JP2020132936A5 - - Google Patents

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Publication number
JP2020132936A5
JP2020132936A5 JP2019026964A JP2019026964A JP2020132936A5 JP 2020132936 A5 JP2020132936 A5 JP 2020132936A5 JP 2019026964 A JP2019026964 A JP 2019026964A JP 2019026964 A JP2019026964 A JP 2019026964A JP 2020132936 A5 JP2020132936 A5 JP 2020132936A5
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JP
Japan
Prior art keywords
protrusion
image
monitoring device
detect
shape
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JP2019026964A
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English (en)
Japanese (ja)
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JP7171466B2 (ja
JP2020132936A (ja
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Priority to JP2019026964A priority Critical patent/JP7171466B2/ja
Priority claimed from JP2019026964A external-priority patent/JP7171466B2/ja
Priority to US16/782,548 priority patent/US11413814B2/en
Publication of JP2020132936A publication Critical patent/JP2020132936A/ja
Publication of JP2020132936A5 publication Critical patent/JP2020132936A5/ja
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Publication of JP7171466B2 publication Critical patent/JP7171466B2/ja
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JP2019026964A 2019-02-18 2019-02-18 製造方法、三次元造形装置 Active JP7171466B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019026964A JP7171466B2 (ja) 2019-02-18 2019-02-18 製造方法、三次元造形装置
US16/782,548 US11413814B2 (en) 2019-02-18 2020-02-05 Method of manufacturing product and additive manufacturing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019026964A JP7171466B2 (ja) 2019-02-18 2019-02-18 製造方法、三次元造形装置

Publications (3)

Publication Number Publication Date
JP2020132936A JP2020132936A (ja) 2020-08-31
JP2020132936A5 true JP2020132936A5 (enExample) 2022-02-25
JP7171466B2 JP7171466B2 (ja) 2022-11-15

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ID=72041084

Family Applications (1)

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JP2019026964A Active JP7171466B2 (ja) 2019-02-18 2019-02-18 製造方法、三次元造形装置

Country Status (2)

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US (1) US11413814B2 (enExample)
JP (1) JP7171466B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11073501B2 (en) * 2015-11-13 2021-07-27 Honeywell Federal Manufacturing & Technologies, Llc System and method for inspecting parts using dynamic response function
US20230100761A1 (en) * 2021-09-27 2023-03-30 Lenovo (United States) Inc. Thermal runaway pin-point heating test

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19853978C1 (de) * 1998-11-23 2000-05-25 Fraunhofer Ges Forschung Vorrichtung für das selektive Laser-Schmelzen zur Herstellung eines Formkörpers
EP1234625A1 (de) * 2001-02-21 2002-08-28 Trumpf Werkzeugmaschinen GmbH + Co. KG Verfahren und Vorrichtung zur Herstellung eines Formkörpers durch selektives Laserschmelzen
JP4273785B2 (ja) * 2002-08-27 2009-06-03 パナソニック電工株式会社 三次元形状造形物の製造装置
JP3599059B2 (ja) * 2003-02-25 2004-12-08 松下電工株式会社 三次元形状造形物の製造方法及びその装置
JP4792905B2 (ja) 2005-10-07 2011-10-12 パナソニック株式会社 3次元形状造形物の製造方法
JP6046027B2 (ja) * 2013-12-09 2016-12-14 本田技研工業株式会社 三次元造形装置
US10549346B2 (en) * 2016-03-30 2020-02-04 Canon Kabushiki Kaisha Three-dimensional modeling apparatus, three-dimensional model body manufacturing method, and three-dimensional modeling data

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