JP2020088273A - Electronic apparatus - Google Patents

Abstract

To provide an electronic apparatus capable of maintaining cooling performance of electronic components.SOLUTION: An electronic apparatus 10 includes a CPU22 where a CPU chip 28 is attached to a CPU substrate 30 which is one example of electronic component, a heat receiving member 32 for absorbing the heat generated from the CPU chip 28, a heat conduction member 40 having flowability provided between the surface 28a of the CPU chip 28 and the heat receiving surface 32a of the heat receiving member 32, and a wall member 42 provided to surround the heat conduction member 40, and closing between the heat receiving surface 32a of the heat receiving member 32 and the surface 30a of the CPU substrate 30.SELECTED DRAWING: Figure 3

Description

The present invention relates to electronic devices.

An electronic device such as a notebook personal computer (notebook PC) includes a cooling module for cooling an electronic component that generates heat, such as a CPU (Central Processing Unit). For example, in Patent Document 1, an electronic device having a configuration in which a heat receiving plate such as a copper plate is brought into contact with the surface of the electronic component to absorb the heat of the electronic component, and the heat is discharged to the outside by a heat pipe, a cooling fan, or the like. Is disclosed.

JP, 2017-118018, A

In the electronic device as described above, in order to secure heat transfer performance between the electronic component and the heat receiving plate, a heat conductive material such as grease having heat conductivity is interposed between the two. However, such a heat-conducting material having fluidity is immersed in the surroundings from between the electronic component and the heat receiving plate due to a pump-out phenomenon which occurs when the heat receiving plate expands or contracts due to a temperature rise during use. It may get out. Then, the heat transfer performance between the electronic component and the heat receiving plate is degraded, the cooling performance of the electronic component is degraded, and the performance of the CPU or the like is degraded.

The present invention has been made in view of the above problems of the conventional art, and an object of the present invention is to provide an electronic device capable of maintaining the cooling performance of an electronic component.

An electronic device according to a first aspect of the present invention is an electronic component in which a semiconductor chip is attached to a substrate, a heat receiving member that absorbs heat generated by the semiconductor chip, a surface of the semiconductor chip, and a heat receiving surface of the heat receiving member. A heat-conducting material having fluidity provided between the heat-conducting material and a wall member that is provided so as to surround the periphery of the heat-conducting material and closes between the heat-receiving surface of the heat-receiving member and the surface of the substrate; Equipped with.

With such a configuration, the wall member can prevent the internal temperature from rising during use and the heat conductive material from seeping into the surroundings due to a pump-out phenomenon or the like. Therefore, it is possible to maintain the close contact state between the semiconductor chip and the heat receiving member by the heat conductive material for a long time. As a result, the electronic device can maintain the cooling performance of the electronic components that generate heat for a long period of time, and can suppress the deterioration of the performance.

The heat conducting material may be composed of a semi-solid lubricant. Then, high heat transfer performance can be ensured between the semiconductor chip and the heat receiving member, and moreover, the wall member prevents outflow to the surroundings.

The wall member may be formed of a solid material having a cushioning property or a semi-solid material having a lower fluidity than the heat conducting material. Then, the wall member can flexibly follow the variation in the distance between the substrate and the heat receiving member, and thus does not hinder the close contact state between the semiconductor chip and the heat receiving member. Further, the wall member is formed of a solid material or a semi-solid material having a fluidity smaller than that of the heat conducting material, so that the shape thereof can be maintained more stably than the heat conducting material. Therefore, even in a situation where the heat conductive material flows out due to a pump-out phenomenon or the like, the wall member can reliably block the heat conductive material while maintaining its shape.

The wall member may be formed of thermal rubber, a high-viscosity semi-solid lubricant in which pump-out is not confirmed, urethane foam, a gel sheet, or an elastic adhesive having peeling property.

The wall member may be made of thermal rubber made of silicone rubber.

According to the above aspect of the present invention, the cooling performance of the electronic component can be maintained.

FIG. 1 is a plan view of an electronic device according to an embodiment of the present invention. FIG. 2 is a plan view schematically showing the internal structure of the main body housing. FIG. 3 is a vertical cross-sectional view of the main body housing schematically showing the configuration of the CPU and its peripheral portion. FIG. 4 is a sectional view taken along the line IV-IV in FIG.

Hereinafter, preferred embodiments of an electronic apparatus according to the present invention will be described and described in detail with reference to the accompanying drawings.

FIG. 1 is a plan view of an electronic device 10 according to an embodiment of the present invention. In the present embodiment, a laptop PC is illustrated as the electronic device 10, but the electronic device 10 may be a tablet PC, a desktop PC, or the like, other than the laptop PC.

As shown in FIG. 1, the electronic device 10 includes a main body housing 14 provided with a keyboard device 12 and a display housing 18 provided with a display device 16. The display housing 18 is rotatably connected to the rear end of the main body housing 14 via a pair of left and right hinges 20, 20. The display device 16 is, for example, a liquid crystal display. FIG. 1 is a top view of the electronic device 10 in which the display housing 18 is opened from the main body housing 14 by the hinge 20 and used.

FIG. 2 is a plan view schematically showing the internal structure of the main body housing 14. FIG. 2 is a schematic view of the inside of the main body housing 14 seen from above with the keyboard device 12 and the cover member around the keyboard device 12 removed from the main body housing 14. As shown in FIG. 2, an electronic circuit board 24 on which the CPU 22 is mounted and a cooling module 26 are housed inside the main body housing 14. Inside the main body housing 14, a hard disk device, a battery device, and the like (not shown) are further housed.

The electronic circuit board 24 is a printed circuit board (PCB). In addition to the CPU 22, the electronic components mounted on the electronic circuit board 24 include a GPU (Graphics Processing Unit) (not shown), a memory, a communication module, and the like.

The CPU 22 is a central processing unit that performs calculations related to main control and processing of the electronic device 10. The CPU 22 has a structure in which a CPU chip (CPU die) 28 which is a semiconductor chip is attached to a CPU substrate 30. The CPU 22 is mounted on the electronic circuit board 24 by soldering the CPU board 30 to the electronic circuit board 24. The CPU 22 is the largest heating element among the electronic components mounted in the main body housing 14.

The cooling module 26 is a device that discharges heat generated from the CPU 22 and other electronic components to the outside of the main body housing 14. The cooling module 26 includes a heat receiving member 32, a heat pipe 34, and a cooling fan 36.

The heat receiving member 32 is a member that absorbs the heat generated by the CPU 22. The heat receiving member 32 is made of a metal plate having high thermal conductivity such as copper or aluminum, and has a larger outer surface area than the surface (top surface) 28a of the CPU chip 28. The heat receiving member 32 is pressed against the surface 28a of the CPU chip 28 by, for example, a leaf spring 38 protruding in four directions.

The heat pipe 34 has, for example, a structure in which a metal tube having both ends thereof joined to form a closed space inside is crushed, and transports heat with high efficiency by utilizing the phase change of the working fluid sealed in the closed space. It is a possible heat transport device. In this embodiment, two heat pipes 34 are arranged in parallel. Each heat pipe 34 has one end 34a connected to the heat receiving member 32 in a heat transferable manner, and the other end 34b connected to a cooling fin connected to a blower opening 36a of the cooling fan 36 in a heat transferable manner.

The cooling module 26 absorbs the heat generated by the CPU 22 by the heat receiving member 32, conveys it by the heat pipe 34, and finally discharges it to the outside of the main body housing 14 by the cooling fan 36.

FIG. 3 is a vertical cross-sectional view of the main body housing 14 schematically showing the configuration of the CPU 22 and its peripheral portion. FIG. 4 is a sectional view taken along the line IV-IV in FIG. As shown in FIGS. 3 and 4, in the electronic device 10, the heat conductive material 40 is provided between the CPU chip 28 and the heat receiving member 32, and the periphery of the heat conductive material 40 is surrounded by the wall member 42.

The heat conductive material 40 is interposed between the surface 28a of the CPU chip 28 and the heat receiving surface 32a of the heat receiving member 32. The heat conductive material 40 is for increasing the adhesion between the surface 28a and the heat receiving surface 32a and for improving the heat transfer performance between the surface 28a and the heat receiving surface 32a. The heat-conducting material 40 is a semi-solid lubricant (grease) to which a metal filler is added and which has a high heat conductivity. The heat-conducting material 40 may be a heat-conducting material having fluidity and is not limited to a semi-solid lubricant as long as it has a certain degree of fluidity. For example, liquid metal may be used. Similar to the heat conductive grease, this liquid metal is generally used to increase the heat transfer coefficient between the electronic component and the heat receiving member, and is, for example, a liquid or semi-solid metal based on tin or the like. is there.

The wall member 42 is an embankment for preventing the heat conductive material 40 having fluidity from leaching into the surroundings between the surface 28a and the heat receiving surface 32a. The wall member 42 is provided so as to surround the periphery of the heat conductive material 40, and stands up by blocking between the heat receiving surface 32 a of the heat receiving member 32 and the surface 30 a of the CPU substrate 30. That is, in the electronic device 10, the CPU chip 28 and the heat conductive material 40 are sealed by the inner surface of the wall member 42, the heat receiving surface 32a of the heat receiving member 32, and the surface 30a of the CPU substrate 30. When the electronic device 10 is manufactured, the wall member 42 is attached so as to come into contact with the CPU substrate 30 in a state of being attached to the heat receiving surface 32a of the heat receiving member 32, for example. The wall member 42 may be attached to the surface 30 a of the CPU substrate 30 so as to come into contact with the heat receiving member 32 in a state of being attached.

The wall member 42 is required to block the space between the heat receiving surface 32a and the surface 30a and not interfere with the close contact state between the surface 28a of the CPU chip 28 and the heat receiving surface 32a of the heat receiving member 32 using the heat conductive material 40. is there. Therefore, the wall member 42 preferably has some flexibility or cushioning property. Then, the wall member 42 can easily follow the variation in the distance between the heat receiving surface 32a and the surface 30a. That is, if the wall member 42 is made of a material that is hard and does not shrink, the wall member 42 becomes a strut that is stretched between the heat receiving surface 32a and the surface 30a, for example, and there is a concern that the CPU chip 28 and the heat receiving member 32 may not be in close contact with each other. ..

Further, the wall member 42 needs to be able to maintain its shape even under the situation where the heat conductive material 40 tries to seep out to the surroundings by the pump-out phenomenon, and it is necessary to prevent this seepage. For this reason, it is preferable that the wall member 42 is made of a material harder than the heat conductive material 40, and further has a shape retention performance higher than that of the heat conductive material 40 when the temperature rises. As a result, the wall member 42 maintains its shape even when the temperature rises during use of the electronic device 10, so that the heat conducting material 40 that is about to ooze out due to the pump-out phenomenon can be securely retained. Can be set. Further, since the wall member 42 has the cushioning property, it is possible to reliably follow the heat shrinkage of the heat receiving member 32 and the like, and the sealing function of the wall member 42 is not impaired.

In the case of this embodiment, the wall member 42 is made of a material having a cushioning property. The wall member 42 may be, for example, a thermal rubber, a highly viscous semi-solid lubricant (grease) in which pump-out is not confirmed, a urethane foam, a gel sheet, a peelable elastic adhesive, or the like.
Examples of the thermal rubber include silicone rubber.
As the semi-solid lubricant, one having higher fluidity and higher heat resistance than the semi-solid lubricant constituting the heat conductive material 40 is preferable.
The wall member 42 may be made of a material that does not have high thermal conductivity, but it is preferable in terms of cooling performance that it is made of a material having high thermal conductivity because it comes into contact with the heat receiving member 32. From the viewpoint of thermal conductivity, thermal rubber is particularly preferable.

As described above, in the electronic device 10 according to the present embodiment, the fluid heat conductive material 40 provided between the surface 28 a of the CPU chip 28 and the heat receiving surface 32 a of the heat receiving member 32, and the heat conductive material 40. The wall member 42 is provided so as to surround the periphery of the heat receiving member 32 and closes the space between the heat receiving surface 32a of the heat receiving member 32 and the surface 30a of the CPU substrate 30.

Therefore, in the electronic device 10, the wall member 42 can prevent the heat conductive material 40 from leaching into the surroundings due to a pump-out phenomenon or the like due to an increase in the internal temperature during use. Therefore, the close contact state of the heat conductive material 40 between the CPU chip 28 and the heat receiving member 32 can be maintained for a long period of time. As a result, the electronic device 10 can maintain the cooling performance of the CPU 22 for a long period of time, and can suppress deterioration of the performance of the CPU 22. Further, by interposing the wall member 42 between the heat receiving member 32 and the CPU substrate 30, it is possible to prevent the heat receiving member 32 from being largely warped and deformed due to thermal contraction.

It should be noted that the present invention is not limited to the above-described embodiments, and it goes without saying that the present invention can be freely modified without departing from the gist of the present invention.

In the above description, as the wall member 42, a rectangular frame-shaped structure surrounding the periphery of the CPU chip 28 having a rectangular outer shape is illustrated. However, the shape of the wall member 42 is not limited as long as it can surround the periphery of the CPU chip 28 and close the space between the heat receiving member 32 and the CPU substrate 30.

In the above description, the cooling structure using the heat conductive material 40 and the wall member 42 exemplifies the configuration for cooling the CPU 22. However, this cooling structure may be used for cooling a heating element other than the CPU 22, such as a GPU. Further, the wall member 42 may be provided so as to surround not only one semiconductor chip but a plurality of semiconductor chips collectively.

10 electronic equipment 14 main body housing 18 display housing 22 CPU
24 Electronic Circuit Board 26 Cooling Module 28 CPU Chips 28a, 30a Surface 30 CPU Board 32 Heat Receiving Member 32a Heat Receiving Surface 40 Heat Conducting Material 42 Wall Member

Claims (5)

Electronic components with semiconductor chips attached to the board,
A heat receiving member that absorbs the heat generated by the semiconductor chip,
A heat conductive material having fluidity provided between the surface of the semiconductor chip and the heat receiving surface of the heat receiving member,
A wall member that is provided so as to surround the periphery of the heat-conducting material and closes between the heat receiving surface of the heat receiving member and the surface of the substrate,
An electronic device comprising: The electronic device according to claim 1, wherein
The electronic device, wherein the heat conductive material is a semi-solid lubricant. The electronic device according to claim 1 or 2, wherein
The electronic device, wherein the wall member is formed of a solid material having a cushioning property or a semi-solid material having fluidity smaller than that of the heat conducting material. The electronic device according to any one of claims 1 to 3,
The electronic device characterized in that the wall member is formed of a thermal rubber, a high-viscosity semi-solid lubricant in which pump-out is not confirmed, a urethane foam, a gel sheet, or a peelable elastic adhesive. The electronic device according to any one of claims 1 to 4,
The electronic device, wherein the wall member is a thermal rubber made of silicone rubber.

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