JP2020193368A5 - - Google Patents
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- JP2020193368A5 JP2020193368A5 JP2019099567A JP2019099567A JP2020193368A5 JP 2020193368 A5 JP2020193368 A5 JP 2020193368A5 JP 2019099567 A JP2019099567 A JP 2019099567A JP 2019099567 A JP2019099567 A JP 2019099567A JP 2020193368 A5 JP2020193368 A5 JP 2020193368A5
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- heater
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- heating device
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- 238000010438 heat treatment Methods 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 19
- 239000010408 film Substances 0.000 claims description 14
- 238000001704 evaporation Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 238000007740 vapor deposition Methods 0.000 claims description 9
- 238000000427 thin-film deposition Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 6
- 239000011364 vaporized material Substances 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims description 2
- 230000008020 evaporation Effects 0.000 claims 6
- 230000007423 decrease Effects 0.000 claims 1
- 238000007599 discharging Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
Description
上記目的のため、本発明は以下の構成を採用する。すなわち、
蒸着材料を収容する容器を加熱する加熱装置であって、
前記容器は、加熱された前記蒸着材料が放出される開口部と、第１領域と、前記第１領域よりも前記開口部から離れた領域である第２領域と、を有し、
前記第１領域を加熱する第１ヒータと、
前記第２領域を加熱する第２ヒータと、
前記第１ヒータと前記第２ヒータをそれぞれ独立に制御する制御部と、
を有し、
前記第２ヒータは第１部分と第２部分を含み、前記第２部分と前記第１ヒータの距離は前記第１部分と前記第１ヒータの距離よりも小さいものであり、
前記制御部は、前記第２ヒータを制御するときに、前記第１部分と前記第２部分を一体に制御するものであり、
前記第２部分と前記容器の間に配置された、前記第２部分から前記容器に放出される熱を遮蔽する内側熱反射部材をさらに有する
ことを特徴とする加熱装置である。
本発明はまた、以下の構成を採用する。すなわち、
蒸着材料を収容する容器を加熱する加熱装置であって、
前記容器は、加熱された前記蒸着材料が放出される開口部と、第１領域と、前記第１領域よりも前記開口部から離れた領域である第２領域と、を有し、
前記第１領域を加熱する第１ヒータと、
前記第２領域を加熱する第２ヒータと、
前記第１ヒータと前記第２ヒータをそれぞれ独立に制御する制御部と、
を有し、
前記第２ヒータは第１部分と第２部分を含み、前記第２部分と前記第１ヒータの距離は前記第１部分と前記第１ヒータの距離よりも小さいものであり、
前記制御部は、前記第２ヒータを制御するときに、前記第１部分と前記第２部分を一体に制御するものであり、
前記第１部分を介して前記容器と反対の側に配置された、前記第１部分から前記加熱装置の外側に放出される熱を反射する外側熱反射部材をさらに有する
ことを特徴とする加熱装置である。
本発明はまた、以下の構成を採用する。すなわち、
被蒸着体である基板に蒸着材料による成膜を行う成膜方法であって、
加熱装置を用いて容器に収容された蒸着材料を加熱して蒸発させるステップを有し、
前記容器は、加熱された前記蒸着材料が放出される開口部と、第１領域と、前記第１領域よりも前記開口部から離れた領域である第２領域と、を有し、
前記加熱装置は、
前記第１領域を加熱する第１ヒータと、
前記第２領域を加熱する第２ヒータと、
前記第１ヒータと前記第２ヒータをそれぞれ独立に制御する制御部と、
を有しており、
前記第２ヒータは第１部分と第２部分を含み、前記第２部分と前記第１ヒータの距離は前記第１部分と前記第１ヒータの距離よりも小さいものであり、
前記制御部は、前記第２ヒータを制御するときに、前記第１部分と前記第２部分を一体に制御するものであり、
前記加熱装置は、前記第２部分と前記容器の間に配置された、前記第２部分から前記容器に放出される熱を遮蔽する内側熱反射部材をさらに有する
ことを特徴とする成膜方法である。
本発明はまた、以下の構成を採用する。すなわち、
被蒸着体である基板に蒸着材料による成膜を行う成膜方法であって、
加熱装置を用いて容器に収容された蒸着材料を加熱して蒸発させるステップを有し、
前記容器は、加熱された前記蒸着材料が放出される開口部と、第１領域と、前記第１領域よりも前記開口部から離れた領域である第２領域と、を有し、
前記加熱装置は、
前記第１領域を加熱する第１ヒータと、
前記第２領域を加熱する第２ヒータと、
前記第１ヒータと前記第２ヒータをそれぞれ独立に制御する制御部と、
を有しており、
前記第２ヒータは第１部分と第２部分を含み、前記第２部分と前記第１ヒータの距離は前記第１部分と前記第１ヒータの距離よりも小さいものであり、
前記制御部は、前記第２ヒータを制御するときに、前記第１部分と前記第２部分を一体に制御するものであり、
前記第１部分を介して前記容器と反対の側に配置された、前記第１部分から前記加熱装置の外側に放出される熱を反射する外側熱反射部材をさらに有する
ことを特徴とする成膜方法である。
For the above purpose, the present invention adopts the following configuration. That is,
A heating device that heats a container that houses a thin-film deposition material.
The container has an opening through which the heated vapor deposition material is discharged, a first region, and a second region, which is a region farther from the opening than the first region.
A first heater that heats the first region and
A second heater that heats the second region and
A control unit that independently controls the first heater and the second heater,
Have ,
The second heater includes a first portion and a second portion, and the distance between the second portion and the first heater is smaller than the distance between the first portion and the first heater.
The control unit integrally controls the first portion and the second portion when controlling the second heater.
The heating device further includes an inner heat reflecting member arranged between the second portion and the container to shield heat released from the second portion to the container.
The present invention also employs the following configuration. That is,
A heating device that heats a container that houses a thin-film deposition material.
The container has an opening through which the heated vapor deposition material is discharged, a first region, and a second region, which is a region farther from the opening than the first region.
A first heater that heats the first region and
A second heater that heats the second region and
A control unit that independently controls the first heater and the second heater,
Have ,
The second heater includes a first portion and a second portion, and the distance between the second portion and the first heater is smaller than the distance between the first portion and the first heater.
The control unit integrally controls the first portion and the second portion when controlling the second heater.
A heating characterized by further having an outer heat reflecting member arranged on the opposite side of the container via the first portion to reflect heat released from the first portion to the outside of the heating device. It is a device.
The present invention also employs the following configuration. That is,
This is a film forming method in which a film is formed on a substrate, which is an object to be vapor-deposited, using a thin-film deposition material.
It has a step of heating and evaporating the vaporized material contained in the container using a heating device.
The container has an opening through which the heated vapor deposition material is discharged, a first region, and a second region, which is a region farther from the opening than the first region.
The heating device is
A first heater that heats the first region and
A second heater that heats the second region and
A control unit that independently controls the first heater and the second heater,
Have and
The second heater includes a first portion and a second portion, and the distance between the second portion and the first heater is smaller than the distance between the first portion and the first heater.
The control unit integrally controls the first portion and the second portion when controlling the second heater.
The film forming method further comprises an inner heat reflecting member arranged between the second portion and the container to shield heat released from the second portion to the container. Is.
The present invention also employs the following configuration. That is,
This is a film forming method in which a film is formed on a substrate, which is an object to be vapor-deposited, using a thin-film deposition material.
It has a step of heating and evaporating the vaporized material contained in the container using a heating device.
The container has an opening through which the heated vapor deposition material is discharged, a first region, and a second region, which is a region farther from the opening than the first region.
The heating device is
A first heater that heats the first region and
A second heater that heats the second region and
A control unit that independently controls the first heater and the second heater,
Have and
The second heater includes a first portion and a second portion, and the distance between the second portion and the first heater is smaller than the distance between the first portion and the first heater.
The control unit integrally controls the first portion and the second portion when controlling the second heater.
It is characterized by further having an outer heat reflecting member arranged on the side opposite to the container via the first portion and reflecting heat released from the first portion to the outside of the heating device. It is a membrane method.
Claims (13)
前記容器は、加熱された前記蒸着材料が放出される開口部と、第１領域と、前記第１領域よりも前記開口部から離れた領域である第２領域と、を有し、
前記第１領域を加熱する第１ヒータと、
前記第２領域を加熱する第２ヒータと、
前記第１ヒータと前記第２ヒータをそれぞれ独立に制御する制御部と、
を有し、
前記第２ヒータは第１部分と第２部分を含み、前記第２部分と前記第１ヒータの距離は前記第１部分と前記第１ヒータの距離よりも小さいものであり、
前記制御部は、前記第２ヒータを制御するときに、前記第１部分と前記第２部分を一体に制御するものであり、
前記第２部分と前記容器の間に配置された、前記第２部分から前記容器に放出される熱を遮蔽する内側熱反射部材をさらに有する
ことを特徴とする加熱装置。 A heating device that heats a container that houses a thin-film deposition material.
The container has an opening through which the heated vapor deposition material is discharged, a first region, and a second region, which is a region farther from the opening than the first region.
A first heater that heats the first region and
A second heater that heats the second region and
A control unit that independently controls the first heater and the second heater,
Have ,
The second heater includes a first portion and a second portion, and the distance between the second portion and the first heater is smaller than the distance between the first portion and the first heater.
The control unit integrally controls the first portion and the second portion when controlling the second heater.
A heating device further comprising an inner heat reflecting member arranged between the second portion and the container to shield heat released from the second portion to the container.
前記容器は、加熱された前記蒸着材料が放出される開口部と、第１領域と、前記第１領域よりも前記開口部から離れた領域である第２領域と、を有し、
前記第１領域を加熱する第１ヒータと、
前記第２領域を加熱する第２ヒータと、
前記第１ヒータと前記第２ヒータをそれぞれ独立に制御する制御部と、
を有し、
前記第２ヒータは第１部分と第２部分を含み、前記第２部分と前記第１ヒータの距離は前記第１部分と前記第１ヒータの距離よりも小さいものであり、
前記制御部は、前記第２ヒータを制御するときに、前記第１部分と前記第２部分を一体に制御するものであり、
前記第１部分を介して前記容器と反対の側に配置された、前記第１部分から前記加熱装置の外側に放出される熱を反射する外側熱反射部材をさらに有する
ことを特徴とする加熱装置。 A heating device that heats a container that houses a thin-film deposition material.
The container has an opening through which the heated vapor deposition material is discharged, a first region, and a second region, which is a region farther from the opening than the first region.
A first heater that heats the first region and
A second heater that heats the second region and
A control unit that independently controls the first heater and the second heater,
Have ,
The second heater includes a first portion and a second portion, and the distance between the second portion and the first heater is smaller than the distance between the first portion and the first heater.
The control unit integrally controls the first portion and the second portion when controlling the second heater.
A heating characterized by further having an outer heat reflecting member arranged on the opposite side of the container via the first portion to reflect heat released from the first portion to the outside of the heating device. Device.
ことを特徴とする請求項１または２に記載の加熱装置。 The heating device according to claim 1 or 2, further comprising a second inner heat reflecting member arranged between the first portion and the second portion and the container.
ことを特徴とする請求項１～３のいずれか１項に記載の加熱装置。 The invention according to any one of claims 1 to 3, further comprising a second outer heat reflecting member arranged on the opposite side of the container via the first portion and the second portion. Heating device.
前記容器のうち前記第１部分に対向する領域に入射する熱量は、前記第２部分に対向する領域に入射する熱量よりも大きく、
前記容器のうち前記第３部分に対向する領域に入射する熱量は、前記第４部分に対向する領域に入射する熱量よりも大きい
ことを特徴とする請求項１～４のいずれか１項に記載の加熱装置。 The first heater includes a third portion and a fourth portion, and the third portion is arranged closer to the opening than the fourth portion.
The amount of heat incident on the region of the container facing the first portion is larger than the amount of heat incident on the region facing the second portion.
The invention according to any one of claims 1 to 4, wherein the amount of heat incident on the region of the container facing the third portion is larger than the amount of heat incident on the region facing the fourth portion. Heating device.
ことを特徴とする請求項１～５のいずれか１項に記載の加熱装置。 Any of claims 1 to 5, wherein the control unit controls so that the amount of heat generated from the second heater increases as the vapor-filmed material contained in the container decreases due to evaporation. The heating device according to item 1.
ことを特徴とする請求項６に記載の加熱装置。 The heating device according to claim 6, wherein the control unit controls so that the amount of heat generated from the first heater is constant.
ことを特徴とする請求項１～７のいずれか１項に記載の加熱装置。 One of claims 1 to 7, wherein the control unit controls the first heater and the second heater so that the temperature does not drop from the bottom of the container toward the opening. The heating device according to item 1.
前記加熱装置は、請求項１～８のいずれか１項に記載の加熱装置である、蒸発源装置。 An evaporation source device having a container for accommodating a vapor deposition material and a heating device.
The heating device is the evaporation source device according to any one of claims 1 to 8.
前記蒸発源装置は、請求項９に記載の蒸発源装置である、成膜装置。 A film forming apparatus having a chamber for accommodating a substrate to be vapor-deposited and an evaporation source apparatus for discharging a vapor-deposited material onto the substrate through a mask to form a film.
The evaporation source device is a film forming device, which is the evaporation source device according to claim 9.
加熱装置を用いて容器に収容された蒸着材料を加熱して蒸発させるステップを有し、
前記容器は、加熱された前記蒸着材料が放出される開口部と、第１領域と、前記第１領域よりも前記開口部から離れた領域である第２領域と、を有し、
前記加熱装置は、
前記第１領域を加熱する第１ヒータと、
前記第２領域を加熱する第２ヒータと、
前記第１ヒータと前記第２ヒータをそれぞれ独立に制御する制御部と、
を有しており、
前記第２ヒータは第１部分と第２部分を含み、前記第２部分と前記第１ヒータの距離は前記第１部分と前記第１ヒータの距離よりも小さいものであり、
前記制御部は、前記第２ヒータを制御するときに、前記第１部分と前記第２部分を一体に制御するものであり、
前記加熱装置は、前記第２部分と前記容器の間に配置された、前記第２部分から前記容器に放出される熱を遮蔽する内側熱反射部材をさらに有する
ことを特徴とする成膜方法。 This is a film forming method in which a film is formed on a substrate, which is an object to be vapor-deposited, using a thin-film deposition material.
It has a step of heating and evaporating the vaporized material contained in the container using a heating device.
The container has an opening through which the heated vapor deposition material is discharged, a first region, and a second region, which is a region farther from the opening than the first region.
The heating device is
A first heater that heats the first region and
A second heater that heats the second region and
A control unit that independently controls the first heater and the second heater,
Have and
The second heater includes a first portion and a second portion, and the distance between the second portion and the first heater is smaller than the distance between the first portion and the first heater.
The control unit integrally controls the first portion and the second portion when controlling the second heater.
The film forming method further comprises an inner heat reflecting member arranged between the second portion and the container to shield heat released from the second portion to the container. ..
加熱装置を用いて容器に収容された蒸着材料を加熱して蒸発させるステップを有し、
前記容器は、加熱された前記蒸着材料が放出される開口部と、第１領域と、前記第１領域よりも前記開口部から離れた領域である第２領域と、を有し、
前記加熱装置は、
前記第１領域を加熱する第１ヒータと、
前記第２領域を加熱する第２ヒータと、
前記第１ヒータと前記第２ヒータをそれぞれ独立に制御する制御部と、
を有しており、
前記第２ヒータは第１部分と第２部分を含み、前記第２部分と前記第１ヒータの距離は前記第１部分と前記第１ヒータの距離よりも小さいものであり、
前記制御部は、前記第２ヒータを制御するときに、前記第１部分と前記第２部分を一体に制御するものであり、
前記第１部分を介して前記容器と反対の側に配置された、前記第１部分から前記加熱装置の外側に放出される熱を反射する外側熱反射部材をさらに有する
ことを特徴とする成膜方法。 This is a film forming method in which a film is formed on a substrate, which is an object to be vapor-deposited, using a thin-film deposition material.
It has a step of heating and evaporating the vaporized material contained in the container using a heating device.
The container has an opening through which the heated vapor deposition material is discharged, a first region, and a second region, which is a region farther from the opening than the first region.
The heating device is
A first heater that heats the first region and
A second heater that heats the second region and
A control unit that independently controls the first heater and the second heater,
Have and
The second heater includes a first portion and a second portion, and the distance between the second portion and the first heater is smaller than the distance between the first portion and the first heater.
The control unit integrally controls the first portion and the second portion when controlling the second heater.
It is characterized by further having an outer heat reflecting member arranged on the side opposite to the container via the first portion and reflecting heat released from the first portion to the outside of the heating device. Membrane method.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019099567A JP7241604B2 (en) | 2019-05-28 | 2019-05-28 | Heating device, evaporation source device, film forming device, film forming method, and electronic device manufacturing method |
| CN201911297341.9A CN112011760A (en) | 2019-05-28 | 2019-12-17 | Heating device, evaporation source device, film forming method, and method for manufacturing electronic device |
| KR1020190170668A KR20200136803A (en) | 2019-05-28 | 2019-12-19 | Heating apparatus, evaporation source apparatus, film formation apparatus, film formation method, and manufacturing method of electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019099567A JP7241604B2 (en) | 2019-05-28 | 2019-05-28 | Heating device, evaporation source device, film forming device, film forming method, and electronic device manufacturing method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020193368A JP2020193368A (en) | 2020-12-03 |
| JP2020193368A5 true JP2020193368A5 (en) | 2022-03-09 |
| JP7241604B2 JP7241604B2 (en) | 2023-03-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2019099567A Active JP7241604B2 (en) | 2019-05-28 | 2019-05-28 | Heating device, evaporation source device, film forming device, film forming method, and electronic device manufacturing method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7241604B2 (en) |
| KR (1) | KR20200136803A (en) |
| CN (1) | CN112011760A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102319130B1 (en) * | 2020-03-11 | 2021-10-29 | 티오에스주식회사 | Metal-Oxide semiconductor evaporation source equipped with variable temperature control module |
| CN114182208B (en) * | 2021-12-10 | 2024-01-23 | 深圳市华星光电半导体显示技术有限公司 | Evaporation source and evaporation equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2011162846A (en) * | 2010-02-10 | 2011-08-25 | Mitsubishi Heavy Ind Ltd | Vacuum evaporation source |
| CN102268642A (en) * | 2011-07-22 | 2011-12-07 | 上海奕瑞光电子科技有限公司 | Resistance heating evaporation source |
| JP5557817B2 (en) * | 2011-09-30 | 2014-07-23 | 株式会社日立ハイテクノロジーズ | Evaporation source and film forming apparatus |
| JP2014070227A (en) * | 2012-09-27 | 2014-04-21 | Hitachi High-Technologies Corp | Filming apparatus, and temperature control method and device for evaporation source of the filming apparatus |
| JP2014072005A (en) * | 2012-09-28 | 2014-04-21 | Hitachi High-Technologies Corp | Evaporation source, vacuum deposition device and method of manufacturing organic el display device |
| JP6223675B2 (en) * | 2012-11-29 | 2017-11-01 | 株式会社オプトラン | Vacuum deposition source and vacuum deposition method using the same |
| CN103757590B (en) * | 2013-12-31 | 2016-04-20 | 深圳市华星光电技术有限公司 | A kind of coating equipment Crucible equipment |
| JP6488928B2 (en) * | 2015-07-15 | 2019-03-27 | アイシン精機株式会社 | Vapor deposition equipment |
| JP6436544B1 (en) * | 2017-08-07 | 2018-12-12 | キヤノントッキ株式会社 | Evaporation source apparatus and control method thereof |
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2019
- 2019-05-28 JP JP2019099567A patent/JP7241604B2/en active Active
- 2019-12-17 CN CN201911297341.9A patent/CN112011760A/en active Pending
- 2019-12-19 KR KR1020190170668A patent/KR20200136803A/en unknown
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