JP2020069606A - Holding method, processing method, and holding device - Google Patents

Abstract

To provide a holding method which is advantageous for holding an object to be held without deformation.SOLUTION: A holding method for holding an object to be held by using a fixture includes a first process of arranging the object to be held through an adhesive on a holding surface of the fixture for holding the object to be held, a second process of applying a load on a second surface opposite to a first surface of the object to be held facing to the holding surface of the fixture before curing the adhesive, and a third process of adhering the object to be held on the holding surface by curing the adhesive while applying the load on the second surface of the object to be held.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a holding method, a processing method, and a holding device.

  A technique has been proposed in which, when processing a thin optical element, such an optical element, that is, an object to be held, is fixed to a toy by using an adhesive such as an alloy (see Patent Document 1). However, the technique disclosed in Patent Document 1 strictly manages the shape accuracy of the bonding surface between the object to be held and the toy and the thickness of the adhesive when high-precision processing is required for the object to be held. Must be done, which is very difficult to achieve.

  In addition, the held object itself is affected by deformation due to its own weight at the time of bonding and the shape error of the bonding surface and the bonding surface, from the yatoi the shape error of the bonding surface, and from the adhesive the uneven thickness. Therefore, it is bonded (fixed) to the yatoi in a distorted state. If the object to be held is adhered to the yatoi in a distorted state, even if highly precise processing is performed on the object to be held, the distortion during adhesion will be restored when the object to be held is peeled from the toy after processing. I will end up.

  Therefore, there has been proposed a technique for reducing the distortion when the object to be held is bonded to the toy (see Patent Document 2). According to the technique disclosed in Patent Document 2, a flexible tube is arranged on the surface of the toy, and the object to be held is placed in a state in which the inside of the tube is filled with an epoxy resin to form the object to be held. The epoxy resin is hardened in a shape that follows. Furthermore, in the technique disclosed in Patent Document 2, a gas-permeable tube is arranged in parallel with the above-mentioned tube, and the atmospheric pressure inside the tube is appropriately controlled.

JP, 2002-187056, A US Pat. No. 5,228,243

  However, in the technique disclosed in Patent Document 2, the tubes are not held, and the shape of the held object is distorted at such portions, so it cannot be said that the deformation of the held object is sufficiently suppressed. .. Further, in the technique disclosed in Patent Document 2, since the tube is not fixed to the toy, it is easily assumed that the holding force required when processing the held object is insufficient.

  The present invention has been made in view of the above problems of the conventional art, and an exemplary object of the present invention is to provide a holding method advantageous for holding an object to be held without deforming it.

  In order to achieve the above object, a holding method as one aspect of the present invention is a holding method for holding an object to be held by using a toy, and a holding method for holding the object to be held on the holding surface of the toy. A first step of disposing the object to be held via an adhesive, and a step on the opposite side of the first surface of the object to be held, which is opposed to the holding surface of the yatoi, before curing the adhesive. A second step of applying a load to the two surfaces, and a third step of curing the adhesive while applying a load to the second surface of the held object to bond the held object to the holding surface, It is characterized by having.

  Further objects and other aspects of the present invention will be made clear by the preferred embodiments described below with reference to the accompanying drawings.

  According to the present invention, for example, it is possible to provide a holding method that is advantageous for holding an object to be held without deforming it.

It is a figure for explaining the holding method as one side of the present invention. It is a figure for explaining concretely a holding method and a processing method as one side of the present invention. It is a figure for demonstrating the method of determining the magnitude of the load applied to the 2nd surface of a mirror. It is a schematic diagram showing composition of a holding device as one side of the present invention.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. In each drawing, the same reference numerals are given to the same members, and duplicate description will be omitted.

  FIG. 1 is a diagram for explaining a holding method according to one aspect of the present invention. This holding method is a method of holding an object to be held (object to be processed) using the toy 1, and in the present embodiment, a thin optical element as the object to be held or the object to be processed, specifically, a mirror. Holds 3.

  The toy 1 is a jig for holding an object to be held (high-precision machining, for example, polishing) on an object to be held (object to be processed), and is a holding surface 1a for holding a mirror 3. including. In the present embodiment, the mirror 3 includes a first surface 3a and a second surface 3b opposite to the first surface 3a, and the first surface 3a forms a back surface including a convex surface and a second surface 3b. Form a reflective surface having a concave shape (including a concave surface). Thus, the first surface 3a and the second surface 3b form a so-called meniscus shape. The mirror 3 includes, for example, a mirror used in a liquid crystal exposure apparatus and a main mirror used in an astronomical telescope.

  As shown in FIG. 1, the holding method according to the present embodiment uses an adhesive 2 between the touchscreen 1 and the mirror 3, more specifically, between the holding surface 1a of the touchscreen 1 and the first surface 3a of the mirror 3. Fill. Then, before the adhesive 2 is cured, a load 4 is applied (loaded) to the second surface 3b of the mirror 3 which faces the holding surface 1a of the toy 1 and is opposite to the first surface 3a. At this time, the magnitude of the load 4 is determined based on the buoyant force acting on the mirror 3 from the adhesive 2 and the weight of the mirror 3, and the load 4 is applied to the second surface 3b of the mirror 3 with such a magnitude. Specifically, the magnitude of the load 4 is adjusted (determined) so that the sum of the magnitude of the load 4 and the weight of the mirror 3 becomes equal to the buoyancy acting on the mirror 3 from the adhesive 2. Then, the adhesive 2 is cured while the load 4 is applied to the second surface 3b of the mirror 3, and the mirror 3 is adhered to the holding surface 1a of the toy 1.

  According to the holding method of the present embodiment, the adhesive 2 can be hardened in the state that the toy 1 holds the mirror 3 with substantially zero gravity. Thereby, when the mirror 3 is adhered (fixed) to the hairtoy 1, the influence of the deformation of the mirror 3 due to its own weight, the influence of the shape error of the hairtoy 1 and the mirror 3, and the influence of the uneven thickness of the adhesive 2 are suppressed. You can Therefore, according to the holding method of the present embodiment, the mirror 3 can be held by the toy 1 without being deformed.

  Here, the adhesive 2 has only to have a function of connecting the touchscreen 1 and the mirror 3. As the adhesive 2, for example, gypsum (calcium sulfate) is suitable. Gypsum is advantageous in that it suppresses deformation during bonding because it has a low curing expansion coefficient. Further, gypsum is advantageous in terms of availability and cost. Alternatively, a resin or a low melting point metal may be used as the adhesive 2. Resins and low-melting-point metals are advantageous in shortening the lead time because they have the characteristics that the curing time is short or they are easily peeled off.

  The load 4 is projected over the area of the adhesive 2, that is, in the second surface 3b of the mirror 3, the area where the first surface 3a of the mirror 3 and the adhesive 2 are in contact is projected on the second surface 3b. It is preferred that the area be evenly applied. In this embodiment, the load 4 is applied by spreading the liquid on the second surface of the mirror 3. As such a liquid, for example, a sodium polytungstate aqueous solution is suitable. Since the sodium polytungstate aqueous solution has good solubility, it is advantageous in that the specific gravity can be increased and the concentration can be easily adjusted. Further, the sodium polytungstate aqueous solution is advantageous in that it is nontoxic to the human body and has high reusability.

  Further, the load 4 may be applied by disposing powder or metal particles or resin particles having a small diameter of about 10 mm on the second surface of the mirror 3. Metal particles or resin particles are advantageous in that they can be easily recovered when the load 4 is removed.

  The holding surface 1 a of the toy 1 has a concave shape (including a concave surface) corresponding to the convex shape of the first surface 3 a of the mirror 3. In this embodiment, the concave shape of the holding surface 1a of the toy 1 has a curvature equal to the curvature of the convex surface of the first surface 3a of the mirror 3. As a result, the thickness of the adhesive 2 can be made uniform, and the influence on the deformation of the mirror 3 due to the expansion and contraction of the adhesive 2 during curing can be made uniform.

  The holding method of the present embodiment is applied to, for example, a processing method for processing the mirror 3 that is a workpiece (holding object). In this processing method, after the adhesive 2 is cured, the load 4 applied to the second surface 3b of the mirror 3 is removed (unloaded). Then, the second surface 3b of the mirror 3 held by the toy 1 is subjected to processing such as grinding or polishing. After the second surface 3b of the mirror 3 is processed, the mirror 3 is peeled from the toy 1. For example, by inserting (holding) the second surface 3b of the mirror 3 into the adhesive 2 with a wedge, the mirror 3 can be easily peeled from the toy 1. According to such a processing method, since the deformation (distortion) at the time of adhesion is not restored when the mirror 3 is peeled from the toy 1, the mirror 3 can be processed with high accuracy.

  With reference to FIGS. 2A to 2E, a holding method and a processing method according to the present embodiment, that is, a procedure for processing the mirror 3 by adhering (fixing) the mirror 3 to the ear toy 1 will be specifically described. explain.

  First, as shown in FIG. 2A, the toy 1 is placed on a work surface plate (not shown). Next, as shown in FIG. 2B, the adhesive 2 is supplied (applied) to the holding surface 1a of the toy 1. Next, as shown in FIG. 2C, the mirror 3 is placed on the adhesive 2 supplied to the holding surface 1 a of the toy 1 using a mirror carrying tool (not shown). In this way, the mirror 3 is arranged on the holding surface 1 of the toy 1 via the adhesive 2 (first step).

  Then, as shown in FIG. 2 (d), before the adhesive 2 is cured, a holding tool 1a of the toy 1 and a first surface 3a of the mirror 3 facing the holding surface 1a are used by using a load insertion tool (not shown). A load 4 is applied to the second surface 3b on the opposite side (second step). Then, while maintaining the state in which the load 4 is applied to the second surface 3b of the mirror 3, it waits until the adhesive 2 is cured. In this way, the adhesive 2 is cured while the load 4 is applied to the second surface 3b of the mirror 3 to bond the mirror 3 to the holding surface 1a of the touch panel 1 (third step).

  Next, as shown in FIG. 2E, after the adhesive 2 is cured, the load 4 applied to the second surface 3b of the mirror 3 is removed using a load discharging tool (not shown) (fourth step). ). Then, the second surface 3b of the mirror 3 held (fixed) by the toy 1 is processed (cutting, polishing, etc.) (fifth step).

  By holding and processing the mirror 3 in such a procedure, as described above, the mirror 3 can be held without being deformed, and the mirror 3 can be processed with high accuracy.

A method for determining the magnitude of the load 4 applied to the second surface 3b of the mirror 3 before the adhesive 2 is cured will be described with reference to FIG. At a certain point 30 on the side of the first surface 3 a of the mirror 3, the pressure (hydrostatic pressure) P applied from the adhesive 2 to the mirror 3 is the density ρ ₂ of the adhesive ₂ , the gravitational acceleration g, and the adhesive 30 from the point 30. It can be expressed by the following formula (1) using the distance h ₂ to the liquid surface.

P = ρ ₂ × g × h ₂ (1)
Further, the buoyancy F received by the adhesive 2 on the entire first surface 3a of the mirror 3 is the sum of the pressures (hydrostatic pressures) P at the points on the first surface 3a of the mirror 3, and therefore the following formula (2) Can be expressed as

F = ΣP (2)
The buoyancy F shown in the equation (2) is equal to the sum of the weight M _{3g of the} mirror 3 and the magnitude M _4g of the load 4, specifically, to satisfy the following equation (3), The magnitude M _4g of load ₄ is determined.

F = M _3g + M _4g (3)
Further, when the minute area on the first surface 3a side of the mirror 3 is ds, the pressure (hydrostatic pressure) received by the adhesive 2 from the minute area ds is a cylinder 50 formed by extending the minute area ds in the vertical direction. A balance equation is established between the sum of the weight of the mirror 3 and the weight of the load 4 included in. The density of the mirror 3 is ρ ₃ , the vertical length of the mirror 3 included in the cylinder 50 is h ₃ , the density of the load 4 is ρ ₄ , and the vertical length of the load 4 included in the cylinder is h ₄ . Then, the balance equation is expressed by the following equation (4).

P × ds = {(ρ ₃ × g × h ₃ ) + (ρ ₄ × g × h ₄ )} × ds (4)
If the formula (4) is satisfied on the entire surface of the mirror 3 on the first surface 3a side, it is possible to realize the holding of the mirror 3 in which deformation is suppressed in a weightless state. By dividing both sides of the equation (4) by ds and substituting the equation (1), the following equation (5) is obtained, which is a condition for realizing the holding of the mirror 3 in which deformation is suppressed in a weightless state.

ρ ₂ × g × h ₂ = (ρ ₃ × g × h ₃ ) + (ρ ₄ × g × h ₄ ) ... (5)
Note that, as shown in FIG. 4, the holding device HA that performs the above-described holding method also constitutes one aspect of the present invention. The holding device HA includes a toy 1, a supply unit SU that supplies the adhesive 2 to the holding surface 1a of the toy 1, and a mirror that mounts the mirror 3 on the adhesive 2 supplied to the holding surface 1a of the toy 1. It has a carrying tool CT and a load input tool LIT for applying a load 4 to the second surface 3b of the mirror 3. Further, the holding device HA performs processing for integrally controlling the load discharge tool LET for removing the load 4 applied to the second surface 3b of the mirror 3 and each part of the holding device HA to hold the mirror 3 in the toy 1, that is, It has the processing part PU which performs each process of the holding method mentioned above.

  The processing unit PU includes a first processing unit PU1 that controls the supply unit SU and the mirror carrying tool CT to perform a step of disposing the mirror 3 on the holding surface 1a of the yattoo 1 via the adhesive 2. .. Further, the processing unit PU includes the second processing unit PU2 that controls the load input tool LIT to perform the step of applying the load 4 to the second surface 3b of the mirror 3 before the adhesive 2 is cured. Further, the processing unit PU controls the load insertion tool LIT to cure the adhesive 2 while applying the load 4 to the second surface 3b of the mirror 3 to bond the mirror 3 to the holding surface 1a of the touchscreen 1. It includes a third processing unit PU3 that performs processing. Further, the processing unit PU includes a fourth processing unit PU4 that controls the load discharging tool LET to cure the adhesive 2 and then remove the load 4 applied to the second surface 3b of the mirror 3.

  According to the holding device HA of this embodiment, the mirror 3 can be held by the toy 1 without being deformed.

  Although the preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the gist thereof.

1: Yatoi 2: Adhesive 3: Mirror 4: Load

Claims (12)

A holding method for holding an object to be held using a toy,
A first step of arranging the held object on the holding surface of the toy holding the held object via an adhesive;
A second step of applying a load to a second surface of the held object, which is opposite to the first surface of the held object, before the adhesive is cured;
A third step of curing the adhesive while applying a load to the second surface of the held object to bond the held object to the holding surface;
A holding method comprising:   In the second step, the load is applied to an area of the second surface where the first surface and the adhesive are in contact with each other and the area projected onto the second surface. The holding method described in 1.   In the second step, the magnitude of the load is determined on the basis of the buoyancy force acting on the held object from the adhesive and the weight of the held object, and the magnitude of the load is determined by the size of the load on the second surface. The holding method according to claim 1, wherein a load is applied.   The magnitude of the load is determined in the second step so that the sum of the magnitude of the load and the weight of the held object is equal to the magnitude of the buoyancy. Retention method.   The holding method according to any one of claims 1 to 4, wherein in the second step, the load is applied by stretching a liquid on the second surface.   The holding method according to claim 5, wherein the liquid contains an aqueous solution of sodium polytungstate.   The holding method according to claim 1, wherein in the second step, the load is applied by disposing metal particles or resin particles on the second surface.   The holding method according to claim 1, wherein the adhesive contains calcium sulfate, a resin, or a low melting point metal. The first surface includes a convex surface,
The holding method according to claim 1, wherein the second surface includes a concave surface. The holding surface includes a concave surface,
The holding method according to claim 9, wherein the concave surface of the holding surface has a curvature equal to the curvature of the convex surface of the first surface. A processing method for processing a workpiece,
A first step of arranging the work piece on a holding surface of a toy holding the work piece via an adhesive;
A second step of applying a load to a second surface of the workpiece opposite to the holding surface of the toy, which is opposite to the first surface, before the adhesive is cured;
A third step of curing the adhesive while applying a load to the second surface of the workpiece to bond the workpiece to the holding surface;
A fourth step of removing the load applied to the second surface of the workpiece after curing the adhesive;
A fifth step of processing the second surface of the workpiece held by the yatto,
A processing method comprising: A holding device for holding an object to be held,
A toy holding the object to be held,
A processing unit that performs a process of holding the held object in the yatto,
Have
The processing unit is
A first step of arranging the held object on the holding surface of the toy holding the held object via an adhesive;
A second step of applying a load to a second surface of the held object, which is opposite to the first surface of the held object, before the adhesive is cured;
A third step of curing the adhesive while applying a load to the second surface of the held object to bond the held object to the holding surface;
A holding device characterized by performing.

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