JP2020150211A - Multilayer substrate and converter - Google Patents

Abstract

To provide a multilayer substrate that can avoid the risk of current concentration and reflection occurring at a part where a current path changes from a winding pattern to a via hole, and avoid the risk of loss, heat generation, or magnetic radiation.SOLUTION: A multilayer substrate includes a first substrate 15, a first conductor pattern winding layer portion 35 provided on one surface of the first substrate 15 in a thickness direction, a second conductor pattern winding layer portion 53 provided on the other surface of the first substrate 15 in the thickness direction, and a conductive portion 75 provided on the first substrate 15 and connecting the first conductor pattern winding layer portion 35 and the second conductor pattern winding layer portion 53 to each other, and the value of the cross section of the conductive portion 75 is equal to or greater than the value of the cross section of the first conductor pattern winding layer portion 35.SELECTED DRAWING: Figure 5

Description

The present invention relates to a laminated substrate and a converter, and more particularly to a coil portion formed on both sides of the substrate is connected by a conductive portion provided on the substrate.

The isolation transformer of the DCDC converter has a predetermined turns ratio on the primary side and the secondary side according to the input / output voltage. When the high-voltage side primary winding is formed by the winding pattern formed on the substrate, it is necessary to make a plurality of turns and fold back, and the winding pattern is generally composed of two layers.

Usually, the two-layer winding pattern is connected by a via hole or the like provided on the substrate. The number of via holes is set so that the total cross section of the conductor pattern forming the winding pattern and the cross section of the plurality of via holes are equal so that the current density and the resistance value do not change.

Here, Patent Document 1 is listed as a patent document relating to the conventional technique.

Japanese Unexamined Patent Publication No. 2004-304906

Even if the total cross-sectional area of the via hole is set as described above, when the switching frequency of the DCDC converter is increased, the current path changes from the winding pattern to the via hole, even though the DC resistance is the same. , Impedance will increase.

Then, at the portion where the current path changes from the winding pattern to the via hole, current concentration or reflection may occur, and loss, heat generation, or magnetic radiation may occur.

INDUSTRIAL APPLICABILITY According to the present invention, it is possible to avoid the risk of current concentration and reflection occurring at the portion where the current path changes from the winding pattern to the via hole, and to avoid the risk of loss, heat generation, or magnetic radiation. It is an object of the present invention to provide a laminated substrate and a converter.

The present invention comprises a first substrate, a first conductor pattern winding layer portion provided on one surface of the first substrate in the thickness direction, and the other in the thickness direction of the first substrate. The second conductor pattern winding layer portion provided on the surface of the above surface, the first conductor pattern winding layer portion provided on the first substrate, and the second conductor pattern winding layer portion. The shape of each conductor pattern winding layer portion and the shape of the conductive portion are different from each other in order to have a conductive portion connected to each other and suppress an increase in impedance at the boundary with the conductive portion. It is a laminated substrate formed in at least one of the above-mentioned aspects, in which the material of each conductor pattern winding layer portion and the material of the conductive portion are different from each other.

According to the present invention, it is possible to avoid the risk of current concentration and reflection occurring at the portion where the current path changes from the winding pattern to the via hole, and to avoid the risk of loss, heat generation, or magnetic radiation. It has the effect of being able to provide a laminated substrate and a converter that can be used.

It is a circuit diagram of the DCDC converter which concerns on embodiment of this invention. It is a front view of the laminated substrate used in the DCDC converter which concerns on embodiment of this invention. FIG. 2 is a view taken along the line III-III in FIG. FIG. 2 is an arrow view of IV-IV in FIG. It is an enlarged view of the 1st conductor pattern winding layer part shown in FIG. (A) is a diagram showing a VIA-VIA cross section in FIG. 5, (b) is a diagram showing a VIB-VIB cross section in (a), and (c) is a diagram showing a VIC-VIC cross section in FIG. is there. It is an enlarged view of the 1st conductor pattern winding layer part which concerns on 1st modification. It is an enlarged view of the 2nd conductor pattern winding layer part which concerns on 1st modification. It is an enlarged view of the 1st conductor pattern winding layer part which concerns on the 2nd modification. It is an enlarged view of the 2nd conductor pattern winding layer part which concerns on the 2nd modification.

The converter (for example, DCDC converter) 1 according to the embodiment of the present invention is a center tap type converter, and as shown in FIG. 1, the input unit 3, the switching unit 5, the transformer 7, the rectifying unit 9, and the output unit 11 It is configured with. Then, the DC voltage input from the input unit 3 is converted into a DC voltage having a different voltage and output from the output unit 11.

Further, the DCDC converter 1 is configured to include a laminated substrate (rectifier circuit for converter) 13 as shown in FIGS. 2 to 4. A transformer 7, a rectifying unit 9, and the like are installed on the laminated substrate 13.

Here, for convenience of explanation, a predetermined one direction is a vertical direction, a predetermined one direction orthogonal to the vertical direction is a horizontal direction, and a direction orthogonal to the vertical direction and the horizontal direction is a thickness direction. And.

As shown in FIG. 2, the laminated substrate 13 includes a first substrate (first substrate) 15, a second substrate (second substrate) 17, and a third substrate (third substrate). ) 19, the first conductor pattern (conductor pattern of layer L2) 21, the second conductor pattern (conductor pattern of layer L3) 23, the third conductor pattern (conductor pattern of layer L1) 25, and the first It is configured to include 4 conductor patterns (conductor pattern of layer L4) 27.

The first substrate 15 is made of, for example, an insulating material and is formed in a rectangular flat plate shape. The second substrate 17 and the third substrate 19 are formed of the same material as the first substrate 15 and have the same shape. The first conductor pattern 21, the second conductor pattern 23, the third conductor pattern 25, and the fourth conductor pattern 27 are formed of the same conductive material. Further, the thickness of the first conductor pattern 21, the thickness of the second conductor pattern 23, the thickness of the third conductor pattern 251 and the thickness of the fourth conductor pattern 27 are equal to each other.

As shown in FIG. 2, from one end to the other end in the thickness direction, the third conductor pattern 25, the second substrate 17, the first conductor pattern 21, the first substrate 15, and the second conductor The pattern 23, the third substrate 19, and the fourth conductor pattern 27 are overlapped and laminated in this order.

When viewed in the thickness direction, as shown in FIG. 3 and the like, all of the first substrate 15, all of the second substrate 17, and all of the third substrate 19 overlap each other. The conductor pattern 21, the second conductor pattern 23, the third conductor pattern 25, and the fourth conductor pattern 27 are located inside the substrates 15, 17, and 19, respectively.

A plurality of through holes 29 penetrating the substrates 15, 17, 19 are formed in the substrates 15, 17, 19. When viewed in the thickness direction, each of these through holes 29 overlaps with each other. One through hole 29a of each through hole 29 forms the core portion of the transformer 7 shown in FIG. When viewed in the thickness direction, the through hole 29a is located at the center in the horizontal direction and on one end side in the vertical direction.

As shown in FIG. 3, the first conductor pattern (first circuit pattern) 21 includes a first conductor pattern winding layer (primary winding layer of layer L2) 31 and other conductor patterns of the first conductor pattern. It is configured to include a wiring layer 33, and is provided between the first substrate 15 and the second substrate 17 in the thickness direction.

The first conductor pattern winding layer 21 includes a first conductor pattern winding layer portion (a first conductor pattern winding layer portion constituting the primary winding of the transformer 7) 35 and a first conductor pattern winding. It is configured to include a line layer extending portion 37.

The first conductor pattern winding layer portion (coil portion) 35 is formed in a spiral shape and is arranged so as to surround the core portion 29a.

The first conductor pattern winding layer extending portion 37 is formed in a rectangular shape long in the vertical direction, and extends from the outer end of the first conductor pattern winding layer portion 35 toward one end side in the vertical direction. It is out. Further, the first conductor pattern winding layer extending portion 37 is located at the center in the lateral direction.

The other wiring layers 33 of the first conductor pattern include the first wiring layer 39 of the first conductor pattern, the second wiring layer 41 of the first conductor pattern, and the third wiring layer 43 and the first wiring layer 43 of the first conductor pattern. The fourth wiring layer 45 of the conductor pattern 1 and the fifth wiring layer 47 of the first conductor pattern are provided.

Although the first conductor pattern winding layer 31 and the second wiring layer 41 of the first conductor pattern are connected to each other, the first wiring layer 39 and the first wiring layer 39 of the other first conductor pattern are connected to each other. A gap is formed between the third wiring layer 43 of the conductor pattern, the fourth wiring layer 45 of the first conductor pattern, and the fifth wiring layer 47 of the first conductor pattern, and these are separated from each other. There is.

The first wiring layer 39 of the first conductor pattern is formed in a "U" shape, is arranged on the other end side in the vertical direction, and is arranged almost entirely in the horizontal direction. The second wiring layer 41 of the first conductor pattern is formed in a substantially rectangular shape, is arranged on one end side in the vertical direction, and is arranged on one end side in the horizontal direction as well. The third wiring layer 43 of the first conductor pattern is formed in a substantially rectangular shape, is arranged on one end side in the vertical direction, and is arranged on the other end side in the horizontal direction.

The fourth wiring layer 45 of the first conductor pattern is formed in a rectangular shape long in the vertical direction, and in the vertical direction, the first conductor pattern winding layer portion 35 and the first wiring layer of the first conductor pattern. It is arranged between 39 (the portion on the other end side in the vertical direction), and is arranged at a position biased toward the other end side from the center in the horizontal direction.

The fifth wiring layer 47 of the first conductor pattern is formed in a rectangular shape long in the vertical direction, and in the vertical direction, the first conductor pattern winding layer portion 35 and the first wiring layer of the first conductor pattern are formed. It is arranged between 39 (the portion on the other end side in the vertical direction) and is arranged in the center in the horizontal direction.

Further, the fourth wiring layer 45 of the first conductor pattern and the fifth wiring layer 47 of the first conductor pattern are arranged inside the first wiring layer 39 of the first conductor pattern in the lateral direction. .. Then, the portion on one end side in the lateral direction of the first wiring layer 39 of the first conductor pattern, the fifth wiring layer 47 of the first conductor pattern, the fourth wiring layer 45 of the first conductor pattern, and the first conductor pattern The portions of the first wiring layer 39 on the other end side in the lateral direction are arranged in this order from one end side to the other end side in the lateral direction.

As shown in FIG. 4, the second conductor pattern (second circuit pattern) 23 includes a second conductor pattern winding layer (primary winding layer of layer L3) 49 and other conductor patterns of the second conductor pattern. It is configured to include a wiring layer 51, and is provided between the first substrate 15 and the third substrate 19 in the thickness direction.

The second conductor pattern winding layer 49 includes a second conductor pattern winding layer portion (a second conductor pattern winding layer portion constituting the primary winding of the transformer 7) 53 and a second conductor pattern winding. It is configured to include a line layer extending portion 55.

The second conductor pattern winding layer portion (coil portion) 53 is formed in a spiral shape and is arranged so as to surround the core portion 29a.

The second conductor pattern winding layer extending portion 55 is formed in a rectangular shape long in the vertical direction, and extends from the outer end of the second conductor pattern winding layer portion 53 toward one end side in the vertical direction. It is out. Further, the second conductor pattern winding layer extending portion 55 is located at the center in the lateral direction.

The other wiring layers 51 of the second conductor pattern include the first wiring layer 57 of the second conductor pattern, the second wiring layer 59 of the second conductor pattern, and the third wiring layer 61 and the second wiring layer 61 of the second conductor pattern. It is configured to include a fourth wiring layer 63 of the second conductor pattern and a fifth wiring layer 65 of the second conductor pattern.

Although the second conductor pattern winding layer 49 and the third wiring layer 61 of the second conductor pattern are connected to each other, the first wiring layer 57 and the second wiring layer 57 of the other second conductor pattern are connected to each other. A gap is formed between the second wiring layer 59 of the conductor pattern, the fourth wiring layer 63 of the second conductor pattern, and the fifth wiring layer 65 of the second conductor pattern, and these are separated from each other. There is.

The first wiring layer 57 of the second conductor pattern is formed in a "U" shape, is arranged on the other end side in the vertical direction, and is arranged almost entirely in the horizontal direction. The second wiring layer 59 of the second conductor pattern is formed in a substantially rectangular shape, is arranged on one end side in the vertical direction, and is arranged on one end side in the horizontal direction as well. The third wiring layer 61 of the second conductor pattern is formed in a substantially rectangular shape, is arranged on one end side in the vertical direction, and is arranged on the other end side in the horizontal direction.

The fourth wiring layer 63 of the second conductor pattern is formed in a rectangular shape long in the vertical direction, and in the vertical direction, the second conductor pattern winding layer portion 53 and the first wiring layer of the second conductor pattern It is arranged between 57 (the portion on the other end side in the vertical direction), and is arranged at a position biased toward the other end side from the center in the horizontal direction.

The fifth wiring layer 65 of the second conductor pattern is formed in a rectangular shape long in the vertical direction, and in the vertical direction, the second conductor pattern winding layer portion 53 and the first wiring layer of the second conductor pattern It is arranged between 57 (the portion on the other end side in the vertical direction) and is arranged in the center in the horizontal direction.

Further, the fourth wiring layer 63 of the second conductor pattern and the fifth wiring layer 65 of the second conductor pattern are arranged inside the first wiring layer 57 of the second conductor pattern in the lateral direction. .. Then, the portion on one end side in the lateral direction of the first wiring layer 57 of the second conductor pattern, the fifth wiring layer 65 of the second conductor pattern, the fourth wiring layer 63 of the second conductor pattern, and the second conductor pattern The portions of the first wiring layer 57 on the other end side in the lateral direction are arranged in this order from one end side to the other end side in the lateral direction.

Although detailed description of the third conductor pattern (third circuit pattern) 25 and the fourth conductor pattern (fourth circuit pattern) 27 is omitted, the third conductor pattern 25 surrounds the core portion 29a. A third conductor pattern winding layer portion or the like that is arranged and constitutes the secondary winding of the transformer 7 is provided, and the fourth conductor pattern 27 is arranged so as to surround the core portion 29a and is arranged so as to surround the transformer 7. It is configured to include a fourth conductor pattern winding layer portion and the like constituting the secondary winding of the above.

When viewed in the thickness direction of the laminated substrate 13, the first conductor pattern winding layer portion 35 and the second conductor pattern winding layer portion 53 substantially overlap each other.

Further, in order to form the circuit shown in FIG. 1, each wiring layer 39 of the first conductor pattern is passed through inlays 69 such as through ball vias 67 and copper inlays penetrating the substrates 15, 17, and 19. , 41, 43, 45, 47, the wiring layers 57, 59, 61, 63, 65 of the second conductor pattern, the third conductor pattern 25, and the fourth conductor pattern 27 are appropriately conductive. There is.

As shown in FIG. 2, the rectifying element 71 constituting the rectifying unit 9 has a surface of the second substrate 17 (one end side in the thickness direction; a mounting surface) and a surface of the second substrate 17 (thickness). It is mounted on the surface on the other end side in the direction; the mounting surface).

Further, as shown in FIGS. 3 to 6, in order to form the primary coil of the transformer 7, the first conductor pattern winding layer portion 35 and the second conductor pattern winding layer portion 53 are connected to the conductive portion 75 ( Verid holes; blind via holes) 73 are conducting with each other.

Further, a plurality of the verid holes 73 constituting the conductive portion 75 penetrate the first substrate 15 in this thickness direction and are provided on the first substrate 21 apart from each other, and the first conductors The inner tip of the pattern winding layer 35 (the end on the core 29a side) and the inner tip of the second conductor pattern winding layer 53 (the end on the core 29a) are mutually connected. It is connected. The plurality of verid holes 73 are arranged apart from each other in the longitudinal direction (stretching direction) of the first conductor pattern winding layer portion 35 and the second conductor pattern winding layer portion 53.

The first conductor pattern winding layer portion 35, the second conductor pattern winding layer portion 53, and the conductive portion 75 are made of the same material (furthermore, materials having the same conductivity). The value of the cross-sectional area of the first conductor pattern winding layer portion 35 and the value of the cross-sectional area of the second conductor pattern winding layer portion 53 are equal to each other, and the cross-sectional area of the conductive portion 75 The value is equal to or larger than the value of the cross-sectional area of the first conductor pattern winding layer portion 35 and the value of the cross-sectional area of the second conductor pattern winding layer portion 53.

The cross-sectional area of the first conductor pattern winding layer portion 35 is the area of the cross section of the first conductor pattern winding layer portion 35 in a plane orthogonal to the direction in which the current flows, and is the second conductor pattern. The cross-sectional area of the winding layer portion 53 is the area of the cross section of the second conductor pattern winding layer portion 53 in a plane orthogonal to the direction in which the current flows. The cross-sectional area of the conductive portion 75 is the area of the cross section of the conductive portion 75 on a plane orthogonal to the direction in which the current flows (a plane orthogonal to the thickness direction).

More specifically, the cross-sectional area of the first conductor pattern winding layer portion 35 is the area of the hatched rectangular portion shown by reference numeral 35A in FIG. 6 (c), or the area of the rectangular portion shown in FIG. 6 (c). It is the area of the hatched rectangular portion indicated by reference numeral 35B.

The cross-sectional area of the second conductor pattern winding layer portion 53 is the area of the hatched rectangular portion shown by the reference numeral 53A in FIG. 6 (c), or the reference numeral 53B in FIG. 6 (c). It is the area of the rectangular part where the hatching is shown. The cross-sectional area of the conductive portion 75 is the total value of the areas of the plurality of hatched rings (verid holes 73) shown in FIG. 6 (b).

The width dimension B1 of the first conductor pattern winding layer portion 35 and the width dimension B2 of the second conductor pattern winding layer portion 53 are equal to each other, and the first conductor pattern winding layer portion 35 The thickness dimension H1 of the second conductor pattern winding layer portion 53 and the thickness dimension H2 of the second conductor pattern winding layer portion 53 are equal to each other.

Next, FIG. 7 shows the first conductor pattern winding layer portion 35 according to the first modification, the second conductor pattern winding layer portion 53 according to the first modification, and their conductive portions 75. , FIG. 8 will be described with reference to FIG.

Regarding the first conductor pattern winding layer portion 35 according to the first modification, the second conductor pattern winding layer portion 53 according to the first modification, and their conductive portions 75, the conductive portion 75 The installation form is different from that shown in FIGS. 5 and 6, and other points are configured in the same manner as those shown in FIGS. 5 and 6 and the like.

As shown in FIG. 7, the first conductor pattern winding layer portion 35 is formed in a rectangular (square) spiral shape. Further, as shown in FIG. 8, the second conductor pattern winding layer portion 53 is also formed in a rectangular spiral shape similar to the first conductor pattern winding layer portion 35. The winding direction of the first conductor pattern winding layer portion 35 and the winding direction of the second conductor pattern winding layer portion 53 are opposite to each other.

Also in the case of the first modification shown in FIGS. 7 and 8, the conductive portion 75 is the inner end portion of the first conductor pattern winding layer portion 35 and the second conductor pattern winding layer portion 53. The inner end portions are connected to each other, and the core portion 29a is formed inside each of the conductor pattern winding layer portions 35 and 53.

In the case of the first modification shown in FIGS. 7 and 8, in order to reduce the dead space in the first substrate 15, the center 77 of the core portion 29a to the first conductor pattern winding layer portion 35 The number of turns of the first conductor pattern winding layer portion 35 in the first direction toward the outside and the second direction toward the outside of the first conductor pattern winding layer portion 35 from the center 77 of the core portion 29a. The number of turns of the first conductor pattern winding layer portion 35 in the above is equal to each other.

The first direction is, for example, a direction from the center 77 of the core portion 29a toward one end side in the lateral direction, and the second direction is opposite to the first direction and is the core. It is a direction from the center 77 of the portion 29a toward the other end side in the lateral direction.

Further, the number of turns of the first conductor pattern winding layer portion 35 and the second conductor pattern winding layer portion 53 are equal to each other. Then, in the same manner as in the case of the first conductor pattern winding layer portion 35, also in the second conductor pattern winding layer portion 53, in order to reduce the dead space in the first substrate 15, the core portion 29a The number of turns of the second conductor pattern winding layer 53 in the first direction toward the outside of the second conductor pattern winding layer 53 from the center 77, and the second conductor pattern winding in the second direction. The number of turns of the wire layer portion 53 is equal to each other.

Further, an odd-numbered coil portion is formed by the first conductor pattern winding layer portion 35, the second conductor pattern winding layer portion 53, and the conductive portion 75.

That is, from the portion indicated by reference numeral 79 (outer end portion of the winding layer portion 35) to the portion indicated by reference numeral 81 (inner end portion of the winding layer portion 35) in FIG. 7, the winding layer The part 35 is wound 2.5 times.

Further, from the portion indicated by reference numeral 83 (outer end portion of the winding layer portion 53) to the portion indicated by reference numeral 85 (inner end portion of the winding layer portion 53) in FIG. 8, the winding layer Part 53 is also wound 2.5 times.

Since the portions 81 and 85 are electrically connected to each other by the conductive portion 75, the first conductor pattern winding layer portion 35 and the second conductor pattern winding layer portion 53 are wound five times (odd number winding). The coil part of is formed.

Further, the conductive portion 75 (verid hole 73) includes a first inner portion 87, a second inner portion 89, a third inner portion 91, and a second conductor pattern winding of the first conductor pattern winding layer portion 35. It is provided in the first inner portion 93, the second inner portion 95, and the inner portion 97 of the line layer portion 53.

The first inner portion 87 of the first conductor pattern winding layer portion 35 is formed in a predetermined direction (longitudinal direction) from the inner end of the first conductor pattern winding layer portion 35 along the outer circumference of the core portion 29a. It is extending. The second inner portion 89 of the first conductor pattern winding layer portion 35 is one end of the first inner portion 87 (the end opposite to the inner end of the first conductor pattern winding layer portion 35). ), It is connected to the first inner portion 87 and extends along the outer periphery of the core portion 29a in a direction different from that of the first inner portion 87 (for example, a lateral direction which is orthogonal to the first inner portion 87).

The third inner portion 91 of the first conductor pattern winding layer portion 35 is the end of the second inner portion 89 opposite to the end connected to the first inner portion 87, and is the second inner side. It is connected to the portion 89 and extends along the outer circumference of the core portion 29a in a direction different from that of the second inner portion 89 (for example, a vertical direction which is an orthogonal direction).

The first inner portion 93 of the second conductor pattern winding layer portion 53 is formed in a predetermined direction (longitudinal direction) from the inner end of the second conductor pattern winding layer portion 53 along the outer circumference of the core portion 29a. It is extending. The second inner portion 95 of the second conductor pattern winding layer portion 53 is one end of the first inner portion 93 (the end opposite to the inner end of the second conductor pattern winding layer portion 53). ), It is connected to the first inner portion 93 and extends along the outer periphery of the core portion 29a in a direction different from that of the first inner portion 93 (for example, a lateral direction which is orthogonal to the first inner portion 93).

The third inner portion 97 of the second conductor pattern winding layer portion 53 is the end of the second inner portion 95 opposite to the end connected to the first inner portion 93, and is the second inner side. It is connected to the portion 95 and extends along the outer circumference of the core portion 29a in a direction different from that of the second inner portion 95 (for example, a vertical direction which is an orthogonal direction).

Then, when viewed in the stacking direction (thickness direction) of the substrates 15, 17 and 19, the first inner portion 87 of the first conductor pattern winding layer portion 35 and the second conductor pattern winding layer portion The third inner portion 97 of 53 overlaps with each other.

When viewed in the stacking direction of the substrates 15, 17 and 19, the second inner portion 89 of the first conductor pattern winding layer portion 35 and the second inner portion 95 of the second conductor pattern winding layer portion 53. And overlap each other.

Further, when viewed in the stacking direction of the substrates 15, 17, and 19, the third inner portion 91 of the first conductor pattern winding layer portion 35 and the first inner portion of the second conductor pattern winding layer portion 53. The parts 93 overlap each other.

The current path in the first modification shown in FIGS. 7 and 8 will be described.

The current flowing from the portion 79 of the first conductor pattern winding layer portion 35 shown in FIG. 7 to the first inner portion 87 of the first conductor pattern winding layer portion 35 is the first conductor pattern winding layer. The second conductor pattern winding shown in FIG. 8 passes through the verid hole 73A and the like provided in the first inner portion 87 of the portion 35 and the third inner portion 97 of the second conductor pattern winding layer portion 53. It reaches the third inner portion 97 of the layer portion 53, and then flows to the portion 83 of the second conductor pattern winding layer portion 53. Even in this flow, an odd-numbered coil portion is formed.

Further, the current flowing from the portion 79 of the first conductor pattern winding layer portion 35 shown in FIG. 7 to the second inner portion 89 of the first conductor pattern winding layer portion 35 is the first conductor pattern winding. A second conductor pattern shown in FIG. 8 through a verid hole 73B or the like provided in the second inner portion 89 of the wire layer portion 35 and the second inner portion 95 of the winding layer portion 53. It reaches the second inner portion 95 of the winding layer portion 53, and then flows to the portion 83 of the second conductor pattern winding layer portion 53. Even in this flow, an odd-numbered coil portion is formed.

Further, the current flowing from the portion 79 of the first conductor pattern winding layer portion 35 shown in FIG. 7 to the third inner portion 91 of the first conductor pattern winding layer portion 35 is the first conductor pattern winding. A second conductor pattern shown in FIG. 8 through a verid hole 73C or the like provided in the third inner portion 91 of the wire layer portion 35 and the first inner portion 93 of the winding layer portion 53. It reaches the first inner portion 93 of the winding layer portion 53, and then flows to the portion 83 of the second conductor pattern winding layer portion 53. Even in this flow, an odd-numbered coil portion is formed.

Next, the operation of the converter 1 will be described. When a DC power supply is input to the input unit 3, it is converted to alternating current (AC) by the switching unit 5 and supplied to the transformer 7. The voltage is converted by the transformer 7, the converted AC is rectified by the rectifying unit 9, converted to direct current by the output choke coil and the output smoothing capacitor, and output from the output unit 11 as a DC power supply.

According to the converter 1, the value of the cross-sectional area of the conductive portion 75 is equal to or greater than the value of the cross-sectional area of the first conductor pattern winding layer portion 35 and the second conductor pattern winding layer portion 53. It is possible to prevent an increase in impedance at a portion where the current path changes from the winding layer portions 35 and 53 to the verid hole 73, avoid the possibility of current concentration and reflection, and cause loss, heat generation, or magnetic radiation. Can be avoided.

Further, according to the converter 1, since the conductive portions 75 are formed by the verid holes 73 provided apart from each other, the connecting portion between the first conductor pattern winding layer portion 35 and the conductive portion 75 , The connecting portion between the second conductor pattern winding layer portion 53 and the conductive portion 75 is not concentrated in one place but dispersed. As a result, an increase in impedance can be further avoided.

Further, according to the converter 1, the number of turns of the conductor pattern winding layer portions 35, 53 on one end side in the lateral direction and the number of turns of the conductor pattern winding layer portions 35, 53 on the other end side in the lateral direction. Is the same number, so that the widths B1 and B2 of the spirally stretched conductor pattern winding layers 35 and 53 are kept constant, and the spirally stretched conductor pattern is formed. If the lateral spacing of the winding layer portions 35 and 53 is made constant, dead space can be eliminated as much as possible and the space can be effectively used.

That is, the dimension K1 (see FIGS. 7 and 8) between the center 77 of the core portion 29a and the outermost portion of each conductor pattern winding layer portion 35, 53 on one side in the lateral direction. Dimension K2 between the value and the outermost part of each conductor pattern winding layer 35, 53 on the other side in the lateral direction from the center 77 of the core 29a (see FIGS. 7 and 8). The values of are equal to each other, and the space on both sides of the core portion 29a located at the center of the first substrate 21 in the lateral direction can be effectively used.

Further, according to the converter 1, when viewed in the stacking direction (thickness direction) of the substrates 15, 17, and 19, a first conductor pattern winding layer portion provided with a plurality of verid holes 73 (conducting portions 75) is provided. The first inner portion 87 of the 35 and the third inner portion 97 of the second conductor pattern winding layer portion 53 overlap each other, and a plurality of verid holes 73 (conducting portions 75) are provided. The second inner portion 89 of the conductor pattern winding layer portion 35 and the second inner portion 95 of the second conductor pattern winding layer portion 53 overlap each other, and a plurality of verid holes 73 (conducting portions 75). Since the third inner portion 91 of the first conductor pattern winding layer portion 35 and the first inner portion 93 of the second conductor pattern winding layer portion 53 are overlapped with each other, a verid hole is provided. The number of 73 can be increased to further increase the cross-sectional area of the conductive portion 75, and an increase in loss or the like can be further avoided.

Next, FIG. 9 shows the first conductor pattern winding layer portion 35 according to the second modification, the second conductor pattern winding layer portion 53 according to the second modification, and the conductive portion 75 thereof. , Will be described with reference to FIG.

Regarding the first conductor pattern winding layer portion 35 according to the second modification, the second conductor pattern winding layer portion 53 according to the second modification, and their conductive portions 75, the first conductor The number of turns of the pattern winding layer portion 35 and the second conductor pattern winding layer portion 53 is different from that shown in FIGS. 7 and 8, and other points are the same as those shown in FIGS. 7 and 8. Has been done.

As shown in FIG. 9, the first conductor pattern winding layer portion 35 is formed in a rectangular spiral shape. Further, as shown in FIG. 10, the second conductor pattern winding layer portion 53 is also formed in a rectangular spiral shape similar to the first conductor pattern winding layer portion 35.

Also in the case of the second modification shown in FIGS. 9 and 10, the conductive portion 75 is the inner end portion of the first conductor pattern winding layer portion 35 and the second conductor pattern winding layer portion 53. The inner end portions are connected to each other, and the core portion 29a is formed inside each of the conductor pattern winding layer portions 35 and 53.

Further, also in the case of the second modification shown in FIGS. 9 and 10, in the same manner as that shown in FIGS. 7 and 8, in order to reduce the dead space in the first substrate 15, FIG. And the value of the distance K1 shown in FIG. 10 and the value of the distance K2 are equal to each other.

In the case of the second modification shown in FIGS. 9 and 10, the first conductor pattern winding layer portion 35, the second conductor pattern winding layer portion 53, and the conductive portion 75 are even-numbered windings. The coil portion of is formed.

Further, in order to reduce the dead space in the first substrate 15, the first direction (direction toward one end side in the lateral direction) from the center 77 of the core portion 29a toward the outside of the first conductor pattern winding layer portion 35. ), The number of turns of the first conductor pattern winding layer portion 35 is opposite to the first direction, and is from the center 77 of the core portion 29a to the outside of the first conductor pattern winding layer portion 35. The number of turns is one more than the number of turns of the first conductor pattern winding layer portion 35 in the second direction (direction toward the other end side in the lateral direction).

Similarly, in order to reduce the dead space in the first substrate 15, the first conductor in the first direction from the center 77 of the core portion 29a toward the outside of the second conductor pattern winding layer portion 53. The number of turns of the pattern winding layer portion 35 is one less than the number of turns of the first conductor pattern winding layer portion 35 in the second direction.

In the second modification shown in FIGS. 9 and 10, although the number of turns of the conductor pattern winding layer portions 35 and 53 is different as described above, the conductor pattern winding layer portion By adjusting at least one of the widths of 35 and 53 and the interval D (see FIGS. 9 and 10) of the conductor pattern winding layer portions 35 and 53, the value of dimension K1 and the value of dimension K2 can be obtained. They are equal to each other.

The laminated substrate 13 described above includes a first substrate, a first conductor pattern winding layer portion provided on one surface in the thickness direction of the first substrate, and the first substrate. A second conductor pattern winding layer portion provided on the other surface in the thickness direction, and the first conductor pattern winding layer portion and the second conductor pattern winding provided on the first substrate. It has a conductive portion that connects the wire layer portions to each other, and in order to suppress an increase in impedance at the boundary with the conductive portion, the shape of each conductor pattern winding layer portion and the shape of the conductive portion Is an example of a laminated substrate formed in at least one of the modes in which the materials of the conductor pattern winding layer portion and the material of the conductive portion are different from each other. is there.

That is, the current flow path, which is the boundary between the first conductor pattern winding layer portion and the conductive portion, is the boundary between the portion where the shape of the current flow path changes and the second conductor pattern winding layer portion and the conductive portion. In order to suppress the increase in impedance at the part where the shape of the conductor changes, the shape of each conductor pattern winding layer and the shape of the conducting part are different from each other, or the material and continuity of each conductor pattern winding layer. The materials of the parts are different from each other, or the shape of each conductor pattern winding layer part and the shape of the conductive part are different from each other, and the material of each conductor pattern winding layer part and the material of the conductive part Is an example of laminated substrates that are different from each other.

1 Converter 15 1st board 17 2nd board 19 3rd board 29a Core part 35 1st conductor pattern winding layer part 53 2nd conductor pattern winding layer part 71 rectifying element 75 Conductive part 87 1st Conductor pattern 1st inner part of winding layer part 89 1st conductor pattern 2nd inner part of winding layer part 91 1st conductor pattern 3rd inner part of winding layer part 93 2nd conductor pattern 1st inner part of winding layer part 95 2nd inner part of 2nd conductor pattern winding layer part 97 3rd inner part of 2nd conductor pattern winding layer part

Claims (6)

The first board and
A first conductor pattern winding layer portion provided on one surface in the thickness direction of the first substrate,
A second conductor pattern winding layer portion provided on the other surface in the thickness direction of the first substrate, and
A conductive portion provided on the first substrate and connecting the first conductor pattern winding layer portion and the second conductor pattern winding layer portion to each other.
In order to suppress an increase in impedance at the boundary with the conductive portion, the shape of each conductor pattern winding layer portion and the shape of the conductive portion are different from each other. A laminated substrate, characterized in that the material of the wire layer portion and the material of the conductive portion are formed in at least one of different aspects from each other. The first board and
A first conductor pattern winding layer portion provided on one surface in the thickness direction of the first substrate,
A second conductor pattern winding layer portion provided on the other surface in the thickness direction of the first substrate, and
A conductive portion provided on the first substrate and connecting the first conductor pattern winding layer portion and the second conductor pattern winding layer portion to each other.
The laminated substrate is characterized in that the value of the cross-sectional area of the conductive portion is equal to or greater than the value of the cross-sectional area of the first conductor pattern winding layer portion. The laminated substrate according to claim 2.
A laminated substrate characterized in that a plurality of conductive portions are provided apart from each other. The laminated substrate according to any one of claims 1 to 3.
The conductive portion connects the inner end portion of the first conductor pattern winding layer portion and the inner end portion of the second conductor pattern winding layer portion.
A core portion is formed inside each of the conductor pattern winding layer portions.
The number of turns of the first conductor pattern winding layer portion in the first direction from the core portion toward the outside of the first conductor pattern winding layer portion is opposite to the first direction. The lamination is characterized in that the number of turns of the first conductor pattern winding layer portion in the second direction from the core portion toward the outside of the first conductor pattern winding layer portion is equal to that of the first conductor pattern winding layer portion. substrate. The laminated substrate according to claim 4.
The conductive portion includes a first inner portion of each conductor pattern winding layer portion, a second inner portion of each conductor pattern winding layer portion, and a third inner portion of each conductor pattern winding layer portion. It is provided in
The first inner portion extends in a predetermined direction from the inner end of each conductor pattern winding layer portion along the outer circumference of the core portion.
The second inner portion is connected to the first inner portion at one end of the first inner portion and extends along the outer circumference of the core portion in a direction different from that of the first inner portion. And
The third inner portion is an end of the second inner portion that is opposite to the end connected to the first inner portion, is connected to the second inner portion, and is on the outer periphery of the core portion. Along it, it extends in a direction different from that of the second inner part.
When viewed in the stacking direction of each of the substrates, the first inner portion of the first conductor pattern winding layer portion and the third inner portion of the second conductor pattern winding layer portion overlap each other. Coil,
When viewed in the stacking direction of each of the substrates, the second inner portion of the first conductor pattern winding layer portion and the second inner portion of the second conductor pattern winding layer portion overlap each other. Coil,
When viewed in the stacking direction of each of the substrates, the third inner portion of the first conductor pattern winding layer portion and the first inner portion of the second conductor pattern winding layer portion overlap each other. A laminated substrate characterized by being present. The laminated substrate according to any one of claims 1 to 5.
A second substrate laminated on the first substrate on one side in the thickness direction of the first substrate, and a second substrate.
A third substrate laminated on the first substrate on the other side in the thickness direction of the first substrate, and a third substrate.
A rectifying element mounted on a mounting surface formed on at least one of the surface of the second substrate and the surface of the third substrate.
A converter characterized by having.

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