JP2020152097A - Resin film manufacturing apparatus and resin film manufacturing method - Google Patents

Abstract

To provide an excellent manufacturing apparatus of a resin film.SOLUTION: One embodiment of a resin film manufacturing apparatus of the present invention determines, for each heat bolt 23, based on a control deviation calculated from a thickness distribution of a resin film 83 gained from a thickness sensor 60, a present state st and a reward rw for a previously selected action ac. Then, a control condition which is a combination of the state st and the action ac is renewed based on the reward rw, and an optimal action ac corresponding to the present state st is selected from the renewed control condition. Then, a heater 24 is controlled based on the optimal action ac.SELECTED DRAWING: Figure 4

Description

The present invention relates to a resin film manufacturing apparatus and a resin film manufacturing method.

A resin film manufacturing apparatus is known that extrudes a film-like molten resin from a gap between lips of a die connected to an extruder. In such a resin film manufacturing apparatus, it is required to make the thickness uniform in the width direction of the resin film.

Therefore, the dies disclosed in Patent Documents 1 to 3 are provided with a plurality of heat bolts arranged along the longitudinal direction of the lip (the width direction of the resin film). The amount of thermal expansion of each heat bolt by the heater can be individually controlled, and the die lip spacing can be adjusted locally.
Further, Patent Document 4 discloses a resin film manufacturing apparatus capable of measuring the thickness of a resin film during manufacturing and feedback-controlling the lip interval of a die.

JP-A-2010-167584 Japanese Unexamined Patent Publication No. 2012-240332 Japanese Unexamined Patent Publication No. 2013-052574 Japanese Unexamined Patent Publication No. 2013-039677

The inventor has found various problems in developing a resin film manufacturing apparatus having a die having a plurality of heat bolts and capable of feedback control of lip spacing.
Other issues and novel features will become apparent from the description and accompanying drawings herein.

In the resin film manufacturing apparatus according to one embodiment, the current state and the reward for the previously selected action are determined for each heat bolt based on the control deviation calculated from the thickness distribution of the resin film acquired from the thickness sensor. To do. Then, the control condition, which is a combination of the state and the action, is updated based on the reward, and the optimum action corresponding to the current state is selected from the updated control condition. Then, the heater is controlled based on the optimum behavior.

According to the above-described embodiment, it is possible to provide an excellent resin film manufacturing apparatus.

It is a schematic cross-sectional view which shows the whole structure of the resin film manufacturing apparatus and the resin film manufacturing method which concerns on Embodiment 1. FIG. It is sectional drawing of T die 20. It is a partial perspective view of the lower side (lip side) of the T die 20. It is a block diagram which shows the structure of the control part 70 which concerns on Embodiment 1. FIG. It is a flowchart which shows the control method of the lip interval in the resin film manufacturing method which concerns on Embodiment 1. FIG. It is a block diagram which shows the structure of the control part 70 which concerns on Embodiment 2. FIG.

Hereinafter, specific embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following embodiments. Moreover, in order to clarify the explanation, the following description and drawings are simplified as appropriate.

(Embodiment 1)
<Overall configuration of resin film manufacturing equipment>
First, with reference to FIG. 1, the overall configuration of the resin film manufacturing apparatus and the resin film manufacturing method according to the first embodiment will be described. FIG. 1 is a schematic cross-sectional view showing the overall configuration of the resin film manufacturing apparatus and the resin film manufacturing method according to the first embodiment.

As a matter of course, the right-handed xyz orthogonal coordinates shown in FIG. 1 and other drawings are for convenience to explain the positional relationship of the components. Usually, the z-axis positive direction is vertically upward, and the xy plane is a horizontal plane, which is common between drawings.
Further, in the present specification, the resin film includes a resin sheet.

As shown in FIG. 1, the resin film manufacturing apparatus according to the first embodiment includes an extruder 10, a T die 20, a cooling roll 30, a transport roll group 40, a winder 50, a thickness sensor 60, and a control unit 70. ing. The resin film manufacturing apparatus according to the first embodiment is an extrusion-molded type resin film manufacturing apparatus that extrudes a film-like molten resin 82a from a gap between lips of a T-die 20 connected to an extruder 10.

The extruder 10 is, for example, a screw type extruder. In the extruder 10 illustrated in FIG. 1, a screw 12 extending in the x-axis direction is housed inside a cylinder 11 extending in the x-axis direction. A hopper 13 for charging the resin pellet 81, which is the raw material of the resin film 83, is provided on the upper side of the x-axis negative side end of the cylinder 11.

The resin pellet 81 supplied from the hopper 13 is extruded from the root to the tip of the rotating screw 12, that is, in the positive x-axis direction. The resin pellet 81 is compressed by the screw 12 that rotates inside the cylinder 11 and changes into the molten resin 82.
Although not shown, a motor is connected to the screw 12 as a drive source, for example, via a speed reducer.

As shown in FIG. 1, the T-die 20 is connected to the lower side of the tip end portion (x-axis positive direction side end portion) of the extruder 10. The film-shaped molten resin 82a is extruded downward (negative direction on the z-axis) from the gap between the lips located at the lower end of the T-die 20. Here, the lip spacing of the T-die 20 is adjustable. As will be described in detail later, the T-die 20 is formed at a plurality of locations along the longitudinal direction (y-axis direction) of the lip so that the thickness of the manufactured resin film 83 in the width direction (y-axis direction) becomes uniform. The lip spacing is adjustable.

The cooling roll 30 cools the film-shaped molten resin 82a extruded from the T-die 20 and carries out the resin film 83 in which the film-shaped molten resin 82a is solidified. The resin film 83 carried out from the cooling roll 30 is conveyed via the conveying roll group 40 and is taken up by the winding machine 50. In the example of FIG. 1, the transport roll group 40 includes eight transport rolls 41 to 48. The number and arrangement of transport rolls are appropriately determined.

The thickness sensor 60 is, for example, a non-contact type thickness sensor, and measures the thickness distribution in the width direction of the resin film 83 being carried out from the cooling roll 30. In the example of FIG. 1, the thickness sensor 60 is arranged so as to sandwich the resin film 83 horizontally transported between the transport rolls 44 and 45 from above and below. Since the thickness sensor 60 is a non-contact type, it can be scanned in the width direction (y-axis direction) of the resin film 83. Therefore, the thickness distribution of the resin film 83 in the width direction can be measured by the compact thickness sensor 60. Further, since the resin film 83 is horizontally conveyed, the thickness distribution can be measured accurately even if the thickness sensor 60 is scanned.

The control unit 70 feedback-controls the lip interval of the T-die 20 based on the thickness distribution of the resin film 83 acquired from the thickness sensor 60. More specifically, the control unit 70 controls the lip spacing of the T-die 20 so that the thickness becomes uniform in the width direction of the resin film 83. A more detailed configuration and operation of the control unit 70 will be described later.

<Structure of T-die 20>
Here, the configuration of the T-die 20 will be described in more detail with reference to FIGS. 2 and 3. FIG. 2 is a cross-sectional view of the T-die 20. Further, FIG. 3 is a partial perspective view of the lower side (lip side) of the T-die 20.

As shown in FIGS. 2 and 3, the T-die 20 is composed of a pair of abutted die blocks 21 and 22. Each of the pair of abutted die blocks 21 and 22 is provided with a tapered portion that is inclined downward from the outer surface toward the inner side surface (butting surface). That is, thin lips 21a and 22a are provided at the lower ends of the abutting surfaces of the die blocks 21 and 22.

An introduction port 20a, a manifold 20b, and a slit 20c are formed on the abutting surfaces of the pair of die blocks 21 and 22. The introduction port 20a extends downward (z-axis negative direction) from the upper surface of the T-die 20. The manifold 20b extends from the lower end of the introduction port 20a in the positive direction on the y-axis and the negative direction on the y-axis. As described above, in the T die 20, the introduction port 20a and the manifold 20b are formed in a T shape.

Further, a slit 20c extending from the bottom surface of the manifold 20b to the bottom surface of the T die 20 extends in the y-axis direction. The molten resin 82 is pushed downward from the slit 20c (that is, the gap between the lips 21a and 22a) through the introduction port 20a and the manifold 20b.

Here, the lip 21a is a fixed lip that does not move, while the lip 22a is a movable lip connected to the heat bolt 23. The lip 22a is formed with a notch groove 22b diagonally upward from the outer surface toward the abutting surface. The lip 22a is pushed and pulled by the heat bolt 23 and can move with the bottom of the notch groove 22b as a fulcrum. As described above, since only the lip 22a is a movable lip, the lip spacing can be easily adjusted by a simple configuration.

The heat bolt 23 extends obliquely upward along the tapered portion of the die block 22. The heat bolt 23 is supported by holders 25a and 25b fixed to the die block 22. More specifically, the heat bolt 23 is screwed into a screw hole formed in the holder 25a. The tightening amount of the heat bolt 23 can be adjusted as appropriate. On the other hand, the heat bolt 23 is inserted into the through hole formed in the holder 25b, but is not fixed to the holder 25b. The holders 25a and 25b may be formed integrally with the die block 22 instead of being separate from the die block 22.

Here, as shown in FIG. 3, a plurality of heat bolts 23 are arranged along the longitudinal direction (y-axis direction) of the lips 21a and 22a. The longitudinal direction of the lips 21a and 22a corresponds to the width direction of the resin film. In the example of FIG. 3, three heat bolts 23 are schematically provided, but usually more heat bolts 23 are provided.

A heater 24 is provided for each heat bolt 23 to heat the heat bolt 23. In the example shown in FIGS. 2 and 3, a heater 24 is provided between the holders 25a and 25b so as to cover the outer peripheral surface of each heat bolt 23. By tightening the heat bolt 23, the lip 22a can be pushed by the lower end surface of the heat bolt 23. Further, the lower end portion of the heat bolt 23 is connected to the lip 22a by a connecting member 26 having a U-shaped cross section fixed to the lip 22a. Therefore, by loosening the heat bolt 23, the lip 22a can be pulled via the connecting member 26.

The distance between the lips 21a and 22a can be adjusted by the tightening amount of the heat bolt 23. Specifically, when the tightening amount of the heat bolt 23 is increased, the heat bolt 23 pushes the lip 22a, and the distance between the lips 21a and 22a becomes narrower. On the contrary, when the tightening amount of the heat bolt 23 is reduced, the distance between the lips 21a and 22a becomes wider. The tightening amount of the heat bolt 23 is adjusted manually, for example.

Further, the distance between the lips 21a and 22a can be finely adjusted by the amount of thermal expansion of the heat bolt 23 by the heater 24. Specifically, when the heating temperature of the heater 24 is raised, the amount of thermal expansion of the heat bolt 23 increases, so that the heat bolt 23 pushes the lip 22a and the distance between the lips 21a and 22a becomes narrower. On the contrary, when the heating temperature of the heater 24 is lowered, the amount of thermal expansion of the heat bolt 23 is reduced, so that the distance between the lips 21a and 22a is widened. The amount of thermal expansion of each heat bolt 23, that is, the heating of each heater 24 is controlled by the control unit 70.

<Structure of control unit 70 according to comparative example>
The resin film manufacturing apparatus according to the comparative example has the same overall configuration as the resin film manufacturing apparatus according to the first embodiment shown in FIG. In the comparative example, the control unit 70 uses PID control to feedback-control the heater 24 of each heat bolt 23 based on the thickness distribution of the resin film 83 acquired from the thickness sensor 60. In the case of PID control, it is necessary to adjust the parameters every time the process conditions are changed. Usually, since the operator adjusts the parameters by trial and error, there is a problem that a large amount of time and a resin material are required for the parameter adjustment.

<Structure of Control Unit 70 According to Embodiment 1>
Next, the configuration of the control unit 70 according to the first embodiment will be described in more detail with reference to FIG. FIG. 4 is a block diagram showing a configuration of the control unit 70 according to the first embodiment. As shown in FIG. 4, the control unit 70 according to the first embodiment includes a state observation unit 71, a control condition learning unit 72, a storage unit 73, and a control signal output unit 74.

Each functional block constituting the control unit 70 can be composed of a CPU (Central Processing Unit), a memory, and other circuits in terms of hardware, and a program loaded in the memory in terms of software. Can be realized by. Therefore, each functional block can be realized in various forms by computer hardware and software or a combination thereof.

The state observation unit 71 calculates the control deviation for each heat bolt 23 from the measured value pv of the thickness distribution of the resin film 83 acquired from the thickness sensor 60. The control deviation is the difference between the target value and the measured value pv. Here, the target value is the average value of the measured values pv of the thickness distribution of the resin film 83 measured by the thickness sensor 60 in all the heat bolts 23.
When calculating the average value of the measured values pv, the measured values at both ends of the resin film 83 that is not used as a product may be excluded.

On the other hand, the measured value pv of each heat bolt 23 is determined from the thickness measured value pv at the measurement point assigned to each heat bolt 23. For example, the measured value pv of each heat bolt 23 is an average value of the thickness measured values pv at the measurement points assigned to each heat bolt 23. Alternatively, at the measurement points assigned to each heat bolt 23, the thickness measurement value pv having the maximum difference from the target value may be set as the measurement value pv of each heat bolt 23.

Then, the state observation unit 71 determines, for each heat bolt 23, the current state st and the reward rw for the previously selected action ac (for example, the previous time) based on the calculated control deviation.
The state st is preset to divide the infinitely possible control deviation values into a finite number. As a simple example for explanation, when the control deviation is err, -0.9 μm ≤ err <-0.6 μm is the state st1, and -0.6 μm ≤ err <-0.3 μm is the state st2, −0. 3 μm ≦ err <0.3 μm is set as state st3, 0.3 μm ≦ err <0.6 μm is set as state st4, 0.6 μm ≦ err ≦ 0.9 μm is set as state st5, and the like. In reality, a large number of more subdivided states st are often set.

The reward rw is an index for evaluating the action ac selected in the previous state st.
Specifically, if the calculated absolute value of the current control deviation is smaller than the absolute value of the previous control deviation, the state observation unit 71 determines that the previously selected action ac is appropriate. For example, let the reward rw be a positive value. In other words, the reward rw is determined so that the previously selected action ac can be easily selected again in the same state st as before.

On the contrary, if the calculated absolute value of the current control deviation is larger than the absolute value of the previous control deviation, the state observation unit 71 determines that the previously selected action ac is inappropriate. For example, the reward rw is a negative value. In other words, the reward rw is determined so that the previously selected action ac is less likely to be selected again in the same state st as before.
A specific example of the reward rw will be described later. Further, the value of the reward rw can be appropriately determined. For example, the value of the reward rn may always be a positive value, and the value of the reward rn may always be a negative value.

The control condition learning unit 72 performs reinforcement learning for each heat bolt 23. Specifically, the control condition learning unit 72 updates the control condition (learning result) based on the reward rw, and selects the optimum action ac corresponding to the current state st from the updated control condition. The control condition is a combination of the state st and the action ac. Table 1 shows simple control conditions (learning results) corresponding to the above-mentioned states st1 to st5. In the example of FIG. 4, the control condition learning unit 72 stores the updated control condition cc in, for example, a storage unit 73 which is a memory, and reads and updates the control condition cc from the storage unit 73.

Table 1 shows the control conditions (learning results) by Q-learning, which is an example of reinforcement learning. The top row of Table 1 shows the above-mentioned five states st1 to st5. That is, each of the 2nd to 6th columns shows five states st1 to st5. On the other hand, four actions ac1 to ac4 are shown in the leftmost column of Table 1. That is, each row in the 2nd to 5th columns shows four actions ac1 to ac4.

Here, in the example of Table 1, the action of reducing the output (for example, voltage) to the heater 24 by 1% is set as the action ac1 (output change: -1%). The action of maintaining the output to the heater 24 is set as action ac2 (output change: 0%). The action of increasing the output to the heater 24 by 1% is set as action ac3 (output change: + 1%). The action of increasing the output to the heater 24 by 1.5% is set as action ac4 (output change: + 1.5%). The example in Table 1 is just a simple example for explanation, and in reality, a large number of more subdivided action acs are often set.

In Table 1, the value determined from the combination of the state st and the action ac is called the value Q (st, ac). After the initial value is given, the value Q is sequentially updated based on the reward rn using a known update formula. The initial value of the value Q is included in the learning conditions shown in FIG. 4, for example. The learning conditions are input by, for example, an operator. The initial value of the value Q may be stored in the storage unit 73, and for example, the past learning result may be used as the initial value. Further, the learning conditions shown in FIG. 4 include, for example, the states st1 to st5 and the actions ac1 to ac4 shown in Table 1.

The value Q will be described by taking the state st4 in Table 1 as an example. In the state st4, since the control deviation is 0.3 μm or more and less than 0.6 μm, the lip interval in the target heat bolt 23 is too wide. Therefore, it is necessary to increase the output to the heater 24 that heats the target heat bolt 23 and increase the amount of thermal expansion of the target heat bolt 23. Therefore, as a result of learning by the control condition learning unit 72, the value Q of the actions ac3 and ac4 that increase the output to the heater 24 is increased. On the other hand, the value Q of the action ac2 that maintains the output to the heater 24 and the action ac4 that reduces the output to the heater 24 is small.

In the example of Table 1, for example, when the control deviation is 0.4 μm, the state st is the state st4. Therefore, the control condition learning unit 72 selects the optimum action ac4 having the maximum value Q in the state st4 and outputs it to the control signal output unit 74.
The control signal output unit 74 increases the control signal ctr output to the heater 24 by 1.5% based on the input action ac4. The control signal ctr is, for example, a voltage signal.

Then, if the absolute value of the next control deviation is smaller than the absolute value of the current control deviation of 0.4 μm, the state observation unit 71 determines that the selection of the action ac4 in the current state st4 is appropriate, and is positive. Output the value reward rw. Therefore, the control condition learning unit 72 updates the control condition so as to increase the value + 5.6 of the action ac4 in the state st4 according to the reward rw. As a result, in the case of the state st4, the control condition learning unit 72 continues to select the action ac4.

On the other hand, if the absolute value of the next control deviation is larger than the absolute value of the current control deviation of 0.4 μm, the state observation unit 71 determines that the selection of the action ac4 in the current state st4 is inappropriate and is negative. The reward rw of the value of is output. Therefore, the control condition learning unit 72 updates the control condition so as to reduce the value +5.6 of the action ac4 in the state st4 according to the reward rw. As a result, when the value of the action ac4 in the state st4 becomes smaller than the value of the action ac3 + 5.4, in the case of the state st4, the control condition learning unit 72 selects the action ac3 instead of the action ac4.

The timing of updating the control conditions is not limited to the next time, and may be appropriately determined in consideration of a time lag and the like. Further, in the initial stage of learning, the action ac may be randomly selected in order to promote learning. Furthermore, in Table 1, reinforcement learning by simple Q-learning was explained, but there are various learning algorithms such as Q-learning, AC (Actor-Critic) method, TD learning, and Monte Carlo method, but they are not limited in any way. Absent. For example, when the number of state st and action ac increases and a combinatorial explosion occurs, it may be selected depending on the situation such as using the AC method.

Further, in the AC method, a probability distribution function is often used as a policy function. The probability distribution function is not limited to the normal distribution function, and for example, a sigmoid function, a softmax function, or the like may be used for the purpose of simplification. The sigmoid function is the most used function in neural networks. Reinforcement learning is one of the same machine learning as neural networks, so a sigmoid function can be adopted. In addition, the sigmoid function has the advantage that the function itself is simple and easy to handle.
As described above, there are various learning algorithms and functions to be used, but the most suitable one for the process may be appropriately selected.

As described above, since the resin film manufacturing apparatus according to the first embodiment does not use PID control, it is not necessary to adjust the parameters due to the change of the process conditions in the first place. Further, the control unit 70 updates the control condition (learning result) based on the reward rw by reinforcement learning, and selects the optimum action ac corresponding to the current state st from the updated control condition. Therefore, even when the process conditions are changed, the time required for adjustment and the resin material can be suppressed as compared with the comparative example.

<Resin film manufacturing method>
Next, the details of the resin film manufacturing method according to the first embodiment will be described with reference to FIGS. 1 and 5. FIG. 5 is a flowchart showing a method of controlling the lip interval in the resin film manufacturing method according to the first embodiment.

As shown in FIG. 1, in the resin film manufacturing method according to the first embodiment, the film-like molten resin 82a is extruded from the gap between the pair of lips 21a and 22a of the T-die 20.
Next, the thickness distribution of the resin film 83 in the width direction is measured by the thickness sensor 60 while transporting the resin film 83 in which the film-shaped molten resin 82a is solidified.
Then, the control unit 70 feedback-controls the lip interval based on the thickness distribution measured by the thickness sensor 60.

Next, with reference to FIG. 5, a method of controlling the lip interval in the resin film manufacturing method according to the first embodiment will be described. In the description of FIG. 5, FIG. 4 is also referred to as appropriate.
First, as shown in FIG. 5, the state observation unit 71 of the control unit 70 shown in FIG. 4 calculates the control deviation from the thickness distribution of the resin film 83 for each heat bolt 23. Then, based on the calculated control deviation, the current state st and the reward rn for the previously selected action ac are determined (step S1). At the first time, since the action ac selected before (for example, the previous time) does not exist and the reward rw cannot be determined, only the current state st is determined.

Next, the control condition learning unit 72 of the control unit 70 updates the control condition, which is a combination of the state st and the action ac, based on the reward rw. Then, the optimum action ac corresponding to the current state st is selected from the updated control conditions (step S2).
Then, the control signal output unit 74 of the control unit 70 outputs the control signal ctr to the heater 24 based on the optimum action ac selected by the control condition learning unit 72 (step S3).

If the production of the resin film 83 is not completed (step S4NO), the process returns to step S1 to continue the control. On the other hand, when the production of the resin film 83 is completed (step S4YES), the control is terminated. That is, steps S1 to S3 are repeated until the production of the resin film 83 is completed.

As described above, since the resin film manufacturing method according to the first embodiment does not use PID control, it is not necessary to adjust the parameters due to the change of the process conditions in the first place. In addition, the control condition (learning result) is updated based on the reward rw by reinforcement learning using a computer, and the optimum action ac corresponding to the current state st is selected from the updated control condition. Therefore, even when the process conditions are changed, the time required for adjustment and the resin material can be suppressed as compared with the comparative example.

(Embodiment 2)
Next, the resin film manufacturing apparatus according to the second embodiment will be described. Since the overall configuration of the resin film manufacturing apparatus according to the second embodiment is the same as the overall configuration of the resin film manufacturing apparatus according to the first embodiment shown in FIGS. 1 to 3, the description thereof will be omitted. The structure of the control unit 70 of the resin film manufacturing apparatus according to the second embodiment is different from that of the resin film manufacturing apparatus according to the first embodiment.

FIG. 6 is a block diagram showing a configuration of the control unit 70 according to the second embodiment. As shown in FIG. 6, the control unit 70 according to the second embodiment includes a state observation unit 71, a control condition learning unit 72, a storage unit 73, and a PID controller 74a. That is, the control unit 70 according to the second embodiment includes the PID controller 74a as the control signal output unit 74 in the control unit 70 according to the first embodiment shown in FIG. The PID controller 74a is also a form of the control signal output unit.

Similar to the first embodiment, the state observation unit 71 determines the current state st and the reward rn for the previously selected action ac based on the calculated control deviation err for each heat bolt 23. Then, the state observation unit 71 outputs the current state st and the reward rw to the control condition learning unit 72. Further, the state observation unit 71 according to the second embodiment outputs the calculated control deviation err to the PID controller 74a.

The control condition learning unit 72 also performs reinforcement learning for each heat bolt 23 as in the first embodiment. Specifically, the control condition learning unit 72 updates the control condition (learning result) based on the reward rw, and selects the optimum action ac corresponding to the current state st from the updated control condition. Here, in the first embodiment, the content of the action ac selected by the control condition learning unit 72 directly changes the output to the heater 24. On the other hand, in the second embodiment, the content of the action ac selected by the control condition learning unit 72 changes the parameter of the PID controller 74a.

As shown in FIG. 6, the parameters of the PID controller 74a are sequentially changed based on the action ac output from the control condition learning unit 72. On the other hand, the PID controller 74a outputs a control signal ctr to the heater 24 based on the input control deviation err. The control signal ctr is, for example, a voltage signal.
Since other configurations are the same as those in the first embodiment, the description thereof will be omitted.

As described above, since the resin film manufacturing apparatus according to the second embodiment uses PID control, it is necessary to adjust the parameters according to the change of the process conditions. In the resin film manufacturing apparatus according to the second embodiment, the control unit 70 updates the control condition (learning result) based on the reward rw by reinforcement learning, and corresponds to the current state st from the updated control condition. Select the best action ac. Here, the action ac in reinforcement learning is a change of the parameter of the PID controller 74a. Therefore, even when the process conditions are changed, the time required for parameter adjustment and the resin material can be suppressed as compared with the comparative example.

Although the invention made by the present inventor has been specifically described above based on the embodiments, the present invention is not limited to the embodiments already described, and various changes can be made without departing from the gist thereof. It goes without saying that it is possible.

10 Extruder 11 Cylinder 12 Screw 13 Hopper 20 T Die 20a Introductory port 20b Manifold 20c Slit 21, 22 Die block 21a, 22a Lip 22b Notch groove 23 Heat bolt 24 Heater 25a, 25b Holder 26 Connecting member 30 Cooling roll 40 Conveying roll Group 41-48 Conveyance roll 50 Winder 60 Thickness sensor 70 Control unit 71 State observation unit 72 Control condition learning unit 73 Storage unit 74 Control signal output unit 74a PID controller 81 Resin pellet 82 Molten resin 82a Film-shaped molten resin 83 resin Film ac Action cc Control condition ctr Control signal err Control deviation pv Measured value rn Reward st State

Claims (14)

A die having a plurality of pairs of heat bolts arranged along the longitudinal direction of the pair of lips and heaters for heating the heat bolts, and the lip spacing can be adjusted for each heat bolt.
A cooling roll that carries out a resin film in which the molten resin is solidified while cooling the film-like molten resin extruded from the gap between the pair of lips.
A thickness sensor that measures the thickness distribution in the width direction of the resin film carried out from the cooling roll, and
A control unit that feedback-controls the lip interval based on the thickness distribution acquired from the thickness sensor is provided.
The control unit is used for each heat bolt.
Based on the control deviation calculated from the thickness distribution, the current state and the reward for the previously selected action are determined.
The control condition, which is a combination of the state and the action, is updated based on the reward, and the optimum action corresponding to the current state is selected from the updated control condition.
Control the heater based on the optimal behavior,
Resin film manufacturing equipment. The action is a change in the output of the heater.
The resin film manufacturing apparatus according to claim 1. The action is a change in the parameters of the PID controller that controls the output of the heater.
The resin film manufacturing apparatus according to claim 1. The thickness sensor is a non-contact type.
The resin film manufacturing apparatus according to claim 1. The thickness sensor measures the thickness distribution in the width direction of the resin film while scanning in the width direction of the resin film.
The resin film manufacturing apparatus according to claim 4. The thickness sensor measures the thickness distribution of the horizontally conveyed resin film in the width direction.
The resin film manufacturing apparatus according to claim 5. Only one of the pair of lips is connected to the heat bolt.
The resin film manufacturing apparatus according to claim 1. (A) A step of extruding a film-like molten resin from a gap between a pair of lips of a die.
(B) A step of measuring the thickness distribution in the width direction of the resin film while transporting the resin film in which the molten resin is solidified.
(C) A step of feedback-controlling the lip spacing based on the measured thickness distribution is provided.
The die has a plurality of pairs of heat bolts arranged along the longitudinal direction of the pair of lips and heaters for heating the heat bolts, and the lip spacing can be adjusted for each heat bolt.
In the step (c), the computer performs each of the heat bolts.
(C1) Based on the control deviation calculated from the thickness distribution, the current state and the reward for the previously selected action are determined.
(C2) The control condition, which is a combination of the state and the action, is updated based on the reward, and the optimum action corresponding to the current state is selected from the updated control condition.
(C3) The heater is controlled based on the optimum behavior.
Resin film manufacturing method. The action determined in the step (c2) is a change in the output of the heater.
The resin film manufacturing method according to claim 8. The action determined in the step (c2) is a change in the parameters of the PID controller that controls the output of the heater.
The resin film manufacturing method according to claim 8. In the step (b), the thickness distribution in the width direction of the resin film is measured by a non-contact thickness sensor.
The resin film manufacturing method according to claim 8. While scanning the thickness sensor in the width direction of the resin film, the thickness distribution in the width direction of the resin film is measured.
The resin film manufacturing method according to claim 11. The thickness sensor measures the thickness distribution in the width direction of the horizontally conveyed resin film.
The resin film manufacturing method according to claim 12. Only one of the pair of lips is connected to the heat bolt.
The resin film manufacturing method according to claim 8.

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