JP2020072119A - Proximity sensor package, proximity sensor device, and electronic module - Google Patents

Abstract

To provide a proximity sensor package or the like that can further reduce the size of a proximity sensor device used in a mobile terminal such as a mobile phone or a smartphone.SOLUTION: A proximity sensor package according to the present invention includes a main surface 102, includes a wiring board 100 in which a first recess 104 that is located on the main surface 102, and in which a light emitting element 106 is mounted on a first mounting portion 104a, and a second recessed portion 105 in which a light receiving element 107 is mounted on a second mounting portion 105a are located, the second mounting portion 105a is rectangular in plan view, and the first recess 104 is located on the corner side of the second mounting portion 105a, and in plan view, a wall portion 110 between the first recess 104 and the second recess 105 includes a curved portion 111.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a proximity sensor package, a proximity sensor device, and an electronic module used in a proximity sensor device or the like having a pair of recesses in which a light emitting element and a light receiving element are mounted.

  Conventionally, in a mobile terminal such as a mobile phone or a smartphone, an optical sensor device such as a proximity sensor device is used to detect the distance between the face of the user and the mobile terminal. As the optical sensor device, for example, a device in which a light emitting element such as an infrared light emitting element and a light receiving element such as an infrared light receiving element are mounted on a rectangular substrate is used. In such an optical sensor device, a recess for a light emitting element on which a light emitting element or the like is mounted and a recess for a light receiving element on which a light receiving element or the like is mounted are provided on a substrate on which two recesses are located adjacent to each other. The device is mounted and configured.

  Then, light such as infrared rays is emitted above the wiring board from the light emitting element mounted in the recess for the light emitting element, and a part of the emitted light is an object (detected object) such as the face of the user. The distance between the object and the mobile terminal can be detected by being reflected by and detected by the light receiving element mounted in the recess for the light receiving element. Whether or not the object is located near the optical sensor device is detected based on the presence / absence and strength of this light reception.

Special Table 2013-519995

  However, in recent years, mobile terminals such as mobile phones and smartphones have been downsized, and further miniaturization of such proximity sensor devices has been demanded. For example, in a proximity sensor device currently mounted on a smartphone, two concave portions are located on the main surface of the wiring board so that the concave portion for the light emitting element and the concave portion for the light receiving element are arranged side by side. ing.

  This is because, on a wiring board, two recesses, a recess for a light emitting element on which an infrared light emitting element or the like is mounted and a recess for a light receiving element on which an infrared light receiving element or the like are mounted, are located adjacent to each other. This is because the optical sensor device is configured by mounting the. In other words, this is to prevent light such as infrared rays emitted from the light-emitting element from being directly detected by the light-receiving element and malfunctioning. Therefore, there are two recesses, one for the light-emitting element and one for the light-receiving element. It was necessary to position a wall portion having a predetermined wall width between them. If the wall width of the wall portion becomes thin, the light may pass through the wall portion even in the ceramic member, and the light emitted from the light emitting element may be directly detected by the light receiving element.

  A proximity sensor package according to one aspect of the present invention has a main surface, a first recess located on the main surface, in which a light emitting element is mounted on a first mounting portion, and a light receiving element is mounted on a second mounting surface. A wiring board in which a second recessed portion to be mounted on the second mounting portion is located, the second mounting portion has a rectangular shape in plan view, and the first recessed portion is located on the corner side of the second mounting portion, In a plan view, the wall portion between the first concave portion and the second concave portion has a curved portion.

  Further, in the proximity sensor package of one aspect of the present invention, the distance between the second mounting portion and the curved portion is gradually increased in plan view.

  Further, in a proximity sensor package according to one aspect of the present invention, the second recess has an auxiliary recess protruding outward in a plan view, and a virtual extension region in a protruding direction of the auxiliary recess and the auxiliary recess. The first recesses do not overlap each other, and the auxiliary recesses and the first recesses overlap each other in a side view in a direction perpendicular to the protruding direction of the auxiliary recesses.

  A proximity sensor device according to one aspect of the present invention includes the proximity sensor package according to any one of the above, a light emitting element mounted in the first recess, and a light receiving element mounted in the second recess. Have

  An electronic module according to one aspect of the present invention includes a module substrate having a connection conductor, and the proximity sensor device according to claim 6 in which a plurality of external connection conductors are connected to the connection conductor.

According to the proximity sensor package of one aspect of the present invention, the proximity sensor package has the main surface, the first recess is located on the main surface, and the light emitting element is mounted on the first mounting portion, and the light receiving element is the second. Since the second mounting portion has a rectangular shape in plan view and the first recess is located on the corner side of the second mounting portion, the wiring substrate includes the wiring board in which the second recessed portion mounted on the mounting portion is located. The distance between the light emitting element and the light receiving element can be increased while reducing the size of the wiring board. That is, the first concave portion for mounting the light emitting element is positioned near one corner portion of the wiring board, and the one concave portion is positioned so that the first concave portion is positioned on the corner portion side of the second mounting portion. By positioning the second recess for mounting the light receiving element in the vicinity of the other diagonally opposite corner, it is possible to effectively arrange the light emitting element and the light receiving element on the wiring board which is downsized and has a limited size. it can. Therefore, the proximity sensor device 200 can be downsized, and a highly reliable wiring board can be provided.

  According to the proximity sensor device of one aspect of the present invention, it is possible to realize a device in which the distance between the light emitting element and the light receiving element can be increased while the wiring board is downsized, and malfunctions when detecting an object are suppressed.

  According to the electronic module of one aspect of the present invention, it is possible to reduce the size of a mobile terminal such as a smartphone and realize a module in which malfunctions when detecting an object are suppressed.

(A) is a top view which shows the proximity sensor package and proximity sensor apparatus of embodiment of this invention, (b) is sectional drawing in the XX line containing a module substrate. (A) is a top view which shows the proximity sensor package and proximity sensor apparatus of embodiment of this invention, (b) is sectional drawing in the YY line containing a module substrate. It is sectional drawing corresponding to FIG.1 (b) which shows the package for proximity sensor of embodiment of this invention, and the other Example of a proximity sensor apparatus. It is sectional drawing corresponding to FIG.2 (b) which shows the package for proximity sensors of embodiment of this invention, and the other Example of a proximity sensor apparatus. It is a plane perspective view which shows the smart phone by which the package for proximity sensors of embodiment of this invention was mounted.

  The proximity sensor package, proximity sensor device, and electronic module of the present invention will be described with reference to the accompanying drawings.

As shown in FIG. 1A, the proximity sensor package has a rectangular wiring board 10 in a plan view.
Contains 0. On the main surface 102 of the wiring board 100, a first recess 104 in which the light emitting element 106 is mounted and a second recess 105 in which the light receiving element 107 is mounted are located. In addition, the second mounting portion 105 a has a rectangular shape, the first recess 104 is located on the corner side of the second mounting portion 105 a, and the curved portion 111 is provided between the first recess 104 and the second recess 105. It has a wall portion 110 including. Further, the second recess 105 has an auxiliary recess 112 protruding outward.

A wiring conductor (not shown) to which the light emitting element 107 is connected is located at the bottom of the first recess 104 located on the main surface 102, and a light receiving element 107 is connected to the bottom of the second recess 105. A wiring conductor (not shown) is located. These wiring conductors are connected to a plurality of external connection conductors 114 located on the surface 103 of the wiring board 100 opposite to the main surface 102.

As described above, the insulating substrate 101, the first recess 104 in which the light emitting element 106 is mounted, and the second recess 105 in which the light receiving element 107 is mounted are provided on the main surface 102 side of the wiring substrate 100 including the wiring conductor (not shown). The proximity sensor package and the proximity sensor device 200 of the present invention are configured by positioning the two recesses.

Here, the light emitted from the light emitting element 106 is physical energy such as infrared rays, electromagnetic waves or ultrasonic waves, and the light receiving element 107 includes a detection element for detecting these physical energies. The light emitting element 106 and the light receiving element 107 are used as a pair. As shown in FIG. 1B, the light emitting element 106 is mounted in the first recess 104 of the wiring board 100, and the light receiving element 107 is mounted in the second recess 105. In the proximity sensor device 200, for example, infrared rays are emitted to the outside from a light emitting portion (not shown) of the light emitting element 106 mounted in the first recess 104. In the case where an object (user's face or the like) is present outside the proximity sensor device 200, that is, in the direction in which it is irradiated with infrared rays, the infrared rays are reflected by the object and the light receiving element 107 located in the second recess 105 is located. Is detected by a light receiving portion (not shown) of the. On the contrary, when the object does not exist, the irradiated infrared ray is not reflected and is not detected, so that it is determined that the object does not exist.

Note that as a sensor element used for the light-emitting element 106, gallium-arsenic (Ga-As)
) Light emitting diodes (infrared rays), ultrasonic oscillators (ultrasonic waves), microwave oscillators (electromagnetic waves), and the like. Further, examples of the sensor element used in the light receiving element 107 include a photodiode (infrared ray), an ultrasonic oscillator (ultrasonic wave), a microwave detection element (electromagnetic wave), and the like. In the following description, the case where the light emitting element 106 and the light receiving element 107 are infrared light emitting elements or infrared light receiving elements capable of detecting the infrared light emitting elements will be described as an example. The light emitting element 106 and the light receiving element 107, which are a pair of sensor elements, are located on the upper surface of the element body such as a rectangular plate made of a semiconductor material such as gallium-arsenide and the element body, and emit or receive light by photoelectric conversion. And a functional part that is performed. The current supplied to the light emitting element 106 via the wiring conductor is photoelectrically converted by the light emitting element, and infrared rays are emitted. The infrared light reflected by the object is received by the light receiving element 107 and converted into an electric signal. The electric signal is transmitted via a wiring conductor to an external electric circuit (not shown) such as a detection circuit or a display display circuit.

The wiring board 100 is a portion that serves as a container for mounting the light-emitting element 106 and the light-receiving element 107 in the two recesses, respectively, and for positioning a wiring conductor that electrically connects the light-receiving element 107 to an external electric circuit. It is also the part that becomes the base of. Therefore, the wiring board 100 is provided with the first recess 104 and the second recess 105, which serve as a pair of recesses for mounting a pair of sensor elements for light emission and light reception. The light emitting element 106 is connected to the wiring conductor exposed inside the first recess 104 by, for example, a low melting point brazing material or a bonding wire. Further, the light receiving element 107 in which the light receiving portion is located is connected to the wiring conductor located in the bottom portion of the second recess 105 through a bonding material such as glass, a low melting point brazing material, or a conductive bonding material.

The wiring board 100 is a ceramic produced by kneading a raw material powder such as aluminum oxide and silicon oxide with an appropriate organic binder and an organic solvent when the base portion is made of, for example, an aluminum oxide sintered body. It can be manufactured by forming a plurality of ceramic green sheets by forming a rally into a sheet shape, stacking these ceramic green sheets, and then firing at a temperature of about 1600 ° C. in a reducing atmosphere.

Wiring board 100 may be formed as a mother board in which a plurality of wiring board regions are arranged. When the wiring conductor is made of tungsten, molybdenum, or the like, the exposed wiring conductor is coated with a plating layer of nickel, gold, or the like, and then the mother substrate is divided to show in FIGS. A wiring board 100 that constitutes such a proximity sensor package is manufactured.

The first recess 104 and the second recess 105 located on the main surface 102 of the wiring board 100 can be formed, for example, as follows. For example, a rectangular hole to be the first recess 104 and a different shape to be the second recess 105 (see FIG. 1 (a 2) is formed into a ceramic green sheet in which two holes are formed. The holes are not limited to these shapes and may be circular, elliptical, or rectangular with chamfered corners. By laminating and closely adhering a ceramic green sheet having two holes including the main surface 102 on the ceramic green sheet including the main surface 102, a proximity sensor package having such two recesses is configured. The wiring board 100 can be manufactured. The ceramic green sheet in which the two recesses including the main surface 102 are located may be formed of a plurality of layers. In this case, by changing the size of the recesses, for example, as shown in FIG. The step 113 can be located on the wall 110 of the first recess 104. On the step portion 113, for example, the light emitting element 106 has the bonding wire 115.
The wiring conductor 108 connected by is located.

A proximity sensor package according to one aspect of the present invention has a main surface 102, is located on the main surface 102, and has a first recess 104 in which a light emitting element 106 is mounted on a first mounting portion 104a, and a light receiving element. 107 includes the wiring board 100 in which the second recess 105 mounted in the second mount 105a is located, the second mount 105a is rectangular in plan view, and the first recess 104 is a corner of the second mount 105a. The wall portion 110 located on the section side and between the first concave portion 104 and the second concave portion 105 has a curved portion 111 in a plan view.

With such a structure, the distance between the light emitting element 106 and the light receiving element 107 can be increased while the wiring board 100 is downsized. That is, the first recess 104 for mounting the light emitting element 106 is located near one corner of the wiring board 100, and the first recess 104 is located on the corner side of the second mounting portion 105a. By arranging the second recess 105 in which the light receiving element 107 is mounted in the vicinity of the other corner on the diagonal of one corner, it is possible to effectively reduce the size of the light emitting element on the wiring board 100 of a limited size. The 106 and the light receiving element 107 can be arranged. Therefore, the proximity sensor device 200 can be downsized, and the wiring board 100 having excellent reliability can be provided.

It should be noted that the light emitting element 106 mounted in the first concave portion 104 is located on the center side of the smartphone 400 (the side close to the object irradiated with infrared rays), and the light receiving element 107 mounted in the second concave portion 105 is arranged in the smartphone. If the proximity sensor device 200 is arranged so as to be located on the outer peripheral side of 400, more infrared rays can be emitted to the object, and the infrared rays reflected from the object can be received efficiently by the light receiving element 107.
Can be detected with.

Even if the ceramic member constituting the wiring board 100 is thin, the width of the wall portion 110 becomes smaller than that of the wall portion 110.
There is a possibility that the infrared ray transmitted through the infrared ray and emitted from the light emitting element 106 may be directly detected by the light receiving element. However, the curved portion 111 is located in a part of the wall portion 110 that separates the first concave portion 104 and the second concave portion 105 in a plan view, which makes it difficult for infrared rays from the light emitting element 106 to pass through the wall portion 110. Become. That is, infrared rays are emitted from the light emitting portion located in the light emitting element 106 to the wall portion 110 of the first recess 104.
Even if the infrared rays are irradiated onto the infrared rays, since the width of the wall section 110 is unlikely to change due to the curved section 111, the infrared rays should be shielded by the wall sections 110 in any direction from the light emitting element 106 to the light receiving element 107. You can This means that the shielding effect of the wall portion 110 against infrared rays emitted from the light emitting element toward the light receiving element is unlikely to change in any direction, and the position of the light receiving portion located in the light receiving element 107 is less likely to be limited.

The insulating substrate 101 included in the wiring board 100 is made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass-ceramic sintered body. Then, in order to form the wall portion 110 in which waves such as infrared rays are difficult to pass, it is suitable to use a ceramic sintered body having a small particle size, a refractory metal as a coloring agent, and a small sintering aid. When an aluminum oxide sintered body is used as the insulating substrate 101, SiO _{2 is} used as a sintering aid.
, MgO, CaO, etc., and those containing W, Mo, Cr, etc. as colorants are desirable. The insulating substrate 101 has a small particle diameter of alumina, a small amount of sintering aid, and infrared rays or the like that hardly penetrate the wall portion 110.

The insulating substrate 101 has, for example, a rectangular outer shape with a side length of about 1.6 to 4 mm in plan view, a plate shape with a thickness of about 0.5 to 2 mm, and a concave first concave portion 104 on its upper surface. The second recess 105 is located.

Insulating substrate 101 has aluminum oxide, silicon oxide, and magnesium oxide when the base and frame (where the holes to be first recess 104 and second recess 105 are located) are made of an aluminum oxide sintered body. In addition to adding and mixing an appropriate organic binder, solvent, plasticizer, etc., with raw material powder such as calcium oxide, etc., and making it into a sludge form, this is made into a sheet form by a sheet forming method such as doctor blade method, roll calender method, etc. To obtain a plurality of ceramic green sheets, and then form a frame-like shape by punching a part of the ceramic green sheets into an appropriate shape. Stacked vertically so that the ceramic green sheets each having a hole to be a recess are formed on the upper surface, It can be manufactured by firing at high temperatures.

For example, as shown in FIG. 1A, the curved portion 111 is positioned so as to project to a part on the second concave portion 105 side with respect to a center point serving as a reference of an outer edge forming a corner portion of the first concave portion 104. is doing. Thereby, the width of the wall portion 110 from the inner wall of the first recess 104 to the inner wall of the second recess 105 can be made constant, and the infrared ray is shielded by the wall portion 110 in any direction from the light emitting element to the light receiving element. The change in the effect is suppressed. It should be noted that if the transmission characteristics of the insulating substrate 101 with respect to the intensity of light such as infrared rays used are measured in advance with samples having different thicknesses of the insulating substrate 101, the infrared rays emitted from the light emitting element will be based on the data. It is possible to set the width of the wall portion 110 that suppresses malfunction of the proximity sensor due to direct detection by the light receiving element. Then, the size of the hole 401 for the proximity sensor device located in the case of the mobile terminal such as the smartphone 400 is appropriately set according to the size of the wiring board 100 (the proximity sensor package).

The inner wall of the first recess 104 may be covered with a metallization layer (not shown) in order to enhance the shielding property of the inner wall of the first recess 104 of infrared rays and the stability during irradiation. As a result, the infrared rays emitted from the light emitting element 106 are reflected by the metallization layer located on the inner wall of the first recess 104, so that the wall 110 is shielded from the infrared rays and the infrared rays are radiated to the object in a stable manner. If a plating layer of nickel, gold, or the like is applied to the metallized layer located on the inner wall of the first recess 104, the shielding property of the wall portion 110 against infrared rays is further improved, and the irradiation of infrared rays on the object is further stabilized. To have sex.

  In addition, the hole 401 for the proximity sensor device located in the case of the mobile terminal such as the smartphone 400 is integrally covered with a transparent film such as glass or resin covering the liquid crystal screen in order to prevent dust from entering from the outside. It may be peeled off.

The proximity sensor package of one aspect of the present invention has a second mounting portion 105a in plan view.
The distance between the curved portion 111 and the curved portion 111 gradually increases. With such a structure, it is possible to increase the distance between the light emitting element 106 and the light receiving element 107 while reducing the size of the wiring board 100, and when the infrared light emitted from the light emitting element 106 is reflected from an object and returns to the light receiving element 107. In addition, the region where the distance between the second mounting portion 105a and the curved portion 111 is gradually increased is less likely to be affected by the inner wall of the second recess 105, and the sensitivity of the proximity sensor can be increased. That is, the infrared light emitted from the light emitting element 106 is reflected from the object, and a part of the infrared light is shielded by the curved portion 111 included in the wall portion 110 separating the first concave portion 104 and the second concave portion 105. As shown in 1 (a) and 1 (b), due to the region where the distance between the second mounting portion 105a and the curved portion 111 is gradually increased, a gap is formed between the second mounting portion 105a and the curved portion 111. Since it is located, the infrared light emitted from the light emitting element 106 and reflected back from the object is hardly affected by the curved portion 111 included in the wall 110, and the infrared light reflected from the object is easily guided to the light receiving element 107. Become. Therefore, it is possible to provide the proximity sensor package in which the infrared rays reflected from the object and returned can be efficiently detected by the light receiving element 107, and the sensitivity as the proximity sensor can be enhanced.

In the proximity sensor package according to one aspect of the present invention, the second recess 105 has a
The auxiliary recess 112 protruding to the outside is provided, and the virtual extension region 112a in the protruding direction of the auxiliary recess 112 and the first recess 104 do not overlap with each other, and a side surface perspective is seen in a direction perpendicular to the protruding direction of the auxiliary recess 112. In, the auxiliary recess 112 and the first recess 104 overlap. With such a structure, when the infrared light emitted from the light emitting element 106 is reflected from the object and returns to the light receiving element 107, the auxiliary recess 112 makes it more difficult to be effectively influenced by the inner wall of the second recess 105. , The sensitivity as a proximity sensor can be increased. That is, the infrared light emitted from the light emitting element 106 is reflected from the object, and a part of the infrared light is shielded by the wall portion 110 separating the first concave portion 104 and the second concave portion 105, but the auxiliary concave portion 112 causes the wall portion 110. Since there is a gap between the light receiving element 107 and the light receiving element 107, as shown in FIG.
As shown in (a) and (b), the structure is less likely to be affected by the wall portion 110, and the infrared light emitted from the light emitting element 106 and reflected from the object is easily guided to the light receiving element 107.

A lens that collects infrared rays may be located above the light emitting element 106. Since the angle of the infrared rays emitted from the light emitting element 106 becomes narrower and the infrared rays are emitted toward the object side with a high intensity, the infrared rays are reflected by the window portion of the panel constituting the smartphone 400 ( Crosstalk) is reduced.

Further, since infrared rays are reflected from an object and diffuse before reaching the light receiving element 107, a lens for condensing the reflected infrared rays may be positioned above the light receiving element 107. At this time, for example, the lens disposed above the light receiving element 107 and the auxiliary recess 112 allow a wide area to be straddled over the first recess 104 and the auxiliary recess 112 so that infrared rays can be efficiently focused on the light receiving portion of the light receiving element 107. The lens may be placed in the. The lens thus arranged above the light receiving element 107 has an effect of condensing infrared rays incident on the lens toward the light receiving portion of the light receiving element 107. In such a proximity sensor device 200 with a lens, This is effective when the light receiving element 107 detects infrared rays emitted from the light emitting element 106, which is smaller and has a weak output, as the substrate 100 is further miniaturized.

The place where the auxiliary recess 112 is located is important. As shown in FIGS. 1A and 2A, in plan view, the virtual extension region 112a and the first recess 104 in the protruding direction of the auxiliary recess 112 are formed.
Are not overlapped with each other, and the auxiliary recess 112 and the first recess 104 are overlapped with each other when viewed from the side. That is, the auxiliary recess 112 prevents the width of the wall portion 110 separating the first recess 104 and the second recess 105 in which the light emitting element 106 is mounted from being partially reduced, and the insulating substrate 101.
It is located extending from the second recess 105 along the outer periphery of the. With such a structure, infrared rays reflected from an object can easily enter from the auxiliary recess 112.

Further, although the auxiliary recess 112 is positioned so that a part of the second recess 105 extends toward the first recess 104, the wall 110 including the curved portion 111 between the first recess 104 and the second recess 105. , And the auxiliary recess 112 is located so as to extend to a position avoiding the first recess 104. Therefore, even if infrared rays are emitted from the light emitting portion located in the light emitting element 106 to the wall portion 110 of the first concave portion 104, the infrared ray is blocked by the wall portion 110 including the curved portion 111, so that the second concave portion 105 side, In addition, infrared rays are suppressed from being transmitted to the auxiliary recess 112 side.

Further, the auxiliary recess 112 is easy to mount the light receiving element 107 when mounting the light receiving element 107 in the second recess 105. That is, if the suction head of the mounter that has suctioned the light receiving element 107 is moved from the side of the auxiliary recess 112 toward the center of the second recess 105, the light receiving element 107 moved by the suction head comes into contact with the wiring board 100. It is possible to suppress poor mounting. Furthermore, by irradiating the auxiliary recess 112 side with illumination for improving the recognizability of the wiring conductor (not shown) located at the bottom of the second recess 105, the shadow of the illumination is generated near the inner wall of the second recess 105. Can be suppressed. Therefore, since the wiring conductor located at the bottom of the second recess 105 can be clearly confirmed by illumination, the light receiving element 107 can be mounted at a predetermined position of the second recess 105 with high positional accuracy. The light receiving element 107 is
In comparison with the light emitting element 106, a larger number of electrodes for mounting are located, and when the wiring board 100 is further miniaturized and the area of the second recess 105 is reduced, the light receiving element 107 and the like are In order to mount the electronic component in the second recess 105 with high positional accuracy, it is effective to clearly confirm the wiring conductor located at the bottom of the second recess 105 by illuminating the auxiliary recess 112. ..

The proximity sensor package of one aspect of the present invention has a second mounting portion 105a in plan view.
And the wall portion 110 of the auxiliary recess 112 has a portion having the same distance W. With such a structure, when the infrared light emitted from the light emitting element 106 is reflected from the object and returns to the light receiving element 107, the second mounting portion 105a and the wall portion 110 of the auxiliary recess 112 have the same distance W. Due to the part, the infrared rays emitted from the light emitting element 106, reflected from the object and returned, are easily guided effectively by the light receiving element 107.

That is, it is easier to more effectively guide the infrared rays reflected and returned from the object from the protruding direction of the auxiliary recess 112, that is, from the portion where the so-called second mounting portion 105a and the wall portion 110 of the auxiliary recess 112 have the same distance W. Therefore, the sensitivity for detecting whether or not the mobile terminal such as the smartphone 400 approaches an object can be increased.

In addition, since the second mounting portion 105a and the wall portion 110 of the auxiliary recess 112 have the same space W,
As shown in FIGS. 1A and 2A, the width of the wall width 110 is not partially narrowed. Therefore,
Infrared rays can be shielded by the wall portion 110, and malfunction of the proximity sensor due to direct detection of infrared rays emitted from the light emitting element 106 by the light receiving element 107 can be suppressed. Further, the second mounting portion 105a and the auxiliary recess 112 are secured by securing a portion where the second mounting portion 105a and the wall portion 110 of the auxiliary recess 112 have the same distance W for the infrared rays reflected and returned from the object. Since the portion having the same interval W as the wall portion 110 of FIG. 1 functions as a light guide path for assisting light reception, infrared rays can be effectively guided to the light receiving element 107.

Further, it is possible to mount the light emitting element 106 and the light receiving element 107 in the first recess 104 and the second recess 105, respectively, while reducing the waste of the storage space while reducing the size of the wiring board 100. In other words, the wall portion 110 not having an excessive wall width reduces the possibility that the infrared light transmitted through the light emitting element 106 is directly detected by the light receiving element 107, while the second recess 105 of the second concave portion 105 is provided. The width of the wall portion 110 protruding inward can be minimized, and in the wiring substrate 100 having a limited size, the light receiving element 107 can be mounted in the second recess 105 with less waste of the storage space. Therefore, a proximity sensor package suitable for miniaturization can be provided.

In the proximity sensor package according to one aspect of the present invention, the step portion 113 is provided on the wall portion 110 of the first recess 104.
Is located on the stepped portion 113, and has the wiring conductor 108 to which the light emitting element 106 is connected. The stepped portion 113 is located on the side facing the second recess 105 in a plan view. With such a structure, the infrared light emitted from the light emitting element 106 is effectively blocked by the inner wall of the first recess 104, and is unlikely to leak to the light receiving element 107 mounted in the second recess 105.

That is, since the step portion 113 is located on the side facing the second recess 105, the distance between the first recess 104 and the light emitting element 106 in plan view can be reduced, so that the infrared light emitted from the light emitting element 106 is emitted. Infrared rays that are shielded by the wall portion 110 and do not pass through an object are less likely to be emitted to the second recess 105 side where the light receiving element 107 is mounted.

When the distance between the first recess 104 and the light emitting element 106 in a plan view is large, the infrared rays emitted from the light emitting element 106 are likely to be emitted even in a direction inclined from the vertical direction, and the window of the panel configuring the smartphone 400. There is a possibility that the panel may be mistaken for an object when the infrared light reflected from the panel window portion is stronger than the infrared light reflected from the object to be detected.

However, since the step portion 113 is located at a position other than the side facing the second recess 105 in this way, the angle of the infrared rays emitted from the light emitting element 106 to the object becomes closer to the vertical direction, and for the proximity sensor device. Since infrared rays pass through the hole 401 near the center and are easily irradiated toward the object side with high intensity, the infrared rays are reduced from being reflected by the window portion of the panel constituting the smartphone 400. Therefore, it is possible to suppress malfunction of the proximity sensor due to the infrared rays emitted from the light emitting element 106 being directly detected by the light receiving element 107.

Since the step portion 113 is located on the side excluding the side facing the second recess 105, the bonding wire 115 connecting the electrode of the light emitting element 106 and the wiring conductor 108 located on the step portion 113 is located on the light receiving element 107 side. The weakening of the infrared intensity of is suppressed. Therefore, when infrared rays are emitted, the object is emitted in a state where it is hard to be weakened, so that the sensitivity of the proximity sensor device 200 can be increased.

When the light emitting element 106 used for such a proximity sensor is a gallium-arsenic (Ga-As) light emitting diode (infrared ray), the wavelength of infrared rays to be radiated is about 950 nm,
It is possible to detect whether or not the mobile terminal such as the smartphone 400 approaches the object by converting the infrared ray reflected from the object and returning to the current by the light receiving element 107 and comparing the current with a preset threshold value. The detection distance between the mobile terminal equipped with the proximity sensor device and the object is set by adjusting the detection threshold for the output current of the light receiving element 107, for example.

A proximity sensor device 200 according to one aspect of the present invention includes the proximity sensor package described above, a light emitting element 106 mounted in the first recess 104, and a light receiving element 107 mounted in the second recess 105. is doing. With such a structure, it is possible to realize a device in which the distance between the light emitting element 106 and the light receiving element 107 can be increased while the wiring board 100 is downsized, and malfunctions when detecting an object are suppressed.

That is, the first concave portion 104 and the second concave portion 105 are respectively biased to the corners of the wiring board 100, so that the distance between the light emitting element 106 and the light receiving element 107 can be increased while the wiring board 100 is downsized. Specifically, the first recess 104 for mounting the light emitting element 106 is located near one corner of the wiring board 100, and the second recess 105 for mounting the light receiving element 107 near the other corner. By arranging, the proximity sensor device 200 can be manufactured in which the light emitting element 106 and the light receiving element 107 are effectively arranged on the wiring board 100 having a small size and a limited size.

  By using such a proximity sensor device 200, an object is detected, and the liquid crystal screen of a mobile terminal such as a smartphone 400 is automatically adjusted to be turned on and off, which suppresses battery consumption and reduces the usage time of the mobile terminal. Can be extended.

  Further, since a part of the second concave portion 105 located on the wiring board 100 is provided with the auxiliary concave portion 112 extending to the first concave portion 104 side, the infrared light emitted from the light emitting element 106 is reflected from the object and the light receiving element 107. When it returns to, the auxiliary recess 112 makes it less likely to be affected by the inner wall of the second recess 105, and the proximity sensor device 200 with improved sensitivity as a proximity sensor can be realized.

That is, the infrared light emitted from the light emitting element 106 is reflected from the object, and a part of the infrared light is shielded by the wall portion 110 separating the first concave portion 104 and the second concave portion 105, but the auxiliary concave portion 112 causes the wall portion 110. Since the gap is located between the light receiving element 107 and the light receiving element 107, the structure is less likely to be affected by the wall portion 110, and the infrared light emitted from the light emitting element 106 and reflected from the object is easily guided to the light receiving element 107.

Here, in FIGS. 1B and 2B, the mounting positions of the light emitting element 106 and the light receiving element 107 mounted on the proximity sensor device 200 are shown on the same plane, but as shown in FIG. By setting the mounting position so that the light receiving portion of the light receiving element 107 mounted on the sensor device 200 is lower than the light emitting portion of the light emitting element 106, the infrared light emitted from the light emitting element 106 directly reaches the light receiving element 107. The malfunction of the proximity sensor device 200 due to the detection can be suppressed. At this time, when the infrared light emitted from the light emitting element 106 is reflected from the object and returns to the light receiving element 107, there is a concern that it may be easily affected by the inner wall of the second concave portion 105, as shown in FIG. As described above, the auxiliary recess 112 makes it difficult to be influenced by the inner wall of the second recess 105, and thus the proximity sensor device 200 having improved sensitivity as a proximity sensor can be realized. That is, the infrared light emitted from the light emitting element 106 is reflected from the object, and a part of the infrared light is shielded by the wall portion 110 separating the first recess 104 and the second recess 105,
Since the gap is located between the wall portion 110 and the light receiving element 107 by the auxiliary recess 112, the structure is less likely to be affected by the wall portion 110, and the infrared light emitted from the light emitting element 106 and reflected from the object is received by the light receiving element 107. It is possible to realize the proximity sensor device 200 that is easy to guide. The light receiving portion of the light receiving element 107 mounted on the proximity sensor device 200 may be located lower than the first mounting portion 104a on which the light emitting element 106 is mounted, and infrared rays emitted from the light emitting element 106 are directly received by the light receiving element 107. It is possible to effectively suppress the malfunction of the proximity sensor device 200 due to the detection by the sensor.

The proximity sensor device 200 may include an illuminance sensor (not shown). For the illuminance sensor, for example, the illuminance sensor element may be arranged together with the light receiving element 107 in the second recess 105 in which the light receiving element 107 is mounted or the auxiliary recess 112. By incorporating the illuminance sensor in this way, it is possible to prevent malfunctions caused by the touching of the LCD screen by an object (human skin as an object to be detected) during a call, and the LCD screen during a call can be turned off automatically. It is possible to control the brightness of the backlight of the LCD screen according to the brightness of, and realize further power saving.

An electronic module 300 according to one aspect of the present invention includes a module substrate 302 having a connection conductor 301, and the proximity sensor device 200 described above in which a plurality of external connection conductors 114 are connected to the connection conductor 301. .. With such a structure, a mobile terminal such as the smartphone 400 can be downsized, and a module in which malfunctions when detecting an object are suppressed can be realized.

That is, the distance between the light emitting element 106 and the light receiving element 107 can be increased while the wiring board 100 is downsized, and the proximity sensor device 200 in which malfunctions when detecting an object are suppressed is mounted, and the smartphone 400 or the like. The size of the hole 401 for the proximity sensor device located in the case of the mobile terminal can be reduced according to the size of the proximity sensor device 200. Therefore, in the conventional case where the proximity sensor device was relatively large, the hole 401 for the proximity sensor device had to be positioned in the shape of an elongated hole or as two holes. Due to the miniaturization, an object can be detected by positioning one hole as shown in FIG.

  Further, since the diameter of the proximity sensor device hole 401 located in the case of the mobile terminal such as the smartphone 400 can be reduced, the width of the window portion of the case can be reduced, and the liquid crystal screen of the mobile terminal can be replaced with a larger one.

The proximity sensor package (wiring substrate 100), proximity sensor device 200, and electronic module 300 of the present invention are not limited to the examples of the above-described embodiments, and various types are possible without departing from the scope of the present invention. There is no problem even if you make changes. In the example of the above-described embodiment, the first recess 104 has a rectangular shape and the second recess 105 has an irregular shape as shown in FIG. 1A, but it may have a circular shape, an elliptical shape, or another shape. Further, a cover made of resin or the like for blocking light other than light to be received may be disposed around the upper side of the light receiving element 107.

Further, the shapes of the wiring substrate 100 and the module substrate 302 that form the proximity sensor device 200 in plan view are not limited to the rectangular shape, and may be configured as a square shape, an octagonal shape, a circular shape, an elliptical shape, or the like.

Further, the application of the proximity sensor package (wiring board 100), proximity sensor device 200, and electronic module 300 of the present invention has been described as a proximity sensor device, but it operates by a pair of sensor elements of the light emitting element 106 and the light receiving element 107. The present invention can be applied to other devices such as a proximity illuminance integrated sensor device, a distance measurement sensor device, a pulse wave blood flow sensor device, and the like.

100 ... Wiring board (Proximity sensor package)
101 ... Insulating substrate
102 ... Main surface
103 ... Surface opposite to main surface
104 ... first recess
104a: First mounting part
105 ... second recess
105a: Second mounting part
106 ... Light emitting element
107 ... Light receiving element
108-wiring conductor
110 ... wall
111 ... Bent
112 ... Auxiliary recess
112a ... Virtual extension region in the protruding direction of the auxiliary recess
113 ... Step
114 ... External connection conductor
115 ... Bonding wire
200 Proximity sensor device
300 ・ ・ ・ Electronic module
301 ・ ・ ・ Connecting conductor
302 ・ ・ ・ Module substrate
400 ... Smartphone
401 ... Hole for proximity sensor device

Claims (7)

A wiring board having a main surface and having a first recessed portion on which the light emitting element is mounted on the first mounting portion and a second recessed portion on which the light receiving element is mounted on the second mounting portion. Including,
In a plan view, the second mounting portion has a rectangular shape, and the first recess is located on the corner side of the second mounting portion,
A proximity sensor package, wherein a wall portion between the first concave portion and the second concave portion has a curved portion in a plan view.   The proximity sensor package according to claim 1, wherein a distance between the second mounting portion and the curved portion gradually increases in a plan view. In a plan view, the second recess has an auxiliary recess protruding outward, and the virtual extension region in the protruding direction of the auxiliary recess does not overlap with the first recess,
The package for a proximity sensor according to claim 1 or 2, wherein the auxiliary recess and the first recess overlap each other in a side view in a direction perpendicular to a protruding direction of the auxiliary recess.   The proximity sensor package according to claim 3, wherein, in a plan view, the second mounting portion and the wall portion of the auxiliary recess have a portion with the same interval. A step portion is located on the wall portion of the first recess, and the wiring conductor is located on the step portion and to which the light emitting element is connected;
The proximity sensor package according to any one of claims 1 to 4, wherein the step portion is located on a side facing the second recess in a plan view. A proximity sensor package according to any one of claims 1 to 5,
A proximity sensor device comprising a light emitting element mounted in the first recess and a light receiving element mounted in the second recess. A module substrate having a connection conductor,
The proximity sensor device according to claim 6, wherein a plurality of external connection conductors are connected to the connection conductors.

Images