JP2020136536A - Sample holding tool - Google Patents

Abstract

To provide a sample holding tool that, even when a cycle of temperature increase and decrease is repeated, maintains the horizontalness of a sample holding surface for a long time and can be continuously used for a long period.SOLUTION: A sample holding tool 10 comprises: a plate-like sample holding member 11 that has a top face 11a on which a sample can be mounted and an under surface 11b used for joint; a support member 12 that bears the sample holding member 11; a first spacer 1A for clearance adjustment that is arranged between the sample holding member 11 and the support member 12; and a joint material (resin layer 4) that joins the sample holding member to the support member. The first spacer 1A is formed of resin and has a plate-like shape or a columnar shape, and the area of at least one of an upper end face and a lower end face of the first spacer 1A is larger than the horizontal direction cross-sectional area at the center part in the vertical direction of the first spacer 1A.SELECTED DRAWING: Figure 2

Description

The present disclosure relates to a sample holder for holding a sample such as a semiconductor wafer, which is used in a manufacturing process of a semiconductor integrated circuit, a manufacturing process of a liquid crystal display device, or the like.

An electrostatic chuck is known as a sample holder used in a semiconductor manufacturing apparatus or the like. The electrostatic chuck is a plate-shaped sample holding member (also referred to as an object to be processed or a work) made of an insulator and having a flat upper surface (sample holding surface) for mounting and sucking and holding a sample such as a wafer. A substrate or ceramic body) and a plate-shaped support member (also referred to as a metal base or base plate) made of a conductor that supports the sample holding member from below are joined by a bonding material such as an adhesive. It is configured.

Inside the joined electrostatic chuck, a plurality of vertical holes communicating between the upper and lower members are provided from the lower portion or the bottom portion of the electrostatic chuck toward the upper surface which is the sample holding surface. Gas such as helium is supplied to the sample holding surface through these vertical holes (also referred to as gas supply flow paths).

Regarding the joining of the sample holding member and the supporting member, Patent Document 1 states that the sample holding member (ceramic member) is joined to the supporting member (metal member) in order to keep the upper surface of the sample holding member, which is the sample holding surface, horizontal. A method is disclosed in which a plurality of spacers (spacer portions) made of resin are arranged and laminated between the sample holding member and the supporting member (interface).

According to this, the bonding material (adhesive) applied between the sample holding member and the supporting member is cured while applying isotropic pressure in the stacking direction to maintain the sample holding surface horizontally, uniformly. A bonding material layer having a thickness of various thickness can be obtained.

Japanese Unexamined Patent Publication No. 2003-258072

By the way, as described above, the spacer disposed between the sample holding member and the supporting member has its upper end surface (upper end surface) adhesively fixed to the lower surface or the bottom surface of the sample holding member by an adhesive or the like. The lower end surface (lower end surface) is adhesively fixed to the upper surface or top surface of the support member.

However, since the ceramic sample holding member and the metal supporting member constituting the sample holder have different linear expansion coefficients (so-called thermal expansion coefficient) with respect to heat, the sample holder including the electrostatic chuck is used. While heating (heating) and heat removal (lowering) are repeated in the semiconductor manufacturing process, the joint between the sample holding member and the spacer (upper end surface of the spacer) or the joint between the support member and the spacer (spacer) A stress due to the difference in the coefficient of thermal expansion between the above-mentioned members is applied to the lower end surface), and one of the joints may peel off or fall off from the adhesively fixed member.

If a plurality of such spacers are peeled off or dropped from between the sample holding member and the supporting member, the sample holding surface cannot be maintained horizontally, and the sample holding tool (electrostatic chuck) is used for manufacturing. It becomes difficult to uniformly process the product (workpiece or workpiece), which may affect the yield of the product.

An object of the present disclosure is to provide a sample holder that can be used for a long period of time by maintaining the horizontality of the sample holding surface for a long time even if the cycle of raising and lowering the temperature is repeated.

The sample holder of the present disclosure is a flat sample holding member having a flat surface having an upper surface on which a sample can be placed and a lower surface used for joining for fixing a position, and a support member having a flat surface. For adjusting the gap, which is arranged between the support member that supports the sample holding member so that the lower surface of the sample holding member faces the lower surface of the sample holding member, and the lower surface of the sample holding member and the flat surface of the supporting member. The first spacer is provided, and a joining material that is disposed between the lower surface of the sample holding member and the flat surface of the supporting member to join the sample holding member and the supporting member.
The first spacer has a plate shape or a columnar shape made of resin, and the area of at least one of the upper end surface and the lower end surface of the first spacer is larger than the horizontal cross section of the vertical center portion of the first spacer. It is characterized by.

According to the configuration of the sample holder of the present disclosure, even if the cycle of raising and lowering the temperature is repeated, the wear of the spacer for adjusting the gap is suppressed, so that the level of the sample holding surface is maintained. As a result, in the sample holder of the present disclosure, even if the number of treatments increases over time, the horizontal heat equalization of the sample (object to be treated) placed and held on the sample holding surface during the treatment is impaired. Never. Therefore, the sample holder of the present disclosure can maintain a homogeneous treatment of a processing object such as a wafer held on the sample holding surface for a long time. As a result, the sample holder can be used for a long period of time.

It is a top view which looked down on the sample holder of an embodiment. It is sectional drawing of the sample holder of an embodiment. (A) is an enlarged view of the first spacer portion in FIG. 2, (b) and (c) are side views and top views of the first spacer 1A, and (d) is another shape example of the first spacer 1A. is there. (A) is an enlarged view of the first spacer portion in FIG. 2, (b) and (c) are side views and top views of the first spacer 1B, and (d) is another shape example of the first spacer 1B. is there. (A) is an enlarged view of the second spacer portion in FIG. 2, (b) and (c) are a cross-sectional view and a top view of the second spacer, and (d) is another shape example of the second spacer. (A) is an enlarged view of both peripheral edges in FIG. 2, (b) is a partial cross-sectional view of the third spacer, and (c) is a top view of the third spacer.

Hereinafter, embodiments of the present disclosure will be described with reference to the drawings.
In the drawings, the circumferential direction of the ceramic body 11 is [X direction], the diameter (diameter) direction passing through the center point of the ceramic body 11 is [Y direction], and the sample holding surface (upper surface of the substrate) is defined as three axes orthogonal to each other. The direction (vertical direction in the figure) perpendicular to 11a) and indicating the thickness of the ceramic body 11 is indicated as the [Z direction].

Further, in the following embodiment, as shown in FIG. 1, the mass and load (weight) of the disk-shaped ceramic body 11 are supported in the center of the circle and the surrounding region (hereinafter referred to as “central region”). The spacer is referred to as a first spacer (reference numerals 1A and 1B), and a large-diameter ring-shaped spacer supported in the edge region of the outer peripheral portion of the circle is referred to as a third spacer (reference numeral 3). Further, it is arranged around the gas supply hole (gas supply through hole 13) provided in the region between the central region and the edge region, and the gas can be circulated in the vertical direction [Z direction]. A small-diameter annular spacer having a hole to be formed is called a second spacer (reference numeral 2).

The sample holder 10 of the embodiment shown in FIGS. 1 and 2 is generated by applying a current between the semicircular electrodes E1 and E2 arranged in the ceramic body 11 in the manufacturing process of the semiconductor integrated circuit. By electrostatic force, a sample (including an object to be processed, a work, etc.) such as a semiconductor wafer placed on the upper surface 11a of a ceramic body, which is a sample holding surface, is electrostatically attracted and fixed in position on the holding surface. It is used as a chuck.

The sample holder 10 is arranged on the upper side in the vertical direction ([Z direction] plus side in the drawing) as shown in the top view of FIG. 1 and the WW'line sectional view (FIG. 2) of FIG. The disc-shaped ceramic body 11 which is an insulator and the metal base plate 12 arranged on the lower side ([Z direction] minus side) thereof are joined by a resin layer 4 on which an adhesive or the like is cured. It is composed of.

The ceramic body 11 is an example of the sample holding member of the present disclosure, the base plate 12 is an example of the support member of the present disclosure, and the resin layer 4 is an example of the bonding material of the present disclosure. Further, the thicknesses of the resin layer 4 and the spacers 1A, 1B, 2 and 3 between them in the cross-sectional view are emphasized.

The ceramic body 11 has a disk shape as a whole, and the upper surface 11a, which is one of the main surfaces, serves as a sample holding surface. The constituent material of the ceramic body 11 (sample holding member) can be, for example, alumina, aluminum nitride, silicon nitride, yttria, or the like. Typical external dimensions of the ceramic body 11 are a diameter (or side length) of about 200 to 500 mm and a thickness of about 2 to 15 mm.

The ceramic body 11 includes the above-mentioned electrodes E1 and E2 for electrostatic adsorption inside the ceramic body 11. Further, the ceramic body 11 is provided with a plurality of gas supply through holes 13 as vertical holes for supplying a sample cooling gas to the back surface of the sample placed on the upper surface 11a.

Each gas supply through hole 13 penetrates from the lower surface 11b to the upper surface 11a, which is the other main surface. As shown in FIG. 1, the gas supply through holes 13 are arranged at positions that are evenly distributed in the circumferential direction of the disk so that the gas can be evenly supplied to the back surface of the sample.

Each gas supply through hole 13 shown in FIG. 1 shows an upper opening (13a) of the hole. Further, the hidden line (dotted line) around each gas supply through hole 13 shown in FIG. 1 is a second spacer 2 located around the opening 13b on the lower side (lower end) of each hole. Each of the gas supply through holes 13 communicates with a vertical hole (gas supply hole 14) of the base plate 12, which will be described later, via a hole formed in the center of the annular second spacer 2.

The base plate 12 is a member for supporting and supporting the ceramic body 11, and is made of a metal material such as aluminum. Typical external dimensions of the base plate 12 are a diameter (or side length) of about 200 to 500 mm and a thickness of about 10 to 100 mm.

Inside the base plate 12, a gas supply hole 14 communicating with the gas supply through hole 13 is provided at the same position as the gas supply through hole 13 described above in a plan view. The upper (upper end) opening 14a of each gas supply hole 14 opens to the upper surface 12a of the base plate 12. Further, the lower end of each gas supply hole 14 is connected to the lateral connecting flow path 14b. The lower end of each gas supply hole 14 may be opened to the lower surface 12b of the base plate 12.

The outer shapes of the ceramic body 11 and the base plate 12 are not particularly limited to a circular shape. A plate shape is desirable so that the sample can be placed on the upper side (upper surface), but the outer shape may be a quadrangular shape, a polygonal shape, or the like. Further, the ceramic body 11 and the base plate 12 do not necessarily have the same or similar outer shape.

As the bonding material (adhesive) for joining the ceramic body 11 and the base plate 12, for example, a silicone resin or the like is used. Then, between the ceramic body 11 and the base plate 12, a resin layer 4 in which the bonding material is cured is formed, in which the ceramic body 11 and the base plate 12 are integrated after curing and curing of the above-mentioned bonding material (adhesive). Will be done.

The above-mentioned bonding material (adhesive) is also applied between both ends of each spacer described later in the vertical direction and the ceramic body 11 or the base plate 12, or penetrates into these interfaces by surface tension. It cures and acts to position and fix each spacer to the ceramic body 11 or the base plate 12.

As shown in the cross-sectional view of FIG. 2, the ceramic body 11 and the base plate 12 having the above-described configuration are the lower surface 11b of the ceramic body 11 and the upper surface of the base plate 12 in order to keep the upper surface 11a which is the sample holding surface horizontal. A plurality of types of resin spacers described below are appropriately arranged (intervened) between the 12a and the gap adjusting member, and the above-mentioned bonding material (adhesive) or the like is applied between them. , Pressurized and bonded.

Specifically, as spacers for the sample holder 10 of the embodiment, plate-shaped (membrane-shaped) or columnar first spacers 1A (FIG. 3) and 1B (FIG. 4) and an annular small-diameter second spacer 2 (FIG. 5) and a ring-shaped third spacer 3 (FIG. 6) having a large diameter are used. Hereinafter, each spacer will be described.

First, the columnar first spacer 1A shown in FIG. 3 and the first spacer 1B shown in FIG. 4, which is a modification thereof, are for gas supply in the plan view of the disk-shaped ceramic body 11 of FIG. Except for the formation position of the through hole 13 (opening 13a), it can be widely arranged in any of the above-mentioned "central region", "edge region", or "intermediate region" at the intermediate position thereof. It is a general-purpose spacer.

In the present embodiment (plan view of FIG. 1), the first spacer is located in the central (center) portion of the "central region" where the thermal expansion and contraction of the base plate 12 (ceramic body 11) is considered to be small. Although 1A (FIG. 3) is arranged, the first spacer 1B (FIG. 4) is arranged in the outer portion near the intermediate region where the thermal expansion and contraction of the base plate 12 are considered to be relatively large. The arrangement and number of the first spacers 1A (FIG. 3) and the first spacers 1B (FIG. 4) are not limited to the example of FIG. 1, and the positions of 1A and 1B can be exchanged, or 1A or 1B can be used. It can also be configured using only one.

As shown in the side view of FIG. 3B and the top view of FIG. 3C, the first spacer 1A has an area of at least one (both in this example) of the upper end surface 1c and the lower end surface 1e of the spacer. It is larger than the horizontal cross section of the central portion 1d in the vertical direction.

Specifically, when the first spacer 1A has a columnar shape as shown in FIGS. 3 (b) and 3 (c), the “diameter D01” that substitutes the size of the area of the upper end surface 1c of the first spacer 1A. Is larger than the "diameter D02" that substitutes for the cross-sectional area of the central portion 1d (D01> D02). Further, the "diameter D03" that substitutes the area of the lower end surface 1e is larger than the "diameter D02" that substitutes the cross-sectional area of the central portion 1d (D02 <D03).

Further, in the first spacer 1A, the diameter D01 of the upper end surface 1c and the diameter D03 of the lower end surface 1e have substantially the same size (diameter). Since the diameter D02 of the central portion 1d is smaller than the diameters D01 and D03 above and below the central portion 1d, the outer peripheral surface (1d portion) of the first spacer 1A has a concave curved surface toward the inside.

The outer peripheral surface (1d portion) of the first spacer 1A does not necessarily have to be a curved surface, and may be formed of a straight line as in the modified example 1A'shown in FIG. 3D.

Incidentally, since the first spacer 1A shown in FIG. 3B and the first spacer 1A'shown in FIG. 3D are so-called "constricted" cylinders whose outer peripheral surfaces are recessed inward. , It can be said that the overall shape is drum-shaped or drum-like.

Here, the first spacer 1A is finally disposed as a gap adjusting member between the ceramic body 11 and the base plate 12, as shown in FIG. 3A, and the above-mentioned adhesive or the like is cured. The upper end surface 1c is adhesively fixed to the lower surface 11b of the ceramic body 11 and the lower end surface 1e is adhesively fixed to the upper surface 12a of the base plate 12 via the thin resin layer 4, and the ceramic body 11 is maintained horizontally.

Then, in this state, the entire sample holder 10 is heated (heated) or deheated (lowered) in order to process or process the sample placed / held on the upper surface 11a during the semiconductor manufacturing process or the like. Is repeated. At this time, as described above, in the conventional sample holder, the peripheral edge portion of the upper end surface 1c fixed to the ceramic body 11 (two corners on the ceramic body 11 side in the first spacer 1A) or , Stress caused by the difference in the coefficient of thermal expansion between the members (shear stress in the horizontal direction shown in the drawing) on the peripheral edge of the lower end surface 1e fixed to the base plate 12 (two corners on the base plate 12 side in the first spacer 1A). ) Was added, and the member may be peeled off from the adhesively fixed member.

On the other hand, in the sample holder 10 of the embodiment, due to the configuration of the first spacer 1A described above, the peripheral edge of the upper end surface 1c (two corners on the ceramic body 11 side) or the peripheral edge of the lower end surface 1e. The stress applied to the portions (two corner portions on the base plate 12 side) is dispersed, and the concentration of the stress on these peripheral portions (corner portions) is alleviated. Therefore, in the sample holder 10 using the first spacer 1A having the above-described configuration as the gap adjusting spacer, the first spacer 1A is suppressed from being peeled off or dropped off during running.

Therefore, according to the sample holder 10 of the embodiment, the horizontal of the sample holding surface (upper surface 11a) and the soaking heat of the sample by maintaining the horizontal are not impaired. Therefore, a homogeneous treatment of a sample (object to be processed) such as a wafer placed on the sample holding surface can be stably maintained for a long period of time. As a result, the sample holder 10 of the present embodiment can be continuously used for a long period of time.

Next, the first spacer 1B arranged in the radial intermediate region between the "central region" and the "edge region" in the plan view of FIG. 1 is the side view of FIG. 4B and FIG. As shown in the top view of (c), the area of at least one (both in this example) of the upper end surface 1f and the lower end surface 1h is horizontal to the vertical central portion 1g of the spacer 1B, as in the case of the first spacer 1A described above. It is larger than the directional cross section.

That is, when the first spacer 1B is cylindrical, the "diameter D04" that substitutes the size of the area of the upper end surface 1f of the first spacer 1B is from the "diameter D05" that substitutes the cross-sectional area of the central portion 1g. Is also large (D04> D05). Further, the "diameter D06" that substitutes the area of the lower end surface 1h is larger than the "diameter D05" that substitutes the cross-sectional area of the central portion 1g (D05 <D06). These points are the same as those of the first spacer 1A.

The difference from the first spacer 1A is that the diameter of the upper end surface (D01) and the diameter of the lower end surface (D03), which were almost the same size (diameter) in the first spacer 1A, are different in the first spacer 1B. It is different, and the "diameter D04" that substitutes the size of the area of the upper end surface 1f is larger (D04> D06) than the "diameter D06" that substitutes the area of the lower end surface 1h.

Other than that, the outer peripheral surface (1 g portion) of the first spacer 1B has a concave curved surface inward, and the outer peripheral surface (1 g portion) is composed of a straight line as in the modified example 1B'. The points may be the same as those of the first spacer 1A [see FIG. 4D].

Even with the above configuration, the same effect as that of the first spacer 1A can be obtained.

In addition, compared to the configuration of the first spacer 1A, the diameter D04 of the upper end surface 1f on the ceramic body 11 side is larger than the diameter D06 of the lower end surface 1h on the base plate 12 side (D04> D06), so that the diameter D04 on the ceramic body 11 side The "bonding force" is further improved.

That is, since the coefficient of thermal expansion of the bonding partner member (ceramic body 11) is small, it is considered that stress (shear stress) is more likely to occur on the ceramic body 11 side than on the base plate 12 side. Correspondingly, in the first spacer 1B, the "bonding force" on the side of the 11 ceramic bodies is improved.

As a result, the first spacer 1B is further suppressed from peeling / falling off during running on the upper end surface 1f on the ceramic body 11 side. Therefore, even if the first spacer 1B is arranged in a region intermediate in the radial direction between the "central region" and the "edge region" where stress is easily applied, it is possible to suppress the occurrence of peeling, dropping, and the like. ..

Next, in the plan view of FIG. 1, around the openings of the gas supply through holes 13 (and the gas supply holes 14 on the base plate 12 side) in the radial intermediate region, a sealing member around these openings also serves. The second spacer shown in FIG. 5 is arranged.

Similar to the first spacers 1A and 1B, the area of both the upper end surface 2a and the lower end surface 2b of the second spacer 2 is the central portion in the vertical direction of the spacer 2, as shown in FIGS. 5 (b) and 5 (c). It is larger than the horizontal cross section of 2c. That is, the "diameter D07" and "diameter D09" that substitute the size of the area of the end face are larger than the "diameter D08" that substitutes the cross-sectional area of the central portion 2c (D07> D08, D08 <D09).

The operation according to the above configuration, the shape of the outer peripheral surface (2c portion) thereof, and the modification 2'[see FIG. 5D] are the same as those of the first spacers 1A and 1B, and thus detailed description thereof will be omitted.

The difference between the second spacer 2 and the first spacers 1A and 1B is that the upper gas supply through hole 13 (vertical hole) and the lower gas supply hole 14 (vertical hole) communicate with each other on the inner circumference thereof. , A communication hole (inner peripheral surface 2d) is formed, which is an annular shape as a whole.

As shown in FIG. 5A, the upper end surface 2a (annular shape) of the second spacer 2 is joined to the lower surface 11b of the ceramic body 11 around the lower surface opening 13b of the gas supply through hole 13. The lower end surface 2a (annular shape) of the second spacer 2 is joined to the upper surface 12a of the base plate 12 around the upper surface opening 14a of the gas supply hole 14. As a result, the upper gas supply through hole 13 (vertical hole) and the lower gas supply hole 14 (vertical hole) are communicated with each other, and the connecting portion of these through holes is sealed.

Then, paying attention to one wall portion (the wall portion on the right side in the drawing in this example) constituting the annulus, FIG. 5 (in this example, the same as the configuration of the entire spacer by the outer peripheral surface 2c) in the individual wall portions As shown in c), the areas of both the upper end surface 2a and the lower end surface 2b are larger than the horizontal cross section of the vertical central portion 2c of the spacer 2.

That is, the "diameter thickness (length) T01" representing the area of the upper end surface 2a and the "diameter thickness T03" representing the area of the lower end surface 2b are "diameters" representing the cross-sectional area of the central portion 2c. It is larger than the "direction thickness T02" (T01> T02, T02 <T03). As a result, the inner peripheral surface 2d of the second spacer 2 has a concave curved surface toward the outside of the annulus.

The "diameter (diameter) direction" is the [Y direction] in FIG. Further, similarly to the outer peripheral surface 2c, the inner peripheral surface 2d may also be formed of a straight line as shown in the modified example 2'of FIG. 5 (d).

According to the second spacer 2 having the above configuration, the shear stress applied to the peripheral edge of the upper end surface 2a (two corners on the ceramic body 11 side) or the peripheral edge of the lower end surface 2be (two corners on the base plate 12 side). Is relaxed. Therefore, even in the second spacer 2, peeling, falling off, etc. that occur during running are suppressed.

Next, as shown in FIG. 6, a ring-shaped third spacer 3 is arranged in the “edge region” in the plan view of FIG. 1 along the shape of the outer peripheral edge portion of the ceramic body 11.

Focusing on one wall portion (the wall portion on the left side in the drawing in this example) constituting the ring of the third spacer 3, the individual wall portions are as shown in FIG. 6 (b). In addition, the areas of both the upper end surface 3a and the lower end surface 3b are larger than the horizontal cross-sectional area of the vertical central portion 3c of the spacer 3. That is, the "diameter thickness (length) T04" representing the area of the upper end surface 3a and the "diameter thickness T06" representing the area of the lower end surface 3b are "diameter thickness T06" representing the cross-sectional area of the central portion (3c portion). It is larger than the radial thickness T05 ”(T04> T05, T05 <T06).

As a result, the shear stress generated at the peripheral edge of the upper end surface 3a (two corners on the ceramic body 11 side) or the peripheral edge of the lower end surface 3be (two corners on the base plate 12 side) is relaxed and is generated during running. Peeling and falling off of the spacer are suppressed.

Further, in the third spacer 3, the radial thickness T04 of the upper end surface 3a is similar to that of the first spacer 1B, corresponding to the fact that the coefficient of thermal expansion of the ceramic body 11 is smaller than the coefficient of thermal expansion of the base plate 12. It is larger than the radial thickness T06 of the lower end surface 3b.

With this structure, the "bonding force" of the joint surface on the ceramic body 1 side where shear stress is likely to occur is improved, and peeling / falling off of the spacer during running at this portion is further suppressed.

As with the second spacer 2, the outer peripheral surface 3c of the ring is formed of a concave curved surface toward the inside of the annulus, and the inner peripheral surface 3d of the ring is formed of a concave curved surface toward the outside of the annulus. ing.

With the above configuration, even in the third spacer 3 having a large diameter, the same action and effect as those of the first spacers 1A and 1B and the second spacer 2 described above can be obtained.

Further, in the third spacer 3, as shown in FIG. 6C, notch-shaped slits 3e are provided at at least one position in the circumferential direction of the ring.

As a result, when the base plate 12 is expanded or contracted by heat, the force of the third spacer 3 being pulled by the resin layer 4 (adhesive) that joins the third spacer 3 to the base plate 12 can be relaxed. Therefore, peeling or falling off of the third spacer 3 that occurs during running can be further suppressed.

1A, 1B 1st spacer 1c, 1f Upper end surface 1d, 1g Central part 1e, 1h Lower end surface 2 2nd spacer 2a Upper end surface 2b Lower end surface 2c Outer outer surface 2d Inner peripheral surface 3 Third spacer 3a Upper end surface 3b Lower end surface 3c Outside Peripheral surface 3d Inner peripheral surface 3e Slit 4 Resin layer 10 Sample holder 11 Ceramic body (sample holding member)
11a Top surface (sample holding surface)
11b Bottom surface 11c Edge 12 Base plate (support member)
12a top surface 12b bottom surface

Claims (7)

A flat sample holding member having an upper surface on which a sample can be placed and a lower surface used for joining for fixing a position,
A support member having a flat surface, which supports the sample holding member so that the flat surface and the lower surface of the sample holding member face each other.
A first spacer for adjusting the gap arranged between the lower surface of the sample holding member and the flat surface of the support member, and
A bonding material that is disposed between the lower surface of the sample holding member and the flat surface of the supporting member to join the sample holding member and the supporting member is provided.
The first spacer has a plate shape or a columnar shape made of resin, and
A sample holder in which the area of at least one of the upper end surface and the lower end surface of the one spacer is larger than the horizontal cross section of the vertical center portion of the first spacer. The sample holder according to claim 1, wherein the first spacer has areas of the upper end surface and the lower end surface larger than the horizontal cross section of the central portion in the vertical direction, respectively. The sample holder according to claim 1 or 2, wherein the first spacer has an area of the upper end surface larger than the area of the lower end surface. The sample holder according to any one of claims 1 to 3, wherein the outer peripheral surface of the first spacer is formed of a curved surface that is concave toward the inside. The sample holding member includes a vertical through hole for gas conduction, and the support member includes a gas supply hole communicating with the vertical through hole.
Between the lower surface of the sample holding member and the flat surface of the support member, the upper end surface abuts around the opening of the vertical through hole and the lower end surface abuts around the opening of the gas supply hole. Further equipped with an annular second spacer,
The sample holder according to claim 1, wherein the area of the upper end surface and the lower end surface of the second spacer is larger than the horizontal cross section of the vertical central portion of the second spacer, respectively. The sample holder according to claim 5, wherein the inner peripheral surface of the second spacer is formed of a curved surface that is concave toward the outside of the annulus. A ring-shaped third spacer that follows the shape of the outer peripheral edge of the sample holding member is further provided between the outer peripheral edge of the lower surface of the sample holding member and the flat surface of the supporting member.
The sample holder according to claim 1 or 5, wherein the third spacer includes a slit extending in the vertical direction.

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