product for electrical engineering. In certain embodiments, the epoxy resin compositions of the present invention are processed by vacuum casting.

  A typical use of the insulation system produced in accordance with the invention is in cast transformers for instrument transformers or dry transformers, for example dry distribution transformers or vacuum cast dry distribution transformers, which are: A conductor is contained in the resin structure.

The following examples serve to illustrate the invention. Unless otherwise stated temperatures are given in degrees Celsius, parts are parts by weight and percentages relate to% by weight. Parts by weight relate to parts by volume in the ratio of kilograms to liters.
Description of ingredients:
ARALDITE® MY740: bisphenol-A diglycidyl ether epoxy resin having an epoxy equivalent of 180-190 g / equivalent (Huntsman)
DY 045: polyethylene glycol with 400 g / mol DETDA: diethyltoluenediamine (Lonza)
ARALDITE® CY228: A modified bisphenol A diglycidyl ether epoxy resin having an epoxy equivalent of 188-200 g / equivalent (Huntsman)
ARADUR® HY918-1: An anhydride hardener consisting of various isomers of methyltetrahydrophthalic anhydride (Huntsman)
Accelerator DY062: N, N-dimethyl-benzylamine (Huntsman)
Silica W12: silica powder with an average particle size of 16 microns (Quarzwerke)
TEP-2E4MHZ: Inclusion catalyst containing 1,1,2,2-tetrakis (4-hydroxyphenyl) ethane as a host molecule and 2-ethyl-4-methylimidazole as a guest molecule (Nippon Soda)
LME 11132: Prepared epoxy resin (Huntsman)
JEFFAMINE® XTJ-568: a polyetheramine having at least one end group of formula (2) (Huntsman)
LME 11089: Curing agent containing monoethylene glycol-polybutylene oxide diamine and isophorone diamine (Huntsman)
ARADUR® 42: isophorone-diamine (Huntsman)
JEFFAMINE (registered trademark) D-230: polyoxypropylene diamine (Huntsman)
Silane A-187: [3- (2,3-epoxypropoxy) propyl] trimethoxysilane (Momentive)

99 parts of ARALDITE (registered trademark) MY740 epoxy resin as the epoxy resin component (A), and 30 parts of JEFFAMINE (registered trademark) XTJ-5 as the curing agent component (B).
Using 1 part Silane A-187 as the 68 polyetheramine and epoxysilane (C), mix components (A), (B) and (C) with a blade agitator for 5 minutes at room temperature. A thermosetting resin composition is prepared. A total of 195 parts of Silica W12 are added separately as filler (D) (60% by weight, based on the total weight of the thermosetting epoxy resin composition). The mixture is degassed under vacuum and poured into a mold preheated to 80 ° C. The mold temperature is raised to 120 ° C. and kept at this temperature for 2 hours to produce a plate for mechanical testing. After cooling and demolding, the plates are machined into test specimens.

  Instead of 30 parts of JEFFAMINE® XTJ-568 polyetheramine as curing agent component (B), use 31.5 parts of JEFFAMINE® D-230 polyetheramine and substitute 195 parts as a filler. Example 1 is repeated except that 198 parts of Silica W12 (60% by weight based on the total weight of the thermosetting epoxy resin composition) are used. The components (A), (B), (C) and (D) are processed as described in Example 1 to give test specimens.

Comparative Example 1
For comparison, 100 parts ARALDITE® CY228 epoxy resin, 20 parts DY 045, 85 parts ARADUR® HY918-1 curative and 0.8 parts Accelerator DY062 at room temperature with a blade stirrer. The thermosetting resin composition is prepared by mixing for 5 minutes. While heating the composition to about 60 ° C. within 10 minutes, a total of 385 parts of Silica W12 are added in portions (65% by weight based on the total weight of the thermosetting epoxy resin composition). The mixture is degassed under vacuum and poured into a mold preheated to 80 ° C. The mold temperature is raised to 145 ° C. and kept at this temperature for 10 hours to produce plates for mechanical testing. After cooling and demolding, the plates are machined into test specimens.

[Comparative Example 2]
For comparison, 28 parts of a mixture containing 100 parts ARALDITE (R) MY740 epoxy resin and 8 parts ARADUR (R) 42 hardener and 20 parts JEFFAMINE (R) XTJ-568 polyetheramine. Is premixed and a total of 192 parts of Silica W12 are added as filler (60% by weight based on the total weight of the thermosetting epoxy resin composition) to prepare a thermosetting resin composition. The composition is fed into a batch mixer at a temperature of 40 ° C., injected into a mold preheated to 110 ° C. to 120 ° C., and the mold temperature is kept at this temperature at a maximum of 120 ° C. for 2 hours.

Comparative Example 3
For comparison, a thermosetting resin composition was prepared by dispersing 3.0 parts of TEP-2E4MHZ in 100 parts of ARALDITE® MY740 epoxy resin within 5 minutes at room temperature using a disperser stirrer. Prepare the product. 20 parts of DETDA are added to the resulting dispersion under stirring with a blade stirrer at room temperature within 2 minutes. Once 184.5 g of Silica W12 has been added to the composition, mixing is continued for 5 minutes. The mixture is degassed under vacuum and poured into a mold preheated to 80 ° C. The mold temperature is raised to 140 ° C. and kept at this temperature for 5 hours to produce plates for mechanical testing. After cooling and demolding, the plates are machined into test specimens.

The gel times of the reactive mixtures obtained according to the above examples and comparative examples are determined according to ISO 9396 at 80 ° C. and 140 ° C. using a gel norm / gel timer. For this purpose, the uncured composition is heated slightly to reduce the gel nor
Facilitates filling of m-tubes. Determining a heat generation by differential scanning calorimetry on Mettler SC 822 ^e.

  The test data is summarized in Table 1 below.

[Comparative Example 4]
For comparison, "Symposium on Epoxy and Polyurethane Resins in Electrical and Electronic and Electronic"
Test data obtained using the anhydride-free thermosetting resin composition described in "Engineering", Ostfildern, Germany, April 19-21, 2016 is also shown in Table 1. The composition is 100 parts LME. 11132, 28 parts LME 11089 and 192 parts Silica W12 (60% by weight based on the total weight of the thermosetting epoxy resin composition).

1) ISO 9396; Gel norm method 2) Tg = glass transition temperature; IE 1006; differential scanning calorimetry on Mettler SC 822 ^e (range: not 20 ° C. at 10 ° C. min ^-1 to 250 ° C.)
3) ISO 527
4) Critical stress intensity factor mode I; double torsion test (Huntsman proprietary test method)
5) Breaking energy, double torsion test (Huntsman proprietary test method)
6) Thermal expansion coefficient: ISO 11359-2
7) simulated cracking temperature is described in 9 and 10 the column of US-A-6638567, wherein ^{RI = -498.08 · Z 0.18480890 · G} 0.194114601 · (A-18) -0.391334273 · T -0.158387791 +224,25
Is calculated according to
RI means simulated crack temperature in ° C.
Z means elongation at break in%,
G means G _IC in J / m ² ,
A means CTE at 10 ^-6 / K,
T means Tg at ° C. 8) Ea = (ln ((gel time at 80 ° C.) / Min) −ln ((gel time at 140 ° C.) / Min)) / (1 / (80 ° C. + 273 ° C.) ) ^* K / ° C-1 / (140 ° C + 273 ° C) ^* K / ° C) ^* 8.31 J / (mol ^* K) / 1000 J / kJ

  The compositions of the present invention (Examples 1 and 2) meet the targeted gel time and glass transition temperature as well as the prior art anhydride-based system (Comparative Example 1). Prior art anhydride-free systems (Comparative Examples 2 and 4) are too reactive and do not meet the targeted gel time at 80 ° C.

  In contrast to the compositions of the present invention, most of the prior art systems have poor mechanical performance (low elongation at break, low critical stress intensity factor, high simulated crack temperature). The compositions according to the invention can therefore be used advantageously as casting systems, especially for anhydride-free instrument transformers and dry transformers.

Claims (12)

(A) at least one epoxy resin, and (B)
Equation (b1)

[Where,
x is a number from 2 to 8]
And a polyetheramine of the formula (b2)

At least one curing agent selected from the group of polyetheramines having at least one terminal group, and (C) at least one epoxy silane;
And a thermosetting epoxy resin composition containing no multicomponent anhydride. The composition of claim 1, wherein the at least one epoxy resin (A) has an epoxy equivalent of about 170 to about 250 g / equivalent. 3. The composition according to claim 1, wherein the at least one epoxy resin (A) is a diglycidyl ether of bisphenol A. 4. The composition according to claim 1, wherein the at least one epoxysilane (C) is [3- (2,3-epoxypropoxy) propyl] trimethoxysilane. Furthermore: (D) silica sand, quartz powder, silica, aluminum oxide, titanium oxide, zirconium _{oxide, Mg (OH) 2, Al} (OH) 3, dolomite _{[CaMg (CO 3) 2]} , Al (OH) 3, From the group consisting of AlO (OH), silicon nitride, boron nitride, aluminum nitride, silicon carbide, boron carbide, dolomite, chalk, calcium carbonate, barite, gypsum, hydromagnesite, zeolite, talc, mica, kaolin and wollastonite 5. The composition according to claim 1, comprising at least one filler selected. (A) at least one diglycidyl ether of bisphenol A having an epoxy equivalent of from about 170 to about 250 g / equivalent, and (B)
(B1) at least one cure selected from the group of polyetheramines of formula (1) wherein x is a number from 2 to 6 and (b2) polyetheramines having at least one terminal group of formula (2) The composition according to any one of the preceding claims, comprising an agent, and (C) [3- (2,3-epoxypropoxy) propyl] trimethoxysilane. A method for producing a product for electrical engineering in which an anhydride-free thermosetting resin composition is used, wherein the resin composition comprises (A) at least one epoxy resin, and (B)
Equation (b1)

[Where,
x is a number from 2 to 8]
And a polyetheramine of the formula (b2)

At least one curing agent selected from the group of polyetheramines having at least one terminal group, and (C) at least one epoxy silane;
And a method comprising: The method according to claim 7, wherein the product for electrical engineering is an instrument transformer or a dry transformer manufactured by casting, casting or encapsulation. 9. The method according to claim 8, wherein the product for electrical engineering is manufactured by automatic pressure gelling (APG) or vacuum casting. 10. The method according to claim 9, wherein the product for electrical engineering is manufactured by vacuum casting. A product for electrical engineering obtained by the method according to any one of claims 8 to 10. Use of the product according to claim 11 as an instrument transformer or a dry transformer.