JP2020088309A - Optical module package and manufacturing method of the same - Google Patents

Abstract

To provide an optical module package capable of being mass-produced in a lump and sealing optical functional elements, etc. with good airtightness.SOLUTION: An optical module package 11 includes: an optical functional element 14; a substrate 12 made of ceramic in which a recess 13 for accommodating the optical functional element 14; and a translucent cover 17 made of a transparent glass material for sealing the recess 13. The translucent cover 17 is in close contact with an entire upper surface of an outer peripheral wall 18 of the recess 13 via a joint member 16.SELECTED DRAWING: Figure 1

Description

The present invention relates to an optical module package equipped with an optical functional element and a method for manufacturing the same.

2. Description of the Related Art Conventionally, an optical module package mounted with an optical functional element such as a semiconductor laser or a photodiode emits or enters light from the optical functional element and a substrate having a concave portion on which an electronic functional element or the like is mounted. Is formed of a light-transmitting sealing body.

In Patent Document 1, a semiconductor having a structure in which an optical functional element such as a VCSEL is mounted in a recess provided in a silicon substrate and the glass substrate is sealed on the optical functional element to transmit light emitted from the optical functional element. A light emitting device is disclosed. Patent Document 2 discloses an optical functional device in which a glass substrate is fitted into a stepped portion of a substrate formed along the outer peripheral surface of a concave portion accommodating an optical functional element and the like.

In Patent Document 3, a first peripheral wall provided so as to surround the periphery of a semiconductor IC mounted on a substrate, a second peripheral wall provided so as to surround the first peripheral wall, and parallel to the substrate. As described above, there is disclosed an optical sensor including a glass plate which is provided on the first and second peripheral walls and hermetically seals the semiconductor IC. In Patent Document 4, a first aggregate substrate in which a plurality of first substrates to which semiconductor elements are joined are formed and arranged, and a plurality of second substrates in which a hollowed portion that accommodates the semiconductor elements is formed are arranged and formed. And a second collective substrate, and a protective film sheet is attached to the surface of the second collective substrate, and the first collective substrate, the second collective substrate, and the protective film sheet are subjected to full-cut dicing. A method of manufacturing a semiconductor device is disclosed.

JP, 2009-27088, A JP2012-194162A JP 2004-200583 A JP, 2007-234899, A

Optical functional elements such as VCSELs and photodiodes (PDs) installed in portable information devices require stable operation even in high temperature and high humidity environments, so package airtightness is important. Is becoming

The semiconductor light emitting device in Patent Document 1 has a structure in which the recess is sealed so that the glass substrate intersects a part of the electrode layer formed on the upper surface of the silicon substrate. With such a structure, a gap is likely to be formed at a portion intersecting with the electrode layer, and the airtightness in the recess for accommodating the optical functional element may be reduced.

In the optical functional device in Patent Document 2, it is necessary to previously form a step portion for fitting the glass substrate in the package in which the recess is formed, and thus precision of processing accuracy of the package and the glass substrate is required. .. Moreover, since the bonding area between the substrate and the light-transmitting cover is reduced, there is a problem that the airtightness is impaired.

In the package manufacturing method, as shown in Patent Documents 1 and 2, a substrate in which a recess is formed is individually formed, an optical functional element is mounted in the recess, and then the substrate is formed according to the shape of the recess. Since it is formed by bonding glass substrates together, it is not easy to mass-produce a plurality of packages at once. Further, as described above, in the individually manufactured packages, there is a problem that variations occur among products. Further, as described in Patent Documents 3 and 4, the method of forming a recess for accommodating an optical functional element or the like by combining a plurality of substrates has a problem that it requires a large number of manufacturing steps and costs. It was

Therefore, an object of the present invention is to provide an optical module package that can seal optical functional elements and the like with good airtightness and that can be mass-produced collectively, and a method for manufacturing the same.

The optical module package of the present invention is an optical module package including an optical functional element, a substrate in which a concave portion for housing the optical functional element is formed, and a translucent cover that seals the concave portion, wherein the translucent cover is , Is closely attached to the upper surface of the outer peripheral wall of the recess via a joining member.

The method for manufacturing an optical module package of the present invention includes accommodating an optical functional element in the recess of a collective substrate in which a plurality of recesses are formed in an array, and forming a collective bonding member on an upper surface of an outer peripheral wall of the plurality of recesses. A collective translucent cover is arranged on the upper surface of the outer peripheral wall via the collective joining member, and the collective translucent cover is bonded to the entire upper surface of the outer peripheral wall, along the upper surface of the outer peripheral wall of the plurality of adjacent recesses. Full-cut dicing the collective substrate and the collective translucent cover to collectively form a plurality of optical module packages.

According to the optical module package of the present invention, since the translucent cover is in close contact with the upper surface of the outer peripheral wall of the recess that accommodates the optical functional element via the joining member, the optical functional element can be hermetically sealed. it can. As a result, it is possible to prevent characteristic variations of the optical functional element and deterioration over time.

According to the method of manufacturing an optical module package of the present invention, by performing full-cut dicing on the collective substrate in which the optical functional element is housed in the recess and the collective transparent cover bonded to the upper surface of the collective substrate, a plurality of optical modules The module packages can be mass-produced in a batch.

It is a perspective view of an optical module package of the present invention. It is an AA sectional view of the said optical module package. FIG. 3 is an exploded perspective view of the optical module package. It is a figure which shows the process of mounting an optical functional element etc. in each of the some recessed part of a collective substrate. It is a figure which shows the process of arrange|positioning a collective joining member on a collective substrate. It is a figure which shows the process of joining a collective translucent cover on a collective joining member. It is the figure which showed the dicing line in a collective optical module package. It is a figure which shows the process of taking out each optical module package from a collective optical module package.

Hereinafter, embodiments of an optical module package according to the present invention will be described in detail with reference to the drawings. In addition, the drawings schematically show the optical module package. The dimensions and dimensional ratios of these real objects do not necessarily match the dimensions and dimensional ratios in the drawings. In addition, redundant description may be omitted as appropriate, and the same reference numerals may be given to the same members.

As shown in FIG. 1 to FIG. 3, the optical module package 11 of the present invention includes a quadrangular bottom surface 15, an outer peripheral wall 18 surrounding the outer peripheral portion of the bottom surface 15, and a rectangular inner space surrounded by the outer peripheral wall 18. Substrate 12 having (concave portion) 13, mounting portion including optical functional element 14 and other electronic components (not shown) mounted in concave portion 13, and bonding arranged on upper surface 19 of outer peripheral wall 18. It is composed of a member 16 and a translucent cover 17 that seals the recess 13 via the joining member 16. The member of the quadrangular bottom surface 15 and the outer peripheral wall 18 that surrounds the outer peripheral portion of the bottom surface 15 is not particularly limited.

A rectangular parallelepiped ceramic base material is used for the substrate 12, and the concave portion 13 is formed by processing one surface of the ceramic base material into a rectangular shape. This hollowing process can be performed by anisotropic etching through a resist pattern formed by a photolithography process, for example. The material of the substrate 12 is not limited to ceramic, and may be other material such as silicon or glass epoxy. Further, the rectangular parallelepiped-shaped ceramic base material used as the substrate 12 may be formed by stacking processed green sheets before firing to form the recess 13 by firing.

External electrodes (not shown) are formed on the bottom surface 15 of the substrate 12 for electrical connection with the optical functional device 14 and the like. By forming the external electrodes by bump electrodes, surface mounting by reflow becomes possible. The bump electrode is not limited to the bump electrode and may be a film-shaped or plate-shaped electrode.

The optical module package 11 of the present embodiment includes a surface emitting semiconductor laser (VCSEL) 14a and a photodiode (PD) 14b as the optical functional element 14 in order to realize a light detection sensor. Alternatively, there may be a case where either one of the PDs 14b is mounted. The VCSEL 14a functions as a light source that illuminates a predetermined range of the object to be detected, and the PD 14b has a function of detecting the light reflected by the part to be detected. The optical functional element mounted in the optical module package 11 of the present invention is not limited to the VCSEL 14a and the PD 14b, and may be another optical functional element such as an LED according to the application and the detection target. The connection terminals and external electrodes of the VCSELs 14a and PD14b are formed by a four-pole structure in which the VCSELs 14a and PD14b are respectively provided with an anode and a cathode terminal or a three-terminal structure in which any one of the VCSELs 14a and PD14b is shared.

The joining member 16 is formed of a frame-shaped adhesive sheet that has an opening 16a that releases the recess 13 and is mounted so as to cover the entire upper surface 19 of the outer peripheral wall 18 of the substrate 12. Both sides of the adhesive sheet are adhesive surfaces. This adhesive sheet is continuously arranged at least along the outer periphery of the recess 13. Further, by disposing the adhesive sheet so as to cover the entire width of the upper surface 19 from the inner peripheral edge 19a to the outer peripheral edge 19b of the outer peripheral wall 18, the bonding strength with the translucent cover 17 can be further increased, and the durability and the durability can be improved. Airtightness can be further enhanced. In this embodiment, the adhesive sheet is used as the joining member 16, but the adhesive may be directly applied to the upper surface 19 of the outer peripheral wall 18.

It is possible to adapt the reflow mounting of the optical module package 11 to the joining member 16 by using an adhesive having UV curability or thermosetting property. Regardless of whether the material is UV curable or thermosetting, the optical module package 11 can be easily and surely joined without being affected by the joining temperature at the time of reflow mounting.

Further, when an adhesive is used as the joining member 16, one having a characteristic (thixotropy) that the viscosity is low and the fluidity is good when the flow velocity is accompanied by injection and the viscosity is high when the flow velocity is not involved. Are suitable. By using such an adhesive having thixotropy, it has good fluidity when it is injected onto the upper surface 19 of the outer peripheral wall 18, evenly spreads over the entire upper surface 19 and fluidized when the translucent cover 17 is arranged. Viscosity increases due to the lack of properties. As a result, the recess 13 can be reliably joined by the translucent cover 17 without a gap. For example, a bonding member having thixotropy may be applied by blending an adhesive containing silicon dioxide or another material, or a bonding member having a thixotropy by mixing a nanofiller with the adhesive. May be applied. By providing such thixotropy, it is possible to prevent the inflow due to the capillary phenomenon when joining the translucent cover 17 which is processed with an accuracy of the order of μm and whose refraction or diffusion is controllable.

The translucent cover 17 is formed of a flat transparent glass plate and has a size substantially the same as the planar size of the substrate 12. By disposing the translucent cover 17 on the substrate 12 with the joining member 16 interposed therebetween, the inside of the recess 13 can be sealed with good airtightness. Further, since the outer surface of the outer peripheral wall 18 of the substrate 12 and the outer surface of the translucent cover 17 are integrally formed so as to be flush with each other, they are small and easy to handle. The transparent cover 17 is also not limited to transparent glass, and various optical materials having a function of refracting or diffusing light can be combined. As various optical materials having a function of refracting or diffusing light, a microlens array processed with an accuracy of the order of μm, a diffraction grating, or the like can be used. The processed surface thus formed is preferably arranged on the side of the recess 13 in consideration of adsorption of dirt due to fine processing and optical performance.

The VCSEL 14a housed in the recess 13 is activated by applying a forward bias voltage to a pair of external electrodes (not shown) formed on the bottom surface 15 of the substrate 12. Then, when a current exceeding the threshold value is applied to the VCSEL 14a, a laser beam having a predetermined wavelength is emitted from the light emitting surface facing the translucent cover 17. The emitted laser light passes through the translucent cover 17 and is output to an external object to be detected. The PD 14b is used to detect the reflected light reflected from the translucent cover 17 and control the output of the laser light.

In the optical module package 11 of the present invention, since the substrate 12 made of ceramic and the transparent cover 17 made of transparent glass material are integrally joined, the airtightness inside the recess 13 can be enhanced. This makes it possible to effectively protect the VCSEL 14a, the PD 14b and the like housed in the recess 13 from the external environment. Further, the heat generated in the concave portion 13 accommodating the optical functional element 14 is effectively transmitted from the substrate 12 formed of a ceramic base material having good thermal conductivity via external electrodes (not shown). Since heat can be dissipated to the outside, it is possible to effectively prevent characteristic fluctuations and deterioration over time of the optical functional element 14.

Next, a method of manufacturing the optical module package of the present invention will be described with reference to FIGS. First, as shown in FIG. 4, an aggregate substrate 32 in which a plurality of concave portions 13 in which the optical functional elements 14 are arranged are formed is prepared. The aggregate substrate 32 is formed of a ceramic base material having a plane size capable of forming a plurality of optical module packages 11 shown in FIG. The plurality of recesses 13 can be collectively formed by depositing a mask pattern for forming the recesses 13 on the entire upper surface of the collective substrate 32 and performing an etching process through the mask patterns.

The optical functional elements 14 such as VCSELs 14a and PDs 14b and other electronic components are mounted in the respective concave portions 13 of the collective substrate 32, and the optical functional elements in the respective concave portions 13 are formed on the bottom surface of the collective substrate 32. External electrodes (not shown) for electrical connection with 14 and the like are formed.

FIG. 5 shows a step of forming the collective joining member 36 on the collective substrate 32. In this step, after mounting the optical functional element 14 in each recess 13, a collective bonding member 36 shown in FIG. 3 in which a plurality of bonding members 16 are formed in an array is positioned and arranged in accordance with each recess 13 of the collective substrate 32. .. The collective joining member 36 has substantially the same width as the upper surface 19 of the outer peripheral wall 18 of each recess 13 and is formed of an adhesive sheet having both surfaces as adhesive surfaces. This adhesive sheet is formed of a UV curable or thermosetting material. In the present embodiment, the collective joining member 36 is formed of the adhesive sheet, but the adhesive may be directly applied to the upper surface 19 of the outer peripheral wall 18 that surrounds each recess 13 of the collective substrate 32. If the adhesive has thixotropy, it can be evenly applied to the entire upper surface 19 of the outer peripheral wall 18 surrounding each recess 13.

FIG. 6 shows a step of disposing the collective translucent cover 37 on the collective substrate 32. The collective translucent cover 37 is formed of a transparent glass plate having the same plane size as the collective substrate 32, and is arranged on the collective joining member 36 under a reduced pressure environment. After that, the collective substrate 32 and the collective translucent cover 37 are brought into close contact with each other by UV irradiation or heat at a predetermined temperature along the outer peripheral portion of each recess 13. By performing this step in a reduced pressure environment, the inside of each recess 13 can be sealed with good airtightness.

FIG. 7 shows dicing lines X and Y for dividing the collective optical module package 31 in which the collective transparent cover 37 is joined to the collective substrate 32 into a plurality of optical module packages 11. The dicing lines X and Y are set by a center line that bisects the width of the upper surface 19 of the outer peripheral wall 18 of each adjacent recess 13. By performing full-cut dicing on the collective substrate 32 and the collective transparent cover 37 along the dicing lines X and Y, as shown in FIG. 8, a plurality of optical module packages 11 can be collectively manufactured. .. As shown in FIGS. 1 and 2, the optical module package 11 thus formed is integrally formed so that the outer surfaces of the substrate 12 and the light-transmitting cover 17 are flush with each other. The miniaturization can be realized without impairing the light emitting and light receiving functions of the optical function element 14. As a result, it can be mounted on a small electronic device or the like.

According to the above manufacturing method, as shown in FIG. 1, full dicing is performed with the collective substrate 32 made of ceramics and the collective translucent cover 37 made of transparent glass material integrally bonded via the collective bonding member 36. Therefore, it is possible to prevent moisture and fine foreign matter from entering during dicing. In addition, since the airtightness in each recess 13 is increased by joining the collective substrate 32 and the collective translucent cover 37 in a reduced pressure environment, it is possible to mass-produce the optical module package 11 without product variations.

11 Optical Module Package 12 Substrate 13 Recess 14 Optical Functional Element 14a VCSEL
14b PD
15 Bottom surface 16 Joining member 16a Opening 17 Light-transmitting cover 18 Outer peripheral wall 19 Top surface 19a Inner edge 19b Outer edge 31 Collective optical module package 32 Collective board 36 Collective joining member 37 Collective translucent cover

Claims (11)

In an optical module package including an optical functional element, a substrate in which a concave portion that accommodates the optical functional element is formed, and a translucent cover that seals the concave portion,
An optical module package in which the translucent cover is adhered to the upper surface of the outer peripheral wall of the recess via a joining member. The optical module package according to claim 1, wherein the joining member is formed on the entire upper surface of the outer peripheral wall. The optical module package according to claim 1, wherein the optical functional element includes at least one of a surface emitting semiconductor laser and a photodiode. The optical module package according to claim 1, wherein the substrate is made of ceramic. The optical module package according to claim 1, wherein the translucent cover is formed of a transparent glass material. The optical module package according to claim 1, wherein the joining member is formed of an adhesive sheet having UV-curable or thermosetting adhesive surfaces on both sides. The optical module package according to claim 1, wherein the joining member is a thixotropic adhesive applied along the outer periphery of the recess. The optical module package according to claim 1, wherein the substrate and the translucent cover are integrally formed such that the outer peripheral side faces are flush with each other. To accommodate the optical functional element in the recess of the aggregate substrate in which a plurality of recesses are formed in an array,
Forming a collective joining member on the upper surface of the outer peripheral wall of the plurality of recesses;
Disposing a collective translucent cover on the upper surface of the outer peripheral wall via the collective joining member, and bonding the collective translucent cover to the entire upper surface of the outer peripheral wall,
Full cut dicing of the collective substrate and the collective translucent cover along the upper surface of the outer peripheral wall of the plurality of adjacent recesses,
A method for manufacturing an optical module package for collectively forming a plurality of optical module packages. The method for manufacturing an optical module package according to claim 9, wherein the joining of the collective substrate and the collective translucent cover is performed under a reduced pressure environment. The method of manufacturing an optical module package according to claim 9, wherein the assembly of the collective substrate and the collective transparent cover is performed by UV irradiation or thermocompression bonding.

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