JP2020153548A - Laminate and manufacturing method for laminate - Google Patents

Abstract

To improve reliability of connecting metal components to suppress increase in manufacturing costs.SOLUTION: A laminate according to one embodiment of the present invention is a laminate formed by laminating n sheets of heat transfer plates by solid phase bonding. The laminate is provided with through holes penetrating in a lamination direction in each of m sheets of heat transfer plates from the uppermost heat transfer plate to an m-th (m<n) heat transfer plate. The through holes formed in each of the m sheets of heat transfer plates communicate with each other in the lamination direction to form a hole into which a pipe is inserted. The inner diameter of the through hole formed in the uppermost heat transfer plate is larger than the inner diameter of the through hole formed in the heat transfer plate other than the uppermost heat transfer plate.SELECTED DRAWING: Figure 1

Description

The present invention relates to a laminate and a method for producing a laminate.

It is a control board that processes the output signals of the heat exchanger body, which is formed by stacking heat transfer plates with flow paths formed in the heat exchanger, and the temperature sensor attached to the heat exchanger body. Some are provided with a printed substrate (see, for example, Patent Document 1).

In such a heat exchanger, as the main body of the heat exchanger, a laminated body in which a plurality of heat transfer plates are laminated and each of them is solid-phase bonded is used. When bonding multiple heat transfer plates in a solid phase, a pressure jig is generally used to apply pressure to the multiple heat transfer plates in the stacking direction in a high-temperature vacuum or an inert gas atmosphere. Will be done.

After the plurality of heat transfer plates are solid-phase bonded to form a laminated body, the laminated body is removed from the pressure jig. At this time, a mold release agent may be interposed between the heat transfer plate in contact with the pressure jig of the laminated body and the pressure jig to make it easier to remove the heat transfer plate from the pressure jig.

Japanese Unexamined Patent Publication No. 2017-053542

However, during solid phase bonding, the release agent is also pressed against the laminate by the pressure jig. Therefore, the component of the mold release agent may remain on the contact surface of the laminate that comes into contact with the pressure jig and may adhere firmly. When the release agent layer remains on the abutting surface in this way, when joining a metal part such as a pipe to the abutting surface by brazing, a joining material (wax) for connecting the laminate and the metal part. The material) may be repelled by the release agent, reducing the reliability of joining metal parts. Further, if surface treatment such as polishing is performed in order to completely remove such a residual mold release agent from the contact surface, a large manufacturing cost is required.

In view of the above circumstances, an object of the present invention is to provide a laminated body and a method for manufacturing the laminated body, which improves the reliability of joining metal parts by brazing and suppresses an increase in manufacturing cost.

In order to achieve the above object, the laminate according to one embodiment of the present invention is a laminate formed by laminating n heat transfer plates and joining them by solid phase bonding.
The laminated body is provided with through holes penetrating in the stacking direction in each of the m heat transfer plates from the uppermost heat transfer plate to the mth (m <n) heat transfer plate.
The through holes formed in each of the m heat transfer plates communicate with each other in the stacking direction to form holes into which metal parts are inserted.
The inner diameter of the through hole formed in the uppermost heat transfer plate is larger than the inner diameter of the through hole formed in the heat transfer plate other than the uppermost heat transfer plate.

In the above laminated body, the through hole formed in the heat transfer plate of the uppermost layer has a first hole portion and a second hole portion communicating with the first hole portion, and the second hole portion. The portion is located between the first hole portion and the through hole formed in the second heat transfer plate counting from the uppermost heat transfer plate, and the inner diameter of the first hole portion is It may be formed below the inner diameter of the second hole.

In the above-mentioned laminated body, the through holes formed from the second heat transfer plate counting from the uppermost heat transfer plate to the mth heat transfer plate counting from the uppermost heat transfer plate are formed. The inner diameter of the through hole having the same inner diameter and formed in the (m + 1) th heat transfer plate counting from the uppermost heat transfer plate may be smaller than the same inner diameter.

In the above laminated body, the metal part is inserted into the hole, and the metal part and the above 2 are applied from the side surface of the metal part to the surface of the second heat transfer plate counting from the uppermost heat transfer plate. A fillet may be formed by a joining material that joins the first heat transfer plate.

In order to achieve the above object, in the method for producing a laminated body according to one embodiment of the present invention, n heat transfer plates are laminated and joined by solid phase bonding to be formed, counting from the uppermost heat transfer plate. Holes for inserting metal parts are formed in the m heat transfer plates up to the mth (m <n) heat transfer plate.
A plurality of first heat transfer plates having the same inner diameter of the first through holes are laminated so that the first through holes are concentrically located.
A second heat transfer plate having a bottom portion and having a recess having an inner diameter larger than the inner diameter of the first through hole is formed so that the recess faces the first through hole and the recess and the first through hole are formed. The second heat transfer plate is laminated on the plurality of first heat transfer plates so that the two heat transfer plates are concentrically located with each other.
Each of the plurality of first heat transfer plates and the second heat transfer plate are laminated and solid-phase bonded.
By cutting the bottom portion to form an opening, a second through hole penetrating in the stacking direction is formed in the second heat transfer plate, and the second through hole and the first through hole are formed in the stacking direction. By communicating, the holes are formed in the laminated body.

In the method for manufacturing a laminated body, when the bottom portion is cut to form an opening, the inner diameter of the first through hole is larger than the inner diameter of the recess, and the inner diameter is smaller than the inner diameter of the recess and is concentric with the first through hole. The target region of the bottom may be removed.

In the method for producing a laminate, when the laminate is formed by solid phase bonding, a pressure jig for pressurizing each of the n heat transfer plates in the lamination direction is prepared, and the pressurization is performed. A mold release agent for removing the laminate from the pressure jig is interposed between the jig and the heat transfer plate in contact with the pressure jig after the solid phase bonding, and the bottom is cut to open an opening. By forming, the mold release agent adhering to the region portion may be removed.

As described above, according to the present invention, there is provided a laminated body and a method for manufacturing a laminated body, which improves the reliability of joining metal parts by brazing and suppresses an increase in manufacturing cost.

FIG. (A) is a schematic perspective view showing a part of the laminated body of the present embodiment. FIG. (B) is a schematic cross-sectional view showing a cross section along A1-A2 in FIG. (A). It is a schematic cross-sectional view which shows the appearance that the pipe is joined to the laminated body of this embodiment. It is a schematic cross-sectional view which shows the manufacturing process in which the laminated body of this embodiment is formed. It is a schematic cross-sectional view which shows the manufacturing process in which the laminated body of this embodiment is formed. It is a schematic perspective view which shows the application example of the laminated body of this embodiment. It is a schematic perspective view which shows the application example of the laminated body of this embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. XYZ axis coordinates may be introduced in each drawing. Further, the same member or a member having the same function may be designated by the same reference numeral, and the description may be omitted as appropriate after the description of the member.

[Laminate]

FIG. 1A is a schematic perspective view showing a part of the laminated body of the present embodiment. FIG. 1B is a schematic cross-sectional view showing a cross section along A1-A2 in FIG. 1A. That is, the cross section of FIG. 1B depicts the cross section of the laminated body 200 viewed from a direction perpendicular to the Z-axis direction.

The laminated body 200 shown in FIG. 1A is a laminated body formed by laminating n heat transfer plates 202 and joining them by solid-phase bonding. FIG. 1A illustrates a corner portion of the laminated body 200. The laminated body 200 has a rectangular parallelepiped shape, and has an upper surface 201u, a lower surface 201d, and a side surface 201w connected to the upper surface 201u and the lower surface 201d. The laminated body 200 is provided with holes 51 having a predetermined depth from the upper surface 201u to the lower surface 201d. When the laminated body 200 is viewed from the top in the stacking direction Z, the outer shape of the hole 51 is, for example, a circular shape.

Each of the n heat transfer plates 202 is a metal plate having high thermal conductivity. Each of the n heat transfer plates 202 is the same type of metal. In the present embodiment, the material of the heat transfer plate 202 will be described as the same type of metal, but different types of metals may be used in combination. Further, these metals are, for example, stainless steel, aluminum, copper and the like.

As shown in FIG. 1B, the heat transfer plate 202a arranged in the uppermost layer of the laminated body 200 is formed with a through hole 510 penetrating in the stacking direction Z. A through hole 511 penetrating in the stacking direction Z is formed in each of the plurality of heat transfer plates 202b located below the heat transfer plate 202a in the uppermost layer. Through holes 512 penetrating in the stacking direction Z are formed in the plurality of heat transfer plates 202c located below the plurality of heat transfer plates 202b.

Through holes 520 penetrating in the stacking direction Z are formed in the plurality of heat transfer plates 202d located below the heat transfer plates 202c. The plurality of heat transfer plates 202e located below the plurality of heat transfer plates 202d are not formed with through holes directly below the holes 51.

Here, assuming that the heat transfer plates 202a to 202e are collectively referred to as the heat transfer plate 202 and the through holes 510 to 512 are collectively referred to as the through holes 500, the laminated body 200 has m sheets counting from the uppermost heat transfer plate 202. Each of the m heat transfer plates 202 up to the heat transfer plate 202 of the eyes (m <n) is provided with through holes 500 communicating with each other in the stacking direction Z.

That is, the through holes 500 formed in each of the m heat transfer plates 202 communicate with each other in the stacking direction, so that the laminated body 200 is formed with holes 51 into which pipes (described later), which are metal parts, are inserted. ing.

In the laminated body 200, the inner diameters (inner diameters R1 and R2) of the through holes 510 formed in the uppermost heat transfer plate 202a are the penetrations formed in the heat transfer plates 202b and 202c other than the uppermost heat transfer plate 202a. It is formed larger than the inner diameters (inner diameters R3 and R4) of the holes 511 and 512.

In the laminated body 200, a step is formed on the inner wall of the heat transfer plate 202a of the uppermost layer. For example, the through hole 510 formed in the heat transfer plate 202a has a first hole portion 510a and a second hole portion 510b. The first hole portion 510a and the second hole portion 510b communicate with each other in the stacking direction Z. The second hole portion 510b is located between the first hole portion 510a and the second heat transfer plate 202b in the stacking direction Z. The inner diameter R1 of the first hole 510a is formed to be equal to or less than the inner diameter R2 of the second hole 510b.

In the laminated body 200, a plurality of heat transfer plates 202b formed from the second heat transfer plate 202b counting from the uppermost heat transfer plate 202a to the mth heat transfer plate 202b counting from the uppermost heat transfer plate 202a. Each of the through holes 511 of the above has the same inner diameter R3. The inner diameter R4 of the through hole 512 formed in the (m + 1) th heat transfer plate 202c counted from the uppermost heat transfer plate 202a is formed to be smaller than the inner diameter R3.

The holes 51 communicate with the flow path 20 provided inside the laminated body 200. The flow path 20 is formed, for example, by having through holes 520 formed in a plurality of heat transfer plates 202d communicating with each other in the stacking direction Z.

FIG. 2 is a schematic cross-sectional view showing a state in which a pipe is attached to the laminated body of the present embodiment. The cross section shown in FIG. 2 is a cross section (A1-A2 cross section) viewed from the same direction as the cross section shown in FIG. 1 (b).

The pipe 5 is inserted into the hole 51 of the laminated body 200. From the side surface 5w of the pipe 5 to the surface 202s of the second heat transfer plate 202b, a fillet 6f is formed by a joining material (brazing material) 6 that joins the pipe 5 and the heat transfer plate 202b. The surface of the fillet 6f is formed in a slope shape, and spreads wet from the side surface 5w of the pipe 5 to the surface 202s of the heat transfer plate 202b. The bonding material 6 is, for example, a nickel brazing material.

The outer diameter R5 of the pipe 5 is formed to be smaller than the inner diameter R3. Therefore, a gap is formed between the pipe 5 and the hole 51, and the bonding material 6 flows into this gap due to the capillary phenomenon. The pipe 5 and the through hole 511 may have a so-called "tightening fit", and in that case, the outer diameter R5 may be the same as or larger than the inner diameter R3.

[Manufacturing method of laminate]

3 (a) to 4 (b) are schematic cross-sectional views showing a manufacturing process in which the laminate of the present embodiment is formed. The cross section shown in FIGS. 3A to 4B is a cross section (A1-A2 cross section) viewed from the same direction as the cross section shown in FIG. 1B.

As shown in FIG. 3A, n heat transfer plates 202 are laminated in advance in the stacking direction Z. For example, a plurality of heat transfer plates 202d are laminated on the plurality of heat transfer plates 202e, and the heat transfer plates 202c are laminated on the plurality of heat transfer plates 202d. Further, a plurality of heat transfer plates 202b are laminated on the heat transfer plate 202c, and the heat transfer plates 202a are laminated on the plurality of heat transfer plates 202b.

In this lamination, the heat transfer plate 202c and the heat transfer plate 202b (first heat transfer plate) are aligned so that the through hole 512 and the through hole 511 (first through hole) are concentrically located. .. In the plurality of heat transfer plates 202b, the alignment is performed so that the through holes 511 are concentrically located.

A recess 510b having an inner diameter R1 larger than the inner diameter R3 is formed in advance on the uppermost heat transfer plate 202a (second heat transfer plate). The recess 510b has a bottom 510ab, which will be described later. The outer diameter and depth of the recess 510b are the same as the outer diameter and depth of the second hole 510b. Therefore, in the present embodiment, the concave portion and the second hole portion are designated by the reference numeral "510b". The recess 510b is formed by any method such as etching processing, laser processing, precision press processing, cutting processing, and 3D printer processing.

When the heat transfer plates 202a are laminated on the plurality of heat transfer plates 202b, the heat transfer plates are arranged so that the recess 510b faces the through hole 511 and the recess 510b and the through hole 511 are concentrically located. The alignment between the 202a and the heat transfer plate 202b is performed.

Next, by pressurizing and heating the n heat transfer plates 202 in a vacuum or in an atmosphere of an inert gas, each of the n heat transfer plates 202 is solid-phase bonded to each other in the stacking direction Z. Here, solid-state bonding means, for example, diffusion bonding. The method of solid-phase bonding is not limited to diffusion bonding, and may be, for example, hot pressing or cold pressing.

When the laminated body 200 is formed by solid-phase bonding, pressure jigs 601 and 602 that pressurize each of the n heat transfer plates 202 in the stacking direction Z are used. For example, the pressure jigs 601 and 602 sandwich the n heat transfer plates 202 from the vertical direction in the stacking direction Z, and the pressure jigs 601 and 602 pressurize the n heat transfer plates 202 in the stacking direction Z. ..

At this time, between the pressure jigs 601 and 602 and the heat transfer plate 202 (heat transfer plate 202 located on the outermost side of the laminate 200) forming each of the upper surface 201u and the lower surface 201d of the laminate 200, A mold release agent 610 is interposed to facilitate the removal of the laminated body 200 bonded after the solid phase bonding from the pressure jigs 601 and 602. The presence of the release agent 610 makes it easier to remove the laminated body 200 joined after the solid phase bonding from the pressure jigs 601 and 602 as compared with the case where the release agent 610 is not present.

FIG. 3B shows the state of the laminated body 200 after solid-phase bonding. As shown in FIG. 3B, each of the heat transfer plate 202a, the plurality of heat transfer plates 202b, the heat transfer plate 202c, the plurality of heat transfer plates 202d, and the plurality of heat transfer plates 202e, respectively. Is solid-phase bonded in the stacking direction Z to form a rectangular-shaped laminated body 200.

Here, in the stacking direction Z, the recess 510b, each of the plurality of through holes 511, the through hole 512, and each of the plurality of through holes 520 communicate with each other to form a hole 51 in the laminated body 200. .. However, at this stage, the hole 51 is closed by the bottom 510ab of the recess 510b.

Next, as shown in FIG. 4A, for example, using a cutting tool such as a hole cutter 620, the surface of the heat transfer plate 202a on the side opposite to the recess 510b, that is, the upper surface 201u to the bottom of the laminate 200. The 510ab is cut to form an opening. The hole cutter 620 has a cylindrical blade 620a and a drill 620b arranged so as to project from the blade 620a on the central axis of the blade 620a. As the hole cutter 620, one in which the outer diameter R5 of the blade 620a is equal to or less than the inner diameter R1 of the recess 510b and the inner diameter R6 of the blade 620a is larger than the inner diameter R3 of the through hole 511 is used.

Here, when the bottom portion 510ab is cut by the hole cutter 620, a region portion that is concentric with the through hole 511 and has an outer diameter larger than the inner diameter R3 of the through hole 511 and an inner diameter R1 or less is removed. After cutting the bottom portion 510ab with the hole cutter 620, as shown in FIG. 4B, the region portion 510ac forming a part of the bottom portion 510ab falls.

As a result, a through hole 510 (second through hole) penetrating in the stacking direction Z is formed in the heat transfer plate 202a, and the through hole 510 and the through hole 511 communicate with each other in the stacking direction Z. As a result, the laminated body 200 having the holes 51 on the upper surface 201u shown in FIG. 1B is formed.

After that, as shown in FIG. 2, the pipe 5 is inserted into the hole 51, and the pipe 5 is joined to the laminated body 200 by brazing using the joining material 6. The bottom 510ab may be cut to form an opening by a method such as press working or end milling instead of cutting with a hole cutter 620.

[effect]

Although the release agent 610 is cleaned after the solid phase bonding, the release agent 610 is also pressed toward the upper surface 201u and the lower surface 201d of the laminate 200 during the solid phase bonding, so that the release agent 610 is also a release agent. The 610 may remain as a contaminated layer on the upper surface 201u or the lower surface 201d.

In the present embodiment, when the holes 51 are formed in the laminated body 200, the region portion 510ac to which the contaminated layer may be attached is removed from the laminated body 200 by the cutting jig 620. Therefore, the bonding material 6 for joining the pipe 5 to the laminated body 200 is not repelled by the contaminated layer (release agent), and is directly on the metal surface (surface 202s) of the heat transfer plate 202b on which the contaminated layer is not formed. I will come in contact with you.

As a result, the bonding material 6 wets and spreads from the side surface 5w of the pipe 5 to the surface 202s of the heat transfer plate 202b in a slope shape to form a fillet 6a well, and the bonding material 6 is bonded due to the generation of voids or insufficient rotation of the bonding material 6. The defect of the attachment) is prevented, the joining material 6 is in close contact with the side surface 5w of the pipe 5 and the surface 202s of the heat transfer plate 202b, and the joining material 6 firmly joins the pipe 5 and the laminate 200. This improves the reliability of the pipe joint.

Further, since the joining member 6 is not repelled by the contaminated layer (release agent), the joining member 6 can easily enter the gap between the pipe 5 and the hole 51. As a result, the pipe 5 and the laminated body 200 are firmly joined.

Further, in the present embodiment, the contaminated layer near the portion where the pipe 5 is joined is removed by a physically simple process such as a hole cutter 620, so that the contaminated layer is completely removed from the upper surface 201u by polishing or chemical treatment. It is possible to form the laminated body 200 in which the pipe 5 is formed at a lower cost than the surface treatment.

Further, in the present embodiment, since the outer diameter of the region portion 510ac is determined by the size of the inner diameter R6 of the blade 620a of the hole cutter 620, the outer diameter of the region portion 510ac is smaller than the inner diameter R2 of the first hole portion 510a. As a result, the region portion 510ac can be easily removed from the hole 51.

For example, after cutting the bottom 510ab to form an opening, the cut bottom 510ab fits into the area 510ac in the hole cutter 620 or is caught by the drill 620b of the hole cutter to form the hole cutter 620. By pulling out from the through hole 510, the region portion 510ac is easily removed from the hole 51.

Further, in the present embodiment, since the outer diameter of the region portion 510ac is determined by the size of the inner diameter R6 of the blade 620a of the hole cutter 620, the outer diameter of the region portion 510ac is larger than the inner diameter R3 of the through hole 511. As a result, the region portion 510ac does not fall downward from the heat transfer plate 202b of the uppermost layer, but stays on the heat transfer plate 202b of the uppermost layer. As a result, the region portion 510ac, which is a chip, does not penetrate deeply into the flow path 20 formed in the laminated body 200.

[Application example of laminated body]

5 and 6 are schematic perspective views showing an application example of the laminated body of the present embodiment.

The laminate 200 to which the pipe 5 is attached is applied to the microchannel heat exchanger 1 as an example. In the microchannel heat exchanger 1, heat exchange is performed between the low temperature fluid and the high temperature fluid.

As shown in FIG. 5, the microchannel heat exchanger 1 includes a heat exchanger main body 2 in which a groove or the like for flowing a fluid is formed, a high temperature side outer shell plate 3A which is a lower outer shell plate, and an upper side. The low temperature side outer shell plate 3B which is an outer shell plate, the high temperature inlet pipe 5A for flowing in the high temperature fluid, the high temperature outlet pipe 5B for flowing out the high temperature fluid, the low temperature inlet pipe 5C for flowing in the low temperature fluid, and the low temperature fluid flow out. It is provided with a low temperature outlet pipe 5D. Further, a control board (not shown) may be attached to the microchannel heat exchanger 1.

The heat exchanger main body 2, the high temperature side outer shell plate 3A, and the low temperature side outer shell plate 3B each form a laminated body 200 integrated by solid phase bonding. FIG. 5 is an exploded perspective view of a state in which the high temperature side outer shell plate 3A and the low temperature side outer shell plate 3B are separated from the heat exchanger main body 2 in order to explain the internal structure of the microchannel heat exchanger 1. It is shown.

The heat exchanger main body 2 corresponds to a laminated body in which a plurality of the above heat transfer plates 202d are laminated. The high temperature side outer shell plate 3A corresponds to a laminated body in which a plurality of the above heat transfer plates 202e are laminated. The low temperature side outer shell plate 3B corresponds to a laminated body in which the above heat transfer plates 202a to 202c are laminated. Each of the high temperature inlet pipe 5A, the high temperature outlet pipe 5B, the low temperature inlet pipe 5C, and the low temperature outlet pipe 5D corresponds to the above pipe 5. Each of the flow paths 20A, 20B, 20C, and 20D corresponds to the above-mentioned flow path 20.

The heat transfer plate 202d forming the heat exchanger main body 2 is further divided into a high temperature heat transfer plate 202da and a low temperature heat transfer plate 202db. The heat exchanger main body 2 is formed by alternately stacking a plurality of high-temperature heat transfer plates 202da and low-temperature heat transfer plates 202db. In the example of FIG. 5, the low temperature heat transfer plate 202db is located on the uppermost layer of the heat exchanger main body 2.

In the heat exchanger main body 2, the low temperature inlet flow path 23 for flowing the low temperature fluid, the low temperature outlet flow path 24 for the low temperature fluid to flow out, the high temperature inlet flow path 21 for flowing the high temperature fluid, and the high temperature fluid flow out. A high temperature outlet flow path 22 is formed. Each of the low temperature inlet flow path 23, the low temperature outlet flow path 24, the high temperature inlet flow path 21, and the high temperature outlet flow path 22 penetrates in the Z-axis direction in the heat exchanger main body 2.

The low-temperature heat transfer plate 202db is provided with grooves 23B, 24B, and 25B that form a flow path for the low-temperature fluid. The grooves 23B, 24B, 25B are formed only on one surface of the low temperature heat transfer plate 202db, for example, by half etching. A plurality of grooves 25B are provided, and the low temperature inlet flow path 23 and the low temperature outlet flow path 24 communicate with each other through the plurality of grooves 25B.

The low temperature inlet flow path 23 communicates with the low temperature inlet pipe 5C via the groove 23B and the flow path 20C. An external pipe (not shown) for flowing a low temperature fluid is detachably connected to the low temperature inlet pipe 5C. The low temperature outlet flow path 24 communicates with the low temperature outlet pipe 5D via the groove 24B and the flow path 20D. An external pipe (not shown) through which the low temperature fluid flows out is detachably connected to the low temperature outlet pipe 5D.

As a result, the low temperature fluid flowing in from the low temperature inlet pipe 5C flows in the order of the flow path 20C, the groove 23B, the low temperature inlet flow path 23, the groove 25B, the low temperature outlet flow path 24, the groove 24B, and the flow path 20D, and the low temperature outlet pipe 5D. Outflow from.

On the other hand, FIG. 6 shows a state of a groove or the like formed in the high temperature heat transfer plate 202da by removing the uppermost low temperature heat transfer plate 202db from the heat exchanger main body 2. In FIG. 6, the high temperature side outer shell plate 3A is not shown.

The high-temperature heat transfer plate 202da is provided with grooves 23A, 24A, 25A, 26A, and 27A that form a flow path for the high-temperature fluid. The grooves 23A, 24A, 25A, 26A, 27A are formed only on one surface of the high temperature heat transfer plate 202da, for example, by half etching. A plurality of grooves 25A are provided, and the groove 26A and the groove 27A communicate with each other via the plurality of grooves 25A. The groove 26A communicates with the high temperature inlet flow path 21, and the groove 27A communicates with the high temperature outlet flow path 22.

The high temperature inlet flow path 21 communicates with the high temperature inlet pipe 5A via the groove 23A and the flow path 20A. An external pipe (not shown) for flowing a high temperature fluid is detachably connected to the high temperature inlet pipe 5A. The high temperature outlet flow path 22 communicates with the high temperature outlet pipe 5B via the groove 24A and the flow path 20B. An external pipe (not shown) through which a high-temperature fluid flows out is detachably connected to the high-temperature outlet pipe 5B.

As a result, the high-temperature fluid flowing in from the high-temperature inlet pipe 5A flows in the order of the flow path 20A, the groove 23A, the high-temperature inlet flow path 21, the groove 26A, the groove 25A, the groove 27A, the high-temperature outlet flow path 22, the groove 24A, and the flow path 20B. It flows and flows out from the high temperature outlet pipe 5B. The microchannel heat exchanger 1 described above is a parallel flow type in which a low-temperature fluid and a high-temperature fluid flow in the same direction. However, as an application example of the laminate of the present invention, the low-temperature fluid and the high-temperature fluid flow in opposition to each other. It can be applied to various types of microchannel heat exchangers, such as a countercurrent type and a orthogonal flow type in which a low-temperature fluid and a high-temperature fluid flow orthogonally.

According to such a microchannel heat exchanger 1, the bonding material 6 wets and spreads from the side surface 5w of the pipe 5 to the surface 202s of the heat transfer plate 202b in a slope shape to form the fillet 6a well, and voids are generated. Defects in joining (brazing) due to insufficient rotation of the joining material 6 are prevented, the joining material 6 adheres to the side surface 5w of the pipe 5 and the surface 202s of the heat transfer plate 202b, and is firmly joined to the pipe 5 by the joining material 6. Since the laminated body 200 is realized, the reliability of joining each of the high temperature inlet pipe 5A, the high temperature outlet pipe 5B, the low temperature inlet pipe 5C, and the low temperature outlet pipe 5D is improved, and further, the microchannel heat exchanger 1 is manufactured. The increase in cost is suppressed.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and it goes without saying that various modifications can be made. Each embodiment is not limited to an independent form and can be combined as technically possible as possible.

1 ... Micro flow path heat exchanger 2 ... Heat exchanger body 3A ... High temperature side outer shell plate 3B ... Low temperature side outer shell plate 5 ... Pipe 5A ... High temperature inlet pipe 5B ... High temperature outlet pipe 5C ... Low temperature inlet pipe 5D ... Low temperature outlet Tube 5w ... Side surface 6 ... Joining member 6a ... Fillet 20, 20A, 20B, 20C, 20D ... Flow path 21 ... High temperature inlet flow path 22 ... High temperature outlet flow path 23 ... Low temperature inlet flow path 24 ... Low temperature outlet flow path 23A, 24A , 25A, 26A, 27A, 23B, 24B, 25B ... Groove 51 ... Hole 200 ... Laminated body 201d ... Bottom surface 201u ... Top surface 201w ... Side surface 202, 202a, 202b, 202c, 202d, 202e ... Heat transfer plate 202da ... High temperature heat transfer Plate 202db ... Low temperature heat transfer plate 202s ... Surface 500, 510, 511, 512, 520 ... Through hole 510a ... First hole 510b ... Second hole (recess)
510ab ... Bottom 510ac ... Area 601 ... Pressurized jig 610 ... Release agent 620 ... Hole cutter 620a ... Blade 620b ... Drill

Claims (7)

In a laminated body formed by laminating n heat transfer plates and joining them by solid phase bonding,
The laminated body is provided with through holes penetrating in the stacking direction in each of the m heat transfer plates from the uppermost heat transfer plate to the mth (m <n) heat transfer plate.
The through holes formed in each of the m heat transfer plates communicate with each other in the stacking direction to form holes into which metal parts are inserted.
A laminate in which the inner diameter of the through hole formed in the uppermost heat transfer plate is larger than the inner diameter of the through hole formed in a heat transfer plate other than the uppermost heat transfer plate. The laminated body according to claim 1.
The through hole formed in the heat transfer plate of the uppermost layer is
The first hole and
It has a second hole that communicates with the first hole.
The second hole portion is located between the first hole portion and the through hole formed in the second heat transfer plate counting from the uppermost heat transfer plate.
The inner diameter of the first hole is equal to or less than the inner diameter of the second hole. The laminated body according to claim 2.
The through holes formed from the second heat transfer plate counting from the uppermost heat transfer plate to the mth heat transfer plate counting from the uppermost heat transfer plate have the same inner diameter.
A laminated body in which the inner diameter of the through hole formed in the (m + 1) th heat transfer plate counting from the uppermost heat transfer plate is smaller than the same inner diameter. The laminated body according to claim 2 or 3.
The metal part is inserted into the hole,
From the side surface of the metal part to the surface of the second heat transfer plate counting from the uppermost heat transfer plate, a fillet made of a joining material for joining the metal part and the second heat transfer plate is formed. Laminated body. n heat transfer plates are laminated and joined by solid-phase bonding to form m heat transfer plates from the top layer heat transfer plate to the mth (m <n) heat transfer plate. In the method for manufacturing a laminate in which holes for inserting metal parts are formed,
A plurality of first heat transfer plates having the same inner diameter of the first through holes are laminated so that the first through holes are concentrically located.
A second heat transfer plate having a bottom portion and having a recess having an inner diameter larger than the inner diameter of the first through hole is formed so that the recess faces the first through hole and the recess and the first through hole are formed. The second heat transfer plate is laminated on the plurality of first heat transfer plates so that the two heat transfer plates are concentrically located.
Each of the plurality of first heat transfer plates and the second heat transfer plate are laminated and solid-phase bonded.
By cutting the bottom portion to form an opening, a second through hole penetrating the second heat transfer plate in the stacking direction is formed, and the second through hole and the first through hole are formed in the stacking direction. A method for producing a laminated body in which the holes are formed in the laminated body by communicating with each other. The method for producing a laminate according to claim 5.
When the bottom portion is cut to form an opening, a laminate that is larger than the inner diameter of the first through hole, is equal to or less than the inner diameter of the recess, and is concentric with the first through hole is removed. How to make a body. The method for producing a laminate according to claim 6.
When forming the laminated body by solid-phase bonding, a pressure jig for pressurizing each of the n heat transfer plates in the laminated direction is prepared.
A mold release agent for easily removing the laminate from the pressure jig is interposed between the pressure jig and the heat transfer plate in contact with the pressure jig after the solid phase bonding.
A method for producing a laminated body, which removes the mold release agent adhering to the region portion by cutting the bottom portion to form an opening.

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