JP2020125876A - Thermomagnetic cycle device - Google Patents

Abstract

To provide a thermomagnetic cycle device comprising a valve mechanism to be magnetically driven.SOLUTION: An air conditioning device 1 comprises an MHP device 2 (magnetocaloric effect type heat pump device) as a thermomagnetic cycle device. The MHP device 2 comprises a magnetic field modulation device 11 for providing a magnetic field to be periodically varied. The MHP device 2 comprises a heat transport device 21 for generating a reciprocating flow of a medium 8. A magnetocaloric effect element 7 is arranged in the magnetic field. The heat transport device 21 comprises a valve 24 for controlling a passage for the medium 8. The valve 24 comprises an armature 24f. The magnetic field modulation device 11 and the armature 24f are magnetically coupled via a magnetic coupling structure 25. As a result, the valve 24 is driven by the magnetic field modulation device 11.SELECTED DRAWING: Figure 1

Description

The disclosure in this specification relates to a thermomagnetic cycle device.

Patent Document 1 discloses a magnetic temperature adjusting device (thermomagnetic cycle device) that utilizes a magnetocaloric element. This device creates a reciprocating flow by switching passages using a rotary valve. The description of the prior art documents listed as the prior art is incorporated by reference as a description of the technical elements in this specification.

JP, 2006-308197, A

Rotary valves are mechanically complex and large in size. In order to put the thermomagnetic cycle device into practical use, it is required to improve the equipment for controlling the flow of the medium. In view of the above, or other aspects not mentioned, there is a need for further improvements in thermomagnetic cycling devices.

One object of the disclosure is to provide a thermomagnetic cycle device having a magnetically actuated valve mechanism.

Another disclosed object is to provide a thermomagnetic cycle device in which leakage of a medium is suppressed.

The thermomagnetic cycle device disclosed herein includes a magnetic field modulator (11) that provides a magnetic field that fluctuates periodically, an MCE element (7) that is placed in the magnetic field, and exhibits a magnetocaloric effect, and an MCE element. A device for reciprocally flowing a medium (8) that exchanges heat with an MCE element, the device comprising a heat transport device (21) having a plurality of valves (24) for controlling the passage of the medium, and for driving the valve And a magnetic coupling structure (25, C25) for magnetically coupling the heat transport device and the valve armature (24f).

According to the disclosed thermomagnetic cycle device, the valve can be driven by the magnetic field supplied by the magnetic field modulator.

The disclosed aspects in this specification employ different technical means to achieve their respective ends. The claims and the reference numerals in parentheses in this section exemplify the corresponding relationship with the portions of the embodiments described later, and are not intended to limit the technical scope. Objects, features, and advantages disclosed in this specification will become more apparent with reference to the following detailed description and the accompanying drawings.

It is a block diagram of the thermal equipment which concerns on 1st Embodiment. It is sectional drawing of the thermal equipment which concerns on 1st Embodiment. It is sectional drawing of the valve in an excited state. It is sectional drawing of the valve in a non-excitation state. It is sectional drawing in the initial stage of excitation of the valve which concerns on 2nd Embodiment. It is sectional drawing in the end of excitation of the valve which concerns on 2nd Embodiment. It is a graph which shows the temperature characteristic of a spring constant. It is a wave form diagram which shows the driving|running state of an apparatus. It is sectional drawing which shows the excitation state of the valve which concerns on 3rd Embodiment. It is sectional drawing which shows the excitation state of the valve which concerns on 4th Embodiment. It is sectional drawing which shows the valve which concerns on 5th Embodiment. It is sectional drawing which shows the valve which concerns on 6th Embodiment. It is sectional drawing which shows the valve which concerns on 7th Embodiment. It is sectional drawing which shows the valve which concerns on 8th Embodiment. It is sectional drawing which shows the valve which concerns on 9th Embodiment. It is sectional drawing which shows the valve which concerns on 10th Embodiment. It is sectional drawing which shows the valve which concerns on 11th Embodiment. It is sectional drawing of the thermal equipment which concerns on 12th Embodiment. It is sectional drawing of the thermal equipment which concerns on 13th Embodiment.

Embodiments will be described with reference to the drawings. In embodiments, functionally and/or structurally corresponding parts and/or associated parts may be provided with the same reference signs or with hundreds or more different reference signs. For the corresponding part and/or the related part, the description of other embodiments can be referred to.

First Embodiment FIG. 1 shows an air conditioner 1 according to the first embodiment. The air conditioner 1 is one of thermal equipment. The air conditioner 1 includes a magnetocaloric effect heat pump device (MHP: Magneto-caloric effect Heat Pump) 2. The MHP device 2 provides a thermomagnetic cycle device.

In this specification, the term heat pump device is used in a broad sense. That is, the term “heat pump device” includes both a device that uses cold heat obtained by the heat pump device and a device that uses warm heat obtained by the heat pump device. A device that uses cold heat may also be referred to as a refrigeration cycle device. Therefore, in this specification, the term heat pump device is used as a concept including a refrigeration cycle device.

The MHP device 2 is configured to generate a temperature difference between the high temperature end HT and the low temperature end LT. The MHP device 2 has a high temperature system 3 and a low temperature system 4. The high temperature system 3 is provided at the high temperature end HT. The low temperature system 4 is provided at the low temperature end LT. The air conditioner 1 includes a device for taking out a thermal output from the MHP device 2. One of the output devices is provided by the heat exchanger 3a that uses the high temperature obtained at the high temperature end HT of the MHP device 2. The heat exchanger 3a provides heat exchange between the hot end HT and a medium such as air. The heat exchanger 3a is mainly used for heat dissipation. The heat exchanger 3a is installed, for example, in a vehicle cabin, and heats the air by exchanging heat with the air for air conditioning. The heat exchanger 3a is one of the components of the high temperature system 3. One of the output devices is provided by the heat exchanger 4a utilizing the low temperature obtained at the low temperature end LT of the MHP device 2. The heat exchanger 4a provides heat exchange between the low temperature end LT and a medium such as air. The heat exchanger 4a is mainly used for absorbing heat. The heat exchanger 4a is installed outside the vehicle, for example, and exchanges heat with the outside air. The heat exchanger 4a is one of the components of the low temperature system 4.

The MHP device 2 includes a housing 6. The housing 6 defines a working chamber in which the heat transport medium can flow. One working chamber extends along the axial direction of the housing 6. One working chamber is open on both axial end faces of the housing 6.

The MHP device 2 includes a magneto-caloric effect element (MCE: Magneto-Caloric Effect) 7. The MCE element 7 is fixedly supported in the housing 6. The MCE element 7 is located in the working room. The MCE element 7 is elongated along the axial direction of the housing 6.

The MHP device 2 utilizes the magnetocaloric effect of the MCE element 7. The MHP device 2 generates the high temperature end HT and the low temperature end LT by the MCE element 7. The MCE element 7 is provided between the high temperature end HT and the low temperature end LT. In the illustrated example, the right side of the drawing is the low temperature end LT, and the left end of the drawing is the high temperature end HT.

The MCE element 7 generates heat and absorbs heat in response to changes in the strength of the external magnetic field. The MCE element 7 generates heat when an external magnetic field is applied and absorbs heat when the external magnetic field is removed. In the MCE element 7, when an external magnetic field is applied and electron spins are aligned in the magnetic field direction, the magnetic entropy decreases, and heat is released to raise the temperature. Further, in the MCE element 7, when the external magnetic field is removed and the electron spin becomes disordered, the magnetic entropy increases, and the temperature is lowered by absorbing heat. The MCE element 7 is made of a magnetic material that exerts a high magnetocaloric effect at room temperature. For example, a gadolinium-based material or a lanthanum-iron-silicon compound can be used. Also, a mixture of manganese, iron, phosphorus and germanium can be used. The MCE element 7 may be an element that absorbs heat when an external magnetic field is applied and generates heat when the external magnetic field is removed.

The MCE element 7 has a plurality of partial elements connected in series. The MCE element 7 is also called a cascade connection element. The plurality of partial elements exhibit a magnetocaloric effect with high efficiency in different temperature zones. The plurality of partial elements are arranged so as to share the temperature difference between the high temperature end HT and the low temperature end LT.

The MCE element 7 is arranged so as to exchange heat with the medium 8 responsible for heat transport. In other words, the medium 8 exchanges heat with the MCE element 7. The medium 8 fills the working chamber. The medium 8 stores heat and provides a heat storage element that transports heat. The MCE element 7 is arranged long along the flow direction of the medium 8. The medium 8 is called the primary medium. The primary medium can be provided by a fluid such as antifreeze, water, oil. The housing 6 and the MCE element 7 provide an element bed.

The MHP device 2 includes a magnetic field modulator 11 (MGMD) for causing the MCE element 7 to function as an element of an AMR (Active Magnetic Refrigeration) cycle, and a heat transport device 21. The magnetic field modulator 11 provides a periodically varying magnetic field. The MCE element 7 is arranged in a magnetic field and exhibits a magnetocaloric effect. The magnetic field modulator 11 applies an external magnetic field to the MCE element 7 and increases or decreases the strength of the external magnetic field. The magnetic field modulator 11 periodically switches between an excited state in which the MCE element 7 is placed in a strong magnetic field and a demagnetized state in which the MCE element 7 is placed in a weak magnetic field or a zero magnetic field. The magnetic field modulator 11 modulates the external magnetic field so as to periodically repeat the excitation period and the demagnetization period. The excitation period is a period in which the MCE element 7 is placed in a strong external magnetic field. The demagnetization period is a period in which the MCE element 7 is placed in an external magnetic field weaker than the excitation period. The magnetic field modulator 11 includes a movable mechanism that periodically changes the distance between the MCE element 7 and the magnetic force source. The movable mechanism moves either the MCE element 7 or the magnetic force source with respect to the other.

The heat transport device 21 is a device that causes the medium 8 that exchanges heat with the MCE element 7 to flow back and forth along the MCE element 7. The heat transport device 21 moves the medium 8 in the axial direction (left and right direction in the figure) in synchronization with heat generation and heat absorption by the magnetocaloric effect of the MCE element 7. The heat transport device 21 causes relative reciprocal movement between the MCE element 7 and the medium 8. In this embodiment, the reciprocating movement is realized by the reciprocating flow of the medium 8. The high temperature system 3 and the low temperature system 4 provide a heat transport device 21. The high temperature system 3 and the low temperature system 4 generate a flow of the medium 8. The high temperature system 3 is arranged between the heat exchanger 3a and the element bed (MCE element 7). The high temperature system 3 provides a medium for the heat exchanger 3a. The low temperature system 4 is arranged between the heat exchanger 4a and the element bed (MCE element 7). The low temperature system 4 provides a medium for the heat exchanger 4a. These media may be media 8. These media may be secondary media that exchange heat with the media 8.

The heat transport device 21 has a plurality of valves 24 that control the passage of the medium 8. The plurality of valves 24 include a high temperature end valve 32 which is one of the components of the high temperature system 3. The high temperature end valve 32 is arranged between the device 3 b of the high temperature system 3 and the MCE element 7. The high temperature end valve 32 controls the inflow and outflow of the medium 8 to and from the element bed (MCE element 7) at the high temperature end HT. The high temperature end valve 32 controls the passage of the medium 8 at the high temperature end HT of the MCE element 7.

The plurality of valves 24 include a low temperature end valve 33 which is one of the components of the low temperature system 4. The low temperature end valve 33 is arranged between the device 4 b of the low temperature system 4 and the MCE element 7. The low temperature end valve 33 controls the inflow and outflow of the medium 8 to and from the element bed (MCE element) 7 at the low temperature end LT. The low temperature end valve 33 controls the passage of the medium 8 at the low temperature end LT of the MCE element 7.

The plurality of valves 24 have an armature 24f. The armature 24f provides a movable iron core. The armature 24f drives the plurality of valves 24 in response to changes in the magnetic field supplied from the outside.

The heat transport device 21 includes a magnetic coupling structure 25. The magnetic coupling structure 25 magnetically couples the heat transport device 11 and the armature 24f of the valve 24 to drive the valve 24. The magnetic coupling structure 25 includes one or more members or cavities. The magnetic coupling structure 25 includes a magnetic member that guides a magnetic flux, an air gap, a magnetic flux transmission member that allows transmission of the magnetic flux, and the like. The magnetic coupling structure 25 enables the magnetic field modulator 11 to drive the armature 24f by the magnetic field. In this embodiment, the armature 24f is driven by the leakage magnetic field supplied from the magnetic field modulator 11 to the MCE element 7. As a result, the magnetic field modulator 11 drives the plurality of valves 24 via the armature 24f. Therefore, the magnetic field sources 12 and 13 supply both a magnetic field for exciting the MCE element 7 and a magnetic field for driving the armature 24f. The magnetic field sources 12 and 13 are also called common magnetic field sources.

FIG. 2 shows the air conditioner 1 of this embodiment. The MHP device 2 has a rotating shaft 2 a for driving the MHP device 2. The rotary shaft 2a is operatively connected to the power source 5. Therefore, the MHP device 2 is rotationally driven by the power source 5. The power source 5 provides rotational power to the MHP device 2. The power source 5 is the only power source of the MHP device 2. The power source 5 is provided by a rotating device such as an electric motor or an internal combustion engine. An example of a power source is an electric motor driven by a battery mounted on a vehicle. The extending direction of the central axis AX of the rotating shaft 2a may be referred to as the axial direction. The radial direction with respect to the central axis AX may be called the radial direction or the radial direction.

The housing 6 rotatably supports the rotating shaft 2a. The housing 6 defines a plurality of working chambers. The plurality of work chambers are also called a plurality of cylinders. The housing 6 can include a plurality of work chambers. The plurality of working chambers are arranged along the circumferential direction of the housing 6. The MHP device 2 includes a plurality of MCE elements 7. The plurality of MCE elements 7 are arranged apart from each other along the circumferential direction of the housing 6.

The MHP device 2 includes a control device (CT) 9. The controller 9 controls at least the power source 5. The control device 9 controls the rotation speed of the power source 5. In addition, the control device 9 controls the function of the air conditioner 1. The controller 9 controls, for example, the amount of air blown to the heat exchanger 3a and/or the heat exchanger 4a.

The control device 9 is an electronic control unit (Electronic Control Unit). The controller 9 provides a control system for the thermomagnetic cycle device. The control system has at least one arithmetic processing unit (CPU) and at least one memory device as a storage medium for storing programs and data. The control system is provided by a microcomputer including a computer-readable storage medium. The storage medium is a non-transitional tangible storage medium that non-temporarily stores a computer-readable program. The storage medium can be provided by a semiconductor memory, a magnetic disk, or the like. The control system may be provided by a computer or a set of computer resources linked by a data communication device. The program, when executed by the control system, causes the control system to function as the device described in this specification and causes the control system to function to execute the method described in this specification.

The means and/or functions provided by the control system can be provided by software recorded in a substantial memory device and a computer executing the software, software only, hardware only, or a combination thereof. For example, the control system can be provided by a logic called if-then-else form or a neural network tuned by machine learning. Alternatively, for example, where the control system is provided by an electronic circuit that is hardware, it can be provided by a digital circuit containing multiple logic circuits, or an analog circuit.

The control device in this specification may also be referred to as an electronic control unit (ECU: Electronic Control Unit). The controller or control system is provided by (a) an algorithm as a plurality of logics called if-then-else form, or (b) a trained model tuned by machine learning, for example, an algorithm as a neural network. ..

The control device is provided by a control system including at least one computer. The control system may include multiple computers linked by a data communication device. The computer includes at least one processor (hardware processor) that is hardware. The hardware processor can be provided by (i), (ii), or (iii) below.

(I) The hardware processor may be at least one processor core that executes a program stored in at least one memory. In this case, the computer is provided with at least one memory and at least one processor core. The processor core is called a CPU: Central Processing Unit, a GPU: Graphics Processing Unit, a RISC-CPU, or the like. The memory is also called a storage medium. A memory is a non-transitional and tangible storage medium that stores "programs and/or data" readable by a processor in a non-transitory manner. The storage medium is provided by a semiconductor memory, a magnetic disk, an optical disk, or the like. The program may be distributed by itself or as a storage medium storing the program.

(Ii) The hardware processor may be a hardware logic circuit. In this case, the computer is provided by a digital circuit including a large number of programmed logic units (gate circuits). The digital circuit is a logic circuit array, for example, ASIC: Application-Specific Integrated Circuit, FPGA: Field Programmable Gate Array, SoC: Programmable CCP, etc. The digital circuit may include a memory that stores programs and/or data. The computer may be provided by analog circuitry. The computer may be provided by a combination of digital circuits and analog circuits.

(Iii) The hardware processor may be a combination of (i) and (ii) above. (I) and (ii) are arranged on different chips or on a common chip. In these cases, the part (ii) is also called an accelerator.

The control device, the signal source, and the controlled object provide various elements. At least some of these elements can be referred to as blocks, modules, or sections. Further, the elements included in the control system are referred to as functional means only if they are intentional.

The control unit and the method described in this disclosure are realized by a dedicated computer provided by configuring a processor and a memory programmed to execute one or a plurality of functions embodied by a computer program. May be done. Alternatively, the control unit and the method described in this disclosure may be realized by a dedicated computer provided by configuring a processor with one or more dedicated hardware logic circuits. Alternatively, the controller and techniques described in this disclosure include a processor and memory programmed to perform one or more functions and a processor configured with one or more hardware logic circuits. It may be realized by one or more dedicated computers configured by combination. Further, the computer program may be stored in a computer-readable non-transition tangible recording medium as an instruction executed by a computer.

The magnetic field modulator 11 is arranged to face the MCE element 7 in the radial direction. The magnetic field modulator 11 is arranged inside and/or outside of the MCE element 7 in the radial direction. The magnetic field modulator 11 periodically increases or decreases the magnetic field by the relative rotational movement of the magnetic force source and the element bed. The magnetic field modulator 11 is driven by the rotational power given to the rotary shaft 2a. The fluctuation of the magnetic field can be created by rotationally moving only one of the magnetic force source and the element bed or both of them. In this embodiment, the element bed provides a stationary member. The magnetic force source provides a movable member. The magnetic field modulator 11 includes magnetic force sources 12 and 13 for generating an external magnetic field. The magnetic force sources 12, 13 can be provided by permanent magnets or electromagnets. The magnetic force source 12 moves radially outside the MCE element 7. The magnetic force source 13 moves inside the MCE element 7 in the radial direction. The magnetic field modulator 11 repeats the application and removal of the magnetic field to the MCE element 7 in synchronization with the reciprocal flow of the medium 8.

The heat transport device 21 includes a pump and a flow path switching mechanism. The pump is a one-way flow type pump that allows the medium to flow in one direction. The pump 22 causes the medium 8 to flow in the high temperature system. The pump 23 causes the flow of the medium 8 in the low temperature system. The pumps 22 and 23 can be driven by the rotary shaft 2a. Only one of the pumps 22 and 23 may be provided.

The flow path switching mechanism includes a plurality of valves 24 for one element bed (one MCE element 7). The plurality of valves 24 include a high temperature end valve that is arranged at the high temperature end HT of the element bed (MCE element 7) to open and close the passage of the medium 8. The plurality of valves 24 include a low temperature end valve 33 that is arranged at the low temperature end LT of the element bed (MCE element 7) to open and close the passage of the medium 8.

Specifically, the magnetic field modulator 11 rotationally moves the magnetic force sources 12 and 13. Thereby, the magnetic field modulator 11 alternately switches the magnetic field applied to one working chamber (MCE element 7) between the excitation period and the demagnetization period. The heat transport device 21 pumps the medium 8 by the pumps 22 and 23, and complementarily drives the plurality of valves 24. As a result, the heat transport device 21 alternately reverses the flow direction of the medium 8 in the working chamber (MCE element 7). The switching of the magnetic field by the magnetic field modulator 11 and the reversal of the flow direction by the heat transport device 21 are synchronized. When the magnetic field modulator 11 places the MCE element 7 in a strong magnetic field, the heat transport device 21 causes the medium 8 to flow along the MCE element 7 in the first direction. The first direction is a direction from the low temperature end LT to the high temperature end HT. When the magnetic field modulator 11 places the MCE element 7 in a weak magnetic field, the heat transport device 21 causes the medium 8 to flow along the MCE element 7 in the second direction. The second direction is a direction from the high temperature end HT to the low temperature end LT.

Each of the plurality of valves 24 is a switching valve that switches the flow direction. Valve 24 is a three port, two position valve. The valve 24 has a first position 24a and a second position 24b. The valve 24 has a main port 24c communicating with the element bed (MCE element 7). The valve 24 has two selection ports 24d and 24e. The valve 24 selectively connects only one of the two selection ports 24d and 24e to the main port 24c in the first position 24a and the second position 24b. The armature 24f is mechanically coupled as a movable iron core of the valve 24 to a movable valve body that switches between the first position 24a and the second position 24b. The valve 24 connects the main port 24c and the first selection port 24d in the first position 24a, for example. In the energized state in which the armature 24f is energized, the valve 24 provides the first position 24a. The valve 24 connects the main port 24c and the second selection port 24e in the second position 24b, for example. In the de-energized state where the armature 24f is de-energized, the valve 24 provides the second position 24b.

Each of the plurality of valves 24 provides an inlet port for the medium 8 to flow into the element bed and an outlet port for the medium 8 to flow out of the element bed. The first selection port 24d and the second selection port 24e can be used as an inlet port and an outlet port.

The valve 24 may include biasing means for biasing it towards either the first position 24a or the second position 24b. In this embodiment, the valve 24 provides a first position 24a when energized and a second position 24b when de-energized. The biasing means biases the valve 24 toward the second position 24b in the non-excited state. The biasing means biases the valve 24 to return from the first position 24a to the second position 24b. The biasing means is also called a returning means or a restoring means. The biasing means may be provided by a biasing member, for example. The biasing means may be provided, for example, by a medium providing fluid pressure and a pressure receiving surface. The bias member can be provided by an elastic member made of metal or resin. The elastic member can be provided by a coil spring, an elastic mass, an elastic bag, or the like.

When the rotating shaft 2a rotates, the magnetic force sources 12 and 13 move relatively to the MCE element 7. At the same time, when the rotating shaft 2a rotates, the magnetic force sources 12 and 13 move relative to the armature 24f. The magnetic field modulator 11 strongly modulates the magnetic field applied to the MCE element 7. At the same time, the magnetic field modulator 11 strongly modulates the leakage magnetic field. The stray magnetic field acts on the armature 24f through the magnetic coupling structure 25. The magnetic coupling structure 25 is configured to cause the leakage magnetic fields of the magnetic force sources 12 and 13 to act on the armature 24f. A state in which the magnetic field acting on the armature 24f exceeds a threshold value that allows the valve body 24v to be driven is called an excited state. A state in which the magnetic field acting on the armature 24f is below the threshold value is called a non-excitation state. During the period when the stray magnetic field acts on the armature 24f through the magnetic coupling structure 25, the armature 24f drives the valve 24 to the first position 24a. The armature 24f drives the valve 24 to the second position 24b during the period when the leakage magnetic field does not act on the armature 24f. As a result, the armature 24f alternately switches between the first position 24a and the second position 24b in response to the magnetic field modulation by the magnetic field modulator 11. In this way, the flow of the medium 8 is controlled.

3 and 4 show the valve 24 including the high temperature end valve 32 and the low temperature end valve 33. FIG. 3 shows an excited state. FIG. 4 shows a non-excited state. In these figures, the element bed and the magnetic sources 12, 13 have been simplified. The valve 24 has a housing 24h and a valve body 24v.

The housing 24h provides a flow path for the medium 8. The housing 24h has a plurality of ports 24c, 24d, 24e. The housing 24h defines a valve chamber that movably accommodates the valve element 24v. The housing 24h provides a fixed valve seat as the valve 24. The housing 24h is made of a non-magnetic material that transmits magnetic flux. The magnetic coupling structure 25 includes a housing 24h that allows transmission of magnetic flux. The housing 24h may partially include a magnetic body as a part of the magnetic coupling structure 25. The housing 24h is preferably made of a material having a large resistivity in order to reduce the eddy current loss in addition to the non-magnetic flux transmission. The housing 24h is made of metal such as aluminum, aluminum alloy, stainless alloy, titanium, and titanium alloy. The housing 24h may be made of resin, for example. The housing 24h may be, for example, a carbon-containing material such as carbon, or a carbon fiber reinforced plastic.

The housing 24h has a passage hole 24m that provides the first selection port 24d. The passage hole 24m extends along the axis AXm. The housing 24h has a passage hole 24n that provides a second selection port 24e. The passage hole 24n extends along the axis AXn. The axis AXn and the axis AXm intersect. The passage hole 24m and the passage hole 24n extend in a direction away from the element bed. This structure enables the valve body 24v and the magnetic force sources 12 and 13 to be arranged at a short distance. The distance between the valve body 24v and the magnetic sources 12, 13 is closer than in the case where a passage is formed between the valve body 24v and the element bed. The shorter the distance between the valve body 24v and the magnetic sources 12 and 13, the stronger the attractive force generated in the armature 24f.

The valve body 24v is housed in the valve chamber defined by the housing 24h. The valve body 24v has a rectangular parallelepiped shape. The valve body 24v has a facing surface 24t facing the first selection port 24d for opening and closing the first selection port 24d. The valve body 24v has a facing surface 24s facing the second selection port 24e for opening and closing the second selection port 24e. The opposing surface 24s is also an inclined surface that intersects the moving direction of the valve body 24v. The facing surface 24s is also called a slope. Therefore, the valve body 24v has a rectangular parallelepiped shape having a slope in part. The housing 24h has an inclined surface facing the facing surface 24s. The passage hole 24n that provides the second selection port 24e is open to the slope. As a result, the valve 24 has a structure in which the inflow direction and the outflow direction of the medium 8 with respect to the valve body 24v intersect. This structure allows a relatively close arrangement of the valve 24 and the magnetic sources 12, 13.

The valve body 24v is a mover that can move to a first position 24a and a second position 24b in the housing 24h. The valve body 24v connects the main port 24c and the first selection port 24d at the first position 24a. At the first position 24a, the valve body 24v forms a communication passage that passes through the through hole that penetrates the valve body 24v and the valve chamber. The valve body 24v connects the main port 24c and the second selection port 24e at the second position 24b. The valve body 24v forms a communication passage that passes through the valve chamber at the second position 24b.

The valve body 24v is made of a magnetic material. The valve body 24v is made of metal such as soft iron or magnetic resin. The valve body 24v is arranged in the valve chamber together with the armature 24f. The valve body 24v also serves as the armature 24f.

The magnetic coupling structure 25 is configured to magnetically couple the heat transport device 11 and the armature 24f by the magnetic flux passing through the housing 24h. The driving force for driving the valve element 24v is given by the magnetic field passing through the housing 24h. Therefore, the leakage of the medium 8 from the valve 24 is suppressed. When the valve body 24v is driven by a cam mechanism or the like, a sealing mechanism made of rubber or the like is required to suppress the leakage of the medium 8. However, in this embodiment, since the valve element 24v can be driven without the sealing mechanism, the leakage of the medium 8 due to the sealing mechanism is suppressed.

The valve 24 has a spring 24r as a bias member. The spring 24r is arranged between the housing 24h and the valve body 24v in a compressed state. The spring 24r urges the valve body 24v from the first position 24a toward the second position 24b against the attraction force of the magnetic force sources 12 and 13. In the excited state, the spring 24r yields to the magnetic attraction force acting on the valve body 24v and allows the valve body 24v to move to the first position 24a. In the non-excited state, the spring 24r moves the valve body 24v to the second position 24b and holds it.

As illustrated in FIG. 3, in the excited state, the magnetic force sources 12 and 13 apply the main magnetic field MM to the MCE element 7. At the same time, the leakage magnetic field ML12 of the magnetic force source 12 attracts the valve element 24v and generates an attraction force Fs. At the same time, the leakage magnetic field ML13 of the magnetic force source 13 attracts the valve element 24v and generates an attractive force Fr. As a result, the valve body 24v is attracted so as to approach the magnetic force sources 12 and 13, reaches the first position 24a, and is maintained.

As illustrated in FIG. 4, the attraction forces Fs and Fr are lost in the non-excited state. As a result, the valve element 24v reaches and is maintained at the second position 24b by the spring 24r. When the second position 24b is the origin, the spring 24r provides an origin returning unit that biases the valve body 24v toward the origin.

According to the embodiment described above, the valve 24 can be driven by utilizing the periodic magnetic field fluctuation generated by the magnetic field modulator 11. Moreover, the valve 24 can be driven by utilizing the leakage magnetic field. Further, the valve body 24v including the armature 24f is housed in the valve chamber defined in the housing 24h. As a result, the leakage of the medium 8 can be suppressed.

Second Embodiment This embodiment is a modification based on the preceding embodiment. In the above embodiment, the spring 24r is used as the bias means. Instead of this, in this embodiment, a bias means that enables simultaneous pressurization by the high temperature end valve 32 and the low temperature end valve 33 is used.

Compressible gas bubbles may be mixed in the medium 8. The bubbles may adhere to the surface of the MCE element 7, for example. The air bubbles impede the flow of medium 8. The high temperature end valve 32 and the low temperature end valve 33 alternately repeat the drive state of FIG. 3 and the drive state of FIG. In this case, the flow of the medium 8 is alternately switched as a reciprocating flow. However, the bubbles cause a delay of a minute period when the reciprocating flow commutates. This is because the bubbles are compressed. The delay of commutation caused by bubbles causes an error between the phase of magnetic field modulation and the phase of reciprocal flow. As a result, the refrigerating capacity of the MHP device 2 may decrease. In this embodiment, by providing a period in which the medium 8 is simultaneously applied from the high temperature end valve 32 and the low temperature end valve 33, the bubbles are preliminarily compressed and the delay in commutation is suppressed. Therefore, the drive of one of the high temperature end valve 32 and the low temperature end valve 33 is advanced and retarded.

Further, the operation of the MHP device 2 starts from the normal temperature range, the temperature rises at the high temperature end HT, and the temperature falls at the low temperature end LT. The MHP device 2 is designed so that a predetermined high temperature is obtained at the high temperature end HT and a predetermined low temperature is obtained at the low temperature end LT. In many cases, a low temperature TL different from the normal temperature range is obtained at the low temperature end LT. The temperature of the low temperature end LT gradually decreases from the beginning of the operation, and reaches the low temperature region TL in the steady operation state. Many media 8 increase in viscosity at low temperatures. Therefore, in the low temperature end LT and the low temperature system 4, the delay in commutation becomes significant due to the viscosity of the medium 8. Therefore, in this embodiment, as the operation of the MHP device 2 progresses and the temperature of the low temperature end LT decreases, the bubbles are preliminarily compressed to suppress the delay in commutation.

5 and 6, the low temperature end valve 33 includes a spring 224r as a bias means. The high temperature end valve 32 includes a spring 24r. FIG. 7 shows temperature characteristics of the springs 24r and 224r.

At the initial temperature Tn in the initial operation of the MHP device 2, the spring constant Sc24r of the spring 24r is larger than the spring constant of the spring 224r. This spring constant difference dSc produces a difference in responsiveness between the high temperature end valve 32 and the low temperature end valve 33. In other words, the spring 24r is harder than the spring 224r. As a result, the low temperature end valve 33 is easier to switch than the high temperature end valve 32 in the initial operation of the MHP device 2. In other words, the low temperature end valve 33 has a higher response to the magnetic field than the high temperature end valve 32. The response of the low temperature end valve 33 to the magnetic field is more sensitive than the response of the high temperature end valve 32 to the magnetic field. The low temperature end valve 33 switches at an earlier time than the high temperature end valve 32 with respect to the increase of the magnetic field. Specifically, the low temperature end valve 33 switches from the second position 24b to the first position 24a at an earlier time than the high temperature end valve 32. The low temperature end valve 33 switches to a time later than the high temperature end valve 32 with respect to the decrease of the magnetic field. Specifically, the low temperature end valve 33 switches from the first position 24a to the second position 24b at a later time than the high temperature end valve 32. This time difference provides a period in which the medium 8 is applied simultaneously from both the hot end valve 32 and the cold end valve 33. As a result, the bubble BL is compressed and becomes smaller. The compression of the bubbles BL suppresses the delay during commutation.

Further, the spring 224r has a temperature characteristic that the spring constant Sc decreases as the temperature TEMP becomes lower. The spring constant ScL in the low temperature region TL is smaller than the spring constant Scn in the initial temperature Tn (ScL<Scn). As described above, the low temperature region TL is lower than the initial temperature Tn (TL<Tn). Therefore, the lower the temperature, the smaller the bubbles BL are compressed. The further compression of the bubbles BL further suppresses the delay during commutation.

FIG. 8 shows the behavior of the high temperature end valve 32 and the low temperature end valve 33, the magnetic field Mg, and the flow of the medium 8. The high temperature end valve 32 and the low temperature end valve 33 have drive characteristics that are driven to add the medium 8 from both the high temperature end HT and the low temperature end LT. The high temperature end valve 32 and the low temperature end valve 33 have drive characteristics in which one valve switches faster than the other valve and one valve switches later than the other valve. This drive characteristic is given by the difference in the urging force between the spring 24r, which is the biasing means for urging the high temperature end valve 32, and the spring 224r, which is the biasing means for urging the low temperature end valve 33. The bias means may have a temperature characteristic in which the biasing force changes according to the temperature. Both of the spring 24r and the spring 224r may have temperature characteristics.

When the high temperature end valve 32 is switched from the non-excited state to the excited state, the high temperature end valve 32 moves from the second position 24b to the first position 24a at time t2. When the high temperature end valve 32 is switched from the excited state to the non-excited state, the high temperature end valve 32 moves from the first position 24a to the second position 24b at time t3. When the low temperature end valve 33 is switched from the non-excited state to the excited state, the low temperature end valve 33 moves from the second position 24b to the first position 24a at time t1. That is, the low temperature end valve 33 switches to the first position 24a in the excited state at a time earlier than the high temperature end valve 32 (t1<t2). When the low temperature end valve 33 is switched from the excited state to the non-excited state, the low temperature end valve 33 moves from the first position 24a to the second position 24b at time t4. That is, the low temperature end valve 33 switches to the second position 24b in the non-excited state at a time later than the high temperature end valve 32 (t3<t4).

The operating states of the high temperature end valve 32 and the low temperature end valve 33 change from the state IV in FIG. 4 to the state III in FIG. 3 via the state V in FIG. The operating states of the high temperature end valve 32 and the low temperature end valve 33 change from the state III in FIG. 3 to the state IV in FIG. 4 via the state VI in FIG. As a result, in the period t2-t1 or the period t4-t3 before the commutation, the bubbles BL are compressed and the commutation delay is suppressed. The solid line EMB shows the waveform according to this embodiment. The alternate long and short dash line CMP shows the waveform of the comparative example. According to this embodiment, in addition to the effect of the preceding embodiment, delay of commutation caused by bubbles is suppressed.

Third Embodiment This embodiment is a modification based on the preceding embodiment as a basic form. In the above embodiment, the valve element 24v is arranged outside the element bed. Instead of or in addition to this, in this embodiment, a member as the armature 24f is formed so as to be able to enter the element bed.

FIG. 9 shows the first position 24 a of the high temperature end valve 32 and the second position 24 b of the low temperature end valve 33. The valve body 24v has a protrusion 324p that reaches into the element bed. The protrusion 324p has magnetism that can function as a part of the armature 24f. The protruding portion 324p contributes to receiving the leakage magnetic field from the magnetic force sources 12 and 13 more strongly. In other words, the protrusion 324p contributes to receiving more magnetic flux leaking from the magnetic force sources 12 and 13. The protrusion 324p may extend to reach into the main magnetic field provided by the magnetic sources 12,13. The protrusion 324p may be arranged in the main magnetic circuit by the magnetic force sources 12 and 13. According to this embodiment, the valve element 24v can obtain a strong suction force.

Fourth Embodiment This embodiment is a modification based on the preceding embodiment. In the above embodiment, the valve 24 includes the facing surface 24s as a slope. Instead of this, in this embodiment, the housing 24h and the valve body 24v are formed without the facing surface 24s.

FIG. 10 shows the hot end valve 32. The low temperature end valve 33 has a shape similar to that of the high temperature end valve 32. In this embodiment, the housing 24h has a thick wall between the valve body 24v and the element bed. A passage hole is formed in the wall for the first selection port 424d. The valve body 24v has a rectangular parallelepiped shape. The valve body 24v has a protrusion 424p in order to more strongly receive the leakage magnetic field. According to this embodiment, the protrusion 424p contributes to receive the leakage magnetic field from the magnetic force sources 12 and 13 more strongly. Further, the protrusion 424p contributes to increase the degree of freedom in the shape of the housing 24h. Further, the protruding portion 424p contributes to increase the degree of freedom in the shape of the valve body 24v.

Fifth Embodiment This embodiment is a modification based on the preceding embodiment as a basic form. In the above embodiment, the valve 24 includes springs 24r and 224r as biasing means. Instead, in this embodiment, the valve 24 includes a resin block 524r as a bias means.

FIG. 11 shows block 524r. The block 524r is a block made of resin. The block 524r is elastically deformable between the contracted shape at the first position 24a and the extended shape at the second position 24b. The block 524r may have the same temperature characteristics as the spring 224r described above.

Sixth Embodiment This embodiment is a modification based on the preceding embodiment. In the above embodiment, the valve 24 includes the spring 24r in a compressed state. Instead, in this embodiment, the valve 24 comprises a spring 624r in tension.

In FIG. 12, the valve 24 has a spring 624r between the housing 24h and the valve body 24v. The spring 624r has one end fixed to the housing 24h and the other end fixed to the valve body 24v. When the valve element 24v is attracted toward the first position 24a in the excited state, the spring 624r is stretched. When the magnetic attraction force is lost in the non-excited state, the spring 624r contracts and pulls the valve body 24v back to the second position 24b. Also in this embodiment, it is possible to obtain the same effects as those of the preceding embodiment.

Seventh Embodiment This embodiment is a modification based on the preceding embodiment. In this embodiment, the valve 24 comprises a spring 724r on the flow path of the medium 8.

In FIG. 13, the valve 24 has a spring 724r between the second selection port 24e and the element bed. The spring 724r is arranged in a compressed state between the housing 24h and the valve body 24v. The spring 724r is coaxially arranged around the through hole of the valve body 24v. This arrangement allows the spring 724r to have a relatively large diameter. The spring 724r biases the valve element 24v toward the second position 24b in the non-excited state. The spring 724r is susceptible to the temperature of the medium 8 passing through the second selection port 24e. The spring 724r has a temperature characteristic similar to that of the preceding embodiment. The spring 724r is suitable for the temperature characteristic that responds to the temperature of the medium 8 passing through the second selection port 24e.

Eighth Embodiment This embodiment is a modification based on the preceding embodiment. In this embodiment, the valve 24 comprises a spring 824r on the flow path of the medium 8.

In FIG. 14, the valve 24 has a spring 824r between the first selection port 24d and the element bed. The spring 824r has one end fixed to the housing 24h and the other end fixed to the valve body 24v. The spring 724r is coaxially arranged around the through hole of the valve body 24v. This arrangement allows the spring 724r to have a relatively large diameter. The spring 824r biases the valve element 24v toward the second position 24b in the non-excited state. The spring 824r is susceptible to the temperature of the medium 8 passing through the first selection port 24d. The spring 824r has a temperature characteristic similar to that of the preceding embodiment. The spring 824r is suitable for the temperature characteristic that responds to the temperature of the medium 8 passing through the first selection port 24d.

Ninth Embodiment This embodiment is a modification based on the preceding embodiment. In this embodiment, the valve 24 comprises a spring 924r on the flow path of the medium 8.

In FIG. 15, the valve 24 has a spring 924r between the second selection port 24e and the element bed. The spring 924r is arranged in a compressed state between the housing 24h and the valve body 24v. The spring 924r biases the valve body 24v toward the second position 24b in the non-excited state. The spring 924r is susceptible to the temperature of the medium 8 passing through the second selection port 24e.

Tenth Embodiment This embodiment is a modification based on the preceding embodiment. In this embodiment, the valve 24 comprises a spring A24r on the flow path of the medium 8.

In FIG. 16, the valve 24 has a spring A24r between the first selection port 24d and the element bed. The spring A24r has one end fixed to the housing 24h and the other end fixed to the valve body 24v. The spring A24r biases the valve body 24v toward the second position 24b in the non-excited state. The spring A24r is susceptible to the temperature of the medium 8 passing through the first selection port 24d.

Eleventh Embodiment This embodiment is a modification based on the preceding embodiment as a basic form. In the above embodiment, the valve 24 includes an elastic member as the biasing means. Instead of this, in this embodiment, the valve 24 is capable of returning from the first position 24a in the excited state to the second position 24b in the non-excited state by the pressure P of the medium 8 and the pressure receiving surface as bias means. There is.

In FIG. 17, the valve 24 utilizes the pressure P of the medium 8 and the pressure receiving surface of the valve body 24v as biasing means. The valve body 24v does not include an elastic member such as the spring 24r. However, the valve body 24v includes a pressure receiving surface B24u. The pressure P of the medium 8 acting on the pressure receiving surface B24u generates a force that urges the valve body 24v from the first position 24a toward the second position 24b. The valve body 24v has a pressure receiving surface B24u that receives the pressure P of the medium 8 and biases the valve body 24v toward the origin position. In this embodiment, the number of parts of the valve 24 can be suppressed.

Twelfth Embodiment This embodiment is a modification based on the preceding embodiment as a basic form. In the above-described embodiment, the valve 24 is driven by utilizing the leakage magnetic field of the magnetic field modulator 11. Instead, in this embodiment, the magnetic field modulator 11 comprises a magnetic force source C26 for driving the valve 24.

In FIG. 18, the MHP device 2 includes a magnetic field modulation device 11. The magnetic field modulator 11 supplies a magnetic field that changes periodically. The magnetic field modulator 11 further includes a magnetic force source C14 in addition to the magnetic force sources 12 and 13 for supplying a magnetic field to the MCE element 7. The magnetic force source C14 supplies a periodically varying magnetic field. The magnetic force source C14 is arranged to supply its main magnetic field to the armature 24f. The magnetic coupling structure C25 causes the magnetic field of the magnetic force source C14 to act on the armature 24f. The magnetic force source C14 is also called a dedicated magnetic force source arranged for the armature 24f.

According to this embodiment, a strong magnetic field can be applied to the valve 24. Therefore, the valve 24 can be reliably driven. Furthermore, the magnetic force source C14 can be arranged so as to generate a phase difference between the magnetic field fluctuations generated by the magnetic force sources 12 and 13 and the magnetic field fluctuations generated by the magnetic force source C14. In this case, the phase difference between the magnetic field fluctuation applied to the MCE element 7 and the reciprocating flow of the medium 8 can be adjusted. Further, the position of the magnetic force source C14 may be configured to be movable with respect to the positions of the magnetic force sources 12 and 13. In this case, the phase difference between the magnetic field fluctuation and the reciprocating flow can be variably adjusted.

Thirteenth Embodiment This embodiment is a modification based on the preceding embodiment. In the above embodiment, one valve 24 is provided by one three-port two-position valve, that is, one switching valve. Alternatively, in this embodiment, one valve 24 is provided by two two-port two-position valves, i.e. two on-off valves.

In FIG. 19, the MHP device 2 includes a plurality of valves 24. The plurality of valves 24 provide a hot end valve 32 and a cold end valve 33. One valve 24 provides one hot end valve 32. One high temperature end valve 32 is provided by two on-off valves D34 and D35. One valve 24 provides one cold end valve 33. One low temperature end valve 33 is provided by two on-off valves D36 and D37. Also in this embodiment, the plurality of on-off valves D34, D35, D36, D37 are operatively connected to the magnetic field modulator 11 by the magnetic coupling structure C25. The plurality of on-off valves D34, D35, D36, D37 are driven so as to provide a reciprocating flow of the medium 8 by the magnetic field fluctuation provided by the magnetic field modulator 11. Also in this embodiment, it is possible to obtain the same operational effects as those of the preceding embodiment.

Other Embodiments The disclosures in this specification and the drawings are not limited to the illustrated embodiments. The disclosure encompasses the illustrated embodiments and variations on them based on them. For example, the disclosure is not limited to the combination of parts and/or elements shown in the embodiments. The disclosure can be implemented in various combinations. The disclosure may have additional parts that may be added to the embodiments. The disclosure includes omissions of parts and/or elements of the embodiments. The disclosure includes replacements or combinations of parts and/or elements between one embodiment and another. The disclosed technical scope is not limited to the description of the embodiments. It is to be understood that some technical scopes disclosed are indicated by the description of the claims and further include meanings equivalent to the description of the claims and all modifications within the scope.

The disclosure in the specification and drawings is not limited by the scope of the claims. The disclosures in the specification, drawings and the like include the technical ideas described in the claims, and further cover various and broader technical ideas than the technical ideas described in the claims. Therefore, various technical ideas can be extracted from the disclosure of the specification and drawings without being bound by the description of the claims.

In the above embodiment, the valve element 24v also serves as the armature 24f. Instead of this, the valve body 24v may include both members of a non-magnetic portion for controlling the passage of the medium 8 and a magnetic portion that functions as the armature 24f. In this case, the valve body 24v includes a valve member for controlling the passage of the medium 8, an armature 24f, and a connecting mechanism that mechanically connects them. Also in this case, it is desirable that the valve member, the armature 24f, and the connecting mechanism are housed in the housing 24h to suppress the leakage of the medium 8.

In the above embodiment, the magnetic coupling structure 25, C25 includes the housing 24h that allows the transmission of magnetic flux. Alternatively or additionally, the magnetic coupling structure 25, C25 can include a magnetic body that guides the magnetic field acting on the armature 24f. The magnetic coupling structure 25, C25 can include, for example, a stator that faces the armature 24f via an air gap.

In the above embodiment, the housing 6 and the housing 24h are provided by different members. Alternatively, the housing 6 and the housing 24h may be provided by a continuous material. The housing 6 and the housing 24h can be made of continuous nonmagnetic metal or resin, for example.

1 air conditioner, 2 magnetocaloric effect heat pump device (MHP device),
2a rotating shaft, 3 high temperature system, 3a heat exchanger, 3b equipment,
4 low temperature system, 4a heat exchanger, 4b equipment, 5 power source,
6 housing, 7 magnetocaloric effect element (MCE element) 8 medium,
9 control device, 11 magnetic field modulation device, 12 magnetic force source, 13 magnetic force source,
21 heat transport device, 22 pump, 23 pump, 24 valve,
24a first position, 24b second position, 24c main port,
24d selection port, 24e selection port, 24f armature,
24h housing, 24m passage hole, 24n passage hole,
24r spring, 24s facing surface, 24t facing surface, 24v valve body,
25 magnetic coupling structure, 32 high temperature end valve, 33 low temperature end valve,
224r spring,
324p protrusion,
424d selection port, 424p protrusion,
524r block,
624r spring,
724r spring,
824r spring,
924r spring,
A24r spring,
B24u Pressure receiving surface, P pressure,
C25 magnetic coupling structure, C14 magnetic force source,
D34, D35, D36, D37 Open/close valve.

Claims (10)

A magnetic field modulator (11) for providing a periodically varying magnetic field;
An MCE element (7) arranged in the magnetic field and exerting a magnetocaloric effect,
A heat transport device (21) having a plurality of valves (24) for controlling a passage of the medium, the device being a device for reciprocally flowing a medium (8) that exchanges heat with the MCE device along the MCE element
A thermomagnetic cycle device comprising a magnetic coupling structure (25, C25) for magnetically coupling the heat transport device and an armature (24f) of the valve to drive the valve. The valve is
A housing (24h) for partitioning the valve chamber into the medium passage,
A valve body (24v) arranged in the valve chamber together with the armature (24f),
The thermomagnetic cycle device according to claim 1, wherein the magnetic coupling structure is configured to magnetically couple the heat transport device and the armature by a magnetic flux passing through the housing. The thermomagnetic cycle device according to claim 2, wherein the valve body also serves as the armature. A plurality of said valves,
A hot end valve (32) for controlling the passage of the medium at the hot end (HT) of the MCE element;
A low temperature end valve (33) for controlling the passage of the medium at a low temperature end (LT) of the MCE element,
The heat according to any one of claims 1 to 3, wherein the high-temperature end valve and the low-temperature end valve have drive characteristics that are driven to add the medium from both the high-temperature end and the low-temperature end. Magnetic cycle device. The high-temperature end valve and the low-temperature end valve have drive characteristics in which one valve is switched earlier than the other valve and the one valve is switched later than the other valve. Thermomagnetic cycle device. The thermomagnetic cycle device according to claim 5, wherein the drive characteristic is given by a difference in biasing force between the bias means for biasing the high temperature end valve and the bias means for biasing the low temperature end valve. 7. The thermomagnetic cycle device according to claim 6, wherein the bias means has a temperature characteristic in which the biasing force changes according to temperature. The thermomagnetic cycle device according to claim 2, wherein the valve body has a pressure receiving surface (B24u) that receives the pressure (P) of the medium and biases the valve body toward the origin position. The magnetic field modulator includes a magnetic force source (12, 13) for supplying a magnetic field to the MCE element,
The thermomagnetic cycle device according to any one of claims 1 to 8, wherein the magnetic coupling structure (25) is configured to cause a leakage magnetic field of the magnetic force source to act on the armature. The magnetic field modulator includes a magnetic force source (C14) for supplying a magnetic field to the armature,
The thermomagnetic cycle device according to any one of claims 1 to 8, wherein the magnetic coupling structure (C25) is configured to cause a magnetic field of the magnetic force source to act on the armature.

Images