JP2020161548A - Multilayer ceramic electronic component - Google Patents

Abstract

To provide a multilayer ceramic electronic component capable of achieving both of an acquisition of an electrostatic capacity and a suppression of a mounted area in a high resistance voltage design.SOLUTION: A multilayer ceramic electronic component 10A comprises: a multilayer ceramic electronic component main body 12A, containing a first lamination body 20 and a second lamination body 40 having a plurality of laminated ceramic layers and a plurality of laminated inner electrodes; a first outer electrode 50a arranged on a first end surface of the first lamination body; a second outer electrode 50b arranged over on a second end surface of the first lamination body and a third end surface of the second lamination body; and a third outer electrode 50c arranged on at least fourth end surface of the second lamination body. The first and second lamination bodies 20 and 40 are arranged so that the second end surface of the first lamination body and the third end surface of the second lamination body are opposite, and comprises: a first metal terminal 16 connected to the first outer electrode 50a; and a second metal terminal 18 connected to the third outer electrode 50c.SELECTED DRAWING: Figure 1

Description

The present invention relates to laminated ceramic electronic components, particularly laminated ceramic electronic components suitable for high withstand voltage.

In recent years, due to the miniaturization and surface mounting of electronic devices, the size and capacity of multilayer ceramic capacitors have been increasing. Such a flow has spread to medium- and high-voltage capacitors such as those for backlights of liquid crystal displays and switching power supplies. Therefore, even in the field of high withstand voltage multilayer ceramic capacitors, smaller and higher capacity multilayer ceramic capacitors are desired.

As a method for increasing the withstand voltage, for example, the method described in Patent Document 1 has been proposed. In this method, as shown in FIG. 15, the internal electrodes 4 connected to the opposing external electrodes 3 at both ends of the laminate 2 formed of the dielectric are divided into a plurality of parts so as to overlap both sides of the divided parts. The structure is such that adjacent internal electrodes 5 are formed with a dielectric layer in between. Here, the internal electrode 5 is not connected to the external electrode 3.

With such a structure, a capacitor is formed at a portion facing the internal electrode 4 and the internal electrode 5. Therefore, a plurality of capacitors are formed between the facing external electrodes 3, and these capacitors are connected in series. Therefore, the voltage applied to each capacitor becomes low, and the internal withstand voltage of the laminated body 2 can be increased.

Japanese Unexamined Patent Publication No. 2003-272946

However, in order to obtain a higher withstand voltage, it is necessary to increase the number of divisions of the internal electrodes and increase the number of facing portions of the internal electrodes (increase the number of capacitors connected in series). However, there is a limit to realizing such a high withstand voltage design within the standard dimensions of the monolithic ceramic capacitor. This is because if the number of divisions of the internal electrodes is increased and the number of the facing portions of the internal electrodes is increased, the effective area of the facing portions of the internal electrodes is reduced, which makes it difficult to acquire the capacitance.

Further, as the above countermeasure, it is conceivable to mount a plurality of multilayer ceramic capacitors having a structure in which the number of facing portions of the internal electrodes is increased on the mounting substrate, but in that case, as the number of multilayer ceramic capacitors increases, , The mounting area becomes large.

Therefore, a main object of the present invention is to provide a laminated ceramic electronic component capable of both acquiring a capacitance and suppressing a mounting area in a high withstand voltage design.

The laminated ceramic electronic component according to the present invention has a plurality of laminated ceramic layers and a plurality of laminated internal electrodes, and has a first main surface and a second main surface facing each other in the stacking direction, and a stacking direction. A first laminate having a first side surface and a second side surface facing the width direction orthogonal to, and a first end face and a second end surface facing the length direction orthogonal to the stacking direction and the width direction. A third main surface and a fourth main surface which are provided so as to face the first laminated body and include a plurality of laminated ceramic layers and a plurality of laminated internal electrodes and face each other in the stacking direction. A surface, a third side surface and a fourth side surface opposite to each other in the width direction orthogonal to the stacking direction, and a third end surface and a fourth end surface facing each other in the length direction orthogonal to the stacking direction and the width direction. A second laminate having, a first external electrode arranged on at least the first end face of the first laminate, and a second of the second laminate and the second laminate of the first laminate. A laminated ceramic electronic component body comprising a second external electrode arranged over the end face of 3 and a third external electrode arranged over at least the fourth end face of the second laminate. , The first laminated body and the second laminated body are arranged so that the second end face of the first laminated body and the third end face of the second laminated body face each other, and the first outer surface A monolithic ceramic electronic component comprising a first metal terminal connected to an electrode and a second metal terminal connected to a third external electrode.

According to the present invention, in a high withstand voltage design, a laminated ceramic electronic component capable of both acquiring a capacitance and suppressing a mounting area can be obtained.

The above-mentioned object, other object, feature and advantage of the present invention will be further clarified from the description of the embodiment for carrying out the following invention with reference to the drawings.

It is an external perspective view which shows an example of the laminated ceramic electronic component which concerns on 1st Embodiment of this invention. It is sectional drawing in line II-II of FIG. It is sectional drawing in line III-III of FIG. It is sectional drawing in line IV-VI of FIG. FIG. 5 is an external perspective view showing an example of a laminated ceramic electronic component provided with a modified example of the metal terminal shown in FIG. 1. FIG. 5 is a cross-sectional view taken along the line VI-VI of FIG. FIG. 5 is an external perspective view showing an example of a laminated ceramic electronic component provided with another modification of the metal terminal shown in FIG. 1. FIG. 7 is a cross-sectional view taken along the line VIII-VIII of FIG. It is an external perspective view which shows an example of the laminated ceramic electronic component which concerns on 2nd Embodiment of this invention. It is sectional drawing in line XX of FIG. FIG. 5 is an external perspective view showing an example of a laminated ceramic electronic component provided with a modified example of the metal terminal shown in FIG. 11 is a cross-sectional view taken along the line XII-XII of FIG. 9 is an external perspective view showing an example of a laminated ceramic electronic component provided with another modification of the metal terminal shown in FIG. 9. It is sectional drawing in the line XIV-XIV line of FIG. It is sectional drawing which shows the conventional laminated ceramic electronic component.

1. 1. Multilayer ceramic electronic components (first embodiment)
The laminated ceramic electronic component according to the first embodiment of the present invention will be described. FIG. 1 is an external perspective view showing an example of a laminated ceramic electronic component according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line II-II of FIG. FIG. 3 is a cross-sectional view taken along the line III-III of FIG. FIG. 4 is a cross-sectional view taken along the line IV-VI of FIG.

As shown in FIGS. 1 to 4, the laminated ceramic electronic component 10A is composed of a laminated ceramic electronic component main body 12A, a first metal terminal 16, and a second metal terminal 18.
The dimension of the laminated ceramic electronic component 10A in the length direction Z is the L dimension. The L dimension is not particularly limited, but is 10.0 mm or more and 19.0 mm or less. The dimension of the laminated ceramic electronic component 10A in the height direction X is defined as the T dimension. The T dimension is not particularly limited, but is 2.0 mm or more and 3.7 mm or less. The dimension Y in the width direction of the laminated ceramic electronic component 10A is the W dimension. The W dimension is not particularly limited, but can be 1.2 mm or more and 5.0 mm or less.

The laminated ceramic electronic component main body 12A is composed of a rectangular parallelepiped first laminated body 20, a rectangular parallelepiped second laminated body 40, and an external electrode 50.

At the lower part of the laminated ceramic electronic component 10A in the height direction X, the first metal terminal 16 is connected to the first external electrode 50a, and the second metal terminal 18 is connected to the third external electrode 50c. Has been done.

Hereinafter, the components of the laminated ceramic electronic component 10A will be described in more detail.

(A) Laminated Ceramic Electronic Component Body (i) First Laminated Body As shown in FIGS. 1 to 4, the first laminated body 20 has a plurality of laminated ceramic layers 22 and a plurality of internal electrodes laminated. 24 and is included. Further, the first laminated body 20 has a first main surface 20a and a second main surface 20b facing the stacking direction, and a first side surface 20c and a second side surface facing the width direction orthogonal to the stacking direction. It has 20d and a first end face 20e and a second end face 20f facing each other in the length direction orthogonal to the stacking direction and the width direction.

It is preferable that the corners and ridges of the first laminated body 20 are rounded. The corner portion is a portion where three adjacent surfaces of the laminated body intersect, and the ridge portion is a portion where two adjacent surfaces of the laminated body intersect. Further, the first main surface 20a and the second main surface 20b, the first side surface 20c and the second side surface 20d, and a part or all of the first end surface 20e and the second end surface 20f are uneven. Etc. may be formed.

The first laminate 20 is an inner layer portion composed of an outer layer portion 23a composed of a plurality of ceramic layers 22, a single or a plurality of ceramic layers 22, and a plurality of internal electrodes 24 arranged on the ceramic layers 22. Includes 23b. The outer layer portion 23a is located on the first main surface 20a side and the second main surface 20b side of the first laminated body 20, and is the internal electrode 24 closest to the first main surface 20a and the first main surface 20a. It is an aggregate of a plurality of ceramic layers 22 located between the two ceramic layers 22 and a plurality of ceramic layers 22 located between the second main surface 20b and the internal electrode 24 closest to the second main surface 20b. .. The region sandwiched between the two outer layer portions 23a is the inner layer portion 23b. In other words, the inner layer portion 23b includes the inner electrode 24, and the outer layer portion 23a does not include the inner electrode 24.

When the first laminate 20 to function as a capacitor, as the material of the ceramic layer 22, for example, can be used a dielectric ceramic containing a component such as BaTiO _3, CaTiO _3, SrTiO ₃ or CaZrO _3,. When the above-mentioned dielectric material is contained as a main component, the content is higher than that of the main component such as Mn compound, Fe compound, Cr compound, Co compound or Ni compound, depending on the desired characteristics of the first laminate 20. You may use the thing which added the component with less.

When a piezoelectric ceramic is used for the first laminated body 20, the laminated ceramic electronic component main body 12A functions as a ceramic piezoelectric element. Specific examples of the piezoelectric ceramic material include PZT (lead zirconate titanate) ceramic materials.
When a semiconductor ceramic is used for the first laminated body 20, the laminated ceramic electronic component main body 12A functions as a thermistor element. Specific examples of the semiconductor ceramic material include, for example, a spinel-based ceramic material.
Further, when magnetic ceramic is used for the first laminated body 20, the laminated ceramic electronic component main body 12A functions as an inductor element. Further, when functioning as an inductor element, the internal electrode 24 becomes a coil-shaped conductor. Specific examples of the magnetic ceramic material include a ferrite ceramic material.

The thickness of the ceramic layer 22 after firing is preferably 0.5 μm or more and 10 μm or less.

The first laminated body 20 has, for example, a plurality of substantially rectangular first internal electrodes 24a and a plurality of second internal electrodes 24b as the plurality of internal electrodes 24. The plurality of first internal electrodes 24a and the plurality of second internal electrodes 24b are embedded so as to be alternately arranged at equal intervals along the stacking direction of the first laminated body 20.
The first internal electrode 24a and the second internal electrode 24b may be arranged so as to be parallel to the mounting surface or perpendicular to the mounting surface.

One end side of the first internal electrode 24a has a first lead-out electrode portion 26a drawn out from the first end face 20e of the first laminated body 20. On one end side of the second internal electrode 24b, there is a second lead-out electrode portion 26b drawn out to the second end face 20f of the first laminated body 20. Specifically, the first extraction electrode portion 26a on one end side of the first internal electrode 24a is exposed on the first end surface 20e of the first laminated body 20. Further, the second extraction electrode portion 26b on one end side of the second internal electrode 24b is exposed on the second end surface 20f of the first laminated body 20.
The shape of the internal electrode 24 may be a T-shape that is drawn out only to the end faces or both sides.

The first laminated body 20 includes a counter electrode portion 28a in which the first internal electrode 24a and the second internal electrode 24b face each other via the ceramic layer 22 in the inner layer portion 23b of the ceramic layer 22. When the multilayer ceramic electronic component main body 12A is a capacitor, a capacitance is formed in the counter electrode portion 28a.

Further, the first laminated body 20 is formed between one end of the counter electrode portion 28a in the width direction and the first side surface 20c and between the other end of the counter electrode portion 28a in the width direction and the second side surface 20d. The side portion (hereinafter, referred to as “W gap”) 28b of the first laminated body 20 to be formed is included. Further, the first laminated body 20 is formed between the end portion of the first internal electrode 24a opposite to the first extraction electrode portion 26a and the second end surface 20f and the second of the second internal electrode 24b. 28c includes an end portion (hereinafter, referred to as “L gap”) 28c of the first laminated body 20 formed between the end portion on the side opposite to the extraction electrode portion 26b and the first end surface 20e.

The internal electrode 24 contains, for example, a metal such as Ni, Cu, Ag, Pd, or Au, or an alloy containing one of these metals, such as an Ag—Pd alloy. The internal electrode 24 may further contain dielectric particles having the same composition as the ceramics contained in the ceramic layer 22.

The thickness of the internal electrode 24 is preferably 0.1 μm or more and 2.0 μm or less, for example.

(Ii) Second Laminated Body The second laminated body 40 has the same structure as the first laminated body 20.
As shown in FIGS. 1 to 4, the second laminated body 40 includes a plurality of laminated ceramic layers 42 and a plurality of laminated internal electrodes 44. Further, the second laminated body 40 has a third main surface 40a and a fourth main surface 40b facing the stacking direction, and a third side surface 40c and a fourth side surface facing the width direction orthogonal to the stacking direction. It has 40d and a third end face 40e and a fourth end face 40f facing each other in the length direction orthogonal to the stacking direction and the width direction.

It is preferable that the corners and ridges of the second laminate 40 are rounded. The corner portion is a portion where three adjacent surfaces of the laminated body intersect, and the ridge portion is a portion where two adjacent surfaces of the laminated body intersect. Further, the third main surface 40a and the fourth main surface 40b, the third side surface 40c and the fourth side surface 40d, and a part or all of the third end surface 40e and the fourth end surface 40f are uneven. Etc. may be formed.

The second laminated body 40 is composed of an outer layer portion 43a composed of a plurality of ceramic layers 42, a single or a plurality of ceramic layers 42, and an inner layer portion composed of a plurality of internal electrodes 44 arranged on the ceramic layers 42. Including 43b. The outer layer portion 43a is located on the third main surface 40a side and the fourth main surface 40b side of the second laminated body 40, and is the internal electrode 44 closest to the third main surface 40a and the third main surface 40a. It is an aggregate of a plurality of ceramic layers 42 located between the four ceramic layers 42 and a plurality of ceramic layers 42 located between the fourth main surface 40b and the internal electrode 44 closest to the fourth main surface 40b. .. The region sandwiched between the two outer layer portions 43a is the inner layer portion 43b. In other words, the inner layer portion 43b includes the inner electrode 44, and the outer layer portion 43a does not include the inner electrode 44.

Since the material used for the ceramic layer 42 is the same as that of the ceramic layer 22, the description thereof will be omitted.

The second laminated body 40 has, for example, a plurality of substantially rectangular third internal electrodes 44a and a plurality of fourth internal electrodes 44b as the plurality of internal electrodes 44. The plurality of third internal electrodes 44a and the plurality of fourth internal electrodes 44b are embedded so as to be alternately arranged at equal intervals along the stacking direction of the second laminated body 40.
The third internal electrode 44a and the fourth internal electrode 44b may be arranged so as to be parallel to the mounting surface or perpendicular to the mounting surface.

On one end side of the third internal electrode 44a, there is a third extraction electrode portion 46a that is drawn out to the third end surface 40e of the second laminated body 40. On one end side of the fourth internal electrode 44b, there is a fourth extraction electrode portion 46b drawn out to the fourth end surface 40f of the second laminated body 40. Specifically, the third extraction electrode portion 46a on one end side of the third internal electrode 44a is exposed on the third end surface 40e of the second laminated body 40. Further, the fourth extraction electrode portion 46b on one end side of the fourth internal electrode 44b is exposed on the fourth end surface 40f of the second laminated body 40.
The shape of the internal electrode 44 may be a T-shape that is drawn out only to the end faces or both sides.

In the inner layer portion 43b of the ceramic layer 42, the second laminated body 40 includes a counter electrode portion 48a in which the third internal electrode 44a and the fourth internal electrode 44b face each other via the ceramic layer 42. When the multilayer ceramic electronic component main body 12A is a capacitor, a capacitance is formed in the counter electrode portion 48a.

Further, the second laminated body 40 is formed between one end of the counter electrode portion 48a in the width direction and the third side surface 40c and between the other end of the counter electrode portion 48a in the width direction and the fourth side surface 40d. The side portion (hereinafter, referred to as “W gap”) 48b of the second laminated body 40 to be formed is included. Further, the second laminated body 40 is formed between the end portion of the third internal electrode 44a opposite to the third extraction electrode portion 48a and the fourth end surface 40f and the fourth of the fourth internal electrode 44b. Includes the end portion (hereinafter, referred to as “L gap”) 48c of the second laminated body 40 formed between the end portion on the side opposite to the extraction electrode portion 48b and the third end surface 40e.

Since the material and thickness of the internal electrode 44 are the same as those of the internal electrode 24, the description thereof will be omitted.

As shown in FIGS. 1 and 2, the first laminate 20 and the second laminate 40 are the second end face 20f of the first laminate 20 and the third laminate 40 of the second laminate 40. It is arranged so as to face the end face 40e. As a result, the first laminated body 20 and the second laminated body 40 are arranged in series.

(Iii) External electrode The external electrode 50 includes a first external electrode 50a, a second external electrode 50b, and a third external electrode 50c.

The first external electrode 50a is arranged on the surface of the first end face 20e of the first laminated body 20. At this time, the first external electrode 50a extends from the first end surface 20e of the first laminated body 20 and extends from the first main surface 20a, the second main surface 20b, the first side surface 20c, and the second side surface 20c. It is formed so as to cover each part of the side surface 20d. In this case, the first external electrode 50a is electrically connected to the first extraction electrode 26a of the first internal electrode 24a. However, the first external electrode 50a may be arranged only on the surface of the first end surface 20e of the first laminated body 20.

The second external electrode 50b is arranged so as to straddle the surface of the second end surface 20f of the first laminated body 20 and the surface of the third end surface 40e of the second laminated body 40.
At this time, the second external electrode 50b extends from the second end surface 20f of the first laminated body 20, and the first main surface 20a, the second main surface 20b, the first side surface 20c, and the second side surface 20c. It is formed so as to cover each part of the side surface 20d of the. In this case, the second external electrode 50b is electrically connected to the second extraction electrode 26b of the second internal electrode 24b.
Further, the second external electrode 50b extends from the third end surface 40e of the second laminated body 40, and the third main surface 40a, the fourth main surface 40b, the third side surface 40c, and the fourth side surface 40c. It is formed so as to cover each part of the side surface 40d. In this case, the second external electrode 50b is electrically connected to the third extraction electrode 46b of the third internal electrode 44a.

The third external electrode 50c is arranged on the surface of the fourth end surface 40f of the second laminated body 40, extends from the fourth end surface 40f, and extends from the third main surface 40a, the fourth main surface 40b, and the third. It is formed so as to cover a part of each of the side surface 40c of the third and the side surface 40d of the fourth side. In this case, the third external electrode 50c is electrically connected to the fourth extraction electrode 46b of the fourth internal electrode 44b. However, the third external electrode 50c may be arranged only on the surface of the fourth end surface 40f of the second laminated body 40.

As shown in FIG. 2, the first external electrode 50a is a first plating arranged on the surfaces of the first base electrode layer 52a and the first base electrode layer 52a in order from the first laminated body 20 side. It has a layer 54a. As shown in FIG. 2, the second external electrode 50b has a second base electrode layer 52b and a second plating layer 54b arranged on the surface of the second base electrode layer 52b. As shown in FIG. 2, the third external electrode 50c is a third plating arranged on the surfaces of the third base electrode layer 52c and the third base electrode layer 52c in order from the second laminated body 40 side. It has a layer 54c and.

The first base electrode layer 52a is arranged on the surface of the first end surface 20e of the first laminate 20, extends from the first end surface 20e, and extends from the first main surface 20a and the second main surface 20b. It is formed so as to cover a part of each of the first side surface 20c and the second side surface 20d. However, the first base electrode layer 52a may be arranged only on the surface of the first end surface 20e of the first laminated body 20.

The second base electrode layer 52b is arranged so as to straddle the surface of the second end surface 20f of the first laminate 20 and the surface of the third end surface 40e of the second laminate 40.
At this time, the second base electrode layer 52b extends from the second end surface 20f of the first laminated body 20, and the first main surface 20a, the second main surface 20b, the first side surface 20c, and the first side surface 20c. It is formed so as to cover each part of the side surface 20d of 2. In this case, the second base electrode layer 52b is electrically connected to the second extraction electrode 26b of the second internal electrode 24b.
Further, the second base electrode layer 52b extends from the third end surface 40e of the second laminated body 40, and extends from the third main surface 40a, the fourth main surface 40b, the third side surface 40c, and the fourth. It is formed so as to cover each part of the side surface 40d of the. In this case, the second base electrode layer 52b is electrically connected to the third extraction electrode 46a of the third internal electrode 44a.

Further, the third base electrode layer 52c is arranged on the surface of the fourth end surface 40f of the second laminated body 40 and extends from the fourth end surface 40f to form the third main surface 40a and the fourth main surface. It is formed so as to cover a part of each of the 40b, the third side surface 40c, and the fourth side surface 40d. However, the third base electrode layer 52b may be arranged only on the surface of the fourth end surface 40f of the second laminated body 40.

The base electrode layer contains glass and metal. The metal of the base electrode layer includes, for example, at least one selected from Cu, Ni, Ag, Pb, Ag-Pb alloy, Au and the like. Further, the glass of the base electrode layer contains at least one selected from B, Si, Ba, Mg, Al, Li and the like. The base electrode layer may be a plurality of layers. The base electrode layer is obtained by applying a conductive paste containing glass and metal to the first laminate 20 and the second laminate 40 and baking them, and simultaneously with the ceramic layers 22, 42 and the internal electrodes 24, 44. It may be fired, or the ceramic layers 22, 42 and the internal electrodes 24, 44 may be fired and then baked. The thickness of the thickest portion of the base electrode layer is preferably 10 μm or more and 50 μm or less.

The first plating layer 54a is arranged on the surface thereof so as to cover the first base electrode layer 52a. Similarly, the second plating layer 54b is arranged on the surface thereof so as to cover the second base electrode layer 52b. Further, similarly, the third plating layer 54c is arranged on the surface thereof so as to cover the third base electrode layer 52c.

Further, examples of the first plating layer 54a, the second plating layer 54b and the third plating layer 54c (hereinafter, also simply referred to as a plating layer) include Cu, Ni, Sn, Ag, Pd and Ag-Pd alloys. , Or at least one metal selected from Au and the like, or an alloy containing the metal is used.

The plating layer may be formed by a plurality of layers. In this case, the plating layer preferably has a two-layer structure of a Ni plating layer and a Sn plating layer. By providing the Ni plating layer so as to cover the surface of the base electrode layer, it is possible to prevent the base electrode layer from being eroded by the solder when the laminated ceramic electronic component 10A is mounted on the mounting substrate. Further, by providing the Sn plating layer on the surface of the Ni plating layer, the wettability of the solder when mounting the laminated ceramic electronic component 10A can be improved and the mounting can be easily performed.

The thickness of one layer of the plating layer is preferably 1 μm or more and 15 μm or less.

In the laminated ceramic electronic component main body 12A shown in FIG. 1, the second external electrode 50b straddles the second end surface 20f of the first laminated body 20 and the third end surface 40e of the second laminated body 40. Since they are arranged, a series connection structure can be obtained, and the voltage applied to the laminated ceramic electronic component 10A can be lowered, so that a high withstand voltage can be achieved. Further, in a large-capacity region, a plurality of ordinary multilayer ceramic capacitors can be arranged side by side, and the laminated ceramic electronic component 10A of the present invention can have a smaller mounting area and a larger acquisition area with respect to the mounting area. Become. As a result, it is possible to acquire the capacity and reduce the mounting area while ensuring the withstand voltage design.

Further, in the laminated ceramic electronic component main body 12A shown in FIG. 1, since the second external electrode 50b is integrally formed across the first laminated body 20 and the second laminated body 40, the following It is possible to obtain the effect.

That is, it is possible to suppress the extra material cost of the material for forming the base electrode layer and the plating layer and the solder for connecting the two laminated ceramic electronic component bodies.

In addition, when two laminated ceramic electronic component bodies are connected by solder (bonding material), when a temperature cycle (assumed actual use stress) is applied, a stress difference occurs due to the difference in linear expansion coefficient between the ceramic electronic component and the bonding solder. Since it is generated, cracks may occur in the solder portion. As a result, there is a concern that the long-term joining reliability will decrease. On the other hand, in the structure of the laminated ceramic electronic component main body 12A shown in FIG. 1, solder (bonding material) is not used for joining the two laminated bodies, and they are connected by a second external electrode 50b formed integrally. In the first place, cracks do not occur in the solder part. Therefore, long-term joining reliability can be ensured.

Further, when the two laminated ceramic electronic component bodies are connected by solder (bonding material), reflow mounting is performed when connecting the metal terminal to the laminated ceramic electronic component body or when mounting the laminated ceramic electronic component on the mounting substrate. It will be. At this time, there is a concern that the solder connecting the two laminated ceramic electronic component main bodies may be remelted in a high temperature environment during reflow, and the two laminated ceramic electronic component main bodies may come off or be displaced. On the other hand, in the structure of the laminated ceramic electronic component main body 12A shown in FIG. 1, solder (bonding material) is not used for joining the two laminated bodies, and they are connected by a second external electrode 50b formed integrally. Even if the reflow is performed, it is possible to prevent the two laminated bodies from coming off or being displaced.

Further, when two laminated ceramic electronic component bodies are connected by solder (bonding material), the length direction (L dimension) varies and the solder (bonding material) varies depending on the amount of solder (bonding material) and the wet spread of the solder. There is a concern that the wet spread area will vary. In this case, the tensile stress applied to the tip of the terminal electrode varies, which leads to variation in thermomechanical strength. On the other hand, in the structure of the laminated ceramic electronic component main body 12A shown in FIG. 1, since solder (bonding material) is not used for joining the two laminated bodies and they are connected by an external electrode formed integrally, the tip of the terminal electrode is connected. Since the tensile stress applied to the surface is stable, variations in thermomechanical strength can be suppressed.

Furthermore, when two laminated ceramic electronic component bodies are connected by solder (bonding material), the resistance value of the entire electronic component body increases due to the contact resistance between the solder (bonding material) and the terminal electrode interface. On the other hand, in the structure of the laminated ceramic electronic component main body 12A shown in FIG. 1, the laminated ceramic electronic component is connected by an external electrode formed integrally without using solder (bonding material) for joining the two laminated bodies. The resistance value of the main body 12A as a whole can be reduced.

(C) First Metal Terminal and Second Metal Terminal As shown in FIG. 1, the first metal terminal 16 is connected to the first external electrode 50a of the laminated ceramic electronic component main body 12A via a bonding material 90. Will be done. The second metal terminal 18 is connected to the third external electrode 50c of the laminated ceramic electronic component main body 12A via the bonding material 90.

The first metal terminal 16 and the second metal terminal 18 are provided for mounting the laminated ceramic electronic component 10A on a mounting substrate.

For the first metal terminal 16 and the second metal terminal 18, for example, a plate-shaped lead frame is used. The first metal terminal 16 and the second metal terminal 18 formed by the plate-shaped lead frame have a first main surface connected to the respective external electrodes 50 and a second main surface facing the first main surface. Has a main surface (a surface opposite to the laminated ceramic electronic component body 12A) and a peripheral surface forming a thickness between the first main surface and the second main surface.

The first metal terminal 16 has a first terminal joint 60 connected to a first external electrode 50a located on a second main surface 20b of the first laminate 20, and a first terminal joint. It has a first extension portion 62 extending from 60 to a direction connecting the first end face 20e and the second end face 20f of the first laminated body 20. As a result, it is possible to make it difficult for a thermal shock to be applied to the laminated ceramic electronic component main body 12A. Further, even if stress due to a temperature change or deformation occurs in the mounting substrate, it can be advantageously absorbed by elastic deformation of the metal terminal.

The second metal terminal 18 has a second terminal joint 80 connected to a third external electrode 50c located on the fourth main surface 40b of the second laminate 40, and a second terminal joint. It has a second extension portion 82 extending from 80 to the direction connecting the third end surface 40e and the fourth end surface 40f of the second laminated body 40. As a result, it is possible to make it difficult for a thermal shock to be applied to the laminated ceramic electronic component main body 12A. Further, even if stress due to a temperature change or deformation occurs in the mounting substrate, it can be advantageously absorbed by elastic deformation of the metal terminal.

The first terminal joint 60 of the first metal terminal 16 is a portion connected to the first external electrode 50a located on the second main surface 20b of the first laminated body 20. The first terminal joint 60 is formed, for example, in the shape of a rectangular plate having a size equal to the width of the first external electrode 50a on the first end surface 20e of the first laminated body 20, and one side thereof is a first. It is preferable that the external electrode 50a of 1 is connected to the external electrode 50a by a bonding material 90. Further, the shape of the first terminal joint portion 60 is not limited to a rectangular shape, and a notch or a hole may be formed. The number of notches and holes may be singular or may be formed over a plurality.

The second terminal joint 80 of the second metal terminal 18 is a portion connected to the third external electrode 50c located on the fourth main surface 40b of the second laminate 40. The second terminal joint 80 is formed, for example, in the shape of a rectangular plate having a size equal to the width of the third external electrode 50c on the fourth end surface 40f of the second laminated body 40, and one side thereof is a second. It is preferable that the external electrode 50c of No. 3 is connected to the external electrode 50c by a bonding material 90. Further, the shape of the second terminal joint 80 is not limited to a rectangular shape, and a notch or a hole may be formed. The number of notches and holes may be singular or may be formed over a plurality.

The bonding material 90 used for bonding the first external electrode 50a and the first terminal bonding portion 60, or for bonding the third external electrode 50c and the second terminal bonding portion 80 is For example, LF solders such as Sn-Sb type, Sn-Ag-Cu type, Sn-Cu type, and Sn-Bi type can be used. In particular, in the case of Sn—Sb-based solder, the Sb content is preferably about 5% or more and 15% or less.

The first extension 62 of the first metal terminal 16 is connected to the first terminal joint 60 and is substantially parallel to the first main surface 20a or the second main surface 20b of the first laminate 20. It extends away from the first laminated body 20 in the direction of As a result, it is possible to make it difficult for a thermal shock to be applied to the laminated ceramic electronic component main body 12A. Further, even if stress due to a temperature change or deformation occurs in the mounting substrate, it can be advantageously absorbed by elastic deformation of the metal terminal.
The length of the laminated ceramic electronic component 10A of the first extension portion 62 of the first metal terminal 16 along the length direction Z is not particularly limited.
Further, the length of the first extension portion 62 of the first metal terminal 16 along the width direction of the first laminated body 20 may be drawn out with the same length as the first terminal joint portion 60. However, the length may be shortened stepwise in a stepwise manner, or the length may be shortened in a tapered shape.

The second extension 82 of the second metal terminal 18 is connected to the second terminal joint 80 and is substantially parallel to the third main surface 40a or the fourth main surface 40b of the second laminate 40. It extends away from the second laminated body 40 in the direction of As a result, it is possible to make it difficult for a thermal shock to be applied to the laminated ceramic electronic component main body 12A. Further, even if stress due to a temperature change or deformation occurs in the mounting substrate, it can be advantageously absorbed by elastic deformation of the metal terminal.
The length of the laminated ceramic electronic component 10A of the second extension portion 82 of the second metal terminal 18 along the length direction Z is not particularly limited.
Further, the length of the second extension portion 82 of the second metal terminal 18 along the width direction of the second laminated body 40 may be drawn out with the same length as the second terminal joint portion 80. However, the length may be shortened stepwise in a stepwise manner, or the length may be shortened in a tapered shape.

Further, as another example of the first metal terminal 16 and the second metal terminal 18 shown in FIG. 1, there are the first metal terminal 116 and the second metal terminal 118 shown in FIG. FIG. 5 is an external perspective view showing an example of a laminated ceramic electronic component provided with a modified example of the metal terminal shown in FIG. FIG. 6 is a cross-sectional view taken along the line VI-VI of FIG.

The laminated ceramic electronic component 110A shown in FIGS. 5 and 6 is different from the laminated ceramic electronic component 10A shown in FIGS. 1 to 4 in the first metal terminal 116 and the second metal terminal 118. The laminated ceramic electronic component body 12A is common. Therefore, the same parts as those of the laminated ceramic electronic component 10A shown in FIGS. 1 to 4 are designated by the same reference numerals, and the description thereof will be omitted.

As shown in FIGS. 5 and 6, the laminated ceramic electronic component 110A is composed of a laminated ceramic electronic component main body 12A, a first metal terminal 116, and a second metal terminal 118.
The dimension of the laminated ceramic electronic component 110A in the length direction Z is the L dimension. The L dimension is not particularly limited, but is 4.0 mm or more and 12.0 mm or less. The dimension X in the height direction of the laminated ceramic electronic component 110A is the T dimension. The T dimension is not particularly limited, but is 2.0 mm or more and 3.7 mm or less. The dimension Y in the width direction of the laminated ceramic electronic component 110A is the W dimension. The W dimension is not particularly limited, but can be 1.2 mm or more and 5.0 mm or less.

The first metal terminal 116 has a gap between the first terminal joint 160 connected to the first external electrode 50a and the laminated ceramic electronic component body 12A and the mounting surface from the first terminal joint 160. It has a first extension portion 162 extending so as to be possible, and a first mounting portion 164 connected to the first extension portion 162 and extending from the first extension portion 162 in parallel with the mounting surface. By interposing the metal terminal in this way, it is possible to make it difficult for a thermal shock to be applied to the laminated ceramic electronic component main body 12A. Further, even if stress due to a temperature change or deformation occurs in the mounting substrate, it can be advantageously absorbed by elastic deformation of the metal terminal.
The first metal terminal 116 has an L-shaped cross section. When the cross-sectional shape of the first metal terminal 116 is formed in an L shape in this way, when the laminated ceramic electronic component 110A is mounted on the mounting board, the resistance to bending of the mounting board can be improved.

The second metal terminal 118 has a gap between the second terminal joint 180 connected to the third external electrode 50c and the laminated ceramic electronic component body 12A and the mounting surface from the second terminal joint 180. It has a second extension portion 182 extending so as to be possible, and a second mounting portion 184 connected to the second extension portion 182 and extending from the second extension portion 182 in parallel with the mounting surface. By interposing the metal terminal in this way, it is possible to make it difficult for a thermal shock to be applied to the laminated ceramic electronic component main body 12A. Further, even if stress due to a temperature change or deformation occurs in the mounting substrate, it can be advantageously absorbed by elastic deformation of the metal terminal.
The second metal terminal 118 has an L-shaped cross section. When the shape of the cross section of the eighth metal terminal 118 is formed in an L shape in this way, when the laminated ceramic electronic component 110A is mounted on the mounting board, the resistance to bending of the mounting board can be improved.

The first terminal joint portion 160 of the first metal terminal 116 is a portion connected to the first external electrode 50a provided on the first end surface 20e of the first laminated body 20. The first terminal joint 160 is formed, for example, in the shape of a rectangular plate having a size equal to the width of the first external electrode 50a on the first end surface 20e of the first laminated body 20, and one side thereof is a first. It is preferable that the external electrode 50a of 1 is connected to the external electrode 50a by a bonding material 90. Further, the shape of the first terminal joint 160 is not limited to a rectangular shape, and a notch or a hole may be formed. The number of notches and holes may be singular or plural.

The second terminal joint 180 of the second metal terminal 118 is a portion connected to the third external electrode 50c provided on the fourth end surface 40f of the second laminated body 40. The second terminal joint 180 is formed, for example, in the shape of a rectangular plate having a size equal to the width of the third external electrode 50c on the fourth end surface 40f of the second laminated body 40, and one side thereof is a first surface. It is preferable that the external electrode 50c of No. 3 is connected to the external electrode 50c by a bonding material 90. Further, the shape of the second terminal joint 180 is not limited to a rectangular shape, and a notch or a hole may be formed. The number of notches and holes may be singular or plural.

The first terminal joint 160 of the first metal terminal 116 may be provided with rib portions extending so as to face both side surfaces of the first laminate 20, and the second metal terminal 118 may be provided with rib portions. The second terminal joint 180 may be provided with ribs extending so as to face both side surfaces of the second laminate 40. Thereby, for example, when a load is applied from the length direction Z of the laminated ceramic electronic component 110A, the deformation of the first terminal joint portion 160 and the second terminal joint portion 180 can be suppressed.

Further, the bonding material 90 used for bonding the first external electrode 50a and the first terminal bonding portion 160, or for bonding the third external electrode 50c and the second terminal bonding portion 180 is For example, LF solders such as Sn-Sb type, Sn-Ag-Cu type, Sn-Cu type, and Sn-Bi type can be used. In particular, in the case of Sn—Sb-based solder, the Sb content is preferably about 5% or more and 15% or less.

The first extension portion 162 of the first metal terminal 116 is connected to the first terminal joint portion 160 and is a surface facing the mounting surface. The second main surface 20b and the mounting surface of the first laminate 20 It extends in the direction of the mounting surface so as to provide a gap between the two. As a result, the distance from the mounting board can be increased, and the stress from the mounting board can be relaxed.
The first extension portion 162 has, for example, a rectangular plate shape, extends from the first terminal joint portion 160 in the height direction X orthogonal to both main surfaces in the mounting surface direction, and is the first terminal joint portion. It is formed in the same plane as 160. Further, the length in the width direction of the first extension portion 162 (the length in the direction connecting the first side surface 20c and the second side surface 20d) is the same as the length in the width direction of the first terminal joint portion 160. It is preferably formed in length, but it may be shorter or longer than the length in the width direction of the first terminal joint 160.
The first extension portion 162 may be provided with a notch or the like.

The second extension portion 182 of the second metal terminal 118 is connected to the second terminal joint portion 180 and is a surface facing the mounting surface, which is the fourth main surface 40b and the mounting surface of the second laminate 40. It extends in the direction of the mounting surface so as to provide a gap between the two. As a result, the distance from the mounting board can be increased, and the stress from the mounting board can be relaxed.
The second extension portion 182 has, for example, a rectangular plate shape, extends from the second terminal joint portion 180 in the height direction X orthogonal to both main surfaces in the mounting surface direction, and is a second terminal joint portion. It is formed in the same plane as 180. Further, the length in the width direction of the second extension portion 182 (the length in the direction connecting the third side surface 40c and the fourth side surface 40d) is the same as the length in the width direction of the second terminal joint portion 180. It is preferably formed in length, but it may be shorter or longer than the length in the width direction of the second terminal joint 180.
The second extension portion 182 may be provided with a notch or the like.

The first mounting portion 164 is connected to the first extension portion 162 and extends from the first extension portion 162 in the direction connecting the first end surface 20e and the second end surface 20f of the first laminated body 20. Is. The first mounting portion 164 of the first metal terminal 116 is in the length direction connecting the end portion of the first extension portion 162 to the first end surface 20e and the second end surface 20f of the first laminated body 20. It is formed by extending and bending. The direction in which the first mounting portion 164 is bent may be opposite to that of the first laminated body 20 and the second laminated body 40.
The length in the direction connecting the first end surface 20e and the second end surface 20f of the first laminated body 20 of the first mounting portion 164 of the first metal terminal 116 is not particularly limited, but the first lamination It may be formed longer than the length in the length direction of the first external electrode 50a formed on the second main surface 20b (mounting surface side) of the body 20. As a result, when the laminated ceramic electronic component 110A is image-recognized by a camera from below and the position of the component is detected, it is possible to prevent erroneous recognition of the first external electrode 50a of the laminated ceramic electronic component 110A as a metal terminal and detect it. You can prevent mistakes.

The second mounting portion 184 is connected to the second extension portion 182 and extends from the second extension portion 182 in the direction connecting the third end surface 40e and the fourth end surface 40f of the second laminated body 40. Is. The second mounting portion 184 of the second metal terminal 118 is in the length direction connecting the end portion of the second extension portion 182 to the third end surface 40e and the fourth end surface 40f of the second laminated body 40. It is formed by extending and bending. The direction in which the second mounting portion 184 is bent may be opposite to that of the first laminated body 20 and the second laminated body 40.
The length in the direction connecting the third end surface 40e and the fourth end surface 40f of the second laminated body 40 of the second mounting portion 184 of the second metal terminal 118 is not particularly limited, but the second lamination It may be formed longer than the length in the length direction of the third external electrode 50c formed on the fourth main surface 40b (mounting surface side) of the body 40. As a result, when the laminated ceramic electronic component 110A is image-recognized by a camera from below and the position of the component is detected, it is possible to prevent erroneous recognition of the third external electrode 50c of the laminated ceramic electronic component 110A as a metal terminal and detect it. You can prevent mistakes.

Further, as another example of the first metal terminal 16 and the second metal terminal 18 shown in FIG. 1, there are the first metal terminal 216 and the second metal terminal 218 shown in FIG. 7. FIG. 7 is an external perspective view showing an example of a laminated ceramic electronic component provided with another modification of the metal terminal shown in FIG. FIG. 8 is a cross-sectional view taken along the line VIII-VIII of FIG.

The laminated ceramic electronic component 210A shown in FIGS. 7 and 8 is different from the laminated ceramic electronic component 10A shown in FIGS. 1 to 4 in the first metal terminal 216 and the second metal terminal 218. The laminated ceramic electronic component body 12A is common. Therefore, the same parts as those of the laminated ceramic electronic component 10A shown in FIGS. 1 to 4 are designated by the same reference numerals, and the description thereof will be omitted.

As shown in FIGS. 7 and 8, the laminated ceramic electronic component 210A is composed of a laminated ceramic electronic component main body 12A, a first metal terminal 216, and a second metal terminal 218.
The dimension of the laminated ceramic electronic component 210A in the length direction Z is the L dimension. The L dimension is not particularly limited, but is 7.2 mm or more and 18.4 mm or less. The dimension X in the height direction of the laminated ceramic electronic component 210A is the T dimension. The T dimension is not particularly limited, but is 1.7 mm or more and 3.4 mm or less. The dimension Y in the width direction of the laminated ceramic electronic component 210A is the W dimension. The W dimension is not particularly limited, but can be 1.2 mm or more and 5.0 mm or less.

The first metal terminal 216 is a first terminal joint portion 260 connected to a first external electrode 50a located on a second main surface 20b of the first laminate 20, and a first terminal joint portion. A surface connected to a first extension portion 262 extending in a direction connecting the first end surface 20e and the second end surface 20f of the first laminate 20 from 260 and the first extension portion 262 and facing the mounting surface. It is connected to a third extension portion 263 extending in the mounting surface direction and a third extension portion 263 so as to provide a gap between the second main surface 20b and the mounting surface of the first laminated body 20. It has a first mounting portion 264 extending substantially parallel to the mounting surface from the third extension portion 263. By providing the third extension portion 263, the distance from the mounting board can be increased, and the effect of relaxing the stress from the mounting board can be obtained.

The second metal terminal 218 is a second terminal joint portion 280 connected to a third external electrode 50c located on the fourth main surface 40b of the second laminate 40, and a second terminal joint portion 280. A surface that is connected to a second extension portion 282 extending in a direction connecting the third end surface 40e and the fourth end surface 40f of the second laminate 40 from 280 and the second extension portion 282 and faces the mounting surface. It is connected to a fourth extension portion 283 extending in the mounting surface direction and a fourth extension portion 283 so as to provide a gap between the fourth main surface 40b and the mounting surface of the second laminated body 40. It has a second mounting portion 284 extending substantially parallel to the mounting surface from the fourth extension portion 283. By providing the fourth extension portion 283, the distance from the mounting substrate can be increased, and the effect of relaxing the stress from the mounting substrate can be obtained.

The first terminal joint portion 260 of the first metal terminal 216 is a portion connected to the first external electrode 50a located on the second main surface 20b of the first laminated body 20. The first terminal joint portion 260 is formed, for example, in the shape of a rectangular plate having a size equal to the width of the first external electrode 50a on the first end surface 20e of the first laminated body 20, and one side thereof is a first. It is preferable that the external electrode 50a of 1 is connected to the external electrode 50a by a bonding material 90. Further, the shape of the first terminal joint portion 260 is not limited to a rectangular shape, and a notch or a hole may be formed. The number of notches and holes may be singular or may be formed over a plurality.

The second terminal joint 280 of the second metal terminal 218 is a portion connected to the third external electrode 50c located on the fourth main surface 40b of the second laminate 40. The second terminal joint 280 is formed, for example, in the shape of a rectangular plate having a size equal to the width of the third external electrode 50c on the fourth end surface 40f of the second laminated body 40, and one side thereof is a first surface. It is preferable that the external electrode 50c of No. 3 is connected to the external electrode 50c by a bonding material 90. Further, the shape of the second terminal joint portion 280 is not limited to a rectangular shape, and a notch or a hole may be formed. The number of notches and holes may be singular or may be formed over a plurality.

Further, the bonding material 90 used for bonding the first external electrode 50a and the first terminal bonding portion 260, or for bonding the third external electrode 50c and the second terminal bonding portion 280 is For example, LF solders such as Sn-Sb type, Sn-Ag-Cu type, Sn-Cu type, and Sn-Bi type can be used. In particular, in the case of Sn—Sb-based solder, the Sb content is preferably about 5% or more and 15% or less.

The first extension portion 262 of the first metal terminal 216 is connected to the first terminal joint portion 260 and is substantially parallel to the first main surface 20a or the second main surface 20b of the first laminate 20. It extends away from the first laminated body 20 in the direction of As a result, it is possible to make it difficult for a thermal shock to be applied to the laminated ceramic electronic component main body 12A. Further, even if stress due to a temperature change or deformation occurs in the mounting substrate, it can be advantageously absorbed by elastic deformation of the metal terminal.
The length of the laminated ceramic electronic component 210A of the first extension portion 262 of the first metal terminal 216 along the length direction Z is not particularly limited.
Further, the length of the first extension portion 262 of the first metal terminal 216 along the width direction of the first laminated body 20 may be the same as the length of the first terminal joint portion 260. However, the length may be shortened stepwise in a stepwise manner, or the length may be shortened in a tapered shape.

The second extension 282 of the second metal terminal 218 is connected to the second terminal joint 280 and is substantially parallel to the third main surface 40a or the fourth main surface 40b of the second laminate 40. It extends away from the second laminated body 40 in the direction of As a result, it is possible to make it difficult for a thermal shock to be applied to the laminated ceramic electronic component main body 12A. Further, even if stress due to a temperature change or deformation occurs in the mounting substrate, it can be advantageously absorbed by elastic deformation of the metal terminal.
The length of the laminated ceramic electronic component 210A of the second extension portion 282 of the second metal terminal 218 along the length direction Z is not particularly limited.
Further, the length of the second extension portion 282 of the second metal terminal 218 along the width direction of the second laminated body 40 may be drawn out with the same length as the second terminal joint portion 280. However, the length may be shortened stepwise in a stepwise manner, or the length may be shortened in a tapered shape.

The third extension portion 263 of the first metal terminal 216 is connected to the first extension portion 262 and has a second main surface 20b and a mounting surface of the first laminated body 20 which are surfaces facing the mounting surface. It extends in the direction of the mounting surface so as to provide a gap between the two. As a result, the distance from the mounting board can be increased, and the effect of relaxing the stress from the mounting board can be obtained.

The fourth extension portion 283 of the second metal terminal 218 is connected to the second extension portion 282 and is a surface facing the mounting surface with the fourth main surface 40b and the mounting surface of the second laminate 40. It extends in the direction of the mounting surface so as to provide a gap between the two. As a result, the distance from the mounting board can be increased, and the effect of relaxing the stress from the mounting board can be obtained.

The first mounting portion 264 of the first metal terminal 216 is a portion connected to the third extension portion 263 and to be mounted on the mounting board, and extends so as to be substantially parallel to the mounting surface. .. The first mounting portion 264 does not necessarily have to be formed.

The second mounting portion 284 of the second metal terminal 218 is a portion connected to the fourth extension portion 283 and to be mounted on the substrate in a single layer, and extends so as to be substantially parallel to the mounting surface. .. The second mounting portion 284 does not necessarily have to be formed.

The first metal terminals 16, 116, 216 and the second metal terminals 18, 118, 218 have a terminal body and a plating film formed on the surface of the terminal body.

The terminal body is preferably made of Ni, Fe, Cu, Ag, Cr or an alloy containing one or more of these metals as a main component. More preferably, the terminal body is made of an alloy containing Ni, Fe, Cr or one or more of these metals as a main component. Specifically, for example, the metal of the base material of the terminal body can be an Fe-42Ni alloy or an Fe-18Cr alloy. The thickness of the first metal terminals 16, 116, 216 and the second metal terminals 18, 118, 218 is preferably about 0.05 mm or more and 0.5 mm or less.

The plating film has, for example, a lower layer plating film and an upper layer plating film.
The lower layer plating film is formed on the surface of the terminal body, and the upper layer plating film is formed on the surface of the lower layer plating film. Each of the lower layer plating film and the upper layer plating film may be composed of a plurality of plating layers.

Even if the plating film is not formed at least on the peripheral surface of the first extension portion 62 of the first metal terminal 16 and the peripheral surface of the second extension portion 82 of the second metal terminal 18. Good.
Further, the plating film is formed on at least the peripheral surfaces of the first extension portion 162 and the first mounting portion 164 of the first metal terminal 116, and the second extension portions 182 and the second mounting portion of the second metal terminal 118. It does not have to be formed on the peripheral surface of the portion 264.
Further, the plating film is formed on at least the peripheral surfaces of the first extension portion 262, the third extension portion 263 and the first mounting portion 264 of the first metal terminal 216, and the second extension of the second metal terminal 218. It may not be formed on the peripheral surfaces of the portion 282, the fourth extension portion 283, and the second mounting portion 284.
As a result, when the laminated ceramic electronic components 10A, 110A, 210A are mounted on the mounting substrate using solder, the solder is connected to the first metal terminals 16, 116, 216 and the second metal terminals 18, 118, 218. It is possible to suppress getting wet. Therefore, in particular, between the laminated ceramic electronic component main body 12A and the first metal terminals 116 and 216 (floating portion) and between the laminated ceramic electronic component main body 12A and the second metal terminals 118 and 218 (floating portion). Since it is possible to prevent the solder from getting wet, it is possible to prevent the floating portion from being filled with the solder. Therefore, a sufficient space for the floating portion can be secured. Therefore, the first extension portions 62, 162, 262 of the first metal terminals 16, 116, 216 and the second extension portions 82, 182, 282 of the second metal terminals 18, 118, 218 are likely to be elastically deformed. Therefore, it is possible to better absorb the mechanical strain generated in the ceramic layer by applying the AC voltage. As a result, it is possible to suppress the vibration generated at this time from being transmitted to the mounting substrate via the first external electrode 50a and the third external electrode 50c. Therefore, by providing the first metal terminals 16, 116, 216 and the second metal terminals 18, 118, 218, it is possible to suppress the generation of acoustic noise (squeal) more stably. It is not necessary that a plating film is formed on the entire peripheral surfaces of the first metal terminals 16, 116, 216 and the second metal terminals 18, 118, 218.

When removing the plating film on the peripheral surface of the first extension portion 62 of the first metal terminal 16 and the second extension portion 82 of the second metal terminal 18, the first of the first metal terminals 116 When removing the plating film on the peripheral surfaces of the extension portion 162 and the first mounting portion 164, and the peripheral surfaces of the second extension portion 182 and the second mounting portion 264 of the second metal terminal 118, the first metal The peripheral surfaces of the first extension 262, the third extension 263 and the first mounting 264 of the terminal 216, and the second extension 282, the fourth extension 283, and the second metal terminal 218. When removing the plating film on the peripheral surface of the second mounting portion 284, or removing the plating film on the entire peripheral surface of the first metal terminals 16, 116, 216 and the second metal terminals 18, 118, 218. In the case, a removal method by a machine (cutting, polishing), a removal method by laser trimming, a removal method by a plating release agent (for example, sodium hydroxide), or a first metal terminal 16, 116, 216 and a second metal terminal 18 , 118,218 Before forming the plating film, after covering the non-plated portion with the resist film and forming the plating film on the first metal terminals 16, 116, 216 and the second metal terminals 18, 118, 218. A method of removing the resist film can be considered.

The underlayer plating film is preferably made of Ni, Fe, Cu, Ag, Cr or an alloy containing one or more of these metals as a main component. More preferably, the underlayer plating film is made of an alloy containing Ni, Fe, Cr or one or more of these metals as a main component. The thickness of the lower plating film is preferably about 0.2 μm or more and 5.0 μm or less.

The upper plating film is preferably made of Sn, Ag, Au or an alloy containing one or more of these metals as a main component. More preferably, the upper plating film is made of Sn or an alloy containing Sn as a main component. By forming the upper plating film with Sn or an alloy containing Sn as a main component, the solderability between the first metal terminals 16, 116, 216 and the second metal terminals 18, 118, 218 and the external electrode 50 can be improved. Can be improved. The thickness of the upper plating film is preferably about 1.0 μm or more and 5.0 μm or less.

Further, the heat resistance of the external electrode is improved by forming each of the terminal body and the lower layer plating film with an alloy containing high melting point Ni, Fe, Cr or one or more of these metals as a main component. Can be made to.

In the laminated ceramic electronic components 10A, 110A, 210A having the above structure, the first laminated body 20 and the second laminated body 40 can be connected in series, so that the voltage applied to each laminated body can be applied. It becomes lower, and it becomes possible to increase the withstand voltage of the laminated ceramic electronic components 10A, 110A, 210A.

Further, in the multilayer ceramic electronic components 10A, 110A, 210A, when a plurality of conventional multilayer ceramic capacitors are arranged on a mounting substrate in a large capacity region and the same capacitance as that of the present invention is to be obtained, the conventional multilayer ceramic capacitors are used. The mounting area is smaller when one of the laminated ceramic electronic components 10A, 110A, and 210A is arranged on the mounting substrate than when a plurality of these are mounted side by side. The laminated ceramic electronic components 10A, 110A, and 210A have acquired capacitance with respect to the mounting area when compared with the laminated ceramic electronic component having a configuration in which a plurality of capacitors are connected to the inside of the ceramic laminate described in Patent Document 1. The capacity increases.

Therefore, the laminated ceramic electronic components 10A, 110A, 210A having the above structure can secure the acquired capacitance and suppress the mounting area while ensuring the high withstand voltage design.

(Second Embodiment)
The laminated ceramic electronic component according to the second embodiment of the present invention will be described. FIG. 9 is an external perspective view showing an example of a laminated ceramic electronic component according to a second embodiment of the present invention. FIG. 10 is a cross-sectional view taken along the line XX of FIG.
The laminated ceramic electronic component 10B according to the second embodiment is shown in FIG. 1, except that the structure of the laminated ceramic electronic component main body 12B is different due to the difference in the arrangement state of the second external electrode 50b'. It has the same structure as that of the laminated ceramic electronic component 10A of the first embodiment. Therefore, the same parts as the laminated ceramic electronic component 10A are designated by the same reference numerals, and the description thereof will be omitted.

As shown in FIGS. 9 and 10, the second external electrode 50b'in the laminated ceramic electronic component body 12B is the second end surface 20f of the first laminate 20 and the third end surface of the second laminate 40. It is arranged so as to straddle only on 40e. In other words, the second external electrode 50b'is a part of the first main surface 20a of the first laminated body 20, a part of the second main surface 20b, a part of the first side surface 20c, and the first. It is not arranged on a part of the side surface 20d of 2, but is a part of the third main surface 40a of the second laminated body 40, a part of the fourth main surface 40b, and a part of the third side surface 40c. , And a part of the fourth side surface 40d.

Further, FIG. 11 is an external perspective view showing an example of a laminated ceramic electronic component provided with a modified example of the metal terminal shown in FIG. FIG. 12 is a cross-sectional view taken along the line XII-XII of FIG.
The laminated ceramic electronic component 110B shown in FIGS. 11 and 12 includes the laminated ceramic electronic component main body 12B shown in FIG. 9, and also includes a first metal terminal 116 and a second metal terminal 118 shown in FIG. That is, the laminated ceramic electronic component 110B is a combination of the configurations already described.

Further, FIG. 13 is an external perspective view showing an example of a laminated ceramic electronic component provided with another modification of the metal terminal shown in FIG. FIG. 14 is a cross-sectional view taken along the line XIV-XIV of FIG.
The laminated ceramic electronic component 210B shown in FIGS. 13 and 14 includes the laminated ceramic electronic component main body 12B shown in FIG. 9, and also includes a first metal terminal 216 and a second metal terminal 218 shown in FIG. 7. That is, the laminated ceramic electronic component 210B is a combination of the configurations already described.

According to the multilayer ceramic capacitors 10B, 110B, 210B according to the second embodiment, the same effect as that of the multilayer ceramic capacitors 10A, 110A, 210A is obtained, and the following effects are obtained.
That is, according to the laminated ceramic electronic component 10B according to the second embodiment, on the main surface of each of the first laminated body 20 and the second laminated body 40, and on each side surface, there is a second external surface. Since the electrode 50b'is not arranged, the outer electrode thickness of the corner portion of the laminated body in the outermost inner layer portion which affects the long-term reliability is sufficiently secured, and the extra second external electrode 50b' is provided. It is possible to reduce the material cost.

Further, according to the laminated ceramic electronic component 10B according to the second embodiment, on the main surface of each of the first laminated body 20 and the second laminated body 40, and on each side surface, there is a second Since the external electrode 50b'is not arranged, the expansion-contraction force applied to the laminated ceramic electronic component 10B during the temperature cycle (assumed actual use stress) becomes small. Therefore, it is possible to suppress the occurrence of cracks in the first laminated body 20 and the second laminated body 40.

2. 2. Method for Manufacturing Laminated Ceramic Electronic Components Next, an embodiment of a method for manufacturing a laminated ceramic electronic component 10A having the above configuration will be described.

First, a method of manufacturing the laminated ceramic electronic component main body 12A will be described.
A dielectric green sheet and a conductive paste for the internal electrode for forming the internal electrode are prepared. The dielectric green sheet and the conductive paste for the internal electrode include a binder and a solvent, but known organic binders and organic solvents can be used.

Then, the conductive paste for the internal electrode is printed on the dielectric green sheet in a predetermined pattern by, for example, a screen printing method or a gravure printing method, and the internal electrode pattern is formed.

Next, a predetermined number of dielectric green sheets for the outer layer on which the internal electrode pattern is not printed are laminated, and a dielectric green sheet on which the internal electrode pattern is printed is sequentially laminated on the dielectric green sheets for the outer layer. A predetermined number of body green sheets are laminated to prepare a laminated body sheet.

Subsequently, this laminated body sheet is pressed in the laminating direction by means such as a hydrostatic pressure press to produce a laminated body block.

After that, the laminate block is cut into a predetermined shape and size, and the raw laminate chips are cut out. At this time, the corners and ridges of the raw laminate may be rounded by barrel polishing or the like. Subsequently, the cut out raw laminate chips are fired to produce a laminate. The firing temperature of the raw laminated chips depends on the material of the dielectric and the conductive paste for the internal electrode, but is preferably 900 ° C. or higher and 1400 ° C. or lower.

Subsequently, the first laminated body and the second laminated body are prepared from the produced laminated body.

Next, in order to form the base electrode layers of the first external electrode, the second external electrode, and the third external electrode, the conductivity for the external electrode is formed on both end faces of the first laminate and the second laminate. The paste is applied and the laminates are connected (contacted) in series. After that, a drying and baking process is performed to form a base electrode layer of the first external electrode, the second external electrode, and the third external electrode. At this time, the baking temperature is preferably 700 ° C. or higher and 900 ° C. or lower. Further, if necessary, one or more layers of plating are applied to the surface of the base electrode layer.

After that, a plating layer is formed on the surface of each base electrode layer, and an external electrode is formed. In the laminated ceramic electronic component main body 12A shown in FIG. 1, a Ni plating layer and a Sn plating layer are formed as plating layers on the base electrode layer. The Ni plating layer and the Sn plating layer are sequentially formed by, for example, a barrel plating method.

In this way, the laminated ceramic electronic component body 12A is manufactured.

Next, a method of attaching the first metal terminal 16 and the second metal terminal 18 to the laminated ceramic electronic component main body 12A will be described.

First, the laminated ceramic electronic component body 12A is prepared.
Subsequently, the first metal terminal 16 and the second metal terminal 18 shown in FIG. 1 are prepared.

Then, the solder as the bonding material 90 is applied to the first external electrode 50a on the second main surface 20b side of the first laminated body 20 of the laminated ceramic electronic component main body 12A, and the second laminated body 40 is the second. Solder, which is a bonding material 90, is applied to the third external electrode 50c on the main surface 40b side of No. 4.

After that, the first metal terminal 16 is brought into contact with the first external electrode 50a on the second main surface 20b side of the first laminated body 20, and the fourth main surface 40b side of the second laminated body 40 is brought into contact with the first external electrode 50a. By bringing the second metal terminal 18 into contact with the third external electrode 50c and performing reflow in this state, the first external electrode 50a and the first metal terminal 16 are joined, and the third external electrode is formed. The 50c and the second metal terminal 18 are joined.

The laminated ceramic electronic component 10A is manufactured by the above method.

In the laminated ceramic electronic component 10A manufactured by the above method, the laminated ceramic electronic component outside 12A places the second external electrode 50b on the second end surface 20f of the first laminated body 20 and the second laminated body 40. Since it is arranged so as to straddle the third end face 40e of the above, a series connection structure can be obtained, and the voltage applied to the laminated ceramic electronic component 10A can be lowered, so that a high withstand voltage can be obtained. Can be achieved. Further, in a large-capacity region, a plurality of ordinary multilayer ceramic capacitors can be arranged side by side, and the laminated ceramic electronic component 10A of the present invention can have a smaller mounting area and a larger acquisition area with respect to the mounting area. Become. As a result, it is possible to acquire the capacity and reduce the mounting area while ensuring the withstand voltage design.

The formation of the second external electrode 50b'in the laminated ceramic electronic component main body 12B of the second embodiment is performed by the following method.

That is, as a method of forming the second external electrode 50b', the front and back side surfaces of the portion of the first laminated body 20 and the second laminated body 40 that forms the second external electrode 50b'are masked and end faces. Is coated with a conductive paste containing a glass component and a metal, connected in series and dried. After drying, the masking is removed and a baking process is performed to form a base electrode layer. The temperature of the baking process at this time is preferably 700 ° C. or higher and 900 ° C. or lower. If necessary, the surface of the baking layer is plated.

Further, as another method for forming the second external electrode 50b', the first laminated body 20 and the second laminated body 40 are aligned in the series direction and held at predetermined intervals. A conductive paste containing a glass component and a metal is injected between the first laminate 20 and the second laminate 40, dried, and then baked to form a base electrode layer. The temperature of the baking process at this time is preferably 700 ° C. or higher and 900 ° C. or lower. If necessary, the surface of the baking layer is plated.

The laminated ceramic electronic component 10B is manufactured by the above method.

The present invention is not limited to the above-described embodiment, and is variously modified within the scope of the gist thereof. Further, the thickness, the number of layers, the area of the counter electrode, and the external dimensions of the ceramic layer of the electronic component body are not limited to these.

10A, 10B, 110A, 110B, 210A, 210B Laminated ceramic electronic component 12A, 12B Laminated ceramic electronic component body 16,116,216 First metal terminal 18,118,218 Second metal terminal 20 First laminated body 20a 1st main surface of the first laminate 20b 2nd main surface of the 1st laminate 20c 1st side surface of the 1st laminate 20d 2nd side surface of the 1st laminate 20e 1st laminate First end face of body 20f Second end face of first laminate 22,42 Ceramic layers 23a, 43a Outer layer parts 23b, 43b Inner layer parts 24,44 Internal electrodes 24a First internal electrodes 24b Second internal electrodes 26a First lead-out electrode part 26b Second lead-out electrode part 28a, 48a Opposite electrode part 28b, 48b Side part (W gap)
28c, 48c end (L gap)
40 Second laminated body 40a Third main surface of the second laminated body 40b Fourth main surface of the second laminated body 40c Third side surface of the second laminated body 40d Fourth of the second laminated body 40e Third end surface of the second laminate 40f Fourth end surface of the second laminate 44a Third internal electrode 44b Fourth internal electrode 46a Third extraction electrode portion 46b Fourth extraction electrode portion 50 External electrode 50a First external electrode 50b, 50b'Second external electrode 50c Third external electrode 52a First base electrode layer 52b Second base electrode layer 52c Third base electrode layer 54a First plating Layer 54b 2nd plating layer 54c 3rd plating layer 60 1st terminal joint 62 1st extension 80 2nd terminal joint 82 2nd extension 90 Joint material 160 1st terminal joint 162 1st extension 164 1st mounting 180 2nd terminal joint 182 2nd extension 184 2nd mounting 260 1st terminal joint 262 1st extension 263 3rd extension 264 1st mounting part 280 2nd terminal joint part 282 2nd extension part 283 4th extension part 284 2nd mounting part X Height direction of laminated ceramic electronic component Y Width direction of laminated ceramic electronic component Z Laminated ceramic Length direction of electronic parts

Claims (3)

A first main surface having a plurality of laminated ceramic layers and a plurality of laminated internal electrodes, and a first main surface and a second main surface facing the stacking direction and a first surface facing the width direction orthogonal to the stacking direction. A first laminate having a side surface and a second side surface, and a first end face and a second end face facing each other in the length direction orthogonal to the stacking direction and the width direction.
A third main surface and a fourth main surface which are provided so as to face the first laminated body, include a plurality of laminated ceramic layers, and a plurality of laminated internal electrodes, and face each other in the stacking direction. A third having a third side surface and a fourth side surface opposite to each other in the width direction orthogonal to the stacking direction, and a third end surface and a fourth end surface facing each other in the length direction orthogonal to the stacking direction and the width direction. 2 laminates and
A first external electrode arranged on at least the first end surface of the first laminate, and the third end surface of the first laminate on the second end surface and of the second laminate. A laminated ceramic electronic component body comprising a second external electrode arranged over the top and a third external electrode arranged on at least the fourth end face of the second laminate.
The first laminated body and the second laminated body are arranged so that the second end face of the first laminated body and the third end face of the second laminated body face each other. ,
A laminated ceramic electronic component comprising a first metal terminal connected to the first external electrode and a second metal terminal connected to the third external electrode. The first external electrode is arranged on the second main surface that will be located on the mounting surface side of the first laminate.
The third external electrode is arranged on the fourth main surface that will be located on the mounting surface side of the second laminate.
The first metal terminal includes a first terminal joint portion connected to the first external electrode located on the second main surface, and the first laminated body from the first terminal joint portion. Alternatively, it has a first extension portion extending in a direction connecting the first end face and the second end face of the second laminate.
The second metal terminal includes a second terminal joint portion connected to the third external electrode located on the fourth main surface, and the first laminated body from the second terminal joint portion. 1. A second extension portion extending in a direction connecting the first end face and the second end face of the above or in a direction connecting the third end face and the fourth end face of the second laminate. Multilayer ceramic electronic components described in. The first metal terminal has a gap between the first terminal joint portion connected to the first external electrode and the laminated ceramic electronic component main body and the mounting surface from the first terminal joint portion. It has a first extension portion extending in such a manner, and a first mounting portion connected to the first extension portion and extending from the first extension portion in parallel with the mounting surface.
The second metal terminal has a gap between the second terminal joint portion connected to the third external electrode and the laminated ceramic electronic component main body and the mounting surface from the second terminal joint portion. The laminate according to claim 1, further comprising a second extension portion extending as described above, and a second mounting portion connected to the second extension portion and extending parallel to the mounting surface from the second extension portion. Ceramic electronic components.

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