JP2020071857A - 室外冷却器ラックシステムを用いた液体冷却 - Google Patents
室外冷却器ラックシステムを用いた液体冷却 Download PDFInfo
- Publication number
- JP2020071857A JP2020071857A JP2019037757A JP2019037757A JP2020071857A JP 2020071857 A JP2020071857 A JP 2020071857A JP 2019037757 A JP2019037757 A JP 2019037757A JP 2019037757 A JP2019037757 A JP 2019037757A JP 2020071857 A JP2020071857 A JP 2020071857A
- Authority
- JP
- Japan
- Prior art keywords
- server rack
- cooling
- heat
- server
- cooler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 28
- 239000007788 liquid Substances 0.000 title description 10
- 238000012546 transfer Methods 0.000 claims abstract description 19
- 239000000110 cooling liquid Substances 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 10
- 239000003507 refrigerant Substances 0.000 claims description 8
- 239000000112 cooling gas Substances 0.000 claims description 7
- 239000012809 cooling fluid Substances 0.000 claims description 5
- 239000007789 gas Substances 0.000 claims description 5
- 238000012544 monitoring process Methods 0.000 claims 1
- 239000002918 waste heat Substances 0.000 claims 1
- 239000003570 air Substances 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 239000012080 ambient air Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20627—Liquid coolant without phase change
- H05K7/20636—Liquid coolant without phase change within sub-racks for removing heat from electronic boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20263—Heat dissipaters releasing heat from coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20836—Thermal management, e.g. server temperature control
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20381—Thermal management, e.g. evaporation control
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
ップ接触するヒートシンクと、対流によってサーバーとその構成要素から熱を除去する冷却システムと、を備える。この冷却システムは、室外冷却器システムを含む熱交換器システムを通過する冷却液を提供できる。このように、このハイブリッドシステムは、ヒートシンクと室外冷却器ユニットの両方の効率化を具現化する。具体的には、開示されたハイブリッドシステムは、サーバーから効率的に熱を奪い、その熱をデータセンターの外に放出できる。
接する冷却板に向けられるように、熱交換器ラジエーター18を介して空気を吸い込むことができる。
媒の圧縮に起因して冷却器ユニット19内で発生した熱を排出するために組み込まれる。
られる限りにおいて、用語「備える/含む」と同様に包括的であることが意図されている。
Claims (10)
- 内部にサーバーを収納するサーバーラックと熱伝達装置との組み合わせ体であって、
前記サーバーラックと、
ハウジングの形態のヒートシンクと、
前記サーバーラックと前記ヒートシンクとを熱接触させる熱接触構造体と、
前記サーバーラックを冷却する冷却液の供給源を提供する冷却器と、
を備える、組み合わせ体。 - 更に、前記ハウジングは前記冷却器からの前記冷却液に作用するように接続されたラジエーターを備え、
前記ハウジングは冷却ファンを備え、
前記冷却ファンは前記ラジエーターに空気を通風して前記サーバー及び前記サーバーラックを冷却する、請求項1に記載の組み合わせ体。 - サーバーラック内のサーバーの冷却システムであって、
前記サーバーラックをヒートシンクと熱接触させる熱接触構造体と、
冷却液の供給源を提供するように構成され、冷媒ガスを含む冷却器と、
前記冷却器によって提供された冷却流体に作用するように接続されたラジエーターと、
前記ラジエーターに空気を通風して、前記空気を冷却する少なくとも1つのファンと、を備え、
冷却された空気は前記サーバーラック内の前記サーバーを冷却する、冷却システム。 - 更に、第2のファンを備え、
前記第2のファンは、前記ラジエーターに通風された空気の一部を前記サーバーラックに向ける、請求項3に記載の冷却システム。 - 更に、前記冷却器は、前記冷却器からの廃熱を消散させる他のラジエーターを備え、
前記冷却器は、前記ヒートシンクから遠隔に配置される、請求項3に記載の冷却システム。 - サーバーラック内のサーバーの動作温度を所定の温度範囲内に維持する方法であって、
ヒートシンクとの伝導熱接触を通じて前記サーバーラックから熱を除去するステップと、
前記ヒートシンクにラジエーターを取り付け、ファンを用いて前記ラジエーターに冷却ガスを通風するステップと、
前記冷却ガスを、冷却液を含む前記ラジエーターと接触させることによって前記サーバーラックから熱を除去するステップと、
前記冷却ガスの少なくとも一部を前記サーバーラック内の前記サーバーに向けるステップと、
を含み、
前記ラジエーターは、前記冷却液を冷却器から供給される、方法。 - 前記冷却器で冷媒ガスを圧縮することによって前記冷却液を提供するステップと、
前記冷却液を前記冷媒ガスと間接的に接触させるステップによって、前記冷却液から熱を伝達させるステップと、を更に含み、
前記間接的に接触させるステップは、熱交換器において行われる、請求項6に記載の方法。 - 対流のプロセスによって前記サーバーラックから熱を除去するステップと、
前記サーバーラックの温度を監視するステップと、
前記サーバーラックを所定の温度範囲内に維持するように、前記サーバーラックから熱を除去するステップを制御するステップと、を更に含む、請求項6に記載の方法。 - 更に、前記冷却器を前記ヒートシンクから遠隔に配置するステップを含む、請求項6に記載の方法。
- 更に、前記冷却器を前記ヒートシンクに直接隣接して配置するステップを含み、
前記ヒートシンクはハウジングの形態にある、請求項6に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/173,529 | 2018-10-29 | ||
US16/173,529 US11147191B2 (en) | 2018-10-29 | 2018-10-29 | Liquid cooling with outdoor chiller rack system |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020071857A true JP2020071857A (ja) | 2020-05-07 |
JP6861234B2 JP6861234B2 (ja) | 2021-04-21 |
Family
ID=65234428
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019037757A Active JP6861234B2 (ja) | 2018-10-29 | 2019-03-01 | 室外冷却器ラックシステムを用いた液体冷却 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11147191B2 (ja) |
EP (1) | EP3648561A1 (ja) |
JP (1) | JP6861234B2 (ja) |
CN (1) | CN111107732B (ja) |
TW (1) | TWI744592B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024053737A1 (ja) * | 2022-09-09 | 2024-03-14 | 三菱重工業株式会社 | サーバ冷却システム |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11751361B2 (en) * | 2021-06-02 | 2023-09-05 | Microsoft Technology Licensing, Llc | Systems and methods for datacenter thermal management |
WO2024109351A1 (zh) * | 2022-11-21 | 2024-05-30 | 北京国科环宇科技股份有限公司 | 自然冷却电子设备及制造方法、采用其的机柜和数据中心 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004246649A (ja) * | 2003-02-14 | 2004-09-02 | Hitachi Ltd | ラックマウントサーバシステム、ラックキャビネット、サーバモジュール、ならびにラックマウントサーバシステムの冷却方法 |
JP2012118781A (ja) * | 2010-12-01 | 2012-06-21 | Hitachi Ltd | 電子機器用ラックおよびデータセンタ |
US20160113149A1 (en) * | 2014-10-21 | 2016-04-21 | International Business Machines Corporation | Multifunction coolant manifold structures |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10296928T5 (de) | 2001-06-12 | 2004-10-07 | Liebert Corp | Einzel- oder Doppelbuswärmeübertragungssystem |
US7957132B2 (en) | 2007-04-16 | 2011-06-07 | Fried Stephen S | Efficiently cool data centers and electronic enclosures using loop heat pipes |
JP4859823B2 (ja) | 2007-12-14 | 2012-01-25 | 株式会社日立製作所 | 冷却装置およびそれを用いた電子機器 |
US7660109B2 (en) * | 2007-12-17 | 2010-02-09 | International Business Machines Corporation | Apparatus and method for facilitating cooling of an electronics system |
JP2010041007A (ja) | 2008-08-08 | 2010-02-18 | Hitachi Information & Communication Engineering Ltd | 冷却ユニット、電子装置ラック、冷却システム及びその構築方法 |
US9271429B2 (en) | 2010-04-12 | 2016-02-23 | Fujikura Ltd. | Cooling device, cooling system, and auxiliary cooling device for datacenter |
ES2769605T3 (es) * | 2010-08-26 | 2020-06-26 | Asetek Danmark As | Sistema de refrigeración por líquido para un servidor |
US8817473B2 (en) * | 2011-09-26 | 2014-08-26 | Mellanox Technologies Ltd. | Liquid cooling system for modular electronic systems |
CA2886657C (en) | 2012-08-20 | 2021-04-13 | Adc Technologies Inc. | Apparatuses for transmitting heat between a rail of rack mounted equipment and a channel of a cooling rack enclosure, and related components, systems, and methods |
CN104703452A (zh) * | 2015-03-31 | 2015-06-10 | 广东申菱空调设备有限公司 | 液冷和压缩机空冷系统相结合的双效型服务器散热装置 |
CN104703449B (zh) * | 2015-03-31 | 2016-05-18 | 广东申菱环境系统股份有限公司 | 门式热管空调和液冷装置结合的服务器机柜散热系统 |
WO2016163994A1 (en) | 2015-04-07 | 2016-10-13 | Hewlett Packard Enterprise Development Lp | Hybrid cooling control of a computing system |
-
2018
- 2018-10-29 US US16/173,529 patent/US11147191B2/en active Active
-
2019
- 2019-01-04 TW TW108100282A patent/TWI744592B/zh active
- 2019-01-21 CN CN201910052355.8A patent/CN111107732B/zh active Active
- 2019-01-24 EP EP19153570.7A patent/EP3648561A1/en not_active Withdrawn
- 2019-03-01 JP JP2019037757A patent/JP6861234B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004246649A (ja) * | 2003-02-14 | 2004-09-02 | Hitachi Ltd | ラックマウントサーバシステム、ラックキャビネット、サーバモジュール、ならびにラックマウントサーバシステムの冷却方法 |
JP2012118781A (ja) * | 2010-12-01 | 2012-06-21 | Hitachi Ltd | 電子機器用ラックおよびデータセンタ |
US20160113149A1 (en) * | 2014-10-21 | 2016-04-21 | International Business Machines Corporation | Multifunction coolant manifold structures |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024053737A1 (ja) * | 2022-09-09 | 2024-03-14 | 三菱重工業株式会社 | サーバ冷却システム |
Also Published As
Publication number | Publication date |
---|---|
EP3648561A1 (en) | 2020-05-06 |
TW202017459A (zh) | 2020-05-01 |
CN111107732B (zh) | 2022-10-04 |
US20200137927A1 (en) | 2020-04-30 |
CN111107732A (zh) | 2020-05-05 |
US11147191B2 (en) | 2021-10-12 |
TWI744592B (zh) | 2021-11-01 |
JP6861234B2 (ja) | 2021-04-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU2017213536B2 (en) | Liquid submerged, horizontal computer server rack and systems and methods of cooling such a server rack | |
US9185830B2 (en) | Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system | |
US7864527B1 (en) | Systems and methods for close coupled cooling | |
WO2013069226A1 (ja) | ラック型サーバーを冷却する冷却装置とこれを備えたデータセンター | |
EP2677848B1 (en) | Heat exchanger and cabinet | |
TW201724959A (zh) | 熱電致冷模組與包含熱電致冷模組的散熱裝置 | |
JP6861234B2 (ja) | 室外冷却器ラックシステムを用いた液体冷却 | |
US11497145B2 (en) | Server rack and data center including a hybrid-cooled server | |
US20150351286A1 (en) | Electronic apparatus cooling system | |
US20130301214A1 (en) | Electronic unit having a housing in which heat generating components are disposed | |
US11197396B2 (en) | Cooling system with curvilinear air to liquid heat exchanger | |
TWM600068U (zh) | 設備組件、冷卻系統、及設備機架 | |
Coles et al. | Rack-Level Cooling and Cold Plate Cooling | |
CN211880860U (zh) | 设备组件、冷却系统、及设备机架 | |
CN104349642A (zh) | 具有不断气流的水冷式冷却设备 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190301 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200616 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200907 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20201020 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210115 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20210309 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210329 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6861234 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |