JP2020167276A - Method for manufacturing electronic device - Google Patents

Abstract

To provide a method for manufacturing an electronic device capable of stably obtaining an electronic device with suppressed entry of water into an electronic component.SOLUTION: A method for manufacturing an electronic device includes: a step (A) of preparing a structure 50 comprising an electronic component 10 including an opening 15 of a first surface 10A, a first adhesive film 20 stuck to the first surface 10A of the electronic component 10 so as to cover the opening 15 and including a first adhesive resin layer whose adhesive force lowers due to external stimulation, and a second adhesive film 30 stuck to a second surface 10B of the electronic component 10 and including a second adhesive resin layer whose adhesive force lowers due to external stimulation; a step (B) of dicing the electronic component 10 together with the first adhesive film 20 while being stuck to the first adhesive film 20 and the second adhesive film 30; and a step (C) of lowering the adhesive force of the first adhesive resin layer by applying external stimulation and peeling the first adhesive film 20 from the individualized electronic component 10.SELECTED DRAWING: Figure 1

Description

The present invention relates to a method for manufacturing an electronic device.

In the manufacturing process of an electronic device, there is a step of dicing an electronic component such as a semiconductor substrate into a plurality of electronic components.
In this dicing step, for example, a plurality of electronic components are obtained by dicing the electronic components in a state where the electronic components are attached on the adhesive film.

Examples of the technique relating to the adhesive film used in such a dicing step include those described in Patent Document 1 (Japanese Unexamined Patent Publication No. 2019-16634).

Patent Document 1 has a laminated structure including a base material and an adhesive layer, and tension is performed on a dicing tape test piece having a width of 20 mm under the conditions of an initial chuck distance of 100 mm, 23 ° C., and a tensile speed of 10 mm / min. With respect to the first tensile stress generated at a strain value of 20% in the test, a dicing tape test piece with a width of 20 mm was subjected to a tensile test conducted under the conditions of an initial chuck distance of 100 mm, 23 ° C. A dicing tape is described in which the value of the ratio of the generated second tensile stress is 1.4 or more.

Japanese Unexamined Patent Publication No. 2019-16634

According to the study of the present inventor, the following problems have been found with respect to the conventional method for manufacturing an electronic device. In the dicing process, electronic components are diced using a dicing blade or laser light to obtain a plurality of electronic components. In the dicing process using a dicing blade, grinding water is generally used to remove chips generated by cutting electronic components.
By the way, some of the electronic components to be diced have an opening, and there is a concern that water such as grinding water may infiltrate into the electronic component through the opening during the dicing process.

The present invention has been made in view of the above circumstances, and provides a method for manufacturing an electronic device capable of stably obtaining an electronic device in which the intrusion of water into electronic components is suppressed.

The present inventors have made extensive studies to achieve the above problems. As a result, an electronic device in which the intrusion of water into the electronic component is suppressed by performing the dicing process of the electronic component in a state where the opening of the electronic component is covered with an adhesive film whose adhesive strength is reduced by an external stimulus. The present invention has been completed by finding that it can be stably obtained.

According to the present invention, the following method for manufacturing an electronic device is provided.

[1]
It has an electronic component having an opening on the first surface and a first adhesive resin layer that is attached to the first surface of the electronic component so as to cover the opening and whose adhesive strength is reduced by an external stimulus. A structure including a first adhesive film and a second adhesive film having a second adhesive resin layer which is attached to the second surface of the electronic component and whose adhesive strength is reduced by an external stimulus is prepared. Step (A) and
A step (B) of dicing the electronic component together with the first adhesive film while being attached to the first adhesive film and the second adhesive film.
A step (C) of reducing the adhesive strength of the first adhesive resin layer by applying an external stimulus and then peeling the first adhesive film from the individualized electronic components.
Manufacturing method of electronic devices including.
[2]
In the method for manufacturing an electronic device according to the above [1],
In the step (C), a method for manufacturing an electronic device in which the second adhesive film is maintained in a state of being attached to the second surface of the electronic component.
[3]
In the method for manufacturing an electronic device according to the above [1] or [2].
An electronic device further comprising a step (D) of reducing the adhesive strength of the second adhesive resin layer by applying an external stimulus and then picking up the individualized electronic components from the second adhesive film. Production method.
[4]
In the method for manufacturing an electronic device according to any one of the above [1] to [3].
The first adhesive resin layer is a layer whose adhesive strength is reduced by heating.
A method for manufacturing an electronic device, wherein the second adhesive resin layer is a layer whose adhesive strength is reduced by light irradiation.
[5]
In the method for manufacturing an electronic device according to any one of the above [1] to [4].
The first adhesive resin layer and the second adhesive resin layer are layers whose adhesive strength is reduced by heating, respectively.
The method for manufacturing an electronic device in which the first adhesive resin layer has a lower adhesive strength at a lower temperature than the second adhesive resin layer.
[6]
In the method for manufacturing an electronic device according to any one of the above [1] to [5].
The first adhesive resin layer is a layer whose adhesive strength is reduced by irradiation with the first light.
The second adhesive resin layer is a layer whose adhesive strength is reduced by irradiation with second light.
A method for manufacturing an electronic device in which the first light and the second light have different wavelengths or different surfaces to be irradiated with light.

According to the present invention, it is possible to provide a method for manufacturing an electronic device capable of stably obtaining an electronic device in which the intrusion of water into an electronic component is suppressed.

It is sectional drawing which shows typically an example of the manufacturing method of the electronic apparatus of embodiment which concerns on this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all drawings, similar components are designated by a common reference numeral, and description thereof will be omitted as appropriate. Further, the figure is a schematic view and does not match the actual dimensional ratio. Further, "A to B" in the numerical range represents A or more and B or less unless otherwise specified. Further, in the present embodiment, "(meth) acrylic" means acrylic, methacrylic or both acrylic and methacrylic.

1. 1. Manufacturing Method of Electronic Device First, a manufacturing method of the electronic device according to the present embodiment will be described. FIG. 1 is a cross-sectional view schematically showing an example of a method for manufacturing an electronic device according to an embodiment of the present invention.
The method for manufacturing an electronic device according to the present embodiment includes at least the following three steps.
(A) A first electronic component 10 having an opening 15 on the first surface 10A and a first one that is attached to the first surface 10A of the electronic component 10 so as to cover the opening 15 and whose adhesive strength is reduced by an external stimulus. A first adhesive film 20 having an adhesive resin layer and a second adhesive film having a second adhesive resin layer that is attached to the second surface 10B of the electronic component 10 and whose adhesive strength is reduced by an external stimulus. Step of preparing the structure 50 including the first adhesive film 20 (B) A step of dying the electronic component 10 together with the first adhesive film 20 while being attached to the first adhesive film 20 and the second adhesive film 30. (C) A step of reducing the adhesive strength of the first adhesive resin layer by giving an external stimulus, and then peeling the first adhesive film 20 from the individualized electronic component 10.

As described above, according to the study of the present inventor, the following problems have been found with respect to the conventional method for manufacturing an electronic device. In the dicing process, electronic components are diced using a dicing blade or laser light to obtain a plurality of electronic components. In the dicing process using a dicing blade, grinding water is generally used to remove chips generated by cutting electronic components.
By the way, for example, a microphone or a pressure sensor has an opening for the sensor portion to come into contact with air. In an electronic component having such an opening, there is a concern that moisture such as grinding water may infiltrate into the electronic component through the opening during the dicing process.
The present inventors have made extensive studies to achieve the above problems. As a result, an electronic device in which the intrusion of water into the electronic component is suppressed by performing the dicing process of the electronic component in a state where the opening of the electronic component is covered with an adhesive film whose adhesive strength is reduced by an external stimulus. The present invention was completed by finding that it can be obtained stably.
That is, according to the method for manufacturing an electronic device according to the present embodiment, the electronic component 10 is subjected to the dicing step of the electronic component 10 with the opening 15 of the electronic component 10 covered with the first adhesive film 20. Moisture can invade. Further, since the adhesive strength of the first adhesive film 20 is reduced by an external stimulus, it can be easily peeled off after the dicing step.
As described above, according to the method for manufacturing an electronic device according to the present embodiment, it is possible to stably obtain an electronic device in which the intrusion of water into electronic components is suppressed.

Hereinafter, each step of the method for manufacturing the electronic device according to the present embodiment will be described.

(Step (A))
In the step (A), the electronic component 10 having the opening 15, the first adhesive film 20 attached to the first surface 10A of the electronic component 10 so as to cover the opening 15, and the second electronic component 10. A structure 50 including a second adhesive film 30 attached to the surface 10B is prepared.

Such a structure 50 can be obtained, for example, by attaching the first adhesive film 20 and the second adhesive film 30 to the electronic component 10 having the opening 15.
Examples of the electronic component 10 having the opening 15 include semiconductor substrates (for example, wafers) such as silicon, germanium, gallium-arsenide, gallium-phosphosphide, and gallium-arsenide-aluminum.
Further, as the semiconductor substrate, it is preferable to use a semiconductor substrate having a circuit formed on its surface.
The method for manufacturing an electronic device according to the present embodiment can be suitably used for manufacturing a device in which sensors, actuators, electronic circuits, and the like of machine element parts are integrated on a substrate, so-called MEMS.
Further, examples of the electronic component 10 having the opening 15 include a microphone, an acceleration sensor, an angular velocity sensor, a pressure sensor, a flow sensor, a microphone, an inkjet printer head, and the like.

The first adhesive film 20 and the second adhesive film 30 may be attached by hand, but are usually attached by an automatic attaching machine to which a roll-shaped surface protective film is attached.
The temperature at the time of sticking is not particularly limited, but is preferably 25 ° C to 80 ° C.
The pressure at the time of sticking is not particularly limited, but is preferably 0.3 MPa to 0.5 MPa.

(Step (B))
Next, the electronic component 10 is diced together with the first adhesive film 20 while being attached to the first adhesive film 20 and the second adhesive film 30.
The "dicing" referred to here is an operation of dividing the electronic component 10 by providing a notch having the same depth as the thickness of the electronic component 10 in the electronic component 10 to obtain a plurality of divided electronic components 10 (hereinafter referred to as "dicing"). , Also called "full-cut dicing").
The dicing can be performed using, for example, a dicing blade having a tapered tip.

When the dicing is full-cut dicing, the electronic component 10 is divided into a plurality of electronic components 10 by the dicing.
The electronic component 10 in the step (B) includes a plurality of divided electronic components 10 obtained by full-cut dicing.

(Step (C))
Next, the adhesive strength of the first adhesive resin layer is reduced by applying an external stimulus, and then the first adhesive film 20 is peeled off from the individualized electronic component 10. Here, in the step (C), it is preferable that the second adhesive film 30 is maintained in a state of being attached to the second surface 10B of the electronic component 10. As a result, the first adhesive film 20 can be stably peeled off from the individualized electronic component 10. Further, in the step (D) described later, the pick-up property of the electronic component 10 can be improved.

Examples of the external stimulus include heat and light.
For example, by irradiating the first adhesive film 20 with light (for example, radiation such as ultraviolet rays) and cross-linking the first adhesive resin layer, the adhesive force of the first adhesive resin layer to the electronic component 10 is increased. Can be lowered.
Alternatively, the first adhesive film 20 is heated to expand the gas generated from the expanding sphere or the gas generating component contained in the first adhesive resin layer, so that the first adhesive resin layer comes into contact with the electronic component 10. By reducing the area or cross-linking the adhesive component, the adhesive strength of the first adhesive resin layer to the electronic component 10 can be reduced.
Light is emitted from, for example, a surface of the first adhesive film 20 opposite to the surface on the first adhesive resin layer side.
When ultraviolet rays are used as the light, the dose of ultraviolet rays irradiated to the first adhesive film 20 is preferably 100 mJ / cm ² or more, and more preferably 350 mJ / cm ² or more.
When the dose of ultraviolet rays is at least the above lower limit value, the adhesive strength of the first adhesive film 20 can be sufficiently reduced, and as a result, the generation of adhesive residue on the surface of the electronic component 10 can be further suppressed. it can.
The upper limit of the dose of ultraviolet rays irradiated to the first adhesive film 20 is not particularly limited, from the viewpoint of productivity, for example, at 1500 mJ / cm ² or less, preferably 1200 mJ / cm ² or less.
Ultraviolet irradiation can be performed using, for example, a high-pressure mercury lamp or an LED.

(Step (D))
In the method for manufacturing an electronic device according to the present embodiment, after the step (B) or step (C), an external stimulus is applied to reduce the adhesive strength of the second adhesive resin layer, and then the second adhesive film. The step (D) of picking up the individualized electronic component 10 from 30 may be further performed. Here, from the viewpoint of stably peeling the first adhesive film 20 from the electronic component 10, the step (D) is preferably performed after the step (C).
With this pickup, the electronic component 10 can be peeled off from the second adhesive film 30. The electronic component 10 can be picked up by a known method.

Examples of the external stimulus include heat and light.
For example, by irradiating the second adhesive film 30 with light (for example, radiation such as ultraviolet rays) and cross-linking the second adhesive resin layer, the adhesive force of the second adhesive resin layer to the electronic component 10 is increased. Can be lowered.
Alternatively, the second adhesive film 30 is heated to expand the gas generated from the expanding sphere or the gas generating component contained in the second adhesive resin layer, so that the second adhesive resin layer comes into contact with the electronic component 10. By reducing the area or cross-linking the adhesive component, the adhesive force of the second adhesive film 30 to the electronic component 10 can be reduced.
Light is emitted from, for example, a surface of the second adhesive film 30 opposite to the surface on the second adhesive resin layer side.
When ultraviolet rays are used as the light, the dose of ultraviolet rays irradiated to the second adhesive film 30 is preferably 100 mJ / cm ² or more, and more preferably 350 mJ / cm ² or more.
When the dose of ultraviolet rays is at least the above lower limit value, the adhesive strength of the second adhesive resin layer can be sufficiently reduced, and as a result, the generation of adhesive residue on the surface of the electronic component 10 can be further suppressed. it can.
The upper limit of the dose of ultraviolet rays irradiated to the second adhesive film 30 is not particularly limited, from the viewpoint of productivity, for example, at 1500 mJ / cm ² or less, preferably 1200 mJ / cm ² or less.
Ultraviolet irradiation can be performed using, for example, a high-pressure mercury lamp or an LED.

In the step (D), the region of the second adhesive film 30 to which the electronic component 10 is attached is expanded in the in-plane direction of the film, and the distance between the adjacent electronic components 10 is expanded in the second state. It is preferable to peel off the electronic component 10 from the adhesive film 30.
By doing so, the distance between the adjacent electronic components 10 is increased, so that the electronic components 10 can be easily picked up from the second adhesive film 30. Further, the shear stress between the electronic component 10 and the second adhesive film 30 caused by the in-plane expansion of the second adhesive film 30 reduces the adhesive force between the electronic component 10 and the second adhesive film 30. Therefore, it becomes easy to pick up the electronic component 10 from the second adhesive film 30.

(Other processes)
The method for manufacturing an electronic device according to the present embodiment may include other steps other than the above. As another step, a step known in the method for manufacturing an electronic device can be used.

For example, any arbitrary process that is generally performed in a process of mounting the obtained electronic component 10 on a circuit board after performing step (D), a wire bonding process, a sealing process, or other manufacturing process of an electronic device. Further steps may be performed.

2. Adhesive film Hereinafter, the first adhesive film 20 and the second adhesive film 30 (hereinafter collectively referred to as an adhesive film) according to the present embodiment will be described.

The adhesive film according to the present embodiment includes, for example, a base material layer and an adhesive resin layer provided on one surface of the base material layer (hereinafter, a first adhesive resin layer and a second adhesive resin layer are grouped together. It is referred to as an adhesive resin layer).

The thickness of the entire adhesive film according to the present embodiment is preferably 10 μm or more and 1000 μm or less, and more preferably 20 μm or more and 500 μm or less, from the viewpoint of the balance between mechanical properties and handleability.

Next, each layer constituting the adhesive film according to the present embodiment will be described.

<Base layer>
The base material layer is a layer provided for the purpose of improving the handleability, mechanical properties, heat resistance, and other properties of the adhesive film.
The base material layer is not particularly limited, and examples thereof include a resin film.
As the resin constituting the resin film, a known thermoplastic resin can be used. For example, polyolefins such as polyethylene, polypropylene, poly (4-methyl-1-pentene), poly (1-butene); polyesters such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate; nylon-6, nylon-66, poly. Polyesters such as metaxylene adipamide; polyacrylates; polymethacrylates; polyvinyl chlorides; polyvinylidene chlorides; polyimides; polyetherimides; ethylene / vinyl acetate copolymers; polyacrylonitrile; polycarbonates; polystyrenes; ionomers; polysulfones; poly Ether sulfone; one or more selected from polyphenylene ether and the like can be mentioned.
Among these, one or more selected from polypropylene, polyethylene terephthalate, polyethylene naphthalate, polyamide, and polyimide are preferable, and polyethylene terephthalate and polyethylene naphthalate are preferable from the viewpoint of excellent balance of transparency, mechanical strength, price, and the like. At least one selected from is more preferred.

The base material layer may be a single layer or two or more types of layers.
Further, the form of the resin film used for forming the base material layer may be a stretched film or a film stretched in a uniaxial direction or a biaxial direction, but the machine of the base material layer From the viewpoint of improving the target strength, a film stretched in the uniaxial direction or the biaxial direction is preferable.

The thickness of the base material layer is preferably 1 μm or more and 500 μm or less, more preferably 5 μm or more and 300 μm or less, and further preferably 10 μm or more and 250 μm or less from the viewpoint of obtaining good film characteristics.
The base material layer may be surface-treated in order to improve the adhesiveness with other layers. Specifically, corona treatment, plasma treatment, undercoat treatment, primer coating treatment and the like may be performed.

<Adhesive resin layer>
The adhesive resin layer is a layer provided on one surface side of the base material layer, and is a layer whose adhesive strength is reduced by an external stimulus.
Here, examples of the adhesive resin layer whose adhesive strength is reduced by an external stimulus include a heat-peeling type adhesive resin layer whose adhesive strength is reduced by heating and photo-peeling whose adhesive strength is reduced by light (for example, radiation). Examples include a mold adhesive resin layer.

Examples of the heat-peeling type adhesive resin layer include a heat-expandable pressure-sensitive adhesive containing a gas-generating component, a heat-expandable pressure-sensitive adhesive containing heat-expandable microspheres that can expand and reduce the adhesive force, and a heat-sensitive adhesive. Examples thereof include an adhesive resin layer composed of a heat-crosslinked pressure-sensitive adhesive or the like whose adhesive strength is reduced by a cross-linking reaction of the components.

In the present embodiment, the pressure-sensitive adhesive used for the heat-peeling type pressure-sensitive adhesive resin layer is, for example, a pressure-sensitive adhesive whose adhesive strength is reduced or lost when heated at a temperature exceeding 150 ° C. For example, it is possible to select a material that does not peel off at a temperature of 150 ° C. or lower and peels off at a temperature of more than 150 ° C. It is preferable to have.
Here, if the adhesive strength is reduced or lost by heating at a temperature exceeding 150 ° C., for example, the adhesive resin layer side is attached to a stainless steel plate, heat-treated at 140 ° C. for 1 hour, and then It can be evaluated by the peel strength from the stainless steel plate measured after heating at a temperature exceeding 150 ° C. for 2 minutes. The specific heating temperature when heating at a temperature exceeding 150 ° C. is set to a temperature higher than the temperature at which the gas is generated and the temperature at which the thermally expandable microspheres thermally expand, and the generated gas and the thermally expandable microspheres are heated. It is appropriately set depending on the type of microsphere. In the present embodiment, the loss of adhesive strength means, for example, a case where the 180 ° peel strength measured under the conditions of 23 ° C. and a tensile speed of 300 mm / min is less than 0.5 N / 25 mm.

As the gas generating component used in the heat-expandable pressure-sensitive adhesive, for example, an azo compound, an azide compound, a meldrum's acid derivative, or the like can be used. In addition, inorganic foaming agents such as ammonium carbonate, ammonium hydrogencarbonate, sodium hydrogencarbonate, ammonium nitrite, sodium boron hydroxide, and various azos, and water; alkane salt fluorides such as trichloromonofluoromethane and dichloromonofluoromethane. Compounds; Azo compounds such as azobisisobutyronitrile, azodicarboxylicamide, barium azodicarboxylate; paratoluenesulfonyl hydrazide, diphenylsulfone-3,3'-disulfonylhydrazide, 4,4'-oxybis (benzenesulfonyl) Hydrazine compounds such as hydrazide) and allylbis (sulfonylhydrazide); semicarbazide compounds such as p-toluylenesulfonyl semicarbazide and 4,4'-oxybis (benzenesulfonyl semicarbazide); 5-morpholyl-1,2,3,4- Triazole compounds such as thiatriazole; organic foaming agents such as N-nitroso compounds such as N, N'-dinitrosopentamethylenetetramine, N, N'-dimethyl-N, N'-dinitrosoterephthalamide Can be used. The gas generating component may be added to the adhesive resin or may be directly bonded to the adhesive resin.

As the heat-expandable microspheres used in the heat-expandable pressure-sensitive adhesive, for example, a microencapsulated foaming agent can be used. Examples of such heat-expandable microspheres include microspheres in which a substance that easily gasifies and expands by heating, such as isobutane, propane, and pentane, is contained in an elastic shell. Examples of the material constituting the shell include vinylidene chloride-acrylonitrile copolymer, polyvinyl alcohol, polyvinyl butyral, polymethylmethacrylate, polyacrylonitrile, polyvinylidene chloride, polysulfone and the like. The heat-expandable microspheres can be produced, for example, by a coacervation method, an interfacial polymerization method, or the like.
The heat-expandable microspheres can be added to the adhesive resin.

The content of at least one selected from the gas generating component and the heat-expandable microspheres can be appropriately set according to the expansion ratio of the heat-peeling type adhesive resin layer, the decrease in adhesive strength, and the like, and in particular, Although not limited, for example, with respect to 100 parts by mass of the adhesive resin in the heat-peeling type adhesive resin layer, for example, 1 part by mass or more and 150 parts by mass or less, preferably 10 parts by mass or more and 130 parts by mass or less, more preferably. It is 12 parts by mass or more and 100 parts by mass or less.
It is preferable to design so that the temperature at which the gas is generated and the temperature at which the thermally expandable microspheres thermally expand exceed 150 ° C.

Examples of the adhesive resin constituting the heat-release type adhesive include (meth) acrylic resin, urethane resin, silicone resin, polyolefin resin, polyester resin, polyamide resin, fluorine resin, and styrene-diene. Block copolymerization system resin and the like can be mentioned. Among these, (meth) acrylic resin is preferable.

Examples of the (meth) acrylic adhesive resin used for the adhesive resin layer include a (meth) acrylic acid alkyl ester monomer unit (a1) and a monomer unit (a2) having a functional group capable of reacting with a cross-linking agent. Examples include copolymers containing.
In the present embodiment, the (meth) acrylic acid alkyl ester means an acrylic acid alkyl ester, a methacrylic acid alkyl ester, or a mixture thereof.

The (meth) acrylic adhesive resin according to the present embodiment is copolymerized with, for example, a monomer mixture containing a (meth) acrylic acid alkyl ester monomer (a1) and a monomer (a2) having a functional group capable of reacting with a cross-linking agent. Can be obtained by

Examples of the monomer (a1) forming the (meth) acrylic acid alkyl ester monomer unit (a1) include (meth) acrylic acid alkyl esters having an alkyl group having about 1 to 12 carbon atoms. A (meth) acrylic acid alkyl ester having an alkyl group having 1 to 8 carbon atoms is preferable. Specific examples thereof include methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, butyl acrylate, butyl methacrylate, -2-ethylhexyl acrylate, and -2-ethylhexyl methacrylate. These may be used alone, or two or more kinds may be used.
In the (meth) acrylic adhesive resin according to the present embodiment, the content of the (meth) acrylic acid alkyl ester monomer unit (a1) is 100 mass by mass, which is the total of all the monomer units in the (meth) acrylic adhesive resin. In terms of%, it is preferably 10% by mass or more and 98.9% by mass or less, more preferably 50% by mass or more and 97% by mass or less, and further preferably 85% by mass or more and 95% by mass or less. ..

Examples of the monomer (a2) forming the monomer (a2) having a functional group capable of reacting with the cross-linking agent include acrylic acid, methacrylic acid, itaconic acid, mesaconic acid, citraconic acid, fumaric acid, maleic acid, and itaconic acid monoalkyl ester. , Methaconic acid monoalkyl ester, citraconic acid monoalkyl ester, fumaric acid monoalkyl ester, maleic acid monoalkyl ester, glycidyl acrylate, glycidyl methacrylate, -2-hydroxyethyl acrylate, -2-hydroxyethyl methacrylate, acrylamide , Methacrylic acid, itaconic-butylaminoethyl acrylate, itaconic-butylaminoethyl methacrylate and the like. Preferred are acrylic acid, methacrylic acid, -2-hydroxyethyl acrylate, -2-hydroxyethyl methacrylate, acrylamide, methacrylamide and the like. These may be used alone, or two or more kinds may be used.
In the (meth) acrylic adhesive resin according to the present embodiment, the content of the monomer unit (a2) is 1 mass when the total of all the monomer units in the (meth) acrylic adhesive resin is 100% by mass. % Or more and 40% by mass or less, more preferably 1% by mass or more and 20% by mass or less, and further preferably 1% by mass or more and 10% by mass or less.

The (meth) acrylic adhesive resin according to the present embodiment has a bifunctional monomer unit (a3) and a specific comonomer having properties as a surfactant, in addition to the monomer unit (a1) and the monomer unit (a2). Hereinafter, a unit (hereinafter referred to as a polymerizable surfactant) may be further contained.
The polymerizable surfactant has a property of copolymerizing with the monomer (a1), the monomer (a2) and the monomer (a3), and also has an action as an emulsifier in the case of emulsion polymerization.

Examples of the monomer (a3) forming the bifunctional monomer unit (a3) include allyl methacrylate, allyl acrylate, divinylbenzene, vinyl methacrylate, vinyl acrylate, trimethylpropantri (meth) acrylate, and pentaerythritoltri (meth). Meta) acrylate, dipentaerythritol hexa (meth) acrylate, tetraethylene glycol di (meth) acrylate, for example, diacrylate or dimethacrylate at both ends and propylene glycol type (for example, Nippon Oil & Fats Co., Ltd.) Manufactured by, trade name: PDP-200, PDP-400, ADP-200, ADP-400), tetramethylene glycol type (for example, manufactured by Nippon Oil & Fats Co., Ltd., trade name: ADT-250, ADT-850 ) And a mixed type thereof (for example, manufactured by Nippon Oil & Fats Co., Ltd., trade name: ADET-1800, ADPT-4000) and the like.

In the (meth) acrylic adhesive resin according to the present embodiment, the content of the monomer unit (a3) is 0. When the total of all the monomer units in the (meth) acrylic adhesive resin is 100% by mass. It is preferably 1% by mass or more and 30% by mass or less, more preferably 0.1% by mass or more and 15% by mass or less, further preferably 0.1% by mass or more and 20% by mass or less, and 0. It is particularly preferable that it is 1% by mass or more and 5% by mass or less.

Examples of polymerizable surfactants include those in which a polymerizable 1-propenyl group is introduced into the benzene ring of polyoxyethylene nonylphenyl ether (manufactured by Daiichi Kogyo Seiyaku Co., Ltd .; trade name: Aqualon RN-10). , RN-20, RN-30, RN-50, etc.), in which a polymerizable 1-propenyl group is introduced into the benzene ring of the ammonium salt of the sulfate ester of polyoxyethylene nonylphenyl ether (Daiichi Kogyo Seiyaku Co., Ltd.) Made by Co., Ltd .; Trade name: Aqualon HS-10, HS-20, HS-1025, etc.), and sulfosuccinic acid diester type having a polymerizable double bond in the molecule (manufactured by Kao Co., Ltd .; trade name) : Latemul S-120A, S-180A, etc.) and the like.
In the (meth) acrylic adhesive resin according to the present embodiment, the content of the polymerizable surfactant is 0. When the total of all the monomer units in the (meth) acrylic adhesive resin is 100% by mass. It is preferably 1% by mass or more and 30% by mass or less, more preferably 0.1% by mass or more and 15% by mass or less, further preferably 0.1% by mass or more and 20% by mass or less, and 0. It is particularly preferable that it is 1% by mass or more and 5% by mass or less.

The (meth) acrylic adhesive resin according to the present embodiment may further contain a monomer unit formed of a monomer having a polymerizable double bond such as vinyl acetate, acrylonitrile, and styrene, if necessary. ..

Examples of the polymerization reaction mechanism of the (meth) acrylic adhesive resin according to the present embodiment include radical polymerization, anionic polymerization, and cationic polymerization. Considering the production cost of the (meth) acrylic adhesive resin, the influence of the functional group of the monomer, the influence of ions on the surface of the electronic component, and the like, it is preferable to polymerize by radical polymerization.
When polymerizing by a radical polymerization reaction, as a radical polymerization initiator, benzoyl peroxide, di-t-butyl peroxide, dicumyl peroxide, 3,3,5-trimethylhexanoyl peroxide, di-2-ethylhexyl peroxy Dicarbonate, methylethylketone peroxide, t-butylperoxyphthalate, t-butylperoxybenzoate, di-t-butylperoxyacetate, t-butylperoxyisobutyrate, t-butylperoxy-2-hexanoate, t -Butylperoxy-2-ethylhexanoate, t-butylperoxy-3,5,5-trimethylhexanoate, acetylperoxide, isobutyryl peroxide, octanoyl peroxide, t-butyl peroxide, di -Organic peroxides such as amylperoxide; Inorganic peroxides such as ammonium persulfate, potassium persulfate, sodium persulfate; 2,2'-azobisisobutyronitrile, 2,2'-azobis-2 Examples thereof include azo compounds such as −methylbutyronitrile and 4,4′-azobis-4-cyanovaleric acid.

When polymerizing by the emulsion polymerization method, among these radical polymerization initiators, water-soluble inorganic peroxides such as ammonium persulfate, potassium persulfate, and sodium persulfate, and water-soluble 4,4'-azobis An azo compound having a carboxyl group in the molecule, such as -4-cyanovaleric acid, is preferable. Considering the influence of ions on the surface of electronic parts, azo compounds having a carboxyl group in the molecule such as ammonium persulfate and 4,4'-azobis-4-cyanovaleric acid are more preferable, and 4,4'-azobis An azo compound having a carboxyl group in the molecule, such as -4-cyanovaleric acid, is particularly preferable.

The pressure-sensitive resin layer according to the present embodiment preferably further contains a cross-linking agent having two or more cross-linking functional groups in one molecule, in addition to the pressure-sensitive resin.
A cross-linking agent having two or more cross-linking functional groups in one molecule is used to react with the functional groups of the adhesive resin to adjust the adhesive force and the cohesive force.
Examples of such a cross-linking agent include sorbitol polyglycidyl ether, polyglycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, diglycerol polyglycidyl ether, glycerol polyglycidyl ether, neopentyl glycol diglycidyl ether, and resorcin diglycidyl ether. Epoxy compounds; isocyanate compounds such as tetramethylene diisocyanate, hexamethylene diisocyanate, toluenediisocyanate 3 adduct of trimethylpropane, polyisocyanate, diphenylmethanediisocyanate, tolylene diisocyanate; Nate, tetramethylolmethane-tri-β-aziridinyl propionate, N, N'-diphenylmethane-4,4'-bis (1-aziridinecarboxyamide), N, N'-hexamethylene-1,6- Aziridine compounds such as bis (1-aziridine carboxylamide), N, N'-toluene-2,4-bis (1-aziridine carboxylamide), trimethylpropan-tri-β- (2-methylaziridine) propionate; Tetrafunctional epoxy compounds such as N, N, N', N'-tetraglycidyl-m-isocyanateamine, 1,3-bis (N, N'-diglycidylaminomethyl) cyclohexane; hexamethoxymethylol melamine and the like. Examples include melamine compounds. These may be used alone or in combination of two or more.
Among these, it is preferable to contain one or more selected from epoxy compounds, isocyanate compounds and aziridine compounds.

The content of the cross-linking agent is usually preferably in a range in which the number of functional groups in the cross-linking agent does not exceed the number of functional groups in the adhesive resin. However, when a new functional group is generated in the cross-linking reaction, or when the cross-linking reaction is slow, an excessive amount may be contained as needed.
The content of the cross-linking agent in the adhesive resin layer is preferably 0.1 part by mass or more and 10 parts by mass or less, and 0.5 parts by mass or more and 5 parts by mass or less with respect to 100 parts by mass of the adhesive resin. Is more preferable.

Further, as the pressure-sensitive adhesive constituting the photo-peeling type pressure-sensitive adhesive resin layer, a photo-crosslinking type pressure-sensitive adhesive can be used in which the adhesive strength is reduced by light. The adhesive resin layer composed of the photocrosslinkable adhesive is crosslinked by irradiation with light, and the adhesive strength is remarkably reduced. Examples of light include ultraviolet rays, electron beams, and infrared rays.
As the photocrosslinkable adhesive, an ultraviolet crosslinkable adhesive is preferable.

Examples of the pressure-sensitive adhesive constituting the photocrosslinking type pressure-sensitive adhesive include (meth) acrylic pressure-sensitive adhesive, silicone-based pressure-sensitive adhesive, urethane-based pressure-sensitive adhesive, olefin-based pressure-sensitive adhesive, and styrene-based pressure-sensitive adhesive. Among these, a (meth) acrylic pressure-sensitive adhesive using a (meth) acrylic polymer as a base polymer is preferable because the adhesive strength can be easily adjusted.
Examples of the (meth) acrylic polymer contained in the (meth) acrylic pressure-sensitive adhesive include a homopolymer of a (meth) acrylic acid ester compound, a copolymer of a (meth) acrylic acid ester compound and a comonomer, and the like. Can be mentioned. Examples of the (meth) acrylic acid ester compound include methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, hydroxyethyl (meth) acrylate, and hydroxypropyl (meth). Examples thereof include acrylate, dimethylaminoethyl (meth) acrylate, and glycidyl (meth) acrylate. These (meth) acrylic acid ester compounds may be used alone or in combination of two or more.
Examples of the comonomer constituting the (meth) acrylic copolymer include vinyl acetate, (meth) acrylonitrile, (meth) acrylic amide, styrene, (meth) acrylic acid, itaconic acid, and (meth) acrylic amide. , Methylol (meth) acrylic amide, maleic anhydride and the like. These comonomer may be used alone or in combination of two or more.

The photocrosslinkable pressure-sensitive adhesive includes, for example, a pressure-sensitive adhesive such as the (meth) acrylic pressure-sensitive adhesive, a crosslinkable compound (a component having a carbon-carbon double bond), a photopolymerization initiator or a thermal polymerization initiator. including.

Examples of the crosslinkable compound include a monomer, an oligomer, a polymer, etc., which has a carbon-carbon double bond in the molecule and can be crosslinked by radical polymerization. Examples of such crosslinkable compounds include trimethyl propantri (meth) acrylate, pentaerythritol tri (meth) acrylate, tetraethylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, and neo. Esters of (meth) acrylic acids such as pentylglycol di (meth) acrylates and dipentaerythritol hexa (meth) acrylates with polyhydric alcohols; ester (meth) acrylate oligomers; 2-propenyldi-3-butenyl cyanurate, 2 Examples thereof include isocyanurates such as −hydroxyethylbis (2- (meth) acryloxyethyl) isocyanurate and tris (2-methacryloxyethyl) isocyanurate, or isocyanurate compounds.
When the pressure-sensitive adhesive is a photocrosslinkable polymer having a carbon-carbon double bond in the side chain of the polymer, it is not necessary to add a crosslinkable compound.

The content of the crosslinkable compound is preferably 5 to 100 parts by mass, more preferably 10 to 50 parts by mass with respect to 100 parts by mass of the pressure-sensitive adhesive. When the content of the crosslinkable compound is in the above range, the adhesive strength can be easily adjusted as compared with the case where the content is less than the above range, and the sensitivity to heat and light is too high as compared with the case where the content is more than the above range. As a result, the storage stability is unlikely to decrease.

The photopolymerization initiator may be any compound that cleaves and generates radicals when irradiated with light. For example, benzoin alkyl ethers such as benzoin methyl ether, benzoin isopropyl ether, and benzoin isobutyl ether; benzyl, benzoin, and benzophenone. , Α-Hydroxycyclohexylphenyl ketone and other aromatic ketones; benzyldimethyl ketal and other aromatic ketals; polyvinylbenzophenone; chlorothioxanthone, dodecylthioxanthone, dimethylthioxanthone, diethylthioxanthone and other thioxanthones and the like.

Examples of the thermal polymerization initiator include organic peroxide derivatives and azo-based polymerization initiators. It is preferably an organic peroxide derivative because nitrogen is not generated during heating. Examples of the thermal polymerization initiator include ketone peroxides, peroxyketals, hydroperoxides, dialkyl peroxides, diacyl peroxides, peroxyesters, peroxydicarbonates and the like.

A cross-linking agent may be added to the pressure-sensitive adhesive. Examples of the cross-linking agent include epoxy compounds such as sorbitol polyglycidyl ether, polyglycerol polyglycidyl ether, pentaeristol polyglycidyl ether, and diglycerol polyglycidyl ether; tetramethylolmethane-tri-β-aziridinyl propionate. , Trimethylolpropane-tri-β-aziridinyl propionate, N, N'-diphenylmethane-4,4'-bis (1-aziridine carboxylamide), N, N'-hexamethylene-1,6-bis Aziridine compounds such as (1-aziridine carboxylamide); isocyanate compounds such as tetramethylene diisocyanate, hexamethylene diisocyanate, and polyisocyanate can be mentioned. The content of the cross-linking agent is 0.1 part by mass or more and 10 parts by mass or less with respect to 100 parts by mass of the (meth) acrylic adhesive resin from the viewpoint of improving the balance between the heat resistance and the adhesive force of the adhesive resin layer. Is preferable.

In the adhesive film according to the present embodiment, it is preferable that the first adhesive resin layer is a layer whose adhesive strength is reduced by heating, and the second adhesive resin layer is a layer whose adhesive strength is reduced by light irradiation. By doing so, in the step (C), while suppressing the decrease in the adhesive force of the second adhesive resin layer, the adhesive force of the first adhesive resin layer is decreased by heating, and the adhesive force of the first adhesive resin layer is reduced from the first adhesive film 20. The electronic component 10 can be peeled off more stably.

Further, in the adhesive film according to the present embodiment, the first adhesive resin layer and the second adhesive resin layer are layers whose adhesive strength is lowered by heating, respectively, and the first adhesive resin layer is the second adhesive. The adhesive strength may be lower than that of the resin layer at a lower temperature. By doing so, it is possible to reduce the adhesive strength of the first adhesive resin layer at a heating temperature at which the adhesive strength of the second adhesive resin layer is unlikely to decrease in the step (C). Therefore, in the step (C), the decrease in the adhesive force of the second adhesive resin layer can be suppressed, and the electronic component 10 can be more stably peeled from the first adhesive film 20.

Further, in the adhesive film according to the present embodiment, both the first adhesive resin layer and the second adhesive resin layer are layers whose adhesive strength is reduced by light irradiation, and the wavelengths at which the adhesive strength reduction occurs are different. There may be. By doing so, in the step (C), the first adhesive resin layer is lowered by the irradiation of the first light, but the decrease in the adhesive strength of the second adhesive resin layer is suppressed, and the electrons are transmitted from the first adhesive film 20. The component 10 can be peeled off more stably. In the subsequent step, the adhesive strength of the second adhesive resin layer can be reduced by irradiating with the second light.
Further, both the first adhesive resin layer and the second adhesive resin layer are layers whose adhesive strength is reduced by light irradiation, and may be in a mode of changing the direction of exposure to light. That is, the step (C) shines light from the first adhesive resin layer side, and the step (D) shines light from the second sticky resin layer side, so that even if the irradiation wavelength is the same, the step (D) In C), it is possible to suppress a decrease in the adhesive strength of the second adhesive resin layer.

The thickness of the adhesive resin layer is not particularly limited, but is preferably 5 μm or more and 300 μm or less, and more preferably 20 μm or more and 150 μm or less.

The adhesive resin layer can be formed by, for example, a method of applying a pressure-sensitive adhesive coating liquid on the base material layer, a method of transferring the adhesive resin layer formed on the separator onto the base material layer, or the like.
As a method for applying the pressure-sensitive adhesive coating liquid, conventionally known coating methods, for example, a roll coater method, a reverse roll coater method, a gravure roll method, a bar coat method, a comma coater method, a die coater method and the like can be adopted. The drying conditions of the applied pressure-sensitive adhesive are not particularly limited, but in general, it is preferable to dry the applied adhesive in a temperature range of 80 to 200 ° C. for 10 seconds to 10 minutes. More preferably, it is dried at 80 to 170 ° C. for 15 seconds to 5 minutes. In order to sufficiently promote the cross-linking reaction between the cross-linking agent and the pressure-sensitive adhesive, the pressure-sensitive adhesive coating liquid may be heated at 40 to 80 ° C. for about 5 to 300 hours after the drying is completed.
Further, the base material layer and the adhesive resin layer may be formed by coextrusion molding, or the film-like base material layer and the film-like adhesive resin layer may be laminated. ..

<Other layers>
The adhesive film according to the present embodiment is further provided with, for example, an uneven absorption layer, a shock absorbing layer, an easy adhesive layer, etc. between the base material layer and the adhesive resin layer as long as the effects of the present embodiment are not impaired. It may have been.
Further, in the adhesive film according to the present embodiment, a release film may be further laminated on the adhesive resin layer. Examples of the release film include a polyester film that has undergone a release treatment.

Although the embodiments of the present invention have been described above, these are examples of the present invention, and various configurations other than the above can be adopted.

The present invention is not limited to the above-described embodiment, and modifications, improvements, and the like within the range in which the object of the present invention can be achieved are included in the present invention.

10 Electronic components 10A 1st surface 10B 2nd surface 15 Opening 20 1st adhesive film 30 2nd adhesive film 50 Structure

Claims (6)

It has an electronic component having an opening on the first surface and a first adhesive resin layer that is attached to the first surface of the electronic component so as to cover the opening and whose adhesive strength is reduced by an external stimulus. A structure including a first adhesive film and a second adhesive film having a second adhesive resin layer that is attached to the second surface of the electronic component and whose adhesive strength is reduced by an external stimulus is prepared. Step (A) and
A step (B) of dicing the electronic component together with the first adhesive film while being attached to the first adhesive film and the second adhesive film.
A step (C) of reducing the adhesive strength of the first adhesive resin layer by applying an external stimulus and then peeling the first adhesive film from the individualized electronic component.
Manufacturing method of electronic devices including. In the method for manufacturing an electronic device according to claim 1,
In the step (C), a method for manufacturing an electronic device in which the second adhesive film is maintained in a state of being attached to the second surface of the electronic component. In the method for manufacturing an electronic device according to claim 1 or 2.
An electronic device further comprising a step (D) of reducing the adhesive strength of the second adhesive resin layer by applying an external stimulus and then picking up the individualized electronic component from the second adhesive film. Production method. In the method for manufacturing an electronic device according to any one of claims 1 to 3.
The first adhesive resin layer is a layer whose adhesive strength is reduced by heating.
A method for manufacturing an electronic device, wherein the second adhesive resin layer is a layer whose adhesive strength is reduced by light irradiation. In the method for manufacturing an electronic device according to any one of claims 1 to 4.
The first adhesive resin layer and the second adhesive resin layer are layers whose adhesive strength is reduced by heating, respectively.
A method for manufacturing an electronic device in which the first adhesive resin layer has a lower adhesive strength at a lower temperature than the second adhesive resin layer. In the method for manufacturing an electronic device according to any one of claims 1 to 5.
The first adhesive resin layer is a layer whose adhesive strength is reduced by irradiation with the first light.
The second adhesive resin layer is a layer whose adhesive strength is reduced by irradiation with second light.
A method for manufacturing an electronic device in which the first light and the second light have different wavelengths or different surfaces on which light is irradiated.

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