JP2020047939A - Electronic apparatus and method for manufacturing the same - Google Patents

Abstract

To provide an electronic apparatus that includes an electromagnetic shield, the manufacturing cost of the electronic apparatus is reduced, the thickness of the same can be reduced, and the electronic apparatus having a high degree of freedom of wiring circuit design, and a method for manufacturing the same.SOLUTION: An electronic apparatus (1A) of one form of the present invention comprises: high-frequency functional components (21) that are electronically shielded by a conductive member (10) and fixed by an internal insulating layer (30); electronic components (22) that are not electronically shielded; and a resin compact (23) in which some of these components are embedded and fixed. An embedded conductive layer (11) and an exposed conductive layer (12) in the conductive member (10) are electrically connected to each other through a short-circuited conductive member (13). The electronic components (22) are not in contact with the internal insulating layer (30).SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic device having an electromagnetic shield for shielding electromagnetic waves from an electronic component operating in a high frequency band such as a microwave band or a millimeter wave band used in a wireless device or the like, and a method for manufacturing the same.

  2. Description of the Related Art In recent years, problems due to electromagnetic noise have been increasing in conjunction with miniaturization and high-speed operation of electronic devices on which electronic components are mounted, or with increased use (eg, wireless LAN and in-vehicle radar). For example, in microcomputers for vehicles, the number of software codes exceeds 200,000 lines, and the operating frequency reaches 100 MHz, and the problem of malfunction of electronic circuits due to electromagnetic noise generated from each electronic component becomes remarkable. ing.

  In addition, high-frequency functional components (for example, amplifiers, phase shifters, and attenuators) mounted on electronic devices have a problem in that electromagnetic characteristics radiated from other high-frequency radiation sources cause electromagnetic coupling and characteristic fluctuations occur. . Further, there is a problem that the electromagnetic resistance itself of the semiconductor chip is reduced due to miniaturization, fine wiring, low power, and the like.

  For these reasons, in order to protect the electronic components from external electromagnetic noise and to suppress the leakage of the electromagnetic noise from the electronic components to the outside, it is even more effective to shield the electronic components from electromagnetic waves. It is becoming important.

  As a general structure of an electromagnetic shield for shielding such an electromagnetic wave, for example, there is a structure proposed in Patent Document 1 or Patent Document 2. As shown in FIG. 6A, an electronic device 100 as proposed in Patent Document 1 includes a case 110 in which a conductive layer is formed on the surface of a conductive metal case or a resin case, and a case 110 that is printed. The electronic component 140 fixed to the printed circuit board 120 by soldering 130 is covered by the conductive circuit 121 provided on the substrate 120. In addition, as shown in FIG. 6B, an electronic device 200 as proposed in Patent Document 2 covers an electronic component 230 with a metal case 210 and a metal substrate 220.

JP 2008-244289 A (released October 09, 2008) JP 2010-258370A (published November 11, 2010) Japanese Patent Application Laid-Open No. 2006-100302 (published on April 13, 2006)

  However, in the related art described above, the electronic component 140 is mounted on the printed circuit board 120 on which the electronic component 140 is mounted by soldering 130 or the like, or the metal case 210 is mounted on the metal substrate 220. It is necessary to assemble the electronic device, and the assembling structure causes a problem that the size of the electronic device is increased and a problem that the manufacturing cost is increased due to the assembling.

  In particular, since the case 110, the metal case 210, and the metal substrate 220 need to have a certain size or more suitable for assembling, it is an obstacle to reduce the height dimension and reduce the thickness of the electronic device. I was

  As a countermeasure against such a problem, as shown in FIG. 6C, an electronic device 300 as described in Patent Document 3 bends a part of a flexible printed board 320 on which an electronic component 310 is mounted, and The component 310 is configured to be covered with a conductive circuit 321. Such an electronic device 300 does not require the metal case and the like in the above-described conventional technology, and thus has an effect that the electronic device can be reduced in size and thickness.

  However, the process of appropriately bending the flexible printed circuit board 320 in a minute area is industrially complicated, and has a problem that the manufacturing cost increases. Further, it is necessary to secure a space on the flexible printed circuit board 320 to cover the electronic component 310 by bending, and the electronic component 310 cannot be arranged in this space. Therefore, the electronic device 300 has a problem that the design of the wiring circuit of the electronic component 310 is limited.

  The present invention has been made in view of the above-described conventional problems, and has as its object to provide an electronic device having an electromagnetic shield in which the manufacturing cost can be reduced, the electronic device can be reduced in thickness, and the degree of freedom in designing a wiring circuit is high. An object of the present invention is to provide an apparatus and a method of manufacturing the same.

  In order to solve the above problems, an electronic device according to the present invention has the following features. That is, the electronic device of the present invention electromagnetically shields at least one electronic component, a conductive member that electromagnetically shields at least one of the electronic components, at least a part of at least one of the electronic components, and the electronic component. A resin molded body in which at least a part of the conductive member is embedded and fixed. The at least one electronic component includes a first electronic component that is the electromagnetically shielded electronic component, and a second electronic component that is not electromagnetically shielded, wherein the second electronic component is At least a part is embedded in the resin molding. The first electronic component is fixed by an insulating member provided in a space formed by being surrounded by the conductive member, and at least a part of the insulating member includes the first electronic component. And at least a part of the conductive member are embedded in the resin molded body. The conductive member includes a first conductive member embedded in the resin molded body, a second conductive member not embedded in the resin molded body, the first conductive member, and the second conductive member. And at least one third conductive member provided between the members, wherein the first conductive member and the second conductive member are electrically connected to each other through the third conductive member. ing. The second electronic component is not in contact with the insulating member embedded in the resin molded body.

  According to the above configuration, at least one electronic component is electromagnetically shielded by the conductive member, and at least a part of the electronic component and at least a part of the conductive member are embedded and fixed in the resin molded body. . That is, the height of the portion protruding above the resin molded body can be suppressed. Therefore, the size of the electronic device in the height direction can be reduced and the electronic device can be reduced in thickness.

  In addition, such a structure can be manufactured by, for example, providing a conductive member on one side of an electronic component and performing electromagnetic shielding, then performing injection molding of a resin, and further providing a conductive member on the other side of the electronic component. it can. Then, after injection molding of the resin, a wiring circuit can be formed before the conductive member is further provided on the other side of the electronic component. Therefore, the manufacturing process can be simplified, and the degree of freedom in designing the wiring circuit can be increased.

  A second electronic component that is not electromagnetically shielded is provided, and at least a part of the second electronic component is embedded in the resin molded body. Therefore, also in an electronic device including the second electronic component, the size in the height direction can be reduced and the electronic device can be reduced in thickness. Further, the first electronic component and the second electronic component can be electrically connected to each other by a wiring circuit, and an electronic device having various types and numbers of electronic components can be provided.

  Furthermore, the first electronic component and the conductive member are insulated by the insulating member, and the insulating member is at least partially embedded in the resin molded body. The dimension in the height direction can be reduced, and the thickness can be reduced.

  Further, the first electronic component is surrounded by the first conductive member, the second conductive member, and the third conductive member, whereby the first electronic component is provided with the third conductive member. Higher electromagnetic shielding than when not provided.

  Further, the second electronic component is not in contact with the insulating member embedded in the resin molded body. Such a structure is unique to the electronic device according to the present invention. This manufacturing process can be simple and has a high degree of freedom in wiring circuit design as described above.

  Therefore, in an electronic device provided with an electromagnetic shield, it is possible to provide an electronic device in which the manufacturing cost is suppressed, the thickness is reduced, and the degree of freedom in designing a wiring circuit is high, and a method of manufacturing the same.

  In the electronic device according to the aspect of the invention, it is preferable that the first conductive member and the second conductive member are thin films having a thickness of 1 μm to 10 μm.

  According to the above configuration, the first conductive member and the second conductive member can be formed by a method of forming a thin film such as an inkjet printing method. Further, the material to be used can be reduced to a necessary minimum, and the material cost can be reduced as compared with the case where a metal case or the like is used. Therefore, manufacturing costs can be reduced.

  In the electronic device according to the aspect of the invention, it is preferable that the third conductive member is a metal material having a thickness of 0.1 mm or more.

  According to the above configuration, the third conductive member can have a certain degree of rigidity. For this reason, it is possible to prevent the third conductive member from being deformed, such as being wrinkled, during industrial transport, thereby causing a problem as a product.

  In the electronic device according to the aspect of the invention, the electrode of the first electronic component and the electrode of the second electronic component may be disposed on a surface of the resin molded body and a surface of an insulating member embedded in the resin molded body. The wiring is connected so as not to contact the third conductive member, and the space between the connected wiring and the second conductive member is an insulating member or air which is not embedded in the resin molded body. Is preferably insulated.

  According to the configuration, it is possible to provide an electronic device in which the electrodes of the first electronic component and the electrodes of the second electronic component are connected by wiring.

  In the electronic device according to the aspect of the invention, it is preferable that the electrode of the first electronic component and the electrode of the second electronic component are located on the same or substantially the same plane as the surface of the resin molded body.

  According to the above configuration, wiring connection between the electrode of the first electronic component and the electrode of the second electronic component can be easily performed using an apparatus such as an ink jet printer.

  In the electronic device according to the aspect of the invention, it is preferable that the second conductive member has an opening formed directly above at least one of the first electronic components.

  According to the above configuration, it is possible to provide an electronic device using, as the first electronic component, a type of electronic component that needs to come into contact with the outside air.

  In the electronic device according to the aspect of the invention, it is preferable that the wiring connection is formed by printing and printing a conductive material.

  According to the above configuration, wiring can be easily performed using a minimum necessary material. In the case where a protective film covering the wiring is formed, the thickness of the protective film can be reduced. Therefore, it is possible to reduce member costs and reduce manufacturing costs.

  The present invention provides an electronic device having an electromagnetic shield, in which the manufacturing cost is reduced, the electronic device can be made thinner, and a method of manufacturing the electronic device having a high degree of freedom in wiring circuit design can be provided.

2A is a plan view illustrating a schematic configuration of the electronic device according to the first embodiment of the present invention, and FIG. 2B is a cross-sectional view taken along line AA of FIG. (A), (b), (c), (e), (f), and (g) are a plan view illustrating an example of a method of manufacturing the electronic device and a cross-sectional view taken along line BB of the plan view. 7) is a side sectional view for explaining an example of the method for manufacturing the electronic device. (A) is a top view which shows schematic structure of the electronic device in Embodiment 2 of this invention, (b) is CC sectional view taken on the line CC of (a). (A) is a top view which shows the schematic structure of the electronic device in Embodiment 3 of this invention, (b) is sectional drawing which follows the DD line of (a), (c) is a bottom view. It is. (A), (b), and (d) are side sectional views explaining an example of the method for manufacturing the electronic device, and (c) and (f) are a plan view and a plan view explaining the example of the method for manufacturing the electronic device. FIG. 2 is a cross-sectional view taken along line EE of FIG. 1, and FIG. 2E is a bottom view illustrating an example of a method for manufacturing the electronic device and a cross-sectional view taken along line EE of the bottom view. It is a side sectional view showing a schematic structure of an electronic device provided with a conventional electromagnetic shield.

[Embodiment 1]
One embodiment of the present invention will be described below with reference to FIGS.

  In this embodiment, an electronic device in which a high-frequency functional component such as an amplifier, a phase shifter, or an attenuator is covered with a thin-film conductive layer and electromagnetically shielded will be described as an example of the electronic device of the present invention. In this specification, electromagnetically shielded means that electromagnetic waves such as a microwave band or a millimeter wave band emitted by a high-frequency radiation source are electromagnetically shielded, and an electromagnetic shield means that electromagnetic waves are electromagnetically shielded. It means a member to be shielded.

  In the present embodiment, an electronic device in which a high-frequency functional component such as an amplifier, a phase shifter, or an attenuator is electromagnetically shielded by a thin film conductive layer will be described as an example of the electronic device. In an apparatus, it is not necessarily limited to this. For example, the present invention can be applied to an electronic device in which various types of electronic components such as a microphone, various sensors such as a temperature / humidity sensor, an optical element, and a power supply IC are electromagnetically shielded, and a manufacturing method thereof. Further, the member to be electromagnetically shielded may be a metal case instead of the thin film conductive layer. Further, a part of the electromagnetically shielding member may be optionally opened, for example, an opening may be provided.

<Structure of Electronic Device in One Embodiment of the Present Invention>
A configuration of an electronic device 1A according to one embodiment of the present invention will be described with reference to FIGS. FIG. 1A is a plan view illustrating a schematic configuration of an electronic device 1A according to the first embodiment. FIG. 1B is a cross-sectional view taken along line AA of the plan view shown in FIG.

  As shown in FIGS. 1A and 1B, an electronic device 1A according to the present embodiment is a high-frequency functional component 21 (first electronic component) covered with a conductive member 10 as an electromagnetic shield and electromagnetically shielded. And an electronic component 22 (second electronic component) not covered by the conductive member 10, and a resin molded body 23 formed so as to embed and fix the high-frequency functional component 21 and the electronic component 22. I have. The conductive member 10 covers the high-frequency functional component 21 via the internal insulating layers 30 and 31 (insulating members), and the high-frequency functional component 21 and the electronic component 22 are interconnected on the surface of the resin molded body 23. They are electrically connected by a circuit 24. The electronic component 22 and the wiring circuit 24 are covered with an exposed insulating layer 32 formed on the resin molded body 23.

(Conductive member)
The conductive member 10 includes a buried conductive layer 11 (first conductive member) buried in the resin molded body 23 together with the high-frequency functional component 21 and an exposed conductive layer 12 (second conductive member) not buried in the resin molded body 23. ), And a short-circuit conductive member 13 (third conductive member) that is buried in the resin molded body 23 and electrically short-circuits the buried conductive layer 11 and the exposed conductive layer 12 to each other.

  The buried conductive layer 11 and the exposed conductive layer 12 are Ag thin films having a thickness of about 1 to 10 μm. The buried conductive layer 11 and the exposed conductive layer 12 only need to have conductivity, and can have desired electromagnetic shielding characteristics by appropriately selecting a film thickness and a material. The thickness of the exposed conductive layer 12 is preferably smaller as the thickness of the portion protruding from the resin molded body 23 can be suppressed and the electronic device 1A can be made thinner. In addition, by setting the thickness of the buried conductive layer 11 and the exposed conductive layer 12 to 1 to 10 μm, the material used for forming these can be minimized, and compared with the case where a metal case or the like is used. Thus, material costs can be reduced. Therefore, manufacturing costs can be reduced.

  The short-circuit conductive member 13 is a thin plate having a thickness of 0.1 mm made of copper (Cu) or stainless steel. The short-circuit conductive member 13 may also be conductive as long as it has conductivity, and its film thickness and material are not particularly limited, but having a certain thickness causes deformation (wrinkles) during the later-described manufacturing. This is preferable because it is possible to suppress the above.

  As shown in FIG. 1A, three short-circuit conductive members 13 are provided so as to surround the high-frequency functional component 21 when the surface of the resin molded body 23 is viewed in plan. The shape and number of the short-circuit conductive members 13 are not particularly limited as long as there is a gap between the high-frequency functional component 21 and the electronic component 22 where a wiring circuit 24 can be formed. The more the short-circuit conductive member 13 surrounds the high-frequency functional component 21 without any gap, the better the electromagnetic shielding characteristics of the conductive member 10 become. This is because the area that is not covered by the conductive member 10 in the space around the high-frequency functional component 21 decreases.

  Note that the short-circuit conductive member 13 is not an essential component for the electronic device 1A because it short-circuits the buried conductive layer 11 and the exposed conductive layer 12 to further improve the electromagnetic shielding characteristics of the conductive member 10.

(High frequency functional parts)
The high-frequency functional component 21 is an electronic component such as an amplifier, a phase shifter, or an attenuator, and two electronic components are provided in the electronic device 1A of the present embodiment. The number of high-frequency functional components 21 electromagnetically shielded by the conductive member 10 is not particularly limited.

  The high-frequency functional component 21 has a connection electrode (not shown) on a surface thereof, and a wiring circuit 24 is connected to the connection electrode. The high-frequency functional component 21 is embedded in the resin molded body 23 so that the connection electrodes are on the same or substantially the same plane as the surface of the resin molded body 23. However, the present invention is not limited to this, and at least a part of the high-frequency functional component 21 may be embedded in the resin molded body 23.

(Electronic components)
The electronic component 22 is an electronic component such as a capacitor, a resistor, and an IC, and three electronic components are provided in the electronic device 1A of the present embodiment. The number of the electronic components 22 is not particularly limited.

  The electronic component 22 has a connection electrode (not shown) provided on the surface thereof, and a wiring circuit 24 is connected to the connection electrode. The electronic component 22 is embedded in the resin molded body 23 so that the connection electrodes are on the same or substantially the same plane as the surface of the resin molded body 23. However, the present invention is not limited to this, and the electronic component 22 may be at least partially embedded in the resin molded body 23.

(Resin molding)
The resin molded body 23 is a rectangular parallelepiped housing made of a resin such as polycarbonate (PC) or acrylonitrile butadiene styrene (ABS). The material of the resin molded body 23 may be another type of resin. Further, the shape of the resin molded body 23 is not particularly limited.

(Internal insulation layer)
The internal insulating layer 30 is provided between the high-frequency functional component 21 and the buried conductive layer 11, and is buried in the resin molded body 23 together with the high-frequency functional component 21 and the buried conductive layer 11. The internal insulating layer 30 is an epoxy resin having a thickness of about 5 to 10 μm. However, the internal insulating layer 30 only needs to have an insulating property, and the thickness and the material can be appropriately selected. For example, the inner insulating layer 30 may be made of glass or ceramic.

  The surface of the internal insulating layer 30 is flush with the surface of the resin molded body 23 in the space surrounded by the conductive member 10, and the wiring circuit 24 is formed on this surface. ing. Therefore, from the viewpoint of having a certain level of strength and flatness and suppressing manufacturing costs, the internal insulating layer 30 is preferably made of an insulating resin.

  The other internal insulating layer 31 is provided between the high-frequency functional component 21 and the exposed conductive layer 12, and is not embedded in the resin molded body 23. The internal insulating layer 31 is an epoxy resin having a thickness of about 5 to 10 μm. Similarly to the internal insulating layer 30, the internal insulating layer 31 only needs to have insulating properties, and the thickness and material thereof can be appropriately selected. For example, the internal insulating layer 31 may be made of glass or ceramics, but is preferably made of an insulating resin.

(Wiring circuit)
The wiring circuit 24 is electrically connected to the high-frequency functional component 21 and the electronic component 22 on the surface of the internal insulating layer 30 and the surface of the resin molded body 23 and electrically connected to the outside of the electronic device 1A. This is a conductive circuit formed on the substrate.

  Here, in the electronic device 1 </ b> A of the present embodiment, the high-frequency functional component 21 and the electronic component 22 have connection electrodes on the same or substantially the same plane as the surfaces of the internal insulating layer 30 and the resin molded body 23. It is embedded in the resin molded body 23. Therefore, the wiring circuit 24 can be formed by spraying silver (Ag) ink using an ink jet printer, and the wiring circuit 24 can be easily formed. The wiring circuit 24 may be made of a material other than Ag or may be formed by another method, and the thickness of the wiring and the like are not particularly limited.

  Note that “being on the same or substantially the same plane” means that the step between the connection electrode of the high-frequency functional component 21 or the electronic component 22 and the plane formed by the surface of the internal insulating layer 30 and the resin molded body 23 is an ink jet. It means that the wiring circuit 24 is small (flat) to the extent that the wiring circuit 24 can be formed by printing using a device such as a printer.

  The wiring circuit 24 is formed so as not to contact the short-circuit conductive member 13. The wiring circuit 24 and the exposed conductive layer 12 are insulated by the internal insulating layer 31.

(Exposed insulating layer)
The exposed insulating layer 32 is an epoxy resin having a thickness of about 5 to 10 μm formed so as to cover the electronic component 22 and the wiring circuit 24, and has a role as a protective film (resist) for protecting these. The exposed insulating layer 32 only needs to have an insulating property, and the thickness and the material can be appropriately selected.

<Method for Manufacturing Electronic Device According to One Embodiment of the Present Invention>
The method of manufacturing the electronic device 1A according to the present embodiment will be described below with reference to (a), (b), (c), (d), (e), (f), and (g) of FIG. 2 (a), (b), (c), (e), (f), and (g) illustrate an example of a method of manufacturing the electronic device 1A according to the present embodiment, and are plan views of the electronic device 1A, respectively. And a sectional view taken along line BB of the plan view. FIG. 2D is a side cross-sectional view illustrating an example of a method for manufacturing electronic device 1 </ b> A of the present embodiment.

(Paste temporary fixing process)
As shown in FIG. 2A, in the method of manufacturing the electronic device 1A according to the present embodiment, first, the high-frequency functional component 21, the electronic component 22, and the short-circuit conductive member 13 (conductive thin plate) are temporarily fixed to the film 40. (Temporary fixing member) is attached and temporarily fixed by an adhesive (not shown) (adhering temporary fixing step). At this time, the high-frequency functional component 21 and the electronic component 22 are fixed such that their connection electrodes (not shown) are in contact with the temporary fixing film 40.

  As a material of the temporary fixing film 40, for example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), or the like can be used. The temporary fixing film 40 is preferably made of a material that transmits ultraviolet light and has flexibility for the reasons described below.

  Further, the temporary fixing film 40 may be a carrier tape, a glass epoxy substrate, or the like. The material of the temporary fixing film 40 is not particularly limited as long as various electronic components can be temporarily fixed and can be peeled off after manufacturing the electronic device 1A.

The temporary fixing can be performed using, for example, an ultraviolet-curable adhesive (not shown) applied to one surface of the temporary fixing film 40, for example. Specifically, for example, GL-3005H manufactured by GlueLab (with adhesive) is applied to the temporary fixing film 40 made of PET having a thickness of 2 to 3 μm to a thickness of 50 μm. This application may be performed using an inkjet printing method. Thereafter, the positions of the high-frequency functional component 21, the electronic component 22, and the short-circuit conductive member 13 are determined and installed. Then, the adhesive is cured by irradiating ultraviolet rays having an intensity of, for example, 3000 mJ / cm ² , and the high-frequency functional component 21, the electronic component 22, and the short-circuit conductive member 13 are temporarily fixed to the temporary fixing film 40.

  The short-circuit conductive member 13 is preferably a metal material having a thickness of 0.1 mm or more. If the short-circuit conductive member 13 is too thin, wrinkles may be formed in the short-circuit conductive member 13 when industrially transporting the short-circuit conductive member 13 and attaching it to the temporary fixing film 40. In this case, the electronic device 1A Failure occurs as a product. Therefore, when the short-circuit conductive member 13 is a metal material having a thickness of 0.1 mm or more, the short-circuit conductive member 13 can have a certain degree of rigidity, and the above-described problem can be suppressed.

(First electromagnetic shielding step)
As shown in FIGS. 2B and 2C, after the above-mentioned attaching temporary fixing step, an internal insulating layer having a thickness of about 5 to 10 μm is formed on the surface of the high-frequency functional component 21 temporarily fixed on the temporary fixing film 40. A layer 30 (first insulating member) is formed, and a buried conductive layer 11 (first conductive layer) made of Ag having a thickness of about 1 to 10 μm is formed on the high-frequency functional component 21 via the internal insulating layer 30. Are laminated (first electromagnetic shielding step).

  In detail, the region where the internal insulating layer 30 is formed is a region on the temporary fixing film 40 that is surrounded by the short-circuit conductive member 13 and does not include the short-circuit conductive member 13. The internal insulating layer 30 may be formed so as to partially cover the surface of the short-circuit conductive member 13, but the buried conductive layer 11 and the surface of the short-circuit conductive member 13 are in contact with each other.

  The method for forming the internal insulating layer 30 and the buried conductive layer 11 is, for example, an inkjet printing method, but is not particularly limited. When the inkjet printing method is used, it is easy to selectively laminate the internal insulating layer 30 and the buried conductive layer 11 on a desired region including on the surface of the high-frequency functional component 21, so that the material cost and the manufacturing cost are increased. Cost can be reduced. On the other hand, the screen printing method or the like may be inappropriate because the high-frequency functional component 21 has a step.

  As described above, the high-frequency functional component 21 is partially surrounded by the buried conductive layer 11 and the short-circuit conductive member 13 and is partially electromagnetically shielded.

(Resin molding process)
As shown in FIG. 2D, after the first electromagnetic shielding step, the high-frequency functional component 21 covered with the internal insulating layer 30 and the buried conductive layer 11, the electronic component 22, the short-circuit conductive member 13, Is temporarily set on the upper mold 41 of the mold with the temporary fixing film 40 side as a fixing surface. Then, a resin material is injected into the mold cavity 43 between the upper mold 41 and the lower mold 42 of the mold, and injection molding of the resin is performed so that the temporarily fixed electronic component is embedded in the resin molded body 23. (Resin molding step).

Conditions for performing the injection molding may be appropriately selected according to the resin constituting the resin molded body 23. For example, when polycarbonate (PC) is used, injection molding is performed at an injection resin temperature of 270 ° C. and an injection pressure of 100 MPa. Do. Alternatively, when acrylonitrile butadiene styrene (ABS) is used, injection molding is performed at an injection resin temperature of 180 ° C. and an injection pressure of 20 kgf / cm ² .

  Various resins can be used for the resin forming the resin molded body 23. The conditions for performing the injection molding are not particularly limited.

(Removal process)
Next, although not shown, after the resin molding step, the resin molded body 23 in which the high-frequency functional component 21, the electronic component 22, and the short-circuit conductive member 13 are embedded is taken out from the mold cavity 43 and temporarily fixed. The film 40 is separated (take-out step). Here, the internal insulating layer 30 and the buried conductive layer 11 are buried in the resin molded body 23 together with the high-frequency functional component 21.

  When the temporary fixing film 40 is a PET film, the temporary fixing film 40 is greatly deformed due to a heat change during the resin molding step and is in a state of being separated from the resin molded body 23. 23 can be easily separated.

(Circuit formation step)
As shown in FIG. 2E, after the removal step, on the surface formed by the resin molded body 23 and the internal insulating layer 30, the connection of the high-frequency functional component 21 and the electronic component 22 exposed on the surface is performed. The electrodes are connected by the wiring circuit 24 (circuit forming step). The wiring circuit 24 can be formed by a method of spraying a conductive material (for example, silver ink or the like) by an inkjet printing method or the like, a method of using an aerosol, a method of using a dispenser, or the like.

  The wiring circuit 24 can be formed easily and with a high degree of freedom in circuit design by using an appropriately selected method, and each electronic component can be easily and electrically connected without soldering or the like. Furthermore, industrially, each electronic component can be connected after the position of each electronic component is determined, so that each electronic component can be connected more accurately and easily than when, for example, aligning the electronic components on a printed circuit board. Electronic components can be electrically connected.

  Here, the wiring circuit 24 is formed on the surface formed by the resin molded body 23 and the internal insulating layer 30 so as not to contact the short-circuit conductive member 13, that is, to escape from the short-circuit conductive member 13. This is because the short-circuit conductive member 13 is also exposed on the surface formed by the resin molded body 23 and the internal insulating layer 30, but if the short-circuit conductive member 13 touches the wiring circuit 24, a problem occurs.

(Second electromagnetic shielding step)
As shown in FIGS. 2F and 2G, after the circuit forming step, the high-frequency functional component 21, the electronic component 22, and the wiring are formed on the surface formed by the resin molded body 23 and the internal insulating layer 30. On the circuit 24, an insulating protective film (an internal insulating layer 31 and an exposed insulating layer 32) having a thickness of 5 to 10 μm is formed. At this time, the insulating protective film is not formed on the short-circuit conductive member 13. Thereafter, the exposed conductive layer 12 (second conductive member) made of Ag having a thickness of about 1 to 10 μm is laminated so as to cover the high-frequency functional component 21 via the internal insulating layer 31 (second insulating member) ( Second electromagnetic shielding step). Thereby, electronic device 1A according to the present embodiment can be obtained.

  The insulating protective film is industrially formed integrally by an ink-jet printing method or the like, but can be divided into an internal insulating layer 31 and an exposed insulating layer 32. The region where the internal insulating layer 31 is formed is a region surrounded by the short-circuit conductive member 13 and does not include the area on the short-circuit conductive member 13. The internal insulating layer 31 may be formed so as to partially cover the surface of the short-circuit conductive member 13, but the exposed conductive layer 12 and the surface of the short-circuit conductive member 13 are in contact with each other. The exposed insulating layer 32 is formed in a region not surrounded by the short-circuit conductive member 13 so as to protect the electronic component 22 and the wiring circuit 24.

  The method for forming the internal insulating layer 31 and the exposed insulating layer 32 is, for example, an inkjet printing method, but is not particularly limited. When the inkjet printing method is used, it is easy to selectively form the internal insulating layer 31 and the exposed insulating layer 32 while avoiding the short-circuit conductive member 13.

  The method of forming the exposed conductive layer 12 is, for example, an inkjet printing method, but is not particularly limited.

<Excellent points of an electronic device according to one embodiment of the present invention>
According to the electronic device 1A in the present embodiment configured as described above, the electronic device 1A includes at least one high-frequency functional component 21 and the conductive member 10 that electromagnetically shields the high-frequency functional component 21. The part and at least a part of the conductive member 10 are embedded and fixed in the resin molded body 23.

  In a conventional electronic device having an electromagnetic shield, an electronic component is mounted on a printed board, and the electronic component is covered with a metal case or the like, and the electronic component and the metal case protrude above the printed board. Further, parts such as a metal case need to have a certain size for industrial transportation and positioning, and there is a limit in reducing the size and thickness of an electronic device.

  On the other hand, in the electronic device 1A of the present embodiment, it is not necessary to use a metal case or the like, and at least a part of the high-frequency functional component 21 is embedded in the resin molded body 23. Therefore, the portion protruding from the resin molded body 23 can be reduced, and the electronic device 1A can be reduced in size in the height direction, and can be reduced in size and thickness.

  Further, the electronic device 1A can be manufactured by the above-described manufacturing process, and the manufacturing process does not include an industrially complicated process. Therefore, manufacturing costs can be reduced.

  The wiring circuit 24 can be freely designed and has few restrictions except that the wiring of the wiring circuit 24 does not come into contact with the short-circuit conductive member 13 as in the circuit forming step. . Therefore, the degree of freedom in designing the wiring circuit can be increased.

  Further, according to electronic device 1A in the present embodiment, at least a part of electronic component 22 that is not electromagnetically shielded is also embedded in resin molded body 23. Therefore, even if the electronic device 1A includes various types of electronic components 22, the electronic device 1A can be reduced in size in the height direction and thinned.

  According to electronic device 1A in the present embodiment, conductive member 10 includes buried conductive layer 11, exposed conductive layer 12, and short-circuit conductive member 13, and buried conductive layer 11 and exposed conductive layer 12 Are electrically connected to each other through the short-circuit conductive member 13.

  Therefore, the high-frequency functional component 21 is surrounded by the conductive member 10 with almost no gap, and is highly electromagnetically shielded.

  Further, according to the method of manufacturing electronic device 1A in the present embodiment as described above, positioning is performed on temporary fixing film 40, high-frequency functional component 21 and electronic component 22 are attached, and internal The insulating layer 30 and the buried conductive layer 11 are stacked. Thereafter, the high-frequency functional component 21 and the electronic component 22 are embedded in the resin molded body 23 to form the wiring circuit 24, and the internal insulating layer 31, the exposed insulating layer 32, and the exposed conductive layer 12 are laminated. The electronic device 1A can be manufactured by such a stack-type continuous process.

  Therefore, it is possible to simplify the manufacturing process without including processes such as soldering, bending a substrate, transporting a component or a processed product, and assembling a component. Therefore, with the electronic device 1A of the present embodiment, the electronic device 1A can be manufactured at a reduced manufacturing cost.

  Furthermore, the electronic device 1A according to the present embodiment does not require a space required for processing such as soldering, installation of a conductive case, or bending of a printed circuit board, and can improve the degree of freedom in circuit design. .

[Embodiment 2]
The following describes another embodiment of the present invention with reference to FIG. The configuration other than that described in the present embodiment is the same as that of the first embodiment. Further, for convenience of explanation, members having the same functions as those shown in the drawings of the first embodiment are given the same reference numerals, and explanations thereof are omitted.

  In the first embodiment, as an example of the electronic device of the present invention, an electronic device in which a high-frequency functional component 21 such as an amplifier, a phase shifter, or an attenuator is electromagnetically shielded by covering it with an exposed conductive layer 12 having a thickness of about 1 to 10 μm. 1A has been described. On the other hand, in the present embodiment, as another example of the electronic device of the present invention, various sensors such as a microphone, a temperature and humidity sensor, or a high-frequency functional component 51 such as an optical element are provided inside a metal case by providing a space. The electronic device 1B covered by 52 and electromagnetically shielded will be described.

  That is, when the high-frequency functional component to be electromagnetically shielded includes a microphone, various sensors such as a temperature and humidity sensor, or a high-frequency functional component 51 such as an optical element, the high-frequency functional component 51 and the electromagnetic shield that covers the high-frequency functional component 51 It is necessary to form a space between them, and in such a case, the electronic device 1B of the present embodiment can be provided.

  The configuration of the electronic device 1B according to the present embodiment will be described with reference to FIGS. FIG. 3A is a plan view illustrating a schematic configuration of an electronic device 1B according to the second embodiment. FIG. 3B is a cross-sectional view taken along line CC of the plan view shown in FIG.

  As shown in FIGS. 3A and 3B, in the electronic device 1B of the present embodiment, the high-frequency functional component 21 and the high-frequency functional component 51 are formed on the resin molded body 23 together with the buried conductive layer 11 and the internal insulating layer 30. It is buried and fixed, and is covered with a metal case 52 with a space provided inside.

  The buried conductive layer 11 and the metal case 52 are electrically short-circuited to each other by the short-circuit conductive member 13 provided therebetween. The high-frequency functional component 51 is electromagnetically shielded by the buried conductive layer 11, the metal case 52, and the short-circuit conductive member 13.

  The high-frequency functional component 21, the high-frequency functional component 51, and the electronic component 22 are electrically connected by the wiring circuit 24.

  The high-frequency function component 51 is an electronic component such as a microphone, various sensors such as a temperature and humidity sensor, or an optical element, and is provided in the electronic device 1B according to the present embodiment. The number of high-frequency functional components 51 is not particularly limited.

  The metal case 52 is formed by processing metal into a case to form a space on the high-frequency functional component 51. The metal case 52 and the short-circuit conductive member 13 embedded in the resin molded body 23 are fixed by a conductive adhesive (not shown) or by welding or the like. When fixed, the metal case 52 is electrically short-circuited with the buried conductive layer 11 buried in the resin molded body 23 to form an electromagnetic shield that covers the high-frequency functional component 51.

  Note that the metal case 52 may be formed by forming a conductive layer on the surface of a resin case by metal coating or the like. Alternatively, the metal case 52 may be provided only on the high-frequency functional component 51, and another part (the high-frequency functional component 21) may be covered with the exposed conductive layer 12. In this case, the metal case 52 and the exposed conductive layer 12 need only be connected and fixed so as to be electrically short-circuited to each other.

  The metal case 52 is provided with an opening 53 above the high-frequency functional component 51. The internal insulating layer 31 is not formed on the high-frequency functional component 51. This is because the high-frequency functional component 51 such as a microphone or a sensor needs to be in contact with the outside air.

  In such an electronic device 1 </ b> B, in the second electromagnetic shielding step, the internal insulating layer 31 is formed except on the high-frequency functional component 51, and the metal case 52 is covered so as to be in contact with the surface of the short-circuit conductive member 13. It can be manufactured so as to be fixedly connected.

  In the electronic device 1B of the present embodiment, the high-frequency functional component 51 is electromagnetically shielded by covering it with the metal case 52 provided with the opening 53. However, it is necessary to form a space on the high-frequency functional component 51. If not, the exposed conductive layer 12 instead of the metal case 52 may be formed except on the high-frequency functional component 51. Thus, an opening can be formed on the high-frequency functional component 51 to perform electromagnetic shielding.

  As described above, according to the electronic device 1 </ b> B of the present embodiment, it is possible to electromagnetically shield the high-frequency functional component 51 that requires at least one of the space and the opening in the upper part.

[Embodiment 3]
The following will describe another embodiment of the present invention with reference to FIGS. 4 and 5. The configuration other than what is described in the present embodiment is the same as that of the first and second embodiments. Further, for convenience of explanation, members having the same functions as those shown in the drawings of the first and second embodiments are denoted by the same reference numerals, and description thereof will be omitted.

  In the second embodiment, as an example of the electronic device of the present invention, an electronic device 1B in which a high-frequency functional component 51 embedded in a resin molded body 23 is provided with a space inside and covered with a metal case 52 and electromagnetically shielded is described. . On the other hand, in the present embodiment, as another example of the electronic device of the present invention, there is provided a metal case 62 made of a metal as a conductive member for housing the high-frequency functional component 51 therein. An electronic device 1C having a configuration in which at least a part of the metal housing 51 and the metal housing 62 is embedded in the resin molded body 23 will be described.

  The configuration of the electronic device 1C according to the present embodiment will be described with reference to (a), (b), and (c) of FIG. FIG. 4A is a plan view illustrating a schematic configuration of an electronic device 1 </ b> C according to the third embodiment. FIG. 4B is a cross-sectional view taken along line DD of the plan view shown in FIG. FIG. 4C is a bottom view of the electronic device 1C.

  Similarly to the second embodiment, when the high-frequency functional component to be electromagnetically shielded includes various sensors such as a microphone, a temperature and humidity sensor, or the high-frequency functional component 51 such as an optical element, a metal case made of a metal material The high-frequency functional component 51 may be provided in the body 62 with a space provided above the high-frequency functional component 51 to be electromagnetically shielded. In the following description, the description of Patent Document 2 can be referred to as appropriate for the configuration of an electronic module in which electronic components are accommodated in the metal housing 62 and a method of manufacturing the electronic module.

(Configuration of Electronic Device 1C)
As shown in FIGS. 4A, 4B, and 4C, in the electronic device 1C according to the present embodiment, the high-frequency functional component 21 and the high-frequency functional component 51 include the first box 62a and the second box The first box body 62a is housed in a metal casing 62 (conductive member) made of the resin molded body 23b together with the high-frequency functional components 21 and 51 housed therein. The electronic component 22 is also embedded in the resin molded body 23.

  The first box 62a and the second box 62b are both obtained by sheet metal processing, and are both box-shaped members having openings. The first housing 62a and the second housing 62b are fixed such that their openings face each other, thereby forming a metal housing 62. The fixing is performed by a conductive adhesive (not shown), welding, or the like. As a result, the first box 62a and the second box 62b are electrically short-circuited to each other, and the metal housing 62 serves as an electromagnetic shield that covers the high-frequency functional component 21 and the high-frequency functional component 51.

  An example of a material (metal plate) used for the first box 62a is a nickel-iron alloy (42 alloy) plate having a thickness of 0.15 mm. An example of a material (metal plate) used for the second box 62b is a nickel-iron alloy (42 alloy) plate having a thickness of 0.12 mm.

  Note that the first box 62a and the second box 62b may be formed by forming a conductive layer on the surface of a resin box by metal coating or the like. The second box 62 b may be provided only on the high-frequency functional component 51, and the other part (the high-frequency functional component 21) may be covered with the exposed conductive layer 12. In this case, the second box 62b and the exposed conductive layer 12 need only be connected and fixed so as to be electrically short-circuited to each other.

  An insulating layer 63 is provided outside the first box 62a (here, outside on the bottom side). As an example of the insulating layer 63, a layer made of an epoxy-based adhesive can be given.

  The high-frequency functional component 21 and the high-frequency functional component 51 are fixed inside the first box 62a by an insulating potting portion 64 (insulating member) filled and cured in the first box 62a. I have. An example of a potting agent that forms the potting portion 64 includes an epoxy-based sealing agent. Here, the high-frequency functional component 51 has a height higher than the depth of the first box 62 a, and an upper portion of the high-frequency functional component 51 is exposed from the potting portion 64.

  Further, a through hole 65 is provided in the bottom plate of the first box body 62a. The through hole 65 is provided for drawing out a conductive wire (not shown) such as a gold wire connected to the high-frequency functional component 21 and the high-frequency functional component 51 to the surface of the insulating layer 63. That is, the conducting wire is inserted through the through hole 65, one end of the conducting wire is electrically connected to the high-frequency functional component 21 or the high-frequency functional component 51, and the other end is pulled out to the surface of the insulating layer 63. And is electrically connected to the wiring circuit 24. Thus, the high-frequency functional component 21 and the high-frequency functional component 51 are electrically connected to the electronic component 22. In FIG. 4C, eight through-holes 65 are provided at eight locations. Needless to say, the number of through-holes 65 is appropriately set according to the type and number of electronic components to be mounted.

  The second box 62 b is not embedded in the resin molded body 23, but has an opening 66 above the high-frequency functional component 51. The upper part of the high-frequency functional component 51 is exposed from the potting portion 64. As described above, the electronic device 1 </ b> C has a space above the high-frequency functional component 51, and the high-frequency functional component 51 comes into contact with the outside air.

(Method of Manufacturing Electronic Device 1C)
The method of manufacturing the electronic device 1C according to the present embodiment will be described below with reference to FIGS. 5A, 5B, 5C, 5D, 5E, and 5F. 5A, 5B, and 5D are side cross-sectional views illustrating an example of a method for manufacturing the electronic device 1C of the present embodiment. FIGS. 5C and 5F are diagrams illustrating an example of a method of manufacturing the electronic device 1 </ b> C of the present embodiment, and are respectively a plan view of the electronic device 1 </ b> C and an EE line of the plan view. It consists of a sectional view. FIG. 5E illustrates an example of a method for manufacturing the electronic device 1 </ b> C according to the present embodiment, which includes a bottom view of the electronic device 1 </ b> C and a cross-sectional view taken along line EE of the bottom view. Has become.

  As shown in FIG. 5A, a first box 62a having an insulating layer 63 and a through hole 65 is prepared.

  Next, as shown in FIG. 5B, the high-frequency functional component 21 and the high-frequency functional component 51 are arranged inside the first box 62a, and a lead wire (not shown) connected thereto is penetrated. After drawing out from the hole 65, a liquid potting agent (epoxy-based sealing agent) is filled. The potting portion 64 is formed by curing the liquid potting agent. Thus, the high-frequency functional component 21 and the high-frequency functional component 51 are fixed in the first box 62a (first electromagnetic shielding step).

  At this time, the potting portion 64 does not cover the portion where the first box 62a is later connected and fixed to the second box 62b. Since the high-frequency function component 51 has a height higher than the depth of the concave portion of the first box 62a, the upper portion of the high-frequency function component 51 projects from the potting portion 64.

  Next, as shown in FIG. 5C, the first box 62a to which the high-frequency functional component 21 and the high-frequency functional component 51 are fixed and the electronic component 22 are bonded to the temporary fixing film 40 with an adhesive (not shown). And temporary fixing (adhering temporary fixing step). At this time, the first box 62a is temporarily fixed such that the surface on which the insulating layer 63 and the through hole 65 are formed is in contact with the temporary fixing film 40. Further, the electronic component 22 is fixed such that each connection electrode (not shown) is in contact with the temporary fixing film 40.

  Thereafter, as shown in FIG. 5D, the temporary fixing film 40 is set on the lower mold 72. Then, between the upper molding die 71 and the lower molding die 72, a resin molding step is performed and a take-out step is performed as in the first embodiment. At this time, the upper mold 71 has a concave portion 71 a at a position corresponding to an upper portion of the high frequency function component 51 protruding from the potting portion 64.

  Next, as shown in FIG. 5E, on the surface formed by the resin molded body 23 and the insulating layer 63, the connection electrode of the electronic component 22 exposed on the surface of the resin molded body 23, The respective lead wires drawn out from the through holes 65 of the box 62a are connected by the wiring circuit 24 (circuit forming step).

  Finally, as shown in FIG. 5F, the second box 62b is electrically connected and fixed to the first box 62a by a conductive adhesive, welding, or the like. And The high-frequency functional component 21 and the high-frequency functional component 51 are covered by the metal housing 62, and the electromagnetic shield structure is completed, whereby the electronic device 1C according to the present embodiment can be obtained.

  As described above, by forming the wiring circuit 24 and assembling the second box 62b and the first box 62a after the resin molding process, the metal housing 62 is deformed at the time of resin injection molding. In addition, it is possible to prevent a quality problem such as disconnection of the electrical connection of the wiring.

[Summary]
As described above, an electronic device according to one embodiment of the present invention includes at least one electronic component, a conductive member that electromagnetically shields at least one of the electronic components, at least a part of at least one of the electronic components, A resin molded body that embeds and fixes at least a part of a conductive member that electromagnetically shields the electronic component.

  According to the above configuration, at least one electronic component is electromagnetically shielded by the conductive member, and at least a part of the electronic component and at least a part of the conductive member are embedded and fixed in the resin molded body. . That is, the height of the portion protruding above the resin molded body can be suppressed. Therefore, the size of the electronic device in the height direction can be reduced and the electronic device can be reduced in thickness.

  In addition, such a structure can be manufactured by, for example, providing a conductive member on one side of an electronic component and performing electromagnetic shielding, then performing injection molding of a resin, and further providing a conductive member on the other side of the electronic component. it can. Then, after injection molding of the resin, a wiring circuit can be formed before the conductive member is further provided on the other side of the electronic component. Therefore, the manufacturing process can be simplified, and the degree of freedom in designing the wiring circuit can be increased.

  Therefore, in an electronic device provided with an electromagnetic shield, it is possible to provide an electronic device in which the manufacturing cost is suppressed, the thickness is reduced, and the degree of freedom in designing a wiring circuit is high, and a method of manufacturing the same.

  The electronic device of the present invention further includes a first electronic component that is the electromagnetically shielded electronic component, and a second electronic component that is not electromagnetically shielded, wherein the second electronic component includes the resin It is preferable that at least a part is buried in the molded body.

  According to the above configuration, the second electronic component that is not electromagnetically shielded is provided, and at least a part of the second electronic component is embedded in the resin molded body. Therefore, also in an electronic device including the second electronic component, the size in the height direction can be reduced and the electronic device can be reduced in thickness.

  Further, the first electronic component and the second electronic component can be electrically connected to each other by a wiring circuit, and an electronic device having various types and numbers of electronic components can be provided.

  In the electronic device of the present invention, the first electronic component is further fixed by an insulating member provided in a space formed by being surrounded by the conductive member, and at least a part of the insulating member is It is preferable that at least a part of the first electronic component and at least a part of the conductive member are embedded in the resin molded body.

  According to the above configuration, the first electronic component and the conductive member are insulated by the insulating member, and the insulating member is at least partially embedded in the resin molded body. Therefore, even when the electronic device is provided, the size of the electronic device in the height direction can be reduced and the electronic device can be reduced in thickness.

  In the electronic device of the present invention, the conductive member may further include a first conductive member embedded in the resin molded body, a second conductive member not embedded in the resin molded body, and the first conductive member. And at least one third conductive member provided between the member and the second conductive member, wherein the first conductive member and the second conductive member are connected to each other through the third conductive member. Preferably, they are electrically connected.

  According to the above configuration, the first electronic component is surrounded by the first conductive member, the second conductive member, and the third conductive member. For this reason, the first electronic component can be more highly electromagnetically shielded than when the third conductive member is not provided.

  In the electronic device according to the aspect of the invention, it is preferable that the first conductive member and the second conductive member are thin films having a thickness of 1 μm to 10 μm.

  According to the above configuration, the first conductive member and the second conductive member can be formed by a method of forming a thin film such as an inkjet printing method. Further, the material to be used can be reduced to a necessary minimum, and the material cost can be reduced as compared with the case where a metal case or the like is used. Therefore, manufacturing costs can be reduced.

  In the electronic device according to the aspect of the invention, it is preferable that the third conductive member is a metal material having a thickness of 0.1 mm or more.

  According to the above configuration, the third conductive member can have a certain degree of rigidity. For this reason, it is possible to prevent the third conductive member from being deformed, such as being wrinkled, during industrial transport, thereby causing a problem as a product.

  In the electronic device according to the aspect of the invention, the electrode of the first electronic component and the electrode of the second electronic component may be disposed on a surface of the resin molded body and a surface of an insulating member embedded in the resin molded body. The wiring is connected so as not to contact the third conductive member, and the space between the connected wiring and the second conductive member is an insulating member or air which is not embedded in the resin molded body. Is preferably insulated.

  According to the configuration, it is possible to provide an electronic device in which the electrodes of the first electronic component and the electrodes of the second electronic component are connected by wiring.

  In the electronic device according to the aspect of the invention, it is preferable that the electrode of the first electronic component and the electrode of the second electronic component are located on the same or substantially the same plane as the surface of the resin molded body.

  According to the above configuration, wiring connection between the electrode of the first electronic component and the electrode of the second electronic component can be easily performed using an apparatus such as an ink jet printer.

  In the electronic device according to the aspect of the invention, it is preferable that the second conductive member has an opening formed directly above at least one of the first electronic components.

  According to the above configuration, it is possible to provide an electronic device using, as the first electronic component, a type of electronic component that needs to come into contact with the outside air.

  In the electronic device according to the aspect of the invention, the conductive member may be a housing made of a metal material, and the housing may be embedded in the resin molded body and fixed such that their openings face each other. A first box, a second box protruding from the surface of the resin molded body, an insulating layer provided outside the first box, and a first box; The body is provided with a through-hole for leading a lead wire connected to the first electronic component to the surface of the insulating layer, and the surface of the insulating layer and an outlet of the through-hole are formed of the resin molded body. May be positioned on the same plane as the back surface of the.

  According to the above configuration, the first box housing the first electronic component is embedded in the resin molded body, and the second box protrudes from the surface of the resin molded body. Therefore, even in a configuration using such a housing, the size of the electronic device in the height direction can be reduced and the electronic device can be made thinner.

  In addition, an electronic device in which the first electronic component is accommodated in the first box body is prepared in a separate process, and is used as appropriate, and is molded with resin to manufacture an electronic device. Therefore, the first electronic component housed in the first box body may be manufactured for another purpose, so that the flexibility of the manufacturing process is improved and the manufacturing cost can be reduced.

  In the electronic device according to the aspect of the invention, the second electronic component may be buried so that an electrode is exposed on a back surface of the resin molded body, and a conductive wire connected to the first electronic component may be provided. The electrode of the electronic component may be wired and connected on the back surface of the resin molded body.

  According to the above configuration, an electronic device in which an electrode of a first electronic component and an electrode of a second electronic component are connected by wiring in an electronic device in which a housing made of a metal material is a conductive member. can do.

  In the electronic device according to the aspect of the invention, it is preferable that the wiring connection is formed by printing and printing a conductive material.

  According to the above configuration, wiring can be easily performed using a minimum necessary material. In the case where a protective film covering the wiring is formed, the thickness of the protective film can be reduced. Therefore, it is possible to reduce member costs and reduce manufacturing costs.

  The method for manufacturing an electronic device according to the present invention includes a step of temporarily attaching and temporarily fixing at least one electronic component to a temporary fixing member, and a first insulating member and a first insulating member for at least one of the electronic components. A first electromagnetic shielding step of electromagnetically shielding by covering with a conductive member, and a temporary fixing member after the first electromagnetic shielding step, wherein the electronic component, the first insulating member, and the first conductive member A resin molding step of disposing the electronic component, the first insulating member, and the first conductive member in a temporarily fixed state in a molding die so as to bury at least a part of each; A removing step of separating the temporary fixing member from the resin molded body generated in the resin molding step; and, after the removing step, the electronic component is moved counter to a side on which the first conductive member is formed. Covered by the second conductive member on the side it is characterized by including a second electromagnetic shielding step of electromagnetically shielding.

  According to the above configuration, the electronic component is attached by positioning the temporary fixing member, and the first insulating member and the first conductive member are covered on one side of the electronic component, electromagnetically shielded, and then resin-molded. Thus, it is possible to obtain an electronic component, a first insulating member, and a first conductive member embedded in a resin molded body. Then, the electronic component can be covered with the second conductive member to electromagnetically shield the electronic component. These steps can be easily performed by industrially simple steps.

  Thus, the electronic component, the first insulating member, and the first conductive member are embedded in the resin molded body, and the second conductive member can project from the resin molded body. Further, after the removal step and before the second electromagnetic shielding step, a wiring circuit can be formed.

  Accordingly, it is possible to manufacture a thin electronic device by reducing the dimension in the height direction, to suppress the manufacturing cost, and to provide a method of manufacturing an electronic device having a high degree of freedom in designing a wiring circuit. .

  In the method for manufacturing an electronic device according to the present invention, in the attaching temporary fixing step, a conductive thin plate having conductivity is attached to the temporary fixing member, and after the removing step and in the second electromagnetic shielding step, Forming a wiring circuit for connecting an electrode of the electronic component on a surface formed by the resin molding and the first insulating member so that the wiring does not contact the conductive thin plate; The second electromagnetic shielding step further includes a step of laminating a second insulating member on the wiring circuit and the electronic component except for the portion of the conductive thin plate, and subsequently embedding the electronic component. It is preferable that a second conductive member including the conductive thin plate is laminated in a region where the second conductive member is provided.

  According to the above configuration, the wiring circuit can be appropriately formed in the configuration in which the conductive thin plate is embedded in the resin molded body. Further, a second insulating member and a second conductive member are laminated on the electronic component, and the electronic component is surrounded by the first conductive member, the second conductive member, and the conductive thin plate, and is highly electromagnetically shielded. It can be.

  In the method of manufacturing an electronic device according to the present invention, the first insulating member, the first conductive member, the second insulating member, the second conductive member, and the wiring circuit are each printed using an inkjet printing method. Preferably, it is formed.

  According to the above configuration, the first insulating member, the first conductive member, the second insulating member, the second conductive member, and the wiring are switched by appropriately switching the head of the inkjet device, using the same inkjet device. Each circuit can be formed, and manufacturing cost can be reduced.

  In the method for manufacturing an electronic device according to the present invention, the first electromagnetic shielding step may further include: forming the first box as the first conductive member having conductivity and having an insulating layer formed outside. A component accommodating step of accommodating at least one of the electronic components, and a conductor extracting step of inserting a conductor connected to the electronic component through a through hole provided in the first box body and extracting the conductor to the surface of the insulating layer And a component fixing step of fixing the electronic component by filling a first insulating member in the first box body after the lead wire drawing step, and the attaching temporary fixing step includes: Then, the side of the first box body on which the insulating layer and the through-hole are formed may be attached.

  According to the above configuration, it is possible to manufacture an electronic device by using an electronic component housed in the first box. The electronic component housed in such a first box body may be manufactured for another purpose. Therefore, the flexibility of the manufacturing process is improved, and the manufacturing cost is reduced. Can be.

  In the method of manufacturing an electronic device according to the present invention, the second electromagnetic shielding step may further include: forming a second box having conductivity and having an opening formed in a part thereof; And the first box body is fixed to the first box body so that the openings thereof face each other to form a housing containing the electronic component.

  According to the above configuration, it is possible to provide a method of manufacturing an electronic device using, as an electronic component, a type of electronic component that needs to come into contact with outside air.

  In the method for manufacturing an electronic device according to the present invention, in the component housing step, the first box may include at least a tall component as the electronic component that is taller than a depth of the first box. And the resin molding step comprises the steps of: (a) forming the tall part and the first part between a lower mold and an upper mold having a recess at a portion where the tall part abuts; The insulating member and the first conductive member may be formed by resin molding so that at least a part of each of the insulating member and the first conductive member is embedded.

  According to the above configuration, even when the tall components are used, the electronic device can be manufactured by using the first box housing the tall components.

  The method for manufacturing an electronic device according to the present invention may further include connecting the electronic component to the electronic component on a surface formed by the resin molded body and the insulating layer after the removing step and before the second electromagnetic shielding step. The method may further include a circuit forming step of forming a wiring circuit connected to the formed conductor.

  According to the above configuration, it is possible to manufacture an electronic device in which the electronic components are connected by wiring using the one in which the electronic components are accommodated in the first box body.

  In the method for manufacturing an electronic device according to the present invention, it is preferable that the circuit forming step is performed by spraying a conductive ink to print a wiring to form a wiring circuit.

  According to the above configuration, wiring connection can be easily performed using an apparatus such as an ink jet printer.

[Appendix]
The present invention is not limited to the embodiments described above, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

1A to 1C Electronic device 10 Conductive member 11 Embedded conductive layer (first conductive member)
12 Exposed conductive layer (second conductive member)
13 Short-circuit conductive member (third conductive member / conductive thin plate)
21 High-frequency functional components (electronic components / first electronic components)
22 Electronic components (second electronic components)
23 Resin molded body 24 Wiring circuit (wiring)
30 Internal insulating layer (insulating member / insulating member embedded in resin molding / first insulating member)
31 Internal insulation layer (insulation member / second insulation member)
40 Temporary fixing film (temporary fixing member)
51 High-frequency functional components (electronic components, first electronic components, tall components)
53, 66 Opening 62 Metal housing (housing made of metal material)
62a first box 62b second box 63 insulating layer 64 potting portion (insulating member)
65 Through hole 71 Upper mold 72 Lower mold

Claims (7)

At least one electronic component;
A conductive member that electromagnetically shields at least one of the electronic components;
At least a part of the at least one electronic component, and a resin molded body that embeds and fixes at least a part of a conductive member that electromagnetically shields the electronic component,
The at least one electronic component includes a first electronic component that is the electromagnetically shielded electronic component, and a second electronic component that is not electromagnetically shielded,
The second electronic component is at least partially embedded in the resin molded body,
The first electronic component is fixed by an insulating member provided in a space formed by being surrounded by the conductive member,
At least a part of the insulating member is embedded in the resin molded body together with at least a part of the first electronic component and at least a part of the conductive member,
The conductive member includes a first conductive member embedded in the resin molded body, a second conductive member not embedded in the resin molded body, and a first conductive member and the second conductive member. And at least one third conductive member provided therebetween.
The first conductive member and the second conductive member are electrically connected to each other through the third conductive member,
The electronic device, wherein the second electronic component is not in contact with the insulating member embedded in the resin molded body.   The electronic device according to claim 1, wherein the first conductive member and the second conductive member are thin films having a thickness of 1 μm to 10 μm.   The electronic device according to claim 1, wherein the third conductive member is a metal material having a thickness of 0.1 mm or more. The electrode of the first electronic component and the electrode of the second electronic component are connected to the third conductive member on the surface of the resin molded body and the surface of the insulating member embedded in the resin molded body. Are connected so that they do not touch the
The wiring between the wiring and the second conductive member is insulated by the insulating member or air not embedded in the resin molded body. The electronic device according to claim 1.   5. The electronic device according to claim 4, wherein the electrode of the first electronic component and the electrode of the second electronic component are located on the same or substantially the same plane as the surface of the resin molded body. 6. apparatus.   6. The electronic device according to claim 1, wherein the second conductive member has an opening formed directly above at least one of the first electronic components. 7.   The electronic device according to claim 5, wherein the wiring connection is formed by printing a conductive material.

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