JP2020067269A5 - - Google Patents
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- Publication number
- JP2020067269A5 JP2020067269A5 JP2019085579A JP2019085579A JP2020067269A5 JP 2020067269 A5 JP2020067269 A5 JP 2020067269A5 JP 2019085579 A JP2019085579 A JP 2019085579A JP 2019085579 A JP2019085579 A JP 2019085579A JP 2020067269 A5 JP2020067269 A5 JP 2020067269A5
- Authority
- JP
- Japan
- Prior art keywords
- heat pipe
- manufacturing
- container
- nanoparticle layer
- pipe according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 claims 8
- 239000002105 nanoparticle Substances 0.000 claims 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 4
- 239000012530 fluid Substances 0.000 claims 3
- 238000009835 boiling Methods 0.000 claims 2
- 239000007788 liquid Substances 0.000 claims 2
- 239000000377 silicon dioxide Substances 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018197126 | 2018-10-19 | ||
| JP2018197126 | 2018-10-19 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020067269A JP2020067269A (ja) | 2020-04-30 |
| JP2020067269A5 true JP2020067269A5 (enExample) | 2022-03-18 |
| JP7284988B2 JP7284988B2 (ja) | 2023-06-01 |
Family
ID=70390070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019085579A Active JP7284988B2 (ja) | 2018-10-19 | 2019-04-26 | ヒートパイプ製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7284988B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW202314185A (zh) * | 2021-06-18 | 2023-04-01 | 國立大學法人電氣通信大學 | 具有奈米粒子層之金屬基材之製造方法 |
| US12394690B2 (en) | 2022-01-04 | 2025-08-19 | Corning Research & Development Corporation | Systems and methods of nano-particle bonding for electronics cooling |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM246562U (en) * | 2003-10-31 | 2004-10-11 | Hon Hai Prec Ind Co Ltd | Heat pipe |
| JP2009276022A (ja) * | 2008-05-16 | 2009-11-26 | Furukawa Electric Co Ltd:The | ヒートパイプ |
| JP5765045B2 (ja) * | 2011-04-28 | 2015-08-19 | 富士通株式会社 | ループ型ヒートパイプ及びその製造方法 |
| JP2013243249A (ja) * | 2012-05-21 | 2013-12-05 | Denso Corp | 沸騰冷却用伝熱面および沸騰冷却装置 |
| JP2016217684A (ja) * | 2015-05-26 | 2016-12-22 | 国立大学法人横浜国立大学 | 冷却器及びそれを用いた冷却装置、並びに、発熱体の冷却方法 |
| JP2018150621A (ja) * | 2017-03-10 | 2018-09-27 | 国立大学法人電気通信大学 | 冷却剤 |
-
2019
- 2019-04-26 JP JP2019085579A patent/JP7284988B2/ja active Active
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