JP2020194818A

JP2020194818A - Printed board device

Info

Publication number: JP2020194818A
Application number: JP2019097868A
Authority: JP
Inventors: 太下薗; Futoshi Shimozono; 哲石坂; Satoru Ishizaka
Original assignee: Mitsubishi Electric Corp
Current assignee: Mitsubishi Electric Corp
Priority date: 2019-05-24
Filing date: 2019-05-24
Publication date: 2020-12-03

Abstract

To provide a printed board device in which deterioration of signal quality is suppressed, by suppressing heat transfer from a high heating component to a weak heat resistant component.SOLUTION: A printed board device 100 includes a printed board 1, a first component 2, a second component 3 and a capacitor 4. The printed board includes a first mounting part 5, a second mounting part 6, an insulation 7, and a connection 8. The first mounting part has a first ground electrode, the second mounting part has a second ground electrode, and is placed to surround the first mounting part. The insulation is formed between the first and second mounting parts. The connection has a third wiring layer, and connects the first and second mounting parts. The first component is connected with the first ground electrode, and the second component is connected with the second ground electrode. The capacitor is placed on the insulation, and connects the first and second ground electrodes. Heat conductivity of the insulation is lower than that of the first and second mounting parts. The distance L1 of the connection and the second component is longer than the distance L2 of the first and second components.SELECTED DRAWING: Figure 1

Description

本発明は、プリント基板装置に関する。 The present invention relates to a printed circuit board device.

電子機器の小型化・高密度化に伴い、発熱量が多い高発熱部品と、温度変化に対する特性変化率が高く耐熱性が低い弱耐熱部品とが１つのプリント基板に実装されるケースが増えている。このようなケースにおいては、高発熱部品の熱により弱耐熱部品の温度が上昇し、部品、もしくは電子機器自体の故障または寿命の低下が引き起こされるおそれがある。 With the miniaturization and high density of electronic devices, the number of cases where high heat generation parts with a large amount of heat generation and weak heat resistance parts with a high rate of change in characteristics and low heat resistance with respect to temperature changes are mounted on one printed circuit board is increasing. There is. In such a case, the temperature of the weakly heat-resistant component may rise due to the heat of the high heat-generating component, which may cause a failure of the component or the electronic device itself or a decrease in life.

特開２００５−７２９５４公報には、スリット状に形成された２つの接地電極非形成部と接地電極非形成部間に配置された隣接接地電極とが弱耐熱部品の周囲に形成されたプリント基板装置、およびスリット状に形成された一連の接地電極非形成部と接地電極非形成部を跨ぐように配置されたコンデンサとが形成されたプリント基板装置が開示されている。 According to JP-A-2005-72954, a printed circuit board device in which two slit-shaped non-formed ground electrode portions and adjacent ground electrode arranged between the non-formed ground electrode portions are formed around a weak heat-resistant component. , And a printed circuit board device in which a series of non-formed ground electrode formed portions formed in a slit shape and a capacitor arranged so as to straddle the non-formed ground electrode portions are disclosed.

特開２００５−７２９５４公報JP-A-2005-72954

しかしながら、従来のプリント基板装置では、高発熱部品が実装される高発熱部品実装領域の接地電位と、弱耐熱部品が実装される弱耐熱部品実装領域の接地電位とが、直流的（ＤＣ（ＤｉｒｅｃｔＣｕｒｒｅｎｔ）的）または交流的（ＡＣ（ＡｌｔｅｒｎａｔｉｎｇＣｕｒｒｅｎｔ）的）に接続されているのみである。そのため、ノイズによって各接地電極に微少電流が流れた場合、その電流の周波数によっては上記２つの接地電位に差が生じ、信号レベルの変化や信号波形のひずみといった信号品質の劣化を生じることが問題となる。 However, in the conventional printed board device, the ground potential of the high heat generation component mounting region on which the high heat generation component is mounted and the ground potential of the weak heat resistant component mounting region on which the weak heat resistant component is mounted are direct current (DC (Direct)). It is only connected in a currant) or alternating current (AC (Alternating Current)) connection. Therefore, when a minute current flows through each ground electrode due to noise, there is a problem that the above two ground potentials differ depending on the frequency of the current, resulting in deterioration of signal quality such as a change in signal level and distortion of signal waveform. It becomes.

本発明の主たる目的は、高発熱部品から弱耐熱部品への熱伝導を抑制しながらも、信号品質の劣化が抑制されたプリント基板装置を提供することにある。 A main object of the present invention is to provide a printed circuit board device in which deterioration of signal quality is suppressed while suppressing heat conduction from a high heat generation component to a weak heat resistant component.

本発明に係るプリント基板装置は、第１プリント基板と、第１部品と、第２部品と、コンデンサとを備える。第１プリント基板は、第１接地電極を有する第１実装部と、第２接地電極を有しかつ第１実装部を囲むように配置された第２実装部と、第１接地電極と第２接地電極とを接続する配線部を有しかつ第１実装部と第２実装部とを接続する接続部と、第１実装部と第２実装部との間に形成された絶縁部を含む。第１部品は、第１実装部に実装されておりかつ第１接地電極に接続されている。第２部品は、第２実装部に実装されておりかつ第２接地電極に接続されている。コンデンサは、絶縁部上に配置されておりかつ第１接地電極と第２接地電極とを接続する。絶縁部の熱伝導率は、第１実装部および第２実装部の熱伝導率よりも低い。接続部と第２部品との間の距離は、第１部品と第２部品との間の距離よりも長い。 The printed circuit board device according to the present invention includes a first printed circuit board, a first component, a second component, and a capacitor. The first printed circuit board has a first mounting portion having a first grounding electrode, a second mounting portion having a second grounding electrode and arranged so as to surround the first mounting portion, and a first grounding electrode and a second. It includes a connecting portion having a wiring portion for connecting the ground electrode and connecting the first mounting portion and the second mounting portion, and an insulating portion formed between the first mounting portion and the second mounting portion. The first component is mounted on the first mounting portion and is connected to the first ground electrode. The second component is mounted on the second mounting portion and is connected to the second ground electrode. The capacitor is arranged on the insulating portion and connects the first ground electrode and the second ground electrode. The thermal conductivity of the insulating portion is lower than the thermal conductivity of the first mounting portion and the second mounting portion. The distance between the connection and the second component is longer than the distance between the first component and the second component.

本発明によれば、高発熱部品から弱耐熱部品への熱伝導を抑制しながらも、信号品質の劣化が抑制されたプリント基板装置を提供できる。 According to the present invention, it is possible to provide a printed circuit board device in which deterioration of signal quality is suppressed while suppressing heat conduction from a high heat generation component to a weak heat resistant component.

実施の形態１に係るプリント基板装置の平面図である。It is a top view of the printed circuit board apparatus which concerns on Embodiment 1. FIG. 図１中の矢印ＩＩ−ＩＩから視た断面図である。It is sectional drawing seen from the arrow II-II in FIG. 図１中の矢印ＩＩＩ−ＩＩＩから視た断面図である。It is sectional drawing seen from the arrow III-III in FIG. 図１中の矢印ＩＶ−ＩＶから視た断面図である。It is sectional drawing seen from the arrow IV-IV in FIG. 実施の形態１に係るプリント基板装置の変形例の、図２と同じ領域を示す断面図である。It is sectional drawing which shows the same area as FIG. 2 of the modification of the printed circuit board apparatus which concerns on Embodiment 1. FIG. 実施の形態２に係るプリント基板装置の斜視図である。It is a perspective view of the printed circuit board apparatus which concerns on Embodiment 2. FIG. 実施の形態２に係るプリント基板装置の変形例を示す側面図である。It is a side view which shows the modification of the printed circuit board apparatus which concerns on Embodiment 2. FIG. 実施の形態３に係るプリント基板装置を示す斜視図である。It is a perspective view which shows the printed circuit board apparatus which concerns on Embodiment 3. 実施の形態３に係るプリント基板装置の変形例を示す斜視図である。It is a perspective view which shows the modification of the printed circuit board apparatus which concerns on Embodiment 3. FIG. 実施の形態４に係るプリント基板装置を示す斜視図である。It is a perspective view which shows the printed circuit board apparatus which concerns on Embodiment 4. FIG.

以下、図面を参照して、本発明の実施の形態について説明する。なお、以下の図面において同一または相当する部分には同一の参照番号を付しその説明は繰返さない。また、説明の便宜上、以下ではＸ方向、Ｙ方向、およびＺ方向が導入されており、各方向は互いに直交している。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings below, the same or corresponding parts are given the same reference numbers, and the explanations are not repeated. Further, for convenience of explanation, the X direction, the Y direction, and the Z direction are introduced below, and the respective directions are orthogonal to each other.

実施の形態１．
図１は、実施の形態１に係るプリント基板装置１００をＺ方向から視た平面図である。図２は、図１中の矢印ＩＩ−ＩＩから視た断面図である。図３は、図１中の矢印ＩＩＩ−ＩＩＩから視た断面図である。 Embodiment 1.
FIG. 1 is a plan view of the printed circuit board device 100 according to the first embodiment as viewed from the Z direction. FIG. 2 is a cross-sectional view taken from arrow II-II in FIG. FIG. 3 is a cross-sectional view taken from arrow III-III in FIG.

図１に示されるように、実施の形態１に係るプリント基板装置１００は、プリント基板１と、プリント基板１に実装された第１部品２、第２部品３、およびコンデンサ４とを主に備える。プリント基板装置１００では、第１部品２が弱耐熱部品であり、第２部品３が高発熱部品である。すなわち、第１部品２の耐熱温度は、第２部品３の耐熱温度未満である。第２部品３の発熱量は、第１部品２の発熱量超えである。第１部品２は、例えば低ノイズ増幅器（ＬｏｗＮｏｉｓｅＡｍｐｌｉｆｉｅｒ）である。第２部品３は、例えば電力増幅器（ＰｏｗｅｒＡｍｐｌｉｆｉｅｒ）である。コンデンサ４は、例えば外付けのコンデンサ素子である。コンデンサ４は、第１端子部４Ａと第２端子部４Ｂとを有している。 As shown in FIG. 1, the printed circuit board device 100 according to the first embodiment mainly includes a printed circuit board 1, a first component 2, a second component 3, and a capacitor 4 mounted on the printed circuit board 1. .. In the printed circuit board device 100, the first component 2 is a weak heat-resistant component, and the second component 3 is a high heat-generating component. That is, the heat resistant temperature of the first component 2 is lower than the heat resistant temperature of the second component 3. The calorific value of the second component 3 exceeds the calorific value of the first component 2. The first component 2 is, for example, a low noise amplifier. The second component 3 is, for example, a power amplifier. The capacitor 4 is, for example, an external capacitor element. The capacitor 4 has a first terminal portion 4A and a second terminal portion 4B.

プリント基板１は、第１部品２が実装された第１実装部５と、第２部品３が実装された第２実装部６と、第１実装部５と第２実装部６との間に配置された絶縁部７および接続部８とを含む。コンデンサ４の第１端子部４Ａは、第１実装部５に実装されている。コンデンサ４の第２端子部４Ｂは、第２実装部６に実装されている。 The printed circuit board 1 is formed between the first mounting unit 5 on which the first component 2 is mounted, the second mounting section 6 on which the second component 3 is mounted, and the first mounting section 5 and the second mounting section 6. It includes an arranged insulating portion 7 and a connecting portion 8. The first terminal portion 4A of the capacitor 4 is mounted on the first mounting portion 5. The second terminal portion 4B of the capacitor 4 is mounted on the second mounting portion 6.

図１に示されるように、Ｚ方向から視て、第１実装部５は、第２実装部６よりも内側に配置されている外周端部５Ａを有している。第２実装部６は、第１実装部５を囲むように配置されている。第２実装部６は、第１実装部５よりも外側に配置されている内周端部６Ａを有している。外周端部５Ａおよび内周端部６Ａは、互いに対向している。外周端部５Ａおよび内周端部６Ａは、絶縁部７に面している。異なる観点から言えば、プリント基板１には、第１実装部５と第２実装部６とを区画する貫通孔が形成されており、外周端部５Ａおよび内周端部６Ａは貫通孔１Ａ（図２参照）の側壁を構成している。Ｚ方向から視て、外周端部５Ａおよび内周端部６Ａは、第１部品２を囲むように形成されている。Ｚ方向から視て、外周端部５Ａおよび内周端部６Ａの各形状は、任意の形状であればよいが、例えば角形状である。 As shown in FIG. 1, when viewed from the Z direction, the first mounting portion 5 has an outer peripheral end portion 5A arranged inside the second mounting portion 6. The second mounting unit 6 is arranged so as to surround the first mounting unit 5. The second mounting portion 6 has an inner peripheral end portion 6A arranged outside the first mounting portion 5. The outer peripheral end portion 5A and the inner peripheral end portion 6A face each other. The outer peripheral end portion 5A and the inner peripheral end portion 6A face the insulating portion 7. From a different point of view, the printed circuit board 1 is formed with a through hole for partitioning the first mounting portion 5 and the second mounting portion 6, and the outer peripheral end portion 5A and the inner peripheral end portion 6A are formed through the through hole 1A ( (See FIG. 2) constitutes a side wall. When viewed from the Z direction, the outer peripheral end portion 5A and the inner peripheral end portion 6A are formed so as to surround the first component 2. When viewed from the Z direction, each shape of the outer peripheral end portion 5A and the inner peripheral end portion 6A may be any shape, but is, for example, a square shape.

図２に示されるように、第１実装部５は、例えば複数の第１配線層１０および複数の第１絶縁層１１を有している。複数の第１配線層１０および複数の第１絶縁層１１は、例えば交互に積層している。複数の第１配線層１０の少なくとも一部は、接地電位とされる第１接地電極を構成している。第１部品２は、第１接地電極に接続されている。第２実装部６は、例えば複数の第２配線層２０および複数の第２絶縁層２１を有している。複数の第２配線層２０および複数の第２絶縁層２１は、例えば交互に積層している。複数の第２配線層２０の少なくとも一部は、接地電位とされる第２接地電極を構成している。第２部品３は、第２接地電極に接続されている。 As shown in FIG. 2, the first mounting unit 5 has, for example, a plurality of first wiring layers 10 and a plurality of first insulating layers 11. The plurality of first wiring layers 10 and the plurality of first insulating layers 11 are laminated, for example, alternately. At least a part of the plurality of first wiring layers 10 constitutes a first ground electrode to be a ground potential. The first component 2 is connected to the first ground electrode. The second mounting unit 6 has, for example, a plurality of second wiring layers 20 and a plurality of second insulating layers 21. The plurality of second wiring layers 20 and the plurality of second insulating layers 21 are laminated, for example, alternately. At least a part of the plurality of second wiring layers 20 constitutes a second ground electrode to be a ground potential. The second component 3 is connected to the second ground electrode.

絶縁部７は、第１実装部５の外周端部５Ａと第２実装部６の内周端部６Ａとの間に配置されている。絶縁部７は、第１実装部５の周方向に沿って延在している。絶縁部７および接続部８は第１実装部５の上記周方向において並んで配置されている。絶縁部７の延在方向における一端部７Ａおよび他端部７Ｂは、接続部８に面している。絶縁部７の一端部７Ａおよび他端部７Ｂとの間の最短距離、すなわち接続部８の最小幅は、絶縁部７の一端部７Ａおよび他端部７Ｂとの間の上記延在方向に沿った距離よりも短い。 The insulating portion 7 is arranged between the outer peripheral end portion 5A of the first mounting portion 5 and the inner peripheral end portion 6A of the second mounting portion 6. The insulating portion 7 extends along the circumferential direction of the first mounting portion 5. The insulating portion 7 and the connecting portion 8 are arranged side by side in the circumferential direction of the first mounting portion 5. One end 7A and the other end 7B of the insulating portion 7 in the extending direction face the connecting portion 8. The shortest distance between one end 7A and the other end 7B of the insulating portion 7, that is, the minimum width of the connecting portion 8, is along the extending direction between the one end 7A and the other end 7B of the insulating portion 7. It is shorter than the distance.

絶縁部７は、第１実装部５と第２実装部６との間、すなわち第１配線層１０と第２配線層２０との間、を電気的および熱的に絶縁している。絶縁部７の熱伝導率は、第１実装部５および第２実装部６の各熱伝導率より低い。絶縁部７の電気伝導率は、第１実装部５および第２実装部６の各電気伝導率より低い。絶縁部７は、例えば上記貫通孔１Ａに配置された樹脂部９を有する。樹脂部９を構成する材料は、例えば第１絶縁層１１および第２絶縁層２１を構成する材料と同じである。 The insulating portion 7 electrically and thermally insulates between the first mounting portion 5 and the second mounting portion 6, that is, between the first wiring layer 10 and the second wiring layer 20. The thermal conductivity of the insulating portion 7 is lower than the thermal conductivity of each of the first mounting portion 5 and the second mounting portion 6. The electrical conductivity of the insulating portion 7 is lower than the electrical conductivity of the first mounting portion 5 and the second mounting portion 6. The insulating portion 7 has, for example, a resin portion 9 arranged in the through hole 1A. The material constituting the resin portion 9 is, for example, the same as the material constituting the first insulating layer 11 and the second insulating layer 21.

なお、絶縁部７は複数の第４配線層４０と複数の第４絶縁層４１を有していてもよい。複数の第４配線層４０および複数の第４絶縁層４１は、例えば交互に積層している。この場合、絶縁部７の配線密度、すなわちＺ方向から視た絶縁部７の面積に対する第４配線層４０の延べ面積の比率は、接続部８の配線密度、すなわちＺ方向から視た接続部８の面積に対する第３配線層３０の延べ面積の比率よりも低い。 The insulating portion 7 may have a plurality of fourth wiring layers 40 and a plurality of fourth insulating layers 41. The plurality of fourth wiring layers 40 and the plurality of fourth insulating layers 41 are laminated, for example, alternately. In this case, the wiring density of the insulating portion 7, that is, the ratio of the total area of the fourth wiring layer 40 to the area of the insulating portion 7 viewed from the Z direction is the wiring density of the connecting portion 8, that is, the connecting portion 8 viewed from the Z direction. It is lower than the ratio of the total area of the third wiring layer 30 to the area of.

接続部８は、第１実装部５と第２実装部６との間、すなわち第１配線層１０と第２配線層２０との間、を電気的および熱的に接続している。接続部８の熱伝導率は、コンデンサ４および絶縁部７の各熱伝導率より高い。接続部８の電気伝導率は、絶縁部７の電気伝導率より高い。接続部８は、例えば複数の第３配線層３０および複数の第３絶縁層３１を有している。複数の第３配線層３０および複数の第３絶縁層３１は、例えば交互に積層している。第３配線層３０を構成する材料は、例えば第１配線層１０および第２配線層２０を構成する材料と同じである。第３絶縁層３１を構成する材料は、例えば第１絶縁層１１および第２絶縁層２１を構成する材料と同じである。 The connecting portion 8 electrically and thermally connects between the first mounting portion 5 and the second mounting portion 6, that is, between the first wiring layer 10 and the second wiring layer 20. The thermal conductivity of the connecting portion 8 is higher than the thermal conductivity of each of the capacitor 4 and the insulating portion 7. The electrical conductivity of the connecting portion 8 is higher than the electrical conductivity of the insulating portion 7. The connection portion 8 has, for example, a plurality of third wiring layers 30 and a plurality of third insulating layers 31. The plurality of third wiring layers 30 and the plurality of third insulating layers 31 are laminated, for example, alternately. The material constituting the third wiring layer 30 is the same as the material constituting the first wiring layer 10 and the second wiring layer 20, for example. The material constituting the third insulating layer 31 is, for example, the same as the material constituting the first insulating layer 11 and the second insulating layer 21.

第１実装部５の第１接地電極と第２実装部６の第２接地電極とは、コンデンサ４を介していわゆるＡＣ（ＡｌｔｅｒｎａｔｉｎｇＣｕｒｒｅｎｔ）的に接続されており、かつ接続部８の第３配線層３０を介していわゆるＤＣ（ＤｉｒｅｃｔＣｕｒｒｅｎｔ）的に接続されている。異なる観点から言えば、コンデンサ４は、第１実装部５の第１接地電極と第２実装部６の第２接地電極との間を、いわゆるＡＣ的に接続している。接続部８は、第１実装部５の第１接地電極と第２実装部６の第２接地電極との間を、いわゆるＤＣ的に接続している。 The first ground electrode of the first mounting portion 5 and the second ground electrode of the second mounting portion 6 are connected to each other in a so-called AC (Alternating Current) manner via a capacitor 4, and the third wiring of the connecting portion 8 is provided. It is connected in a so-called DC (Direct Current) manner via the layer 30. From a different point of view, the capacitor 4 connects the first ground electrode of the first mounting portion 5 and the second ground electrode of the second mounting portion 6 in a so-called AC manner. The connection portion 8 connects the first ground electrode of the first mounting portion 5 and the second ground electrode of the second mounting portion 6 in a so-called DC manner.

図１に示されるように、第２部品３と接続部８との間の距離Ｌ１は、第１部品２と第２部品３との間の距離Ｌ２よりも長い。 As shown in FIG. 1, the distance L1 between the second component 3 and the connecting portion 8 is longer than the distance L2 between the first component 2 and the second component 3.

第２部品３、絶縁部７、第１部品２、および接続部８は、仮想直線上に並んで配置されている。当該仮想直線上において、接続部８は、第１部品２から視て第２部品３および絶縁部７とは反対側に配置されている。接続部８とコンデンサ４との間の距離Ｌ３は、接続部８と第１部品２との間の距離Ｌ４よりも長い。コンデンサ４は、絶縁部７において接続部８から最も離れた領域上に配置されている。なお、距離Ｌ１〜Ｌ４は、いずれもＺ方向から視たときの２部分間の最短距離である。 The second component 3, the insulating portion 7, the first component 2, and the connecting portion 8 are arranged side by side on a virtual straight line. On the virtual straight line, the connecting portion 8 is arranged on the side opposite to the second component 3 and the insulating portion 7 when viewed from the first component 2. The distance L3 between the connection portion 8 and the capacitor 4 is longer than the distance L4 between the connection portion 8 and the first component 2. The capacitor 4 is arranged on the region of the insulating portion 7 farthest from the connecting portion 8. The distances L1 to L4 are the shortest distances between the two parts when viewed from the Z direction.

第２部品３と絶縁部７との間の距離は、例えば第２部品３と第１部品２とを最短距離で結ぶ仮想直線に近い領域上において最も短く、該領域から離れるにつれて長い。 The distance between the second component 3 and the insulating portion 7 is, for example, the shortest on a region close to a virtual straight line connecting the second component 3 and the first component 2 at the shortest distance, and becomes longer as the distance from the region increases.

＜作用効果＞
プリント基板装置１００は、プリント基板１と、第１部品２と、第２部品３と、コンデンサ４とを備える。プリント基板１は、第１実装部５、第２実装部６、絶縁部７、および接続部８を含む。第１実装部５は、第１接地電極を有する。第２実装部６は、第２接地電極を有しかつ第１実装部５を囲むように配置されている。絶縁部７は、第１実装部５と第２実装部６との間に形成されている。接続部８は、第２実装部６と、第１接地電極と第２接地電極とを接続する配線部としての第３配線層３０を有しかつ第１実装部５と第２実装部６とを接続する。第１部品２は、第１実装部５に実装されておりかつ第１接地電極に接続されている。第２部品３は、第２実装部に実装されておりかつ第２接地電極に接続されている。コンデンサ４は、絶縁部７上に配置されておりかつ第１接地電極と第２接地電極とを接続する。絶縁部７の熱伝導率は、第１実装部５および第２実装部６の熱伝導率よりも低い。接続部８と第２部品３との間の距離Ｌ１は、第１部品２と第２部品３との間の距離Ｌ２よりも長い。第１部品２の耐熱温度は、第２部品３の耐熱温度よりも低い。 <Effect>
The printed circuit board device 100 includes a printed circuit board 1, a first component 2, a second component 3, and a capacitor 4. The printed circuit board 1 includes a first mounting portion 5, a second mounting portion 6, an insulating portion 7, and a connecting portion 8. The first mounting portion 5 has a first ground electrode. The second mounting portion 6 has a second ground electrode and is arranged so as to surround the first mounting portion 5. The insulating portion 7 is formed between the first mounting portion 5 and the second mounting portion 6. The connection portion 8 has a second mounting portion 6, a third wiring layer 30 as a wiring portion for connecting the first ground electrode and the second ground electrode, and the first mounting portion 5 and the second mounting portion 6. To connect. The first component 2 is mounted on the first mounting portion 5 and is connected to the first ground electrode. The second component 3 is mounted on the second mounting portion and is connected to the second ground electrode. The capacitor 4 is arranged on the insulating portion 7 and connects the first ground electrode and the second ground electrode. The thermal conductivity of the insulating portion 7 is lower than the thermal conductivity of the first mounting portion 5 and the second mounting portion 6. The distance L1 between the connecting portion 8 and the second component 3 is longer than the distance L2 between the first component 2 and the second component 3. The heat resistant temperature of the first component 2 is lower than the heat resistant temperature of the second component 3.

プリント基板装置１００では、第１部品２が接続されている第１接地電極と第２部品３が接続されている第２接地電極とが、コンデンサ４によっていわゆるＡＣ的に接続されているとともに、接続部８によってＤＣ的に接続されている。そのため、プリント基板装置１００では、ノイズによって第１実装部５および第２実装部６の少なくともいずれかにおいて接地電位の変動が高周波的にまたは低周波的に生じた場合にも、第１実装部５と第２実装部６との間の接地電位差が生じにくいため、広帯域に渡って信号品質の劣化が抑制されている。 In the printed circuit board device 100, the first ground electrode to which the first component 2 is connected and the second ground electrode to which the second component 3 is connected are connected by a capacitor 4 in a so-called AC manner and are connected. It is connected in a DC manner by the unit 8. Therefore, in the printed board apparatus 100, even when the ground potential fluctuates at at least one of the first mounting unit 5 and the second mounting unit 6 due to noise at a high frequency or a low frequency, the first mounting unit 5 Since the ground potential difference between the second mounting portion 6 and the second mounting portion 6 is unlikely to occur, deterioration of signal quality is suppressed over a wide band.

さらに、プリント基板装置１００では、第２部品３に生じた熱は第１部品２に達するまでに接続部８を通る必要がある。すなわち、第２部品３と第１部品２との間の熱経路の長さは、接続部８と第２部品３との間の距離Ｌ１と、接続部８と第１部品２との間の距離Ｌ４との和に等しくなる。その上で、プリント基板装置１００では、接続部８と第２部品３との間の距離Ｌ１が第１部品２と第２部品３との間の距離Ｌ２よりも長く設けられている。そのため、第２部品３と第１部品２との間の熱経路の長さは、第１部品２と第２部品３との間の最短距離よりも長くなる。よって、プリント基板装置１００は、従来のプリント基板装置と比べて、高発熱部品としての第２部品３から弱耐熱部品としての第１部品２への熱伝導を抑制できる。 Further, in the printed circuit board apparatus 100, the heat generated in the second component 3 needs to pass through the connecting portion 8 before reaching the first component 2. That is, the length of the heat path between the second component 3 and the first component 2 is the distance L1 between the connecting portion 8 and the second component 3 and the distance between the connecting portion 8 and the first component 2. It is equal to the sum with the distance L4. On top of that, in the printed circuit board device 100, the distance L1 between the connecting portion 8 and the second component 3 is provided longer than the distance L2 between the first component 2 and the second component 3. Therefore, the length of the heat path between the second component 3 and the first component 2 is longer than the shortest distance between the first component 2 and the second component 3. Therefore, the printed circuit board device 100 can suppress heat conduction from the second component 3 as a high heat generation component to the first component 2 as a weak heat resistant component as compared with the conventional printed circuit board device.

さらに、プリント基板装置１００では、絶縁部７が第１実装部５の周方向に沿って延在している。接続部８と絶縁部７とは上記周方向において並んで配置されている。そのため、絶縁部７による断熱効果は、絶縁部７が周方向に沿って延在していない場合と比べて、高められている。 Further, in the printed circuit board device 100, the insulating portion 7 extends along the circumferential direction of the first mounting portion 5. The connecting portion 8 and the insulating portion 7 are arranged side by side in the circumferential direction. Therefore, the heat insulating effect of the insulating portion 7 is enhanced as compared with the case where the insulating portion 7 does not extend along the circumferential direction.

さらに、プリント基板装置１００では、接続部８は、第１部品２から視て第２部品３とは反対側に配置されている。そのため、第２部品３と第１部品２との間の熱経路の長さは、接続部８が第１部品２から視て第２部品３とは反対側に配置されていない場合のそれと比べて、接続部８と第２部品３との間の距離Ｌ１が長くなるため、長くなる。つまり、プリント基板装置１００では、従来のプリント基板装置と比べて、高発熱部品から弱耐熱部品への熱伝導が効果的に抑制されている。 Further, in the printed circuit board device 100, the connecting portion 8 is arranged on the side opposite to the second component 3 when viewed from the first component 2. Therefore, the length of the heat path between the second component 3 and the first component 2 is compared with that when the connecting portion 8 is not arranged on the opposite side of the second component 3 when viewed from the first component 2. Therefore, the distance L1 between the connecting portion 8 and the second component 3 becomes long, so that the distance L1 becomes long. That is, in the printed circuit board device 100, heat conduction from the high heat generation component to the weak heat resistant component is effectively suppressed as compared with the conventional printed circuit board device.

プリント基板装置１００では、接続部８とコンデンサ４との間の距離Ｌ３が、接続部８と第１部品２との間の距離Ｌ４よりも長い。 In the printed circuit board device 100, the distance L3 between the connection portion 8 and the capacitor 4 is longer than the distance L4 between the connection portion 8 and the first component 2.

仮に第１接地電極と第２接地電極とが接続部８のみによって接続されている場合、絶縁部７を介して隣り合う第１接地電極および第２接地電極の各部分間の接地電位差は、当該部分と第２実装部６との間のインピーダンス、すなわち距離および絶縁部７と接続部８との間の距離に比例する。これに対し、プリント基板装置１００では、上記距離Ｌ３が上記Ｌ４よりも長くなるようにコンデンサ４が配置されているため、上記のような接地電位差の発生が抑制されている。 If the first ground electrode and the second ground electrode are connected only by the connecting portion 8, the ground potential difference between the adjacent first ground electrode and the second ground electrode via the insulating portion 7 is the said. It is proportional to the impedance between the portion and the second mounting portion 6, that is, the distance and the distance between the insulating portion 7 and the connecting portion 8. On the other hand, in the printed circuit board device 100, since the capacitor 4 is arranged so that the distance L3 is longer than the distance L4, the occurrence of the above-mentioned ground potential difference is suppressed.

プリント基板装置１００では、コンデンサ４は、絶縁部７において接続部８から最も離れた領域上に配置されている。コンデンサ４は、絶縁部７において接続部８から最も離れた領域を挟んで隣り合う第１接地電極および第２接地電極の各部分間を接続している。 In the printed circuit board device 100, the capacitor 4 is arranged on the region of the insulating portion 7 farthest from the connecting portion 8. The capacitor 4 connects each portion of the first ground electrode and the second ground electrode that are adjacent to each other with the region farthest from the connection portion 8 in the insulating portion 7.

上述のように、仮に第１接地電極と第２接地電極とが接続部８のみによって接続されている場合、絶縁部７を介して隣り合う第１接地電極および第２接地電極の各部分間の接地電位差は当該部分と第２実装部６との間の距離および絶縁部７と接続部８との間の距離に比例する。そのため、絶縁部７において接続部８から最も離れた領域を挟んで隣り合う第１接地電極および第２接地電極の各部分間の接地電位差は、最大となる。これに対し、プリント基板装置１００では、コンデンサ４が絶縁部７において接続部８から最も離れた領域を挟んで隣り合う第１接地電極および第２接地電極の各部分間を接続しているため、上記のような接地電位差の発生が抑制されている。 As described above, if the first ground electrode and the second ground electrode are connected only by the connecting portion 8, between the first ground electrode and the second ground electrode adjacent to each other via the insulating portion 7. The ground potential difference is proportional to the distance between the portion and the second mounting portion 6 and the distance between the insulating portion 7 and the connecting portion 8. Therefore, the ground potential difference between the first ground electrode and the second ground electrode that are adjacent to each other with the region farthest from the connection portion 8 in the insulating portion 7 is maximized. On the other hand, in the printed circuit board device 100, since the capacitor 4 connects each part of the first ground electrode and the second ground electrode adjacent to each other with the region farthest from the connection part 8 in the insulating part 7 connected. The occurrence of the above-mentioned ground potential difference is suppressed.

＜変形例＞
プリント基板装置１００では、絶縁部７が第１絶縁層１１および第２絶縁層２１と同等の材料で構成されているが、これに限られるものではない。図５に示されるように、絶縁部７は、プリント基板１を貫通する貫通孔１Ａのみで構成されていてもよい。このようにしても、絶縁部７の熱伝導率、すなわち上記貫通孔内の気体の熱伝導率は、第１配線層１０および第２配線層２０の熱伝導率よりも低くなる。そのため、このような絶縁部７を含むプリント基板装置１００は、絶縁部７を含まない従来のプリント基板装置と比べて、高発熱部品から弱耐熱部品への熱伝導を抑制できる。図２および図５に示される絶縁部７の各構成は、プリント基板装置１００に求められる断熱効果に応じて、選択され得る。 <Modification example>
In the printed circuit board device 100, the insulating portion 7 is made of the same material as the first insulating layer 11 and the second insulating layer 21, but is not limited thereto. As shown in FIG. 5, the insulating portion 7 may be composed of only the through hole 1A penetrating the printed circuit board 1. Even in this way, the thermal conductivity of the insulating portion 7, that is, the thermal conductivity of the gas in the through hole is lower than the thermal conductivity of the first wiring layer 10 and the second wiring layer 20. Therefore, the printed circuit board device 100 including such an insulating portion 7 can suppress heat conduction from a high heat generating component to a weak heat resistant component as compared with a conventional printed circuit board device not including the insulating portion 7. Each configuration of the insulating portion 7 shown in FIGS. 2 and 5 can be selected according to the heat insulating effect required for the printed circuit board device 100.

実施の形態２．
図６は、実施の形態２に係るプリント基板装置１０１を示す斜視図である。実施の形態２に係るプリント基板装置１０１は、実施の形態１に係るプリント基板装置１００と基本的に同様の構成を備えるが、第２部品３に接続されたヒートシンク１３をさらに備えている点で、プリント基板装置１００と異なる。 Embodiment 2.
FIG. 6 is a perspective view showing the printed circuit board device 101 according to the second embodiment. The printed circuit board device 101 according to the second embodiment has basically the same configuration as the printed circuit board device 100 according to the first embodiment, but further includes a heat sink 13 connected to the second component 3. , Different from the printed circuit board device 100.

ヒートシンク１３は、第２部品３においてプリント基板１に実装されている面以外の他の面、例えば第２部品３においてプリント基板１に実装されている面とは反対側に位置する面に、接続されている。ヒートシンク１３は、任意の形状を有していれば良いが、例えば複数のフィンを有している。ヒートシンク１３は、例えば熱媒体としての空気と熱交換するように設けられている。ヒートシンク１３を構成する材料は、熱伝導率が比較的高い任意の材料であればよいが、例えば銅（Ｃｕ）またはアルミニウム（Ａｌ）を含む。好ましくは、ヒートシンク１３の表面には、ヒートシンク１３の表面の輻射率を高めるために、メッキおよび塗装などの表面処理が施されている。 The heat sink 13 is connected to a surface other than the surface mounted on the printed circuit board 1 in the second component 3, for example, a surface located on the side opposite to the surface mounted on the printed circuit board 1 in the second component 3. Has been done. The heat sink 13 may have any shape, but has, for example, a plurality of fins. The heat sink 13 is provided so as to exchange heat with, for example, air as a heat medium. The material constituting the heat sink 13 may be any material having a relatively high thermal conductivity, and includes, for example, copper (Cu) or aluminum (Al). Preferably, the surface of the heat sink 13 is subjected to surface treatment such as plating and painting in order to increase the emissivity of the surface of the heat sink 13.

プリント基板装置１０１は、プリント基板装置１００と基本的に同様の構成を備えているため、プリント基板装置１００と同様の効果を奏することができる。さらに、プリント基板装置１０１では、第２部品３の発熱量のうちヒートシンク１３により放熱される熱量の分だけプリント基板１に伝えられる熱量が低下する。その結果、プリント基板装置１０１は、従来のプリント基板装置と比べて、高発熱部品としての第２部品３から弱耐熱部品としての第１部品２への熱伝導をより効果的に抑制できる。
＜変形例＞
プリント基板装置１０１は、ヒートシンク１３に代えてあるいはこれに加えて、伝熱部材１４を備えていてもよい。図７に示されるプリント基板装置１０１は、ヒートシンク１３に代えて、伝熱部材１４を備えている。伝熱部材１４は、第２部品３に生じた熱を、第２部品３よりも熱容量が大きい他の部材、例えば筐体１５、に伝えるように設けられている。伝熱部材１４は、第２部品３と筐体１５とに接続されている。言い換えると、第２部品３および筐体１５は、伝熱部材１４を介して接続されている。伝熱部材１４を構成する材料は、熱伝導率が比較的高い任意の材料であればよいが、例えば銅（Ｃｕ）またはアルミニウム（Ａｌ）を含む。好ましくは、筐体１５を構成する材料も、熱伝導率が比較的高い任意の材料であり、例えば銅（Ｃｕ）またはアルミニウム（Ａｌ）を含む。 Since the printed circuit board device 101 has basically the same configuration as the printed circuit board device 100, the same effect as that of the printed circuit board device 100 can be obtained. Further, in the printed circuit board device 101, the amount of heat transferred to the printed circuit board 1 is reduced by the amount of heat radiated by the heat sink 13 out of the amount of heat generated by the second component 3. As a result, the printed circuit board device 101 can more effectively suppress heat conduction from the second component 3 as a high heat generation component to the first component 2 as a weak heat resistant component as compared with the conventional printed circuit board device.
<Modification example>
The printed circuit board device 101 may include a heat transfer member 14 in place of or in addition to the heat sink 13. The printed circuit board device 101 shown in FIG. 7 includes a heat transfer member 14 instead of the heat sink 13. The heat transfer member 14 is provided so as to transfer the heat generated in the second component 3 to another member having a heat capacity larger than that of the second component 3, for example, the housing 15. The heat transfer member 14 is connected to the second component 3 and the housing 15. In other words, the second component 3 and the housing 15 are connected via the heat transfer member 14. The material constituting the heat transfer member 14 may be any material having a relatively high thermal conductivity, and includes, for example, copper (Cu) or aluminum (Al). Preferably, the material constituting the housing 15 is also any material having a relatively high thermal conductivity, and includes, for example, copper (Cu) or aluminum (Al).

また、プリント基板装置１０１は、図示しないファンをさらに備えていてもよい。ファンは、例えばヒートシンク１３に送風するように設けられている。このようなプリント基板装置１０１では、第２部品３はヒートシンク１３およびファンによって強制的に空冷される。また、プリント基板装置１０１は、図示しないヒートパイプをさらに備えていてもよい。ヒートパイプは、例えば伝熱部材１４の内部に配設されている第１部分と、プリント基板装置１０１の内部または外部において当該第１部分および第１部品２から離れた他の領域に配設されている第２部分とを有している。ヒートパイプは、第１部分から第２部分に伝熱するように設けられている。このようなプリント基板装置１０１では、第２部品３は伝熱部材１４およびヒートパイプによって強制的に冷却される。そのため、このようなプリント基板装置１０１は、従来のプリント基板装置と比べて、高発熱部品としての第２部品３から弱耐熱部品としての第１部品２への熱伝導をより効果的に抑制できる。 Further, the printed circuit board device 101 may further include a fan (not shown). The fan is provided so as to blow air to, for example, the heat sink 13. In such a printed circuit board device 101, the second component 3 is forcibly air-cooled by the heat sink 13 and the fan. Further, the printed circuit board device 101 may further include a heat pipe (not shown). The heat pipes are arranged in, for example, a first portion arranged inside the heat transfer member 14 and another region inside or outside the printed circuit board device 101 apart from the first portion and the first component 2. It has a second part that is The heat pipe is provided so as to transfer heat from the first portion to the second portion. In such a printed circuit board device 101, the second component 3 is forcibly cooled by the heat transfer member 14 and the heat pipe. Therefore, such a printed circuit board device 101 can more effectively suppress heat conduction from the second component 3 as a high heat generation component to the first component 2 as a weak heat resistant component as compared with the conventional printed circuit board device. ..

なお、プリント基板装置１０１においても、絶縁部７は、図２に示される構成を備えていてもよいし、図５に示される構成を備えていてもよい。 In the printed circuit board device 101, the insulating portion 7 may have the configuration shown in FIG. 2 or may have the configuration shown in FIG.

実施の形態３．
図８は、実施の形態３に係るプリント基板装置１０２を示す側面図である。実施の形態３に係るプリント基板装置１０２は、実施の形態１に係るプリント基板装置１００と基本的に同様の構成を備えるが、第３部品５１が実装された第２プリント基板５０をさらに備え、第１部品２が第１プリント基板１と第２プリント基板５０とを接続する基板間コネクタとして構成されている点で、プリント基板装置１００と異なる。 Embodiment 3.
FIG. 8 is a side view showing the printed circuit board device 102 according to the third embodiment. The printed circuit board device 102 according to the third embodiment has basically the same configuration as the printed circuit board device 100 according to the first embodiment, but further includes a second printed circuit board 50 on which the third component 51 is mounted. It differs from the printed circuit board device 100 in that the first component 2 is configured as an inter-board connector for connecting the first printed circuit board 1 and the second printed circuit board 50.

プリント基板装置１０２では、プリント基板装置１００，１０１におけるプリント基板１と同等の構成を備えるプリント基板を第１プリント基板１とよぶ。第１部品２、第２部品３、およびコンデンサ４は、第１プリント基板１に実装されている。第１部品２は、第１接地電極に接続されている一端２Ａと、後述する第３接地電極に接続されている他端２Ｂとを有している。 In the printed circuit board device 102, the printed circuit board having the same configuration as the printed circuit board 1 in the printed circuit board devices 100 and 101 is called the first printed circuit board 1. The first component 2, the second component 3, and the capacitor 4 are mounted on the first printed circuit board 1. The first component 2 has one end 2A connected to the first ground electrode and the other end 2B connected to the third ground electrode described later.

第２プリント基板５０は、図示しない第５配線層を含む。第５配線層の少なくとも一部は、接地電位とされる第３接地電極を構成している。第３部品５１は、第３接地電極に接続されている。 The second printed circuit board 50 includes a fifth wiring layer (not shown). At least a part of the fifth wiring layer constitutes a third ground electrode which is a ground potential. The third component 51 is connected to the third ground electrode.

プリント基板装置１０２では、第３部品５１が弱耐熱部品であり、第２部品３が高発熱部品である。第３部品５１の耐熱温度は、第１部品２および第２部品３の耐熱温度未満である。第３部品５１は、例えば低ノイズ増幅器（ＬｏｗＮｏｉｓｅＡｍｐｌｉｆｉｅｒ）である。 In the printed circuit board device 102, the third component 51 is a weak heat-resistant component, and the second component 3 is a high heat-generating component. The heat resistant temperature of the third component 51 is lower than the heat resistant temperature of the first component 2 and the second component 3. The third component 51 is, for example, a low noise amplifier.

プリント基板装置１０２では、第２部品３から第３部品５１に至る熱経路は、第２部品３から接続部８を経て第１部品２に至る熱経路と、第１部品２から第３部品５１に至る熱経路とが直列に接続された経路となる。 In the printed circuit board device 102, the heat paths from the second component 3 to the third component 51 are the heat path from the second component 3 to the first component 2 via the connecting portion 8 and the first component 2 to the third component 51. The heat path leading to is connected in series.

プリント基板装置１０２は、プリント基板装置１００と基本的に同様の構成を備えているため、プリント基板装置１００と同様の効果を奏することができる。特に、プリント基板装置１０２では、プリント基板装置１００と比べて、高発熱部品としての第２部品３と弱耐熱部品としての第３部品５１との間の熱経路が延長されているため、高発熱部品としての第２部品３から弱耐熱部品としての第３部品５１への熱伝導がより効果的に抑制される。 Since the printed circuit board device 102 has basically the same configuration as the printed circuit board device 100, the same effect as that of the printed circuit board device 100 can be obtained. In particular, in the printed circuit board device 102, the heat path between the second component 3 as a high heat-generating component and the third component 51 as a weak heat-resistant component is extended as compared with the printed circuit board device 100, so that the printed circuit board device 102 generates high heat. Heat conduction from the second component 3 as a component to the third component 51 as a weak heat-resistant component is more effectively suppressed.

また、プリント基板装置１０２では、ノイズによって第１実装部５および第２実装部６の少なくともいずれかにおいて接地電位の変動が高周波的にまたは低周波的に生じた場合にも、第１実装部５と第２実装部６との間の接地電位差が生じにくいため、第１部品２を介した第１プリント基板１および第２プリント基板５０に形成された各回路間の通信に関する信号品質の劣化が抑制されている。
＜変形例＞
図９に示されるように、プリント基板装置１０２において、第２プリント基板５０は、第１プリント基板１と同様の構成を備えていてもよい。この場合、プリント基板装置１０２は、第２プリント基板５０に実装された第２コンデンサ５４をさらに備える。 Further, in the printed circuit board device 102, even when the ground potential fluctuates at a high frequency or a low frequency in at least one of the first mounting unit 5 and the second mounting unit 6 due to noise, the first mounting unit 5 Since the ground potential difference between the and the second mounting portion 6 is unlikely to occur, the signal quality of communication between the circuits formed on the first printed circuit board 1 and the second printed circuit board 50 via the first component 2 deteriorates. It is suppressed.
<Modification example>
As shown in FIG. 9, in the printed circuit board device 102, the second printed circuit board 50 may have the same configuration as the first printed circuit board 1. In this case, the printed circuit board device 102 further includes a second capacitor 54 mounted on the second printed circuit board 50.

図９に示されるように、第２プリント基板５０は、第１プリント基板１の第１実装部５と同様の構成を備える第３実装部５５と、第１プリント基板１の第２実装部６と同様の構成を備える第４実装部５６と、絶縁部７と同様の構成を備える絶縁部５７と、接続部８と同様の構成を備える接続部５８とを含む。絶縁部５７および接続部５８は、第３実装部５５と第２実装部６との間に配置されている。第２コンデンサ５４は、第１コンデンサ４と同様の構成を備える。第２コンデンサ５４の第１端子部５４Ａは、第３実装部５５に実装されている。第２コンデンサ５４の第２端子部５４Ｂは、第４実装部５６に実装されている。 As shown in FIG. 9, the second printed circuit board 50 includes a third mounting unit 55 having the same configuration as the first mounting unit 5 of the first printed circuit board 1, and a second mounting unit 6 of the first printed circuit board 1. The fourth mounting portion 56 having the same configuration as the above, the insulating portion 57 having the same configuration as the insulating portion 7, and the connecting portion 58 having the same configuration as the connecting portion 8 are included. The insulating portion 57 and the connecting portion 58 are arranged between the third mounting portion 55 and the second mounting portion 6. The second capacitor 54 has the same configuration as the first capacitor 4. The first terminal portion 54A of the second capacitor 54 is mounted on the third mounting portion 55. The second terminal portion 54B of the second capacitor 54 is mounted on the fourth mounting portion 56.

第３実装部５５は、例えば複数の第５配線層および複数の第５絶縁層を有している。複数の第５配線層および複数の第５絶縁層は、例えば交互に積層している。複数の第５配線層の少なくとも一部は、接地電位とされる第４接地電極を構成している。第３部品５１は、第４接地電極に接続されている。 The third mounting portion 55 has, for example, a plurality of fifth wiring layers and a plurality of fifth insulating layers. The plurality of fifth wiring layers and the plurality of fifth insulating layers are laminated, for example, alternately. At least a part of the plurality of fifth wiring layers constitutes a fourth ground electrode to be a ground potential. The third component 51 is connected to the fourth ground electrode.

第４実装部５６は、例えば複数の第６配線層および複数の第６絶縁層を有している。複数の第６配線層および複数の第６絶縁層は、例えば交互に積層している。複数の第６配線層の少なくとも一部は、接地電位とされる第３接地電極を構成している。第１部品２の上記他端２Ｂは、第４実装部５６の第３接地電極に接続されている。 The fourth mounting unit 56 has, for example, a plurality of sixth wiring layers and a plurality of sixth insulating layers. The plurality of sixth wiring layers and the plurality of sixth insulating layers are laminated, for example, alternately. At least a part of the plurality of sixth wiring layers constitutes a third ground electrode to be a ground potential. The other end 2B of the first component 2 is connected to the third ground electrode of the fourth mounting portion 56.

第３実装部５５の第４接地電極と第４実装部５６の第３接地電極とは、第２コンデンサ５４を介していわゆるＡＣ（ＡｌｔｅｒｎａｔｉｎｇＣｕｒｒｅｎｔ）的に接続されており、かつ接続部５８を介していわゆるＤＣ（ＤｉｒｅｃｔＣｕｒｒｅｎｔ）的に接続されている。 The fourth ground electrode of the third mounting portion 55 and the third ground electrode of the fourth mounting portion 56 are connected in a so-called AC (Alternating Current) manner via the second capacitor 54, and are connected via the connecting portion 58. It is connected in a so-called DC (Direct Current) manner.

第１部品２の他端２Ｂと接続部５８との間の距離は、第３部品５１と第１部品２の他端２Ｂとの間の距離よりも長い。 The distance between the other end 2B of the first component 2 and the connecting portion 58 is longer than the distance between the third component 51 and the other end 2B of the first component 2.

第１部品２の他端２Ｂ、絶縁部５７、第３部品５１、および接続部５８は、仮想直線上に並んで配置されている。当該仮想直線上において、接続部５８は、第３部品５１から視て第１部品２の他端２Ｂおよび絶縁部５７とは反対側に配置されている。接続部５８と第２コンデンサ５４との間の距離は、接続部５８と第３部品５１との間の距離よりも長い。第２コンデンサ５４は、絶縁部５７において接続部５８から最も離れた領域上に配置されている。 The other end 2B of the first component 2, the insulating portion 57, the third component 51, and the connecting portion 58 are arranged side by side on a virtual straight line. On the virtual straight line, the connecting portion 58 is arranged on the opposite side of the other end 2B of the first component 2 and the insulating portion 57 when viewed from the third component 51. The distance between the connection portion 58 and the second capacitor 54 is longer than the distance between the connection portion 58 and the third component 51. The second capacitor 54 is arranged on the region of the insulating portion 57 farthest from the connecting portion 58.

第１部品２の他端２Ｂと絶縁部５７との間の距離は、例えば第１部品２の他端２Ｂと第３部品５１とを最短距離で結ぶ仮想直線に近い領域上において最も短く、該領域から離れるにつれて長い。 The distance between the other end 2B of the first component 2 and the insulating portion 57 is, for example, the shortest in a region close to a virtual straight line connecting the other end 2B of the first component 2 and the third component 51 at the shortest distance. Longer as you move away from the area.

このようなプリント基板装置１０２では、第３部品５１が弱耐熱部品であり、第２部品３が高発熱部品である。プリント基板装置１０２では、第２部品３から第３部品５１に至る熱経路は、第２部品３から接続部８を経て第１部品２に至る熱経路と、第１部品２から接続部５８を経て第３部品５１に至る熱経路とが直列に接続された経路となる。 In such a printed circuit board device 102, the third component 51 is a weak heat-resistant component, and the second component 3 is a high heat-generating component. In the printed circuit board device 102, the heat path from the second component 3 to the third component 51 includes the heat path from the second component 3 to the first component 2 via the connecting portion 8 and the connecting portion 58 from the first component 2. The heat path leading to the third component 51 is connected in series.

図９に示されるプリント基板装置１０２では、図８に示されるプリント基板装置１０２と比べて、第２プリント基板５０上での熱経路が延長されているため、高発熱部品としての第２部品３から弱耐熱部品としての第３部品５１への熱伝導がより効果的に抑制される。 In the printed circuit board device 102 shown in FIG. 9, since the heat path on the second printed circuit board 50 is extended as compared with the printed circuit board device 102 shown in FIG. 8, the second component 3 as a high heat generating component 3 Heat conduction to the third component 51 as a weak heat-resistant component is more effectively suppressed.

また、プリント基板装置１０２において、第１部品２はケーブルおよび接続端子として構成されていてもよい。また、プリント基板装置１０２は、第１プリント基板１と第２プリント基板５０とが互いに平行に配置されている構成に限られるものではなく、第２プリント基板５０は第１プリント基板１に対して交差する方向、例えば直交する方向に配置されていてもよい。 Further, in the printed circuit board device 102, the first component 2 may be configured as a cable and a connection terminal. Further, the printed circuit board device 102 is not limited to a configuration in which the first printed circuit board 1 and the second printed circuit board 50 are arranged in parallel with each other, and the second printed circuit board 50 is relative to the first printed circuit board 1. They may be arranged in intersecting directions, for example, orthogonal directions.

また、プリント基板装置１０２は、プリント基板装置１０１と同様に、第２部品３に接続されたヒートシンク１３をさらに備えていてもよい。 Further, the printed circuit board device 102 may further include a heat sink 13 connected to the second component 3 as in the printed circuit board device 101.

実施の形態４．
図１０は、実施の形態４に係るプリント基板装置１０３を示す側面図である。実施の形態４に係るプリント基板装置１０３は、実施の形態１に係るプリント基板装置１００と基本的に同様の構成を備えるが、複数のプリント基板１と、複数のプリント基板１の間を接続する基板間コネクタ６０，６１とを備える点で、プリント基板装置１００と異なる。 Embodiment 4.
FIG. 10 is a side view showing the printed circuit board device 103 according to the fourth embodiment. The printed circuit board device 103 according to the fourth embodiment has basically the same configuration as the printed circuit board device 100 according to the first embodiment, but connects between the plurality of printed circuit boards 1 and the plurality of printed circuit boards 1. It differs from the printed circuit board device 100 in that it includes inter-board connectors 60 and 61.

基板間コネクタ６０は、一方のプリント基板１の第１接地電極と接続されている一端と、他方のプリント基板１の第１接地電極とを接続されている他端とを有している。 The inter-board connector 60 has one end connected to the first ground electrode of one printed circuit board 1 and the other end connected to the first ground electrode of the other printed circuit board 1.

基板間コネクタ６１は、一方のプリント基板１の第２接地電極と接続されている一端と、他方のプリント基板１の第２接地電極とを接続されている他端とを有している。 The inter-board connector 61 has one end connected to the second ground electrode of one printed circuit board 1 and the other end connected to the second ground electrode of the other printed circuit board 1.

プリント基板装置１０３は、プリント基板装置１００と基本的に同様の構成を備えているため、プリント基板装置１００と同様の効果を奏することができる。さらに、複数のプリント基板１間の接地電位差が生じにくいため、基板間コネクタ６０，６１を介した各プリント基板１間の通信に関する信号品質の劣化が抑制されている。 Since the printed circuit board device 103 has basically the same configuration as the printed circuit board device 100, the same effect as that of the printed circuit board device 100 can be obtained. Further, since a ground potential difference between the plurality of printed circuit boards 1 is unlikely to occur, deterioration of signal quality related to communication between the printed circuit boards 1 via the inter-board connectors 60 and 61 is suppressed.

以上のように本発明の実施の形態について説明を行なったが、上述の実施の形態を様々に変形することも可能である。また、本発明の範囲は上述の実施の形態に限定されるものではない。本発明の範囲は、特許請求の範囲によって示され、特許請求の範囲と均等の意味および範囲内でのすべての変更を含むことが意図される。 Although the embodiment of the present invention has been described above, it is possible to modify the above-described embodiment in various ways. Moreover, the scope of the present invention is not limited to the above-described embodiment. The scope of the present invention is indicated by the scope of claims and is intended to include all modifications within the meaning and scope equivalent to the scope of claims.

１プリント基板、２第１部品、２Ａ一端、２Ｂ他端、３第２部品、４コンデンサ、４Ａ，５４Ａ第１端子部、４Ｂ，５４Ｂ第２端子部、５第１実装部、５Ａ外周端部、６第２実装部、６Ａ内周端部、７，５７絶縁部、７Ａ一端部、７Ｂ他端部、８，５８接続部、１０第１配線層、１１第１絶縁層、１３ヒートシンク、１４伝熱部材、１５筐体、２０第２配線層、２１第２絶縁層、３０第３配線層、３１第３絶縁層、４０第４配線層、４１第４絶縁層、５０第２プリント基板、５１第３部品、５４第２コンデンサ、５５第３実装部、５６第４実装部、６０，６１基板間コネクタ、１００，１０１，１０２，１０３プリント基板装置。 1 Printed circuit board, 2 1st component, 2A one end, 2B other end, 3 2nd component, 4 capacitor, 4A, 54A 1st terminal, 4B, 54B 2nd terminal, 5 1st mounting, 5A outer peripheral end , 6 2nd mounting part, 6A inner peripheral end part, 7,57 insulation part, 7A one end part, 7B other end part, 8,58 connection part, 10 1st wiring layer, 11 1st insulation layer, 13 heat sink, 14 Heat transfer member, 15 housing, 20 second wiring layer, 21 second insulation layer, 30 third wiring layer, 31 third insulation layer, 40 fourth wiring layer, 41 fourth insulation layer, 50 second printed circuit board, 51 3rd component, 54 2nd capacitor, 55 3rd mounting part, 56 4th mounting part, 60, 61 Board-to-board connector, 100, 101, 102, 103 Printed circuit board device.

Claims

A first mounting portion having a first grounding electrode, a second mounting portion having a second grounding electrode and arranged so as to surround the first mounting portion, and the first grounding electrode and the second grounding electrode. Includes a connection portion that has a wiring portion for connecting the first mounting portion and connects the first mounting portion and the second mounting portion, and an insulating portion formed between the first mounting portion and the second mounting portion. 1st printed board and
The first component mounted on the first mounting portion and connected to the first ground electrode, and
A second component mounted on the second mounting portion and connected to the second ground electrode, and
It is provided with a capacitor arranged on the insulating portion and connecting the first ground electrode and the second ground electrode.
The thermal conductivity of the insulating portion is lower than the thermal conductivity of the first mounting portion and the second mounting portion.
A printed circuit board device in which the distance between the connection portion and the second component is longer than the distance between the first component and the second component.

The insulating portion extends along the circumferential direction of the first mounting portion.
The printed circuit board device according to claim 1, wherein the connecting portion and the insulating portion are arranged side by side in the circumferential direction.

The printed circuit board device according to claim 1 or 2, wherein the connecting portion is arranged on the side opposite to the second component when viewed from the first component.

The printed circuit board device according to any one of claims 1 to 3, wherein the distance between the connection portion and the capacitor is longer than the distance between the connection portion and the first component.

The printed circuit board device according to claim 4, wherein the capacitor is arranged on the region of the insulating portion farthest from the connection portion.

The printed circuit board device according to any one of claims 1 to 5, wherein the insulating portion is a through hole penetrating the first printed circuit board.

The first printed circuit board further includes wiring.
The printed circuit board device according to any one of claims 1 to 5, wherein the wiring density in the insulating portion is lower than the wiring densities of the first mounting portion, the second mounting portion, and the connecting portion.

The printed circuit board device according to any one of claims 1 to 7, wherein the heat-resistant temperature of the first component is lower than the heat-resistant temperature of the second component.

With the third part
Further provided with a second printed circuit board on which the third component is mounted,
The first component is an inter-board connector that connects the first printed circuit board and the second printed circuit board.
The printed circuit board device according to any one of claims 1 to 7, wherein the heat resistant temperature of the third component is lower than the heat resistant temperature of the second component.

The second printed substrate has a third mounting portion having a fourth grounding electrode, a fourth mounting portion having a third grounding electrode and arranged so as to surround the third mounting portion, and the fourth grounding electrode. Between the third mounting portion and the fourth mounting portion, the connecting portion having a wiring portion for connecting the third mounting portion and the third mounting portion and connecting the third mounting portion and the fourth mounting portion, and the third mounting portion and the fourth mounting portion. Including the formed insulation
The third component is mounted on the third mounting portion and connected to the fourth ground electrode.
The first component is an inter-board connector having one end connected to the first ground electrode of the first printed circuit board and the other end connected to the third ground electrode of the second printed circuit board. Yes,
A claim that the distance between the other end of the first component and the connection portion of the second printed circuit board is longer than the distance between the third component and the other end of the first component. 9. The printed circuit board device according to 9.