JP2020128054A5 - - Google Patents

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Publication number
JP2020128054A5
JP2020128054A5 JP2019022260A JP2019022260A JP2020128054A5 JP 2020128054 A5 JP2020128054 A5 JP 2020128054A5 JP 2019022260 A JP2019022260 A JP 2019022260A JP 2019022260 A JP2019022260 A JP 2019022260A JP 2020128054 A5 JP2020128054 A5 JP 2020128054A5
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Japan
Prior art keywords
thickness direction
oxide film
layer
film layer
conductive film
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JP2019022260A
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Japanese (ja)
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JP7323293B2 (en
JP2020128054A (en
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Priority to JP2019022260A priority Critical patent/JP7323293B2/en
Priority claimed from JP2019022260A external-priority patent/JP7323293B2/en
Priority to KR1020200003288A priority patent/KR20200098389A/en
Priority to CN202010085809.4A priority patent/CN111554431A/en
Publication of JP2020128054A publication Critical patent/JP2020128054A/en
Publication of JP2020128054A5 publication Critical patent/JP2020128054A5/ja
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Publication of JP7323293B2 publication Critical patent/JP7323293B2/en
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Claims (7)

透明基材、透明導電層、銅層および酸化皮膜層を厚み方向一方向に順に備え、
前記酸化皮膜層の厚み方向一方面の水接触角が、７０°以上であることを特徴とする、導電性フィルム。 A transparent base material, a transparent conductive layer, a copper layer and an oxide film layer are provided in this order in the thickness direction.
A conductive film having a water contact angle of 70 ° or more on one surface of the oxide film layer in the thickness direction. 透明基材、銅層および酸化皮膜層を厚み方向一方向に順に備え、A transparent substrate, a copper layer, and an oxide film layer are provided in order in one direction in the thickness direction.
前記酸化皮膜層の厚み方向一方面の水接触角が、７０°以上であることを特徴とする、導電性フィルム。A conductive film having a water contact angle of 70 ° or more on one surface of the oxide film layer in the thickness direction. 前記酸化皮膜層の厚み方向一方面における水酸化銅の比率が、２０ａｒｅａ％以下であることを特徴とする、請求項１または２に記載の導電性フィルム。 The conductive film according to claim 1 or 2 , wherein the ratio of copper hydroxide on one surface in the thickness direction of the oxide film layer is 20 area% or less. 前記酸化皮膜層の厚み方向一方面における銅の比率が、２５ａｒｅａ％以下であることを特徴とする、請求項１〜３のいずれか一項に記載の導電性フィルム。 The conductive film according to any one of claims 1 to 3, wherein the ratio of copper on one surface in the thickness direction of the oxide film layer is 25 area% or less. 前記酸化皮膜層の厚み方向一方面における酸化銅（Ｉ）の比率が、４０ａｒｅａ％以上であることを特徴とする、請求項１〜４のいずれか一項に記載の導電性フィルム。 The conductive film according to any one of claims 1 to 4 , wherein the ratio of copper (I) oxide on one surface in the thickness direction of the oxide film layer is 40 area% or more. 前記酸化皮膜層の厚みが、５ｎｍ以上であることを特徴とする、請求項１〜５のいずれか一項に記載の導電性フィルム。 The conductive film according to any one of claims 1 to 5 , wherein the thickness of the oxide film layer is 5 nm or more. 請求項１〜６のいずれか一項に記載の導電性フィルムを備えることを特徴とする、タッチパネル。 A touch panel comprising the conductive film according to any one of claims 1 to 6.
JP2019022260A 2019-02-12 2019-02-12 Conductive film and touch panel Active JP7323293B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2019022260A JP7323293B2 (en) 2019-02-12 2019-02-12 Conductive film and touch panel
KR1020200003288A KR20200098389A (en) 2019-02-12 2020-01-09 Conductive film and touch panel
CN202010085809.4A CN111554431A (en) 2019-02-12 2020-02-11 Conductive film and touch panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019022260A JP7323293B2 (en) 2019-02-12 2019-02-12 Conductive film and touch panel

Publications (3)

Publication Number Publication Date
JP2020128054A JP2020128054A (en) 2020-08-27
JP2020128054A5 true JP2020128054A5 (en) 2022-01-06
JP7323293B2 JP7323293B2 (en) 2023-08-08

Family

ID=72005526

Family Applications (1)

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JP2019022260A Active JP7323293B2 (en) 2019-02-12 2019-02-12 Conductive film and touch panel

Country Status (3)

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JP (1) JP7323293B2 (en)
KR (1) KR20200098389A (en)
CN (1) CN111554431A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7407063B2 (en) 2019-07-02 2023-12-28 クアーズテック株式会社 diffuser
JP2023173028A (en) * 2022-05-25 2023-12-07 日東電工株式会社 Film with conductive layer, and laminated film for film antenna

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002263834A (en) 2001-03-14 2002-09-17 Mori Engineering:Kk Wire bonding and pre-treating method for soldering
JP2013130129A (en) 2011-12-21 2013-07-04 Kawasaki Heavy Ind Ltd Cooling structure of piston in engine
JP5531029B2 (en) 2012-01-05 2014-06-25 日東電工株式会社 Conductive film and conductive film roll
CN108027688B (en) 2015-09-30 2021-04-13 住友金属矿山株式会社 Conductive substrate

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