JP2020061895A - Power conversion device - Google Patents

Abstract

To provide a power conversion device capable of reducing the size.SOLUTION: The power conversion device includes: a transformer case 200 and a transformer 24b; a power line 140 connected to the transformer 24b; and a transformer shield 210 having a contact portion that is in contact with the transformer 24b and a shield portion that extends along the power line 140 and that shields radio waves emitted from the power line.SELECTED DRAWING: Figure 4A

Description

  The present disclosure relates to power conversion devices.

  2. Description of the Related Art In recent years, in-vehicle power conversion devices have been integrated with each other in order to increase the cruising range. Along with this, a structure in which power components are mounted on both sides of a cooler is used for cooling power components that are small but generate heat.

JP, 2016-220344, A

  In such a structure, the power cable and the signal cable that connect the circuits provided above and below the cooler need to be passed through the through holes that vertically pass through the cooler in a state of being close to each other. There is a problem that the generated noise affects the function of the signal cable.

  With respect to such a problem, Patent Document 1 has a structure in which a shield coating for preventing the outflow of noise is provided on the cable itself. However, the structure described in Patent Document 1 has a problem that the cable becomes large and the power conversion device becomes large accordingly.

  An object of the present disclosure is to provide a power conversion device that can be downsized.

  One form of the present disclosure is a reactor, a power line connected to the reactor, a contact portion in contact with the reactor, and a shield that extends along the power line and shields radio waves emitted from the power line. And a shield member having a section.

  According to the present disclosure, it is possible to reduce the size of the power conversion device.

FIG. 1 is a circuit block diagram showing the configuration of the power supply device according to the embodiment. FIG. 2 is a diagram showing the configuration of the power supply device according to the embodiment. FIG. 3A is a diagram showing the configuration of the low-voltage substrate according to the embodiment. FIG. 3B is a diagram showing the configuration of the low-voltage substrate according to the embodiment. FIG. 3C is a diagram showing the configuration of the low-voltage substrate according to the embodiment. FIG. 3D is a diagram showing a configuration of a low voltage substrate according to a modification. FIG. 3E is a diagram showing the configuration of the control board according to the modification. FIG. 4A is a perspective view showing a configuration of a transformer and its periphery according to the embodiment. FIG. 4B is a perspective view showing the configuration of the transformer shield according to the embodiment. FIG. 4C is a diagram showing a transformer. 4D is a sectional view taken along line 4D-4D of FIG. 4C. 4E is a cross-sectional view taken along line 4E-4E of FIG. 4D. FIG. 5A is a diagram for explaining a shared structure of capacitors. FIG. 5B is a diagram for explaining a shared structure of capacitors. FIG. 5C is a diagram for explaining a common structure of capacitors. FIG. 6A is a perspective view showing a coil and its surroundings of the DC / DC converter according to the embodiment. FIG. 6B is a diagram showing a coil. 6C is a sectional view taken along line 6C-6C of FIG. 6B. FIG. 7A is a perspective view showing a configuration of the current sensor and its periphery according to the embodiment. FIG. 7B is a diagram showing a current sensor. 7C is a sectional view taken along line 7C-7C of FIG. 7B. 7D is a sectional view taken along line 7D-7D in FIG. 7B.

  Hereinafter, a power supply device (an example of a “voltage conversion device”) according to an embodiment of the present disclosure will be described in detail with reference to the drawings. Note that the embodiment described below is an example, and the present disclosure is not limited to this embodiment.

(Overall structure of power supply unit)
The overall configuration of the power supply device 1 will be described with reference to FIG. FIG. 1 is a circuit block diagram showing the configuration of the power supply device 1.

  The power supply device 1 is mounted on a vehicle such as an electric vehicle. The power supply device 1 charges the battery 3 with the electric power supplied from the external power supply 2, and supplies the electric power from the battery 3 to at least one of the load 4 and the motor 5.

  The battery 3 is, for example, a low-voltage (for example, 48V) rated battery that does not need to be insulated from the vehicle body. Examples of the battery 3 include a lithium ion battery. The load 4 is an electronic device driven by a low voltage (for example, 12V). The motor 5 is a three-phase AC motor driven by a low voltage (for example, 48V). The motor 5 is a motor for driving the vehicle.

  The power supply device 1 includes an AC filter unit 10, a charger 20, a DC / DC conversion unit 40, a capacitor 50, a power conversion unit 60, a first control unit 70, and a second control unit 80. The AC filter unit 10, the charger 20, the DC / DC conversion unit 40, the capacitor 50, the power conversion unit 60, the first control unit 70, and the second control unit 80 are connected to the vehicle body of the vehicle in which the power supply device 1 is mounted. It is stored inside the casing 100.

  The AC filter unit 10 reduces noise that enters from the external power supply 2 and noise that flows out to the external power supply 2. The AC filter unit 10 has a coil, a capacitor, and the like.

  The charger 20 converts the electric power of the first voltage (for example, 100V) supplied from the external power supply 2 which is an AC power source into the electric power of the second voltage (for example, 48V) lower than the first voltage, and the battery 3 Output to. The charger 20 includes a rectification unit 21, a power factor correction unit 22, a capacitor 23, and a DC / DC conversion unit 24.

  The rectification unit 21 performs full-wave rectification on the AC power from the AC filter unit 10 to convert it into DC power, and outputs the DC power to the power factor correction unit 22. The rectifying unit 21 is a diode bridge circuit including four diodes.

  The power factor improving unit 22 has a function of improving the power factor of the electric power from the rectifying unit 21. The power factor correction unit 22 has a coil 22a, a switching element 22b, and a diode 22c. Although omitted in FIG. 1, the power supply device 1 includes two power factor correction units 22 connected in parallel between the rectification unit 21 and the capacitor 23. As a result, the power factor correction unit 22 constitutes an interleave type power factor correction circuit.

  The capacitor 23 is connected to the output side of the power factor improving unit 22 and smoothes the DC power from the power factor improving unit 22. Since the voltage of the DC power is boosted by the power factor correction unit 22, the capacitor 23 has a relatively large capacity.

  The DC / DC conversion unit 24 is a circuit that converts the DC power from the power factor correction unit 22 into a voltage with which the battery 3 can be charged. The DC / DC converter 24 includes an inverter 24a, a transformer 24b, and a secondary side rectifier circuit 24c.

  The inverter 24a converts the DC power from the power factor correction unit 22 into AC power and outputs the AC power to the transformer 24b. The inverter 24a has four switching elements 24d.

  The transformer 24b transforms the voltage of the AC power from the inverter 24a and outputs it to the secondary side rectifier circuit 24c. The transformer 24b has a power transmission coil 24e connected to the output side of the inverter 24a and a power reception coil 24f connected to the input side of the secondary side rectification circuit 24c.

  The secondary side rectifier circuit 24c is a circuit that converts the AC power from the transformer 24b into DC power. The secondary side rectifier circuit 24c has four switching elements 24g.

  The DC / DC converter 40 converts the DC power of the second voltage (for example, 48V) output from the battery 3 into the third voltage (for example, 12V) that can be supplied to the load 4. The DC / DC converter 40 has a capacitor 30 arranged on the input side, two switching elements 41, a coil 42, and a capacitor 43 arranged on the output side.

  The capacitor 50 is arranged on the input side of the power conversion unit 60. The function of the capacitor 50 will be described later.

  The power converter 60 converts the DC power of the second voltage into AC power. The power converter 60 is a three-phase bridge inverter circuit and has a plurality of switching elements. A current sensor 90 is provided on the output side of the power conversion unit 60.

  The first control unit 70 controls the operation of the charger 20 by on / off controlling the switching element 22b of the power factor correction unit 22, the switching element 24d of the inverter 24a, and the switching element 24g of the secondary side rectification circuit 24c. . That is, under the control of the first control unit 70, the AC power of the first voltage supplied from the external power supply 2 is converted into the DC power of the second voltage via the charger 20, and the battery 3 is charged.

  In addition, the first control unit 70 controls the operation of the DC / DC conversion unit 40 by performing on / off control of the switching element 41 of the DC / DC conversion unit 40. That is, under the control of the first control unit 70, the DC power of the second voltage is converted into the DC power of the third voltage via the DC / DC conversion unit 40 and output to the load 4.

  The second control unit 80 controls the operation of the power conversion unit 60 by turning on and off the switching elements of the power conversion unit 60. That is, under the control of the second control unit 80, the DC power of the second voltage supplied from the battery 3 is converted into the three-phase AC power of the second voltage via the power conversion unit 60 and output to the motor 5. It

  The first control unit 70 and the second control unit 80 can communicate with the vehicle control device via a connector provided in the housing 100, and each unit of the power supply device 1 under the control of the vehicle control device. Control. Since the first control unit 70 and the second control unit 80 operate at a low voltage, it is not necessary to insulate the vehicle body.

(Structure of power supply device)
Next, the configuration of the power supply device 1 will be described with reference to FIG. FIG. 2 is a diagram showing the configuration of the power supply device 1. Note that FIG. 2 schematically shows the configuration of the power supply device 1, and omits some components and wiring that are not directly related to the description. In FIG. 2, the Z axis is drawn for convenience. The positive direction of Z axis (upward direction in FIG. 2) is defined as + Z direction.

  The power supply device 1 has a housing 100. The housing 100 includes a partition member 101 extending in a plane orthogonal to the Z axis (hereinafter, referred to as “XY plane”), a first cover member 101a provided on the −Z direction side of the partition member 101, The second cover member 101b is provided on the + Z direction side of the partition member 101.

  In this embodiment, the partition member 101, the first cover member 101a, and the second cover member 101b are all members made of aluminum. The first cover member 101a is open on the + Z direction side. The second cover member 101b is open on the −Z direction side. The first cover member 101a and the second cover member 101b are fixed (for example, screwed) to the partition member 101.

  The AC filter unit 10, the rectifying unit 21, the power factor improving unit 22 (the coil 22a, the switching element 22b, and the diode 22c) in the charger 20, the capacitor 23, the inverter 24a, and the transformer 24b are the partition member 101 and the first cover. It is provided in the first space 102 surrounded by the member 101a.

  The AC filter unit 10, the rectifying unit 21, the power factor improving unit 22, the capacitor 23, the inverter 24a, and the transformer 24b in the charger 20 are the parts to which the first voltage is applied. Hereinafter, the portion to which the first voltage is applied may be referred to as “first circuit portion 6” (see FIG. 1). Further, the rectification unit 21, the power factor correction unit 22, the capacitor 23, the inverter 24a, and the transformer 24b in the charger 20 may be referred to as the "primary side circuit 8" (see FIG. 1).

  Each element that constitutes the AC filter unit 10 is mounted on the + Z side surface of the AC filter substrate 110 that extends in the XY plane. The AC filter substrate 110 is a resin substrate.

  Each element constituting the rectification unit 21, the switching element 22b and the diode 22c of the power factor correction unit 22, and the inverter 24a are mounted on the + Z side surface of the high voltage substrate 120 extending in the XY plane. The capacitor 23 is mounted on the −Z side surface of the high voltage board 120. The high voltage substrate 120 is a resin substrate. The AC filter substrate 110 and the high voltage substrate 120 are electrically connected.

  The high-voltage board 120 is arranged on the −Z direction side of the partition member 101 with a gap from the partition member 101. Further, the AC filter substrate 110 is arranged on the −Z direction side of the high voltage substrate 120 with a gap from the high voltage substrate 120.

  The coil 22a of the power factor correction section 22 is arranged with a predetermined gap from the −Z side surface of the partition member 101. The high voltage substrate 120 and the coil 22a are electrically connected. The transformer 24b is arranged with a predetermined gap from the −Z side surface of the partition member 101. The high voltage substrate 120 and the transformer 24b are electrically connected.

  The secondary side rectifier circuit 24c, the DC / DC converter 40, the capacitor 50, the power converter 60, the first controller 70, and the second controller 80 of the charger 20 are provided in the partition member 101 and the second cover member 101b. It is provided in the enclosed second space 103.

  The secondary side rectifier circuit 24c, the DC / DC converter 40, the capacitor 50, the power converter 60, the first controller 70, and the second controller 80 of the charger 20 are parts to which the second voltage is applied. Hereinafter, the portion to which the second voltage is applied may be referred to as "second circuit portion 7" (see FIG. 1).

  The insulation grade in the first space 102 and the insulation grade in the second space 103 are different from each other. Specifically, the insulation grade in the first space 102 is higher than the insulation grade in the second space 103.

  The respective elements constituting the secondary side rectifier circuit 24c, the DC / DC converter 40, the capacitor 50, and the power converter 60 of the charger 20 are mounted on the + Z side surface of the low-voltage board 130. The low voltage substrate 130 is an aluminum substrate, and the + Z side surface of the low voltage substrate 130 is coated with a resin insulating layer.

  Further, a wiring pattern for electrically connecting the respective elements is printed on the surface of the insulating layer. The wiring pattern formed on the low voltage substrate 130 will be described later. The −Z side surface of the low voltage substrate 130 is in direct contact with the + Z side surface of the partition member 101. Thereby, the element on the low voltage side through which a large current flows can be appropriately cooled.

  Radiating fins 104 are provided on the partition member 101. Further, the partition member 101 is provided with a hole 105 penetrating in the Z direction. The first circuit portion 6 and the second circuit portion 7 are electrically connected to each other by a power line 140 penetrating the hole 105. Specifically, the transformer 24b and the secondary side rectifier circuit 24c are electrically connected by the power line 140 that penetrates through the hole 105.

  Each element forming the first control unit 70 and each element forming the second control unit 80 are mounted on the + Z side surface of the control board 160 extending in the XY plane. The control board 160 is a resin board. The control board 160 is arranged on the + Z direction side of the low-voltage board 130 with a gap from the low-voltage board 130.

  The first control unit 70, the switching element 22b, and the inverter 24a are electrically connected by a signal line 150 penetrating the hole 105.

  As described above, in the present embodiment, the primary circuit 8 of the charger 20 to which the first voltage is applied is stored in the first space 102, and the charger 20 to which the second voltage lower than the first voltage is applied. The secondary side rectifier circuit 24c is stored in the second space 103.

  Further, according to the present embodiment, the first circuit portion 6 to which the first voltage is applied is stored in the first space 102, and the second circuit portion 7 to which the second voltage lower than the first voltage is applied is the second space 103. Stored in.

  As a result, the elements on the high voltage side, which require high insulation, can be collectively arranged in the first space 102, and the elements on the low voltage side, which require high heat dissipation, can be placed in the second space. They can be collectively arranged in 103.

  According to the present embodiment, by appropriately arranging the respective elements according to the need for insulation and the need for heat dissipation, the insulation structure and the heat dissipation structure can be made appropriate, and the power supply device 1 It is possible to reduce the size.

  Further, according to the present embodiment, the first control unit 70 that controls the primary side circuit 8 is stored in the second space 103. Therefore, it is possible to preferably prevent the insulation of the elements forming the first control unit 70 from becoming excessive.

  Further, according to the present embodiment, the elements on the low voltage side, through which a large amount of current flows and having a high heat generation property, are collectively mounted on the low voltage substrate 130 made of aluminum which is excellent in heat dissipation. Therefore, these elements can be cooled appropriately.

  Further, the low-voltage substrate 130 is arranged so as to be in direct contact with the partition member 101 having the heat radiation fins 104 and excellent in heat radiation. Therefore, a large current flows, and the element on the low voltage side, which has high heat generation, can be cooled more appropriately.

  Furthermore, according to the present embodiment, the elements on the high voltage side are collectively arranged in the first space 102, and the elements on the low voltage side are collectively arranged in the second space 103. It is possible to preferably suppress the influence of noise on the low voltage side.

  In particular, in the present embodiment, the power supply device 1 has the partition member 101 that partitions the first space 102 and the second space 103, and the partition member 101 has the radiation fins 104. As a result, the first space 102 on the high voltage side can be separated from the second space 103 on the low voltage side.

  Therefore, it is possible to preferably suppress the noise generated on the high voltage side from affecting the low voltage side. Further, since the impedance can be increased by the partition member 101 and the heat radiation fin 104, it is possible to more preferably suppress the noise generated on the high voltage side from affecting the low voltage side.

(Distribution structure on low voltage substrate)
Next, with reference to FIG. 3A, FIG. 3B and FIG. 3C, the wiring pattern (power distribution structure) in the low voltage substrate 130 will be described. 3A, 3B and 3C are diagrams showing the configuration of the low voltage substrate 130. For convenience, the X-axis, the Y-axis, and the Z-axis are drawn in FIGS. 3A, 3B, and 3C. The Z axis is common to the Z axis in FIG. The positive direction of the X axis is defined as + X direction, and the positive direction of the Y axis is defined as + Y direction. In addition, in FIGS. 3A, 3B, and 3C, configurations that are not directly related to the description are omitted.

  As described above, the low voltage substrate 130 is a metal substrate such as an aluminum substrate or a copper substrate. The low voltage substrate 130 is directly placed and fixed on the + Z side surface of the partition member 101 (see FIG. 2). The + Z side surface of the low voltage substrate 130 is coated with an insulating layer made of resin.

  Each element of the secondary side rectifier circuit 24c, each element of the DC / DC converter 40, the capacitor 50, and each element of the power converter 60 are mounted on the + Z side surface of the low-voltage board 130.

  A connector 131 used for outputting electric power to the battery 3 and inputting electric power from the battery 3 is provided at an end portion of the low-voltage board 130 in the −X direction. The connector 131 is a common connector for the DC / DC converter 40 and the power converter 60.

  The secondary side rectifier circuit 24c of the charger 20 is provided on the + Y direction side of the connector 131 and near the end of the low voltage substrate 130 in the −X direction. The DC / DC converter 40 is provided on the + X direction side of the secondary side rectifier circuit 24c and near the end of the low voltage substrate 130 in the + Y direction. The capacitor 50 and the power conversion unit 60 are provided on the −Y direction side of the connector 131.

  The connector 131, the secondary side rectifier circuit 24c, the DC / DC converter 40, and the power converter 60 are electrically connected by a wiring pattern printed on the surface of the insulating layer of the low-voltage board 130.

  A wiring pattern 132 extends from the connector 131 in the + X direction. That is, the first end of the wiring pattern 132 is connected to the connector 131. From the second end of the wiring pattern 132, the wiring pattern 133, the wiring pattern 134, and the wiring pattern 135 are branched.

  The wiring pattern 133 is connected to the secondary side rectifier circuit 24c. That is, the first end of the wiring pattern 133 is connected to the second end of the wiring pattern 132, and the second end of the wiring pattern 133 is connected to the output side of the secondary side rectification circuit 24c. There is. The power line 140 (see FIG. 2) that electrically connects the input side of the secondary side rectifier circuit 24c and the transformer 24b extends from the secondary side rectifier circuit 24c in the + Z direction.

  The wiring pattern 134 is connected to the DC / DC converter 40. That is, the first end of the wiring pattern 134 is connected to the second end of the wiring pattern 132, and the second end of the wiring pattern 134 is connected to the input side of the DC / DC converter 40. There is. The connector 136 that outputs the power from the DC / DC converter 40 to the load 4 is provided at the end of the low-voltage board 130 in the + Y direction.

  The wiring pattern 135 is connected to the power conversion unit 60 via the capacitor 50. That is, the first end of the wiring pattern 135 is connected to the second end of the wiring pattern 132, and the second end of the wiring pattern 135 is connected to the input side of the power conversion unit 60. The power line that outputs the power from the power converter 60 to the motor 5 extends from the power converter 60 in the + Z direction.

  FIG. 3B shows an operation state in which the battery 3 is charged with the electric power from the external power source 2 and the load 4 is supplied with the electric power from the external power source 2. A current A1 [A] output from the secondary side rectifier circuit 24c of the charger 20 flows through the wiring pattern 133. A current A2 [A] input to the DC / DC conversion unit 40 flows through the wiring pattern 134. A current obtained by subtracting the current input to the DC / DC conversion unit 40 from the current output from the secondary side rectifier circuit 24c of the charger 20 flows through the wiring pattern 132. That is, a current of (A1-A2) [A] flows through the wiring pattern 132.

  FIG. 3C shows an operating state in which electric power from the battery 3 is supplied to the load 4 and the motor 5. A current A2 [A] input to the DC / DC conversion unit 40 flows through the wiring pattern 134. A current A3 [A] input to the power conversion unit 60 flows through the wiring pattern 135. A current that is the sum of the current input to the DC / DC conversion unit 40 and the current input to the power conversion unit 60 flows through the wiring pattern 132.

  That is, in the operating state in which the power from the battery 3 is supplied to the load 4 and the motor 5, a large current of (A2 + A3) [A] flows through the wiring pattern 132. Therefore, the amount of heat generated in the wiring pattern 132 is particularly large.

  In this embodiment, the wiring pattern 132, the wiring pattern 133, the wiring pattern 134, and the wiring pattern 135 are all provided on the low-voltage substrate 130 made of aluminum. Therefore, even if a large current flows through the wiring pattern 132 and the amount of heat generated in the wiring pattern 132 is large, the wiring pattern 132 can be appropriately cooled.

  Further, in the present embodiment, the secondary side rectifier circuit 24c, the DC / DC converter 40, the capacitor 50, and the power converter 60 are also provided on the low voltage substrate 130. Therefore, the secondary side rectifier circuit 24c, the DC / DC converter 40, the capacitor 50, and the power converter 60 can be appropriately cooled.

  In particular, since the secondary side rectifier circuit 24c, the DC / DC converter 40, the capacitor 50, and the power converter 60 are included in the second circuit portion 7 on the low voltage side, the amount of heat generated during operation is large. According to the present embodiment, even when the DC / DC converter 40 and the power converter 60 operate simultaneously, for example, the wiring pattern 132, the wiring pattern 134, the wiring pattern 135, the DC / DC converter 40, the capacitor 50, and the power. The heat generated in the conversion unit 60 can be appropriately radiated from the low voltage substrate 130.

  As described above, in the present embodiment, the wiring patterns 132, 134 and 135 for distributing the power supplied via the connector 131 to the DC / DC conversion unit 40 and the power conversion unit 60 are made of aluminum having high heat dissipation performance. Is formed on the low voltage substrate 130.

  Therefore, even when the DC / DC converter 40 and the power converter 60 operate simultaneously, the heat generated in the wiring pattern 132, the wiring pattern 134, and the wiring pattern 135 can be appropriately radiated from the low-voltage board 130. .

  In the above-described embodiment, the secondary side rectifier circuit 24c, the DC / DC converter 40, the capacitor 50, and the power converter 60 are mounted on the low-voltage board 130 as an example. Not limited. Hereinafter, modified examples of the power distribution structure will be described.

(Modification of distribution structure on low voltage substrate)
A modification of the power distribution structure will be described in detail with reference to FIG. 3D. FIG. 3D is a diagram showing a wiring structure of the low voltage substrate 130A according to the modification. In FIG. 3D, the X-axis, the Y-axis, and the Z-axis are drawn for convenience. The X axis, the Y axis, and the Z axis are the same as those in FIGS. 3A to 3C.

  The modification is different from the above-described embodiment in that the secondary side rectifier circuit 24c, the DC / DC converter 40, and the power converter 60 are not mounted on the low-voltage board 130A. The same parts as those in the above-described embodiment are designated by the same reference numerals, and their names and functions are also the same. Therefore, detailed description thereof will be omitted.

  The low voltage substrate 130A is, for example, an aluminum substrate. The low voltage substrate 130A is directly placed and fixed on the + Z side surface of the partition member 101 (see FIG. 2). The + Z side surface of the low voltage substrate 130A is coated with an insulating layer.

  The secondary side rectifier circuit 24c of the charger 20 is mounted on the first substrate 137, which is separate from the low voltage substrate 130A. The DC / DC converter 40 is mounted on the second substrate 138 which is a separate body from the low voltage substrate 130A. The power conversion unit 60 is mounted on the third substrate 139, which is separate from the low voltage substrate 130A.

  A connector 131 is provided at the −X direction end of the low-voltage board 130A. A wiring pattern 132A extends from the connector 131 in the + Y direction. That is, the first end of the wiring pattern 132A is connected to the connector 131. The wiring pattern 133A, the wiring pattern 134A, and the wiring pattern 135A are branched from the second end of the wiring pattern 132A.

  That is, the wiring pattern 132A, the wiring pattern 133A, the wiring pattern 134A, and the wiring pattern 135A are all provided on the low-voltage substrate 130A.

  The wiring pattern 133A is electrically connected to the secondary side rectifier circuit 24c mounted on the first substrate 137. The power line that electrically connects the low voltage substrate 130A and the first substrate 137 may be a flexible wiring or a rigid body such as a bus bar.

  The wiring pattern 134A is electrically connected to the DC / DC conversion unit 40 mounted on the second substrate 138. The power line that electrically connects the low voltage substrate 130A and the second substrate 138 may be a flexible wiring or a rigid body such as a bus bar.

  The wiring pattern 135A is electrically connected to the power conversion unit 60 mounted on the third substrate 139. The power line that electrically connects the low-voltage substrate 130A and the third substrate 139 may be a flexible wiring or a rigid body such as a bus bar.

  As described above, in the modified example, the wiring pattern 132A is formed on the aluminum low-voltage substrate 130A having high heat dissipation performance. Therefore, even if a large current flows through the wiring pattern 132A and the amount of heat generated in the wiring pattern 132A is large, the wiring pattern 132A can be appropriately cooled.

  In addition, although the secondary side rectifier circuit 24c, the DC / DC conversion unit 40, and the power conversion unit 60 are mounted on different substrates in the above-described modified example, the description is given as an example, but the present invention is not limited to this. . For example, the DC / DC converter 40 and the power converter 60 may be mounted on a common substrate, or the power converter 60 that generates a large amount of heat may be mounted on a low voltage substrate.

(Distribution structure on control board)
The wiring pattern (power distribution structure) in the control board 160 will be described with reference to FIG. 3E. FIG. 3E is a diagram showing the configuration of the control board 160. For convenience, the X axis, the Y axis, and the Z axis are drawn in FIG. 3E. The X axis, the Y axis, and the Z axis are the same as those in FIGS. 3A to 3D. Note that, in FIG. 3E, configurations that are not directly related to the description are omitted.

  As described above, the control board 160 is a resin board. Each element of the first control unit 70 and each element of the second control unit 80 are mounted on the + Z side surface of the control board 160. At the end of the control board 160 in the + Y direction, a connector 161 used for inputting power and control signals from the outside is provided. The connector 161 is a common connector for the first controller 70 and the second controller 80.

  The first control unit 70 is provided near the end of the control board 160 in the + Y direction. The second control unit 80 is provided near the end of the control board 160 in the −Y direction. The connector 161, the first control unit 70, and the second control unit 80 are electrically connected by a wiring pattern printed on the surface of the control board 160.

  A wiring pattern 162 extends from the connector 161 in the −Y direction. That is, the first end of the wiring pattern 162 is connected to the connector 161. A wiring pattern 163 and a wiring pattern 164 are branched from the second end of the wiring pattern 162.

  The wiring pattern 163 is connected to the first controller 70. That is, the first end of the wiring pattern 163 is connected to the second end of the wiring pattern 162, and the second end of the wiring pattern 163 is connected to the first controller 70.

  The wiring pattern 164 is connected to the second controller 80. That is, the first end of the wiring pattern 164 is connected to the second end of the wiring pattern 162, and the second end of the wiring pattern 164 is connected to the second controller 80.

  A current A4 [A] input to the first control unit 70 flows through the wiring pattern 163. A current A5 [A] input to the second controller 80 flows through the wiring pattern 164. That is, a current of (A4 + A5) [A] flows through the wiring pattern 162.

  In this embodiment, electric power from the outside is supplied to the first control unit 70 and the second control unit 80 via the wiring pattern 162 on the control board 160 and the wiring patterns 163 and 164 branched from the wiring pattern 162. I am trying to do it.

  Therefore, it is not necessary to arrange the wiring inside the housing, and the power supply device 1 can be downsized.

(Structure of transformer and its surroundings)
The configuration of the transformer 24b and its surroundings will be described with reference to FIGS. 4A, 4B, 4C, 4D, and 4E. For convenience, the X axis, the Y axis, and the Z axis are drawn in FIGS. 4A to 4E. The X axis, the Y axis, and the Z axis are the same as those in FIGS. 3A to 3E. 4A to 4E, configurations that are not directly related to the description are omitted.

  FIG. 4A is a perspective view showing the configuration of the transformer 24b and its periphery. As shown in FIG. 4A, a resin transformer case 200 integrally formed with the pedestal of the high-voltage board 120 (see FIG. 2) is provided on the −Z side surface of the partition member 101. Both the −Z direction end and the + Z direction end of the transformer case 200 are open. The + Z direction end of the transformer case 200 is fixed to the partition member 101 by adhesion. Thus, the box-shaped transformer case 200 having the partition member 101 as the bottom surface and having only the top surface (the surface in the −Z direction) opened is configured. The transformer 24b is stored in the transformer case 200.

  The transformer shield 210 is arranged so as to cover the -Z side surface of the transformer 24b. Hereinafter, the transformer shield 210 will be described in detail with reference to FIG. 4B. FIG. 4B is a perspective view showing the configuration of the transformer shield 210.

  The transformer shield 210 is a thin plate member (for example, an aluminum material) having good electrical conductivity and thermal conductivity. The transformer shield 210 includes a bottom wall portion 211 extending in the XY plane, a first side wall portion 212 extending in the + Z direction from an end of the bottom wall portion 211 in the + Y direction, and a bottom wall portion 211 in the −Y direction. And a second side wall portion 213 extending from the end portion in the + Z direction.

  Further, the transformer shield 210 has a third side wall portion 214 extending in the + Z direction from the −X direction end of the bottom wall portion 211. The opening 215 is provided so as to straddle the −X direction end of the bottom wall 211 and the −Z direction end of the third side wall 214.

  The first fixing portion 216 projects in the −X direction from the + Z-direction end of the third side wall 214 near the + Y-direction end. The transformer shield 210 is fixed to the transformer case 200 and the partition member 101 at the first fixing portion 216 (see FIG. 4A).

  A fourth sidewall 217 extending in the −X direction is provided at the −Y direction end of the third sidewall 214. The second fixing portion 218 projects in the −Y direction from the + Z direction end of the fourth side wall portion 217. The transformer shield 210 is fixed to the transformer case 200 and the partition member 101 at the second fixing portion 218 (see FIG. 4A).

  The third side wall part 214 has an intermediate part 219 extending in the + Z direction. The fifth side wall portion 220 projects in the −X direction from the + Y direction end of the intermediate portion 219. Further, the sixth side wall portion 221 projects in the −X direction from the −Y direction end of the intermediate portion 219.

  As shown in FIG. 2 and FIG. 4A, the partition member 101 is provided with a hole 105 penetrating in the Z direction for inserting the power line 140 (for example, a litz line) and the signal line 150, and the transformer shield 210. The intermediate portion 219, the fifth side wall portion 220, and the sixth side wall portion 221 are inserted into the hole 105.

  The transformer 24b, the transformer case 200, and the transformer shield 210 will be described in detail with reference to FIGS. 4C, 4D, and 4E. FIG. 4C is a diagram showing a state in which the intermediate portion 219, the fifth side wall portion 220, and the sixth side wall portion 221 of the transformer shield 210 penetrate through the hole 105 of the partition member 101. FIG. 4C is a diagram of the transformer 24b viewed from the −X direction side of the power line 140 toward the + X direction. 4D is a sectional view taken along line 4D-4D of FIG. 4C. 4E is a cross-sectional view taken along line 4E-4E of FIG. 4D.

  As shown in FIGS. 4A and 4C, in the power line 140, the first end is connected to the ends of the transformer 24b in the −X direction and the −Z direction, and the power line 140 is inserted through the opening 215. It extends in the X direction and further extends in the + Z direction.

  The power line 140 is surrounded by the middle portion 219, the fifth side wall portion 220, and the sixth side wall portion 221 of the transformer shield 210. The intermediate portion 219, the fifth side wall portion 220, and the sixth side wall portion 221 of the transformer shield 210 extend in the + Z direction along the power line 140.

  Although not shown in FIGS. 4A and 4C, the signal line 150 electrically connecting the first control unit 70 to the switching element 22b and the inverter 24a is provided on the + Y direction side of the fifth side wall 220 and The hole 105 is inserted through the −Y direction side of the sixth side wall portion 221. That is, in this embodiment, there are two signal lines 150, one of which is arranged on the + Y direction side of the fifth side wall 220 and the other of which is arranged on the −Y side of the sixth side wall 221 to form the hole 105. It is inserted.

  In this manner, the conductive trans shield 210 (specifically, the fifth sidewall portion 220 or the sixth sidewall portion 221) is interposed between the power line 140 and the signal line 150, so that the power line 140 is generated. It is possible to appropriately suppress the generated noise from interfering with the signal line 150. Therefore, it is possible to appropriately suppress noise interference with the signal line 150 by the power line 140 without providing a shield (coating) for preventing the outflow of noise on the power line 140 itself.

  As shown in FIGS. 4D and 4E, the transformer 24b is arranged inside the space 202 surrounded by the side wall 201 of the transformer case 200. Gaps are provided between the transformer 24b and the side wall 201 of the transformer case 200 and between the transformer 24b and the partition member 101, respectively. A heat-dissipating resin (for example, potting resin material) 240 is filled in the gap.

  As shown in FIG. 4E, the transformer 24b includes a pair of an upper core 231 having an E-shaped cross section and a lower core 232 having an E-shaped cross section, and each middle leg of the upper core 231 and the lower core 232. A coil 233 is wound around the. A bobbin (not shown) made of an insulating material is arranged around the coil 233.

  The space between the end surface of the lower core 232 in the + Z direction and the partition member 101 is filled with the heat dissipation resin 240 as described above. Thereby, the heat generated in the coil 233 can be transmitted to the partition member 101 via the lower core 232 and the heat dissipation resin 240. Therefore, the transformer 24b can be appropriately cooled.

  Furthermore, the −Z direction end surface of the upper core 231 is in contact with the bottom wall portion 211 of the transformer shield 210. The first side wall 212 extending from the + Y direction end of the bottom wall 211 of the transformer shield 210 in the + Z direction and the second side wall 213 extending from the −Y direction end of the bottom wall 211 in the + Z direction. Is embedded in the heat dissipation resin 240 filled in the gap between the side wall 201 of the transformer case 200 and the transformer 24b.

  Thereby, the heat generated in the coil 233 is transferred through the upper core 231, the transformer shield 210 (specifically, the bottom wall portion 211, the first side wall portion 212 and the second side wall portion 213) and the heat dissipation resin 240. It can be transmitted to the partition member 101. Therefore, the transformer 24b can be appropriately cooled.

  The transformer shield 210 (specifically, the first side wall portion 212 and the second side wall portion 213) is configured so as not to contact the lower surface (end surface in the + Z direction) of the lower core 232 and the transformer case 200 (side wall 201). To be done. As a result, as shown in FIG. 4E, it is easy to cover the transformer shield 210 on the upper core 231 from the −Z direction side of the upper core 231 in the + Z direction (from the upper side to the lower side).

  As described above, in the present embodiment, the power line 140 having the first end connected to the transformer 24b, the intermediate part 219 extending along the power line 140, the fifth sidewall part 220, and the sixth sidewall part 221. And a transformer shield 210 having a.

  Thereby, it is possible to prevent the noise on the power line 140 from interfering with other power lines without providing a shield for preventing the noise from flowing out on the power line 140. Therefore, the power line 140 can be prevented from increasing in size, and the power supply device 1 can be reduced in size.

  Particularly, by configuring the transformer shield 210 with a member having good electrical conductivity and good thermal conductivity, the noise shield of the power line 140 and the heat dissipation of the transformer 24b can be realized by the transformer shield 210 alone. . This makes it possible to reduce the number of fixing portions (fixing points) as compared with the case where the noise shielding member of the power line 140 and the heat radiating member of the transformer 24b are separately configured.

  In the present embodiment, the transformer 24b is stored in the first space 102 on the high voltage side, and the secondary side rectifier circuit 24c is stored in the second space 103 on the low voltage side. Then, the power line 140 connecting the transformer 24b and the secondary side rectifier circuit 24c and the transformer shield 210 are inserted into the hole 105 of the partition member 101. Therefore, the hole 105 can be made small, and the first space and the second space can be appropriately divided.

  In the present embodiment, the transformer 24b is formed integrally with the pedestal of the high-voltage board 120 and is housed in the transformer case 200 having an open end in the + Z direction, and is placed in the gap between the transformer 24b and the transformer case 200. The heat dissipation resin 240 is filled. That is, the heat dissipation resin 240 is in direct contact with the partition member 101. Therefore, the heat generated in the transformer 24b can be transferred to the partition member 101 via the heat dissipation resin 240, and the transformer 24b can be appropriately cooled.

  In the present embodiment, the transformer 24b has an upper core 231, a lower core 232, and a coil 233 surrounded by the upper core 231 and the lower core 232. The + Z side surface of the lower core 232 is in direct contact with the partition member 101. Therefore, the heat generated in the coil 233 can be transferred to the partition member 101 via the lower core 232.

  Further, the bottom wall portion 211 of the transformer shield 210 is in direct contact with the −Z side surface of the upper core 231, and the first side wall provided at the + Y direction end portion and the −Y direction end portion of the bottom wall portion 211. The portion 212 and the second side wall portion 213 are embedded in the heat dissipation resin 240. Therefore, the heat generated in the coil 233 can be transferred to the partition member 101 via the upper core 231, the transformer shield 210, and the heat dissipation resin 240. Therefore, according to this embodiment, the transformer 24b can be appropriately cooled.

  In the above embodiment, the power line 140 and the transformer shield 210 are inserted into the holes 105 of the partition member 101, but the present invention is not limited to this. Even when the transformer and the secondary side rectifier circuit are housed in the same space, by disposing the shield member so as to surround the power line connecting the transformer and the secondary side rectifier circuit, the transformer and the secondary side rectifier circuit are disposed. It is possible to appropriately prevent the noise of the power line connecting to the rectifier circuit from interfering with other power lines.

  Further, even when the transformer and the secondary side rectifier circuit are mounted on the same substrate and the transformer and the secondary side rectifier circuit are connected by a wiring pattern, a wiring pattern for connecting the transformer and the secondary side rectifier circuit. By disposing the shield member so as to surround the surface of the, it is possible to appropriately prevent the noise of the wiring pattern connecting the transformer and the secondary side rectifier circuit from interfering with other power lines.

  In addition, in the above-described embodiment, the power line that connects the transformer and the secondary side rectifier circuit has been described as an example, but the present invention is not limited to this and is applied to a power line that electrically connects elements in a power conversion device. Of course it is possible.

(Common structure for smoothing capacitors)
The function of the capacitor 50 will be described with reference to FIGS. 5A, 5B, and 5C. 5A, 5B and 5C are circuit block diagrams showing the configuration of the power supply device 1. In addition, in FIGS. 5A, 5B, and 5C, configurations that are not directly related to the description are omitted.

  As described above, in the charger 20, the elements other than the secondary side rectification circuit 24c are included in the first circuit portion 6 to which a high voltage is applied, and are arranged in the first space 102.

  On the other hand, the secondary side rectifier circuit 24c of the charger 20, the capacitor 50, and the power conversion unit 60 are all included in the second circuit portion 7 to which a low voltage is applied.

  As described above, the insulation grade of the first space 102 storing the first circuit portion 6 and the insulation grade of the second space 103 storing the second circuit portion 7 are different from each other. Specifically, the insulation grade of the first space 102 is higher than the insulation grade of the second space 103.

  The secondary side rectifier circuit 24c of the charger 20, the capacitor 50, and the power conversion unit 60 are all mounted on the low-voltage board 130 in the second space 103 and are arranged close to each other.

  The capacitor 50 is provided on the power line that electrically connects the secondary side rectifier circuit 24c of the charger 20 and the battery 3. The capacitor 50 is provided on the input side of the power conversion unit 60.

  In the power supply device 1, the operation of charging the battery 3 with the electric power from the external power supply 2 and the operation of driving the motor 5 using the electric power of the battery 3 are exclusive operations. In other words, the charger 20 and the power converter 60 do not operate at the same time.

  FIG. 5B shows an operation state in which the battery 3 is charged with electric power from the external power supply 2. When the battery 3 is charged with the power from the external power source 2, the power from the secondary side rectifier circuit 24c of the charger 20 is smoothed by the capacitor 50 and then output to the battery 3.

  FIG. 5C shows an operating state in which the motor 5 is driven by the electric power from the battery 3. When the motor 5 is driven by the electric power from the battery 3, the electric power from the battery 3 is smoothed by the capacitor 50 and then input to the power conversion unit 60.

  As described above, according to the present embodiment, when the battery 3 is charged with the electric power from the external power source 2, the capacitor 50 is used as the smoothing capacitor on the output side of the secondary side rectifier circuit 24c of the charger 20. You can Further, when the motor 5 is driven by the power from the battery 3, the capacitor 50 can be used as a smoothing capacitor on the input side of the power conversion unit 60.

  Therefore, the capacitor 50 can be commonly used as a smoothing capacitor on the output side of the secondary side rectifier circuit 24c of the charger 20 and a smoothing capacitor on the input side of the power conversion unit 60, and the space for disposing the smoothing capacitor can be reduced. be able to.

  Further, according to the present embodiment, the capacity of the capacitor 50 is such that the capacity required to smooth the power from the secondary side rectifier circuit 24c of the charger 20 and the power to the power converter 60 are smoothed. Less than the sum of the capacity needed to convert.

  Specifically, the capacity of the capacitor 50 is required to smooth the power from the secondary side rectifier circuit 24c of the charger 20 and the power to the power converter 60. It can be the larger of the required capacities. With this configuration, the capacity of the capacitor 50 can be set to the minimum necessary capacity.

  Further, since the capacitor 50 is provided in the second circuit portion 7 to which a low voltage is applied, it is possible to suitably suppress the withstand voltage strength from becoming excessive.

  Further, in the present embodiment, the secondary side rectifier circuit 24c of the charger 20, the capacitor 50, and the power conversion unit 60 are all arranged in the second space 103. Therefore, the wiring from the secondary side rectifier circuit 24c of the charger 20 to the capacitor 50 and the wiring from the capacitor 50 to the power conversion unit 60 can be shortened.

  By doing so, a capacitor having a relatively small capacity is used as the capacitor 50, and functions as a smoothing capacitor on the output side of the secondary side rectifier circuit 24c of the charger 20 and a smoothing capacitor on the input side of the power conversion unit 60. Can be satisfied.

  In particular, in this embodiment, the secondary side rectifier circuit 24c of the charger 20, the capacitor 50, and the power conversion unit 60 are all mounted on the low-voltage board 130. Thereby, the secondary side rectification circuit 24c of the charger 20, the capacitor 50, and the power conversion unit 60 can be arranged close to each other. Therefore, the wiring from the secondary side rectifier circuit 24c of the charger 20 to the capacitor 50 and the wiring from the capacitor 50 to the power conversion unit 60 can be made shorter.

  In the above-described embodiment, the capacitor 50 mounted on the low-voltage substrate 130 has been described as an example, but the present invention is not limited to this. The capacitor 50 may be mounted on a board separate from the low voltage board 130. Furthermore, the secondary side rectifier circuit 24c of the charger 20, the capacitor 50, and the power conversion unit 60 may also be mounted on a board separate from the low-voltage board 130.

(Configuration of coil of DC / DC converter and its periphery)
The configuration of the coil 42 of the DC / DC conversion unit 40 and its periphery will be described with reference to FIGS. 6A, 6B and 6C. FIG. 6A is a perspective view showing the configuration of the coil 42 and its surroundings. FIG. 6B is a diagram when the −Z direction is viewed from the + Z direction side of the coil 42. 6C is a sectional view taken along line 6C-6C of FIG. 6B. For convenience, the X axis, the Y axis, and the Z axis are drawn in FIGS. 6A to 6C. The X axis, the Y axis, and the Z axis are common to FIGS. 4A to 4E. 6A to 6C, configurations that are not directly related to the description are omitted.

  As shown in FIGS. 6A and 6B, the pedestal 300 of the control board 160 (see FIG. 2) is arranged on the + Z side surface of the low voltage board 130. The + Z side surface of the low voltage substrate 130 is coated with the resin insulating layer as described above.

  A case 310 that stores the coil 42 is provided integrally with the pedestal 300 so as to project from the pedestal 300 in the + Y direction. Both the pedestal 300 and the case 310 are made of resin.

  A control board 160 (FIG. 2) on which various semiconductor components forming the first control unit 70 (see FIG. 2) and various semiconductor components configuring the second control unit 80 (see FIG. 2) are mounted on the pedestal 300. Is installed).

  Here, the pedestal 300 and the low voltage substrate 130 are provided with positioning guide holes. Then, positioning pins (not shown) are inserted into both the guide holes of the pedestal 300 and the guide holes of the low-voltage board 130. Thereby, the pedestal 300 is positioned with respect to the low voltage substrate 130.

  In addition, the control board 160 and the partition member 101 are also provided with positioning guide holes. The partitioning member 101, the low-voltage board 130, the pedestal 300, and the control board 160 are positioned by inserting the positioning pins described above into these guide holes as well.

  Note that one positioning pin is not limited to the configuration in which all the guide holes of the partition member 101, the low-voltage board 130, the pedestal 300, and the control board 160 are inserted. For example, by inserting the first positioning pin into the guide hole of the pedestal 300 and the guide hole of the control board 160, the pedestal 300 is positioned with respect to the control board 160, and the second positioning pin is moved to the control board. The control board 160 may be positioned with respect to the low voltage board 130 by inserting the control board 160 into the guide hole of the low voltage board 130 and the guide hole of the low voltage board 130. That is, the pedestal 300 may be positioned with respect to the low voltage substrate 130 via the control substrate 160.

  Both the −Z direction end and the + Z direction end of the case 310 are open. The case 310 has side walls 311 (first side wall 311a, second side wall 311b, third side wall 311c, and fourth side wall 311d). The first side wall 311a, the second side wall 311b, the third side wall 311c, and the fourth side wall 311d form a space 312 surrounded by these side walls.

  As shown in FIG. 6C, the bottom surface 313, which is the −Z side surface of the side wall 311, is in contact with the low-voltage substrate 130. The bottom surface 313 is bonded to the low voltage substrate 130 with an adhesive. Ribs 314 (first ribs 314a, second ribs 314b, and third ribs 314c) protruding toward the space 312 are provided on the −Z direction end side of the first side wall 311a, the second side wall 311b, and the third side wall 311c. Are formed.

  The coil 42 is arranged inside the space 312 and positioned with respect to the case 310. More specifically, the coil 42 is guided by the first rib 314a, the second rib 314b, and the third rib 314c along its four sides, and is positioned with respect to the case 310.

  With the above configuration, the coil 42 is positioned with respect to the low-voltage board 130 via the case 310, the pedestal 300, and the control board 160.

  A space between the coil 42 and the side wall 311 of the case 310 is filled with heat dissipation resin 315. The coil 42 includes an upper core 42a, a lower core 42b, and a coil body 42c surrounded by the upper core 42a and the lower core 42b.

  The −Z side surface of the lower core 42b is in direct contact with the low voltage substrate 130. Therefore, the heat generated in the coil body 42c is transferred to the lower core 42b and further transferred to the low voltage substrate 130 that is in direct contact with the lower core 42b.

  Further, the heat generated in the coil body 42c is transferred to the upper core 42a and further transferred to the low voltage substrate 130 via the heat dissipation resin 315. Therefore, the coil 42 can be appropriately cooled.

  As shown in FIGS. 6A and 6B, the power line 320 and the power line 321 extend in the −Y direction from the −Y direction end of the coil 42. In other words, the first end of the power line 320 and the first end of the power line 321 are connected to the coil 42, respectively. The power line 320 and the power line 321 are embedded in the heat dissipation resin 315. Note that both the power line 320 and the power line 321 may not be embedded in the heat dissipation resin 315, but only one of the power line 320 and the power line 321 may be embedded in the heat dissipation resin 315.

  As described above, in the present embodiment, the pedestal 300 fixed to the low voltage substrate 130 and on which the control substrate 160 is mounted is integrally provided on the pedestal 300, surrounds the coil 42, and has a low voltage. The pedestal 300 is positioned with respect to the low voltage substrate 130, and the coil 42 is positioned with respect to the case 310.

  Therefore, the coil 42 can be positioned with respect to the low voltage substrate 130 without providing a mechanism for positioning the coil 42 and the low voltage substrate 130.

  In the present embodiment, the coil 42 is in direct contact with the low voltage substrate 130. Specifically, the −Z side surface of the lower core 42b of the coil 42 is in direct contact with the insulating layer coated on the + Z side surface of the low voltage substrate 130. Thereby, the heat generated in the coil 42 can be transferred to the low voltage substrate 130 while ensuring the insulation between the coil 42 and the low voltage substrate 130. Therefore, the coil 42 can be appropriately cooled.

  In the present embodiment, the gap between the coil 42 and the side wall 311 of the case 310 is filled with the heat dissipation resin 315. Therefore, the heat generated in the coil 42 can be transferred to the low voltage substrate 130 via the heat dissipation resin 315. Therefore, the coil 42 can be appropriately cooled.

  In this embodiment, the pedestal 300 is positioned with respect to the low voltage substrate 130. Particularly, when the pedestal 300 is provided with the positioning pins, the pedestal 300 enables the control board 160 and the low-voltage board 130 to be positioned. Therefore, the positional deviation error between the control board 160 and the low voltage board 130 can be reduced.

  In the present embodiment, the side wall 311 of the case 310 is provided with a rib 314 that projects toward the coil 42 and positions the coil 42 by contacting the coil 42. Therefore, the coil 42 can be appropriately positioned with respect to the case 310 with a simple configuration in which the rib 314 is provided on the side wall 311.

  In the present embodiment, at least one of the power line 320 and the power line 321 having the first end connected to the coil 42 is embedded in the heat dissipation resin 315. Therefore, it is possible to enhance the heat dissipation performance of the heat generated in at least one of the power line 320 and the power line 321, and fix at least one of the power line 320 and the power line 321.

(Configuration of current sensor and its surroundings)
The configuration of the current sensor 90 and its surroundings will be described with reference to FIGS. 7A, 7B, 7C and 7D. For convenience, the X-axis, the Y-axis, and the Z-axis are drawn in FIGS. 7A to 7D. The X axis, Y axis, and Z axis are the same as those described above. 7A to 7D, configurations that are not directly related to the description are omitted.

  FIG. 7A is a perspective view showing the configuration of the current sensor 90 and its surroundings. FIG. 7B is a plan view showing the configuration of the current sensor 90 and its surroundings. As shown in FIG. 7A, the second cover member 101b is fixed to the + Z side surface of the partition member 101. The second cover member 101b has a plurality of fixing portions 402 used for fixing to the motor 5 (see FIG. 2).

  As described above, the low voltage second circuit portion 7 (see FIG. 2) is stored in the second space 103 (see FIG. 2) surrounded by the partition member 101 and the second cover member 101b. .

  The second cover member 101b has a wall portion 400 extending in the XY plane. The wall portion 400 is provided with an opening portion 401 that connects the second space 103 and the external space. The wall portion 410 projects from the wall portion 400 in the + Z direction. That is, the wall portion 410 projects from the wall portion 400 toward the external space.

  The wall portion 410 includes a first wall portion 411 extending in the X direction, a second wall portion 412 extending in the + Y direction from the + X direction end of the first wall portion 411, and a −X direction of the first wall portion 411. Third wall portion 413 extending in the + Y direction from the end portion of the third wall portion 413, and the fourth wall portion 414 that connects the + Y direction end portion of the second wall portion 412 and the + Y direction end portion of the third wall portion 413. including.

  The wall portion 420 extending in the XY plane is provided in the third space 415 surrounded by the wall portion 410 (the first wall portion 411, the second wall portion 412, the third wall portion 413, and the fourth wall portion 414). ing. The wall portion 420 is formed integrally with the wall portion 400 and the wall portion 410. The wall portion 420 may be a member separate from the wall portions 400 and 410 and may be fixed to the second cover member 101b.

  The current sensor 90 is fixed to the + Z side surface of the wall portion 420. As described above, the current sensor 90 is a sensor that detects the current value of the power output from the power conversion circuit 60 and supplied to the motor 5.

  The current sensor 90 will be described in detail with reference to FIG. 7C as well. 7C is a sectional view taken along line 7C-7C of FIG. 7B. The current sensor 90 has a main body 91, a fixed portion 92, and a first hole 93, a second hole 94, and a third hole 95 that penetrate the main body 91 in the Z direction. The first hole 93, the second hole 94 and the third hole 95 are provided side by side in the X direction.

  As described above, the power conversion circuit 60 for supplying power to the motor 5 is mounted on the low voltage substrate 130. The three-phase alternating current output from the power conversion circuit 60 is output from the bus bar 430a, the bus bar 430b, and the bus bar 430c protruding from the + Z side surface of the low voltage substrate 130 in the + Z direction.

  As shown in FIG. 7C, the motor 5 is placed so as to be in close contact with the + Z side surface of the wall portion 410, and is fixed to the second cover member 101b. An O-ring is arranged on the + Z side surface of the wall portion 410 to seal the third space 415 surrounded by the wall portion 410.

  A bus bar 5 a, a bus bar 5 b, and a bus bar 5 c project from the motor 5. The bus bar 5a is inserted into the first hole 93. The bus bar 5b is inserted into the second hole 94. The bus bar 5c is inserted into the third hole 95. Bus bar 5a is fixed to bus bar 430a. Bus bar 5b is fixed to bus bar 430b. The bus bar 5c is fixed to the bus bar 430c.

  Since the current sensor 90 is fixed to the + Z side surface of the wall portion 420, the distance between the current sensor 90 and the low voltage substrate 130 can be secured. Accordingly, it is possible to preferably prevent the noise generated in the circuit mounted on the low voltage substrate 130 from affecting the current sensor 90. Therefore, the accuracy of the current sensor 90 can be improved.

  The wiring arrangement will be described with reference to FIG. 7D. 7D is a sectional view taken along line 7D-7D in FIG. 7B. As shown in FIG. 7D, a signal line 5d that electrically connects the power supply device 1 and the motor 5 is provided. The first end of the signal line 5d is connected to the motor 5, and the second end of the signal line 5d is connected to the power supply device 1.

  A state in which the first end of the signal line 5d is connected to the motor 5 and the second end of the signal line 5d is connected to the power supply 1 in fixing and integrating the power supply device 1 and the motor 5. Then, the power supply device 1 and the motor 5 are fixed. Therefore, a relatively long wiring is used as the signal line 5d.

  In the present embodiment, as shown in FIG. 7D, the signal line 5d for controlling the motor 5 is placed on the + Z side surface of the wall portion 420 while the motor 5 is fixed to the power supply device 1. Therefore, the signal line 5d is prevented from entering the second space 103 and coming into contact with other electric components arranged in the second space 103.

  As described above, in the present embodiment, the second cover member 101b includes the wall portion 400 provided with the opening 401 that communicates the second space 103 with the external space, and the wall portion 400 toward the external space. And a wall portion 410 projecting and surrounding the opening portion 401. Then, the current sensor 90 that detects the current value of the power output from the power conversion circuit 60 is arranged in the third space 415 surrounded by the wall portion 410.

  Thereby, the distance between the current sensor 90 and the low voltage substrate 130 can be secured. Therefore, it is possible to preferably prevent the noise generated in the circuit mounted on the low-voltage board 130 from affecting the current sensor 90. Therefore, the accuracy of the current sensor 90 can be improved.

  In the present embodiment, the wall portion 420 that projects from the wall portion 410 toward the third space 415 and extends in the XY plane is provided, and the current sensor 90 is fixed to the wall portion 420. Therefore, it is possible to prevent the current sensor 90 from moving.

  In the present embodiment, the current sensor 90 is arranged on the + Z side surface of the wall portion 420, that is, on the external space side. Therefore, the current sensor 90 can be fixed to the wall portion 420 from the external space side.

  In the present embodiment, the wall portion 420 is a part of the second cover member 101b, and is integrally formed with at least one of the wall portion 400 and the wall portion 410. Therefore, the wall portion 420 can be prevented from falling off.

  In the present embodiment, the signal line 5d is placed on the wall portion 420. Therefore, it is possible to prevent the signal line 5d from entering the second space 103 and coming into contact with other electric components arranged in the second space 103.

  Although the embodiment of the present disclosure has been described above, the present disclosure is not limited to the above-described embodiment, and may be appropriately modified and implemented without departing from the spirit of the present disclosure. Further, the above-described embodiments and modified examples can be appropriately combined and used.

  According to the voltage conversion device according to the present disclosure, downsizing can be achieved, and the voltage conversion device is suitably used for an electric vehicle (EV).

1 Power Supply Device 2 External Power Supply 3 Battery 4 Load 5 Motor 5a Bus Bar 5b Bus Bar 5c Bus Bar 5d Signal Line 6 1st Circuit Part 7 2nd Circuit Part 8 Primary Side Circuit 10 AC Filter Part 20 Charger 21 Rectifier 22 Power Factor Improvement Part 22a Coil 22b Switching element 22c Diode 23 Capacitor 24 DC / DC converter 24a Inverter 24b Transformer 24c Secondary side rectifier circuit 24d Switching element 24e Power transmission coil 24f Power receiving coil 24g Switching element 30 Capacitor 40 DC / DC converter 41 Switching element 42 Coil 42a Upper core 42b Lower core 42c Coil body 43 Capacitor 50 Capacitor 60 Power conversion unit 70 First control unit 80 Second control unit 90 Current sensor 91 Main body unit 92 Fixed unit 3 1st hole 94 2nd hole 95 3rd hole 100 Housing 101 Partition member 101a 1st cover member 101b 2nd cover member 102 1st space 103 2nd space 104 Radiating fin 105 hole 110 AC filter board 120 High voltage board 130 , 130A Low-voltage board 131 Connector 132, 132A Wiring pattern 133, 133A Wiring pattern 134, 134A Wiring pattern 135, 135A Wiring pattern 136 Connector 137 1st board 138 2nd board 139 3rd board 140 Power line 150 Signal line 160 Control board 161 Connector 162 Wiring pattern 163 Wiring pattern 164 Wiring pattern 200 Transformer case 201 Side wall 202 Space 210 Transformer shield 211 Bottom wall part 212 First side wall part 213 Second side wall part 214th 3 side wall part 215 opening part 216 1st fixing part 217 4th side wall part 218 2nd fixing part 219 middle part 220 5th side wall part 221 6th side wall part 231 upper core 232 lower core 233 coil 240 heat dissipation resin 300 pedestal 310 case 311 Side wall 311a First side wall 311b Second side wall 311c Third side wall 311d Fourth side wall 312 Space 313 Bottom surface 314 Rib 314a First rib 314b Second rib 314c Third rib 315 Heat dissipation resin 320 Power line 321 Power line 400 Wall section 401 Opening 402 fixed part 410 wall part 411 first wall part 412 second wall part 413 third wall part 414 fourth wall part 415 third space 420 wall part 430a bus bar 430b bus bar 430c bus bar

Claims (6)

Reactor,
A power line connected to the reactor,
A contact portion that is in contact with the reactor; and a shield member that extends along the power line and that has a shield portion that shields radio waves emitted from the power line.
Power converter. Further comprising a housing partitioned into a first space and a second space by a partition member,
The reactor is stored in the first space,
The power line and the shield member are provided in the partition member, and are inserted into holes that connect the first space and the second space,
The power conversion device according to claim 1. A signal line is inserted through the hole,
The shield member is interposed between the power line and the signal line,
The power conversion device according to claim 2. The reactor is stored in the case,
The space between the reactor and the case is filled with heat dissipation resin,
The shield member is in contact with the heat dissipation resin,
The power conversion device according to claim 1. The reactor includes an upper first core and a lower second core,
The shield member is in contact with the upper first core and is in contact with the heat dissipation resin,
The power conversion device according to claim 4. The shield member does not contact the lower surface of the lower second core and the case,
The power conversion device according to claim 5.

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