JP2020177926A - Led illuminating device - Google Patents

Abstract

To provide an LED " that can be easily provided with sensors.SOLUTION: An LED illuminating device 1 comprises sensors 81 and 83 comprising sensor bodies 81a and 83a and lead wires 81b and 83b, a support base 85 supporting the sensors 81 and 83, LED elements, an LED board on which the LED elements are annularly mounted, and a control unit for controlling light emission of the LED elements on the basis of signals outputted from the sensors 81 and 83. The support base 85 comprises sensor fitting parts 851a and 851b fitted with the sensors 81 and 83, and a plate-like part 855a extending from bottom parts of the sensor fitting parts 851a and 851b, and fitted to a region surrounded by the LED elements on the LED board. The sensor fitting parts 851a and 851b comprise through holes 851c and 851d through which the lead wires 81b and 83b are passed, in the bottom parts. The plate-like part 855a is provided so as not to overlap with the through holes 851c and 851d.SELECTED DRAWING: Figure 8

Description

The present invention relates to an LED lighting device including a sensor.

In recent years, due to heightened environmental awareness, LED lighting devices that use LED elements with excellent power saving as a light source have been widely used, and there are devices that control the light emission of LED elements with sensors (for example). Patent Document 1).
The LED lighting device described in Patent Document 1 has a second substrate for a sensor in addition to the first substrate on which the LED element is mounted. The second substrate and the support material that supports the second substrate are provided separately from the heat radiating portion that dissipates heat generated from the LED element.

Patent No. 54633431

In the above LED lighting device, the first substrate on which the LED element is mounted is provided in contact with the heat radiating portion in order to conduct the heat of the LED element, and the second substrate for the sensor is provided in a state of being separated from the radiating portion. .. Therefore, there is a problem that it is troublesome to provide a sensor.
An object of the present invention is to provide an LED lighting device to which a sensor can be easily provided.

The LED lighting device according to the present invention is an LED substrate in which a sensor having a sensor body and a lead wire, a support base for supporting the sensor, a plurality of LED elements as a light source, and the plurality of LED elements are annularly mounted. And a control unit that controls the light emission of the LED element based on the signal output from the sensor, and the support base includes a sensor mounting unit that mounts the sensor and a sensor mounting unit that mounts the sensor.
It has a plate-shaped portion extending from the bottom of the sensor mounting portion and mounted in a region surrounded by the plurality of LED elements on the LED substrate, and the sensor mounting portion penetrates through the lead wire. The bottom portion has a hole, and the plate-shaped portion is provided so as not to overlap with the through hole.

According to the above configuration, the sensor can be easily provided by mounting the support base supported by the sensor on the LED substrate.

It is a perspective view of the LED lighting device according to the embodiment, (a) is a view seen from the light emitting side of the LED lighting device, and (b) is a view seen from the side opposite to the light emitting side. It is a perspective view which looked at the disassembled state of the LED lighting apparatus which concerns on embodiment from the light emitting side. It is a perspective view which looked at the disassembled state of the LED lighting apparatus which concerns on embodiment from the side opposite to the light emitting side. FIG. 5 is a perspective view of the LED lighting device according to the embodiment as viewed from the light emitting side in a state of being cut by a virtual surface orthogonal to the circuit board. It is a perspective view which looked at the state which cut in the virtual plane orthogonal to the circuit board in the LED lighting apparatus which concerns on embodiment, from the side opposite to the light emitting side. FIG. 5 is a perspective view of the LED lighting device according to the embodiment as viewed from the light emitting side in a state of being cut by a virtual surface parallel to the circuit board. FIG. 5 is a perspective view of the LED lighting device according to the embodiment as viewed from the side opposite to the light emitting side in a state of being cut by a virtual surface parallel to the circuit board. It is a perspective view of the disassembled state of the sensor unit which concerns on embodiment, FIG. It is a perspective view of the state in which the sensor unit, the LED module and the power supply circuit unit which concerns on embodiment are integrated. It is a block diagram of the LED lighting apparatus which concerns on embodiment. It is a circuit diagram related to a temperature sensor. It is a perspective view of the translucent cover according to the embodiment seen from the inside, (a) is a view in which a through hole for a motion sensor is located in front, and (b) is a through hole for an illuminance sensor in front. It is a figure located in. It is the figure which looked at the case body which concerns on embodiment from the translucent cover side. It is a figure of the case main body which concerns on embodiment cut by the virtual plane parallel to a circuit board, (a) is a front view, and (b) is a perspective view. There is a view of the cross-sectional state of FIG. 14 as viewed from the opposite side, (a) is a front view, and (b) is a perspective view. An LED lighting device in which a through hole for a sensor is provided in a translucent cover is shown. FIG. is there.

<Overview>
In the LED lighting device according to one aspect of the present invention, a sensor having a sensor body and a lead wire, a support base for supporting the sensor, a plurality of LED elements as a light source, and the plurality of LED elements are annularly mounted. The LED substrate is provided with a control unit that controls light emission of the LED element based on a signal output from the sensor, and the support base includes a sensor mounting portion for mounting the sensor and a bottom portion of the sensor mounting portion. It has a plate-shaped portion extending from the LED substrate and mounted in a region surrounded by the plurality of LED elements in the LED substrate, and the sensor mounting portion has a through hole at the bottom through which the lead wire penetrates. However, the plate-shaped portion is provided so as not to overlap with the through hole.
The LED lighting device according to one aspect of the specification includes a sensor, a support base for supporting the sensor, a plurality of LED elements as a light source, an LED substrate on which the plurality of LED elements are annularly mounted, and the sensor. The support base includes a control unit that controls light emission of the LED element based on an output signal, and a heat dissipation unit for releasing heat transmitted from the LED element via the LED substrate. It is mounted in the area of the LED substrate surrounded by the plurality of LED elements, and the LED substrate is connected to the heat radiating portion. As a result, the area of the LED substrate surrounded by the LED elements can be effectively used.
In the LED lighting device according to another aspect of the specification, the support base is attached to the LED substrate by engaging with a through hole provided in the LED substrate. As a result, the support base can be easily mounted on the LED substrate.
In the LED lighting device according to another aspect of the specification, the sensor is supported at a position in the thickness direction of the LED substrate and away from the surface on which the LED element is mounted. As a result, false detection of the sensor can be reduced.
In the LED lighting device according to another aspect of the specification, the heat radiating portion includes an annular base material, and the back side portion of the LED element of the LED substrate comes into contact with the base material. Thereby, the heat at the time of light emission of the LED element can be efficiently transferred to the base member.
In the LED lighting device according to another aspect of the specification, the sensor is an illuminance sensor, and a motion sensor is also supported by the support base. As a result, the member that supports the sensor can be configured by one.

<Embodiment>
In the embodiment, a mode applied to a so-called light bulb type lamp as the LED lighting device according to the present invention will be described.

1. 1. Overall Configuration The outline of the LED lighting device 1 according to the present embodiment will be described mainly with reference to FIGS. 1 to 3.
The LED lighting device 1 includes an LED module 2 and a power supply circuit unit 3 inside the enclosure 4.
The outer enclosure 4 here is composed of a translucent cover 5, a case body 6, and a base 7. The LED module 2 is located on the translucent cover 5 side, and the power supply circuit unit 3 is located inside the case body 6. The circuit components of the power supply circuit unit 3 are not shown.
The LED lighting device 1 receives AC power, which is a commercial power source, from the base 7 forming a part of the enclosure 4, and if the lighting conditions are met, the LED element 21 is generated by the DC power converted by the power supply circuit unit 3. Lights up (lights up).
The LED lighting device 1 includes a sensor unit 8 that acquires information for turning on and off the LED element 21. The sensor unit 8 includes one or a plurality of sensors 81 and 83 (two in this example). The translucent cover 5 has through holes 5a and 5b for the sensors 81 and 83.
The LED module 2 is attached to the case body 6 in a state of being placed on the base material 9 provided at the end opposite to the base 7 of the case body 6. The LED lighting device 1 has a heat radiating unit that releases heat generated by the LED element 21.

2. Each part configuration (1) LED module The description will be made with reference to FIGS. 4 to 7.
The LED module 2 has one or a plurality of LED elements 21 and an LED substrate 23 on which the LED elements 21 are mounted. The surface of the LED substrate 23 on the side where the LED element 21 is mounted is used as the surface.
In the LED module 2, a part of the peripheral edge of the LED substrate 23 is supported by a module-side support portion 61g of the case body 6 in a state where the back surface of the LED substrate 23 is in contact with the base material 9 (mounted state). It is stopped by a locking piece which is an example of the module side support portion 61g). The LED module 2 is attached to the case body 6 in a state where the peripheral surface of the LED substrate 23 is in contact with the inner surface of the positioning portion 61e of the case body 6.

(1-1) LED element 20 LED elements 21 are mounted here. The LED substrate 23 has a disk shape, and the 20 LED elements 21 are arranged in an annular shape (for example, an annular shape) at equal intervals in the circumferential direction near a peripheral portion of the LED substrate 23.

(1-2) LED board The LED board 23 has an LED side wiring pattern (not shown) for mounting the LED element 21 on the surface. The LED side wiring pattern also has a function of electrically connecting the mounted LED elements 21.
The LED board 23 has a sensor fixing portion 23a for fixing the sensor unit 8. The sensor fixing portion 23a is in a region surrounded by the LED elements 21 arranged in an annular shape on the LED substrate 23. Here, the sensors 81 and 83 are connected to the power supply circuit unit 3 via the LED substrate 23. Therefore, the LED substrate 23 has a sensor-side wiring pattern (not shown) that is electrically connected to the sensors 81 and 83, and a sensor-side connection portion 23b that is connected to the sensors 81 and 83. The sensor signals of the sensors 81 and 83 are sent to the power supply circuit unit 3. Therefore, the sensor-side wiring pattern can be said to be a relay pattern.
The LED board 23 has a power supply side connection portion 23c for connecting the power supply circuit unit 3. The power supply side connection portion 23c includes a connection portion for supplying power to the LED element 21 and a connection portion for a sensor signal, and there are a total of six here (see FIG. 2).
The LED substrate 23 has a sensor fixing portion 23a, a sensor side connecting portion 23b, and a power supply side connecting portion 23c inside a plurality of LED elements 21 mounted in an annular shape.

The sensor fixing portion 23a is formed of a through hole here. That is, it is a through hole for the pair of stretched pieces 853a of the sensor unit 8. The sensor side connection portion 23b is formed of a through hole here. That is, it is a hole formed in the wiring pattern on the sensor side and is a through hole for the lead wires 81b and 83b of the sensors 81 and 83. The power supply side connection portion 23c is formed of a through hole here. That is, it is for the metal pin 55a which is a hole formed in the sensor side wiring pattern and the LED side wiring pattern and extends from the power supply circuit unit 3.
Solder is used for connecting the lead wires 81b and 83b and the metal pin 55a in the sensor side connection portion 23b and the power supply side connection portion 23c. The metal pin 55a has a length such that the tip portion of the metal pin 55a protrudes from the solder in the soldered state.

The LED substrate 23 has a rotation stop 23d for restricting the rotation of the LED module 2 with respect to the case body 6. The rotation stop portion 23d here is composed of a recess that is recessed from the peripheral surface (peripheral end surface) of the LED substrate 23 toward the center. The rotation stop portion 61f of the case body 6 is fitted in the recess. It should be noted that the peripheral surface or the main surface of the LED substrate may be provided with a convex shape, and a concave portion may be provided as a rotation stop portion of the case body so that the two can be fitted to each other.

(2) Sensor unit This will be described mainly with reference to FIG.
The sensor unit 8 includes a plurality of sensors and a support base 85 on which the plurality of sensors are mounted and attached to the LED substrate 23. The plurality of sensors here are for detecting the external environment. Specifically, it is a motion sensor 81 and an illuminance sensor 83. When the periphery of the LED lighting device 1 is dark and a person is detected, the LED lighting device 1 is turned on for a certain period of time.

(2-1) Motion sensor As the motion sensor 81, for example, a pyroelectric infrared type is used. The motion sensor 81 outputs a detection signal when the voltage generated in response to a change in the amount of heat generated by a person changes beyond a specified value. The motion sensor 81 has a sensor body 81a and a lead wire 81b. There are a total of three lead wires 81b, one for power supply, one for grounding, and one for output.

(2-2) Illuminance sensor As the illuminance sensor 83, for example, a photodiode is used. The illuminance sensor 83 applies a voltage that fluctuates according to the light reception. The illuminance sensor 83 has a sensor body 83a and a lead wire 83b. There are a total of two lead wires 83b, one for the power supply and the other for the output.

(2-3) Support base The support base 85 includes a sensor mounting portion 851 for mounting the motion sensor 81 and the illuminance sensor 83, a mounting portion 853 for mounting on the LED board 23, and a sensor mounting portion 851 mounted on the LED board 23. It has a spacer portion 855 for arranging at a position away from the above.

The sensor mounting portion 851 integrally includes a motion sensor mounting portion 851a for mounting the motion sensor 81 and an illuminance sensor mounting portion 851b. The motion sensor mounting portion 851a has a bottomed tubular shape and has a through hole 851c for a lead wire 81b at the bottom. The motion sensor 81 is housed in a bottomed tubular portion and mounted. Therefore, the motion sensor mounting portion 851a functions as a shielding wall that shields the side surface of the sensor body 81a of the motion sensor 81. There are three through holes 851c corresponding to the number of lead wires 81b. The three through holes 851c are provided so as to be at the apex positions of a right triangle.

The illuminance sensor mounting portion 851b has a bottomed tubular shape and has a through hole 851d for the lead wire 83b at the bottom. The illuminance sensor 83 is housed in a bottomed tubular portion and mounted. There are two through holes 851d corresponding to the number of lead wires 83b. In the two through holes 851d, the virtual line segment connecting the two through holes of the three through holes 851c of the motion sensor mounting portion 851a and the virtual line connecting the two through holes 851d are substantially parallel to each other. Is provided in.
The motion sensor 81 is configured to be present at a portion inside (on the base 7 side) from the top of the translucent cover 5, and the illuminance sensor 83 is configured to be present at a portion near the top of the translucent cover 5. There is. Therefore, the illuminance sensor mounting portion 851b is provided so as to extend from the motion sensor mounting portion 851a to the top side of the translucent cover 5. That is, the illuminance sensor mounting portion 851b exists at a position farther from the motion sensor mounting portion 851a with respect to the LED substrate 23.

The spacer portion 855 has a function of filling the space between the sensor mounting portion 851 and the LED substrate 23. The spacer portion 855 is composed of a plate-shaped portion 855a. The plate-shaped portion 855a extends from the bottom of the motion sensor mounting portion 851a and the bottom of the illuminance sensor mounting portion 851b toward the LED substrate 23. The cross-sectional shape of the plate-shaped portion 855a is, for example, a "ju" shape. As a result, the support base 85 can be attached to the LED substrate 23 in a stable state.
One plate portion of the cross plate-shaped portion 583a extends from the bottom wall of the motion sensor mounting portion 851a, and the other plate portion extends from the bottom wall of the motion sensor mounting portion 851a and the bottom wall of the illuminance sensor mounting portion 851b. It is stretched while straddling. One plate portion is used as the short side plate portion, and the other plate portion is used as the long side plate portion.

The intersecting portion of the plate-shaped portion 855a exists on the bottom wall side of the motion sensor mounting portion 851a when viewed from the LED substrate 23 side. The cross-shaped plate-shaped portion 855a is provided so that two or more of the three through holes 851c of the motion sensor mounting portion 851a do not overlap in the four regions separated by the cross. That is, the two through holes 851c located on one of the adjacent sides of the right triangle sandwich the right angle sandwich the one plate portion of the cross, and the two through holes 851c located on the other side sandwich the right angle. The plate-shaped portion 855a is provided so as to sandwich the other plate portion of the cross. This makes it possible to prevent the three lead wires 81b from coming into contact with each other. The long side plate portion of the plate-shaped portion 855a is located between the two through holes 851d of the illuminance sensor mounting portion 851b. This makes it possible to prevent the two lead wires 83b from coming into contact with each other.
A groove 851f facing the LED substrate 23 side is provided in a portion of the long side plate portion corresponding to the two through holes 851d. The groove 851f is configured by utilizing a pair of protruding portions provided on a surface orthogonal to the thickness direction of the long side plate portion. As a result, the two lead wires 83b are protected by the protruding portion.

The mounting portion 853 is composed of a pair of stretched pieces 853a extending from the spacer portion 855 to the side opposite to the sensor mounting portion 851. The attachment portion 853 has a locking portion 853b that protrudes from a surface that is the extension tip of the extension piece 853a and does not face the other extension piece 853a to the side where the other extension piece 853a does not exist. The pair of stretched pieces 853a are configured to be elastically deformable in the direction in which they are close to each other. The elastic deformation is carried out by providing a groove 853c in which the inner portion of the pair of stretched pieces 853a is recessed in the spacer portion 855 from the end surface opposite to the sensor mounting portion 851 to the sensor mounting portion 851 side. When the pair of stretched pieces 853a are elastically deformed and the locking portion 853b passes through the through hole which is the sensor fixing portion 23a of the LED substrate 23, the locking portion 853b engages with the LED substrate 23. In this state, the support base 85 comes into contact with the LED substrate 23 at the spacer portion 855 and the locking portion 853b.

(3) Power Supply Circuit Unit This will be described mainly with reference to FIGS. 2, 5, and 9.
The power supply circuit unit 3 includes a power supply circuit 35 for generating electric power for the LED element 21 from AC power. The power supply circuit unit 3 is composed of a plurality of circuit components, a circuit board 31 on which the circuit components are mounted, and a connection unit 33 for connecting to the LED module 2. The circuit components are not shown.

(3-1) Power Supply Circuit This will be described with reference to FIG.
The power supply circuit 35 includes a rectifier circuit unit 351, a smoothing circuit unit 353, a power generation unit 355, and a control unit 357.
The rectifier circuit unit 351 is a circuit that rectifies commercial power, and for example, a diode bridge is used. The smoothing circuit unit 353 is a circuit for smoothing rectified DC power, and for example, a capacitor is used. The power generation unit 355 generates power for the LED element 21 from the smoothed DC power, and for example, a step-down circuit is used.

The control unit 357 controls turning on / off of the LED module 2. That is, the control unit 357 lights the LED module 2 when a predetermined condition is met. The conditions here are the presence of a person and the illuminance. Specifically, the control unit 357 instructs the power generation unit 355 to generate electric power to be output to the LED module 2 when the illuminance sensor 83 detects a predetermined darkness and the motion sensor 81 detects a person. When the motion sensor 81 stops detecting a person, the power generation unit 355 is instructed to stop generating electric power. As a result, power saving can be achieved. The control unit 357 uses, for example, an IC chip in which a program is incorporated in advance.

The control unit 357 controls dimming / brightening while the LED module 2 is lit. That is, the control unit 357 changes the amount of light emitted from the LED module 2 under a predetermined condition. The condition here is the temperature around the LED element 21, and when the temperature rises, the light is dimmed, and when the temperature drops during the dimming, the light is brightened (returned to before dimming). The amount of light is changed by increasing or decreasing the power supplied to the LED module 2.

Dimming / brightening will be described with reference to FIGS. 10 and 11.
The power supply circuit 35 includes a temperature sensor 358. As the temperature sensor 358, for example, a polymer-based PTC thermistor can be used. Here, as shown in FIG. 11, a plurality of (three in this case) detection resistors 360a, 360b, 360c are connected in parallel, and the detection resistors 360a, 360b, 360c connected in parallel are connected. A PTC thermistor (358) is connected in series to at least one detection resistor 360a (this circuit is referred to as a detection circuit 360). The control unit 357 is connected in series with the detection circuit 360 and monitors the change in the voltage of the detection circuit 360. The change in the current of the detection circuit 360 may be monitored.

That is, as the temperature rises, the resistance value of the PTC thermistor (358) rises, and the resistance of the detection circuit 360 also rises. When the control unit 357 detects an increase in the voltage of the detection circuit 360, the control unit 357 instructs the power generation unit 355 to lower the power value output to the LED module 2. When the LED module 2 is lit with low power, the temperature of the LED element 21 will be lowered soon. When the resistance value of the PTC thermistor (358) decreases due to the temperature decrease of the LED element 21, the resistance of the detection circuit 360 also decreases. When the control unit 357 detects a voltage drop in the detection circuit 360, the control unit 357 instructs the power generation unit 355 to increase (return) the power value output to the LED module 2.

By using a polymer system as the temperature sensor 358, the resistance change can be digitally detected as "0" or "1", and the temperature change of the object can be reliably detected. Further, although the detection circuit includes three detection resistors in parallel, the number of parallel resistors may be a plurality, may be two, or may be four or more.

The power supply circuit 35 has a drive power generation unit 359 that generates drive power for driving the motion sensor 81 and the illuminance sensor 83. The drive power generation unit 359 supplies the drive power independently of the power generation unit 355 for the LED module 2.

(3-2) Circuit Board This will be described mainly with reference to FIG.
The circuit board 31 has a wiring pattern for connecting a plurality of circuit components so as to form the power supply circuit 35. The circuit board 31 has a shape close to a long trapezoid.
The circuit components for the power supply circuit 35 are mounted on the circuit board 31, but the motion sensor 81 and the illuminance sensor 83 are mounted on the LED substrate 23, and the signals between the motion sensor 81 and the illuminance sensor 83 are the LED substrate 23. Is sent to the control unit 357 via the circuit board 31 and the circuit board 31.
The temperature sensor 358 has a main body and a lead wire (not shown), and the lead wire is connected to the circuit board 31 in a state where the main body is in contact with the LED substrate 23.

The circuit board 31 is arranged in the case body 6 so that its longitudinal direction is parallel to the central axis of the case body 6. The shorter base (shorter width side) of the circuit board 31 is located on the base 7 side. The circuit board 31 is inserted into a pair of grooves in which both ends in the width direction (short direction) of the end portion on the base 7 side are an example of the unit support portion 61p of the case body 6. As a result, the movement of the circuit board 31 in the thickness direction of the substrate is restricted.

The connection portion 33 is provided at the end of the circuit board 31 on the LED module 2 side, and is electrically connected to the wiring pattern of the circuit board 31. The metal pin 33a extends from the connecting portion 33 so that the tip side extends to the translucent cover 5 side through the LED module 2. There are six metal pins 33a, which are provided at intervals.

(4) Outer Encloser The outer enclosure 4 is provided with a tubular case body 6 and one end of the case body 6 in the central axis direction (the side from which light is emitted from the LED element 21). It is composed of a sex cover 5 and a base 7 provided at the other end of the case body 6 in the central axis direction.

(4-1) Translucent cover This will be described mainly with reference to FIGS. 2, 3 and 12.
The translucent cover 5 covers the LED module 2 and transmits and emits the light emitted from the LED module 2. The translucent cover 5 has a main body portion 5c having a shape (for example, a hemispherical shell shape) such that a hollow sphere is cut in a plane.
The translucent cover 5 is made of, for example, a translucent resin material. If necessary, the translucent cover 5 may have diffusion particles mixed in the resin material, or may be subjected to diffusion treatment on the inner peripheral surface and the outer peripheral surface.

The translucent cover 5 has through holes 5a and 5b for the sensors 81 and 83 in the main body 5c. Here, the two sensors 81 and 83 have dedicated through holes 5a and 5b, respectively, and there are a total of two through holes. The through holes 5a and 5b are located at the top of the translucent cover 5 opposite to the opening side. The through holes 5a and 5b have a circular shape when the translucent cover 5 is viewed from the top side. A part of the motion sensor 81 and the illuminance sensor 83 is exposed on the front side through the through holes 5a and 5b.

The translucent cover 5 has a tubular portion 5d extending from the opening edge of the through hole 5a to the opening side end portion of the main body portion 5c in the main body portion 5c. The tubular portion 5d has a truncated cone shape in which the top side of the tubular portion 5d is widened to the top side in order to widen the sensing area of the sensor 81. The case body 6 side portion of the tubular portion 5d abuts on the outer peripheral surface of the sensor 81. As a result, it is possible to suppress the intrusion of moisture and the like from between the sensor 81 and the through hole 5a.
The through hole 5b is adjacent to the through hole 5a, and a part of the tubular portion 5d on the outer peripheral surface side is missing for the through hole 5b. As a result, the area for providing the through holes 5a and 5b for the sensors 81 and 83 can be reduced, and the light emitted from the LED module 2 can be reduced from being blocked by the through holes 5a and 5b.

The translucent cover 5 has a positioning portion 5f for positioning with respect to the case main body 6 at the opening side end portion of the main body portion 5c. The translucent cover 5 has a joint portion 5 g for coupling with the case main body 6 at the opening side end portion of the main body portion 5c. The translucent cover 5 has a rotation stop portion 5h at the opening side end portion of the main body portion 5c so as not to rotate with respect to the case main body 6.
Here, the positioning portion 5f is composed of a protruding portion protruding from the opening side end surface of the main body portion 5c. The protruding portion is fitted in the open end portion on the translucent cover 5 side of the case body 6. The protruding portion has a tubular shape (cylindrical shape according to the shape of the case body 6), but may protrude in an arc shape at intervals in the circumferential direction. To be precise, since the protruding portion (positioning portion 5f) is the rotation stop portion 5h, a part of the cylindrical shape in the circumferential direction is missing.

The connecting portion 5g is composed of a convex portion protruding outward in the radial direction from the outer peripheral surface of the tubular portion constituting the positioning portion 5f. The convex portion engages with the joint portion 61a of the opening end portion on the translucent cover 5 side of the case body 6. The convex portion functions as an engaging convex portion. The convex portions are continuously present in a part of the outer peripheral region, but may be present in the entire outer peripheral portion of the tubular portion, or may be a plurality of convex portions at intervals in the circumferential direction.
The rotation stop portion 5h is formed by a recess provided in a part of the protruding portion constituting the positioning portion 5f. A rotation stop 61c at the opening end of the case body 6 on the translucent cover 5 side is fitted in the recess. Although one dent exists in the positioning portion 5f, a plurality of dents may be present at intervals in the circumferential direction.

In the translucent cover 5, the positioning portion 5f is in contact with the inner peripheral surface of the translucent glove 5 side end portion of the case body 6, and the joint portion 5g is the joint portion of the translucent glove 5 side end portion of the case body 6. In a state of being engaged with 61a, it is attached to the case body 6 by using, for example, an adhesive.

(4-2) Case Main Body FIGS. 4 to 7 and 13 to 15 will be described.
The case body 6 has a tubular shape. The case body 6 has a function of releasing the heat of the LED module 2. Specifically, the case body 6 is composed of a resin case 61 made of a resin material and a metal case 63 made of a metal material. The metal case 63 is provided on the inner peripheral side of the resin case 61 and is in close contact with the resin case 61. positioned. That is, the resin case 61 and the metal case 63 are integrated. For example, insert molding is used for integration, but it may be fixed with an adhesive or the like. Even when the adhesive is interposed between the resin case and the metal case, it is assumed that the resin case and the metal case are in close contact with each other.

(4-2-1) Resin Case This will be described with reference to FIGS. 14 and 15.
The resin case 61 has a tubular shape that becomes thicker as it moves from the base 7 side to the translucent cover 5 side. Specifically, the thickness of the resin case 61 is substantially constant, and the outer peripheral surface of the resin case 61 has a concave arc shape on the central axis side.
The resin case 61 has a connecting portion 61a for connecting the translucent cover 5 at the end on the translucent cover 5 side. The resin case 61 has a positioning portion 61b for positioning the translucent cover 5 at the end on the opening side. The resin case 61 has a rotation stop 61c at the end on the opening side to prevent the translucent cover 5 from rotating.

The connecting portion 61a is composed of a protruding portion protruding from the opening side end toward the central axis. There are a plurality of protrusions, and here, three protrusions are present at equal intervals in the circumferential direction. The protruding portion engages with the joint portion 5g of the translucent cover 5.
The positioning portion 61b is composed of a thick portion that protrudes from the inner peripheral surface of the opening side end toward the central axis and becomes thicker. When the translucent cover 5 is attached to the resin case 61, the inner peripheral surface of the thick portion comes into contact with the outer peripheral surface of the positioning portion (convex portion) 5f of the translucent cover 5 (FIG. 6). And FIG. 7). The inner surface of the opening side end of the positioning portion 61b is an inclined surface. As a result, the translucent cover 5 can be easily attached.
The rotation stop portion 61c is composed of a convex portion provided on the inner peripheral surface of the opening side end portion. The convex portion is composed of a pair of rib portions. The pair of rib portions are fitted with the rotation stop portion (recess) 5h of the translucent cover 5. The circumferential outer dimension between the pair of rib portions coincides with the circumferential inner dimension of the recess of the translucent cover 5. As a result, rattling in the circumferential direction can be reduced.

The case body 6 accommodates and fixes the base material 9. Therefore, the resin case 61 has a fixing portion 61d for fixing the base material 9. The fixing portion 61d here is provided on the translucent cover 5 side of the resin case 61. The case body 6 has a positioning portion 61e for positioning the base material 9 to be accommodated on the translucent cover 5 side. The case body 6 has a rotation stop portion 61f on the translucent cover 5 side to prevent the base material 9 and the LED module 2 from rotating.
The fixing portion 61d includes a module side support portion 61g that supports the surface of the base material 9 on the LED module 2 side and a base side support portion 61h that supports the surface of the base material 9 opposite to the LED module 2 (base 7 side). And have.
The module-side support portion 61g is composed of locking pieces provided on the inner peripheral surface of the resin case 61. The locking piece has an engaging portion that engages with the peripheral edge of the LED substrate 23 on the side surface opposite to the base material 9 in a state where the LED module 2 is placed on the base material 9. A plurality of locking pieces are provided at intervals in the circumferential direction, and here, three are provided.

The base side support portion 61h is composed of a flange portion protruding from the inner peripheral surface of the resin case 61 toward the central axis. The flange portion abuts on the end surface of the metal case 63 on the side of the translucent cover 5.
The positioning portion 61e is composed of a stretched portion extending parallel to the direction in which the central axis extends from the resin case 61. Here, there are a plurality of stretched portions, which are stretched in a plate shape and are spaced apart in the circumferential direction, and here there are six. The stretched portion is configured to abut on the outer peripheral surface of the base material 9 and the outer peripheral surface of the LED substrate 23. Here, the base material 9 and the LED substrate 23 have a circular outer peripheral shape when viewed from the translucent cover 5 side, and the plate-shaped stretched portion is circular when viewed from the translucent cover 5 side. It has an arc shape. The module-side support portion 61g is provided between the positioning portions 61e.
As shown in FIG. 4, the rotation stop portion 61f is composed of a rotation stop portion 9e of the base material 9 and a protruding portion protruding so as to fit into the rotation stop portion 23d of the LED substrate 23. The protruding portion here is formed in a ridge (rib shape) extending in parallel with the central axis of the resin case 61.

The resin case 61 has a base fixing portion for fixing the base 7 at the end on the base 7 side. The resin case 61 has a straight tubular tubular portion 61k at the end on the base 7 side and a region from the end of the tubular portion 61k on the translucent cover 5 side to the edge of the resin case 61 on the translucent cover 5 side. It has an enlarged diameter tubular portion 61 m provided over the entire surface. There is a step between the tubular portion 61k and the enlarged diameter tubular portion 61m.
The base fixing portion is provided on the tubular portion 61k. Here, an E type (screw-in type) is used as the base 7, and the base fixing portion is composed of male screws 61n provided on the outer circumference of the tubular portion 61k. The male screw 61n is screwed with the female screw of the shell portion 71 of the base 7.

The resin case 61 has a unit support portion 61p that supports the power supply circuit unit 3 to be housed. The unit support portion 61p supports the circuit board 31 from both sides in the thickness direction. Specifically, it is composed of a pair of grooves into which both ends of the circuit board 31 in the width direction are inserted.
The resin case 61 has an inner flange portion 61q extending from the base side end portion of the tubular portion 61k toward the central axis. The groove is provided so as to extend in parallel with the central axis across the tubular portion 61k and the inner flange portion 61q. As shown in FIG. 13, the groove which is the unit support portion 61p is provided at two portions which are deviated (eccentric) from the central axis of the tubular portion 61k and which face each other. The groove insertion port side of the tubular portion 61k is an inclined surface 61r in which the groove becomes larger as it moves to the translucent cover 5 side.

(4-2-2) Metal Case The metal case 63 is provided along the enlarged diameter tubular portion 61 m of the resin case 61. The metal case 63 has a substantially constant thickness and increases in diameter as it moves from the base 7 side to the translucent cover 5 side. The cross-sectional shape of the metal case 63 is an annular shape. The outer peripheral surface of the metal case 63 has a concave arc shape on the central axis side.
The contact surface of the base material 9 with the metal case 63 and the contact surface of the metal case 63 with the base material 9 are outward on the central axis of the metal case 63 as they approach one end (the LED module 2 side). It is tilted in a spread state.

(4-3) Base The description will be made with reference to FIGS. 1 to 3.
The base 7 has the same configuration as the base used for a conventional light bulb, has a shell portion 71 and an eyelet portion 73, and the eyelet portion 73 is attached to the shell portion 71 via an insulating portion 75. A female screw is formed in the shell portion 71, and is screwed into the male screw 61n of the tubular portion 61k of the case body 6.

(5) Base Material This will be described with reference to FIGS. 2 to 7.
The base material 9 has an annular shape having a through hole 91 in the center. The annular shape here has a shape similar to an annular shape when viewed from the translucent cover 5 side. The cross section (cross section orthogonal to the circumferential direction) of the base material 9 is a quadrangle whose corners are chamfered and located on the base 7 side and on the outer peripheral side. The base material 9 is made of a metal material.
The circuit board 31 is arranged inside the base material 9 (the area surrounded by the inner peripheral surface). As shown in FIGS. 2 and 3, the circuit board 31 is arranged at a position away from the central axis of the case body 6. The inner peripheral surface of the base material 9 has a recess 9a recessed on the outer peripheral side for arranging the circuit board 31. The recess 9a is provided so as to be recessed in a portion away from the central axis and opposite to the facing direction. The virtual line connecting the two recesses 9a does not pass through the center of the annular base material 9 and is off-center.

As shown in FIGS. 4 to 7, the outer peripheral surface of the base material 9 is formed on the inner peripheral surface of the positioning portion 61e of the case body 6, the support portion 61h on the base side, and the end portion of the metal case 63 on the translucent cover 5 side. Contact. That is, as shown in FIG. 6, the outer peripheral surface of the base material 9 approaches the central axis as it moves from the step portion 9b recessed in the central axis direction and the base 7 side end to the base 7 side in the step portion 9b. It has an inclined portion 9c.
The inner peripheral surface of the base material 9 has an inclined surface 9d at the end on the base 7 side. The inclined surface 9d is inclined so as to move away from the central axis as the direction parallel to the central axis moves from the central position to the base 7 side. As a result, a sufficient insulation distance can be secured between the base material 9 and the circuit board 31.
The base material 9 has a rotation stop portion 9e with respect to the case body 6 on the outer peripheral surface. The rotation stop portion 9e here is composed of a recess that is recessed from the outer peripheral surface toward the center. The rotation stop portion 61f of the case body 6 is fitted in the recess.

3. 3. Assembly The characteristic parts of the assembly of the LED lighting device 1 will be described.
The LED lighting device 1 includes an integration process in which the sensor unit 8, the LED module 2, and the power supply circuit unit 3 are integrated into an integrated unit, and an integrated unit assembly in which the integrated unit is incorporated into the case body 6 with the base material 9. After performing the loading process, the base connection step of electrically connecting the power supply circuit unit 3 and the base 7 incorporated by attaching the base to the case body 6 and the translucent cover 5 are attached to the case body 6. Perform the process of attaching the translucent cover. Either the base connection step or the translucent cover mounting step may be performed first.

(1) Integration Step In the integration step, a sensor coupling step of connecting the sensor unit 8 and the LED module 2 and a module coupling step of coupling the power supply circuit unit 3 and the LED module 2 are performed. Either the sensor coupling step or the module coupling step may be performed first.
In the sensor coupling step, after mounting the sensor unit 8 on the LED board 23 of the LED module 2, the mounted sensor unit 8 and the LED board 23 are electrically connected. Solder is used here. As a result, the sensor unit 8 can be easily coupled. In particular, since the spacer portion 855 of the sensor unit 8 is composed of the cross-shaped plate-shaped portion 855a, the support base 85 can be attached to the LED substrate 23 in a stable state. Further, since the cross-shaped plate-shaped portion 855a is provided so that the three lead wires 81b of the motion sensor 81 and the two lead wires 83b of the illuminance sensor 83 do not come into contact with each other, they are electrically connected. Can be easily performed.
In the module coupling step, the connection portion 33 of the circuit board 31 and the power supply side connection portion 23c of the LED board 23 are connected to connect the two. That is, in the module coupling step, the metal pins 33a provided on the circuit board 31 are connected and fixed by solder in a state of being inserted into the power supply side connection portion 23c (through hole) of the LED board 23. As a result, the circuit board 31 and the LED board 23 can be easily and efficiently coupled.
Further, since there are three or more metal pins 33a, the LED module 2 and the power supply circuit unit 3 can be firmly connected even if solder is used to connect the metal pins 33a. Here, there are six metal pins 33a, which are actually electrically connected. However, for example, a metal pin for the purpose of mechanical connection (not electrically connected) may be included.

(2) Integrated unit assembly process In the integrated unit assembly process, the power supply circuit unit 3 is inserted through the through hole in the center of the base material 9 attached to the case body 6, and the LED substrate 23 is transparent to the base material 9. It is brought into contact with the surface on the light cover 5 side. As a result, the locking piece, which is an example of the module-side support portion 61g of the case body 6, is elastically deformed and locked to the surface of the LED substrate 23 opposite to the base material 9. In this way, the integrated unit can be easily incorporated into the case body 6.
At this time, since the base material 9 has a recess 9a on the inner circumference according to the size (width) of the circuit board 31, even if the circuit board 31 has a size that secures an area for mounting circuit components. , The passage of the circuit board 31 is allowed. Further, since the virtual line segment connecting the two recesses 9a is formed so as not to pass through the center of the annular base material 9 (off the center), the circuit board 31 is placed on the central axis of the case body 6. The distance between the circuit board 31 and the case body 6 is larger than that of the arrangement, and the circuit components mounted on the circuit board 31 are allowed to pass through.

4. When lit The LED lighting device 1 has a heat release function (heat dissipation unit) because it generates heat when the LED module 2 is lit. The heat generated by the LED module 2 (LED element 21) is transferred from the LED substrate 23 to the base material 9 and then to the case body 6 via the base material 9.
A part of the heat transferred to the base material 9 is released to the inside of the case body 6, and the temperature inside the case body 6 rises. That is, the heat radiating portion is composed of at least the base material 9. Since the metal case 63 of the case body 6 is in contact (heat connection) with the base material 9, the temperature of the metal case 63 rises due to the heat transferred from the base material 9, and heat is dissipated to the inside of the case body 6. .. A part of the heat of the case body 6 is conducted to the resin case 61 and radiated to the outside from the resin case 61. That is, the heat radiating portion is composed of the metal case 63 and the resin case 61 in addition to the base material 9.
When the temperature inside the case body 6 rises in this way, the circuit board 31 is affected by the heat. In addition, the circuit components constituting the power supply circuit 35 include components that generate excessive heat. Therefore, the circuit board 31 expands under the influence of heat.
At this time, the circuit board 31 is housed in the case main body 6 in a state where the end portion on the base 7 side in the longitudinal direction does not come into contact with the resin case 61. Therefore, even if the circuit board 31 expands in the longitudinal direction due to heat, the end portion of the circuit board 31 in the longitudinal direction does not come into contact with the case body 6. In particular, when solder fixing of the metal pin 33a is used to bond the LED board 23 and the circuit board 31, if the stretching direction of the metal pin 33a and the expanding direction of the circuit board 31 match, the solder is bonded. It may come off. However, since the end portion (end portion on the base 7 side) in the longitudinal direction that coincides with the stretching direction of the metal pin 33a on the circuit board 31 is not constrained, the bond between the metal pin 33a and the solder is disengaged due to thermal expansion. There is no such thing.

Although the embodiments have been described above, the embodiments are not limited to these embodiments, and for example, the following modifications may be used. Further, the embodiment, the modified example, and the modified example may be combined.
Further, even if there is an example not described in the embodiment or the modified example, or a design change within a range not deviating from the gist, the present invention is included.

<Modification example>
1. 1. In the LED lighting device embodiment, the light bulb type lamp has been described as an example of the LED lighting device, but other types of devices may be used. For example, it may be a ceiling type, a straight tube type, a spot type, or the like in which the lighting of the LED element is controlled by a remote controller.

2. Outer enclosure (1) configuration When the LED lighting device is a light bulb type lamp, the outer enclosure 4 of the embodiment is composed of three members, a translucent cover 5, a case body 6, and a base 7. For example, it may be composed of four members of a translucent cover, a case body, a base support member, and a base, or may be composed of five or more members.

(2) Case body The case body may or may not have a fin portion on the outer circumference. The case body is composed of a resin case and a metal case, but may have a structure that does not have a metal case. In this case, the heat radiating portion is composed of a base material and a case body (resin case).
From the viewpoint of releasing heat when the LED element emits light, it is preferable to have a metal case that is thermally connected to the base material. In this case, the heat radiating portion is composed of a base material and a case body (including a resin case and a metal case).
Most of the inner peripheral surface of the metal case 63 of the embodiment is exposed, but for example, an insulating paint may be applied to the inner peripheral surface of the metal case, or an insulating sheet may be attached.
The resin case 61 of the embodiment has an inner collar portion 61q at the end on the base 7 side, but does not have to have the inner collar portion.

(3) Translucent cover Although the light diffusing function is not described for the translucent cover 5 of the embodiment, it may have a light diffusing function. In the light diffusion function, diffusion particles may be mixed in the resin material constituting the translucent cover, or unevenness may be provided on at least one of the inner peripheral surface and the outer peripheral surface by embossing or blasting.
The translucent cover 5 of the embodiment has the human sensor 81 and the through holes 5a and 5b for the illuminance sensor 83. For example, a sensor such as a light receiving sensor that receives a signal for remote control operation is translucent. When arranged in the cover, it does not have to have a through hole.

The translucent cover 5 of the embodiment has two independent through holes 5a and 5b for the motion sensor 81 and the illuminance sensor 83, but a plurality of (two in the embodiment) sensors. The through hole may be configured by one. Hereinafter, the LED lighting device 1001 in which one through hole 1005a is provided in the translucent cover 1005 will be described with reference to FIG.
The translucent cover 1005 has a through hole 1005a for a sensor in the main body 1005c. Here, two sensors, a motion sensor 81 and an illuminance sensor 83, are used. The through hole 1005a has a human sensor area for the motion sensor 81 and an illuminance area for the illuminance sensor 83. The through hole 1005a has a gourd shape in a plan view, and a portion having a wide opening area is a human sensation region and a portion having a narrow opening area is an illuminance region. In the translucent cover 1005, the portion around the opening (the portion facing the opening) of the through hole 1005a in the main body portion 1005c is a thick portion 1005d. The thick portion 1005d is composed of a tubular portion that extends inward, and the inner end (stretched tip) of the thick portion 1005d is parallel to the plane orthogonal to the central axis of the case body 6 and becomes flush with each other. There is.

The sensor unit 1008 includes a motion sensor 81, an illuminance sensor 83, and a support base 1085 on which the motion sensor 81 and the illuminance sensor 83 are mounted and attached to the LED substrate 23. The support base 1085 arranges the sensor mounting portion 1851 for mounting the motion sensor 81 and the illuminance sensor 83, the mounting portion 853 for mounting on the LED board 23, and the sensor mounting portion 851 at positions away from the LED board 23. It has a spacer portion 855 for the purpose. Since the motion sensor 81, the illuminance sensor 83, the LED module 2, the mounting portion 853 and the spacer portion 855 of the sensor unit 1008 have the same configuration as that of the embodiment, the description thereof will be omitted.
The sensor mounting unit 1851 integrally includes a motion sensor mounting unit 1851a for mounting the motion sensor 81 and an illuminance sensor mounting unit 1851b for mounting the illuminance sensor 83. The motion sensor mounting portion 1851a has a bottomed tubular shape and has a through hole (see FIG. 8) for a lead wire of the motion sensor 81 at the bottom. The motion sensor 81 is housed in a bottomed tubular portion and mounted.
The illuminance sensor mounting portion 1851b has a bottomed tubular shape and has a through hole (see FIG. 8) for a lead wire of the illuminance sensor 83 at the bottom. The illuminance sensor 83 is housed in a bottomed tubular portion and mounted.

The tip portions of the motion sensor 81 and the illuminance sensor 83 are arranged so as to project from the through hole 1005a of the translucent cover 1005 or to enter a little. Since the illuminance sensor 83 is smaller than the motion sensor 81, the illuminance sensor mounting portion 1851b is provided in the cylinder portion of the motion sensor mounting portion 1851a, and the plan view of the outer peripheral shape of the sensor mounting portion 1851 is the translucent cover 1005. It has the same shape (gourd shape) as the through hole 1005a.
The tip ends of the cylinders of the motion sensor mounting portion 1851a and the illuminance sensor mounting portion 1851b reach the vicinity of the opening edge of the through hole 1005a. The portion constituting the outer peripheral wall of the sensor mounting portion 1851 is a fitting portion 1851c that fits with the thick portion 1005d around the through hole 1005a of the translucent cover 1005. The fitting portion 1851c is a tubular portion of the motion sensor mounting portion 1851a and the illuminance sensor mounting portion 1851b, and is a step in which the outer peripheral side is missing in a portion constituting the outer peripheral shape of the sensor mounting portion 1851. The thick portion 1005d comes into contact (fitting) with the portion.

The support base 1085 is made of a non-transmissive resin, and the tip of the cylinder of the motion sensor mounting portion 1851a and the illuminance sensor mounting portion 1851b reaches the vicinity of the opening edge of the through hole 1005a, so that the motion sensor 81 and the illuminance It is possible to prevent light that becomes noise from entering the sensor 83 (it has a light-shielding function).
The fitting portion 1851c of the sensor mounting portion 1851 may be provided so as to be internally fitted to the thick portion 1005d of the through hole 1005a of the translucent cover 1005.

3. 3. Base material The base material 9 has a shape close to a circular shape, and has a through hole 91 having two recesses 9a recessed from a portion of the circumferential surface to the side opposite to the center. However, the shape of the through hole does not have to be close to a circular shape as long as it can pass through the power supply circuit unit 3, may have one recess, or has two recesses. It may be a shape that does not.
From the viewpoint of heat conduction of the LED module 2 at the time of light emission, it is preferable that the back side portion of the LED element 21 in the LED substrate 23 is formed as a base material 9. From the viewpoint of reducing the weight of the base material 9, it is preferable to increase the through hole. In this example, the LED element 21 is arranged in an annular shape on the LED substrate 23, is annular so as to support the back side portion of the LED element 21 in the LED substrate 23 and secure the heat capacity, and mounts a tall circuit component. The base material 9 has two recesses 9a so that the circuit unit 3 can easily pass through.
Further, the base material 9 has a through hole 91 that allows the power supply circuit unit 3 to pass through, but at least has a through hole for electrically connecting the LED board and the circuit board. It is not necessary to have a hole through which the power supply circuit unit 3 can pass. In this case, the base material may be attached after the power supply circuit unit is housed in the case body.
4. Power supply circuit unit (1) Control unit The power supply circuit 35 receives signals from the motion sensor 81 and the illuminance sensor 83, and instructs the power generation unit 355 to generate electric power to be supplied to the LED element 21. It has 357. However, the power supply circuit only needs to be able to control the light emission of the LED element according to the signals of the motion sensor 81 and the illuminance sensor 83, and the control thereof is not particularly limited. For example, the power supply circuit includes a control unit configured to generate electric power to be supplied to the LED element and to supply electric power to the LED element when the signal of the motion sensor or the illuminance sensor satisfies the lighting condition. You may.
The control unit 357 receives signals from the motion sensor 81 and the illuminance sensor 83. However, the power supply circuit only needs to be able to control the lighting of the LED element based on the signals of the human sensor and the illuminance sensor. For example, when the signals of the human sensor 81 and the illuminance sensor 83 are received and both signals are "ON". A separate circuit that outputs an "ON" signal to the control unit may be provided.
The control unit 357 controls turning on / off by signals from the motion sensor 81 and the illuminance sensor 83. For example, the light is dimmed when the motion sensor 81 stops detecting a person, and the light is turned off after a predetermined time. It may be controlled to do so. Further, the control unit controls to turn on the illuminance sensor 83 in a dimmed state when it becomes a predetermined darkness, brighten the light when the motion sensor 81 detects a person, and return to the dimmed state when the person is no longer detected. You may.

(2) Temperature sensor The temperature sensor 358 of the embodiment uses a polymer type whose resistance changes significantly when the threshold temperature is reached. When the control unit 357 receives this signal, the control unit 357 reduces the power supplied to the LED element 21. However, the temperature sensor may use a thermistor whose resistance changes with the temperature change, and may change the electric power supplied to the LED element with the temperature change.
The main body of the temperature sensor 358 is provided in contact with the LED substrate 23. However, the temperature sensor only needs to be able to directly or indirectly measure the temperature of a target part or member such as an LED element or a circuit component constituting a power supply circuit, and the arrangement part is not limited to the LED substrate. The main body of the temperature sensor may be provided on, for example, a base material, a metal case, a circuit board, or the like. Further, the lead wire of the temperature sensor may be connected to the LED substrate.

(3) Others The power supply circuit 35 of the embodiment is configured to light up when a person is detected in a dark state. However, when the human detection signal disappears, the light may be turned off immediately or after a predetermined time has elapsed. The control unit may include, for example, a counter, and may start the counter to count when there is no human detection signal. Further, the control unit may turn off the light when, for example, the electric charge charged in the capacitor is discharged.
The circuit board 31 of the embodiment is arranged so as to reach the vicinity of the LED board 23. As a result, the mounting area of the circuit component can be increased. When the number of circuit parts is small, it is not necessary to arrange the circuit board in a state close to the LED board.

5. Sensor unit (1) Sensor The motion sensor 81 and the illuminance sensor 83 of the embodiment are provided on the LED board 23, but one of them may be provided on the LED board depending on the purpose of use of the LED lighting device. Another sensor may also be provided. Other sensors include, for example, a light receiving sensor that receives a signal for operating a remote controller. Further, for example, the lead wire of the temperature sensor may be connected to the LED substrate.
(2) Spacer portion The spacer portion 855 of the embodiment is composed of a cross-shaped plate-shaped portion 855a, but may have another shape. Other shapes include a cylindrical portion extending from the bottom wall of the motion sensor mounting portion 851a toward the LED substrate 23, and a cylindrical portion extending from the bottom wall of the illuminance sensor mounting portion 851b toward the LED substrate 23. It may be composed of, or it may be composed of a connecting portion that connects two columnar portions. The columnar portion preferably has a groove for a lead wire.
From the viewpoint of weight reduction and stability during placement, a cross-shaped plate-shaped portion is preferable. Further, from the viewpoint of contact (insulation) between the lead wires 81b and 83b of the motion sensor 81 and the illuminance sensor 83, it is preferable that the lead wires are arranged on both sides in the thickness direction of the plate-shaped portion.

1 LED lighting device 2 LED module 3 Power supply circuit unit 4 Encloser 8 Sensor unit 9 Base material (heat dissipation part)
21 LED element 23 LED board 81 Human sensor 83 Illuminance sensor 85 Support base 357 Control unit

Claims (3)

A sensor having a sensor body and a lead wire,
A support base that supports the sensor and
Multiple LED elements as light sources and
An LED substrate on which the plurality of LED elements are mounted in a ring shape,
It is provided with a control unit that controls the light emission of the LED element based on the signal output from the sensor.
The support base
The sensor mounting part that mounts the sensor and
It has a plate-shaped portion extending from the bottom of the sensor mounting portion and mounted in a region surrounded by the plurality of LED elements in the LED substrate.
The sensor mounting portion has a through hole at the bottom through which the lead wire penetrates.
The plate-shaped portion is an LED lighting device provided so as not to overlap with the through hole. The sensor consists of a motion sensor.
The LED lighting device according to claim 1, wherein the sensor mounting portion includes a motion sensor mounting portion for mounting the motion sensor. The sensor consists of an illuminance sensor.
The LED lighting device according to claim 1, wherein the sensor mounting portion includes an illuminance sensor mounting portion for mounting the illuminance sensor.

Images