JP2020161688A - Multilayer ceramic electronic component - Google Patents

Abstract

To provide a multilayer ceramic electronic component such as a multilayer ceramic capacitor, the multilayer ceramic electronic component having sufficient strength while being capable of attaining low height.SOLUTION: The present invention relates to multilayer ceramic electronic components. This electronic component has a pair of element bodies 4, 4. For each of the element bodies 4, 4, terminal electrodes 6, 8 having tip-side electrode parts 6a, 8a to cover lead-out ends of the element body from which internal electrode layers are led out, and main surface electrode parts 6b, 8b to partially cover an outer main surface vertical to a lamination direction of the element body continuously from the tip-side electrode parts, meanwhile. the terminal electrodes 6, 8 substantially do not exist on an inner main surface of the element body positioned on an opposed side of the outer main surface along the lamination direction. The inner main surfaces 4d, 4d of the pair of element bodies 4, 4 are joined together via an adhesion layer 60.SELECTED DRAWING: Figure 1A

Description

The present invention relates to a multilayer ceramic electronic component used as, for example, a multilayer ceramic capacitor, and more particularly to a multilayer ceramic electronic component that can be made thinner.

For example, as shown in Patent Document 1 below, a conventional multilayer ceramic capacitor has terminal electrodes at both ends in the longitudinal direction of the element body, and each terminal electrode has an end side electrode portion of the element body and an element body. It is common to have an upper electrode portion that covers the upper surface of the device and a lower electrode portion that covers the lower surface of the element body.

The base electrode of the terminal electrode is formed by immersing the end portion of the element body in a solution containing conductive particles. At the time of immersion, a plurality of element bodies are inserted into a plurality of holding holes formed in the holding plate, and each end of the element body is immersed in a solution to form a base electrode. After that, if necessary, a plating film is formed on the base electrode to serve as a terminal electrode.

In any case, when forming the terminal electrode on the element body, if the element body itself does not have a certain thickness, it is difficult to form the base electrode and it is difficult to form the plating film. That is, if the element body is thin, the element body is liable to be damaged when the element body is held by the holding hole of the holding plate. Further, when plating is performed, if the element body is thin, the element body is easily damaged. Therefore, in the conventional structure of the multilayer ceramic capacitor, it is difficult to reduce the thickness of the element body, and therefore, it is difficult to reduce the height of the multilayer ceramic capacitor.

In order to solve such a problem, the applicant has developed a laminated ceramic electronic component shown in Patent Document 2 below and has applied for it first. However, since the laminated ceramic electronic component filed earlier is considerably thinner than the conventional one, it is an issue to improve the mechanical strength.

Japanese Unexamined Patent Publication No. 2017-28254 Japanese Patent Application No. 2018-203974

The present invention has been made in view of such an actual situation, and an object of the present invention is to provide a multilayer ceramic electronic component such as a multilayer ceramic capacitor having sufficient strength while being able to reduce the height.

In order to achieve the above object, the laminated ceramic electronic component according to the present invention
A pair of element bodies in which internal electrode layers and insulating layers substantially parallel to a plane including the first axis and the second axis are alternately laminated along the direction of the third axis.
A laminated ceramic electronic component having a terminal electrode formed in close contact with each end surface of the element body and electrically connected to the internal electrode layer.
The terminal electrodes are not substantially present on the outer main surface of each of the element bodies and the inner main surface of the element body located on the opposite side along the direction of the third axis.
It is characterized in that the inner main surfaces of the pair of the element bodies are joined by an adhesive layer.

In the laminated ceramic electronic component according to the present invention, the terminal electrode is not substantially formed on the inner main surface of the element body. In the structure of a conventional laminated ceramic electronic component, it is difficult to form a terminal electrode on the element body simply by reducing the thickness of the element body to, for example, about 100 μm or less.

The monolithic ceramic electronic component of the present invention can be formed, for example, by combining two or more thin element bodies to form terminal electrodes, and then separating the element bodies. Therefore, for example, an element body as thin as 1/2 or less of the conventional one can be easily manufactured.

Moreover, the terminal electrodes are not substantially formed on the inner main surface of the element body, and the entire inner main surface of the element body is exposed. Then, by joining the inner main surfaces of these pair of element bodies with an adhesive layer, the laminated ceramic electronic component according to the present invention can be obtained.

The total thickness of the laminated ceramic electronic component of the present invention can be reduced to 100 μm or less, preferably 90 μm or less, more preferably 80 μm or less, and particularly preferably 60 μm or less, which contributes to lowering the height of the laminated ceramic electronic component.

Further, in the laminated ceramic electronic component according to the present invention, the inner main surfaces of the pair of element bodies are bonded to each other by an adhesive layer.

Due to the existence of such an adhesive layer, even if a mechanical impact is applied to the electronic component, the adhesive layer absorbs the impact and damage to the component can be effectively suppressed.

Preferably, the inner main surface of each element body is a flat surface. Since the inner main surface of each element body is a flat surface, the inner main surfaces of the element body can be easily adhered to each other by the adhesive layer, and an adhesive layer having a constant thickness can be easily formed between the inner main surfaces.

Preferably, the terminal electrodes formed on at least one of the element bodies cover the ends of the element body in the direction of the second axis from which the internal electrode layer is pulled out, and mutually in the direction of the second axis. A pair of end side electrode portions facing each other, and a pair of main surface electrode portions that continuously cover a part of the outer main surface substantially perpendicular to the third axis of the element body with the end side electrode portions. Has. By forming such a terminal electrode on the element body, the terminal electrode is not formed on the inner main surface of the element body.

Preferably, the adhesive layer is composed of a resin layer.

A reinforcing layer may be provided on the outer main surface or the inner main surface of the element body. By including the reinforcing layer in the element body, the strength of the laminated ceramic electronic component is further improved.

The material of the reinforcing layer may be glass containing Si as a main component or a film containing resin as a main component. As a result, the moisture resistance of the laminated ceramic electronic component can be further increased, and the strength can be increased. The material of the reinforcing layer may be a film containing a resin as a main component.

Preferably, the surface of the terminal electrode is covered with at least one selected from Ni plating, Sn plating, Au plating and Cu plating.

The monolithic ceramic electronic component can be embedded in the substrate. The laminated ceramic electronic component according to the present invention preferably has a main surface electrode portion. Even if the monolithic ceramic electronic component is embedded in the substrate, it can be electrically connected to an external circuit of the substrate via the main surface electrode portion.

FIG. 1A is a vertical sectional view of a multilayer ceramic capacitor according to an embodiment of the present invention. FIG. 1B is a vertical sectional view of a multilayer ceramic capacitor according to another embodiment of the present invention. FIG. 1C is a vertical cross-sectional view of a multilayer ceramic capacitor according to still another embodiment of the present invention. FIG. 2A1 is a cross-sectional view of the multilayer ceramic capacitor along the line IIA1-IIA1 shown in FIG. 1A. FIG. 2A2 is a cross-sectional view of the multilayer ceramic capacitor along the line IIA2-IIA2 shown in FIG. 1A. FIG. 2B is a cross-sectional view of the multilayer ceramic capacitor along the line IIB-IIB shown in FIG. 1B. FIG. 2C is a cross-sectional view of a modified example of the multilayer ceramic capacitor shown in FIG. 2B. FIG. 3 is a plan view of the multilayer ceramic capacitor shown in FIG. 1A. FIG. 4 is a cross-sectional view of a main part showing a manufacturing process of the multilayer ceramic capacitor shown in FIG. 1A. FIG. 5 is a cross-sectional view of a main part showing a usage example of the multilayer ceramic capacitor shown in FIG. 1A. FIG. 6 is a cross-sectional view of a main part showing a usage example of the multilayer ceramic capacitor shown in FIG. 1A.

Hereinafter, the present invention will be described based on the embodiments shown in the drawings.

One embodiment of the laminated ceramic electronic component according to a first embodiment the present embodiment will be described laminated ceramic capacitor.

As shown in FIG. 1A, the multilayer ceramic capacitor 2 according to the present embodiment has at least a pair of element bodies 4. In this embodiment, the pair of element bodies 4 have the same configuration, but may have different configurations. Each element body 4 has an inner dielectric layer (insulating layer) 10 substantially parallel to a plane including the X-axis and the Y-axis, and an internal electrode layer 12, and is inside between the inner dielectric layers 10. The electrode layers 12 are alternately laminated along the Z-axis direction. Here, "substantially parallel" means that most of the parts are parallel, but may have parts that are not parallel to each other, and the internal electrode layer 12 and the inner dielectric layer 10 are slightly parallel to each other. The idea is that it may be uneven or tilted.

The portion where the inner dielectric layer 10 and the inner electrode layer 12 are alternately laminated is the interior region 13. Further, the element main body 4 has exterior regions 11 on both end faces in the stacking direction Z (Z axis). The exterior region 11 is formed by laminating a plurality of outer dielectric layers thicker than the inner dielectric layer 10 constituting the interior region 13. The thickness of the interior region 13 in the Z-axis direction is preferably within the range of 10 to 75% of the total thickness z1a and z1b of each element body 4. The total thickness of the two exterior regions 11 is a value obtained by subtracting the thickness of the interior region 13 and the thicknesses of the terminal electrodes 6 and 8 from the total thicknesses z1a and z1b.

In the following, the "inner dielectric layer 10" and the "outer dielectric layer" may be collectively referred to as a "dielectric layer".

The materials of the dielectric layers constituting the inner dielectric layer 10 and the outer region 11 may be the same or different, and are not particularly limited. For example, a dielectric material having a perovskite structure such as ABO ₃ is used as a main component. It is composed.

In ABO ₃ , A is at least one kind such as Ca, Ba and Sr, and B is at least one kind such as Ti and Zr. The molar ratio of A / B is not particularly limited and is 0.980 to 1.020. In addition, rare earths (at least one selected from Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu) as subcomponents. , Alkaline earth metals (Mg and Mn), oxides of transition metals (at least one selected from V, W, and Mo) and mixtures thereof, composite oxides, and sintering aids containing SiO ₂ as glass. Etc. may be included.

One of the alternately laminated internal electrode layers 12 is a drawer portion electrically connected to the inside of the first terminal electrode 6 formed on the outside of the first end portion in the Y-axis direction of the element body 4. Has 12a. Further, the other internal electrode layer 12 that is alternately laminated is electrically connected to the inside of the second terminal electrode 8 formed on the outside of the second end portion in the Y-axis direction of the element body 4. It has a drawer portion 12b.

In the figure, the X-axis, the Y-axis, and the Z-axis are perpendicular to each other, the Z-axis coincides with the stacking direction of the inner dielectric layer 10 and the inner electrode layer 12, and the Y-axis is the extraction portions 12a and 12b. Matches the direction in which is pulled out.

The interior area 13 has a capacity area and a drawer area. The capacitance region is a region in which the internal electrode layer 12 is laminated with the inner dielectric layer 10 interposed therebetween along the stacking direction. The extraction region is a region located between the extraction portions 12a (12b) of the internal electrode layer 12 connected to the terminal electrodes 6 or 8. Further, the side gap region 14 shown in FIGS. 2A1 and 2A2 is a region for protecting the internal electrode layer 12 located at both ends of the internal electrode layer 12 in the X-axis direction, and is generally an inner dielectric layer. It is composed of the same dielectric material as 10 or the exterior region 11. However, the side gap region 14 may be made of a glass material or the like as a reinforcing layer 16 (see FIGS. 1B and 2C) described later. Further, the exterior region 11 may also be made of a glass material or the like.

The conductive material contained in the internal electrode layer 12 is not particularly limited, and metals such as Ni, Cu, Ag, Pd, Al, and Pt, or alloys thereof can be used. As the Ni alloy, an alloy of one or more elements selected from Mn, Cr, Co and Al and Ni is preferable, and the Ni content in the alloy is preferably 95% by mass or more. The Ni or Ni alloy may contain various trace components such as P in an amount of about 0.1% by mass or less.

The materials of the terminal electrodes 6 and 8 are also not particularly limited, but at least one such as Ni, Pd, Ag, Au, Cu, Pt, Rh, Ru, Ir, or an alloy thereof can be used. Usually, Cu, Cu alloy, Ni or Ni alloy or the like, Ag, Ag-Pd alloy, In-Ga alloy or the like is used.

In the present embodiment, the terminal electrodes 6 and 8 are formed in close contact with the end faces 4a and 4b of the element body 4 in the Y-axis direction, respectively, and may be a single film or a multilayer film. The terminal electrodes 6 and 8 of the present embodiment have end side electrode portions 6a and 8a covering the end faces 4a and 4b which are the extraction ends of the element body 4 from which the lead portions 12a and 12b of the internal electrode layer 12 are drawn out, respectively. Further, the terminal electrodes 6 and 8 are formed on a part of the outer main surface 4c substantially perpendicular to the Z axis of the element body 4, respectively, on the end side electrode portions 6a and 8a. , 8b.

Here, "substantially vertical" means that the main surface electrode portions 6b and 8b may have a portion that is substantially vertical but not slightly vertical, and the main surface electrode portions 6b and 8b are slightly uneven or tilted. The idea is that you may be there.

Further, as shown in FIG. 2A1, the terminal electrodes 6 and 8 are formed on the side surfaces 4e and 4e of the element body 4 opposite to each other along the X axis, respectively, with the main surface electrode portions 6b and 8b and the end side electrode portions. It has side electrode portions 6c and 8c formed continuously on 6a and 8a (see FIG. 1A). As shown in FIG. 1A, the terminal electrodes 6 and 8 are insulated from each other by a predetermined distance in the Y-axis direction on the outer surface of the element body 4.

The respective thicknesses of the terminal electrodes 6 and 8 may be the same or different between the main surface electrode portions 6b and 8b, the end side electrode portions 6a and 8a and the side electrode portions 6c and 8c, for example, 2 to 15 μm. It is within the range. In the present embodiment, the thicknesses of the main surface electrode portions 6b and 8b and the side electrode portions 6c and 8c are larger in the range of 100 to 750% than the thickness of the end side electrode portions 6a and 8a.

Further, in the present embodiment, the terminal electrodes 6 and 8 are substantially formed on the inner main surface 4d of the element body 4 located on the opposite side of the outer main surface 4c of the element body 4 along the Z-axis direction. Absent. That is, the inner main surface 4d of the element body 4 is not covered with the terminal electrodes 6 and 8, and the entire inner main surface 4d of the element body 4 is mutually connected between the element bodies 4 via the adhesive layer 60. Facing. Since each inner main surface 4d is not covered with the terminal electrodes 6 and 8, there is no stepped convex portion and the flatness is excellent. The adhesive layer 60 will be described in detail later.

In the present embodiment, the outer main surface covering layer 18 covering the outer main surface 4c of the element body 4 located between the pair of main surface electrode portions 6b and 8b is substantially the surface of the main surface electrode portions 6b and 8b. They are in close contact with each other so as to be flush with each other. The outer main surface covering layer 18 covers the outer main surface 4c of the element main body 4 between the main surface electrode portions 6b and 8b.

The term "substantially flush" means that the surface is substantially flush with each other, but may have some steps. For example, (the average thickness of the outer main surface covering layer 18 / the main surface electrode portion). The relative thickness of the outer main surface covering layer 18 obtained from the formula of (average thickness of 6b and 8b) × 100 may be 70 to 110%. As a result, the step on the outer main surface 4c side of the element main body 4 can be reduced, stress concentration on the step can be suppressed even if the height of the multilayer ceramic capacitor 2 is lowered, and the bending strength of the multilayer ceramic capacitor 2 is increased. be able to. In addition, it is easy to pick up the multilayer ceramic capacitor 2 by vacuum adsorption.

The material of the outer main surface coating layer 18 is not particularly limited, and examples thereof include glass, alumina-based composite material, zirconia-based composite material, polyimide resin, epoxy resin, aramid fiber, and fiber reinforced plastic. From the viewpoint of improving the adhesion to the main surface electrode portions 6b and 8b and improving the bending strength, glass having a softening point of 600 ° C. or higher and 850 ° C. or lower is preferable.

From the above viewpoint, the softening point of the glass used for the outer main surface coating layer 18 is more preferably 600 ° C. or higher and 850 ° C. or lower. Such glass, for example, Si-B-Zn-O-based glass and Si-Ba-Al-O, and examples of the other glass components, BaO, _Al 2 _{O 3,} alkali metal, CaO, SrO May include.

The glass component constituting the outer main surface coating layer 18 preferably contains 30 to 70% by mass of SiO ₂ , 1 to 20% by mass of B ₂ O _3, and 1 to 60% by mass of Zn O in the glass component. This makes it easier to keep the softening point of the glass within an appropriate range.

Further, it is preferable that SiO ₂ , B ₂ O ₃ and Zn O are contained in a total of 70 to 100% by mass in the glass component constituting the outer main surface coating layer 18 of the present embodiment. This makes it easier to set the softening point of the glass in an appropriate range. The material of the outer main surface covering layer 18 is selected with an emphasis on adhesion to the main surface electrode portions 6b and 8b and the exterior region 11 from the viewpoint of reducing the step on the outer main surface 4c side.

Further, the outer main surface coating layer 18 of the present embodiment is preferably made of a material having a lower elastic modulus than the dielectric layer. As a result, since the stress impact from the outside is alleviated, cracks and cracks in the subsequent process can be suppressed.

Further, the outer main surface coating layer 18 of the present embodiment is preferably made of a material having a lower coefficient of linear thermal expansion than the dielectric layer. This makes it possible to improve the strength by adjusting the stress using the difference in the coefficient of linear expansion.

As shown in FIG. 1A, the inner main surfaces 4d of the pair of element bodies 4 are joined by an adhesive layer 60. The adhesive layer 60 is composed of a resin layer. The resin layer is made of a polyimide resin, an epoxy resin, or the like having excellent heat resistance.

In the present embodiment, the thickness z2 of the adhesive layer 60 shown in FIG. 1A is not particularly limited, but is preferably 1 to 5 μm. Further, in the present embodiment, the adhesive layer 60 is formed on the entire surface of the inner main surface 4d of the element body 4, but is at least 80% or more, preferably 90% or more of the area of the inner main surface 4d of the element body 4. , More preferably, it is formed in an amount of more than 95%.

As shown in FIG. 1A, in the present embodiment, the outer surfaces of the end side electrode portions 6a and 8a may be covered with the conductive film 9, respectively. That is, the end-side electrode portion 6a of the element body 4 located on the upper side in the Z-axis direction and the end-side electrode portion 8a of the element body 4 located on the lower side are connected by the conductive film 9 and are connected to the upper side in the Z-axis direction. The end-side electrode portion 8a of the element main body 4 located in the above and the end-side electrode portion 6a of the element main body 4 located below may be connected by a conductive film 9. In that case, the capacitor circuit of the element body 4 located on the upper side in the Z-axis direction and the capacitor circuit of the element body 4 located on the lower side are connected in parallel.

The conductive film 9 does not have to be formed on the outer surfaces of the end side electrode portions 6a and 8a. In that case, two or more independent capacitors are formed inside the multilayer ceramic capacitor 2. .. The conductive film 9 is not particularly limited, but is composed of a conductive adhesive, a resin electrode, or the like.

The shape and size of the multilayer ceramic capacitor 2 may be appropriately determined according to the purpose and application, but in the present embodiment, the total thickness z0 of the multilayer ceramic capacitor 2 in the Z-axis direction is, for example, 100 μm or less, preferably 90 μm or less. The thickness can be further preferably reduced to 80 μm or less, particularly preferably 60 μm or less, which contributes to lowering the height of the multilayer ceramic capacitor 2.

In the present embodiment, the length y0 in the Y-axis direction, which is the length in the longitudinal direction of the capacitor 2, can be set to 3 times or more the thickness z0, preferably 300 μm or more, preferably 400 to 1200 μm. Further, the width x0 of the capacitor 2 in the X-axis direction can be twice or more, preferably 200 μm or more, preferably 200 to 600 μm of the thickness z0.

Further, in the above, the longitudinal direction of the multilayer ceramic capacitor 2 is the Y-axis direction and the lateral direction of the multilayer ceramic capacitor 2 is the X-axis direction, but the longitudinal direction of the multilayer ceramic capacitor 2 is the X-axis direction. It is also possible to design the lateral direction in the Y-axis direction. That is, the distance between the two external electrodes 6 and 8 facing each other can be made shorter than the distance between the two side surfaces 4e and 4e facing each other. In this case, the length x0 in the X-axis direction can be three times or more the thickness z0, preferably 300 μm or more, preferably 400 to 1200 μm. Further, the width y0 of the multilayer ceramic capacitor 2 in the y-axis direction can be twice or more, preferably 200 μm or more, preferably 200 to 600 μm of the thickness z0.

Further, in the multilayer ceramic capacitor 2 according to the present embodiment, since the inner main surfaces 4d of the pair of element main bodies 4 are bonded to each other by the adhesive layer 60, even if a mechanical impact is applied to the electronic component, it may be applied. The adhesive layer absorbs the impact and can effectively suppress the damage of the parts. That is, the adhesive layer 60 can soften the mechanical impact caused by the external force applied to the multilayer ceramic capacitor 2, and can more effectively suppress the damage of the capacitor 2.

Further, since the inner main surface 4d of each element main body 4 is a flat surface, the inner main surfaces 4d of the element main body 4 can be easily adhered to each other by the adhesive layer 60.

Moreover, the terminal electrodes 6 and 8 cover the ends of the element body 4 in the Y-axis direction, and the pair of end-side electrode portions 6a and 8a facing each other in the Y-axis direction and the outer main surface 4c of the element body 6 It has a pair of main surface electrode portions 6b and 8b that continuously cover a part of the end side electrode portions 6a and 8a, respectively. By forming such terminal electrodes 6 and 8 on each element main body 4, for example, as shown in FIG. 5, it becomes easy to embed the multilayer ceramic capacitor 2 inside the multilayer substrate 40.

In FIG. 5, a wiring pattern 42 formed on the multilayer substrate 40 is connected to the main surface electrodes 6b and 8b of the terminal electrodes 6 and 8 of the multilayer ceramic capacitor 2 through a through-hole electrode or the like. The multilayer ceramic capacitor 2 of the present embodiment may be mounted on the circuit board 40a as shown in FIG. 6 by using, for example, an anisotropic conductive adhesive 50.

Further, in the present embodiment, the exterior region 11 constituting the outer main surface 4c or the inner main surface 4d of the element body 4 shown in FIG. 1A is made of a dielectric material having a strength higher than that of the inner dielectric layer 10. You may. With such a configuration, the bending strength of the multilayer ceramic capacitor 2 is further improved. Further, by improving the strength, it becomes easy to lengthen the longitudinal dimension y0 or the width dimension x0 (see FIG. 3) of the element body 4, and the internal electrode layers 12 inside the element body 4 face each other. The area becomes wider and the characteristics such as capacitance are improved. Further, the side gap region 14 shown in FIGS. 2A1 and 2A2 may also be made of a dielectric material having a strength higher than that of the inner dielectric layer 10.

Next, a method for manufacturing the multilayer ceramic capacitor 2 as an embodiment of the present invention will be specifically described.

First, in order to produce the inner green sheet that constitutes the inner dielectric layer 10 and the outer green sheet 11 that constitutes the inner dielectric layer 10 shown in FIG. 1A after firing, the paste for the inner green sheet and the outer green sheet are produced. Prepare the paste for. The inner green sheet paste and the outer green sheet paste are usually composed of an organic solvent-based paste or an aqueous paste obtained by kneading a ceramic powder and an organic vehicle.

As the raw material of the ceramic powder, various compounds to be composite oxides and oxides, for example, carbonates, nitrates, hydroxides, organometallic compounds and the like can be appropriately selected and mixed and used. In the present embodiment, the raw material of the ceramic powder is used as a powder having an average particle size of 0.45 μm or less, preferably about 0.1 to 0.3 μm. In order to make the inner green sheet extremely thin, it is desirable to use a powder finer than the thickness of the green sheet.

An organic vehicle is a binder dissolved in an organic solvent. The binder used for the organic vehicle is not particularly limited, and may be appropriately selected from various ordinary binders such as ethyl cellulose and polyvinyl butyral. The organic solvent used is not particularly limited, and may be appropriately selected from various organic solvents such as acetone and methyl ethyl ketone.

Further, the green sheet paste may contain an additive selected from various dispersants, plasticizers, dielectrics, subcomponent compounds, glass frits, insulators and the like, if necessary.

Examples of the plasticizer include phthalates such as dioctyl phthalate and benzyl butyl phthalate, adipic acid, phosphoric acid esters, and glycols.

Next, a paste for the internal electrode layer is prepared in order to produce an internal electrode pattern layer that will form the internal electrode layer 12 shown in FIG. 1A after firing. The paste for the internal electrode layer is prepared by kneading the above-mentioned conductive material made of various conductive metals and alloys with the above-mentioned organic vehicle.

The terminal electrode paste that constitutes the terminal electrodes 6 and 8 shown in FIG. 1A after firing may be prepared in the same manner as the internal electrode layer paste described above.

Using the paste for the inner green sheet and the paste for the inner electrode layer prepared above, the inner green sheet and the inner electrode pattern layer are alternately laminated to produce an inner laminate. Then, after manufacturing the inner laminate, the outer green sheet paste is used to form the outer green sheet, and the pressure is applied in the lamination direction to obtain the green laminate.

As a method for producing the green laminate, in addition to the above, a predetermined number of inner green sheets and internal electrode pattern layers are alternately laminated directly on the outer green sheet and pressed in the lamination direction to obtain a green laminate. May be good.

Specifically, first, an inner green sheet is formed on a carrier sheet (for example, PET film) as a support by a doctor blade method or the like. The inner green sheet is formed on the carrier sheet and then dried.

Next, an internal electrode pattern layer is formed on the surface of the inner green sheet using the paste for the internal electrode layer to obtain an inner green sheet having the internal electrode pattern layer. Next, a plurality of inner green sheets having an inner electrode pattern layer are laminated to produce an inner laminate, and then an appropriate number of outer green sheets are formed by using pastes for outer green sheets above and below the inner laminate. It is formed and pressed in the stacking direction to obtain a green laminate.

Next, the green laminate is cut into individual pieces to obtain green chips. The method for forming the internal electrode pattern layer is not particularly limited, and the internal electrode pattern layer may be formed by a thin film forming method such as thin film deposition or sputtering in addition to the printing method and the transfer method.

The green chips are solidified by removing the plasticizer by solidification drying. The element main body 4 is obtained from the green chip after solidification and drying by performing a binder removal step, a firing step, and an annealing step performed as needed. The binder removal step, firing step and annealing step may be performed continuously or independently.

Next, the terminal electrode paste is applied to both end faces of the element body 4 in the Y-axis direction and fired to form terminal electrodes 6 and 8. When forming the terminal electrodes 6 and 8, for example, as shown in FIG. 4, a dummy block 20 is temporarily bonded between the inner main surfaces 4d and 4d of the two element bodies 4 and 4, and these are integrated. First, the transformed work 22 is formed.

The dummy block 20 is preferably made of a material that can be removed in a subsequent step, and is preferably a material to which the terminal electrode paste does not easily adhere. The dummy block 20 is made of, for example, silicon rubber, nitrile rubber, polyurethane, fluororesin, PET resin, PEN resin, or the like. The width in the X-axis direction and the width in the Y-axis direction of the dummy block 20 are preferably substantially the same as the size of the element body 4. The thickness of the dummy block 20 in the Z-axis direction may be equal to or thinner than or thicker than the thickness of the element body 4 in the Z-axis direction.

The work 22 may be formed by directly adhering the inner main surfaces 4d and 4d of the two element bodies 4 and 4 with a peelable adhesive in a later step without providing the dummy block 20. .. As the adhesive, for example, a modified silicone polymer, a PVA aqueous solution paste, a water-soluble acrylic resin aqueous solution paste, a modified polyurethane, a modified silicone + epoxy resin two-component type, a starch paste and the like are preferable. Further, instead of the dummy block 20, one or more element bodies 4 may be adhered between the two element bodies 4 and 4 to form the work 22.

Since the work 22 is a combination of two or more element bodies 4, 4, even if the element bodies 4, 4 themselves are thin in the Z-axis direction, the work 22 has a thickness that is sufficiently easy to handle, and is the same as the conventional one. The work 22 can be attached to the through hole 32 of the holding plate 30 to form the terminal electrodes 6 and 8. The method for forming the terminal electrodes 6 and 8 is not particularly limited, and an appropriate method such as coating / baking, plating, vapor deposition, or sputtering of the terminal electrode paste can be used. If necessary, a coating layer is formed on the surfaces of the terminal electrodes 6 and 8 by plating or the like. Examples of the coating layer include Ni plating, Sn plating, Au plating, and Cu plating.

After forming the terminal electrodes 6 and 8, if the two element bodies 4 and 4 are separated by removing the dummy block 20 or the like, the pair of element bodies 4 shown in FIG. 1A can be obtained. That is, the terminal electrodes 6 and 8 are not substantially formed on the inner main surface 4d of each element main body 4, and the entire inner main surface 4d of the element main body 4 is exposed to the outside. Is obtained.

Next, the outer main surface covering layer 18 is formed on the outer main surface 4c perpendicular to the Z axis of the element body 4. The method for forming the outer main surface coating layer 18 is not particularly limited, and examples thereof include dipping, printing, coating, vapor deposition, and sputtering.

For example, when the outer main surface coating layer 18 is formed by coating, the outer main surface coating layer 18 can be formed by applying the coating layer paste to the outer main surface 4c of the element main body 4 and baking it. The baking conditions of the element body 4 to which the coating layer paste is applied are not particularly limited, and for example, the device body 4 is held at 600 to 1000 ° C. for 0.1 to 3 hours and baked in an atmosphere of humidification N ₂ or drying N ₂ .

Next, the surfaces of the main surface electrode portions 6b and 8b and the surfaces of the outer main surface covering layer 18 are polished so that the ends in the Z-axis direction are flush with each other. When a plating film is formed on the surfaces of the main surface electrode portions 6b and 8b, the surface of the plating film and the outer main surface coating layer 18 may be polished so as to be flush with each other.

Next, if the inner main surfaces 4d and 4d of the pair of element bodies 4 and 4 manufactured in this manner are bonded and joined by the adhesive layer 60 shown in FIG. 1A, the multilayer ceramic capacitor shown in FIG. 1A is formed. 2 is obtained.

In the step shown in FIG. 4, the inner main surfaces 4d and 4d of the two element bodies 4 and 4 are bonded by the adhesive layer 60 shown in FIG. 1A without providing the dummy block 20, and also in the subsequent steps. , The terminal electrodes 6 and 8 may be directly formed as they are without separating the element bodies 4 and 4.

The multilayer ceramic capacitor 2 of the present embodiment manufactured in this manner is mounted on a printed circuit board or the like as shown in FIG. 6, for example, and is used in various electronic devices and the like. Alternatively, as shown in FIG. 5, the multilayer ceramic capacitor 2 is embedded and used inside the multilayer substrate 40. Specific applications of the multilayer ceramic capacitor 2 of the present embodiment include, but are not limited to, a decoupling capacitor, and are also used as a high withstand voltage capacitor, a low ESL capacitor, a large capacity capacitor, and the like.

As shown in FIG. 2A2 of the second embodiment, the multilayer ceramic capacitor 2 according to the present embodiment is the same as the multilayer ceramic capacitor 2 of the first embodiment except as shown below. The multilayer ceramic capacitor 2 has a side coating layer 18a continuously provided on the outer main surface coating layer 18 of the first embodiment on the side surface 4e facing the X-axis direction of the element main body 4. With such a configuration, the strength of the multilayer ceramic capacitor 2 is further improved.

The material of the side coating layer 18a is not particularly limited, and may be the same as or different from that of the outer main surface coating layer 18. Further, the thickness of the side coating layer 18a is not particularly limited, and may be the same as or different from that of the outer main surface coating layer 18.

The method for forming the side coating layer 18a is not particularly limited, and is formed by, for example, the same method as the outer main surface coating layer 18.

As shown in FIGS. 1B and 2B of the third embodiment, the multilayer ceramic capacitor 2a according to the present embodiment is the same as the multilayer ceramic capacitor 2 of the first embodiment except as shown below. In this monolithic ceramic capacitor 2a, the outer main surface 4c of at least one of the element bodies 4 includes an outer main surface reinforcing layer 16 made of a material having a strength higher than that of the inner dielectric layer 10.

The outer main surface reinforcing layer 16 is formed on the outer main surface 4c of the element main body 4 after the element main body 4 is formed in the same manner as in the first embodiment and before the terminal electrodes 6 and 8 are formed. The material of the outer main surface reinforcing layer 16 is not particularly limited, and examples thereof include glass, alumina-based composite materials, zirconia-based composite materials, polyimide resins, epoxy resins, aramid fibers, and fiber-reinforced plastics. Further, the material of the outer main surface reinforcing layer 16 may be the same as or different from the material of the outer main surface covering layer 18.

With such a configuration, the bending strength of the multilayer ceramic capacitor 2a is further improved. Further, by improving the strength, even if the element body 4 is thinned, it becomes easy to lengthen the longitudinal dimension y0 or the width dimension x0 (see FIG. 3) of the element body 4, and the inside of the element body 4 The facing area between the internal electrode layers 12 becomes wide, and the characteristics of the multilayer ceramic capacitor 2a such as the capacitance are further improved.

From the above viewpoint, the relative thickness of the outer main surface reinforcing layer 16 obtained from the equation (average thickness of the outer main surface reinforcing layer 16 / average thickness of the main surface electrode portions 6b and 8b) × 100 is 20 to 133%. Is preferable.

The glass component constituting the outer main surface reinforcing layer 16 is not particularly limited, but preferably contains SiO ₂ , BaO, Al ₂ O ₃ , alkali metal, CaO, SrO, and B ₂ O ₃ . SiO ₂ contained as a glass component constituting the outer main surface reinforcing layer 16 is preferably contained in an amount of 30 to 70% by mass in the glass component of the outer main surface reinforcing layer 16. When SiO ₂ is contained in the above range, the amount of network-forming oxide is sufficient as compared with the case where it is less than the above range, and the plating resistance is improved. When SiO ₂ is included in the above range, the softening point is prevented from becoming too high and the working temperature is prevented from becoming too high as compared with the case where the amount is more than the above range.

BaO contained as a glass component constituting the outer main surface strengthening layer 16 of the present embodiment is preferably contained in the glass component of the outer main surface strengthening layer 16 in an amount of 20 to 60% by mass. When BaO is included in the above range, the adhesion to the dielectric layer is improved and delamination is less likely to occur as compared with the case where it is less than the above range. In addition, it prevents the coefficient of thermal expansion from becoming too small and makes it difficult for cracks to occur. Further, when the dielectric layer is BaTiO ₃ , it is possible to prevent Ba from eluting into the glass component and suppress the decrease in HALT reliability. When BaO is included in the above range, the vitrification is improved and the plating resistance is improved as compared with the case where the amount is larger than the above range.

Al ₂ O ₃ contained as a glass component constituting the outer main surface strengthening layer 16 of the present embodiment is preferably contained in an amount of 1 to 15% by mass in the glass component of the outer main surface strengthening layer 16. When Al ₂ O ₃ is contained in the above range, the plating resistance is better than when it is less than the above range. When Al ₂ O ₃ is included in the above range, the softening point is prevented from rising too much as compared with the case where the amount is more than the above range.

It is preferable that SiO ₂ , BaO, and Al ₂ O ₃ are contained in a total of 70 to 100% by mass in the glass component constituting the outer main surface reinforcing layer 16 of the present embodiment. As a result, the Ba—Ti—Si—O phase is easily formed at the interface between the dielectric layer and the outer main surface reinforcing layer 16.

Examples of the alkali metal contained as the glass component constituting the outer main surface reinforcing layer 16 of the present embodiment include Li, Na, and K, but K and Na are more preferable from the viewpoint of the coefficient of thermal expansion. The alkali metal contained as a glass component constituting the outer main surface reinforcing layer 16 of the present embodiment is preferably contained in the glass component of the outer main surface reinforcing layer 16 in an amount of 0.1 to 15% by mass. Thereby, the coefficient of thermal expansion can be increased. When the alkali metal is contained in the above range, the plating resistance can be improved as compared with the case where the alkali metal is contained in the above range.

CaO contained as a glass component constituting the outer main surface strengthening layer 16 of the present embodiment is preferably contained in the glass component of the outer main surface strengthening layer 16 in an amount of 0 to 15% by mass. As a result, the coefficient of thermal expansion can be increased and the plating resistance can be improved.

SrO contained as a glass component constituting the outer main surface strengthening layer 16 of the present embodiment is preferably contained in the glass component of the outer main surface strengthening layer 16 in an amount of 0 to 20% by mass. As a result, the coefficient of thermal expansion can be increased and the plating resistance can be improved. When SrO is included in the above range, it is possible to prevent SrO from reacting with BaTiO ₃ and improve the insulation and reliability of the chip as compared with the case where the amount is larger than the above range.

B ₂ O ₃ contained as a glass component constituting the outer main surface reinforcing layer 16 of the present embodiment is preferably contained in the glass component of the outer main surface reinforcing layer 16 in an amount of 0 to 10% by mass. As a result, the effect as a network-forming oxide of glass can be exhibited. When B ₂ O ₃ is included in the above range, the plating resistance can be improved as compared with the case where the amount exceeds the above range.

In the present embodiment, the outer main surface reinforcing layer 16 constitutes only a part of the outer surface side of the exterior area 11, but may occupy most or all of the exterior area 11. The outer main surface reinforcing layer 16 can be formed by applying a reinforcing layer paste to the outer main surface 4c or the inner main surface 4d of the element main body 4 and baking the paste.

This paste for the reinforcing layer is obtained, for example, by kneading the above-mentioned glass raw material, a binder containing ethyl cellulose as a main component, and tarpineol and acetone as dispersion media with a mixer. The method of applying the reinforcing layer paste to the element body 4 is not particularly limited, and examples thereof include methods such as dipping, printing, coating, vapor deposition, and spraying.

The baking conditions of the element body 4 to which the reinforcing layer paste is applied are not particularly limited. For example, in an atmosphere of humidification N ₂ or drying N ₂ , the element body 4 is held at 700 ° C. to 1300 ° C. for 0.1 to 3 hours and then baked. Be done.

As shown in FIG. 2C of the fourth embodiment, the multilayer ceramic capacitor 2b according to the present embodiment is the same as the multilayer ceramic capacitor 2a of the third embodiment except as shown below. The multilayer ceramic capacitor 2b has a side reinforcing layer 16a that is continuously provided on the outer main surface reinforcing layer 16 of the third embodiment on the side surface 4e facing the element main body 4 along the X-axis direction. With such a configuration, the strength of the multilayer ceramic capacitor 2 is further improved.

In FIG. 2C, the side reinforcing layer 16a constitutes only a part of the side surface 4e side of the side gap region 14, but may occupy the entire side gap region 14. That is, the side reinforcing layer 16a may be in contact with the end portion of the internal electrode layer 12 in the X-axis direction.

The material of the side reinforcing layer 16a is not particularly limited, and may be the same as or different from that of the outer main surface reinforcing layer 16. Further, the thickness of the side reinforcing layer 16a is not particularly limited, and may be the same as or different from that of the outer main surface reinforcing layer 16.

The method for forming the side reinforcing layer 16a is not particularly limited, and is formed by, for example, the same method as the outer main surface reinforcing layer 16.

As shown in FIG. 1C of the fifth embodiment, the multilayer ceramic capacitor 2c according to the present embodiment is the same as the multilayer ceramic capacitor 2a according to the embodiment 1B except as shown below. In this multilayer ceramic capacitor 2c, a reinforcing layer 16 similar to the reinforcing layer 16 formed on the outer main surface 4c of the element main body 4 shown in FIG. 1B is formed on the inner main surface 4d of the element main body 4. Other configurations and effects are the same as in the above-described embodiment. The reinforcing layer 16 is not limited to the configuration shown in FIG. 1C (a method of first forming the reinforcing layer 16 on the element body 4 and then forming the first terminal electrode 6 and the second terminal electrode 8), and the reverse method. (A method of first forming the first terminal electrode 6 and the second terminal electrode 8 on the element body 4 first, and then forming the reinforcing layer 16) may be appropriately used.

The present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the present invention.

For example, when one or more element main bodies 4 are arranged and adhered instead of the dummy block 20 shown in FIG. 4, the end side electrode portions 6a and 8a and the side electrode portions 6c are attached to the element main bodies 4. , 8c only are formed. That is, in that case, the element body 4 having the terminal electrodes 6 and 8 substantially not formed on both the inner main surface 4d and the outer main surface 4c of the element body 4 can be obtained. These element main bodies 4 have terminal electrodes in which terminal electrodes 6 and 8 are not substantially formed on both the inner main surface 4d and the outer main surface 4c of the element main body 4. Therefore, such an element body 4 can be bonded to, for example, the pair of element bodies 4 shown in FIG. 1A via an adhesive layer 60. In that case, three or more element bodies 4 constitute the laminated ceramic electronic component.

Further, in the above embodiment, the outer main surface covering layer 18 covers the outer main surface 4c of the element main body 4 located between the pair of main surface electrode portions 6b and 8b, but the outer main surface 4c of the element main body 4 is covered. The outer main surface covering layer 18 may not cover the surface.

Further, the multilayer ceramic electronic component of the present invention is not limited to the multilayer ceramic capacitor, and can be applied to other multilayer ceramic electronic components. Other laminated electronic components include all electronic components in which a dielectric layer (insulating layer) is laminated via internal electrodes, such as a bandpass filter, an inductor, a laminated three-terminal filter, a piezoelectric element, a PTC thermistor, and an NTC. Examples include a thermistor and a varistor.

Further, in the laminated ceramic electronic component of the present invention, the element body and the element body combined via the adhesive layer 60 may be different types of electronic components. For example, one element body may be a monolithic ceramic capacitor, the other may be an inductor, or the like.

Hereinafter, the present invention will be described based on more detailed examples, but the present invention is not limited to these examples.

Sample number 1
As described below, the multilayer ceramic capacitor 2 of sample number 1 was produced.

First, BaTiO ₃ ceramic powder: 100 parts by mass, polyvinyl butyral resin: 10 parts by mass, dioctyl phthalate (DOP) as a plasticizer: 5 parts by mass, and alcohol as a solvent: 100 parts by mass are mixed by a ball mill. To obtain a paste for the inner green sheet.

Separately from the above, 44.6 parts by mass of Ni particles, 52 parts by mass of terpineol, 3 parts by mass of ethyl cellulose and 0.4 parts by mass of benzotriazole are kneaded by three rolls to form a slurry. A paste for the internal electrode layer was prepared.

The inner green sheet was formed on the PET film using the inner green sheet paste prepared above. Next, the internal electrode pattern layer was formed in a predetermined pattern using the paste for the internal electrode layer, and then the sheet was peeled off from the PET film to obtain an inner green sheet having the internal electrode pattern layer.

The inner green sheets having the inner electrode pattern layer thus obtained were alternately laminated to produce an inner laminate.

Next, an appropriate number of outer green sheets were formed above and below the inner laminate using the outer green sheet paste, and pressure-bonded in the lamination direction to obtain a green laminate. The paste for the outer green sheet was obtained by the same method as the paste for the inner green sheet.

Next, the green laminate was cut to obtain green chips.

Next, the obtained green chip was subjected to binder removal treatment, firing and annealing under the following conditions to obtain an element body 4.

The binder removal treatment conditions were a heating rate of 60 ° C./hour, a holding temperature of 260 ° C., a holding time of 8 hours, and an atmosphere of air.

The firing conditions were a heating rate of 200 ° C./hour, a holding temperature of 1000 ° C. to 1200 ° C., and a temperature holding time of 2 hours. The cooling rate was 200 ° C./hour. The atmospheric gas was a humidified N ₂ + H ₂ mixed gas.

The annealing condition was a Atsushi Nobori rate: 200 ° C. / hour, holding temperature: 500 ° C. to 1000 ° C., a temperature holding time: 2 hours, cooling rate: 200 ° C. / time, the atmospheric gas of a wet _{N 2} gas.

A wetter was used to humidify the atmospheric gas during firing and annealing.

Next, as shown in FIG. 4, a dummy block 20 is temporarily bonded between the inner main surfaces 4d and 4d of the two element bodies 4 and 4, respectively, and a work 22 in which these are integrated is first formed. Then, the work 22 was attached to the through hole 32 of the holding plate 30.

Next, 100 parts by mass of a mixture of spherical Cu particles having an average particle size of 0.4 μm and flaky Cu powder, and 30 parts by mass of an organic vehicle (5 parts by mass of ethyl cellulose resin dissolved in 95 parts by mass of butyl carbitol). , And 6 parts by mass of butyl carbitol were kneaded to obtain a paste for terminal electrodes.

The resulting terminal electrode paste dip by applying to the end surface of the Y-axis direction of the ceramic sintered body, and baked 10 minutes at 850 ° C. in a N ₂ atmosphere, the terminal electrodes 6 and 8 on the surface of the device main body 4 Formed.

Next, the dummy block 20 was removed to separate the two element bodies 4 and 4. Next, the inner main surfaces 4d and 4d of the pair of element bodies 4 and 4 manufactured in this manner are bonded and joined by the adhesive layer 60 shown in FIG. 1A, and the multilayer ceramic capacitor shown in FIG. 1A is bonded. I got 2. The adhesive layer 60 was made of a polyimide resin.

As shown in Table 1, the thickness z0 of the multilayer ceramic capacitor 2 was 80 μm. The thickness of the main surface electrode portions 6b and 8b was 15 μm, and the thickness of the end side electrode portions 6a and 8a was 10 μm. Further, the outer main surface covering layer 18 shown in FIG. 1A was not formed.

Sample number 2
Sample No. 2 is the same as Sample No. 1 except that, as shown in FIG. 1B, the outer main surface reinforcing layer 16 is formed of Si—B—Zn—O based glass on the outer main surface 4c of the element body 4. The multilayer ceramic capacitor 2 was manufactured. The specifications of sample number 2 are shown in Table 1.

Sample numbers 3-5
In sample numbers 3 to 5, the multilayer ceramic capacitor 2 was produced in the same manner as in sample number 2 except that the outer main surface reinforcing layer 16 was formed of Si—Al—Ca—O glass, polyimide resin, and epoxy resin, respectively. did. The specifications of sample numbers 2 to 5 are shown in Table 1.

Sample number 6
In sample number 6, the multilayer ceramic capacitor 2 was produced in the same manner as in sample number 1 except that the adhesive layer 60 was formed of epoxy resin. The specifications of sample number 6 are shown in Table 1.

Sample numbers 7-10
In sample numbers 7 to 10, the multilayer ceramic capacitor 2 was produced in the same manner as in sample numbers 2 to 5, except that the adhesive layer 60 was formed of epoxy resin. The specifications of sample numbers 7 to 10 are shown in Table 1.

Sample number 11
In sample number 11, in FIG. 4, only a single element body 4 having a thickness of 100 μm prepared by a conventional method is held by a holding plate 30 without a dummy block, and terminal electrodes are attached to both end faces of the element body 4, respectively. 6 and 8 were formed to prepare a multilayer ceramic capacitor. The specifications of sample number 11 are shown in Table 1.

<3-point bending strength>
The three-point bending strength of the obtained sample of the multilayer ceramic capacitor 2 was measured using a measuring instrument (trade name: 5543, manufactured by Instron). The jig distance between the two points that support the test piece during measurement is 400 μm, the measurement speed is 0.5 mm / min, and the average value (unit: MPa) of the values obtained by measuring with 10 tests is measured. did. Table 1 shows the relative values of each sample when the three-point bending strength of sample number 2 is 100%. The 3-point bending strength of Sample No. 1 was 200 MPa.

<Impact load test>
The repeated load test (impact load test) was carried out by Instron; using a strength tester with a trade name of 5543, an impact load stress of 10 MPa was repeatedly applied to the obtained sample of the multilayer ceramic capacitor 2 every 5 seconds. The percentage of samples that were not destroyed was examined. A test was performed on 20 samples to determine the percentage. The results are shown in Table 1.

From Table 1, it was confirmed that the presence of the adhesive layer improves the bending strength of the monolithic ceramic capacitor and the resistance to impact load even if it is thin.

2,2a, 2b, 2c ... Multilayer ceramic capacitor 4 ... Element body 4a, 4b ... End surface 4c ... Outer main surface 4d ... Inner main surface 4e ... Side surface 6 ... First terminal electrode 6a ... End side electrode part 6b ... Main surface electrode Part 6c ... Side electrode part 8 ... Second terminal electrode 8a ... End side electrode part 8b ... Main surface electrode part 8c ... Side electrode part 9 ... Conductive film 10 ... Inner dielectric layer 11 ... Exterior area 12 ... Internal electrode layer 12a, 12b ... Drawer portion 13 ... Interior area 14 ... Side gap area 16 ... Reinforcing layer 16a ... Side reinforcing layer 18 ... Outer main surface covering layer 18a ... Side covering layer 20 ... Dummy block 22 ... Work 30 ... Holding plate 32 ... Through hole 40 ... Multilayer substrate 40a ... Circuit boards 42, 42a ... Wiring pattern 50 ... Iteroelectric conductive adhesive 60 ... Adhesive layer

Claims (8)

A pair of element bodies in which internal electrode layers and insulating layers substantially parallel to a plane including the first axis and the second axis are alternately laminated along the direction of the third axis.
A laminated ceramic electronic component having a terminal electrode formed in close contact with each end surface of the element body and electrically connected to the internal electrode layer.
The terminal electrodes are not substantially present on the outer main surface of each of the element bodies and the inner main surface of the element body located on the opposite side along the direction of the third axis.
A laminated ceramic electronic component characterized in that the inner main surfaces of the pair of element bodies are bonded to each other by an adhesive layer. A pair of terminal electrodes formed on at least one of the element bodies covers the end of the element body in the direction of the second axis from which the internal electrode layer is pulled out and faces each other in the direction of the second axis. A claim having an end side electrode portion of the device and a pair of main surface electrode portions that continuously cover a part of the outer main surface substantially perpendicular to the third axis of the element body to the end side electrode portion. Item 2. The laminated ceramic electronic component according to Item 1. The laminated ceramic electronic component according to claim 1 or 2, wherein the adhesive layer is composed of a resin layer. The laminated ceramic electronic component according to any one of claims 1 to 3, which has a reinforcing layer on the outer main surface or the inner main surface of the element body. The laminated ceramic electronic component according to claim 4, wherein the material of the reinforcing layer is glass containing Si as a main component. The laminated ceramic electronic component according to claim 4, wherein the material of the reinforcing layer is a film containing a resin as a main component. The laminated ceramic electronic component according to any one of claims 1 to 6, wherein the surface of the terminal electrode is covered with at least one selected from Ni plating, Sn plating, Au plating and Cu plating. The laminated ceramic electronic component according to any one of claims 1 to 7, which can be embedded in a substrate.

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