JP2020191517A - Vibrating device, electronic apparatus, mobile object, and frequency adjustment method of vibrating element - Google Patents

Abstract

To provide a vibrating device, an electronic apparatus, a mobile object, and a frequency adjustment method of a vibrating element capable of highly accurate frequency adjustment.SOLUTION: A vibrating device includes a base, a vibrating element that includes a vibrating arm and a metal film provided on the vibrating arm and supported by the base, and an adjusting member located between the base and the vibrating element and adjusting the frequency of the vibrating element, and the adjusting member has a region that overlaps with the vibrating arm in a plan view, and has portions having different thicknesses in the region. In addition, a part of the adjusting member is scattered and attached to the vibrating arm.SELECTED DRAWING: Figure 14

Description

The present invention relates to a method for adjusting the frequency of a vibrating device, an electronic device, a moving body and a vibrating element.

For example, in Patent Document 1, as a method of adjusting the frequency of the tuning fork oscillator, a metal film for a weight provided on a base is irradiated with a laser, and the metal scattered from the metal film for the weight due to the laser irradiation is applied to a vibrating arm. A method of adjusting the frequency of the tuning fork oscillator by adhering it is described. Further, in Patent Document 2, a base, an IC fixed to the base, a substrate made of a polyimide film fixed to the base, located above the IC, and a substrate made of a polyimide film fixed to the base, and located above the substrate, via a bonding wire. A vibrator having a vibrating element fixed to a substrate is described.

Japanese Unexamined Patent Publication No. 2011-250225 Japanese Unexamined Patent Publication No. 2006-105962

However, in the configuration described in Patent Document 1, since the metal film for the weight has a uniform thickness, the amount of metal scattered per unit time is the same regardless of which part of the metal film for the weight is irradiated with the laser. The minimum amount of scattering is when the laser is irradiated with the shortest irradiation time that can be set by the device used. That is, there is a problem that the amount of metal scattered cannot be less than the minimum amount of scattering, it is difficult to fine-tune the frequency, and it is not possible to perform highly accurate frequency adjustment.

Further, when the metal film for weight described in Patent Document 1 is applied to the configuration described in Patent Document 2, the substrate and the IC are located between the vibrating element and the base. Therefore, the metal film for the weight cannot be irradiated with the laser, and even if the laser can be irradiated, the scattered metal that is disturbed by the substrate and the IC cannot be attached to the vibrating element. Therefore, the frequency adjustment as in Patent Document 1 cannot be performed.

The vibration device according to this application example is the base and
A vibrating arm and a vibrating element having a metal film provided on the vibrating arm and supported by the base,
It has an adjusting member located between the base and the vibrating element and adjusting the frequency of the vibrating element.
The adjusting member has a region that overlaps with the vibrating arm in a plan view, and has a portion having a different thickness in the region.

In the vibrating device according to the present application example, it is preferable that a part of the adjusting member is scattered and adhered to the vibrating arm.

In the vibration device according to the present application example, it is preferable that at least a part of the metal film overlaps with the adjusting member in a plan view.

In the vibration device according to the present application example, it is preferable that the adjusting member has a portion in the region that does not overlap with the metal film.

In the vibrating device according to the present application example, it is preferable that the region has a different thickness in the extending direction of the vibrating arm.

In the vibrating device according to the present application example, it is preferable that the region on the tip end side of the vibrating arm is thicker than the base end side.

The vibrating device according to this application example has a substrate supported by the base and has a substrate.
It is preferable that the vibrating element is supported on the substrate.

In the vibration device according to this application example, it is preferable that the adjusting member is provided on the substrate.

The vibrating device according to this application example has a circuit element supported by the base and electrically connected to the vibrating element.
It is preferable that the substrate is located between the vibrating element and the circuit element.

In the vibration device according to this application example, the vibration element is preferably a sensor element that detects a physical quantity.

The electronic device according to this application example includes the above-mentioned vibration device and
It is characterized by including a signal processing circuit that performs signal processing based on the output signal of the vibration device.

The moving body according to this application example includes the above-mentioned vibration device and
It is characterized by including a signal processing circuit that performs signal processing based on the output signal of the vibration device.

The frequency adjusting method of the vibrating element according to this application example includes a base, a vibrating arm, and a vibrating element provided on the vibrating arm and supported by the base, and the base and the vibrating element. It has an adjusting member that is located between the two and adjusts the frequency of the vibrating element, and the adjusting member has a region that overlaps with the vibrating arm in a plan view, and portions having different thicknesses are formed in the region. The process of preparing the structure to have and
It is characterized by having a step of adjusting the frequency of the vibrating element by irradiating the adjusting member with a laser beam, scattering at least a part of the adjusting member and attaching it to the vibrating arm.

It is sectional drawing of the vibration device which concerns on 1st Embodiment of this invention. It is a top view which shows the vibrating element which the vibrating device of FIG. 1 has. FIG. 2 is a cross-sectional view taken along the line AA in FIG. FIG. 2 is a cross-sectional view taken along the line BB in FIG. It is a schematic diagram which shows the drive vibration mode of a vibrating element. It is a schematic diagram which shows the detection vibration mode of a vibrating element. It is a top view which shows the vibration device of FIG. It is a top view which shows the support substrate and the vibration element which the vibration device of FIG. 1 has. FIG. 5 is a cross-sectional view taken along the line CC in FIG. It is a figure which shows the manufacturing process of a vibrating device. It is a top view for demonstrating the manufacturing method of a vibrating device. It is sectional drawing for demonstrating the manufacturing method of a vibrating device. It is sectional drawing for demonstrating the manufacturing method of a vibrating device. It is sectional drawing for demonstrating the manufacturing method of a vibrating device. It is sectional drawing for demonstrating the function of the adjustment member. It is sectional drawing which shows the method of irradiating the adjustment member with a laser beam. It is sectional drawing of the vibrating element and the support substrate which the vibrating device which concerns on 2nd Embodiment of this invention has. It is sectional drawing which shows the vibration device which concerns on 3rd Embodiment of this invention. It is a top view which shows the vibration device of FIG. It is a perspective view which shows the personal computer of 4th Embodiment. It is a perspective view which shows the mobile phone of 5th Embodiment. It is a perspective view which shows the digital still camera of 6th Embodiment. It is a perspective view which shows the automobile of 7th Embodiment.

Hereinafter, a method for adjusting the frequency of the vibrating device, electronic device, mobile body, and vibrating element of the present invention will be described in detail based on the embodiments shown in the accompanying drawings.

<First Embodiment>
FIG. 1 is a cross-sectional view of the vibration device according to the first embodiment of the present invention. FIG. 2 is a plan view showing a vibrating element included in the vibrating device of FIG. FIG. 3 is a cross-sectional view taken along the line AA in FIG. FIG. 4 is a cross-sectional view taken along the line BB in FIG. FIG. 5 is a schematic diagram showing a drive vibration mode of the vibrating element. FIG. 6 is a schematic view showing the detected vibration mode of the vibrating element. FIG. 7 is a plan view showing the vibration device of FIG. FIG. 8 is a plan view showing a support substrate and a vibration element included in the vibration device of FIG. FIG. 9 is a cross-sectional view taken along the line CC in FIG. FIG. 10 is a diagram showing a manufacturing process of the vibration device. FIG. 11 is a plan view for explaining a method of manufacturing a vibration device. FIG. 12 is a cross-sectional view for explaining a method of manufacturing a vibration device. FIG. 13 is a cross-sectional view for explaining a method of manufacturing a vibration device. FIG. 14 is a cross-sectional view for explaining a method of manufacturing a vibration device. FIG. 15 is a cross-sectional view for explaining the function of the adjusting member. FIG. 16 is a cross-sectional view showing a method of irradiating the adjusting member with laser light.

For convenience of explanation, each drawing except FIG. 10 shows an X-axis, a Y-axis, and a Z-axis which are three axes orthogonal to each other. Further, the positive side in the Z-axis direction is also referred to as "upper", and the negative side is also referred to as "lower". Further, the plan view from the Z-axis direction is also simply referred to as "plan view". The X-axis, Y-axis, and Z-axis correspond to the crystal axis of quartz, as will be described later.

The vibration device 1 shown in FIG. 1 is a physical quantity sensor, and in particular, a gyro sensor capable of detecting an angular velocity. The vibration device 1 includes a package 3, a vibration element 4, a support substrate 5, and a circuit element 6 housed in the package 3.

The package 3 has a base 31 having a recess 311 that opens on the upper surface, and a plate-shaped lid 32 that is joined to the upper surface of the base 31 via a joining member 33 so as to close the opening of the recess 311. An internal space S is formed inside the package 3 by a recess 311, and the vibrating element 4, the support substrate 5, and the circuit element 6 are housed in the internal space S. For example, the base 31 can be made of ceramics such as alumina, and the lid 32 can be made of a metal material such as Kovar. However, the constituent materials of the base 31 and the lid 32 are not particularly limited, respectively. For example, the lid 32 may be made of a light-transmitting glass material.

Further, the internal space S is airtight and is in a reduced pressure state, preferably in a state closer to vacuum. As a result, the vibration characteristics of the vibrating element 4 are improved. However, the atmosphere of the internal space S is not particularly limited, and may be, for example, an atmosphere in which an inert gas such as nitrogen or Ar is sealed, and may be in an atmospheric pressure state or a pressurized state instead of a reduced pressure state. Good.

Further, the recess 311 opens in the recess 311a which is opened on the upper surface of the base 31, and the recess 311b which is opened in the bottom surface of the recess 311a and has an opening width smaller than that of the recess 311a, and the recess 311b which is opened in the bottom surface of the recess 311b. Also has a recess 311c with a small opening width. Then, the support substrate 5 is joined to the bottom surface of the recess 311a via the conductive first joining member B1, the vibrating element 4 is joined to the support substrate 5 via the conductive second joining member B2, and the recess 311c is joined. A circuit element 6 is joined to the bottom surface.

By interposing the support substrate 5 between the vibrating element 4 and the base 31, for example, stress generated by an impact or thermal deflection of the package 3 is less likely to be transmitted to the vibrating element 4, and the vibration characteristics of the vibrating element 4 are deteriorated. Fluctuations can be suppressed.

Further, a plurality of internal terminals 341 are arranged on the bottom surface of the recess 311a, a plurality of internal terminals 342 are arranged on the bottom surface of the recess 311b, and an external terminal 343 is arranged on the lower surface of the base 31. A part of the plurality of internal terminals 342 is electrically connected to the internal terminal 341 via an internal wiring (not shown) formed in the base 31, and the remaining part is an external terminal 343 via the internal wiring. Is electrically connected to. Further, each internal terminal 342 is electrically connected to the circuit element 6 via a bonding wire BW.

The vibrating element 4 is a sensor element that detects a physical quantity, and in particular, in the present embodiment, is an angular velocity sensor element that can detect an angular velocity ωz around the Z axis. As shown in FIGS. 2 to 4, the vibrating element 4 has a vibrating body 41, electrodes 48 arranged on the vibrating body 41, and weights 46 and 47 as metal films for frequency adjustment.

The vibrating body 41 is formed of a Z-cut quartz plate, has a spread in an XY plane defined by an X-axis (electrical axis) and a Y-axis (mechanical axis), which are crystal axes of quartz, and has a Z-axis (optical axis). Has thickness in the direction. Further, the vibrating body 41 includes a base 42, detection arms 431 and 432 extending from the base 42 to both sides in the Y-axis direction, connecting arms 441 and 442 extending from the base 42 to both sides in the X-axis direction, and connecting arms 441. It has driving arms 451 and 452 extending from the tip of the connecting arm 442 to both sides in the Y-axis direction, and driving arms 453 and 454 extending from the tip of the connecting arm 442 to both sides in the Y-axis direction. Since the vibrating body 41 is made of crystal, it has light transmittance.

Further, the drive arms 451, 452, 453, 454 have wide portions 451a, 452a, 453a, 454a at the tip thereof, which are wider (length in the X-axis direction) than the proximal end side. Further, the detection arms 431 and 432 have wide portions 431a and 432a at the tip thereof, which are wider than the base end portion. As a result, the drive arms 451 and 452, 453, 454 and the detection arms 431 and 432 can be shortened when compared at the same frequency, and the vibrating element 4 can be miniaturized. Further, by shortening the lengths of the drive arms 451, 452, 453, and 454, the viscous resistance is reduced and the oscillation characteristics are improved. Further, the drive arms 451, 452, 453, 454 have grooves 451b, 452b, 453b, 454b that open on the upper surface thereof, and grooves 451c, 452c, 453c, 454c that open on the lower surface thereof. However, the configuration of the driving arms 451 and 452, 453, 454 and the detection arms 431 and 432 is not limited to this, and for example, it may not have a wide portion or may not have a groove. Good.

Further, the electrodes 48 include a drive signal electrode 481, a drive ground electrode 482, a first detection signal electrode 483, a first detection ground electrode 484, a second detection signal electrode 485, and a second detection ground electrode 486. Has. Further, the drive signal electrodes 481 are arranged on the upper and lower surfaces of the drive arms 451 and 452 and on both side surfaces of the drive arms 453 and 454. On the other hand, the drive ground electrode 482 is arranged on both side surfaces of the drive arms 451 and 452 and on the upper and lower surfaces of the drive arms 453 and 454.

Further, the first detection signal electrode 483 is arranged on the upper surface and the lower surface of the detection arm 431, and the first detection ground electrode 484 is arranged on both side surfaces of the detection arm 431. On the other hand, the second detection signal electrode 485 is arranged on the upper surface and the lower surface of the detection arm 432, and the second detection ground electrode 486 is arranged on both side surfaces of the detection arm 432. Although not shown, each of these electrodes 481, 482, 483, 484, 485, and 486 is routed to the lower surface of the base 42, and is electrically connected to the support substrate 5 via the second bonding member B2 at the base 42. It is connected to the.

The vibrating element 4 can detect the angular velocity ωz around the Z axis, which is the detection axis, as follows. First, when a drive signal is applied between the drive signal electrode 481 and the drive ground electrode 482, the drive arms 451, 452, 453, and 454 vibrate in the drive vibration mode as shown in FIG. When the angular velocity ωz around the Z axis is applied to the vibrating element 4 while driving in the drive vibration mode, the detection vibration mode as shown in FIG. 6 is newly excited. In the detection vibration mode, the Coriolis force acts on the drive arms 451, 452, 453, and 454 to excite the vibration in the direction indicated by arrow A, and the detection arms 431 and 432 are assigned to arrow B in response to this vibration. It bends and vibrates in the indicated X-axis direction. The electric charge generated in the detection arms 431 and 432 by such a detection vibration mode is taken out as a detection signal from between the first and second detection signal electrodes 483 and 485 and the first and second detection ground electrodes 484 and 486, and this signal is taken out. The angular velocity ωz can be detected based on.

The frequency fd in the drive vibration mode and the frequency fs in the detection vibration mode are different from each other, and the absolute value (| fd−fs |) of these differences is called the detuning frequency Δf. In addition, fd> fs or fd <fs may be used.

Further, as shown in FIG. 2, the weight 46 is provided on the upper surface of the wide portions 451a, 452a, 453a, 454a, and the weight 47 is provided on the upper surface of the wide portions 431a, 432a. The weight 46 is a weight for adjusting the frequency fd and the vibration balance of the drive vibration mode, and the weight 47 is a weight for adjusting the frequency fs and the vibration balance of the detection vibration mode. As will be described later, the frequency fd and vibration balance of the drive vibration mode can be adjusted by irradiating the weight 46 with the laser beam L to remove a part of the weight 46, and the laser beam L is irradiated to the weight 47. By removing a part of the weight 47, the frequency fs and the vibration balance of the detected vibration mode can be adjusted.

The configurations of the electrodes 48 and the weights 46 and 47 are not particularly limited, but for example, Au (gold), Al (aluminum), and Au (gold) or It can be composed of a metal film in which an alloy containing Al (aluminum) as a main component is laminated.

The support substrate 5 is a substrate for mounting a TAB (Tape Automated Bonding). As shown in FIG. 7, the support substrate 5 has a frame-shaped substrate 51 and a plurality of leads 52 provided on the substrate 51.

The substrate 51 has a frame shape in a plan view from the thickness direction, that is, the Z-axis direction, and is made of a film made of an insulating resin such as polyimide. However, the constituent material of the substrate 51 is not particularly limited, and for example, it may be composed of an insulating resin other than polyimide. Further, the substrate 51 is fixed to the bottom surface of the recess 311a by the first joining member B1, and each lead 52 and the internal terminal 341 are electrically connected via the first joining member B1. Further, the base portion 42 of the vibrating element 4 is fixed to the tip of each lead 52 by the second joining member B2, and the leads 52 and the electrodes 481 to 486 are electrically connected to each other via the second joining member B2. It is connected. As a result, the vibrating element 4 is supported by the base 31 via the support substrate 5 and is electrically connected to the circuit element 6.

As shown in FIGS. 8 and 9, an adjusting member 2 that functions as a frequency adjusting weight for adjusting the frequencies fd and fs of the vibrating element 4 is provided on the upper surface of the substrate 51, that is, the surface on the vibrating element 4 side. There is. Further, the adjusting member 2 has wide portions 431a, 432a of the detection arms 431 and 432 and wide portions 451a, 452a, 453a, 454a of the driving arms 451, 452, 453, 454, that is, weights 46, in a plan view from the Z-axis direction. , 47 overlaps with each other. In FIG. 9, the adjusting member 2 that overlaps with the driving arm 451 is shown as a representative, and the other adjusting members 2 are not shown.

As described above, each of the adjusting members 2 functions as a material for a frequency adjusting weight for adjusting the frequency of the vibrating element 4 or a supply unit thereof. Specifically, a method for manufacturing the vibration device 1 and FIG. 14 will be described in detail later. The adjusting member 2 is irradiated with laser light L to scatter at least a part of the adjusting member 2, and the scattered droplets 20 Is used as a material for the frequency adjustment weight, and the mass is increased by adhering to the drive arms 451, 452, 453, 454 and the detection arms 431, 432 located directly above the weight, and the frequency fd and vibration balance of the drive vibration mode and the detection. The frequency fs and vibration balance of the vibration mode can be adjusted. By providing the adjusting member 2 on the substrate 51, it becomes easy to provide the adjusting member 2 in the vicinity of the driving arms 451, 452, 453, 454 and the detecting arms 431, 432, and the droplet 20 can be more reliably provided on the driving arms 451, 452, 453. It can be attached to 454 or detection arms 431 and 432.

Such an adjusting member 2 is not particularly limited, but may be made of, for example, a metal material, a resin material, a composite material thereof, or the like. The detailed configuration of the adjusting member 2 will be described after explaining the manufacturing method of the vibrating device 1.

As shown in FIG. 1, the circuit element 6 is fixed to the bottom surface of the recess 311c. Further, the circuit element 6 is located on the lower side of the support substrate 5, and is located on the side opposite to the vibrating element 4 with respect to the support substrate 5. In other words, the support substrate 5 is located between the vibrating element 4 and the circuit element 6. With such an arrangement, as described above, the support substrate 5 can shield the laser beam L, and the circuit element 6 can be effectively suppressed from being irradiated with the laser beam L. Therefore, the circuit element 6 can be protected. Such a circuit element 6 includes, for example, an interface unit that communicates with an external host device, and a drive / detection circuit that drives the vibrating element 4 and detects the angular velocity ωz applied to the vibrating element 4. ..

Although the configuration of the vibration device 1 has been described above, the vibration device 1 is not particularly limited, and for example, the circuit element 6 may be omitted. Further, in the present embodiment, the angular velocity sensor element is used as the vibration element 4, but the present invention is not limited to this. For example, an acceleration sensor element may be used as the vibration element 4, and the vibration device 1 may be used as an acceleration sensor or vibration. An oscillating element may be used as the element 4, and the vibrating device 1 may be used as an oscillator.

Further, the configuration of the vibrating element 4 is not particularly limited, and for example, one or three driving arms 451, 452, 453, 454 may be omitted, or another driving arm may be provided. .. Similarly, one of the detection arms 431 and 432 may be omitted, or the other detection arm may be provided. Further, the detection axis of the vibrating element 4 is not limited to the Z axis, and may be, for example, an X axis or a Y axis. Further, it may have a plurality of detection axes of the X-axis, the Y-axis and the Z-axis.

Next, the frequency adjusting method of the vibrating element 4 will be described while explaining the manufacturing method of the vibrating device 1. As shown in FIG. 10, the manufacturing method of the vibrating device 1 is based on the preparatory step of preparing the vibrating element 4, the first frequency adjusting step of adjusting the frequency of the vibrating element 4 on the crystal wafer 40, and the vibrating element 4. It includes a mounting step of mounting on 31, a second frequency adjusting step of adjusting the frequency of the vibrating element 4, and a sealing step of joining the lid 32 to the base 31.

[Preparation process]
First, as shown in FIG. 11, a crystal wafer 40 is prepared, and the crystal wafer 40 is patterned by using a photolithography technique and an etching technique to form a plurality of vibrating bodies 41 on the crystal wafer 40. Next, the electrode 48 is formed on the surface of the vibrating body 41 by sputtering or the like. Further, by sputtering or the like, a weight 46 is formed on the wide portions 451a, 452a, 453a, 454a of the driving arms 451, 452, 453, 454, and a weight 47 is formed on the wide portions 431a, 432a of the detection arms 431, 432. ..

[First frequency adjustment process]
Next, the frequencies fd and fs of the vibrating element 4 are roughly adjusted on the crystal wafer 40. Specifically, if necessary, the weights 46 provided on the drive arms 451, 452, 453, and 454 are irradiated with laser light L, and a part of the weights 46 is removed to reduce the mass, thereby causing drive vibration. Adjust the frequency fd of the mode. Similarly, if necessary, the weights 47 provided on the detection arms 431 and 432 are irradiated with the laser beam L, and a part of the weights 47 is removed to reduce the mass, thereby adjusting the frequency fs of the detection vibration mode. To do. The laser light L is not particularly limited, and for example, pulsed laser light such as YAG, YVO ₄ , excimer laser, and continuously oscillating laser light such as carbon dioxide laser can be used. Further, an energy ray other than a laser, for example, an electron beam may be used.

In this way, by adjusting the frequencies fd and fs on the crystal wafer 40, that is, before mounting the vibrating element 4 on the base 31, the adverse effects of the weights 46 and 47 evaporated during the adjustment adhering to the base 31. Can be suppressed.

[Mounting process]
Next, as shown in FIG. 12, the vibrating element 4 is cut from the crystal wafer 40, and the cut vibrating element 4 is joined to the base 31 via the support substrate 5. When the vibrating element 4 is fixed to the base 31 in this way, the frequencies fd, fs and vibration balance of the vibrating element 4 may change due to environmental changes such as stress.

[Second frequency adjustment process]
As described above, since the frequency fd and the vibration balance may change in the mounting process, in this step, a part of the weight 46 is removed again by using the laser beam L to adjust the frequency fd. Specifically, in a vacuum state, as shown in FIG. 13, laser light L is applied to the weights 46 of the driving arms 451, 452, 453, and 454 as needed to remove at least a part of the weights 46. As a result, the frequency fd is adjusted to the target value, and the vibration balance of the drive arms 451, 452, 453, and 454 is adjusted.

Here, it is conceivable that the weight 46 is removed too much and the frequency fd becomes higher than the target value, or the vibration balance of the driving arms 451, 452, 453, and 454 is lost. In that case, as shown in FIG. 14, the laser beam L is adjusted to be located directly below the driving arms 451, 452, 453, 454 through the window portion M formed by removing the weight 46 by the above-mentioned laser irradiation. The member 2 is irradiated to disperse at least a part of the adjusting member 2, and the scattered droplets 20 are attached to the lower surfaces of the driving arms 451, 452, 453, and 454. As a result, the masses of the drive arms 451, 452, 453, and 454 can be increased, and the frequency fd can be lowered. As described above, according to the vibration device 1, it is possible to adjust the frequency fd by removing the weight 46 and to lower the frequency fd by adhering the droplets 20. Therefore, the frequency fd and the vibration balance of the driving arms 451, 452, 453, and 454 can be adjusted with high accuracy.

It should be noted that such adjustment may not be performed if it is not necessary, and if necessary, it may be performed on at least one of the driving arms 451, 452, 453, and 454. That is, it is not necessary to make the above adjustments on all of the driving arms 451, 452, 453, and 454.

Further, the droplet 20 adheres to the lower surfaces of the driving arms 451, 452, 453, and 454, so that the mass on the lower surface side can be increased and balanced with the mass on the upper surface side increased by the weight 46. You can also. That is, the difference between the mass on the upper surface side and the mass on the lower surface side of the drive arms 451, 452, 453, and 454 can be reduced. Therefore, in the drive vibration mode, unnecessary vibration of the drive arms 451, 452, 453, and 454 in the Z-axis direction can be suppressed.

Here, when the adjusting member 2 is made of a metal material, the specific gravity of the adjusting member 2 can be sufficiently increased. Therefore, the frequency fd can be adjusted efficiently. Further, when the adjusting member 2 is made of a resin material, since the adjusting member 2 has an insulating property, the drive signal electrode 481 and the drive ground electrode 482 are short-circuited by the droplets 20 adhering to the drive arms 451, 452, 453, and 454. There is no risk of doing so.

Further, at least a part of the weights 46 provided on the drive arms 451, 452, 453, and 454 overlap with the adjusting member 2 located immediately below the weights 46. Therefore, the window portion M can be formed in the portion overlapping the adjusting member 2, and the laser beam L can be irradiated to the adjusting member 2 through the window portion M. Therefore, it becomes easy to irradiate the adjusting member 2 with the laser beam L. Furthermore, since the droplets 20 can be scattered directly under the drive arms 451, 452, 453, and 454, the droplets 20 can be efficiently attached to the lower surfaces of the drive arms 451, 452, 453, and 454. .. Further, if there is such a window portion M, it is not necessary to newly remove a part of the weight 46 and the electrode 48 in order to irradiate the adjusting member 2 with the laser beam L. Therefore, by that action, each driving arm It is also possible to prevent the masses of 451 and 452, 453 and 454 from further decreasing.

Similarly, the frequency fs and the vibration balance may change in the mounting process, and the detuning frequency Δf deviated by the above-mentioned adjustment of the frequency fd may need to be readjusted. Therefore, in this step, the frequency fs is adjusted by removing a part of the weight 47 again by using the laser beam L. The method for adjusting the frequency fs is the same as the method for adjusting the frequency fd described above. That is, adjustments for increasing the frequency fs by removing the weight 47 and adjusting for lowering the frequency fs by attaching the droplets 20 to the detection arms 431 and 432 are performed as necessary.

It should be noted that such adjustment may not be performed if it is not necessary, and if necessary, it may be performed on at least one of the detection arms 431 and 432. That is, it is not necessary to make the above adjustments on all of the detection arms 431 and 432.

[Sealing process]
Next, in a vacuum state, the lid 32 is seam welded to the upper surface of the base 31 via, for example, a joining member 33 made of a seam ring. As a result, the internal space S is hermetically sealed, and the vibration device 1 is obtained.

The manufacturing method of the vibration device 1 has been described above. Hereinafter, the adjusting member 2 will be described in detail. Since the configurations of the adjusting members 2 are the same as each other, the adjusting member 2 overlapping the driving arm 451 will be described below as a representative, and the adjustments overlapping the detecting arms 431 and 432 and the driving arms 452, 453, and 454 will be described. The description of the member 2 will be omitted.

As shown in FIG. 15, the adjusting member 2 has a region Q that overlaps with the wide portion 451a in a plan view, and has portions having different thicknesses in this region Q. That is, the region Q has a relatively thick first portion Q1 and a second portion Q2 that is thinner than the first portion Q1. As a result, for example, the position P2 in the second portion Q2, which is thinner than the position P1 than the amount of droplets scattered per unit time when the laser beam L is irradiated to the position P1 in the first portion Q1. The amount of droplets 20 scattered per unit time when the laser beam L is irradiated is reduced.

That is, the amount of the droplet 20 scattered can be changed depending on the location where the laser beam L is irradiated. Therefore, for example, if the position P1 is irradiated with the laser beam L, the amount of the droplets 20 scattered increases, and the rough adjustment of the frequency fd can be efficiently performed with the shorter irradiation time of the laser beam L. If the laser beam L is irradiated to the surface, the amount of the droplet 20 scattered is reduced, and the frequency fd can be finely adjusted more accurately. Therefore, the frequency fd can be adjusted more efficiently and accurately.

Here, it is preferable that the thickness of the adjusting member 2 at the position P2 is sufficiently thin. Specifically, when the depth removed when the laser beam L is irradiated to the adjusting member 2 at the shortest irradiation time set by the laser irradiation device used in the second frequency adjusting step is D, the position P2. The thickness of the adjusting member 2 is preferably thinner than the depth D. That is, the adjusting member 2 preferably has a portion thinner than the depth D. As a result, the amount of scattering of the droplet 20 can be further reduced, and specifically, the amount of scattering can be less than the minimum amount described in the above-mentioned "problem to be solved by the invention", and the frequency fd can be finely adjusted. Can be performed more accurately. However, the thickness of the adjusting member 2 at the position P2 is not particularly limited.

Further, the thickness of the adjusting member 2 changes along the extending direction of the driving arm 451. That is, the first portion Q1 and the second portion Q2 are obtained by making the upper surface of the region Q a slope non-parallel to the upper surface of the substrate 51. Therefore, when performing the adjustment method as described above, the irradiation position of the laser beam L may be shifted in the extending direction of the driving arm 451, and the droplet 20 adheres along the extending direction of the driving arm 451 accordingly. .. Therefore, the mass balance in the width direction, which is a direction orthogonal to the thickness direction and the extension direction of the drive arm 451 is unlikely to deviate, and the occurrence of unnecessary vibration in the drive vibration mode can be effectively suppressed. However, the thickness of the adjusting member 2 is not limited to this, and the thickness of the adjusting member 2 may change along the width direction of the driving arm 451.

In particular, in the present embodiment, the thickness of the adjusting member 2 gradually increases from the base end side to the tip end side of the drive arm 451. That is, the thickness of the adjusting member 2 continuously increases from the proximal end side of the driving arm 451 toward the distal end side, and the distal end side of the driving arm 451 is thicker than the proximal end side. Therefore, the amount of droplets 20 scattered per unit time when irradiated with the laser beam L increases toward the tip side of the driving arm 451. Since the amount of change in the frequency fd with respect to the mass change is larger toward the tip end side of the drive arm 451, the frequency fd can be efficiently lowered by attaching more droplets 20 to the tip end portion of the drive arm 451.

On the contrary, the amount of droplets 20 scattered per unit time when irradiated with the laser beam L becomes smaller toward the proximal end side of the driving arm 451. Since the amount of change in the frequency fd with respect to the mass change is smaller toward the proximal end side of the drive arm 451, fine adjustment of the frequency fd can be performed more accurately by attaching a smaller amount of droplets 20 to the proximal end side. That is, according to such a configuration, the coarse adjustment of the frequency fd can be performed efficiently in a shorter time, and the fine adjustment of the frequency fd can be performed more accurately.

The configuration of the adjusting member 2 is not particularly limited, and for example, the thickness of the driving arm 451 may be gradually reduced from the base end side to the tip end side. Further, the adjusting member 2 may have a staircase shape, and the thickness thereof may be changed stepwise. That is, it may have a first portion Q1 having a uniform thickness and a second portion Q2 having a uniform thickness, and the thickness of the first portion Q1 may be thicker than the thickness of the second portion Q2.

Here, the method of irradiating the adjusting member 2 with the laser beam L as described above will be described in detail. As shown in FIG. 16, it is preferable to irradiate the adjusting member 2 with the laser light L so that the position of the beam waist L0 of the laser light L deviates from the surface of the adjusting member 2 at the position P2. In particular, in the present embodiment, when the bisector of the thickness of the adjusting member 2 is a virtual line R, the laser is applied to the adjusting member 2 so that the beam waist L0 of the laser light L is located on the virtual line R. It is irradiating light L. As a result, at the position P2 of the adjusting member 2, the beam spot of the laser beam L expands and the amount of energy per unit area decreases, and the amount of scattered droplets 20 decreases accordingly. As a result, the amount of the droplet 20 scattered can be reduced, and the frequency fd can be finely adjusted more accurately. However, the method of irradiating the laser beam L is not particularly limited.

As described above, the vibrating device 1 has a base 31 and a weight 46 as a metal film provided on the driving arms 451, 452, 453, 454 and the driving arms 451, 452, 453, 454 as vibrating arms. It also has a vibrating element 4 supported by the base 31 and an adjusting member 2 located between the base 31 and the vibrating element 4 and adjusting the frequency fd of the vibrating element 4. The adjusting member 2 has a region Q that overlaps the driving arms 451, 452, 453, and 454 in a plan view, and a portion having a different thickness, that is, a first portion Q1 and a second portion Q2 are provided in the region Q. Have.

According to such a configuration, the mass of the driving arms 451, 452, 453, 454 can be reduced by irradiating the weight 46 with the laser beam L to remove at least a part of the weight 46, and the frequency fd Can be raised. On the contrary, by irradiating the adjusting member 2 with the laser beam L to scatter at least a part of the adjusting member 2, and attaching the scattered droplets 20 to the lower surfaces of the driving arms 451, 452, 453, and 454, the driving arm 451 , 452, 453, 454 can be increased in mass and the frequency fd can be lowered. As described above, the frequency fd can be set high or low, so that the frequency fd can be adjusted accurately. Further, since the adjusting member 2 has portions having different thicknesses, the amount of the droplets 20 scattered can be changed depending on the place where the laser beam L is irradiated. Therefore, the frequency fd can be adjusted more efficiently and accurately.

Further, as described above, in the vibration device 1, a part of the adjusting member 2 is scattered and attached to the driving arms 451, 452, 453, 454. As a result, the masses of the drive arms 451, 452, 453, and 454 can be increased, and the frequency fd can be lowered.

Further, as described above, at least a part of the weight 46 overlaps with the adjusting member 2 in a plan view. As a result, the weight 46 of the portion overlapping the adjusting member 2 is removed, so that the window portion M for transmitting the laser light L can be formed, and the laser light L is adjusted through the window portion M. 2 can be irradiated. Therefore, it becomes easy to irradiate the adjusting member 2 with the laser beam L. Further, if there is such a window portion M, it is not necessary to newly remove a part of the weight 46 and the electrode 48 in order to irradiate the adjusting member 2 with the laser beam L. Therefore, each driving arm 451 by the action. , 452, 453, 454 can be prevented from further decreasing in mass.

Further, as described above, the thickness of the region Q changes along the extending direction of each of the driving arms 451, 452, 453, and 454. Therefore, even if the droplet 20 is attached, the mass balance of each of the drive arms 451, 452, 453, and 454 in the width direction is unlikely to shift, and the occurrence of unnecessary vibration in the drive vibration mode can be effectively suppressed. ..

Further, as described above, the region Q is thicker on the distal end side of each of the driving arms 451, 452, 453, 454 than on the proximal end side. As a result, the amount of droplets 20 scattered per unit time when irradiated with the laser beam L increases toward the tip side of the drive arm 451. Therefore, if the tip side of the adjusting member 2 is irradiated with the laser beam L, the coarse adjustment of the frequency fd can be efficiently performed in a shorter irradiation time, and if the base end side is irradiated with the laser beam L, the frequency fd is fine. The adjustment can be performed more accurately.

Further, as described above, the vibration device 1 has a substrate 51 supported by the base 31, and the vibration element 4 is supported by the substrate 51. As a result, for example, stress generated by an impact or thermal bending of the base 31 is less likely to be transmitted to the vibrating element 4, and deterioration or fluctuation of the vibrating characteristics of the vibrating element 4 can be suppressed.

Further, as described above, the adjusting member 2 is provided on the substrate 51. As a result, the adjusting member 2 can be easily provided in the vicinity of the drive arms 451, 452, 453, 454, and the droplet 20 can be more reliably attached to the drive arms 451, 452, 453, 454.

Further, as described above, the vibration device 1 has a circuit element 6 supported by the base 31 and electrically connected to the vibration element 4. The substrate 51 is located between the vibrating element 4 and the circuit element 6. As a result, the substrate 51 can block the laser beam L and prevent the laser beam L from being irradiated to the circuit element 6. Therefore, the circuit element 6 can be protected.

Further, as described above, the vibration element 4 is a sensor element that detects a physical quantity. In the present embodiment, the vibration element 4 is an angular velocity sensor element that detects an angular velocity. This makes the vibration device 1 highly convenient.

Further, as described above, the frequency adjusting method of the vibrating element 4 is a method of adjusting the frequency of the vibrating element 4, the weight 46 as a metal film provided on the base 31, the driving arms 451, 452, 453, 454 and the driving arms 451, 452, 453, 454. The adjusting member 2 is provided with a vibrating element 4 supported by the base 31 and an adjusting member 2 located between the base 31 and the vibrating element 4 and adjusting the frequency fd of the vibrating element 4. A step of preparing a structure having a region Q overlapping the driving arms 451, 452, 453, 454 in a plan view and having portions having different thicknesses in the region Q, and irradiating the adjusting member 2 with laser light L. The step of adjusting the frequency fd of the vibrating element 4 by scattering at least a part of the adjusting member 2 and attaching it to the driving arms 451, 452, 453, 454.

According to such a frequency adjusting method, the mass of the driving arms 451, 452, 453, 454 can be reduced by irradiating the weight 46 with the laser beam L to remove at least a part of the weight 46. The frequency fd can be increased. On the contrary, by irradiating the adjusting member 2 with the laser beam L to scatter at least a part of the adjusting member 2, and attaching the scattered droplets 20 to the lower surfaces of the driving arms 451, 452, 453, and 454, the driving arm 451 , 452, 453, 454 can be increased in mass and the frequency fd can be lowered. As described above, the frequency fd can be set high or low, so that the frequency fd can be adjusted accurately. Further, since the adjusting member 2 has portions having different thicknesses, the amount of the droplets 20 scattered can be changed depending on the place where the laser beam L is irradiated. Therefore, the frequency fd can be adjusted more efficiently and accurately.

<Second Embodiment>
FIG. 17 is a cross-sectional view of a vibration element and a support substrate included in the vibration device according to the second embodiment of the present invention.

The vibration device 1 according to the present embodiment is the same as the vibration device 1 of the first embodiment described above, except that the configuration of the vibration element 4 is different. In the following description, the vibration device 1 of the second embodiment will be mainly described with respect to the differences from the above-described embodiment, and the description of the same matters will be omitted. Further, in FIG. 17, the same reference numerals are given to the same configurations as those in the first embodiment described above. Since the configurations of the adjusting members 2 are the same as each other, the adjusting member 2 overlapping the driving arm 451 will be described below as a representative, and the adjustments overlapping the detecting arms 431 and 432 and the driving arms 452, 453, and 454 will be described. The description of the member 2 will be omitted.

As shown in FIG. 17, in a plan view from the Z-axis direction, the wide portion 451a is provided with a window portion M in which the weight 46 and the electrode 48 are not formed. That is, the window portion M formed by the irradiation of the laser beam L in the above-described first embodiment is formed from the beginning in the present embodiment. Then, at least a part of the adjusting member 2 overlaps with the window portion M in the plan view of the substrate 51. That is, at least a part of the adjusting member 2 does not overlap with the weight 46 and the electrode 48 in the plan view of the substrate 51. According to such a configuration, it is not necessary to remove the weight 46 to form the window portion M in the second frequency adjusting step described in the first embodiment, so that the weight 46 is not removed. The adjusting member 2 can be irradiated with the laser beam L through the window portion M. That is, only the adjustment for lowering the frequency fd can be performed. Therefore, the frequency fd can be adjusted more easily.

As described above, at least a part of the adjusting member 2 does not overlap with the weight 46 as the metal film in the plan view of the substrate 51. According to such a configuration, it is not necessary to remove the weight 46 to form the window portion M in the second frequency adjusting step, so that the weight 46 is not removed and the adjustment is made through the window portion M. The member 2 can be irradiated with the laser beam L. That is, only the adjustment for lowering the frequency fd can be performed. Therefore, the frequency fd can be adjusted more easily.

The second embodiment as described above can also exert the same effect as the first embodiment described above.

<Third Embodiment>
FIG. 18 is a cross-sectional view showing a vibration device according to a third embodiment of the present invention. FIG. 19 is a plan view showing the vibration device of FIG.

The vibration device 1 according to the present embodiment is the same as the vibration device 1 of the first embodiment described above, except that the circuit element 6 and the support substrate 5 are omitted. In the following description, the vibration device 1 of the third embodiment will be mainly described with respect to the differences from the first embodiment described above, and the same matters will be omitted. Further, in FIGS. 18 and 19, the same reference numerals are given to the same configurations as those in the first embodiment described above.

As shown in FIG. 18, the vibration device 1 of the present embodiment includes a package 3 and a vibration element 4 housed in the package 3. Further, the recess 311 formed in the base 31 has a recess 311a that opens on the upper surface of the base 31 and a recess 311b that opens on the bottom surface of the recess 311a and has an opening width smaller than that of the recess 311a. Then, the vibrating element 4 is joined to the bottom surface of the recess 311a via the conductive first joining member B1, and the adjusting member 2 is provided on the bottom surface of the recess 311b. Further, a plurality of internal terminals 341 electrically connected to the vibrating element 4 via the first joining member B1 are arranged on the bottom surface of the recess 311a, and on the lower surface of the base 31 via internal wiring (not shown). A plurality of external terminals 343 that are electrically connected to the internal terminals 341 are arranged.

Further, as shown in FIG. 19, in addition to the configuration of the first embodiment described above, the vibrating element 4 includes a pair of support portions 491 and 492 joined to the bottom surface of the recess 311a by the first joining member B1. It has a pair of connecting beams 493 and 494 that connect the base portion 42 and the support portion 491, and a pair of connecting beams 495 and 494 that connect the base portion 42 and the support portion 492. Although not shown, the electrodes 481, 482, 483, 484, 485, and 486 are routed to the lower surfaces of the support portions 491 and 492, respectively, and inside the support portions 491 and 492 via the first joining member B1. It is electrically connected to the terminal 341.

The third embodiment as described above can also exert the same effect as the first embodiment described above.

<Fourth Embodiment>
FIG. 20 is a perspective view showing the personal computer of the fourth embodiment.

The personal computer 1100 as an electronic device shown in FIG. 20 is composed of a main body 1104 having a keyboard 1102 and a display unit 1106 having a display 1108, and the display unit 1106 has a hinge structure with respect to the main body 1104. It is rotatably supported via a portion. Further, the personal computer 1100 has a built-in vibration device 1 as a physical quantity sensor and a signal processing circuit 1110 that performs signal processing, that is, control of each part based on the output signal from the vibration device 1.

As described above, the personal computer 1100 as an electronic device includes a vibration device 1 and a signal processing circuit 1110 that performs signal processing based on the output signal of the vibration device 1. Therefore, the effect of the vibration device 1 described above can be enjoyed, and high reliability can be exhibited.

<Fifth Embodiment>
FIG. 21 is a perspective view showing the mobile phone of the fifth embodiment.

The mobile phone 1200 as an electronic device shown in FIG. 21 includes an antenna (not shown), a plurality of operation buttons 1202, an earpiece 1204 and a mouthpiece 1206, and a display unit 1208 is provided between the operation button 1202 and the earpiece 1204. Is placed. Further, the mobile phone 1200 has a built-in vibration device 1 as a physical quantity sensor and a signal processing circuit 1210 that performs signal processing, that is, control of each part based on the output signal from the vibration device 1.

As described above, the mobile phone 1200 as an electronic device includes a vibration device 1 and a signal processing circuit 1210 that performs signal processing based on the output signal of the vibration device 1. Therefore, the effect of the vibration device 1 described above can be enjoyed, and high reliability can be exhibited.

<Sixth Embodiment>
FIG. 22 is a perspective view showing the digital still camera of the sixth embodiment.

The digital steel camera 1300 as an electronic device shown in FIG. 22 includes a case 1302, and a display unit 1310 is provided on the back surface of the case 1302. The display unit 1310 is configured to display based on the imaging signal obtained by the CCD, and functions as a finder that displays the subject as an electronic image. Further, a light receiving unit 1304 including an optical lens, a CCD, and the like is provided on the front side of the case 1302. Then, when the photographer confirms the subject image displayed on the display unit 1310 and presses the shutter button 1306, the imaging signal of the CCD at that time is transferred and stored in the memory 1308. Further, the digital still camera 1300 has a built-in vibration device 1 as a physical quantity sensor and a signal processing circuit 1312 that performs signal processing, that is, control of each part based on the output signal from the vibration device 1.

As described above, the digital steel camera 1300 as an electronic device includes a vibration device 1 and a signal processing circuit 1312 that performs signal processing based on the output signal of the vibration device 1. Therefore, the effect of the vibration device 1 described above can be enjoyed, and high reliability can be exhibited.

In addition to the personal computer 1100, mobile phone 1200, and digital still camera 1300 described above, the electronic device including the vibration device 1 includes, for example, a smartphone, a tablet terminal, a clock including a smart watch, an inkjet ejection device, for example, an inkjet printer. Wearable terminals such as HMDs (head mount displays), TVs, video cameras, video tape recorders, car navigation devices, pagers, electronic notebooks including communication functions, electronic dictionaries, calculators, electronic game devices, word processors, workstations, videophones , Security TV monitors, electronic binoculars, POS terminals, electronic thermometers, blood pressure monitors, blood glucose meters, electrocardiogram measuring devices, ultrasonic diagnostic devices, medical devices such as electronic endoscopes, fish finder, various measuring devices, vehicles, It may be an instrument such as an aircraft or a ship, a base station for a mobile terminal, a flight simulator, or the like.

<7th Embodiment>
FIG. 23 is a perspective view showing the automobile of the seventh embodiment.

The vehicle 1500 as a moving body shown in FIG. 23 includes a system 1502 such as an engine system, a braking system and a keyless entry system. Further, the automobile 1500 includes a vibration device 1 as a physical quantity sensor and a signal processing circuit 1510 that performs signal processing, that is, control of the system 1502 based on the output signal from the vibration device 1.

As described above, the automobile 1500 as a moving body includes a vibration device 1 and a signal processing circuit 1510 that performs signal processing based on the output signal (oscillation signal) of the vibration device 1. Therefore, the effect of the vibration device 1 described above can be enjoyed, and high reliability can be exhibited.

The moving body provided with the vibration device 1 may be, for example, a robot, a drone, a motorcycle, an aircraft, a ship, a train, a rocket, a spaceship, or the like, in addition to the automobile 1500.

The frequency adjustment method for the vibrating device, electronic device, mobile body, and vibrating element of the present invention has been described above based on the illustrated embodiment, but the present invention is not limited to this, and the configuration of each part is described. It can be replaced with an arbitrary configuration having a similar function. Further, any other constituents may be added to the present invention. Moreover, each embodiment may be combined appropriately.

1 ... Vibration device, 2 ... Adjusting member, 20 ... Splash, 3 ... Package, 31 ... Base, 311, 311a, 311b, 311c ... Recess, 32 ... Lid, 33 ... Joining member, 341, 342 ... Internal terminal, 343 ... External terminal, 4 ... Vibrating element, 40 ... Crystal wafer, 41 ... Vibrating body, 42 ... Base, 431, 432 ... Detection arm, 431a, 432a ... Wide part, 441, 442 ... Connecting arm, 451, 452, 453, 454 ... Drive arm, 451a, 452a, 453a, 454a ... Wide portion, 451b, 451c, 452b, 452c, 453b, 453c, 454b, 454c ... Groove, 46, 47 ... Weight, 48 ... Electrode, 481 ... Drive signal electrode, 482 ... drive ground electrode, 483 ... first detection signal electrode, 484 ... first detection ground electrode, 485 ... second detection signal electrode, 486 ... second detection ground electrode, 491, 492 ... support, 493, 494, 495, 496 ... Connecting beam, 5 ... Support board, 51 ... Board, 52 ... Lead, 6 ... Circuit element, 1100 ... Personal computer, 1102 ... Keyboard, 1104 ... Main body, 1106 ... Display unit, 1108 ... Display, 1110 ... Signal Processing circuit, 1200 ... Mobile phone, 1202 ... Operation button, 1204 ... Earpiece, 1206 ... Mouthpiece, 1208 ... Display, 1210 ... Signal processing circuit, 1300 ... Digital steel camera, 1302 ... Case, 1304 ... Light receiving unit, 1306 ... Shutter button, 1308 ... Memory, 1310 ... Display, 1312 ... Signal processing circuit, 1500 ... Automobile, 1502 ... System, 1510 ... Signal processing circuit, A, B ... Arrow, B1 ... First joining member, B2 ... First 2 Bonding member, BW ... Bonding wire, L ... Laser light, L0 ... Beam waist, M ... Window, P1, P2 ... Position, Q ... Region, Q1 ... 1st part, Q2 ... 2nd part, R ... Virtual line , S ... Internal space

Claims (13)

With the base
A vibrating arm and a vibrating element having a metal film provided on the vibrating arm and supported by the base,
It has an adjusting member located between the base and the vibrating element and adjusting the frequency of the vibrating element.
A vibrating device characterized in that the adjusting member has a region overlapping the vibrating arm in a plan view, and has portions having different thicknesses in the region. The vibrating device according to claim 1, wherein a part of the adjusting member is scattered and attached to the vibrating arm. The vibrating device according to claim 1 or 2, wherein at least a part of the metal film overlaps the adjusting member in a plan view. The vibrating device according to any one of claims 1 to 3, wherein the adjusting member has a portion in the region that does not overlap with the metal film. The vibrating device according to any one of claims 1 to 4, wherein the region has a thickness different in the extending direction of the vibrating arm. The vibrating device according to claim 5, wherein the region is thicker on the distal end side of the vibrating arm than on the proximal end side. Having a substrate supported by the base
The vibrating device according to any one of claims 1 to 6, wherein the vibrating element is supported on the substrate. The vibrating device according to claim 7, wherein the adjusting member is provided on the substrate. It has a circuit element supported by the base and electrically connected to the vibrating element.
The vibrating device according to claim 8, wherein the substrate is located between the vibrating element and the circuit element. The vibrating device according to any one of claims 1 to 9, wherein the vibrating element is a sensor element that detects a physical quantity. The vibrating device according to any one of claims 1 to 10.
An electronic device including a signal processing circuit that performs signal processing based on an output signal of the vibration device. The vibrating device according to any one of claims 1 to 10.
A mobile body including a signal processing circuit that performs signal processing based on an output signal of the vibration device. A base, a vibrating arm, and a metal film provided on the vibrating arm are provided, and the vibrating element supported by the base is located between the base and the vibrating element, and the frequency of the vibrating element is adjusted. The step of preparing a structure having an adjusting member, the adjusting member having a region overlapping the vibrating arm in a plan view, and having portions having different thicknesses in the region.
The vibrating element is characterized by having a step of adjusting the frequency of the vibrating element by irradiating the adjusting member with laser light, scattering at least a part of the adjusting member and attaching it to the vibrating arm. Frequency adjustment method.

Images