JP2020136556A - Power storage unit - Google Patents

Power storage unit Download PDF

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JP2020136556A
JP2020136556A JP2019030211A JP2019030211A JP2020136556A JP 2020136556 A JP2020136556 A JP 2020136556A JP 2019030211 A JP2019030211 A JP 2019030211A JP 2019030211 A JP2019030211 A JP 2019030211A JP 2020136556 A JP2020136556 A JP 2020136556A
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Prior art keywords
power storage
substrate
storage element
pair
lead portions
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拓也 大田
Takuya Ota
拓也 大田
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Sumitomo Wiring Systems Ltd
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Sumitomo Wiring Systems Ltd
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Priority to JP2019030211A priority Critical patent/JP2020136556A/en
Priority to PCT/JP2020/003850 priority patent/WO2020170777A1/en
Publication of JP2020136556A publication Critical patent/JP2020136556A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/204—Racks, modules or packs for multiple batteries or multiple cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/10—Multiple hybrid or EDL capacitors, e.g. arrays or modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/74—Terminals, e.g. extensions of current collectors
    • H01G11/76—Terminals, e.g. extensions of current collectors specially adapted for integration in multiple or stacked hybrid or EDL capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G15/00—Structural combinations of capacitors or other devices covered by at least two different main groups of this subclass with each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G17/00—Structural combinations of capacitors or other devices covered by at least two different main groups of this subclass with other electric elements, not covered by this subclass, e.g. RC combinations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/218—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by the material
    • H01M50/22—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by the material of the casings or racks
    • H01M50/222—Inorganic material
    • H01M50/224—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/218—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by the material
    • H01M50/22—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by the material of the casings or racks
    • H01M50/227—Organic material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Abstract

To miniaturize a power storage unit by increasing a packaging density of components.SOLUTION: A power storage unit 10 includes: a substrate 21 that has an electrically conducting path 23; electronic components 31 and 32 that are mounted on the electrically conducting path 23 of the substrate 21; a power storage body 41 in which a power storage element is accommodated; and a plurality of power storage devices 40A and 40C that have each a pair of lead portions 42A and 42B which are led out from one side of the power storage body 41 and are connected to the electrically conducting path of the substrate 21. The plurality of power storage devices 40A and 40C include: the first power storage device 40A in which the pair of lead portions 42A and 42B are connected to the electrically conducting path on one edge side of the substrate 21; and the second power storage device 40C in which a side on which the pair of lead portions 42A and 42B are provided to the power storage body 41 is a side opposite to the first power storage device 40A, and the pair of lead portions 42A and 42B are connected to the electrically conducting path on an edge side opposite to the one edge side of the substrate 21.SELECTED DRAWING: Figure 3

Description

本明細書では、蓄電ユニットに関する技術を開示する。 This specification discloses a technique relating to a power storage unit.

従来、複数の蓄電素子を備える蓄電ユニットが知られている。特許文献１は、複数の蓄電装置が並設された状態で接続部材により電気的に接続されるとともに、複数の蓄電装置がホルダーに支持された状態で台座に取り付けられている。台座上における複数の蓄電装置とは異なる位置には、制御基板が配されている。 Conventionally, a power storage unit including a plurality of power storage elements is known. In Patent Document 1, a plurality of power storage devices are electrically connected by a connecting member in a state of being arranged side by side, and the plurality of power storage devices are attached to a pedestal in a state of being supported by a holder. A control board is arranged on the pedestal at a position different from that of the plurality of power storage devices.

特開２０１４−２２９７２５号公報Japanese Unexamined Patent Publication No. 2014-229725

ところで、上記した構成では、台座上に並んで配された複数の蓄電装置がホルダーに保持された状態で密集して配置されている。このような蓄電装置を台座上に密集して配置する構成では、台座上に基板や電子部品を搭載できるスペースが少なくなり、電子部品の実装密度を高めてユニットを小型化することが容易ではないという問題がある。 By the way, in the above-described configuration, a plurality of power storage devices arranged side by side on the pedestal are densely arranged in a state of being held by the holder. In such a configuration in which the power storage devices are densely arranged on the pedestal, the space on which the substrate and electronic components can be mounted is reduced, and it is not easy to increase the mounting density of the electronic components and reduce the size of the unit. There is a problem.

本明細書に記載された技術は、上記のような事情に基づいて完成されたものであって、部品の実装密度を高めてユニットを小型化することを目的とする。 The technique described in this specification has been completed based on the above circumstances, and an object thereof is to increase the mounting density of parts and to reduce the size of the unit.

本明細書に記載された蓄電ユニットは、導電路を有する基板と、前記基板の導電路に実装される電子部品と、蓄電要素が収容された蓄電本体と前記蓄電本体の一方の側から導出されて前記基板の導電路に接続される一対のリード部とを有する複数の蓄電素子と、を備え、前記複数の蓄電素子は、前記基板の一方の縁部側の導電路に前記一対のリード部が接続される第１の蓄電素子と、前記蓄電本体に対して前記一対のリード部が配される側が前記第１の蓄電素子とは反対側とされ、前記基板の前記一方とは反対の縁部側の導電路に前記一対のリード部が接続される第２の蓄電素子とを含む。
上記構成によれば、電子部品の実装を行うことが容易ではない基板の縁部側を蓄電素子の接続に利用することにより、基板における縁部の内側の領域を蓄電素子の接続のために使用しなくてもよいため、基板における電子部品の実装領域を大きくすることが可能になる。これにより、部品の実装密度を高めることができ、蓄電ユニットを小型化することが可能になる。 The power storage unit described in the present specification is derived from one side of a substrate having a conductive path, an electronic component mounted on the conductive path of the substrate, a power storage body containing a power storage element, and the power storage body. The plurality of power storage elements are provided with a pair of lead portions connected to the conductive path of the substrate, and the plurality of power storage elements are provided with the pair of lead portions on the conductive path on one edge side of the substrate. The side to which the first power storage element to which is connected and the pair of lead portions are arranged with respect to the power storage body is the side opposite to the first power storage element, and the edge opposite to the one of the substrate. A second power storage element in which the pair of lead portions are connected to a conductive path on the portion side is included.
According to the above configuration, by using the edge side of the substrate, which is not easy to mount electronic components, for connecting the power storage element, the area inside the edge of the board is used for connecting the power storage element. Since it is not necessary to do so, it is possible to increase the mounting area of electronic components on the substrate. As a result, the mounting density of parts can be increased, and the power storage unit can be miniaturized.

本明細書に記載された技術の実施態様としては以下の態様が好ましい。
前記複数の蓄電素子は、前記蓄電本体に対して前記一対のリード部が導出される第３の蓄電素子を含み、前記第３の蓄電素子は、前記第１の蓄電素子と前記第２の蓄電素子との間に配され、前記第３の蓄電素子の前記一対のリード部は、前記基板における前記一方の縁部及び前記反対の縁部とは異なる縁部側に接続される。
このようにすれば、第１の蓄電素子及び第２の蓄電素子に加えて、第３の蓄電素子を基板に接続する場合であっても、電子部品の実装領域を確保することができる。よって、より一層、部品の実装密度を高めることができ、蓄電ユニットを小型化することが可能になる。 The following embodiments are preferred as embodiments of the techniques described herein.
The plurality of power storage elements include a third power storage element from which the pair of lead portions are led out to the power storage body, and the third power storage element includes the first power storage element and the second power storage element. The pair of lead portions of the third power storage element, which are arranged between the elements, are connected to an edge portion of the substrate different from the one edge portion and the opposite edge portion.
In this way, even when the third power storage element is connected to the substrate in addition to the first power storage element and the second power storage element, the mounting area of the electronic component can be secured. Therefore, the mounting density of parts can be further increased, and the power storage unit can be miniaturized.

前記基板における前記第１の蓄電素子と前記第２の蓄電素子とが配される領域の内側に前記電子部品が実装されている。
このようにすれば、第１の蓄電素子と第２の蓄電素子とが配置されない領域に電子部品を実装することができるため、電子部品の実装密度を高めることができる。 The electronic component is mounted inside the region of the substrate on which the first power storage element and the second power storage element are arranged.
By doing so, the electronic component can be mounted in the region where the first power storage element and the second power storage element are not arranged, so that the mounting density of the electronic component can be increased.

複数の前記電子部品を備え、複数の前記電子部品は、低背部品と、前記低背部品よりも前記基板に対する高さ寸法が大きい高背部品とを有し、前記第１の蓄電素子と前記第２の蓄電素子とが配される領域の内側に前記高背部品が実装されている。
このようにすれば、蓄電素子の高さ寸法に応じた空きスペースを高背部品の実装のために利用することができるため、電子部品の実装密度を高めることができる。 The plurality of electronic components are provided, and the plurality of electronic components include a low-profile component and a high-profile component having a height dimension larger than that of the low-profile component with respect to the substrate, and the first power storage element and the said. The tall component is mounted inside the region where the second power storage element is arranged.
In this way, the empty space corresponding to the height dimension of the power storage element can be used for mounting the tall component, so that the mounting density of the electronic component can be increased.

前記基板に対して前記蓄電素子が配される側とは反対側の面には、前記低背部品が実装されている。
このようにすれば、高さ寸法のスペースが少ない側を有効に利用して基板に低背部品を実装することができるため、電子部品の実装密度を高めることができる。 The low-profile component is mounted on a surface of the substrate opposite to the side on which the power storage element is arranged.
By doing so, the low-profile component can be mounted on the substrate by effectively utilizing the side having a small space in the height dimension, so that the mounting density of the electronic component can be increased.

前記基板と複数の前記電子部品とは、電力変換装置を構成している。
このようにすれば、蓄電ユニットが多くの電子部品が必要とされる電力変換装置を備えることで大型化しやすい構成であっても、複数の蓄電素子の配置によって蓄電ユニットを小型化することができる。 The substrate and the plurality of electronic components form a power conversion device.
In this way, even if the power storage unit is provided with a power conversion device that requires many electronic components and is likely to be large in size, the power storage unit can be miniaturized by arranging a plurality of power storage elements. ..

本明細書に記載された技術によれば、部品の実装密度を高めてユニットを小型化することが可能になる。 According to the techniques described herein, it is possible to increase the mounting density of components and reduce the size of the unit.

蓄電ユニットを示す斜視図Perspective view showing the power storage unit 蓄電ユニットを示す平面図Top view showing the power storage unit 図２のＡ−Ａ断面図AA sectional view of FIG. 蓄電ユニットのアッパーケースを外した状態を示す平面図Top view showing the state where the upper case of the power storage unit is removed 図４のＢ−Ｂ断面図BB sectional view of FIG.

＜実施形態１＞
以下、実施形態１について、図１〜図５を参照しつつ説明する。
本実施形態の蓄電ユニット１０（図１）は、例えば、電気自動車やハイブリッド自動車等の車両に搭載され、車両の補助電源として使用することができる。以下では、図１のＸ方向を前方、Ｙ方向を左方、Ｚ方向を上方として説明する。 <Embodiment 1>
Hereinafter, the first embodiment will be described with reference to FIGS. 1 to 5.
The power storage unit 10 (FIG. 1) of the present embodiment can be mounted on a vehicle such as an electric vehicle or a hybrid vehicle and can be used as an auxiliary power source for the vehicle. Hereinafter, the X direction in FIG. 1 will be described as forward, the Y direction as left, and the Z direction as upward.

蓄電ユニット１０は、図３に示すように、ケース１１と、ケース１１に収容されるユニット本体２０とを備える。ケース１１は、合成樹脂製又は金属製とされ、共に一方が開口する箱形のアッパーケース１２とロアケース１３とを嵌め合わせて構成される。 As shown in FIG. 3, the power storage unit 10 includes a case 11 and a unit main body 20 housed in the case 11. The case 11 is made of synthetic resin or metal, and is configured by fitting a box-shaped upper case 12 and a lower case 13 both of which are open.

ユニット本体２０は、基板２１と、基板２１の導電路２３に実装される電子部品３１，３２と、基板２１に搭載される複数（本実施形態では９個）の蓄電素子４０Ａ〜４０Ｃとを備える。基板２１は、長方形の板状であって、絶縁板に導電路２３がプリント配線技術により形成されている。導電路２３は、基板２１の両面に形成されている。基板２１の下面（一方の面）は、複数の電子部品３１が実装される部品実装領域３６Ａを有し、この部品実装領域３６Ａの下方側は、複数の電子部品３１が配される部品実装空間３６とされている。基板２１の上面（他方の面）は、電子部品３２が実装される部品実装領域３７Ａを有し、この部品実装領域３７Ａの上方側は、複数の電子部品３２が配される部品実装空間３７とされている。 The unit main body 20 includes a substrate 21, electronic components 31 and 32 mounted on the conductive path 23 of the substrate 21, and a plurality of (nine in this embodiment) power storage elements 40A to 40C mounted on the substrate 21. .. The substrate 21 has a rectangular plate shape, and a conductive path 23 is formed on an insulating plate by a printed wiring technique. The conductive paths 23 are formed on both sides of the substrate 21. The lower surface (one surface) of the board 21 has a component mounting area 36A on which a plurality of electronic components 31 are mounted, and the lower side of the component mounting area 36A is a component mounting space in which the plurality of electronic components 31 are arranged. It is said to be 36. The upper surface (the other surface) of the board 21 has a component mounting area 37A on which the electronic component 32 is mounted, and the upper side of the component mounting area 37A is a component mounting space 37 in which a plurality of electronic components 32 are arranged. Has been done.

部品実装領域３７Ａは、基板２１の上面における複数の蓄電素子４０Ａ〜４０Ｃに包囲された長方形状の範囲に設けられている。部品実装領域３７Ａの外側は、複数の蓄電素子４０Ａ〜４０Ｃが搭載される蓄電搭載領域３５Ａとされている。蓄電搭載領域３５Ａは、図４に示すように、基板２１の外周の四辺２２Ａ〜２２Ｄのうちの三辺２２Ａ〜２２Ｃから所定の範囲（所定寸法内側）に設けられている。なお、コネクタ２７が装着される一辺２２Ｄ側については、蓄電素子４０Ａ〜４０Ｃが並んで搭載されないため、蓄電搭載領域３５Ａが設けられていない。 The component mounting area 37A is provided in a rectangular area surrounded by a plurality of power storage elements 40A to 40C on the upper surface of the substrate 21. The outside of the component mounting area 37A is a power storage mounting area 35A on which a plurality of power storage elements 40A to 40C are mounted. As shown in FIG. 4, the electricity storage mounting area 35A is provided in a predetermined range (inside a predetermined dimension) from the three sides 22A to 22C of the four sides 22A to 22D on the outer circumference of the substrate 21. Since the power storage elements 40A to 40C are not mounted side by side on the side 22D on which the connector 27 is mounted, the power storage mounting area 35A is not provided.

基板２１には、図３に示すように、複数のスルーホール２４が貫通形成されている。複数のスルーホール２４は、蓄電素子４０Ａのリード部４２Ａ，４２Ｂを接続するために、蓄電搭載領域３５Ａに設けられている。複数のスルーホール２４は、基板２１の三辺２２Ａ〜２２Ｃに沿うように(三辺２２Ａ〜２２Ｃの所定寸法内側に）、蓄電素子４０Ａに応じて一対ずつ間隔を空けて配置されている。なお、スルーホール２４は、基板２１における部品実装領域やコネクタ２７側にも設けられているが、図３等ではスルーホール２４は省略されている。なお、基板２１は、プリント基板のみに限られず、例えば、プリント基板に銅、銅合金等の金属板材からなるバスバーを重ねて基板を構成してもよい。基板２１の４つの角部には、ネジ孔が貫通形成されており、図４，図５に示すように、ロアケース１３の底面から突出するボス部１４に対してネジ２５の軸部を通してネジ留めされる。 As shown in FIG. 3, a plurality of through holes 24 are formed through the substrate 21. The plurality of through holes 24 are provided in the power storage mounting area 35A in order to connect the lead portions 42A and 42B of the power storage element 40A. The plurality of through holes 24 are arranged at intervals of one pair according to the power storage element 40A so as to be along the three sides 22A to 22C of the substrate 21 (inside the predetermined dimensions of the three sides 22A to 22C). The through holes 24 are also provided in the component mounting area on the board 21 and on the connector 27 side, but the through holes 24 are omitted in FIGS. 3 and the like. The substrate 21 is not limited to the printed circuit board, and for example, the substrate may be formed by superimposing a bus bar made of a metal plate material such as copper or a copper alloy on the printed circuit board. Screw holes are formed through the four corners of the substrate 21, and as shown in FIGS. 4 and 5, the boss portion 14 protruding from the bottom surface of the lower case 13 is screwed through the shaft portion of the screw 25. Will be done.

基板２１の前端部には、コネクタ２７が固定されている。コネクタ２７は、フード状に開口するハウジング２７Ａと、ハウジング２７Ａに固定されるコネクタ端子（不図示）とを備える。コネクタ端子は、基板２１のランドに半田付けされて導電路２３に接続されている。 A connector 27 is fixed to the front end of the substrate 21. The connector 27 includes a housing 27A that opens like a hood, and a connector terminal (not shown) fixed to the housing 27A. The connector terminal is soldered to the land of the substrate 21 and connected to the conductive path 23.

複数の電子部品３１，３２は、基板２１の上下両面の導電路２３に実装されており、基板２１の下面側には、低背部品３１が実装され、基板２１の上面側には、低背部品３１よりも背の高い（上下方向の高さ寸法の大きい）高背部品３２が実装されている。低背部品３１としては、例えば、ＦＥＴ（Field effect transistor）、抵抗、ダイオード、背の低いコンデンサ、マイコン等とされ、高背部品３２としては、例えば、背の高いコンデンサ、コイル等とすることができる。 The plurality of electronic components 31 and 32 are mounted on the conductive paths 23 on both the upper and lower sides of the substrate 21, the low-profile component 31 is mounted on the lower surface side of the substrate 21, and the low profile is mounted on the upper surface side of the substrate 21. A tall component 32 that is taller than the component 31 (the height dimension in the vertical direction is large) is mounted. The low-profile component 31 may be, for example, a FET (Field effect transistor), a resistor, a diode, a short capacitor, a microcomputer, or the like, and the high-profile component 32 may be, for example, a tall capacitor, a coil, or the like. it can.

複数の蓄電素子４０Ａ〜４０Ｃは、図４に示すように、基板２１の外周の四辺２２Ａ〜２２Ｄのうちの一辺２２Ａに沿って並んで配される複数（本実施形態では３つ）の第１の蓄電素子４０Ａと、四辺２２Ａ〜２２Ｄのうちの一辺２２Ａとは反対側の対辺２２Ｃに沿って並んで配される複数（本実施形態では３つ）の第２の蓄電素子４０Ｃと、一辺２２Ａと対辺２２Ｃとを連結する一対の連結辺２２Ｂ，２２Ｄの一方２２Ｂに沿って並んで配される複数（本実施形態では３つ）の第３の蓄電素子４０Ｂとを備える。 As shown in FIG. 4, the plurality of power storage elements 40A to 40C are the first of a plurality (three in the present embodiment) arranged side by side along one side 22A of the four sides 22A to 22D on the outer periphery of the substrate 21. A plurality of (three in this embodiment) second power storage elements 40C arranged side by side along the opposite side 22C opposite to one side 22A of the four sides 22A to 22D, and one side 22A. A plurality of (three in the present embodiment) third power storage elements 40B arranged side by side along one of the pair of connecting sides 22B and 22D connecting the opposite side 22C and the opposite side 22C are provided.

複数の蓄電素子４０Ａ〜４０Ｃは、例えば電気二重層キャパシタ、リチウムイオンキャパシタ、リチウムイオン二次電池等からなり、各蓄電素子４０Ａ〜４０Ｃは、蓄電要素が収容された円柱状の蓄電本体４１と蓄電本体４１の一方の端面４１Ａから導出される正負一対のリード部４２Ａ，４２Ｂとを有する。一対のリード部４２Ａ，４２Ｂは、図５に示すように、共に、Ｌ字状に延びており、蓄電本体４１の平坦な端面４１Ａから端面４１Ａと直交（交差）する方向に導出されている。なお、蓄電本体４１は、例えば合成樹脂製又は金属製のホルダＨにより基板２１上に支持されるようにしてもよい。 The plurality of power storage elements 40A to 40C are composed of, for example, an electric double layer capacitor, a lithium ion capacitor, a lithium ion secondary battery, etc., and each power storage element 40A to 40C is a columnar power storage body 41 containing a power storage element and storage. It has a pair of positive and negative lead portions 42A and 42B derived from one end surface 41A of the main body 41. As shown in FIG. 5, the pair of lead portions 42A and 42B both extend in an L shape, and are led out from the flat end surface 41A of the power storage body 41 in a direction orthogonal to (intersect) with the end surface 41A. The power storage body 41 may be supported on the substrate 21 by, for example, a holder H made of synthetic resin or metal.

次に、蓄電ユニット１０の製造方法について説明する。
基板２１に対して例えばリフロー半田付けにより、電子部品３１，３２の端子及び蓄電素子４０Ａ〜４０Ｃのリード部４２Ａ，４２Ｂを基板２１に半田付けすることにより、ユニット本体２０が形成される。次に、基板２１の角部をロアケース１３のボス部１４にネジ２５でネジ留めし、アッパーケース１２を被せることにより、電気接続箱１０が形成される。 Next, a method of manufacturing the power storage unit 10 will be described.
The unit body 20 is formed by soldering the terminals of the electronic components 31 and 32 and the lead portions 42A and 42B of the power storage elements 40A to 40C to the substrate 21 by, for example, reflow soldering to the substrate 21. Next, the corner portion of the substrate 21 is screwed to the boss portion 14 of the lower case 13 with a screw 25, and the upper case 12 is covered with the screw 25 to form the electrical connection box 10.

本実施形態によれば以下の作用、効果を奏する。
蓄電ユニット１０は、導電路２３を有する基板２１と、基板２１の導電路２３に実装される電子部品３１，３２と、蓄電要素が収容された蓄電本体４１と蓄電本体４１の一方の側から導出されて基板２１の導電路に接続される一対のリード部４２Ａ，４２Ｂとを有する複数の蓄電素子４０Ａ，４０Ｃと、を備え、複数の蓄電素子４０Ａ，４０Ｃは、基板２１の一辺２２Ａ側（一方の縁部側）の導電路に一対のリード部４２Ａ，４２Ｂが接続される第１の蓄電素子４０Ａと、蓄電本体４１に対して一対のリード部４２Ａ，４２Ｂが配される側が第１の蓄電素子４０Ａとは反対側とされ、基板２１の対辺２２Ｃ（一方とは反対の縁部）側の導電路２３に一対のリード部４２Ａ，４２Ｂが接続される第２の蓄電素子４０Ｃとを含む。
本実施形態によれば、電子部品３１，３２の実装を行うことが容易ではない基板２１の縁部側を蓄電素子４０Ａ，４０Ｃの接続に利用することにより、基板２１の縁部よりも内側の領域を蓄電素子４０Ａ，４０Ｃの接続のために使用しなくてもよいため、基板２１における電子部品３１，３２の実装領域を大きくすることが可能になる。これにより、電子部品３１，３２の実装密度を高めることができ、蓄電ユニット１０を小型化することが可能になる。 According to this embodiment, the following actions and effects are exhibited.
The power storage unit 10 is led out from a substrate 21 having a conductive path 23, electronic components 31 and 32 mounted on the conductive path 23 of the substrate 21, and one side of a power storage body 41 and a power storage body 41 in which a power storage element is housed. A plurality of power storage elements 40A and 40C having a pair of lead portions 42A and 42B connected to the conductive path of the substrate 21 are provided, and the plurality of power storage elements 40A and 40C are on one side 22A side (one side) of the substrate 21. The first storage element 40A to which the pair of lead portions 42A and 42B are connected to the conductive path (on the edge side) and the first storage side to which the pair of lead portions 42A and 42B are arranged with respect to the storage body 41. It includes a second storage element 40C which is on the opposite side of the element 40A and in which a pair of lead portions 42A and 42B are connected to a conductive path 23 on the opposite side 22C (the edge opposite to one side) of the substrate 21.
According to the present embodiment, by using the edge side of the substrate 21, which is not easy to mount the electronic components 31 and 32, for connecting the power storage elements 40A and 40C, the inside of the edge portion of the substrate 21 is used. Since the region does not have to be used for connecting the power storage elements 40A and 40C, it is possible to increase the mounting region of the electronic components 31 and 32 on the substrate 21. As a result, the mounting densities of the electronic components 31 and 32 can be increased, and the power storage unit 10 can be miniaturized.

また、複数の蓄電素子４０Ａ〜４０Ｃは、蓄電本体４１に対して一対のリード部４２Ａ，４２Ｂが導出される第３の蓄電素子４０Ｂを含み、第３の蓄電素子４０Ｂは、第１の蓄電素子４０Ａと第２の蓄電素子４０Ｃとの間に配され、第３の蓄電素子４０Ｂの一対のリード部４２Ａ，４２Ｂは、基板２１における連結片２２Ｃ側（一方の縁部及び反対の縁部とは異なる縁部側）に接続される。
このようにすれば、第１の蓄電素子４０Ａ及び第２の蓄電素子４０Ｃに加えて、第３の蓄電素子４０Ｂを基板２１に接続する場合であっても、電子部品３１，３２の実装領域を確保することができる。よって、より一層、電子部品３１，３２の実装密度を高めることができ、蓄電ユニット１０を小型化することが可能になる。 Further, the plurality of power storage elements 40A to 40C include a third power storage element 40B from which a pair of lead portions 42A and 42B are derived from the power storage body 41, and the third power storage element 40B is a first power storage element. The pair of lead portions 42A and 42B of the third power storage element 40B, which are arranged between the 40A and the second power storage element 40C, are on the connecting piece 22C side (one edge portion and the opposite edge portion) of the substrate 21. Connected to different edge sides).
By doing so, even when the third power storage element 40B is connected to the substrate 21 in addition to the first power storage element 40A and the second power storage element 40C, the mounting areas of the electronic components 31 and 32 are covered. Can be secured. Therefore, the mounting densities of the electronic components 31 and 32 can be further increased, and the power storage unit 10 can be downsized.

また、基板２１における第１の蓄電素子４０Ａと第２の蓄電素子４０Ｃとが配される領域の内側に電子部品３１，３２が実装されている。
このようにすれば、第１の蓄電素子４０Ａと第２の蓄電素子４０Ｃとが配置されない領域に電子部品３１，３２を実装することができるため、電子部品３１，３２の実装密度を高めることができる。 Further, the electronic components 31 and 32 are mounted inside the region of the substrate 21 where the first power storage element 40A and the second power storage element 40C are arranged.
In this way, the electronic components 31 and 32 can be mounted in the region where the first power storage element 40A and the second power storage element 40C are not arranged, so that the mounting density of the electronic components 31 and 32 can be increased. it can.

また、複数の電子部品３１，３２を備え、複数の電子部品３１，３２は、低背部品３１と、低背部品３１よりも基板２１に対する高さ寸法が大きい高背部品３２とを有し、第１の蓄電素子４０Ａと第２の蓄電素子４０Ｃとが配される領域の内側に高背部品３２が実装されている。
このようにすれば、蓄電素子４０Ａ〜４０Ｃの高さ寸法に応じた空きスペースを高背部品３２の実装のために利用することができるため、電子部品３１，３２の実装密度を高めることができる。 Further, a plurality of electronic components 31 and 32 are provided, and the plurality of electronic components 31 and 32 have a low-profile component 31 and a high-profile component 32 having a height dimension larger than that of the low-profile component 31 with respect to the substrate 21. The tall component 32 is mounted inside the region where the first power storage element 40A and the second power storage element 40C are arranged.
In this way, the empty space corresponding to the height dimension of the power storage elements 40A to 40C can be used for mounting the tall component 32, so that the mounting density of the electronic components 31 and 32 can be increased. ..

また、基板２１に対して蓄電素子４０Ａ〜４０Ｃが配される側とは反対側の面には、低背部品３１が実装されている。
このようにすれば、高さ寸法のスペースが少ない側を有効に利用して基板２１に低背部品３１を実装することができるため、電子部品３１，３２の実装密度を高めることができる。 Further, the low-profile component 31 is mounted on the surface of the substrate 21 opposite to the side on which the power storage elements 40A to 40C are arranged.
In this way, the low-profile component 31 can be mounted on the substrate 21 by effectively utilizing the side having a small space in the height dimension, so that the mounting density of the electronic components 31 and 32 can be increased.

また、基板２１と複数の電子部品３１，３２とは、電力変換装置を構成している。
このようにすれば、蓄電ユニット１０が多くの電子部品３１，３２が必要とされる電力変換装置を備えることで大型化しやすい構成であっても、複数の蓄電素子４０Ａ〜４０Ｃの配置によって蓄電ユニット１０を小型化することができる。 Further, the substrate 21 and the plurality of electronic components 31 and 32 constitute a power conversion device.
In this way, even if the power storage unit 10 is provided with a power conversion device that requires many electronic components 31 and 32 and is easily enlarged in size, the power storage unit can be arranged by arranging a plurality of power storage elements 40A to 40C. 10 can be miniaturized.

＜他の実施形態＞
本明細書に記載された技術は上記記述及び図面によって説明した実施形態に限定されるものではなく、例えば次のような実施形態も本明細書に記載された技術の技術的範囲に含まれる。 <Other embodiments>
The techniques described herein are not limited to the embodiments described above and in the drawings, and for example, the following embodiments are also included in the technical scope of the techniques described herein.

（１）基板２１の三辺２２Ａ〜２２Ｃに沿う蓄電素子４０Ａ〜４０Ｃを備えたが、これに限られない。例えば、蓄電素子４０Ｂを備えない構成としてもよい。 (1) The storage elements 40A to 40C along the three sides 22A to 22C of the substrate 21 are provided, but the present invention is not limited to this. For example, the configuration may not include the power storage element 40B.

（２）蓄電素子４０Ａ〜４０Ｃの全てのリード部４２Ａ，４２Ｂが基板２１の縁部側（外側）に向けて配置されていたが、これに限られず、蓄電本体４１に対してリード部４２Ａ，４２Ｂが基板２１の縁部側（外側）以外の方向に向けて配置された一又は複数の蓄電素子を含んでいてもよい。 (2) All the lead portions 42A and 42B of the power storage elements 40A to 40C were arranged toward the edge side (outside) of the substrate 21, but the present invention is not limited to this, and the lead parts 42A and 42B are arranged with respect to the power storage body 41. 42B may include one or more power storage elements arranged in a direction other than the edge side (outside) of the substrate 21.

（３）蓄電素子の個数は、上記実施形態の個数に限られず、異なる個数としてもよい。
（４）リード部４２Ａ，４２Ｂは、基板２１のスルーホール２４に挿通されて半田付けされていたが、これに限られず、基板２１の導電路２３のランドに表面実装されていてもよい。また、基板２１が導電路２３としての金属のバスバーを備える場合には、リード部４２Ａ，４２Ｂは、バスバーに対して各種の溶接（例えば、超音波溶接、振動溶着、レーザー溶接など）によって電気的に接続（実装）されていてもよい。 (3) The number of power storage elements is not limited to the number of the above-described embodiment, and may be different.
(4) The lead portions 42A and 42B are inserted into the through holes 24 of the substrate 21 and soldered, but the present invention is not limited to this, and the lead portions 42A and 42B may be surface-mounted on the land of the conductive path 23 of the substrate 21. When the substrate 21 is provided with a metal bus bar as a conductive path 23, the lead portions 42A and 42B are electrically bonded to the bus bar by various welding (for example, ultrasonic welding, vibration welding, laser welding, etc.). It may be connected (mounted) to.

１０： 蓄電ユニット
１１： ケース
２０： ユニット本体
２１： 基板
３１： 低背部品（電子部品）
３２： 高背部品（電子部品）
４０Ａ： 第１の蓄電素子
４０Ｃ： 第２の蓄電素子
４０Ｂ： 第３の蓄電素子
４１： 蓄電本体
４２Ａ，４２Ｂ： リード部 10: Power storage unit 11: Case 20: Unit body 21: Board 31: Low profile parts (electronic parts)
32: Tall parts (electronic parts)
40A: First power storage element 40C: Second power storage element 40B: Third power storage element 41: Power storage main body 42A, 42B: Lead portion

Claims (6)

導電路を有する基板と、
前記基板の導電路に実装される電子部品と、
蓄電要素が収容された蓄電本体と前記蓄電本体の一方の側から導出されて前記基板の導電路に接続される一対のリード部とを有する複数の蓄電素子と、を備え、
前記複数の蓄電素子は、前記基板の一方の縁部側の導電路に前記一対のリード部が接続される第１の蓄電素子と、前記蓄電本体に対して前記一対のリード部が配される側が前記第１の蓄電素子とは反対側とされ、前記基板の前記一方とは反対の縁部側の導電路に前記一対のリード部が接続される第２の蓄電素子とを含む、蓄電ユニット。 A substrate with a conductive path and
Electronic components mounted on the conductive path of the substrate and
A plurality of power storage elements including a power storage body in which a power storage element is housed and a pair of lead portions derived from one side of the power storage body and connected to a conductive path of the substrate are provided.
The plurality of power storage elements include a first power storage element in which the pair of lead portions are connected to a conductive path on one edge side of the substrate, and the pair of lead parts are arranged with respect to the power storage body. A power storage unit including a second power storage element whose side is opposite to the first power storage element and to which the pair of lead portions are connected to a conductive path on the edge side opposite to the one of the substrate. .. 前記複数の蓄電素子は、前記蓄電本体に対して前記一対のリード部が導出される第３の蓄電素子を含み、前記第３の蓄電素子は、前記第１の蓄電素子と前記第２の蓄電素子との間に配され、前記第３の蓄電素子の前記一対のリード部は、前記基板における前記一方の縁部及び前記反対の縁部とは異なる縁部側に接続される請求項１に記載の蓄電ユニット。 The plurality of power storage elements include a third power storage element from which the pair of lead portions are led out to the power storage body, and the third power storage element includes the first power storage element and the second power storage element. According to claim 1, the pair of lead portions of the third power storage element, which are arranged between the elements, are connected to an edge portion different from the one edge portion and the opposite edge portion of the substrate. The power storage unit described. 前記基板における前記第１の蓄電素子と前記第２の蓄電素子とが配される領域の内側に前記電子部品が実装されている請求項１又は請求項２に記載の蓄電ユニット。 The power storage unit according to claim 1 or 2, wherein the electronic component is mounted inside a region of the substrate on which the first power storage element and the second power storage element are arranged. 複数の前記電子部品を備え、複数の前記電子部品は、低背部品と、前記低背部品よりも前記基板に対する高さ寸法が大きい高背部品とを有し、前記第１の蓄電素子と前記第２の蓄電素子とが配される領域の内側に前記高背部品が実装されている請求項３に記載の蓄電ユニット。 The plurality of electronic components are provided, and the plurality of electronic components include a low-profile component and a high-profile component having a height dimension larger than that of the low-profile component with respect to the substrate, and the first power storage element and the said. The power storage unit according to claim 3, wherein the tall component is mounted inside a region in which a second power storage element is arranged. 前記基板に対して前記蓄電素子が配される側とは反対側の面には、前記低背部品が実装されている請求項４に記載の蓄電ユニット。 The power storage unit according to claim 4, wherein the low-profile component is mounted on a surface of the substrate opposite to the side on which the power storage element is arranged. 前記基板と複数の前記電子部品とは、電力変換装置を構成している請求項１から請求項５のいずれか一項に記載の蓄電ユニット。 The power storage unit according to any one of claims 1 to 5, wherein the substrate and the plurality of electronic components constitute a power conversion device.
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