JP2020107845A5 - - Google Patents

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Publication number
JP2020107845A5
JP2020107845A5 JP2018248131A JP2018248131A JP2020107845A5 JP 2020107845 A5 JP2020107845 A5 JP 2020107845A5 JP 2018248131 A JP2018248131 A JP 2018248131A JP 2018248131 A JP2018248131 A JP 2018248131A JP 2020107845 A5 JP2020107845 A5 JP 2020107845A5
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JP
Japan
Prior art keywords
pattern
wiring board
board according
grooves
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2018248131A
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English (en)
Japanese (ja)
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JP2020107845A (ja
JP7145067B2 (ja
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Priority to JP2018248131A priority Critical patent/JP7145067B2/ja
Priority claimed from JP2018248131A external-priority patent/JP7145067B2/ja
Priority to US16/714,905 priority patent/US10743403B2/en
Publication of JP2020107845A publication Critical patent/JP2020107845A/ja
Publication of JP2020107845A5 publication Critical patent/JP2020107845A5/ja
Application granted granted Critical
Publication of JP7145067B2 publication Critical patent/JP7145067B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2018248131A 2018-12-28 2018-12-28 配線基板及びその製造方法 Active JP7145067B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018248131A JP7145067B2 (ja) 2018-12-28 2018-12-28 配線基板及びその製造方法
US16/714,905 US10743403B2 (en) 2018-12-28 2019-12-16 Wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018248131A JP7145067B2 (ja) 2018-12-28 2018-12-28 配線基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2020107845A JP2020107845A (ja) 2020-07-09
JP2020107845A5 true JP2020107845A5 (cg-RX-API-DMAC10.html) 2021-12-16
JP7145067B2 JP7145067B2 (ja) 2022-09-30

Family

ID=71123500

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018248131A Active JP7145067B2 (ja) 2018-12-28 2018-12-28 配線基板及びその製造方法

Country Status (2)

Country Link
US (1) US10743403B2 (cg-RX-API-DMAC10.html)
JP (1) JP7145067B2 (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102777726B1 (ko) * 2020-06-29 2025-03-06 삼성전자주식회사 패키지 기판
CN111970816B (zh) * 2020-08-27 2022-01-25 合肥鑫晟光电科技有限公司 驱动电路背板、及其制备方法、背光模组

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5096223B2 (ja) * 2008-05-08 2012-12-12 日東電工株式会社 配線回路基板の製造方法
JP2012156498A (ja) * 2011-01-07 2012-08-16 Fujikura Ltd 配線基板、モールド及び配線基板の製造方法
JP2016051834A (ja) * 2014-09-01 2016-04-11 イビデン株式会社 プリント配線基板およびその製造方法
TWI684389B (zh) * 2015-04-17 2020-02-01 王忠寶 一種電路板結構

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