JP2020143848A - LED heating device - Google Patents

LED heating device Download PDF

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JP2020143848A
JP2020143848A JP2019041103A JP2019041103A JP2020143848A JP 2020143848 A JP2020143848 A JP 2020143848A JP 2019041103 A JP2019041103 A JP 2019041103A JP 2019041103 A JP2019041103 A JP 2019041103A JP 2020143848 A JP2020143848 A JP 2020143848A
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led
case
heating device
air
heating element
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勉 戸谷
Tsutomu Totani
勉 戸谷
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Beat Sonic Co Ltd
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Beat Sonic Co Ltd
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Abstract

To provide an LED heating device 10, 20, 30, 50 applying an LED chip 12a, 52a of low running costs as a heat generating source, and capable of achieving high heating effect.SOLUTION: When a strip-like heating element 12 is energized, an LED chip 12a emits light, and air in a case 11 is heated by heat generation in accompany with the light emission. The heated air is discharged to the outside of the case 11 from an air discharge port 11b, and air from an air inlet port 11a flows into the case 11. As the heating element 12 has a slit shape, it can be housed in the case 11 while being bent and curved, folded and wound in multiple layers. As a number of LED chips 12a can be incorporated in the case 11, and flow of the heated air in the case 11 is complicated, high heating effect can be achieved.SELECTED DRAWING: Figure 1

Description

本発明は発光に伴って発熱するLEDチップを発熱源とするLED暖房装置に関する。 The present invention relates to an LED heating device that uses an LED chip that generates heat as it emits light as a heat generating source.

この種のLED暖房装置の一形式として、実用新案登録第3174165号公報には、複数個のLEDチップを並べた基板の表面を透光性の表カバーで覆い、基板の裏面を裏カバーで覆い、基板と裏カバーの間に断熱材を設け、基板と表カバー及び裏カバーをサイドフレームで連結したパネル状の発熱体をケースに内蔵したLED暖房装置が開示されている。
このLED暖房装置は消費電力の少ないLEDチップを発熱源とするので、ランニングコストを低く抑えることができる。
As a type of LED heating device of this type, Practical New Design Registration No. 3174165 discloses that the front surface of a substrate on which a plurality of LED chips are arranged is covered with a translucent front cover, and the back surface of the substrate is covered with a back cover. Disclosed is an LED heating device in which a heat insulating material is provided between a substrate and a back cover, and a panel-shaped heating element in which the substrate, the front cover, and the back cover are connected by a side frame is built in a case.
Since this LED heating device uses an LED chip with low power consumption as a heat generating source, the running cost can be kept low.

実用新案登録第3174165号公報Utility Model Registration No. 3174165

上記した従来のLED暖房装置の発熱源であるパネル状の発熱体は嵩張っているため、ケースに多数のLEDチップを内蔵できず、また、基板の裏面に断熱材を設けているため、基板の裏面側にはLEDチップから放熱されないので、ケース内の空気が温まり難く、所望の暖房効果を得にくい。 Since the panel-shaped heating element, which is the heat generating source of the conventional LED heating device described above, is bulky, a large number of LED chips cannot be built in the case, and the back surface of the substrate is provided with a heat insulating material. Since the LED chip does not dissipate heat on the back side of the case, it is difficult for the air inside the case to warm up and it is difficult to obtain the desired heating effect.

本発明は上記した問題点に鑑み、ランニングコストの低いLEDチップを発熱源とし、高い暖房効果を得ることができるLED暖房装置を提供することを目的とする。 In view of the above problems, an object of the present invention is to provide an LED heating device capable of obtaining a high heating effect by using an LED chip having a low running cost as a heat generating source.

請求項1に係るLED暖房装置は、空気取入口と空気排出口を形成したケースに、複数個のLEDチップを基板上に並べて軟質樹脂製又は合成ゴム製の被覆層で被覆した帯状又はつる状若しくはシート状の発熱体を内蔵し、空気取入口からケース内に流入した空気をLEDチップの発光に伴う発熱で暖め、温めた空気が空気排出口からケース外部に流出するようにしたことを特徴とする。 The LED heating device according to claim 1 has a strip-shaped or vine-shaped case in which a plurality of LED chips are arranged on a substrate and coated with a coating layer made of soft resin or synthetic rubber in a case in which an air inlet and an air outlet are formed. Alternatively, a sheet-shaped heating element is built in, and the air that has flowed into the case from the air intake is warmed by the heat generated by the light emission of the LED chip, and the warmed air flows out from the air outlet to the outside of the case. And.

請求項2に係る発明は、請求項1に記載のLED暖房装置において、前記LEDチップとともに該LEDチップの点灯回路に含まれる回路素子を前記被覆層で被覆し、回路素子の発熱を暖房に利用することを特徴とする。 In the invention according to claim 2, in the LED heating device according to claim 1, the circuit element included in the lighting circuit of the LED chip is covered with the coating layer together with the LED chip, and the heat generated by the circuit element is used for heating. It is characterized by doing.

請求項3に係る発明は、請求項1に記載のLED暖房装置において、前記帯状又はつる状の発熱体をつづら折にしてケースに収納することを特徴とする。 The invention according to claim 3 is the LED heating device according to claim 1, wherein the band-shaped or vine-shaped heating element is folded in a zigzag manner and stored in a case.

請求項4に係る発明は、請求項1に記載のLED暖房装置において、前記シート状の発熱体を巻回してケースに収納することを特徴とする。 The invention according to claim 4 is characterized in that, in the LED heating device according to claim 1, the sheet-shaped heating element is wound and stored in a case.

請求項5に係る発明は、請求項1に記載のLED暖房装置において、前記発熱体の被覆層の表面に複数の凹凸を形成することを特徴とする。 The invention according to claim 5 is characterized in that, in the LED heating device according to claim 1, a plurality of irregularities are formed on the surface of the coating layer of the heating element.

請求項6に係る発明は、請求項1に記載のLED暖房装置において、前記発熱体の被覆層の表面に接触する金属製放熱体を設けることを特徴とする。 The invention according to claim 6 is characterized in that, in the LED heating device according to claim 1, a metal radiator that comes into contact with the surface of the coating layer of the heating element is provided.

請求項7に記載の発明は、請求項1に記載のLED暖房装置において、前記軟質樹脂に透光性樹脂を用いることを特徴とする。 The invention according to claim 7 is characterized in that, in the LED heating device according to claim 1, a translucent resin is used as the soft resin.

請求項8に係る発明は、請求項1に記載のLED暖房装置において、前記発熱体が防水性を有するように前記LEDチップを前記被覆層で被覆したことを特徴とする。 The invention according to claim 8 is characterized in that, in the LED heating device according to claim 1, the LED chip is coated with the coating layer so that the heating element has waterproof property.

請求項9に係る発明は、請求項1に記載のLED暖房装置において、前記ケースを木質材又は樹脂材で構成したことを特徴とする。 The invention according to claim 9 is characterized in that, in the LED heating device according to claim 1, the case is made of a wood material or a resin material.

請求項10に係る発明は、請求項1に記載のLED暖房装置において、前記空気取入口に、空気中の塵埃を補足するフィルタを設けたことを特徴とする。 The invention according to claim 10 is characterized in that, in the LED heating device according to claim 1, a filter for catching dust in the air is provided at the air intake.

請求項11に係る発明は、請求項1に記載のLED暖房装置において、前記ケース内に空気を吸引するファンをケースに内蔵したことを特徴とする。 The invention according to claim 11 is the LED heating device according to claim 1, wherein a fan for sucking air is built in the case.

請求項1に係る発明によれば、発熱体が帯状又はつる状若しくはシート状の形態を有するので、幾重にも曲がりくねらせたり、捻じらせたり、折り曲げたり、巻いたりしてケースに収納できる。そのため、多くのLEDチップをケースに内蔵でき、高い暖房効果を得ることができる。
発熱体を様々な形態にしてケースに収納できるので、ケースの意匠を設計するうえで自由度が高い。そのため様々な意匠のケースを製作できる。
According to the invention of claim 1, since the heating element has a band-shaped, vine-shaped, or sheet-shaped form, it can be stored in a case by being repeatedly bent, twisted, bent, and rolled. .. Therefore, many LED chips can be built in the case, and a high heating effect can be obtained.
Since the heating element can be stored in the case in various forms, there is a high degree of freedom in designing the case design. Therefore, cases with various designs can be manufactured.

請求項2に係る発明によれば、LEDチップの発熱に加えて回路素子の発熱を暖房に利用するので、より高い暖房効果を得ることができる。 According to the invention of claim 2, since the heat generated by the circuit element is used for heating in addition to the heat generated by the LED chip, a higher heating effect can be obtained.

請求項3に係る発明によれば、帯状又はつる状の発熱体を幾重にも曲がりくねり、若しくは、幾重にもねじれたつづら折りにしてケースに収納するので、より多くのLEDチップをケースに内蔵でき、かつケース内の暖められた空気の流れが複雑になり、一層暖房効果を高めることができる。 According to the invention of claim 3, since the band-shaped or vine-shaped heating element is stored in the case by winding it in multiple layers or twisting it in multiple layers, more LED chips can be built in the case. In addition, the flow of warmed air in the case becomes complicated, and the heating effect can be further enhanced.

請求項4に係る発明によれば、シート状の発熱体を巻回してケースに収納するので、より多くのLEDチップをケースに内蔵でき、より一層暖房効果を高めることができる。 According to the invention of claim 4, since the sheet-shaped heating element is wound and stored in the case, more LED chips can be built in the case, and the heating effect can be further enhanced.

請求項5に係る発明によれば、発熱体の被覆層の表面に複数の凹凸を形成するので、発熱体の表面積が大きくなり、発熱体の放熱効果、ひいては暖房効果を高めることができる。 According to the invention of claim 5, since a plurality of irregularities are formed on the surface of the coating layer of the heating element, the surface area of the heating element is increased, and the heat dissipation effect of the heating element and the heating effect can be enhanced.

請求項6に係る発明によれば、発熱体の被覆層の表面に接触する金属製放熱体を設けるので、LEDチップの熱が金属製放熱体に伝わって、放熱作用の高い金属製放熱体から放熱され、暖房効果を高めることができる。 According to the invention of claim 6, since the metal radiator is provided in contact with the surface of the coating layer of the heating element, the heat of the LED chip is transferred to the metal radiator, and the metal radiator having a high heat dissipation effect is used. Heat is dissipated and the heating effect can be enhanced.

請求項7に係る発明によれば、LED暖房装置が作動中であることをケースの空気取入口や空気排出口、隙間などからケースの外に漏れ出るLEDチップの光で視認でき、使い勝手が良い。 According to the invention of claim 7, it is easy to use because it is possible to visually recognize that the LED heating device is operating by the light of the LED chip leaking out of the case from the air inlet, the air outlet, the gap, etc. of the case. ..

請求項8に係る発明によれば、LEDチップを被覆層で被覆して発熱体に防水性を付与するので、発熱体に水分が付着し易い洗面所、シャワー室、浴室等で使用することが可能となる。 According to the invention of claim 8, since the LED chip is coated with a coating layer to impart waterproofness to the heating element, it can be used in a washroom, a shower room, a bathroom, etc. where moisture easily adheres to the heating element. It will be possible.

請求項9に係る発明によれば、LEDチップから成る発熱体は発熱量が低いので、ケースの材質に難燃性材料を使わなくて済み、木質材や樹脂を用いて様々なデザインのケースを製作できる。 According to the invention of claim 9, since the heating element made of the LED chip has a low calorific value, it is not necessary to use a flame-retardant material for the case material, and cases of various designs using wood material or resin can be used. Can be manufactured.

請求項10に係る発明によれば、空気中の塵埃をフィルタで補足するので、暖房効果に加えて空気清浄効果を得ることができる。 According to the invention of claim 10, since the dust in the air is captured by the filter, an air cleaning effect can be obtained in addition to the heating effect.

請求項11に係る発明によれば、ファンで強制的に空気をケースに取り込み、ケース内で温められた空気をケースの外に排出するので、より暖房効果を高めることができる。 According to the invention of claim 11, since the air is forcibly taken into the case by the fan and the air warmed in the case is discharged to the outside of the case, the heating effect can be further enhanced.

本発明の第1実施例に係るLED暖房装置を示す斜視図である。It is a perspective view which shows the LED heating apparatus which concerns on 1st Embodiment of this invention. 本発明の第1実施例に係るLED暖房装置に使用した帯状の発熱体を示す説明図である。It is explanatory drawing which shows the band-shaped heating element used for the LED heating device which concerns on 1st Example of this invention. 図2の3-3線から切断した断面図である。It is sectional drawing which cut from the 3-3 line of FIG. 本発明の第2実施例に係るLED暖房装置を示す斜視図である。It is a perspective view which shows the LED heating apparatus which concerns on 2nd Embodiment of this invention. 本発明の第3実施例に係るLED暖房装置を示す斜視図である。It is a perspective view which shows the LED heating apparatus which concerns on 3rd Example of this invention. 本発明の第4実施例に係るLED暖房装置値に使用する帯状の発熱体を示す説明図である。It is explanatory drawing which shows the band-shaped heating element used for the LED heating apparatus value which concerns on 4th Embodiment of this invention. 本発明の第5実施例に係るLED暖房装置に使用する帯状の発熱体を示す説明図である。It is explanatory drawing which shows the band-shaped heating element used for the LED heating apparatus which concerns on 5th Embodiment of this invention. 本発明の第6実施例に係るLED暖房装置を示す斜視図である。It is a perspective view which shows the LED heating apparatus which concerns on 6th Embodiment of this invention. 本発明の第6実施例に係るLED暖房装置に使用したシート状の発熱体を示す説明図である。It is explanatory drawing which shows the sheet-shaped heating element used for the LED heating apparatus which concerns on 6th Embodiment of this invention.

以下に本発明を図面に基づき説明する。図1には本発明の第1実施例に係るLED暖房装置10が示されている。当該LED暖房装置10は木質材から成るケース11を備えている。このケース11の側面の下部には空気取入口11aが形成され、ケース11の上端面は空気排出口11bとして開放されている。ケース11には帯状の発熱体12が幾重にも曲がりくねったり、若しくは、幾重にもねじれたりしたつづら折りにして収納されている。 The present invention will be described below with reference to the drawings. FIG. 1 shows the LED heating device 10 according to the first embodiment of the present invention. The LED heating device 10 includes a case 11 made of a wood material. An air intake port 11a is formed in the lower part of the side surface of the case 11, and the upper end surface of the case 11 is opened as an air discharge port 11b. In the case 11, a strip-shaped heating element 12 is stored in a zigzag fold that is twisted or twisted many times.

図2及び図3に拡大して示すように、帯状の発熱体12は複数個のLEDチップ12aを実装したフレキシブルプリント配線基板12bを備えている。複数個のLEDチップ12aは、フレキシブルプリント配線基板12bの長手方向に沿って配置され、一列のLEDチップ12aの列を形成している。家庭用の交流電源を直流に変換し、各LEDチップ12aに所要の電力を供給し、LEDチップ12aの点灯を制御する電源回路12cが電源コード12dを介してフレキシブルプリント配線基板12bに接続されている。 As shown enlarged in FIGS. 2 and 3, the strip-shaped heating element 12 includes a flexible printed wiring board 12b on which a plurality of LED chips 12a are mounted. The plurality of LED chips 12a are arranged along the longitudinal direction of the flexible printed wiring board 12b to form a row of LED chips 12a. A power supply circuit 12c that converts household AC power to direct current, supplies required power to each LED chip 12a, and controls lighting of the LED chip 12a is connected to a flexible printed wiring board 12b via a power cord 12d. There is.

フレキシブルプリント配線基板12bの表裏両面は、同基板12bに実装されたLEDチップ12aを含めて熱可塑性の透明な軟質ポリ塩化ビニル樹脂から成る被覆層12eで被覆されている。この被覆層12eは、電源コード12dとフレキシブルプリント配線基板12bとの接続部分、すなわち、電源コード12dの先端部分のビニル絶縁体から露出した電線12fがフレキシブルプリント配線基板12bのプリント配線12gに半田付けされている部分12hも被覆している。電源コード12dは元来防水性を有し、またフレキシブルプリント配線基板12bとLEDチップ12aの列が、同基板12bと電源コード12dとの接続部分を含めて被覆層12eで被覆されているので、帯状の発熱体12は防水性を有する。 Both the front and back surfaces of the flexible printed wiring board 12b are covered with a coating layer 12e made of a thermoplastic transparent soft polyvinyl chloride resin including the LED chip 12a mounted on the substrate 12b. In the coating layer 12e, the connection portion between the power cord 12d and the flexible printed wiring board 12b, that is, the electric wire 12f exposed from the vinyl insulator at the tip of the power cord 12d is soldered to the printed wiring 12g of the flexible printed wiring board 12b. The portion 12h that is covered is also covered. The power cord 12d is originally waterproof, and the row of the flexible printed wiring board 12b and the LED chip 12a is covered with the coating layer 12e including the connection portion between the substrate 12b and the power cord 12d. The band-shaped heating element 12 is waterproof.

第1実施例に係るLED暖房装置10の構成は以上の通りであって、帯状の発熱体12に通電するとLEDチップ12aが発光し、発光に伴う発熱でケース11内の空気が温められる。暖められた空気は空気排出口11bからケース11の外に排出されるとともに、空気取入口11aから空気がケース11内に流入する。 The configuration of the LED heating device 10 according to the first embodiment is as described above. When the band-shaped heating element 12 is energized, the LED chip 12a emits light, and the heat generated by the light emission warms the air in the case 11. The warmed air is discharged from the air discharge port 11b to the outside of the case 11, and the air flows into the case 11 from the air intake port 11a.

第1実施例に係るLED暖房装置10によれば、発熱体12が帯状の形態を有するので、幾重にも曲がりくねらせたり、折り曲げたり、巻いたりしてケース11に収納できる。そのため、多くのLEDチップ12aをケース11に内蔵できるうえに、ケース11内の暖められた空気の流れが複雑になり、高い暖房効果を得ることができる。 According to the LED heating device 10 according to the first embodiment, since the heating element 12 has a band-like shape, it can be stored in the case 11 by being bent, bent, and rolled many times. Therefore, many LED chips 12a can be built in the case 11, and the flow of warmed air in the case 11 becomes complicated, so that a high heating effect can be obtained.

発熱体12を様々な形態にしてケース11に収納できるので、ケース11の意匠を設計するうえで自由度が高い。そのため様々な意匠のケース11を製作できる。とりわけ、LEDチップ12aから成る発熱体12は発熱量が低いので、ケース11の材質に難燃性材料を使わなくて済み、木質材や樹脂を用いて様々なデザインのケース11を製作できる。 Since the heating element 12 can be stored in the case 11 in various forms, there is a high degree of freedom in designing the design of the case 11. Therefore, cases 11 having various designs can be manufactured. In particular, since the heating element 12 made of the LED chip 12a has a low calorific value, it is not necessary to use a flame-retardant material as the material of the case 11, and the case 11 having various designs can be manufactured by using a wood material or a resin.

LED暖房装置10が作動中であることをケース11の空気取入口11aや空気排出口11bからケース11の外に漏れ出るLEDチップ12aの光で視認でき、使い勝手が良い。 The fact that the LED heating device 10 is operating can be visually recognized by the light of the LED chip 12a leaking out of the case 11 from the air inlet 11a and the air outlet 11b of the case 11, which is convenient.

LEDチップ12aを被覆層12eで被覆して発熱体12に防水性を付与しているので、発熱体12に水分が付着し易い洗面所、シャワー室、浴室等で使用することが可能となる。 Since the LED chip 12a is coated with the coating layer 12e to impart waterproofness to the heating element 12, it can be used in a washroom, a shower room, a bathroom, etc. where moisture easily adheres to the heating element 12.

本発明の第2実施例に係るLED暖房装置20を図4に示す。当該LED暖房装置20はプラスチック成型品のケース21を備え、ケース21の側面下部にもうけた空気取入口21aにはフィルタ21bが取り付けられている。また、ケース21の空気排出口21cの直下にファン21dが内設され、空気排出口21cにルーバ21eが取り付けられている。そして、ケース21には帯状の発熱体12がつづら折にして収納されている。 The LED heating device 20 according to the second embodiment of the present invention is shown in FIG. The LED heating device 20 includes a case 21 made of a plastic molded product, and a filter 21b is attached to an air intake 21a provided at the lower side surface of the case 21. Further, a fan 21d is internally provided directly below the air discharge port 21c of the case 21, and a louver 21e is attached to the air discharge port 21c. The band-shaped heating element 12 is stored in the case 21 in a zigzag manner.

第2実施例に係るLED暖房装置20の構成は以上の通りであって、空気中の塵埃をフィルタ21bで補足できるので、暖房効果に加えて空気清浄効果を得ることができる。また、ファン21dで強制的に空気をケース21に取り込み、ケース21内で温められた空気をケース21の外に排出できるので、より暖房効果を高めることができる。 The configuration of the LED heating device 20 according to the second embodiment is as described above, and since the dust in the air can be captured by the filter 21b, an air cleaning effect can be obtained in addition to the heating effect. Further, since the fan 21d forcibly takes in the air into the case 21 and discharges the air warmed in the case 21 to the outside of the case 21, the heating effect can be further enhanced.

本発明の第3実施例に係るLED暖房装置を図5に示す。当該LED暖房装置30は陶器製のケース31を備え、ケース31の側面下部に空気取入口31aが設けられ、ケース31の上端面が空気排出口31bとして開放されている。そして、ケース31には帯状の発熱体12が螺旋状に巻回して収納されている。 The LED heating device according to the third embodiment of the present invention is shown in FIG. The LED heating device 30 includes a case 31 made of earthenware, an air intake 31a is provided in the lower part of the side surface of the case 31, and the upper end surface of the case 31 is opened as an air discharge port 31b. A band-shaped heating element 12 is spirally wound and stored in the case 31.

本発明の第4実施例に係るLED暖房装置のケースに内蔵される帯状の発熱体40を図6に示す。当該発熱体40の被覆層40aの表面には多数本の凸条40bがその長手方向に沿って形成されている。
なお、他の構成は前述した帯状発熱体12と同じであるので、同一の構成要素に同一の符号を付して説明を省略する。
FIG. 6 shows a band-shaped heating element 40 built in the case of the LED heating device according to the fourth embodiment of the present invention. A large number of ridges 40b are formed along the longitudinal direction on the surface of the coating layer 40a of the heating element 40.
Since the other configurations are the same as those of the band-shaped heating element 12 described above, the same components are designated by the same reference numerals and the description thereof will be omitted.

本実施例に係るLED暖房装置によれば、帯状の発熱体40の被覆層40aの表面に複数本の凸条40bを形成するので、発熱体40の表面積が大きくなり、発熱体40の放熱効果、ひいては暖房効果を高めることができる。 According to the LED heating device according to the present embodiment, since a plurality of ridges 40b are formed on the surface of the coating layer 40a of the band-shaped heating element 40, the surface area of the heating element 40 becomes large, and the heat dissipation effect of the heating element 40 becomes large. As a result, the heating effect can be enhanced.

本発明の第5実施例に係るLED暖房装置のケースに内蔵される帯状の発熱体41を図7に示す。当該発熱体41の被覆層12eの表面に金属製の放熱体シート41aが接着されている。この放熱体シート41aは被覆層12eの長手方向に延びている。
なお、他の構成は前述した帯状発熱体12と同じであるので、同一の構成要素に同一の符号を付して説明を省略する。
FIG. 7 shows a band-shaped heating element 41 built in the case of the LED heating device according to the fifth embodiment of the present invention. A metal radiator sheet 41a is adhered to the surface of the coating layer 12e of the heating element 41. The heat radiating body sheet 41a extends in the longitudinal direction of the coating layer 12e.
Since the other configurations are the same as those of the band-shaped heating element 12 described above, the same components are designated by the same reference numerals and the description thereof will be omitted.

本実施例に係るLED暖房装置によれば、発熱体41の被覆層12eの表面に放熱体シート41aを接着したので、LEDチップ12aの熱が金属製の放熱体シート41aに伝わり、放熱作用の高い金属製の放熱体シート41aから放熱され、暖房効果を高めることができる。 According to the LED heating device according to the present embodiment, since the heat radiating body sheet 41a is adhered to the surface of the coating layer 12e of the heating element 41, the heat of the LED chip 12a is transferred to the metal heat radiating body sheet 41a, and the heat radiating action is performed. Heat is dissipated from the high metal radiator sheet 41a, and the heating effect can be enhanced.

上記した第1〜第5実施例に係るLED暖房装置10,20,30では発熱体12,40,41を扁平な帯状に成形したが、断面形状が円形に近いつる状に成形することもできる。 In the LED heating devices 10, 20 and 30 according to the first to fifth embodiments described above, the heating elements 12, 40 and 41 are formed into a flat strip shape, but the heating elements 12, 40 and 41 can also be formed into a vine shape having a cross-sectional shape close to a circle. ..

本発明の第6実施例に係るLED暖房装置50を図8に示す。当該LED暖房装置50は陶器製のケース51を備え、ケース51の側面下部に空気取入口51aが設けられ、ケース51の上端面が空気排出口51bとして開放されている。そして、ケース51にはシート状の発熱体52が巻回して収納されている。 The LED heating device 50 according to the sixth embodiment of the present invention is shown in FIG. The LED heating device 50 includes a case 51 made of earthenware, an air intake port 51a is provided in the lower part of the side surface of the case 51, and the upper end surface of the case 51 is opened as an air discharge port 51b. A sheet-shaped heating element 52 is wound and stored in the case 51.

図9にシート状の発熱体52の詳細を部分的に示す。当該シート状の発熱体52は複数個のLEDチップ52aを実装したフレキシブルプリント配線基板52bを備えている。
複数個のLEDチップ52aはフレキシブルプリント配線基板上52bに縦及び横方向に並べられて、面状の発光面を形成している。また、過電流によってLEDチップ52aが損傷するのを防止するためチップ抵抗器52kがLEDチップ52aの点灯回路に設けられている。家庭用の交流電源を直流に変換し、各LEDチップ52aに所要の電力を供給し、LEDチップ52aの点灯を制御する電源回路52cが電源コード52dを介してフレキシブルプリント配線基板52bに接続されている。
FIG. 9 partially shows the details of the sheet-shaped heating element 52. The sheet-shaped heating element 52 includes a flexible printed wiring board 52b on which a plurality of LED chips 52a are mounted.
The plurality of LED chips 52a are arranged vertically and horizontally on the flexible printed wiring substrate 52b to form a planar light emitting surface. Further, a chip resistor 52k is provided in the lighting circuit of the LED chip 52a in order to prevent the LED chip 52a from being damaged by an overcurrent. A power supply circuit 52c that converts household AC power to direct current, supplies required power to each LED chip 52a, and controls lighting of the LED chip 52a is connected to a flexible printed wiring board 52b via a power cord 52d. There is.

フレキシブルプリント配線基板52bの表裏両面は、同基板52bに実装されたLEDチップ52aとチップ抵抗器52kを含めて熱可塑性の透明な軟質ポリ塩化ビニル樹脂から成る被覆層52eで被覆されている。この被覆層52eは、電源コード52dとフレキシブルプリント配線基板52bとの接続部分、すなわち、電源コード52dの先端部分のビニル絶縁体から露出した電線52fがフレキシブルプリント配線基板52bのプリント配線52gに半田付けされている部分52hも被覆しているので、シート状の発熱体52は防水性を有する。 Both the front and back surfaces of the flexible printed wiring board 52b are covered with a coating layer 52e made of a thermoplastic transparent soft polyvinyl chloride resin including the LED chip 52a and the chip resistor 52k mounted on the substrate 52b. In the coating layer 52e, the connection portion between the power cord 52d and the flexible printed wiring board 52b, that is, the electric wire 52f exposed from the vinyl insulator at the tip of the power cord 52d is soldered to the printed wiring 52g of the flexible printed wiring board 52b. Since the portion 52h is also covered, the sheet-shaped heating element 52 is waterproof.

第6実施例に係るLED暖房装置50の構造は以上の通りであって、シート状の発熱体52を巻回してケース51に収納するので、より多くのLEDチップ52aをケース51に内蔵でき、高い暖房効果を得ることができる。
なお、本実施例では、LEDチップ52aとともに、チップ抵抗器52kを被覆層52eで被覆したが、LEDチップ52aの点灯回路を構成する集積回路やトランジスタ等、他の回路素子も被覆層52eで被覆してそれらの発熱を暖房に利用することもできる。
また、LEDチップ52aを縦横に規則正しく並べたが、不規則に並べて面状の発光面を形成することもできる。
The structure of the LED heating device 50 according to the sixth embodiment is as described above, and since the sheet-shaped heating element 52 is wound and stored in the case 51, more LED chips 52a can be built in the case 51. A high heating effect can be obtained.
In this embodiment, the chip resistor 52k is covered with the coating layer 52e together with the LED chip 52a, but other circuit elements such as integrated circuits and transistors constituting the lighting circuit of the LED chip 52a are also covered with the coating layer 52e. Then, those heat generations can be used for heating.
Further, although the LED chips 52a are regularly arranged vertically and horizontally, it is also possible to arrange them irregularly to form a planar light emitting surface.

10…LED暖房装置
11…ケース
11a…空気取入口
11b…空気排出口
12…帯状の発熱体
12a…LEDチップ
12b…フレキシブルプリント配線基板
12e…被覆層
20…LED暖房装置
21…ケース
21a…空気取入口
21b…フィルタ
21c…空気排出口
21d…ファン
30…LED暖房装置
31…ケース
31a…空気取入口
31b…空気排出口
40…帯状の発熱体
40a…被覆層
40b…凸条
41…帯状の発熱体
41a…金属製の放熱体シート
50…LED暖房装置
51…ケース
51a…空気取入口
51b…空気排出口
52…シート状の発熱体
52a…LEDチップ
52b…フレキシブルプリント配線基板
52e…被覆層
52k…チップ抵抗器
10 ... LED heating device 11 ... Case 11a ... Air intake 11b ... Air outlet 12 ... Band-shaped heating element 12a ... LED chip 12b ... Flexible printed wiring board 12e ... Coating layer 20 ... LED heating device 21 ... Case 21a ... Air intake Inlet 21b ... Filter 21c ... Air outlet 21d ... Fan 30 ... LED heating device 31 ... Case 31a ... Air intake 31b ... Air outlet 40 ... Band-shaped heating element 40a ... Coating layer 40b ... Convex 41 ... Band-shaped heating element 41a ... Metal heating element sheet 50 ... LED heating device 51 ... Case 51a ... Air intake 51b ... Air outlet 52 ... Sheet-shaped heating element 52a ... LED chip 52b ... Flexible printed wiring board 52e ... Coating layer 52k ... Chip Resistor

Claims (11)

空気取入口と空気排出口を形成したケースに、複数個のLEDチップを基板上に並べて軟質樹脂製又は合成ゴム製の被覆層で被覆した帯状又はつる状若しくはシート状の発熱体を内蔵し、空気取入口からケース内に流入した空気をLEDチップの発光に伴う発熱で暖め、温めた空気が空気排出口からケース外部に流出するようにしたことを特徴とするLED暖房装置。 A band-shaped, vine-shaped, or sheet-shaped heating element in which a plurality of LED chips are arranged on a substrate and coated with a coating layer made of soft resin or synthetic rubber is built in a case having an air inlet and an air outlet. An LED heating device characterized in that the air flowing into the case from the air intake is warmed by the heat generated by the light emission of the LED chip, and the warmed air flows out from the air outlet to the outside of the case. 前記LEDチップとともに該LEDチップの点灯回路に含まれる回路素子を前記被覆層で被覆し、回路素子の発熱を暖房に利用することを特徴とする請求項1に記載のLED暖房装置。 The LED heating device according to claim 1, wherein the circuit element included in the lighting circuit of the LED chip is covered with the coating layer together with the LED chip, and the heat generated by the circuit element is used for heating. 前記帯状又はつる状の発熱体をつづら折にしてケースに収納することを特徴とする請求項1に記載のLED暖房装置。 The LED heating device according to claim 1, wherein the band-shaped or vine-shaped heating element is folded in a zigzag manner and stored in a case. 前記シート状の発熱体を巻回してケースに収納することを特徴とする請求項1に記載のLED暖房装置。 The LED heating device according to claim 1, wherein the sheet-shaped heating element is wound and stored in a case. 前記発熱体の被覆層の表面に複数の凹凸を形成することを特徴とする請求項1に記載のLED暖房装置。 The LED heating device according to claim 1, wherein a plurality of irregularities are formed on the surface of the coating layer of the heating element. 前記発熱体の被覆層の表面に接触する金属製放熱体を設けることを特徴とする請求項1に記載のLED暖房装置。 The LED heating device according to claim 1, wherein a metal radiator that comes into contact with the surface of the coating layer of the heating element is provided. 前記軟質樹脂に透光性樹脂を用いることを特徴とする請求項1に記載のLED暖房装置。 The LED heating device according to claim 1, wherein a translucent resin is used as the soft resin. 前記発熱体が防水性を有するように前記LEDチップを前記被覆層で被覆したことを特徴とする請求項1に記載のLED暖房装置。 The LED heating device according to claim 1, wherein the LED chip is coated with the coating layer so that the heating element has waterproof property. 前記ケースを木質材又は樹脂材で構成したことを特徴とする請求項1に記載のLED暖房装置。 The LED heating device according to claim 1, wherein the case is made of a wood material or a resin material. 前記空気取入口に、空気中の塵埃を補足するフィルタを設けたことを特徴とする請求項1に記載のLED暖房装置。 The LED heating device according to claim 1, wherein a filter for catching dust in the air is provided at the air intake. 前記ケース内に空気を吸引するファンをケースに内蔵したことを特徴とする請求項1に記載のLED暖房装置。 The LED heating device according to claim 1, wherein a fan for sucking air is built in the case.
JP2019041103A 2019-03-07 2019-03-07 LED heating device Pending JP2020143848A (en)

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