JP2020166285A - Display - Google Patents

Abstract

To provide a display that can prevent a reduction in adhesive strength of a sealant to improve reliability.SOLUTION: In a display, a first substrate has an inorganic insulating film, wiring, an organic insulating film, and a mounting part having a pad; a seal bonding the first substrate to a second substrate has a first seal part with a first width formed along the mounting part and a second seal part with a second width intersecting the first seal part; the first width is larger than the second width; the organic insulating film has a first groove part that is a non-forming part of the organic insulating film extending along the first seal part in an area overlapping the first seal part, a second groove part that is a non-forming part of the organic insulating film extending along the second seal part in an area overlapping the second seal part, and a removal part of the organic insulating film that is connected to the first groove part and second groove part at an intersection part at which the first seal part and the second seal part intersect each other and extended to an end of the first seal part and an end of the second seal part.SELECTED DRAWING: Figure 1

Description

Embodiments of the present invention relate to display devices.

In recent years, display devices such as liquid crystal display devices have been used in various fields. For example, in a liquid crystal display panel, a pair of substrates sandwiching a liquid crystal layer are bonded by a sealing material. By the way, in order to increase the adhesive strength between the substrates without inviting an increase in the frame size, a part of the insulating film provided on the wiring group is removed, and the pair of substrates are sealed without passing through the insulating film. Techniques for bonding by materials are disclosed.

Japanese Unexamined Patent Publication No. 2008-46307

An object of the present embodiment is to provide a display device capable of suppressing a decrease in adhesive strength of a sealing material and improving reliability.

According to this embodiment
A first substrate having a first substrate end portion, a second substrate having a second substrate end portion and facing the first substrate, and a seal for adhering the first substrate and the second substrate are provided. The first substrate includes a display region having a plurality of pixels, a first region that overlaps the second substrate and includes the display region, a second region that does not overlap the second substrate, the first region, and the first substrate. It has an organic insulating film formed over a second region, the second substrate end portion is a boundary between the first region and the second region, and the second region is the first region. It is a region between the edge of the substrate and the end of the second substrate, and the seal is formed along the end of the second substrate between the display region and the end of the second substrate. A first organic insulating film having a sealing portion, which is a non-forming portion of the organic insulating film extending along the first sealing portion between the display region and the end portion of the second substrate. The groove portion, the first side wall on the end side of the first substrate, and the second side wall separated from the first side wall in the first groove portion, and the first side wall has the display area and the first side wall. The second side wall is formed along the second substrate end between the two substrate ends, and the second side wall is formed on the second substrate end between the second substrate end and the first substrate end. A display device is provided that is formed along the line.

FIG. 1 is a diagram showing a configuration and an equivalent circuit of a display panel constituting the liquid crystal display device of the present embodiment. FIG. 2 is an enlarged view of the area A of the display panel shown in FIG. FIG. 3 is a diagram showing a cross section of the display panel taken along the line BC of FIG. FIG. 4 is a diagram showing a first modification according to the present embodiment. FIG. 5 is a diagram showing a second modification according to the present embodiment. FIG. 6 is a diagram showing a third modification according to the present embodiment. FIG. 7 is a diagram schematically showing a process of applying a sealing material. FIG. 8 is a diagram showing a fourth modification according to the present embodiment. FIG. 9 is a diagram schematically showing a process of applying a sealing material.

Hereinafter, the present embodiment will be described with reference to the drawings. It should be noted that the disclosure is merely an example, and those skilled in the art can easily conceive of appropriate changes while maintaining the gist of the invention are naturally included in the scope of the present invention. Further, in order to clarify the explanation, the drawings may schematically represent the width, thickness, shape, etc. of each part as compared with the actual embodiment, but this is merely an example, and the present invention It does not limit the interpretation. Further, in the present specification and each figure, components exhibiting the same or similar functions as those described above with respect to the above-mentioned figures may be designated by the same reference numerals, and duplicate detailed description may be omitted as appropriate. ..

First, the display device according to the present embodiment will be described in detail.
FIG. 1 is a diagram showing a configuration of a display panel constituting the display device of the present embodiment. In this embodiment, the case where the display device has a liquid crystal display panel will be described, but the present invention is not limited to this, and the display panel may have a self-luminous display panel such as organic electroluminescence as the display panel. Alternatively, the display panel may have an electronic paper type display panel or the like having an electroluminescent element or the like.

Here, FIG. 1 shows a plan view of the display panel PNL in the XY planes defined by the first direction X and the second direction Y intersecting each other. In the present specification, the first direction X and the second direction Y are not limited to the direction of the arrow in the drawing, but include the direction 180 degrees opposite to the arrow.

That is, the display panel PNL is a liquid crystal held between the array substrate (first substrate) AR, the facing substrate (second substrate) CT arranged to face the array substrate AR, and the array substrate AR and the facing substrate CT. It has a layer LQ. The array substrate AR and the facing substrate CT are adhered to each other by the sealing material SE with a predetermined cell gap formed between them. The liquid crystal layer LQ is held inside surrounded by the sealing material SE in the cell gap between the array substrate AR and the facing substrate CT. The display panel PNL is provided with an active area (display area) ACT for displaying an image inside the seal material SE. The active area ACT has, for example, a substantially rectangular shape, and is composed of a plurality of pixel PXs arranged in a matrix. The active area ACT may have another polygonal shape, or its edge may be formed in a curved shape.

In the active area ACT, the array substrate AR includes a gate wiring G extending along the first direction X, a source wiring S extending along the second direction Y, and a gate wiring G and a source wiring S in each pixel PX. It includes an electrically connected switching element SW, a pixel electrode PE electrically connected to the switching element SW in each pixel PX, and the like. The common electrode CE is provided on at least one of the array substrate AR and the counter substrate CT.

Although the detailed configuration of the display panel PNL will be omitted, the description of the substrate main surface (XY plane) such as TN (Twisted Nematic) mode, OCB (Optically Compensated Bend) mode, and VA (Vertical Aligned) mode will be omitted. In the display mode that uses the longitudinal electric field along the normal or the display mode that uses the gradient electric field that is inclined in the diagonal direction with respect to the main surface of the substrate, the pixel electrode PE is provided in the array substrate AR, while the common electrode The CE is provided on the facing substrate CT. Further, in a display mode using a transverse electric field along the main surface of the substrate, such as an IPS (In-Plane Switching) mode and an FFS (Fringe Field Switching) mode, which is one of the IPS modes, the pixel electrode PE and the common electrode CE Both are provided in the array substrate AR. Further, the display panel PNL may have a configuration corresponding to a display mode in which the above-mentioned vertical electric field, horizontal electric field, and gradient electric field are appropriately combined and used.

Further, the display panel PNL may be configured as a transmissive panel that displays an image by selectively transmitting light from a backlight unit arranged on the back side thereof, or may be configured as a transmissive panel that is incident on the display panel PNL. It may be configured as a reflective panel that displays an image by selectively reflecting light, or may be configured as a transflective panel that combines a transmissive type and a reflective type.

The signal supply source required to drive the display panel PNL such as the drive IC chip 2 and the flexible printed circuit (FPC) board 3 is the peripheral area (non-display area) PRP outside the active area (display area) ACT. Is located in. In the illustrated example, the drive IC chip 2 and the FPC substrate 3 are mounted on the mounting portion MT of the array substrate AR extending outward from one substrate end CTE of the opposing substrate CT. The mounting portion MT is formed along one substrate end ARE of the array substrate AR. Although not described in detail, this mounting portion MT has a pad for electrically connecting to a signal supply source. The pad includes a pad that is electrically connected to the above-mentioned gate wiring, source wiring, and the like. In the illustrated example, the other three substrate ends of the facing substrate CT face each other of the other three substrate ends of the array substrate AR. The mounting portion MT is not limited to the one formed at one substrate end of the rectangular array substrate, but is formed at two substrate ends or two or more substrate ends. It may be. The same applies even if the array substrate has a polygonal shape.

The sealing material SE is formed in a frame shape surrounding the active area ACT. In the illustrated example, the sealing material SE is formed in a rectangular shape. That is, the sealing material SE has a first sealing portion SL1, a second sealing portion SL2, a third sealing portion SL3, and a fourth sealing portion SL4. Both the first seal portion SL1 and the fourth seal portion SL4 extend along the first direction X and face each other with the active area ACT in between in the XY plane. Both the second seal portion SL2 and the third seal portion SL3 extend along the second direction Y and face each other with the active area ACT in between in the XY plane. The first seal portion SL1 is formed along the mounting portion MT. The second seal portion SL2 and the third seal portion SL3 intersect with the first seal portion SL1 at both ends of the first seal portion SL1, respectively. The fourth seal portion SL4 intersects the second seal portion SL2 and the third seal portion SL3 at both ends thereof. The first seal portion SL1 is formed wider than the second seal portion SL2, the third seal portion SL3, and the fourth seal portion SL4. In one example, the first width W1 of the first seal portion SL1 is larger than the second width W2 of the second seal portion SL2. The first width W1 is 1.5 to 4 times the second width W2, and preferably 1.5 to 2.5 times the second width W2. The width of the seal portion is the center in the length direction of the seal portion, or the width between one-third and two-thirds of the length divided into three equal parts.

FIG. 2 is an enlarged view of the area A of the display panel PNL shown in FIG. The illustrated region A is a region of the sealing material SE including the intersection CR where the first sealing portion SL1 and the second sealing portion SL2 intersect. The same structure as that of the region A shown in FIG. 2 is applied to the region including the intersection where the first seal portion SL1 and the third seal portion SL3 shown in FIG. 1 intersect. Is omitted.

In the illustrated example, the gap 30 in which the sealing material SE does not extend is formed in the intersection CR, but the gap 30 may disappear. Further, the broken line shown along the first direction X from the gap 30 indicates the boundary line 30L between the sealing materials applied in each of the two drawing processes. The boundary line 30L disappears in a cured state after each sealing material spreads in the width direction. It should be noted that the sealing materials coated on the boundary line 30L may be separated from each other. In such a sealing material SE, the first sealing portion SL1 is formed wider than the second sealing portion SL2. The coating of the sealant is not limited to drawing using a dispenser, and may be printing using a printing plate or drawing using an inkjet. In this case, the boundary line 30L may not exist.

The array substrate AR includes a wiring group WG, a third insulating film (organic insulating film described later) 13, and the like. The wiring group WG has a plurality of wirings WR1, WR2 ... Arranged in the peripheral area PRP. In the illustrated example, the wiring WR1 is the outermost wiring formed closest to the substrate end ARA of the array substrate AR. The wirings WR1, WR2 ... Are electrically connected to the mounting portion MT. Wiring WR1, WR2 ... Are, for example, various wirings to which source wiring and gate wiring drawn from the active area ACT to the peripheral area PRP, control signals, clock signals, power supplies, etc. for circuits formed in the peripheral area are supplied. ..

The third insulating film 13 is formed in a region overlapping the wiring group WG. In the illustrated example, the third insulating film 13 is formed so as to overlap all the wiring including the outermost wiring in the wiring group WG. A groove 4 is formed in the third insulating film 13. The groove portion 4 is formed along the first direction X in the region overlapping the first seal portion SL1, and is formed along the second direction in the region overlapping the second seal portion SL2. Further, the third insulating film 13 is formed with a removing portion (recess) 4E extended to a position facing the substrate end portion CTE of the opposing substrate CT at the intersecting portion CR. The removing portion 4E is connected to the groove portion 4. In the illustrated example, the removal portion 4E extends to the substrate end ARA of the array substrate AR. Such a removing portion 4E is formed, for example, in a substantially triangular shape. The hypotenuse 41 of the removing portion 4E extends along the wiring direction of the wiring group WG. The apex angle 42 facing the hypotenuse 41 of the removing portion 4E is located near the intersection of the substrate end portion ARA and the substrate end portion CTE. The third insulating film 13 is not formed even in the mounting portion MT in which the drive IC chip 2 is arranged. The removing portion 4E may extend to a region where the third insulating film 13 of the mounting portion MT is not formed.

FIG. 3 is a diagram showing a cross section of the display panel PNL in line BC of FIG. Note that FIG. 3 mainly illustrates the structure of the display panel PNL in the peripheral area PRP, and the detailed structure of the display panel PNL in the active area ACT is not shown.

The display panel PNL includes an array substrate AR, an opposing substrate CT facing the array substrate AR, and a liquid crystal layer LQ held between the array substrate AR and the opposing substrate CT. The array substrate AR and the facing substrate CT are adhered to each other by the sealing material SE in the peripheral area PRP.

In the description of the array substrate AR, “upper” means the side close to the opposite substrate CT. The array substrate AR includes a first insulating substrate 10, a first wiring 5, a second wiring 6, a first insulating film 11, a second insulating film 12, a third insulating film 13, a fourth insulating film 14, and a first alignment film AL1. Etc. are provided. The first insulating substrate 10 is formed by using a material such as glass or resin. The first insulating substrate 10 is covered with the first insulating film 11. In addition, another insulating film, electrodes, wiring, or the like may be interposed between the first insulating substrate 10 and the first insulating film 11. The first wiring 5 is formed on the first insulating film 11. In the illustrated example, the wiring WR2, the wiring WR3, and the like correspond to the first wiring 5. The second insulating film 12 covers the first wiring 5 and the first insulating film 11. The second wiring 6 is formed on the second insulating film 12. In the illustrated example, the wiring WR1 and the wiring WR4 correspond to the second wiring 6. The third insulating film 13 covers the second wiring 6 and the second insulating film 12. The first wiring 5 and the second wiring 6 are formed by using a metal material such as molybdenum (Mo), tungsten (W), aluminum (Al), and titanium (Ti).

The first insulating film 11 and the second insulating film 12 correspond to an inorganic insulating film, and are formed of an inorganic material such as silicon oxide (SiO) or silicon nitride (SiN). As described above, the third insulating film 13 corresponds to an organic insulating film and is formed of an organic material such as various resins. The third insulating film 13 has a thicker film thickness than the first insulating film 11 and the second insulating film 12.

In the illustrated example, the first insulating film 11 and the second insulating film 12 are formed substantially continuously from the active area ACT to the peripheral area PRP and extend to the substrate end portion 10E of the first insulating substrate 10. There is. The third insulating film 13 is interrupted by a groove 4 penetrating to the second insulating film 12 in the peripheral area PRP. That is, the third insulating film 13 is separated into a first segment 131 located on the substrate end 10E side and a second segment 132 extending toward the active area ACT side in the peripheral area PRP. Although not described in detail, the removing portion 4E shown in FIG. 2 penetrates to the second insulating film 12 in the same manner as the groove portion 4.

The distance L between the end D on the groove 4 side of the wiring WR1, which is the outermost wiring, and the end E facing the groove 4 of the third insulating film 13 is set to, for example, 10 μm or more.

In the illustrated example, the fourth insulating film 14 is formed on the third insulating film 13. The fourth insulating film 14 corresponds to an inorganic insulating film and is formed of an inorganic material such as silicon nitride (SiN). As shown in the figure, the fourth insulating film 14 may be formed substantially continuously from the active area ACT to the peripheral area PRP, or may be formed only in the active area ACT. The fourth insulating film 14 corresponds to an interlayer insulating film interposed between the pixel electrodes and the common electrodes in a configuration in which the array substrate AR includes the pixel electrodes and the common electrodes. Here, the fourth insulating film 14 may be omitted in a display mode that utilizes a longitudinal electric field or a gradient electric field.

The first alignment film AL1 is formed on the fourth insulating film 14 and is arranged on the surface of the array substrate AR in contact with the liquid crystal layer LQ. In FIG. 3, the end portion of the first alignment film is located in the sealing material SE forming region, but a configuration may be provided up to the substrate end portion 10E of the first insulating substrate.

On the other hand, the facing substrate CT includes a second insulating substrate 20, a light-shielding layer BM, a color filter CF, an overcoat layer OC, a second alignment film AL2, and the like. The second insulating substrate 20 is formed by using a material such as glass or resin.

The light-shielding layer BM is formed on the side of the second insulating substrate 20 facing the array substrate AR. Although not described in detail, the light-shielding layer BM is formed so as to partition each pixel in the active area ACT. Further, the light-shielding layer BM extends over almost the entire peripheral area PRP. In the illustrated example, the light-shielding layer BM has a slit 22. The slit 22 faces, for example, the wiring WR1. In one example, the width of the slit 22 is equal to or less than the width of the wiring WR1.

The color filter CF is formed on the side of the second insulating substrate 20 facing the array substrate AR in the active area ACT, and its end portion overlaps with the light shielding layer BM. The color filter CF is formed of a colored resin material. The color filter CF may be provided on the array substrate AR.

The overcoat layer OC covers the color filter CF and the light-shielding layer BM. The overcoat layer OC is formed of a transparent resin material. The second alignment film AL2 is formed on the side of the overcoat layer OC facing the array substrate AR, and is arranged on the surface of the facing substrate CT in contact with the liquid crystal layer LQ.

In the illustrated example, the display panel PNL further includes a spacer PS interposed between the array substrate AR and the opposing substrate CT. The spacer PS is located in a region where the substrate end portion 10E of the first insulating substrate 10 and the substrate end portion 20E of the second insulating substrate 20 face each other. In one example, the spacer PS is provided on the facing substrate CT and is formed on the side of the overcoat layer OC facing the array substrate AR. The tip of the spacer PS is in contact with the first segment 131 of the third insulating film 13. Such a spacer PS may be formed in the shape of a wall continuously extending in the normal direction of the drawing, may be formed in the shape of a discontinuous wall, or may be formed in scattered columns. Is also good. Further, the spacer SP may be formed on the AR side of the array substrate. In the figure, only the spacer PS provided at the end of the substrate is shown, but other spacer PS may be provided in the active area ACT or the peripheral area PRP.

The array substrate AR and the facing substrate CT described above are adhered to each other by a sealing material SE. The sealing material SE is also filled in the groove portion 4, and is in contact with the upper surface and the side surface of the third insulating film 13 and also the second insulating film 12 exposed in the groove portion 4. The liquid crystal layer LQ is enclosed between the first alignment film AL1 of the array substrate AR and the second alignment film AL2 of the opposing substrate CT.

According to the present embodiment, the sealing material SE has a first sealing portion SL1 formed along the mounting portion MT and a second sealing portion SL2 intersecting the first sealing portion SL1, and the first sealing portion SL1. The first width W1 is larger than the second width W2 of the second seal portion SL2. That is, more sealing material SE is applied on the mounting portion MT side of the peripheral area PRP that does not contribute to the display. Therefore, it is possible to suppress a decrease in the adhesive strength of the sealing material SE. Therefore, it is possible to provide a display device capable of suppressing peeling of the sealing material SE and improving reliability.

Further, since the adhesive strength of the sealing material SE is ensured in the first sealing portion SL1 along the mounting portion MT, the width of the sealing material SE in the portion different from the first sealing portion SL1 is larger than that of the first sealing portion SL1. It can be made smaller. That is, in the frame-shaped peripheral area PRP, the width along the side different from the side along the mounting portion MT can be reduced, and the frame can be narrowed. In one example, in a display device having a narrow frame specification in which the width along a side different from that of the mounting portion MT is set to 1 mm or less, sufficient adhesive strength of the sealing material SE can be secured.

Further, according to the present embodiment, the groove portion 4 is formed in the third insulating film 13 which is the organic insulating film of the display panel PNL. By forming the groove portion, the contact area between the sealing material SE and the array substrate AR is increased, and the adhesive strength of the sealing material SE can be increased. Further, when the groove 4 of the third insulating film 13 is penetrated to the second insulating film 12 which is an inorganic insulating film, the sealing material SE adheres to the second insulating film 12 not only in the third insulating film 13 but also in the groove 4. Has been done. As shown in FIG. 3, the array substrate AR has a laminated structure in which the second insulating film 12 made of an inorganic material and the third insulating film 13 made of an organic material are laminated. At the interface between the inorganic insulating film and the organic insulating film, there is a high possibility that peeling will occur as compared with the laminated structure of the inorganic insulating film and the inorganic insulating film or the laminated structure of the organic insulating film and the organic insulating film. Therefore, the sealing material SE is directly adhered not only to the third insulating film 13 which is an organic insulating film but also to the second insulating film 12 which is an inorganic insulating film, so that the second insulating film 12 and the third insulating film 13 are attached to each other. It is possible to suppress peeling at the interface. Therefore, it is possible to further strengthen the adhesive strength of the sealing material SE with the array substrate AR.

Since the opposed substrate CT has a laminated structure in which organic insulating films such as the overcoat layer OC and the light-shielding layer BM are laminated, peeling at the interface between the layers tends to be difficult to occur.

Further, the third insulating film 13 has a removing portion 4E that is connected to the groove portion 4 and penetrates to the second insulating film 12 at the intersection where the first sealing portion SL1 and the second sealing portion SL2 intersect. The removing portion 4E is extended to the substrate end CTE of the opposing substrate CT. That is, since the area in which the sealing material SE is in contact with the second insulating film 12 is expanded in the removing portion 4E, it is possible to further strengthen the adhesive strength between the array substrate AR and the opposing substrate CT by the sealing material SE. Become. In particular, when the removing portion 4E is formed in a triangular shape and its hypotenuse extends in the wiring direction of the wiring group WG of the peripheral area PRP, most of the wiring of the wiring group WG is covered with the third insulating film 13. , The adhesive area between the sealing material SE and the second insulating film 12 can be expanded.

Further, according to the present embodiment, the third insulating film 13 is separated into a first segment 131 on the substrate end portion 10E side and a second segment 132 on the active area ACT side by the groove portion 4. The third insulating film 13 which is an organic insulating film may be formed of a material having higher water permeability than the inorganic insulating film. Even in such a case, since the third insulating film 13 has the groove portion 4, the infiltration path of water is blocked by the groove portion 4, and the moisture from the outside of the display panel PNL toward the active area ACT side is blocked. It is possible to suppress infiltration. Therefore, it is possible to suppress the occurrence of defects (for example, deterioration of the liquid crystal material and wiring) due to the intrusion of moisture.

Further, in the example shown in FIG. 3, the light-shielding layer BM has a slit 22. Therefore, even when the light-shielding layer BM is formed of a material having high water permeability, the light-shielding layer BM has the slit 22 to suppress the invasion of moisture from the outside of the display panel PNL. It is possible. Of the wiring group WG included in the array substrate AR, at least one wiring (wiring WR1 in the example shown in FIG. 3) is formed so as to face the slit 22 of the light-shielding layer BM, and is below the array substrate AR. Leakage of light emitted from the can be suppressed.

Further, according to the present embodiment, the spacer PS is interposed between the array substrate AR and the facing substrate CT in the peripheral area PRP. Therefore, it is possible to maintain a gap between the array substrate AR and the opposing substrate CT in the peripheral area PRP. Further, the display panel PNL provided with these array substrate AR and facing substrate CT is, for example, a first mother substrate for forming a plurality of array substrate AR and a second mother substrate for forming a plurality of opposing substrate CT. It is manufactured by bonding a substrate with a sealing material SE and then cutting each of them. At this time, by providing the spacer PS at each cut line of the first mother substrate and the second mother substrate, the sealing material SE hardly intervenes in the cut line. Therefore, the external stress applied at the time of cutting is concentrated toward the spacer PS, and it is possible to suppress the cutting failure of the mother substrate. Further, since the sealing material SE is hardly present at the position along the cut line, the cut out display panel PNL can be easily separated.

Further, according to the present embodiment, the distance L between the end D of the wiring WR1 which is the outermost wiring and the end E of the third insulating film 13 is provided to be 10 μm or more. Therefore, since the infiltration path of water is blocked by the groove portion 4, it is possible to suppress the influence of water from the outside on the wiring WR1. Further, since the wiring WR1 is covered with the third insulating film 13 having a relatively thick film, when the array substrate AR and the facing substrate CT are crimped, the wiring WR1 is removed from the inclusions (for example, fibers) contained in the sealing material SE. Can be protected.

When the outermost wiring is covered with the second insulating film 12, which is an inorganic insulating film, the third insulating film 13 does not necessarily have to be arranged at a position overlapping the outermost wiring. In order to give priority to narrowing the frame, it is also possible to provide a groove portion 4 that does not penetrate to the second insulating film 12 in the region where the second wiring 6 or the like is formed. Further, the groove portion 4 may have a structure in which the third insulating film penetrates to the second insulating film 12 and the removing portion 4E partially leaves the third insulating film. It is also possible to make the distance L in the removing portion larger than the distance L in the groove portion 4. Further, it is not necessary to make the wiring WR1 and the hypotenuse 41 parallel to each other, and the distance L at the center of the hypotenuse 41 may be larger than the distance L at the end of the hypotenuse 41.

Next, a modified example of this embodiment will be described.

FIG. 4 is a diagram showing a first modification according to the present embodiment. The first modification is different from the configuration example shown in FIG. 2 in that the third insulating film 13 is formed up to the region 31 along the substrate end ARA of the array substrate AR. In other words, the removing portion 4E of the third insulating film 13 does not extend to the substrate end portion ARA. As shown in FIG. 3, the spacer PS faces the third insulating film 13 formed in the region 31. In the sealing material SE, the first sealing portion SL1 is formed wider than the second sealing portion SL2, as in the above configuration example.

Even in such a modified example, the same effect as the above-mentioned configuration example can be obtained. Further, since the third insulating film 13 is formed along the substrate end portion ARA of the array substrate AR, the spacer PS facing the third insulating film 13 can be arranged. Therefore, in the peripheral area PRP, the gap between the array substrate AR and the opposing substrate CT can be maintained more stably.

FIG. 5 is a diagram showing a second modification according to the present embodiment. The second modification is different from the configuration example shown in FIG. 2 in that the island portion 32 of the third insulating film 13 is further formed inside the removal portion 4E formed in a substantially triangular shape. are doing. Similar to the first modification, the spacer PS faces the island portion 32. The shape and size of the island portion 32 are not particularly limited as long as the adhesive area between the groove portion 4 and the removing portion 4E and the sealing material SE is secured to a certain extent or more. The number of islands is not limited to one, and two or more may be provided.

Even in such a modified example, the same effect as the above-mentioned configuration example can be obtained.
FIG. 6 is a diagram showing a third modification according to the present embodiment. The third modification is different from the configuration example shown in FIG. 2 in that the end portion (or the hypotenuse of the removal portion 4E) of the third insulating film 13 facing the removal portion 4E has a curved portion 33. are doing. The curved portion 33 is formed in a curved shape along, for example, the intersection CR of the sealing material SE. In one example, the curved portion 33 is formed along a trajectory when the sealing material SE is applied.

Even in such a modified example, the same effect as the above-mentioned configuration example can be obtained. In addition, even if a relatively large step (for example, 2 μm) corresponding to the film thickness of the third insulating film 13 is formed at the end of the third insulating film 13 facing the removing portion 4E, or the sealing material SE Even if the coating position varies, it is possible to coat the upper surface of the third insulating film 13 and the removing portion 4E with substantially the same sealing material SE. Therefore, it is possible to suppress a decrease in adhesive strength due to the bias of the sealing material SE.

FIG. 7 is a diagram schematically showing a process of applying the sealing material. In one example, the sealing materials SE1, SE2, and SE3 are placed on one main surface side of the first mother substrate M1 for forming the array substrate AR (that is, the side to which the second mother substrate that later becomes the facing substrate CT is adhered). Is applied. Here, the layout of the sealing material for three array substrates is shown. The order in which the sealing materials SE1, SE2, and SE3 are applied is not particularly limited.

The array substrate AR1 is formed by being cut at the cut lines CL1 and CL2 in the second direction Y and the cut lines CL5 and CL6 in the first direction X. The array substrate AR2 is formed by being cut at the cut lines CL2 and CL3 in the second direction Y and the cut lines CL5 and CL6 in the first direction X. The array substrate AR3 is formed by being cut at the cut lines CL3 and CL4 in the second direction Y and the cut lines CL5 and CL6 in the first direction X.

The sealing material SE1 is applied along the cut line CL1 along the cut line CL1 and closer to the cut line CL5 than the cut line CL6 in the region of the array substrate AR1, and after being applied along the cut line CL2, in the region of the array substrate AR2. , Applied along the cut line CL5, and further, in the region of the array substrate AR3, along the cut line CL3, along the side closer to the cut line CL5 than the cut line CL6, and continuously applied along the cut line CL4. Will be done.

The sealing material SE2 is applied along the cut line CL5 in the region of the array substrate AR1, and then along the cut line CL2 in the region of the array substrate AR2 and along the side closer to the cut line CL5 than the cut line CL6. , Is applied along the cut line CL3, and is further applied continuously along the cut line CL5 in the region of the array substrate AR3.

The sealing material SE3 is continuously applied along the cut line CL6 at positions adjacent to the sealing material SE1 and the sealing material SE2 in each region of the array substrates AR1 to AR3. That is, the sealing portion formed along the mounting portions MT1 to MT3 of the array substrates AR1 to AR3 is formed by applying the sealing material SE twice. When the sealing materials SE1 to SE3 are applied with substantially the same width W12, the width W11 of the sealing portion along each mounting portion MT1 to MT3 is substantially twice the width W12. By making the coating width of the sealing material SE3 different from the coating width of the sealing material SE1 and the coating width of SE2, it is possible to set the width 12 with respect to the width W11 to a value other than double.

FIG. 8 is a diagram showing a fourth modification according to the present embodiment. The fourth modification is different from the configuration example shown in FIG. 2 in that the void 30 disappears at the intersection CR of the sealing material SE. That is, the sealing material SE extends to the substrate end ARA of the array substrate AR at the intersection CR. In such a sealing material SE, the first sealing portion SL1 is formed wider than the second sealing portion SL2, as in the above configuration example.

Even in such a modified example, the same effect as the above-mentioned configuration example can be obtained. In addition, the sealing material SE in this modification can be formed by a simpler method than in any of the above examples. An example of the method for forming the sealing material SE will be described below.

FIG. 9 is a diagram schematically showing a step of applying the sealing material SE. In one example, the sealing materials SE4, SE5, and SE6 are placed on one main surface side of the first mother substrate M1 for forming the array substrate AR (that is, the side to which the second mother substrate that later becomes the facing substrate CT is adhered). , SE7, SE8 are applied. Here, the layout of the sealing material for three array substrates is shown. The order in which the sealing materials SE4, SE5, SE6, SE7, and SE8 are applied is not particularly limited. These sealing materials SE4, SE5, SE6, SE7, and SE8 are applied with a substantially constant width W21.

The sealing material SE4 is applied along the cut line CL5. The sealing material SE4 is formed so that substantially the center of the width W21 is along the cut line CL5. The sealing material SE5 is applied along the side closer to the cut line CL5 than the cut line CL6. The sealing material SE6 is applied along the cut line CL1. The sealing material SE6 is formed so that substantially the center of the width W21 is along the cut line CL1. The sealing material SE7 is applied along the cut line CL2. The sealing material SE7 is formed so that the substantially center of the width W21 is along the cut line CL2. The sealing material SE8 is applied along the cut line CL3. The sealing material SE8 is formed so that substantially the center of the width W21 is along the cut line CL3. The sealing material SE9 is applied along the cut line CL4. The sealing material SE9 is formed so that substantially the center of the width W21 is along the cut line CL4.

When the first mother substrate M1 shown and the second mother substrate (not shown) are bonded together and then cut along the cut lines CL1 to CL6, the sealing materials SE4 and SE6 to SE9 have a width W22 that is half the width W21. .. On the other hand, in each region of the array substrates AR1 to AR3, the sealing portion formed along the mounting portions MT1 to MT3 is formed by the sealing material SE5 formed with the width W21. That is, the width of the seal portion formed along the mounting portions MT1 to MT3 is approximately twice the width of the seal portion along the other three sides. According to such a method of forming the sealing material SE, the sealing portion formed along the mounting portion is wider than the sealing portion along the other sides without applying the sealing material a plurality of times. It is possible to form.

The seal material SE4 does not necessarily have to overlap with the cut line CL5, and the seal material SE4 may be applied to the side closer to the cut line CL6 than the cut line CL5.

As described above, according to the present embodiment, it is possible to provide a display device capable of suppressing a decrease in the adhesive strength of the sealing material and improving reliability.

Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other embodiments, and various omissions, replacements, and changes can be made without departing from the gist of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are also included in the scope of the invention described in the claims and the equivalent scope thereof.

5 ... 1st wiring 6 ... 2nd wiring 10 ... 1st insulating substrate 12 ... 2nd insulating film (inorganic insulating film)
13 ... Third insulating film (organic insulating film) 4 ... Groove 4E ... Removal part (recess)
MT ... Mounting part SE ... Sealing material SL1 ... 1st sealing part SL2 ... 2nd sealing part Spacer ... PS

Claims (6)

The first substrate having the end of the first substrate and
A second substrate having a second substrate end and facing the first substrate,
A seal for adhering the first substrate and the second substrate is provided.
The first substrate includes a display region having a plurality of pixels, a first region that overlaps the second substrate and includes the display region, a second region that does not overlap the second substrate, the first region, and the first substrate. It has an organic insulating film formed over two regions.
The end of the second substrate is a boundary between the first region and the second region.
The second region is a region between the end of the first substrate and the end of the second substrate.
The seal has a first seal portion formed along the second substrate end portion between the display area and the second substrate end portion.
The organic insulating film is
Between the display area and the end portion of the second substrate, a first groove portion that is a non-forming portion of the organic insulating film extending along the first seal portion and a first groove portion.
In the first groove portion, the first side wall on the end side of the first substrate and
It has a second side wall separated from the first side wall, and has.
The first side wall is formed between the display area and the end portion of the second substrate along the end portion of the second substrate.
A display device in which the second side wall is formed between the end of the second substrate and the end of the first substrate along the end of the second substrate. The end of the first substrate and the end of the second substrate extend in the first direction.
The organic insulating film has a third side wall that connects the first side wall and the second side wall.
The display device according to claim 1, wherein the third side wall is formed obliquely with respect to the first direction and intersects the end portion of the second substrate. The seal portion has a second seal portion that intersects with the first seal portion.
The organic insulating film has a second groove portion extending along the second seal portion in a region overlapping the second seal portion.
The display device according to claim 1 or 2, wherein the second side wall is located at an intersection where the first seal portion and the second seal portion intersect. The first seal portion has a first width and has a first width.
The second seal portion has a second width and has a second width.
The display device according to claim 3, wherein the first width is larger than the second width. The first substrate has a third substrate end extending in a second direction orthogonal to the first substrate end.
The second seal portion is formed along the end portion of the third substrate, and is formed.
The second groove portion is located between the display area and the end portion of the third substrate.
The organic insulating film has a fourth side wall on the end side of the third substrate in the second groove portion.
The fourth side wall extends along the second direction.
The display device according to claim 3, wherein the second side wall and the fourth side wall are connected at the intersection. The organic insulating film is
With the fifth side wall on the display area side facing the first side wall,
With the sixth side wall on the display area side facing the fourth side wall,
At the intersection, the fifth side wall and the seventh side wall connecting the sixth side wall are provided.
The first groove portion is formed by the first side wall and the fifth side wall.
The second groove portion is formed by the fourth side wall and the sixth side wall.
The display device according to claim 5, wherein the seventh side wall is formed obliquely with respect to the first direction and the second direction.

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