JP2020153723A - Probe pin and IC socket - Google Patents
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- JP2020153723A JP2020153723A JP2019050630A JP2019050630A JP2020153723A JP 2020153723 A JP2020153723 A JP 2020153723A JP 2019050630 A JP2019050630 A JP 2019050630A JP 2019050630 A JP2019050630 A JP 2019050630A JP 2020153723 A JP2020153723 A JP 2020153723A
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Abstract
Description
本発明は、ＩＣ（Ｉｎｔｅｇｒａｔｅｄ Ｃｉｒｃｕｉｔ、集積回路）の検査などに使用されるプローブピンおよびＩＣソケットに関する。 The present invention relates to probe pins and IC sockets used for inspection of ICs (Integrated Circuits, Integrated Circuits) and the like.
多数の端子を備えるＩＣを検査するときには、ＩＣにおける隣接する端子同士での電気的な接続（短絡）を抑制しつつ、ＩＣの各端子と、ＩＣを検査するための検査装置（ＩＣテスター）に接続された検査用基板における各端子に対応する電極とを電気的に接続するために、各端子に対応するプローブピンを備えたＩＣソケットが使用される。 When inspecting an IC having a large number of terminals, it is necessary to use each terminal of the IC and an inspection device (IC tester) for inspecting the IC while suppressing electrical connection (short circuit) between adjacent terminals in the IC. An IC socket having a probe pin corresponding to each terminal is used in order to electrically connect the electrodes corresponding to each terminal on the connected inspection board.
プローブピンの代表的な構成は、両端が部分的に閉塞されつつ開口された管状体と、この管状体の内部に配置されたコイルバネと、このコイルバネに付勢されながら前記の部分的な閉塞部に係止された状態で管状体から部分的に突出する二つの接触部材とからなる。 A typical configuration of the probe pin is a tubular body that is opened while being partially closed at both ends, a coil spring that is arranged inside the tubular body, and the partially closed portion that is urged by the coil spring. It consists of two contact members that partially project from the tubular body while being locked to.
また、ＩＣソケットは、一般的にはプラスチックなどの絶縁性の剛体からなり、検査対象物であるＩＣの端子に対応した配列の貫通孔を有するハウジングを備え、ハウジングの貫通孔内にプローブピンが保持される。本明細書においては、ハウジングにプローブピンが保持された組立体をＩＣソケットと呼ぶ。 Further, the IC socket is generally made of an insulating rigid body such as plastic, and has a housing having through holes arranged in an array corresponding to the terminals of the IC to be inspected, and a probe pin is provided in the through holes of the housing. Be retained. In the present specification, an assembly in which a probe pin is held in a housing is referred to as an IC socket.
ここで検査対象物であるＩＣが高速で動作する場合は、高周波性能に優れたＩＣソケットが求められる。高周波性能に優れたＩＣソケットとしては、全長の短いプローブピンを使用することによりプローブピンのインダクタンスを小さくしたＩＣソケット、あるいは、ハウジングを導電性の金属とし、プローブピンを導電性のハウジングと絶縁しつつハウジングの貫通孔内に保持することにより、導電性ハウジングとプローブピンを同軸構造にしたＩＣソケットなどがある。導電性ハウジングとプローブピンを同軸構造にしたＩＣソケットの一例としては、特許文献１、特許文献２に開示されたＩＣソケットがある。 Here, when the IC to be inspected operates at high speed, an IC socket having excellent high frequency performance is required. As an IC socket with excellent high-frequency performance, an IC socket in which the inductance of the probe pin is reduced by using a probe pin with a short overall length, or the housing is made of a conductive metal and the probe pin is insulated from the conductive housing. There are IC sockets and the like in which the conductive housing and the probe pin have a coaxial structure by being held in the through hole of the housing. As an example of an IC socket having a conductive housing and a probe pin having a coaxial structure, there are IC sockets disclosed in Patent Documents 1 and 2.
特許文献１のＩＣソケットは、ＲＦ信号用コンタクトプローブの外周の少なくとも２か所に誘電体リングが固着され、金属ブロック（ハウジング）の貫通孔に嵌合されることにより、前記コンタクトプローブと金属ブロックとの間に中空部が形成され、前記コンタクトプローブを中心導体とすると共に前記金属ブロックを外部導体とし、所望の特性インピーダンスの同軸線路となるように前記誘電体リングの外径が設定されてなる高周波・高速用デバイスの検査治具（ＩＣソケット）であって、前記誘電体リングが、前記コンタクトプローブの外周に樹脂の一体成形により形成されてなる検査治具である。 In the IC socket of Patent Document 1, a dielectric ring is fixed to at least two places on the outer periphery of the contact probe for RF signal, and the contact probe and the metal block are fitted into a through hole of a metal block (housing). A hollow portion is formed between the two, the contact probe is used as a central conductor, and the metal block is used as an outer conductor, and the outer diameter of the dielectric ring is set so as to be a coaxial line having a desired characteristic impedance. An inspection jig (IC socket) for a high-frequency / high-speed device, wherein the dielectric ring is formed by integrally molding a resin on the outer periphery of the contact probe.
また、特許文献２のＩＣソケットは、金属パイプの少なくとも一端部からプランジャーの突出長を可変できるコンタクトプローブ（プローブピン）と、該コンタクトプローブを少なくとも一方から挿入できる挿入孔が形成された金属ブロック（ハウジング）と、前記コンタクトプローブを前記挿入孔とほぼ同心に保持しながら、前記金属パイプ端部のみを絶縁体を介して前記金属ブロックに固定する固定手段とを有し、前記コンタクトプローブを中心導体とし、前記金属ブロックを外部導体として所定のインピーダンスの同軸構造を形成するように、前記金属パイプの外径および前記挿入孔の内径がそれぞれ設定されてなる検査用同軸プローブであって、前記金属パイプ先端部の外径に合せた凹部を有すると共に、該凹部とほぼ同心で前記プランジャーを貫通させる貫通孔が形成された絶縁性基板が、該絶縁性基板の凹部と前記金属ブロックの挿入孔とがほぼ同心になるように前記金属ブロック表面に固定されることにより、前記固定手段が形成されてなる検査用同軸プローブである。 Further, the IC socket of Patent Document 2 is a metal block in which a contact probe (probe pin) capable of varying the protruding length of a plunger from at least one end of a metal pipe and an insertion hole into which the contact probe can be inserted can be formed. It has a (housing) and a fixing means for fixing only the end of the metal pipe to the metal block via an insulator while holding the contact probe substantially concentrically with the insertion hole, and centering the contact probe. An inspection coaxial probe in which the outer diameter of the metal pipe and the inner diameter of the insertion hole are set so as to form a coaxial structure having a predetermined impedance by using the metal block as a conductor and the metal block as an outer conductor. An insulating substrate having a recess corresponding to the outer diameter of the tip of the pipe and having a through hole formed through the plunger so as to be substantially concentric with the recess is a recess of the insulating substrate and an insertion hole of the metal block. This is an inspection coaxial probe in which the fixing means is formed by being fixed to the surface of the metal block so as to be substantially concentric with each other.
しかしながら、特許文献１のＩＣソケットは、コンタクトプローブの外周に誘電体リングを固着した構造であり、そのため、誘電体リングをコンタクトプローブの外周に一体成形している。誘電体リングの外径は、実際には１ｍｍ以下であり、一体成形することは難しい。また、誘電体リングをハウジングの貫通孔に圧入してコンタクトプローブを保持する構造であり、誘電体リングには、少なくとも若干の弾性が必要であり、硬質な誘電体を使用することができない。また、誘電体リングが固着された部位の特性インピーダンスは、その他の外周の特性インピーダンスと異なるため、コンタクトプローブ全体の特性インピーダンスが変動する。 However, the IC socket of Patent Document 1 has a structure in which a dielectric ring is fixed to the outer periphery of the contact probe, and therefore the dielectric ring is integrally molded on the outer periphery of the contact probe. The outer diameter of the dielectric ring is actually 1 mm or less, and it is difficult to integrally mold it. Further, the structure is such that the dielectric ring is press-fitted into the through hole of the housing to hold the contact probe, and the dielectric ring requires at least some elasticity, and a hard dielectric cannot be used. Further, since the characteristic impedance of the portion where the dielectric ring is fixed is different from the characteristic impedance of other outer circumferences, the characteristic impedance of the entire contact probe fluctuates.
また、特許文献２のＩＣソケットは、ハウジングの凹部に、プランジャーを貫通させる貫通孔が形成された絶縁性基板を固定した構造であるが、実際の絶縁性基板は外形が１ｍｍ以下の小さい部品であり、ハウジングに固定するのは難しい。また、絶縁性基板が摩耗した時に、絶縁性基板を交換することも難しい。 Further, the IC socket of Patent Document 2 has a structure in which an insulating substrate having a through hole through which a plunger is formed is fixed in a recess of the housing, but the actual insulating substrate is a small component having an outer shape of 1 mm or less. It is difficult to fix it to the housing. It is also difficult to replace the insulating substrate when the insulating substrate is worn.
かかる技術背景に鑑み、本発明は、上記の問題を解決し、同軸構造のＩＣソケットにおいて、同軸構造を保持する絶縁体を備えつつプローブピン全体の特性インピーダンスの変動が小さく、また、絶縁体として硬質な誘電体リングを使用することが可能なプローブピンを提供することを目的とする。また、本発明は、上記のプローブピンを備えるＩＣソケットを提供することも目的とする。 In view of such a technical background, the present invention solves the above-mentioned problems, and in an IC socket having a coaxial structure, the fluctuation of the characteristic impedance of the entire probe pin is small while providing an insulator that holds the coaxial structure, and as an insulator. It is an object of the present invention to provide a probe pin capable of using a rigid dielectric ring. It is also an object of the present invention to provide an IC socket provided with the above probe pins.
上記課題を解決するために提供される本発明は次のとおりである。
（１）導電性を有する第１プランジャー、導電性を有する第２プランジャー、絶縁性の第１絶縁リング、絶縁性の第２絶縁リング、導電性を有するパイプ材、および前記パイプ材に内包されるスプリングを備えるプローブピンであって、前記第１プランジャーは、一方の端部に、検査対象物の電極と接触するための第１接触部を備え、他方の端部に、前記パイプ材の一方の端部から前記パイプ材の内側面と摺動可能に挿入される第１軸を備え、前記第２プランジャーは、一方の端部に、検査用基板の電極と接触するための第２接触部を備え、他方の端部に、前記パイプ材の他方の端部から前記パイプ材の内側面と摺動可能に挿入される第２軸を備え、前記第１絶縁リングは、前記第１プランジャーの前記第１軸をその貫通孔に挿通させて、前記パイプ材の前記一方の端部と前記第１プランジャーの前記第１接触部との間に位置し、前記第２絶縁リングは、前記第２プランジャーの前記第２軸をその貫通孔に挿通させて、前記パイプ材の前記他方の端部と前記第２プランジャーの前記第２接触部との間に位置し、前記第１絶縁リングの外径Ｄ１３および前記第２絶縁リングの外径Ｄ１４は、前記パイプ材の外径Ｄ１５よりも大きいことを特徴とするプローブピン。
（２）前記第１絶縁リングの内径ｄ１３は、前記パイプ材の外径Ｄ１５および前記第１接触部の外径Ｄ１１１より小さく、前記第２絶縁リングの内径ｄ１４は、前記パイプ材の外径Ｄ１５および前記第２接触部の外径Ｄ１２１より小さく、前記第１絶縁リングは、前記第１接触部と前記パイプ材との間で、前記第１軸に対して隙間嵌めされ、前記第２絶縁リングは、前記第２接触部と前記パイプ材との間で、前記第２軸に対して隙間嵌めされることを特徴とする、上記（１）に記載のプローブピン。
（３）前記第１絶縁リングの外径Ｄ１３および内径ｄ１３、および、前記第２絶縁リングの外径Ｄ１４および内径ｄ１４、ならびに、前記パイプ材の外径Ｄ１５は、下記式で示される関係を有する、上記（１）または上記（２）に記載のプローブピン。
ｌｏｇ（Ｄ１３／Ｄ１５）＝１／（ε１０．５）×ｌｏｇ（Ｄ１３／ｄ１３）
ｌｏｇ（Ｄ１４／Ｄ１５）＝１／（ε２０．５）×ｌｏｇ（Ｄ１４／ｄ１４）
ここで、ε１は前記第１絶縁リングの比誘電率、ε２は前記第２絶縁リングの比誘電率である。
（４）前記第１絶縁リングおよび前記第２絶縁リングはエンジニアリングプラスチックで構成される、上記（１）から上記（３）のいずれかに記載のプローブピン。
（５）前記第１絶縁リングと前記第２絶縁リングとは等しい材料で構成される、上記（１）から上記（４）のいずれかに記載のプローブピン。
（６）前記パイプ材の内側面が部分的に縮径した第１縮径部を有し、前記第１プランジャーの前記第１軸には外径が部分的に細くなった第１細径部が設けられ、前記第１細径部と前記第１縮径部とが対向配置されることにより、前記第１プランジャーの前記パイプ材からの脱落止め構造が構成され、前記パイプ材の内側面が部分的に縮径した第２縮径部を有し、前記第２プランジャーの前記第２軸には外径が部分的に細くなった第２細径部が設けられ、前記第２細径部と前記第２縮径部とが対向配置されることにより、前記第２プランジャーの前記パイプ材からの脱落止め構造が構成される、上記（１）から上記（５）のいずれかに記載のプローブピン。
（７）前記第１縮径部および前記第２縮径部の少なくとも一方は、前記パイプ材の外側面の一部が押されて形成された内側面の凸部からなる、上記（６）に記載のプローブピン。
（８）前記パイプ材の前記外側面の一部は肉厚が薄い切り欠き部を有し、前記凸部は前記切り欠き部に形成された、上記（７）に記載のプローブピン。
（９）上記（１）から上記（８）のいずれかに記載されるプローブピンと、複数の貫通孔を有するハウジングと、を備えるＩＣソケットであって、前記ハウジングの前記複数の貫通孔のそれぞれの中空部に前記プローブピンは保持され、少なくとも前記中空部の内側面は導電性を有し、前記プローブピンは前記第１絶縁リングおよび前記第２絶縁リングにおいて前記ハウジングの前記貫通孔の前記中空部に接触し、前記プローブピンにおける導電性の部分は前記ハウジングと電気的に絶縁されることを特徴とするＩＣソケット。
（１０）前記ハウジングは導電性材料から構成される、上記（９）に記載のＩＣソケット。
（１１）前記ハウジングは、絶縁性材料から構成される部分を有する、上記（９）に記載のＩＣソケット。
（１２）前記ハウジングが備える前記貫通孔は、前記第１プランジャーの前記第１接触部は通過可能であるが前記第１絶縁リングは通過不能に部分的に閉塞された第１部分閉塞開口を一方の端部に有し、前記第２プランジャーの前記第２接触部は通過可能であるが前記第２絶縁リングは通過不能に部分的に閉塞された第２部分閉塞開口を他方の端部に有し、前記第１部分閉塞開口と前記第２部分閉塞開口との間に前記中空部が構成される、上記（９）から上記（１１）のいずれかに記載のＩＣソケット。
（１３）前記貫通孔は、前記第１部分閉塞開口に、前記第１プランジャーの前記第１接触部の少なくとも一部を収容可能な座繰り部を有する、上記（９）から上記（１２）のいずれかに記載のＩＣソケット。
The present invention provided to solve the above problems is as follows.
(1) A first plunger having conductivity, a second plunger having conductivity, an insulating first insulating ring, an insulating second insulating ring, a conductive pipe material, and inclusion in the pipe material. A probe pin comprising a spring to be formed, the first plunger having a first contact portion at one end for contacting an electrode of an object to be inspected and the pipe material at the other end. A first shaft slidably inserted from one end to the inner surface of the pipe material is provided, and the second plunger has a first end for contacting an electrode of an inspection substrate. The first insulating ring is provided with a second shaft provided with two contact portions and slidably inserted from the other end portion of the pipe material to the inner surface surface of the pipe material at the other end portion. The first shaft of the plunger is inserted through the through hole, and is located between the one end of the pipe material and the first contact portion of the first plunger, and the second insulating ring. Is located between the other end of the pipe material and the second contact portion of the second plunger by inserting the second shaft of the second plunger into the through hole thereof. A probe pin characterized in that the outer diameter D13 of the first insulating ring and the outer diameter D14 of the second insulating ring are larger than the outer diameter D15 of the pipe material.
(2) The inner diameter d13 of the first insulating ring is smaller than the outer diameter D15 of the pipe material and the outer diameter D111 of the first contact portion, and the inner diameter d14 of the second insulating ring is the outer diameter D15 of the pipe material. And smaller than the outer diameter D121 of the second contact portion, the first insulating ring is gap-fitted with respect to the first shaft between the first contact portion and the pipe material, and the second insulating ring is fitted. The probe pin according to (1) above, characterized in that the second contact portion and the pipe material are gap-fitted with respect to the second shaft.
(3) The outer diameter D13 and inner diameter d13 of the first insulating ring, the outer diameter D14 and inner diameter d14 of the second insulating ring, and the outer diameter D15 of the pipe material have a relationship represented by the following formula. , The probe pin according to (1) or (2) above.
log (D13 / D15) = 1 / (ε10.5) × log (D13 / d13)
log (D14 / D15) = 1 / (ε20.5) × log (D14 / d14)
Here, ε1 is the relative permittivity of the first insulating ring, and ε2 is the relative permittivity of the second insulating ring.
(4) The probe pin according to any one of (1) to (3) above, wherein the first insulating ring and the second insulating ring are made of engineering plastic.
(5) The probe pin according to any one of (1) to (4) above, wherein the first insulating ring and the second insulating ring are made of the same material.
(6) A first small diameter portion in which the inner surface of the pipe material has a first reduced diameter portion whose diameter is partially reduced, and the outer diameter of the first shaft of the first plunger is partially reduced. A portion is provided, and the first small diameter portion and the first reduced diameter portion are arranged so as to face each other, so that a structure for preventing the first plunger from falling off from the pipe material is formed, and the inside of the pipe material is formed. The second shaft of the second plunger is provided with a second diameter portion having a partially reduced outer diameter, and the second diameter portion has a second diameter portion whose side surface is partially reduced. Any of the above (1) to (5), wherein the small diameter portion and the second reduced diameter portion are arranged so as to face each other to form a structure for preventing the second plunger from falling off from the pipe material. The probe pin described in.
(7) In the above (6), at least one of the first reduced diameter portion and the second reduced diameter portion is formed by a convex portion on the inner surface formed by pressing a part of the outer surface of the pipe material. The probe pin described.
(8) The probe pin according to (7) above, wherein a part of the outer surface of the pipe material has a notch portion having a thin wall thickness, and the convex portion is formed in the notch portion.
(9) An IC socket including the probe pin according to any one of (1) to (8) above and a housing having a plurality of through holes, and each of the plurality of through holes in the housing. The probe pin is held in the hollow portion, at least the inner surface of the hollow portion has conductivity, and the probe pin is the hollow portion of the through hole of the housing in the first insulating ring and the second insulating ring. An IC socket characterized in that a conductive portion of the probe pin is electrically insulated from the housing in contact with the housing.
(10) The IC socket according to (9) above, wherein the housing is made of a conductive material.
(11) The IC socket according to (9) above, wherein the housing has a portion made of an insulating material.
(12) The through hole provided in the housing has a first partially closed opening that is partially closed so that the first contact portion of the first plunger can pass through but the first insulating ring cannot pass through. The second end has a second partially blocked opening that is at one end and is passable through the second contact of the second plunger but is impenetrable to pass through the second insulating ring. The IC socket according to any one of (9) to (11) above, wherein the hollow portion is formed between the first partially closed opening and the second partially closed opening.
(13) The through hole has a counterbore portion capable of accommodating at least a part of the first contact portion of the first plunger in the first partial closing opening, from the above (9) to the above (12). IC socket described in any of.
本発明により、同軸構造のＩＣソケットにおいて、同軸構造を保持する絶縁体を備えつつプローブピン全体の特性インピーダンスの変動が小さく、また、絶縁体として硬質な誘電体リングを使用することが可能なプローブピンが提供される。また、本発明により、上記のプローブピンを備えるＩＣソケットも提供される。 According to the present invention, in an IC socket having a coaxial structure, a probe that is provided with an insulator that holds the coaxial structure, has a small variation in the characteristic impedance of the entire probe pin, and can use a hard dielectric ring as the insulator. Pins are provided. The present invention also provides an IC socket provided with the above probe pins.
以下、図面を参照しつつ、本発明に係るプローブピンおよびＩＣソケットを説明する。 Hereinafter, the probe pin and the IC socket according to the present invention will be described with reference to the drawings.
〔第１実施形態〕
本発明の第１実施形態に係るプローブピン１は、第１プランジャー１１、第２プランジャー１２、第１絶縁リング１３、第２絶縁リング１４、パイプ材１５、スプリング１６から構成される。図１は、本発明の第１実施形態に係るプローブピン１の断面図である。ここで、いずれも導電性を有する第１プランジャー１１、第２プランジャー１２、パイプ材１５の材質は金属であり、いずれも絶縁性である第１絶縁リング１３、第２絶縁リング１４の材質は、例えばプラスチックなどの絶縁体である。
[First Embodiment]
The probe pin 1 according to the first embodiment of the present invention is composed of a first plunger 11, a second plunger 12, a first insulating ring 13, a second insulating ring 14, a pipe material 15, and a spring 16. FIG. 1 is a cross-sectional view of the probe pin 1 according to the first embodiment of the present invention. Here, the materials of the first plunger 11, the second plunger 12, and the pipe material 15 which are all conductive are metal, and the materials of the first insulating ring 13 and the second insulating ring 14, which are all insulating, are made of metal. Is an insulator such as plastic.
第１プランジャー１１は、一方の端部に検査対象物の電極と接触するための第１接触部１１１を備え、他方の端部にパイプ材１５の内側面と摺動可能に挿入される第１軸１１２を備える。また、第１軸１１２は、直径が小さく加工された第１細径部１１３を備える。ここで第１接触部１１１の外径をＤ１１１、第１軸１１２の外径をＤ１１２とする。第２プランジャー１２は、一方の端部に検査用基板の電極と接触するための第２接触部１２１を備え、他方の端部にパイプ材１５の内側面摺動可能に挿入される第２軸１２２を備える。また、第２軸１２２は、直径が小さく加工された第２細径部１２３を備える。ここで第２接触部１２１の外径をＤ１２１、第２軸１２２の外径をＤ１２２とする。 The first plunger 11 is provided with a first contact portion 111 for contacting the electrode of the inspection object at one end thereof, and is slidably inserted into the other end portion with the inner surface of the pipe member 15. A single axis 112 is provided. Further, the first shaft 112 includes a first small diameter portion 113 processed to have a small diameter. Here, the outer diameter of the first contact portion 111 is D111, and the outer diameter of the first shaft 112 is D112. The second plunger 12 is provided with a second contact portion 121 for contacting the electrode of the inspection substrate at one end, and is inserted into the other end so as to be slidable on the inner surface of the pipe material 15. It includes a shaft 122. Further, the second shaft 122 includes a second small diameter portion 123 processed to have a small diameter. Here, the outer diameter of the second contact portion 121 is D121, and the outer diameter of the second shaft 122 is D122.
第１絶縁リング１３は、リング状の絶縁体であり、第１絶縁リング１３の外径をＤ１３、内径をｄ１３とする。第２絶縁リング１４もリング状の絶縁体であり、第２絶縁リング１４の外径をＤ１４、内径をｄ１４とする。 The first insulating ring 13 is a ring-shaped insulator, and the outer diameter of the first insulating ring 13 is D13 and the inner diameter is d13. The second insulating ring 14 is also a ring-shaped insulator, and the outer diameter of the second insulating ring 14 is D14 and the inner diameter is d14.
パイプ材１５は、外径および内径がほぼ一定の金属製の筒状の部材（パイプ）から形成されるものであり、パイプ材１５の外径をＤ１５とする。 The pipe material 15 is formed of a metal tubular member (pipe) having a substantially constant outer diameter and inner diameter, and the outer diameter of the pipe material 15 is D15.
スプリング１６は、図１に示した通りコイルバネが使用される。 As the spring 16, a coil spring is used as shown in FIG.
パイプ材１５の一方の端部の内径側に第１プランジャー１１の第１軸１１２の第１接触部１１１とは反対側の端部が挿入され、パイプ材１５の他方の端部の内径側に第２プランジャー１２の第２軸１２２の第２接触部１２１とは反対側の端部が挿入される。スプリング１６は、パイプ材１５の内部において、第１軸１１２の第１接触部１１１とは反対側の端部と、第２軸１２２の第２接触部１２１とは反対側の端部とに挟持される。 The end opposite to the first contact portion 111 of the first shaft 112 of the first plunger 11 is inserted into the inner diameter side of one end of the pipe material 15, and the inner diameter side of the other end of the pipe material 15 is inserted. The end of the second shaft 122 of the second plunger 12 opposite to the second contact portion 121 is inserted into the second plunger 12. The spring 16 is sandwiched between the end of the first shaft 112 opposite to the first contact portion 111 and the end of the second shaft 122 opposite to the second contact portion 121 inside the pipe member 15. Will be done.
第１絶縁リング１３は、その貫通孔に第１軸１１２を挿通させ、第１接触部１１１とパイプ材１５との間に配置され、第２絶縁リング１４は、その貫通孔に第２軸１２２を挿通させ、第２接触部１２１とパイプ材１５との間に配置される。ここで第１絶縁リング１３の内径ｄ１３は、第１軸１１２の外径Ｄ１１２より極僅かに大きく、第１接触部１１１の外径Ｄ１１１、および、パイプ材１５の外径Ｄ１５より小さく設定され、第２絶縁リング１４の内径ｄ１４は、第２軸１２２の外径Ｄ１２２より極僅かに大きく、第２接触部１２１の外径Ｄ１２１、および、パイプ材１５の外径Ｄ１５より小さく設定される。 The first insulating ring 13 has the first shaft 112 inserted through the through hole and is arranged between the first contact portion 111 and the pipe material 15, and the second insulating ring 14 has the second shaft 122 in the through hole. Is inserted and arranged between the second contact portion 121 and the pipe material 15. Here, the inner diameter d13 of the first insulating ring 13 is set to be extremely slightly larger than the outer diameter D112 of the first shaft 112 and smaller than the outer diameter D111 of the first contact portion 111 and the outer diameter D15 of the pipe material 15. The inner diameter d14 of the second insulating ring 14 is set to be extremely slightly larger than the outer diameter D122 of the second shaft 122 and smaller than the outer diameter D121 of the second contact portion 121 and the outer diameter D15 of the pipe material 15.
さらに、パイプ材１５における、パイプ材１５に挿入された第１軸１１２の第１細径部１１３が位置する部位の外側面の一部が、例えばプレス金型などにより押されて縮径され、パイプ材１５の内側面の局所的な凸部からなる第１縮径部１５１が形成される。このように、第１細径部１１３と第１縮径部１５１とが対向配置されることにより、第１プランジャー１１がパイプ材１５から脱落しないための構造（脱落止め構造）が構成される。なお、第１縮径部１５１を構成する凸部は、パイプ材１５の内側面にリング状に形成されてもよいし、複数の突起から構成されてもよい。 Further, a part of the outer surface of the pipe material 15 where the first small diameter portion 113 of the first shaft 112 inserted into the pipe material 15 is located is pushed by, for example, a press die to reduce the diameter. A first diameter-reduced portion 151 formed of a locally convex portion on the inner surface of the pipe material 15 is formed. By arranging the first small diameter portion 113 and the first reduced diameter portion 151 so as to face each other in this way, a structure (fall-off prevention structure) for preventing the first plunger 11 from falling off from the pipe material 15 is formed. .. The convex portion forming the first reduced diameter portion 151 may be formed in a ring shape on the inner side surface of the pipe member 15, or may be composed of a plurality of protrusions.
同様に、パイプ材１５における、パイプ材１５に挿入された第２軸１２２の第２細径部１２３が位置する部位の外側面の一部が押されて縮径され、パイプ材１５の内側面の局所的な凸部からなる第２縮径部１５２が形成される。このように、第２細径部１２３と第２縮径部１５２とが対向配置されることにより、第２プランジャー１２がパイプ材１５から脱落しないための構造（脱落止め構造）が構成される。なお、第２縮径部１５２を構成する凸部は、パイプ材１５の内側面にリング状に形成されてもよいし、複数の突起から構成されてもよい。 Similarly, a part of the outer surface of the pipe material 15 where the second small diameter portion 123 of the second shaft 122 inserted into the pipe material 15 is located is pushed to reduce the diameter, and the inner surface surface of the pipe material 15 is reduced. A second reduced diameter portion 152 is formed, which is composed of a local convex portion of the above. By arranging the second small diameter portion 123 and the second reduced diameter portion 152 so as to face each other in this way, a structure (fall-off prevention structure) for preventing the second plunger 12 from falling off from the pipe material 15 is formed. .. The convex portion forming the second diameter-reduced portion 152 may be formed in a ring shape on the inner side surface of the pipe member 15, or may be composed of a plurality of protrusions.
このように配置、組み立てられた本発明の第１実施形態に係るプローブピン１においては、第１プランジャー１１の第１軸１１２の外側面とパイプ材１５の内側面、および、第２プランジャー１２の第２軸１２２の外側面とパイプ材１５の内側面が摺動接触構造を構成する。この摺動接触構造により、第１プランジャー１１と第２プランジャー１２とは電気的接触を維持しつつ相対位置を変動することが可能となる。また、第１縮径部１５１および第２縮径部１５２により、第１プランジャー１１と第２プランジャー１２は、パイプ材１５から容易に脱離することはない。また、第１絶縁リング１３は第１プランジャー１１から、第２絶縁リング１４は第２プランジャー１２から、容易に脱離することはない。なお、第１絶縁リング１３と第２絶縁リング１４の機能は後述する。 In the probe pin 1 according to the first embodiment of the present invention arranged and assembled in this way, the outer surface of the first shaft 112 of the first plunger 11, the inner surface of the pipe material 15, and the second plunger The outer surface of the second shaft 122 of the 12 and the inner surface of the pipe member 15 form a sliding contact structure. With this sliding contact structure, the relative positions of the first plunger 11 and the second plunger 12 can be changed while maintaining electrical contact. Further, the first plunger 11 and the second plunger 12 are not easily separated from the pipe material 15 by the first reduced diameter portion 151 and the second reduced diameter portion 152. Further, the first insulating ring 13 is not easily detached from the first plunger 11, and the second insulating ring 14 is not easily detached from the second plunger 12. The functions of the first insulating ring 13 and the second insulating ring 14 will be described later.
ここでプローブピン１の組立方法を説明する。プローブピン１の組立方法は、先ずスプリング１６をパイプ材１５の内径側に挿入する。続いて、第１プランジャー１１の第１軸１１２を第１絶縁リング１３の内径側に貫通させつつ、さらに、パイプ材１５の一方の端部からパイプ材１５の内径側に挿入する。同様に、第２プランジャー１２の第２軸１２２を第２絶縁リング１４の内径側に貫通させつつ、さらに、パイプ材１５の他方の端部からパイプ材１５の内径側に挿入する。その後、パイプ材１５におけるパイプ材１５に挿入された第１軸１１２の第１細径部１１３が位置する部位の外側面の一部、および、パイプ材１５におけるパイプ材１５に挿入された第２軸１２２の第２細径部１２３が位置する部位の外側面の一部を、例えばプレス金型などにより縮径すればよい。こうして、プローブピン１に脱落止め構造が形成される。 Here, a method of assembling the probe pin 1 will be described. In the method of assembling the probe pin 1, the spring 16 is first inserted into the inner diameter side of the pipe material 15. Subsequently, the first shaft 112 of the first plunger 11 is passed through the inner diameter side of the first insulating ring 13, and is further inserted from one end of the pipe material 15 into the inner diameter side of the pipe material 15. Similarly, the second shaft 122 of the second plunger 12 is passed through the inner diameter side of the second insulating ring 14, and is further inserted into the inner diameter side of the pipe material 15 from the other end of the pipe material 15. After that, a part of the outer surface of the portion of the pipe material 15 where the first small diameter portion 113 of the first shaft 112 inserted into the pipe material 15 is located, and the second inserted into the pipe material 15 in the pipe material 15. A part of the outer surface of the portion where the second small diameter portion 123 of the shaft 122 is located may be reduced in diameter by, for example, a press die. In this way, a fall-prevention structure is formed on the probe pin 1.
続いて、図２、図３を用いて、本発明の第１実施形態に係るハウジング２、および、ＩＣソケット３の構造を説明する。図２は、本発明の第１実施形態に係るプローブピン１をハウジング２が保持した状態、即ちＩＣソケット３の断面図である。また、図３は、ＩＣソケット３が検査用基板５に載置され、検査対象物であるＩＣ４を検査している状態を示す断面図である。ハウジング２は金属などの導電体である。 Subsequently, the structures of the housing 2 and the IC socket 3 according to the first embodiment of the present invention will be described with reference to FIGS. 2 and 3. FIG. 2 is a cross-sectional view of the IC socket 3 in a state where the housing 2 holds the probe pin 1 according to the first embodiment of the present invention. Further, FIG. 3 is a cross-sectional view showing a state in which the IC socket 3 is placed on the inspection substrate 5 and the IC 4 which is the inspection target is inspected. The housing 2 is a conductor such as metal.
ＩＣソケット３は、ハウジング２に設けられた複数の貫通孔２１のそれぞれの中空部２１３により、プローブピン１を、検査対象物であるＩＣ４に付設される電極に対応した位置に保持する。具体的には、ハウジング２は主面内方向に２分割され、いずれも導電性材料から構成された第１部分ハウジング２０１および第２部分ハウジング２０２を備える。 The IC socket 3 holds the probe pin 1 at a position corresponding to the electrode attached to the IC 4 to be inspected by the hollow portion 213 of each of the plurality of through holes 21 provided in the housing 2. Specifically, the housing 2 is divided into two in the main surface inward direction, and both include a first partial housing 201 and a second partial housing 202 made of a conductive material.
第１部分ハウジング２０１は第１貫通孔２１１を複数有する。第１貫通孔２１１は、第１プランジャー１１の第１接触部１１１は通過可能であるが第１絶縁リング１３は通過不能に部分的に閉塞された第１部分閉塞開口２１１Ａを一方に有し、第１絶縁リング１３が挿入可能に開口する第１開口２１１Ｂを他方に有する。第１貫通孔２１１の中空部２１３Ａの内径は、第１開口２１１Ｂの開口径と等しい。 The first partial housing 201 has a plurality of first through holes 211. The first through hole 211 has a first partially closed opening 211A which is partially closed so that the first contact portion 111 of the first plunger 11 can pass through but the first insulating ring 13 cannot pass through. The other side has a first opening 211B through which the first insulating ring 13 can be inserted. The inner diameter of the hollow portion 213A of the first through hole 211 is equal to the opening diameter of the first opening 211B.
第２部分ハウジング２０２は第２貫通孔２１２を複数有する。第２貫通孔２１２は、第２プランジャー１２の第２接触部１２１は通過可能であるが第２絶縁リング１４は通過不能に部分的に閉塞された第２部分閉塞開口２１２Ａを一方に有し、第２絶縁リング１４が挿入可能に開口する第２開口２１２Ｂを他方に有する。第２貫通孔２１２の中空部２１３Ｂの内径は、第２開口２１２Ｂの開口径と等しい。 The second partial housing 202 has a plurality of second through holes 212. The second through hole 212 has a second partially closed opening 212A which is partially closed so that the second contact portion 121 of the second plunger 12 can pass through, but the second insulating ring 14 cannot pass through. The other side has a second opening 212B through which the second insulating ring 14 can be inserted. The inner diameter of the hollow portion 213B of the second through hole 212 is equal to the opening diameter of the second opening 212B.
第１開口２１１Ｂの開口径と第２開口２１２Ｂの開口径とは等しく、第１開口２１１Ｂと第２開口２１２Ｂとが当接するように第１部分ハウジング２０１と第２部分ハウジング２０２とが組み立てられて、第１貫通孔２１１と第２貫通孔２１２とが連通して貫通孔２１を構成する。貫通孔２１の中空部２１３の内径をｄ２１３とする。 The opening diameter of the first opening 211B and the opening diameter of the second opening 212B are equal, and the first partial housing 201 and the second partial housing 202 are assembled so that the first opening 211B and the second opening 212B are in contact with each other. , The first through hole 211 and the second through hole 212 communicate with each other to form the through hole 21. The inner diameter of the hollow portion 213 of the through hole 21 is d213.
図２に示されるＩＣソケット３では、第１部分閉塞開口２１１Ａと中空部２１３との境界には第１孔内段差部２１４が設けられ、第２部分閉塞開口２１２Ａと中空部２１３との境界には第２孔内段差部２１５が設けられる。ここで本発明の第１実施形態に係るプローブピン１は、図２に示した通り、ＩＣソケット３が組み立てられた状態において、プローブピン１が備える第１絶縁リング１３の第１接触部１１１側の端部が第１孔内段差部２１４と係止し、第２絶縁リング１４の第２接触部１２１側の端部が第２孔内段差部２１５と係止する。これにより、プローブピン１は、貫通孔２１の中空部２１３に保持される。このように、プローブピン１は第１絶縁リング１３および第２絶縁リング１４においてハウジング２の貫通孔２１の中空部２１３に接触するため、プローブピン１における導電性の部分（第１接触部１１１、パイプ材１５および第２接触部１２１を含む部分）と、ハウジング２の中空部２１３の内側面とは電気的に絶縁されている。 In the IC socket 3 shown in FIG. 2, a step portion 214 in the first hole is provided at the boundary between the first partially closed opening 211A and the hollow portion 213, and at the boundary between the second partially closed opening 212A and the hollow portion 213. Is provided with a stepped portion 215 in the second hole. Here, as shown in FIG. 2, the probe pin 1 according to the first embodiment of the present invention is on the first contact portion 111 side of the first insulating ring 13 included in the probe pin 1 in a state where the IC socket 3 is assembled. The end of the second insulating ring 14 is locked with the stepped portion 214 in the first hole, and the end portion of the second insulating ring 14 on the second contact portion 121 side is locked with the stepped portion 215 in the second hole. As a result, the probe pin 1 is held in the hollow portion 213 of the through hole 21. As described above, since the probe pin 1 contacts the hollow portion 213 of the through hole 21 of the housing 2 in the first insulating ring 13 and the second insulating ring 14, the conductive portion (first contact portion 111, The portion including the pipe member 15 and the second contact portion 121) and the inner surface of the hollow portion 213 of the housing 2 are electrically insulated.
さらに、本発明の第１実施形態に係るＩＣソケット３においては、プローブピン１が備える第１絶縁リング１３の外径Ｄ１３、および、第２絶縁リング１４の外径Ｄ１４は、ハウジング２の中空部２１３の内径ｄ２１３より極僅か小さく、且つ、パイプ材１５の外径Ｄ１５より大きく設定される。このように設定、配置された本発明の第１実施形態に係るＩＣソケット３においては、プローブピン１は、ハウジング２の貫通孔２１とほぼ同軸に配置される。また、プローブピン１は、第１絶縁リング１３と第２絶縁リング１４以外の部位でハウジング２の貫通孔２１の内側面と接触することはなく、プローブピン１は、その導電性の部分がハウジング２と電気的に絶縁された状態で、貫通孔２１の中空部２１３に保持される。 Further, in the IC socket 3 according to the first embodiment of the present invention, the outer diameter D13 of the first insulating ring 13 included in the probe pin 1 and the outer diameter D14 of the second insulating ring 14 are hollow portions of the housing 2. It is set to be extremely smaller than the inner diameter d213 of 213 and larger than the outer diameter D15 of the pipe material 15. In the IC socket 3 according to the first embodiment of the present invention set and arranged in this way, the probe pin 1 is arranged substantially coaxially with the through hole 21 of the housing 2. Further, the probe pin 1 does not come into contact with the inner surface of the through hole 21 of the housing 2 at a portion other than the first insulating ring 13 and the second insulating ring 14, and the conductive portion of the probe pin 1 is the housing. It is held in the hollow portion 213 of the through hole 21 in a state of being electrically insulated from 2.
また、図３に示した通り、ＩＣソケット３が検査対象物であるＩＣ４を検査している状態においては、ＩＣソケット３はＩＣ４と検査用基板５との間に位置し、プローブピン１の備えるスプリング１６が所定の長さまで圧縮される。スプリング１６の弾性回復力により、検査対象物であるＩＣ４の各端子４１とＩＣソケット３の各プローブピン１の第１接触部１１１との接点部分には所定の接触圧力が加わるとともに、検査用基板５と第２接触部１２１との接点部分においても所定の接触圧力が加わり、電気的に安定した検査が可能となる。 Further, as shown in FIG. 3, when the IC socket 3 is inspecting the IC 4 which is the inspection target, the IC socket 3 is located between the IC 4 and the inspection board 5, and is provided with the probe pin 1. The spring 16 is compressed to a predetermined length. Due to the elastic recovery force of the spring 16, a predetermined contact pressure is applied to the contact portion between each terminal 41 of the IC 4 which is the inspection target and the first contact portion 111 of each probe pin 1 of the IC socket 3, and the inspection substrate is used. A predetermined contact pressure is also applied to the contact portion between the 5 and the second contact portion 121, and an electrically stable inspection becomes possible.
続いて、図２を用いて、プローブピン１の特性インピーダンスを説明する。同軸構造の伝送線路の特性インピーダンスＺ０は、外部導体の内径をｄ、内部導体の外径をＤ、外部導体と内部導体の間に存在する絶縁体の比誘電率をεとすると、下記式（１）で算出される。（ｌｏｇは常用対数）
Ｚ０＝１３８／（ε０．５）×ｌｏｇ（ｄ／Ｄ） （１）
Subsequently, the characteristic impedance of the probe pin 1 will be described with reference to FIG. The characteristic impedance Z0 of the transmission line having a coaxial structure is calculated by the following equation, where d is the inner diameter of the outer conductor, D is the outer diameter of the inner conductor, and the relative permittivity of the insulator existing between the outer conductor and the inner conductor is ε. Calculated in 1). (Log is the common logarithm)
Z0 = 138 / (ε 0.5 ) × log (d / D) (1)
本実施形態に係るＩＣソケット３では、ＩＣソケット３の各部の特性インピーダンスＺ０が等しくなるように、第１絶縁リング１３および第２絶縁リング１４の材質および形状ならびにパイプ材１５の形状が上記式（１）に基づいて規定されている。 In the IC socket 3 according to the present embodiment, the materials and shapes of the first insulating ring 13 and the second insulating ring 14 and the shape of the pipe material 15 are expressed by the above formula so that the characteristic impedance Z0 of each part of the IC socket 3 becomes equal. It is stipulated based on 1).
ＩＣソケット３において、第１絶縁リング１３が設けられている部分では、上記式（１）は、下記式（２）のように表される。
Ｚ０＝１３８／（ε１０．５）×ｌｏｇ（ｄ２１３／Ｄ１１２） （２）
ここで、ε１は第１絶縁リング１３の比誘電率である。上記のとおり、ｄ２１３はハウジング２の中空部２１３の内径であり、Ｄ１１２は第１プランジャー１１の第１軸１１２の外径である。第１絶縁リング１３の外径Ｄ１３は、ハウジング２の中空部２１３の内径ｄ２１３よりわずかに細いだけであり、第１絶縁リング１３の内径ｄ１３は、第１軸１１２の外径Ｄ１１２よりわずかに太いだけであるから、上記式（２）は下記式（２−１）と近似することができる。
Ｚ０＝１３８／（ε１０．５）×ｌｏｇ（Ｄ１３／ｄ１３） （２−１）
In the portion of the IC socket 3 where the first insulating ring 13 is provided, the above equation (1) is expressed as the following equation (2).
Z0 = 138 / (ε1 0.5 ) × log (d213 / D112) (2)
Here, ε1 is the relative permittivity of the first insulating ring 13. As described above, d213 is the inner diameter of the hollow portion 213 of the housing 2, and D112 is the outer diameter of the first shaft 112 of the first plunger 11. The outer diameter D13 of the first insulating ring 13 is only slightly smaller than the inner diameter d213 of the hollow portion 213 of the housing 2, and the inner diameter d13 of the first insulating ring 13 is slightly thicker than the outer diameter D112 of the first shaft 112. Therefore, the above equation (2) can be approximated to the following equation (2-1).
Z0 = 138 / (ε1 0.5 ) × log (D13 / d13) (2-1)
ＩＣソケット３において、パイプ材１５が位置する部分では、上記式（１）は、下記式（３）のように表される。
Ｚ０＝１３８／（ε００．５）×ｌｏｇ（ｄ２１３／Ｄ１５） （３）
ここで、ε０は空気の比誘電率（＝１）である。第１絶縁リング１３の外径Ｄ１３は、ハウジング２の中空部２１３の内径ｄ２１３よりわずかに細いだけであるから、上記式（３）は下記式（３−１）と近似することができる。
Ｚ０＝１３８×ｌｏｇ（Ｄ１３／Ｄ１５） （３−１）
In the portion of the IC socket 3 where the pipe material 15 is located, the above equation (1) is expressed as the following equation (3).
Z0 = 138 / (ε0 0.5 ) × log (d213 / D15) (3)
Here, ε0 is the relative permittivity of air (= 1). Since the outer diameter D13 of the first insulating ring 13 is only slightly smaller than the inner diameter d213 of the hollow portion 213 of the housing 2, the above equation (3) can be approximated to the following equation (3-1).
Z0 = 138 × log (D13 / D15) (3-1)
ＩＣソケット３において、第２絶縁リング１４が設けられている部分では、上記式（１）は、下記式（４）のように表される。
Ｚ０＝１３８／（ε２０．５）×ｌｏｇ（ｄ２１３／Ｄ１２２） （４）
ここで、ε２は第２絶縁リング１４の比誘電率である。上記のとおり、ｄ２１３はハウジング２の中空部２１３の内径であり、Ｄ１２２は第２プランジャー１２の第２軸１２２の外径である。第２絶縁リング１４の外径Ｄ１４は、ハウジング２の中空部２１３の内径ｄ２１３よりわずかに細いだけであり、第２絶縁リング１４の内径ｄ１４は、第２軸１２２の外径Ｄ１２２よりわずかに太いだけであるから、上記式（４）は下記式（４−１）と近似することができる。
Ｚ０＝１３８／（ε２０．５）×ｌｏｇ（Ｄ１４／ｄ１４） （４−１）
In the portion of the IC socket 3 where the second insulating ring 14 is provided, the above equation (1) is expressed as the following equation (4).
Z0 = 138 / (ε2 0.5 ) × log (d213 / D122) (4)
Here, ε2 is the relative permittivity of the second insulating ring 14. As described above, d213 is the inner diameter of the hollow portion 213 of the housing 2, and D122 is the outer diameter of the second shaft 122 of the second plunger 12. The outer diameter D14 of the second insulating ring 14 is only slightly smaller than the inner diameter d213 of the hollow portion 213 of the housing 2, and the inner diameter d14 of the second insulating ring 14 is slightly thicker than the outer diameter D122 of the second shaft 122. Therefore, the above equation (4) can be approximated to the following equation (4-1).
Z0 = 138 / (ε2 0.5 ) × log (D14 / d14) (4-1)
第１絶縁リング１３の外径Ｄ１３および第２絶縁リング１４の外径Ｄ１４が、いずれもＩＣソケット３の中空部２１３の内径ｄ２１３と実質的に等しい場合には、Ｄ１３＝Ｄ１４＝ｄ２１３となり、第１絶縁リング１３の外径Ｄ１３および内径ｄ１３、第２絶縁リング１４の外径Ｄ１４および内径ｄ１４、ならびにパイプ材１５の外径Ｄ１５が下記の式（５）および式（６）を満たすように設計すれば、ＩＣソケット３の各部の特性インピーダンスＺ０が実質的に等しくなる。
ｌｏｇ（Ｄ１３／Ｄ１５）＝１／（ε１０．５）×ｌｏｇ（Ｄ１３／ｄ１３） （５）
ｌｏｇ（Ｄ１４／Ｄ１５）＝１／（ε２０．５）×ｌｏｇ（Ｄ１４／ｄ１４） （６）
When the outer diameter D13 of the first insulating ring 13 and the outer diameter D14 of the second insulating ring 14 are substantially equal to the inner diameter d213 of the hollow portion 213 of the IC socket 3, D13 = D14 = d213, and the second 1 Designed so that the outer diameter D13 and inner diameter d13 of the insulating ring 13, the outer diameter D14 and inner diameter d14 of the second insulating ring 14, and the outer diameter D15 of the pipe material 15 satisfy the following equations (5) and (6). Then, the characteristic impedance Z0 of each part of the IC socket 3 becomes substantially equal.
log (D13 / D15) = 1 / (ε1 0.5 ) × log (D13 / d13) (5)
log (D14 / D15) = 1 / (ε2 0.5 ) × log (D14 / d14) (6)
一例として、ハウジング２の中空部２１３の内径ｄ２１３を０．６ｍｍ、プローブピン１に求められる特性インピーダンスＺ０を５０Ωとして、上記式（３）からＤ１５を算出すると、ハウジング２の中空部２１３の絶縁体は空気であり、その比誘電率εは１．０であるから、Ｄ１５＝０．２６０ｍｍと算出される。即ち、パイプ材１５の外径Ｄ１５は０．２６０ｍｍと決定される。 As an example, when D15 is calculated from the above equation (3), where the inner diameter d213 of the hollow portion 213 of the housing 2 is 0.6 mm and the characteristic impedance Z0 required for the probe pin 1 is 50Ω, the insulator of the hollow portion 213 of the housing 2 is calculated. Is air, and its relative permittivity ε is 1.0, so D15 = 0.260 mm is calculated. That is, the outer diameter D15 of the pipe material 15 is determined to be 0.260 mm.
続いて、プローブピン１における第１プランジャー１１の第１軸１１２が第１絶縁リング１３を貫通している部分の特性インピーダンスＺ０、および、第２プランジャー１２の第２軸１２２が第２絶縁リング１４を貫通している部分の特性インピーダンスＺ０を算出することになるが、本発明において絶縁リングの材質は重要であり、比誘電率ε以外に、硬度と加工精度を勘案して材質を決定する必要がある。以下に、本発明に使用される絶縁リングの材質について説明する。 Subsequently, the characteristic impedance Z0 of the portion of the probe pin 1 where the first shaft 112 of the first plunger 11 penetrates the first insulating ring 13 and the second shaft 122 of the second plunger 12 are second insulated. The characteristic impedance Z0 of the portion penetrating the ring 14 is calculated, but the material of the insulating ring is important in the present invention, and the material is determined in consideration of hardness and processing accuracy in addition to the relative permittivity ε. There is a need to. The material of the insulating ring used in the present invention will be described below.
本発明に使用される絶縁リングの材質は、その候補となる材質が２つのグループに大別される。一つはＰＴＦＥ（ポリテトラフルオロエチレン）やポリエチレンなど、樹脂の中でもっとも比誘電率εが小さい樹脂のグループであり、比誘電率εは凡そ２．１〜２．３である。もう一つは、ＰＥＥＫ（ポリエーテルエーテルケトン）、ＰＥＩ（ポリエーテルイミン）、ＰＥＳ（ポリエーテルスルホン）などのエンジニアリングプラスチックであり、比誘電率εはＰＴＦＥやポリエチレンよりも若干大きいが、硬度が高く、加工精度も高い樹脂のグループである。比誘電率εは凡そ３．３〜３．５である。 The materials of the insulating ring used in the present invention are roughly classified into two groups of candidate materials. One is a group of resins having the smallest relative permittivity ε among resins such as PTFE (polytetrafluoroethylene) and polyethylene, and the relative permittivity ε is about 2.1 to 2.3. The other is engineering plastics such as PEEK (polyetheretherketone), PEI (polyetherimine), and PES (polyethersulfone). The specific dielectric constant ε is slightly larger than that of PTFE and polyethylene, but the hardness is high. , A group of resins with high processing accuracy. The relative permittivity ε is about 3.3 to 3.5.
先ず、ＰＴＦＥやポリエチレンなど、樹脂の中でもっとも比誘電率εが小さい樹脂のグループについて説明する。ＰＴＦＥやポリエチレンなどは比誘電率εが小さい半面、硬度がショア硬度Ｄ５５〜６５と柔らかい樹脂である。柔らかいため、旋盤などにより切削加工ができず、リング形状を得るためには、押出成形によりパイプ形状の部材を製作し、それを切断する。押出成形時の収縮率も大きいため、外径と内径の寸法公差を±０．０３ｍｍ以下にすることが難しい。 First, a group of resins having the smallest relative permittivity ε among the resins such as PTFE and polyethylene will be described. While PTFE and polyethylene have a small relative permittivity ε, they are soft resins with a shore hardness of D55-65. Since it is soft, it cannot be cut by a lathe or the like, and in order to obtain a ring shape, a pipe-shaped member is manufactured by extrusion molding and cut. Since the shrinkage rate during extrusion molding is also large, it is difficult to make the dimensional tolerance between the outer diameter and the inner diameter ± 0.03 mm or less.
他方、ＰＥＥＫ、ＰＥＩ、ＰＥＳなどのエンジニアリングプラスチックは、硬度がロックウェル硬度Ｍ１００〜１１０とかなり硬い樹脂である。リング形状を得るためには、旋盤などにより切削加工してもよいし、押出成形によりパイプ形状の部材を製作して切断してもよい。押出成形時の収縮率が小さいので、いずれの加工方法を用いても、外径と内径の寸法公差を±０．０１ｍｍ以下にすることが可能である。 On the other hand, engineering plastics such as PEEK, PEI, and PES are resins having a hardness of Rockwell hardness M100 to 110, which is quite hard. In order to obtain a ring shape, it may be cut by a lathe or the like, or a pipe-shaped member may be manufactured and cut by extrusion molding. Since the shrinkage rate during extrusion molding is small, it is possible to reduce the dimensional tolerance between the outer diameter and the inner diameter to ± 0.01 mm or less regardless of which processing method is used.
ここで特性インピーダンスＺ０は、上記式（１）からｌｏｇ（ｄ／Ｄ）に比例するので、絶縁リングの外径や内径に製造上の公差があると、その絶縁リングを用いたプローブピンの特性インピーダンスＺ０も変動する。したがって、本発明に係るプローブピンの絶縁リングの材質を選定する時は、比誘電率εのほか、製造上の寸法公差を勘案することが望ましい。 Here, the characteristic impedance Z0 is proportional to the log (d / D) from the above equation (1). Therefore, if there is a manufacturing tolerance in the outer diameter or inner diameter of the insulating ring, the characteristics of the probe pin using the insulating ring. Impedance Z0 also fluctuates. Therefore, when selecting the material of the insulating ring of the probe pin according to the present invention, it is desirable to consider the dimensional tolerance in manufacturing in addition to the relative permittivity ε.
以下、再び図２を用いて、プローブピン１における第１プランジャー１１の第１軸１１２が第１絶縁リング１３を貫通している部分の特性インピーダンスＺ０、および、第２プランジャー１２の第２軸１２２が第２絶縁リング１４を貫通している部分の特性インピーダンスＺ０を説明する。上記の通り、ハウジング２の中空部２１３の内径ｄ２１３は０．６ｍｍ、プローブピン１に求められる特性インピーダンスＺ０は５０Ωであり、パイプ材１５の外径Ｄ１５は０．２６０ｍｍと決定された。続いて、プローブピン１における第１プランジャー１１の第１軸１１２が第１絶縁リング１３を貫通している部分の特性インピーダンスＺ０を上記式（５）に基づき計算する。 Hereinafter, using FIG. 2 again, the characteristic impedance Z0 of the portion of the probe pin 1 where the first axis 112 of the first plunger 11 penetrates the first insulating ring 13 and the second of the second plunger 12. The characteristic impedance Z0 of the portion where the shaft 122 penetrates the second insulating ring 14 will be described. As described above, it was determined that the inner diameter d213 of the hollow portion 213 of the housing 2 is 0.6 mm, the characteristic impedance Z0 required for the probe pin 1 is 50Ω, and the outer diameter D15 of the pipe material 15 is 0.260 mm. Subsequently, the characteristic impedance Z0 of the portion of the probe pin 1 where the first shaft 112 of the first plunger 11 penetrates the first insulating ring 13 is calculated based on the above equation (5).
ここで本発明に使用される絶縁リングの材質は、前述のとおり、その候補となる材質が２つのグループに大別されるが、プローブピンの特性インピーダンスＺ０の変動を小さくするためには、寸法精度に優れるＰＥＥＫ、ＰＥＩ、ＰＥＳなどのエンジニアリングプラスチックを使用することが望ましい。しかしながら、ＰＥＥＫ、ＰＥＩ、ＰＥＳなどのエンジニアリングプラスチックは、比誘電率εが凡そ３．３〜３．５であり、ＰＴＦＥやポリエチレンなど、樹脂の中でもっとも比誘電率εが小さい樹脂と比較すると、比誘電率εが大きい。本発明の第１実施形態に係るプローブピン１は、絶縁リング（第１絶縁リング１３と第２絶縁リング１４）を、パイプ材１５よりも外径が小さい第１プランジャー１１の第１軸１１２、および、第２プランジャー１２の第２軸１２２の外周に配置することにより、絶縁リングの内径を小さくすることが可能となり、絶縁リングの材質として、ＰＥＥＫ、ＰＥＩ、ＰＥＳなどのエンジニアリングプラスチックを使用することが可能となる。以下に具体的な設計例を示す。 As described above, the material of the insulating ring used in the present invention is roughly divided into two groups of candidate materials, but in order to reduce the fluctuation of the characteristic impedance Z0 of the probe pin, the dimensions are small. It is desirable to use engineering plastics such as PEEK, PEI, and PES, which have excellent accuracy. However, engineering plastics such as PEEK, PEI, and PES have a relative permittivity ε of about 3.3 to 3.5, and are compared with resins having the smallest relative permittivity ε among resins such as PTFE and polyethylene. Relative permittivity ε is large. The probe pin 1 according to the first embodiment of the present invention has an insulating ring (first insulating ring 13 and second insulating ring 14), and the first shaft 112 of the first plunger 11 having an outer diameter smaller than that of the pipe material 15. , And by arranging it on the outer circumference of the second shaft 122 of the second plunger 12, the inner diameter of the insulating ring can be reduced, and engineering plastics such as PEEK, PEI, and PES are used as the material of the insulating ring. It becomes possible to do. A concrete design example is shown below.
具体的な一例として、絶縁リングの材質をＰＥＥＫとする。ＰＥＥＫの比誘電率εは３．３である。上記の通り、本明細書の特性インピーダンスＺ０の算出においては、第１絶縁リング１３の外径Ｄ１３はハウジング２の中空部２１３の内径ｄ２１３と同じ値としているので、上記式（２−１）にε１＝３．３、Ｄ１３＝０．６ｍｍ、Ｚ０＝５０を代入し、ｄ１３の値を求めると、ｄ１３＝０．１３２ｍｍとなる。したがって、第１絶縁リング１３の内径ｄ１３は０．１３２ｍｍとすればよい。 As a specific example, the material of the insulating ring is PEEK. The relative permittivity ε of PEEK is 3.3. As described above, in the calculation of the characteristic impedance Z0 of the present specification, the outer diameter D13 of the first insulating ring 13 has the same value as the inner diameter d213 of the hollow portion 213 of the housing 2, so that the above equation (2-1) is used. Substituting ε1 = 3.3, D13 = 0.6 mm, and Z0 = 50 to obtain the value of d13, d13 = 0.132 mm. Therefore, the inner diameter d13 of the first insulating ring 13 may be 0.132 mm.
さらに、本明細書の特性インピーダンスＺ０の算出においては、上記の通り、第１絶縁リング１３の内径ｄ１３は第１プランジャー１１の第１軸１１２の外径Ｄ１１２と同じ値としているので、本設計例では、第１軸１１２の外径Ｄ１１２を０．１３２ｍｍとすればよい。また、第２絶縁リング１４の内径ｄ１４は、上記式（４−１）に基づいて算出されるが、本設計例ではε１＝ε２＝３．３なので、第２絶縁リング１４の内径ｄ１４は第１絶縁リング１３の内径ｄ１３と同じ値とすればよい。さらに、第２軸１２２の外径Ｄ１２２は、第２絶縁リング１４の内径ｄ１４と同じ値とすればよい。本設計例において、パイプ材１５の外径Ｄ１５は０．２６０ｍｍなので、パイプ材１５の肉厚等を調整し、第１軸１１２の外径Ｄ１１２、および、第２軸１２２の外径Ｄ１２２を０．１３２ｍｍとすることは可能である。 Further, in the calculation of the characteristic impedance Z0 of the present specification, as described above, the inner diameter d13 of the first insulating ring 13 is the same value as the outer diameter D112 of the first shaft 112 of the first plunger 11, so that this design In the example, the outer diameter D112 of the first shaft 112 may be 0.132 mm. Further, the inner diameter d14 of the second insulating ring 14 is calculated based on the above equation (4-1), but since ε1 = ε2 = 3.3 in this design example, the inner diameter d14 of the second insulating ring 14 is the first. 1 The value may be the same as the inner diameter d13 of the insulating ring 13. Further, the outer diameter D122 of the second shaft 122 may be the same value as the inner diameter d14 of the second insulating ring 14. In this design example, since the outer diameter D15 of the pipe material 15 is 0.260 mm, the wall thickness of the pipe material 15 and the like are adjusted to set the outer diameter D112 of the first shaft 112 and the outer diameter D122 of the second shaft 122 to 0. It is possible to make it .132 mm.
また、本設計例において、絶縁リングの材質をＰＴＦＥやポリエチレンなど、樹脂の中でもっとも比誘電率εが小さい樹脂を使用することも可能である。一例として、絶縁リングの材質をＰＴＦＥとする。ＰＴＦＥの比誘電率εは２．１である。上記の設計例と同様に、上記式（２−１）にε＝２．１、Ｄ１３＝０．６ｍｍ、Ｚ０＝５０を代入し、ｄ１３の値を求めると、ｄ１３＝０．１７９ｍｍとなる。したがって、第１絶縁リング１３の内径ｄ１３、および、第１軸１１２の外径Ｄ１１２を０．１７９ｍｍとすればよい。第２絶縁リング１４の内径、および、第２軸１２２の外径も同じ値とすればよい。上記の設計例と同様に、本設計例において、パイプ材１５の外径Ｄ１５は０．２６０ｍｍなので、パイプ材１５の肉厚等を調整し、第１軸１１２の外径Ｄ１１２、および、第２軸１２２の外径Ｄ１２２を０．１７９ｍｍとすることは可能である。 Further, in this design example, it is also possible to use a resin having the smallest relative permittivity ε among the resins such as PTFE and polyethylene as the material of the insulating ring. As an example, the material of the insulating ring is PTFE. The relative permittivity ε of PTFE is 2.1. Similar to the above design example, when ε = 2.1, D13 = 0.6 mm, and Z0 = 50 are substituted into the above equation (2-1) and the value of d13 is obtained, d13 = 0.179 mm. Therefore, the inner diameter d13 of the first insulating ring 13 and the outer diameter D112 of the first shaft 112 may be 0.179 mm. The inner diameter of the second insulating ring 14 and the outer diameter of the second shaft 122 may be the same values. Similar to the above design example, in this design example, the outer diameter D15 of the pipe material 15 is 0.260 mm, so the wall thickness of the pipe material 15 and the like are adjusted to adjust the outer diameter D112 of the first shaft 112 and the second. It is possible to set the outer diameter D122 of the shaft 122 to 0.179 mm.
以上の通り、本発明の第１実施形態に係るプローブピン１は、特性インピーダンスＺ０を所定の値としつつ、絶縁リングの材質を、ＰＥＥＫ、ＰＥＩ、ＰＥＳなどのエンジニアリングプラスチック、および、ＰＴＦＥやポリエチレンなど、樹脂の中でもっとも比誘電率εが小さい樹脂のいずれも使用することが可能である。しかしながら、上述した通り、ＰＴＦＥやポリエチレンなどは加工精度が劣るため、絶縁リングの材質は、ＰＥＥＫ、ＰＥＩ、ＰＥＳなどのエンジニアリングプラスチックを使用することが望ましい。 As described above, the probe pin 1 according to the first embodiment of the present invention uses engineering plastics such as PEEK, PEI, and PES, and PTFE, polyethylene, and the like as the material of the insulating ring while setting the characteristic impedance Z0 to a predetermined value. , Any of the resins having the smallest relative permittivity ε can be used. However, as described above, since PTFE, polyethylene and the like are inferior in processing accuracy, it is desirable to use engineering plastics such as PEEK, PEI and PES as the material of the insulating ring.
また、ハウジング２が備える検査対象物であるＩＣ４に対向する面に設けられる第１部分閉塞開口２１１Ａの孔径は、第１部分閉塞開口２１１Ａの内側面と第１プランジャー１１が備える第１軸１１２の外径との間の特性インピーダンスＺ０が所定の値（上記の設計例では５０Ω）にできる限り近くなるよう設定することが望ましい。また、検査用基板５に対向する面に設けられる第２部分閉塞開口２１２Ａの孔径は、図３に示したＩＣソケット３が検査用基板５に載置された状態において、第２部分閉塞開口２１２Ａの内側面と第２プランジャー１２が備える第２接触部１２１の外径との間の特性インピーダンスＺ０が所定の値（上記の設計例では５０Ω）にできる限り近くなるよう設定することが望ましい。 Further, the hole diameter of the first partially closed opening 211A provided on the surface of the housing 2 facing the IC4, which is the inspection target, is the inner surface of the first partially closed opening 211A and the first shaft 112 provided by the first plunger 11. It is desirable to set the characteristic impedance Z0 with the outer diameter of the above to be as close as possible to a predetermined value (50Ω in the above design example). Further, the hole diameter of the second partially closed opening 212A provided on the surface facing the inspection board 5 is such that the second partially closed opening 212A is provided in a state where the IC socket 3 shown in FIG. 3 is placed on the inspection board 5. It is desirable to set the characteristic impedance Z0 between the inner surface of the second plunger 12 and the outer diameter of the second contact portion 121 included in the second plunger 12 as close as possible to a predetermined value (50Ω in the above design example).
〔第１実施形態の第１変形例〕
図４は、本発明の第１実施形態の第１変形例に係るプローブピン１の断面図である。本発明の第１実施形態に係るプローブピン１は、上述の通り、パイプ材１５におけるパイプ材１５に挿入された第１軸１１２の第１細径部１１３が位置する部位の外側面の一部、および、第２軸１２２の第２細径部１２３が位置する部位の外側面の一部が、例えばプレス金型などにより縮径されている。この時、パイプ材１５の肉厚が厚い場合は、部分的に切り欠き部を設ければよい。具体的には、図４に示した通り、パイプ材１５における縮径される部位の外側面に第１切り欠き部１５３および第２切り欠き部１５４を設け、縮径される部位の肉厚を薄くしてもよい。パイプ材１５における第１切り欠き部１５３および第２切り欠き部１５４の外径は、パイプ材１５の外径Ｄ１５より若干小さくなり、この部位の特性インピーダンスＺ０は若干大きくなるが、その差異は小さいので、プローブピン１の特性インピーダンスＺ０に与える影響も小さい。なお、第１切り欠き部１５３に形成される第１縮径部１５１を構成する凸部および２切り欠き部１５４に形成される第２縮径部１５２を構成する凸部は、パイプ材１５の内側面にリング状に形成されてもよいし、複数の突起から構成されてもよい。
[First Modified Example of First Embodiment]
FIG. 4 is a cross-sectional view of the probe pin 1 according to the first modification of the first embodiment of the present invention. As described above, the probe pin 1 according to the first embodiment of the present invention is a part of the outer surface of the portion of the pipe material 15 where the first small diameter portion 113 of the first shaft 112 inserted into the pipe material 15 is located. , And a part of the outer surface of the portion where the second small diameter portion 123 of the second shaft 122 is located is reduced in diameter by, for example, a press die. At this time, if the wall thickness of the pipe material 15 is thick, a notch portion may be partially provided. Specifically, as shown in FIG. 4, a first notch portion 153 and a second notch portion 154 are provided on the outer surface of the diameter-reduced portion of the pipe material 15, and the wall thickness of the diameter-reduced portion is determined. It may be thin. The outer diameters of the first notch 153 and the second notch 154 in the pipe material 15 are slightly smaller than the outer diameter D15 of the pipe material 15, and the characteristic impedance Z0 of this part is slightly larger, but the difference is small. Therefore, the influence on the characteristic impedance Z0 of the probe pin 1 is small. The convex portion forming the first reduced diameter portion 151 formed in the first cutout portion 153 and the convex portion forming the second reduced diameter portion 152 formed in the second notched portion 154 are made of the pipe material 15. It may be formed in a ring shape on the inner surface, or may be composed of a plurality of protrusions.
〔第１実施形態の第２変形例〕
図５は、本発明の第１実施形態の第２変形例に係るＩＣソケット３が検査用基板５に載置され、検査対象物であるＩＣ４を検査している状態を示す断面図である。図５に示した通り、ハウジング２が備える検査対象物であるＩＣ４に対向する面に設けられる第１部分閉塞開口２１１Ａは、第１プランジャー１１の第１接触部１１１の少なくも一部を収容可能な座繰り部２１６を有してもよい。ここで、座繰り部２１６の孔径は、図５に示したＩＣソケット３が検査用基板５に載置された状態において、座繰り部２１６の内側面と第１プランジャー１１が備える第１接触部１１１の外径との間の特性インピーダンスＺ０が所定の値（上記の設計例では５０Ω）にできる限り近くなるよう設定することが望ましい。
[Second variant of the first embodiment]
FIG. 5 is a cross-sectional view showing a state in which the IC socket 3 according to the second modification of the first embodiment of the present invention is placed on the inspection substrate 5 and the IC 4 which is the inspection target is inspected. As shown in FIG. 5, the first partial blockage opening 211A provided on the surface of the housing 2 facing the IC4, which is an inspection object, accommodates at least a part of the first contact portion 111 of the first plunger 11. It may have a possible counterbore 216. Here, the hole diameter of the counterbore portion 216 is the first contact between the inner surface of the counterbore portion 216 and the first plunger 11 in a state where the IC socket 3 shown in FIG. 5 is mounted on the inspection substrate 5. It is desirable to set the characteristic impedance Z0 with the outer diameter of the unit 111 as close as possible to a predetermined value (50Ω in the above design example).
以上の通り、本発明の第１実施形態に係るプローブピン１は、絶縁リングを備える部位の特性インピーダンスＺ０をも所定の値にすることが可能であり、また、絶縁リングの材質として、硬質なエンジニアリングプラスチックを使用することも可能である。 As described above, the probe pin 1 according to the first embodiment of the present invention can set the characteristic impedance Z0 of the portion provided with the insulating ring to a predetermined value, and is hard as a material of the insulating ring. It is also possible to use engineering plastics.
なお、以上説明した第１実施形態、および、その変形例は、本発明の理解を容易にするために記載されたものであって、本発明を限定するために記載されたものではない。したがって、上記実施形態に開示された各要素は、本発明の技術的範囲に属する全ての設計変更や均等物をも含む趣旨である。
例えば、上記のＩＣソケット３では、ハウジング２は主面内方向に２分割され、いずれも導電性材料から構成された第１部分ハウジング２０１および第２部分ハウジング２０２を備えるが、貫通孔２１の中空部２１３は一体とし、ハウジング２を別の部分で分割してもよい。また、貫通孔２１の中空部２１３の内側面が導電性を有していればよいので、ハウジング２の一部を絶縁体で構成してもよい。
It should be noted that the first embodiment described above and its modifications are described for facilitating the understanding of the present invention, and are not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.
For example, in the above IC socket 3, the housing 2 is divided into two in the main surface inward direction, and both include a first partial housing 201 and a second partial housing 202 made of a conductive material, but the through hole 21 is hollow. The portion 213 may be integrated and the housing 2 may be divided into separate portions. Further, since the inner side surface of the hollow portion 213 of the through hole 21 may have conductivity, a part of the housing 2 may be made of an insulator.
１ プローブピン
１１ 第１プランジャー
１２ 第２プランジャー
１３ 第１絶縁リング
１４ 第２絶縁リング
１５ パイプ材
１６ スプリング
１１１ 第１接触部
１１２ 第１軸
１１３ 第１細径部
１２１ 第２接触部
１２２ 第２軸
１２３ 第２細径部
１５１ 第１縮径部
１５２ 第２縮径部
１５３ 第１切り欠き部
１５４ 第２切り欠き部
Ｄ１３ 第１絶縁リングの外径
ｄ１３ 第１絶縁リングの内径
Ｄ１４ 第２絶縁リングの外径
ｄ１４ 第２絶縁リングの内径
Ｄ１５ パイプ材の外径
Ｄ１１１ 第１接触部の外径
Ｄ１２１ 第２接触部の外径
Ｄ１１２ 第１軸の外径
Ｄ１２２ 第２軸の外径
２ ハウジング
２０１ 第１部分ハウジング
２０２ 第２部分ハウジング
２１ 貫通孔
２１１ 第１貫通孔
２１１Ａ 第１部分閉塞開口
２１１Ｂ 第１開口
２１２ 第２貫通孔
２１２Ａ 第２部分閉塞開口
２１２Ｂ 第２開口
２１３ 中空部
ｄ２１３ 中空部の内径
２１３Ａ 第１貫通孔２１１の中空部
２１３Ｂ 第２貫通孔２１２の中空部
２１４ 第１孔内段差部
２１５ 第２孔内段差部
２１６ 座繰り部
３ ＩＣソケット
４ ＩＣ
４１ ＩＣの端子
５ 検査用基板
1 Probe pin 11 1st plunger 12 2nd plunger 13 1st insulating ring 14 2nd insulating ring 15 Pipe material
16 Spring 111 1st contact part 112 1st shaft 113 1st small diameter part 121 2nd contact part 122 2nd shaft 123 2nd small diameter part 151 1st reduced diameter part 152 2nd reduced diameter part 153 1st notch part 154 Second notch D13 Outer diameter of first insulating ring d13 Inner diameter of first insulating ring D14 Outer diameter of second insulating ring d14 Inner diameter of second insulating ring D15 Outer diameter of pipe material D111 Outer diameter of first contact D121 Outer diameter of the second contact part D112 Outer diameter of the first shaft D122 Outer diameter of the second shaft 2 Housing 201 First part housing 202 Second part housing 21 Through hole 211 First through hole 211A First part closing opening 211B No. 1 opening 212 2nd through hole 212A 2nd partial closing opening 212B 2nd opening 213 Hollow part d213 Inner diameter of hollow part 213A Hollow part of 1st through hole 211B Hollow part 214 of 2nd through hole 212 Step in 1st hole 215 Step portion in the second hole 216 Counterbore portion 3 IC socket 4 IC
41 IC terminal 5 Inspection board
Claims (13)
前記第１プランジャーは、一方の端部に、検査対象物の電極と接触するための第１接触部を備え、他方の端部に、前記パイプ材の一方の端部から前記パイプ材の内側面と摺動可能に挿入される第１軸を備え、
前記第２プランジャーは、一方の端部に、検査用基板の電極と接触するための第２接触部を備え、他方の端部に、前記パイプ材の他方の端部から前記パイプ材の内側面と摺動可能に挿入される第２軸を備え、
前記第１絶縁リングは、前記第１プランジャーの前記第１軸をその貫通孔に挿通させて、前記パイプ材の前記一方の端部と前記第１プランジャーの前記第１接触部との間に位置し、
前記第２絶縁リングは、前記第２プランジャーの前記第２軸をその貫通孔に挿通させて、前記パイプ材の前記他方の端部と前記第２プランジャーの前記第２接触部との間に位置し、
前記第１絶縁リングの外径Ｄ１３および前記第２絶縁リングの外径Ｄ１４は、前記パイプ材の外径Ｄ１５よりも大きいこと
を特徴とするプローブピン。 A first plunger having conductivity, a second plunger having conductivity, an insulating first insulating ring, an insulating second insulating ring, a conductive pipe material, and a spring contained in the pipe material. A probe pin with
The first plunger is provided with a first contact portion for contacting an electrode of an inspection object at one end, and at the other end, from one end of the pipe material to the inside of the pipe material. Equipped with a first shaft that is slidably inserted with the side surface
The second plunger is provided with a second contact portion for contacting an electrode of an inspection substrate at one end thereof, and at the other end portion, from the other end portion of the pipe material to the inside of the pipe material. Equipped with a second shaft that is slidably inserted with the side surface
The first insulating ring has the first shaft of the first plunger inserted through the through hole between the one end of the pipe material and the first contact portion of the first plunger. Located in
The second insulating ring has the second shaft of the second plunger inserted through the through hole between the other end of the pipe material and the second contact portion of the second plunger. Located in
A probe pin characterized in that the outer diameter D13 of the first insulating ring and the outer diameter D14 of the second insulating ring are larger than the outer diameter D15 of the pipe material.
前記第２絶縁リングの内径ｄ１４は、前記パイプ材の外径Ｄ１５および前記第２接触部の外径Ｄ１２１より小さく、
前記第１絶縁リングは、前記第１接触部と前記パイプ材との間で、前記第１軸に対して隙間嵌めされ、前記第２絶縁リングは、前記第２接触部と前記パイプ材との間で、前記第２軸に対して隙間嵌めされることを特徴とする、請求項１に記載のプローブピン。 The inner diameter d13 of the first insulating ring is smaller than the outer diameter D15 of the pipe material and the outer diameter D111 of the first contact portion.
The inner diameter d14 of the second insulating ring is smaller than the outer diameter D15 of the pipe material and the outer diameter D121 of the second contact portion.
The first insulating ring is gap-fitted with respect to the first shaft between the first contact portion and the pipe material, and the second insulating ring is formed between the second contact portion and the pipe material. The probe pin according to claim 1, wherein the probe pin is gap-fitted with respect to the second axis.
ｌｏｇ（Ｄ１３／Ｄ１５）＝１／（ε１０．５）×ｌｏｇ（Ｄ１３／ｄ１３）
ｌｏｇ（Ｄ１４／Ｄ１５）＝１／（ε２０．５）×ｌｏｇ（Ｄ１４／ｄ１４）
ここで、ε１は前記第１絶縁リングの比誘電率、ε２は前記第２絶縁リングの比誘電率である。 The claim that the outer diameter D13 and the inner diameter d13 of the first insulating ring, the outer diameter D14 and the inner diameter d14 of the second insulating ring, and the outer diameter D15 of the pipe material have a relationship represented by the following formula. 1 or the probe pin according to claim 2.
log (D13 / D15) = 1 / (ε1 0.5 ) × log (D13 / d13)
log (D14 / D15) = 1 / (ε2 0.5 ) × log (D14 / d14)
Here, ε1 is the relative permittivity of the first insulating ring, and ε2 is the relative permittivity of the second insulating ring.
前記パイプ材の内側面が部分的に縮径した第２縮径部を有し、前記第２プランジャーの前記第２軸には外径が部分的に細くなった第２細径部が設けられ、前記第２細径部と前記第２縮径部とが対向配置されることにより、前記第２プランジャーの前記パイプ材からの脱落止め構造が構成される、
請求項１から請求項５のいずれか一項に記載のプローブピン。 The inner side surface of the pipe material has a first diameter-reduced portion whose diameter is partially reduced, and the first shaft of the first plunger is provided with a first diameter-reduced portion whose outer diameter is partially reduced. By arranging the first small diameter portion and the first reduced diameter portion so as to face each other, a structure for preventing the first plunger from falling off from the pipe material is formed.
The inner side surface of the pipe material has a second diameter-reduced portion whose diameter is partially reduced, and the second shaft of the second plunger is provided with a second diameter portion whose outer diameter is partially reduced. By arranging the second small diameter portion and the second reduced diameter portion so as to face each other, a structure for preventing the second plunger from falling off from the pipe material is formed.
The probe pin according to any one of claims 1 to 5.
前記ハウジングの前記複数の貫通孔のそれぞれの中空部に前記プローブピンは保持され、少なくとも前記中空部の内側面は導電性を有し、前記プローブピンは前記第１絶縁リングおよび前記第２絶縁リングにおいて前記ハウジングの前記貫通孔の前記中空部に接触し、前記プローブピンにおける導電性の部分は前記ハウジングと電気的に絶縁されること
を特徴とするＩＣソケット。 An IC socket comprising the probe pin according to any one of claims 1 to 8 and a housing having a plurality of through holes.
The probe pin is held in each hollow portion of the plurality of through holes of the housing, and at least the inner surface of the hollow portion is conductive, and the probe pin is the first insulating ring and the second insulating ring. The IC socket is characterized in that it comes into contact with the hollow portion of the through hole of the housing and the conductive portion of the probe pin is electrically insulated from the housing.
前記第１プランジャーの前記第１接触部は通過可能であるが前記第１絶縁リングは通過不能に部分的に閉塞された第１部分閉塞開口を一方の端部に有し、
前記第２プランジャーの前記第２接触部は通過可能であるが前記第２絶縁リングは通過不能に部分的に閉塞された第２部分閉塞開口を他方の端部に有し、前記第１部分閉塞開口と前記第２部分閉塞開口との間に前記中空部が構成される、
請求項９から請求項１１のいずれか一項に記載のＩＣソケット。 The through hole provided in the housing is
The first contact portion of the first plunger is passable, but the first insulating ring has a first partially closed opening at one end that is partially closed so that it cannot pass through.
The second part of the second plunger is passable, but the second insulating ring has a second partially closed opening at the other end that is partially closed so that it cannot pass through. The hollow portion is formed between the closed opening and the second partial closed opening.
The IC socket according to any one of claims 9 to 11.
Any one of claims 9 to 12, wherein the through hole has a counterbore portion capable of accommodating at least a part of the first contact portion of the first plunger in the first partial closing opening. IC socket described in.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019050630A JP2020153723A (en) | 2019-03-19 | 2019-03-19 | Probe pin and IC socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019050630A JP2020153723A (en) | 2019-03-19 | 2019-03-19 | Probe pin and IC socket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2020153723A true JP2020153723A (en) | 2020-09-24 |
Family
ID=72558592
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019050630A Pending JP2020153723A (en) | 2019-03-19 | 2019-03-19 | Probe pin and IC socket |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2020153723A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021049237A1 (en) * | 2019-09-12 | 2021-03-18 | 山一電機株式会社 | Contact probe and inspection socket comprising same |
| US20220155343A1 (en) * | 2020-11-17 | 2022-05-19 | Yamaichi Electronics Co., Ltd | Socket for inspection |
| KR20230118646A (en) | 2021-01-19 | 2023-08-11 | 닛폰 하츠죠 가부시키가이샤 | probe unit |
-
2019
- 2019-03-19 JP JP2019050630A patent/JP2020153723A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021049237A1 (en) * | 2019-09-12 | 2021-03-18 | 山一電機株式会社 | Contact probe and inspection socket comprising same |
| JP2021043100A (en) * | 2019-09-12 | 2021-03-18 | 山一電機株式会社 | Contact probe and socket for inspection equipped therewith |
| US20220155343A1 (en) * | 2020-11-17 | 2022-05-19 | Yamaichi Electronics Co., Ltd | Socket for inspection |
| US11821915B2 (en) * | 2020-11-17 | 2023-11-21 | Yamaichi Electronics Co., Ltd. | Socket for inspection |
| KR20230118646A (en) | 2021-01-19 | 2023-08-11 | 닛폰 하츠죠 가부시키가이샤 | probe unit |
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