JP2020046393A - Device for inspecting chip body - Google Patents

Abstract

To provide a device for inspecting a chip body, capable of reducing the influence of information on the brightness of a non-inspection portion included in an inspection image to obtain an inspection result with desired accuracy.SOLUTION: A device 1 for inspecting a chip body, capable of processing an inspection image obtained by imaging an inspection area including the chip body and a region therearound to inspect the chip body comprises: an inspection image acquisition section 5 for acquiring the inspection image; a processing section 6 for creating inspection data from the inspection image; and an inspection section 7 for inspecting the chip body on the basis of the inspection data and a preregistered criterion. The processing section comprising: a brightness information storage part 61 for storing information on brightness for each pixel in the inspection area of the inspection image; an effective pixel information determination part 62 for acquiring information on the brightness of a pixel having higher brightness in the number of pixels corresponding to the area of a portion to be inspected of the chip body on the basis of the maximum brightness value from the brightness information to determine the acquired brightness information as effective pixel information in the inspection area, creates the inspection data on the basis of the effective pixel information.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an apparatus for processing an image of a chip in an inspection area and inspecting the chip.

  2. Description of the Related Art A technique is known in which an LED chip having photoluminescence characteristics is irradiated with excitation light to measure light having a fluorescence wavelength emitted from the LED chip to determine the quality of the LED chip (for example, Patent Document 1).

  Further, in an appearance inspection method for taking in an image including an IC package (inspection object) and inspecting the appearance of the inspection object, the image data of the inspection object obtained by removing predetermined dark portions and bright portions from image data. A technique has been proposed in which an average value of brightness is obtained based on the threshold value, a threshold value is obtained based on the average value, and the image data is binarized using the threshold value (for example, Patent Document 2).

  Japanese Patent Application Laid-Open No. H11-163,086 discloses that an average value is calculated from a predetermined fixed range of brightness for a histogram of the number of pixels with respect to the brightness of image data. A method of obtaining an average value from a brightness range having a predetermined ratio of pixels to the number of brightness pixels, and a method of obtaining an average value from a predetermined range of brightness centering on the peak brightness of the histogram. Have been.

Japanese Patent No. 6076133 JP-A-11-14317

  Although the effective pixels for extracting the luminance information by the alignment in the image are designated, if the total number of the effective pixels for imaging the chip body is sufficiently large, the desired luminance information is obtained even if the position of the alignment in the image is slightly shifted. Was able to get.

  However, when the number of effective pixels for imaging one chip body is relatively small, such as when imaging a large number of chip bodies at a low magnification or when imaging a chip body having a very small size, misalignment of the alignment in the image is required. The luminance information in the effective pixels varies depending on the presence or absence of the pixel.

  Also, if the effective pixel is designated to include the chip (inspection target part) and the non-inspection part around it so that the influence of the positional deviation in the image alignment does not occur, the luminance information in the effective pixel varies. However, desired luminance information could not be obtained because a large amount of luminance information of a non-inspection site was included.

Therefore, the present invention has been made in view of the above problems,
It is an object of the present invention to provide a chip body inspection apparatus capable of reducing the influence of luminance information of a non-inspection site included in an inspection image and obtaining an inspection result with desired accuracy.

In order to solve the above problems, one embodiment of the present invention provides:
A chip body inspection apparatus for processing an inspection image obtained by imaging an inspection area including a chip body and a peripheral area thereof and inspecting the chip body,
An inspection image acquisition unit that acquires an inspection image;
A processing unit that generates inspection data from the inspection image;
An inspection unit that inspects the chip body based on the inspection data and a pre-registered determination criterion,
The processing unit
A luminance information storage unit that stores luminance information for each pixel in the inspection area of the inspection image,
From the luminance information, the luminance information of the luminance upper pixels corresponding to the number of pixels according to the area of the inspection target portion of the chip body of the chip body is acquired based on the maximum luminance value, and the acquired luminance information is used as valid pixel information in the inspection area. And an effective pixel information determining unit,
It is characterized in that inspection data is generated based on valid pixel information.

  ADVANTAGE OF THE INVENTION According to this invention, the influence of the brightness information of the non-inspection part contained in an inspection image can be reduced and an inspection result can be obtained with desired precision.

FIG. 1 is a schematic diagram illustrating an entire configuration of an example of an embodiment embodying the present invention. It is a schematic diagram showing an inspection area etc. in an example of a form which embodies the present invention. FIG. 3 is a conceptual diagram of an inspection image and luminance information in an example of an embodiment of the present invention. FIG. 4 is a flowchart showing an inspection procedure in an example of an embodiment embodying the present invention. It is a conceptual diagram of an inspection image and an effective pixel in the modification of the form which embodies the present invention.

  An embodiment for carrying out the present invention will be described below with reference to the drawings.

  In the following description, three axes of the rectangular coordinate system are represented by X, Y, and Z, the horizontal direction is represented by the X direction and the Y direction, and the direction perpendicular to the XY plane (that is, the direction of gravity) is represented by the Z direction. I do. In the Z direction, the direction against gravity is expressed as “up”, and the direction in which gravity acts is expressed as “down”. The direction in which the Z direction rotates about the center axis is defined as the θ direction.

  FIG. 1 is a schematic diagram showing an entire configuration of an example of an embodiment embodying the present invention. FIG. 1 shows a schematic diagram of a chip device 1 according to the present invention.

  The chip inspection apparatus 1 processes an image obtained by imaging a chip body in the inspection area R and inspects the chip body.

  Note that the inspection includes determination of presence or absence and degree of foreign matter or defect, quality determination, identification, classification, characteristic evaluation, test, diagnosis support, and the like. Here, the circuit portion of the semiconductor device is illustrated as a chip body C (C1 to Cn), the chip body C is irradiated with illumination light L1, and the light L2 reflected or scattered on the surface of the chip body C is imaged. An example in which the body C is inspected for the presence or absence of foreign matter, defects, and the like (so-called chip body appearance inspection) will be described as an example.

  Specifically, the chip inspection device 1 includes a work holding unit 2, an illumination unit 3, an imaging unit 4, an image acquisition unit 5, a processing unit 6, an inspection unit 7, a computer CN, and the like.

  The work holding unit 2 holds the work W on which the chips C are arranged in a predetermined posture. Specifically, the work holding unit 2 includes a work mounting table 20, a relative moving unit MT, and a suction mechanism (not shown). Here, a circular substrate is illustrated as the work W.

  The work mounting table 20 holds the work W in a predetermined posture by applying a frictional force, a suction force, or the like to the lower surface or the side surface of the work W while being in contact with the lower surface or the side surface of the work W. Specifically, the work mounting table 20 is provided with a suction groove or a hole on the upper surface of a plate-shaped member arranged so that the upper surface is horizontal, and is connected to a suction mechanism via a switching valve or the like. Configuration (so-called negative pressure suction plate), an electrostatic suction plate, a gripping chuck mechanism having an opening / closing mechanism, and the like.

  The relative moving unit MT relatively moves the work mounting table 20 holding the work W, the illumination unit 3 and the imaging unit 4. Specifically, the relative moving unit MT includes an X-axis stage M1, a Y-axis stage M2, a θ-axis stage M3, and the like.

  The X-axis stage M1 moves the work mounting table 20 in the X direction or stops at a predetermined position, and is mounted on the apparatus frame 1f.

  The Y-axis stage M2 moves the work mounting table 20 in the Y-direction or stops at a predetermined position, and is attached to the X-axis stage M1.

  The θ-axis stage M3 is for rotating the work table 20 or stopping at a predetermined angle, and is attached to the Y-axis stage M2.

  The illumination section 3 irradiates the illumination light L1 toward the chip body C. Specifically, the illumination unit 3 includes a light source 31.

  The light source 31 emits light having a wavelength used as the illumination light L1. Specifically, examples of the light source 31 include a LED diode, a xenon lamp, a metal halide lamp, a fluorescent lamp, and a laser diode that emits light of a predetermined wavelength, which emit light in a visible light region.

  The imaging unit 4 captures an image of the inspection area R including the LED chip C and the surrounding area B, and outputs the image to the external device as an inspection image IM. Specifically, the imaging unit 4 outputs an image of the inspection area R including the chip body C and the peripheral area B thereof contained in the visual field F (that is, the inspection image IM) to the external device. More specifically, the imaging unit 4 includes an imaging camera 41.

  The light source 31 and the imaging camera 41 are attached to the lens barrel 30, and the lens barrel 30 is attached to the apparatus frame 1f via a connection fitting (not shown).

  The lens barrel 30 irradiates the light emitted from the light source 31 to the chip body C as illumination light L1 and guides the light (so-called observation light) L2 reflected or scattered on the surface of the chip body C to the imaging camera 41. The light source is provided with a half mirror 32, objective lenses 33a and 33b, a revolver mechanism 34, and the like.

  The half mirror 32 transmits the observation light L2 while reflecting the light emitted from the light source 31.

  The objective lenses 33a and 33b project and form an image in the field of view F on the work W to the imaging camera 41 while irradiating a predetermined range on the work W with the illumination light L1. The objective lenses 33a and 33b are configured by combining a plurality of lenses, and have different magnifications.

  The revolver mechanism 34 switches the objective lenses 33a and 33b, and changes the magnification (range of the field of view F) for imaging by the imaging camera 41.

  The imaging camera 41 includes an imaging device (a so-called image sensor) such as a CCD or a CMOS, and converts an image in a field of view F in which the observation light L2 is formed on the imaging device via the objective lenses 33a and 33b. It is output to an external device as a video signal or image data.

  FIG. 2 is a schematic diagram showing an inspection area and the like in an example of an embodiment embodying the present invention. FIG. 2 exemplifies a state of an inspection area R including a chip body C and a peripheral area B contained in a visual field F of the imaging unit 4.

  The computer CN controls the work holding unit 2, the illumination unit 3, the imaging unit 4, and the like, while configuring the image acquisition unit 5, the processing unit 6, and the inspection unit 7. Specifically, the computer CN acquires the inspection image IM output from the imaging unit 4, performs predetermined processing (image processing, arithmetic processing, data processing, etc.) on the inspection image IM, and generates the generated inspection image IM. The chip body C is inspected based on the data XD. More specifically, the computer CN includes hardware such as an input / output device, a storage device, an image processing device, and an arithmetic processing device, and an execution program (software) that executes a predetermined process.

The inspection image acquisition unit 5 acquires an inspection image IM.
Specifically, the inspection image acquisition unit 5 acquires an image of the inspection area R including the chip body C and the surrounding area B captured by the imaging unit 4 (that is, the inspection image IM) as a video signal or image data. I do. More specifically, an image of the inspection area R (that is, the inspection image IM) may be obtained, or an entire image of the field of view F including the image may be obtained.

  The processing unit 6 performs a process of generating inspection data XD from the inspection image IM. When the entire image of the visual field F is acquired by the inspection image acquiring unit 5, the processing unit 6 performs a process of generating an image of the inspection area R (the inspection image IM) from the entire image of the visual field F.

  Specifically, the processing unit 6 includes a luminance information storage unit 61 and an effective pixel information determination unit 62.

  FIG. 3 is a conceptual diagram of an inspection image IM and luminance information DM according to an example of an embodiment embodying the present invention. FIG. 3A illustrates the coordinates (so-called addresses) of each pixel in the inspection image IM and a light / dark image, and FIG. 3B illustrates a pixel of the inspection image IM as an example of the luminance information DM. The data array in which the coordinates (H, V) for each and the luminance value IB are linked. Specifically, in the inspection image IM, the luminance value IB of the pixel for the bright part is about 200, and the luminance value IB of the pixel for the dark part is about 100. More specifically, the pixels at the coordinates (j, k), (j + 1, k), (j + 2, k), etc., at which the bright portion is imaged have luminance values IB of 197 to 204. On the other hand, the pixels at coordinates (1, 1), (2, 1), (m, 1), (1, n), (m, n), etc., at which the dark portion is imaged have a luminance value IB of 95 to 105. . Note that j, k, m, and n are predetermined natural numbers.

  The luminance information storage unit 61 stores luminance information DM for each pixel in the inspection area R of the inspection image IM. Specifically, the brightness information storage unit 61 stores a data array as shown in FIG. 3B as brightness information DM. Note that the first row of the data array illustrated in FIG. 3B is a so-called title row, and may be omitted from the actual data array.

  The effective pixel information determination unit 62 acquires, from the luminance information DM, luminance information of luminance upper pixels for the number of pixels corresponding to the area of the inspection target portion of the chip C based on the maximum luminance value, and acquires the acquired luminance information DM. Is determined as effective pixel information in the inspection area.

  As a specific example, in the inspection image IM obtained by imaging the rectangular chip body C to be inspected, the inspection area R corresponds to 18 × 18 pixels in the vertical and horizontal directions, and the area of the chip body C is equal to 36 pixels (6 × 6 in the vertical and horizontal directions). A case corresponding to the above will be described.

  When the chip body C is irradiated with the illumination light L1, bright light (strong reflected light or scattered light) is emitted from the surface of the chip body C. On the other hand, weak light (weak reflected light or scattered light) is emitted from the peripheral region B around the chip body C. Then, in the inspection image IM obtained by irradiating the chip body C with the illumination light L1, a pixel obtained by imaging the chip body C is captured as a bright portion (a luminance value is about 200), and a pixel obtained by imaging the peripheral region B is obtained. An image is captured as a dark part (a luminance value is around 100). The inspection image IM is acquired by the inspection image acquisition unit 5 and stored in the luminance information storage unit 61 as luminance information DM.

  The brightness information DM stored in the brightness information storage unit 61 is a data array in which the coordinates (H, V) and the brightness value IB are linked to each other in the coordinate order of all the pixels (that is, 324 pixels) of the inspection image IM. It is remembered. Of the data array included in the luminance information DM, the luminance value is around 200 for 36 pixels that have imaged a bright part, and the luminance value is around 100 for other pixels that have imaged a dark part (that is, 288 pixels). It is.

  The effective pixel information determination unit 62 extracts, from the data array of all pixels (for 324 pixels) included in the luminance information DM, the one with the largest luminance value IB with the luminance value as a base axis, and then extracts the luminance value IB next. A pixel having a large value IB is extracted for 35 pixels, and these 36 pixels with higher luminance are extracted first. Then, these 36 pixels with higher luminance are designated as effective pixels in the inspection area R. Then, the luminance information of these effective pixels is obtained and determined as effective pixel information in the inspection area R.

  Specifically, the effective pixel information determination unit 62 performs arithmetic processing, data processing, and the like on the luminance information DM, and arranges each data string in the order of the luminance value (for example, in descending order) with the luminance value of the luminance information DM as a base axis. ), Filtering so that a data string with a large luminance value remains, and adding luminance order information, flag information, and the like to each data string of luminance information DM. A process for designating the minute pixel as an effective pixel is performed. Then, a process of acquiring the luminance information (address value, luminance value, and the like) of these effective pixels and determining it as effective pixel information in the inspection area R is performed.

  The processing unit 6 is configured to generate the inspection data XD based on the effective pixel information. Specifically, the processing unit 6 determines, among the data sequence determined as the effective pixel information in the inspection area R in the luminance information DM, data necessary for an inspection to be described later (for example, the upper 36 pixels that are regarded as effective pixels). Are generated as the inspection data XD.

The inspection unit 7 inspects the chip body C based on the inspection data XD and a pre-registered criterion.
Specifically, the inspection unit 7 registers in advance a predetermined criterion (also referred to as an inspection condition) for the chip body C to be inspected. The predetermined criterion includes a maximum value and a minimum value of the luminance value, an average value, a median value, a variance value, a distribution pattern, and the like. It is set appropriately according to characteristics evaluation, tests, diagnosis support, etc. (also referred to as inspection items and inspection forms). Then, the inspection unit 7 performs a desired inspection by performing a process of comparing the determination criterion with the inspection data XD.

<Inspection procedure>
FIG. 4 is a flowchart showing an inspection procedure in an example of an embodiment embodying the present invention.

  Hereinafter, a specific example of a series of procedures (referred to as an inspection procedure) for inspecting the appearance of the chip body C according to the present invention will be described. The inspection procedure includes a preliminary preparation step S1, an inspection image acquisition step S2, a processing step S3, and an inspection step S4.

  In the preparatory step S1, a criterion used in an inspection step S4 to be described later is registered in advance, an imaging condition (a lens magnification, an intensity of illumination light, and the like) is registered, a route and a speed of a relative movement of the workpiece W, and an Processing for registering timing and the like is performed.

  In the inspection image acquisition step S2, a process of acquiring the inspection image IM is performed. Specifically, the inspection image acquisition step S2 has steps s21 to s25 as described below.

  First, the work W on which the chip body C is arranged is held by the work holding unit 2, and the imaging unit 4 is set to be in a state where the chip body C can be imaged (step s21).

  Subsequently, the chip body C is irradiated with the illumination light L1 (step s22), the light L2 reflected or scattered on the surface of the chip body C is imaged by the imaging unit 3 (step s23), and an inspection image is output (step s23). Step s24).

  Then, the inspection image output from the imaging unit 3 is acquired by the computer CN (step s25).

  Next, in processing step S3, the following processing (image processing, arithmetic processing, data processing, etc.) is performed on the inspection image IM. Specifically, the processing step S3 includes a luminance information storage step s31, an effective pixel determination step s32, and an inspection data generation step s32 as described below.

  In the brightness information storage step s31, for each pixel of the inspection image IM, a process of storing the brightness value IB associated with the pixel coordinates (H, V) as brightness information DM is performed.

  In the effective pixel determination step s32, the inspection data XD is generated from any pixel in the inspection area by matching the number of pixels corresponding to the area of the inspection target portion of the chip body with the maximum luminance value in the luminance histogram. Is determined to determine whether the pixel is an effective pixel.

  In the test data generation step s33, a process of generating the test data XD based on the effective pixel information is performed.

  In the inspection step S4, a process of inspecting the chip body C is performed based on the inspection data XD generated in the processing step S3 and a pre-registered criterion.

  Then, it is determined whether to inspect the chip body in another place or to inspect the chip body of another wafer (step S5). If necessary, the chip C to be imaged is changed or the work W is replaced. Then, the above steps S2 and S3 are repeated. On the other hand, if all the inspections have been completed, the wafer W is paid out and a series of steps is completed.

  With such a configuration, the chip device 1 according to the present invention processes the inspection image IM obtained by imaging the chip body (image processing, arithmetic processing, data processing, and the like), and outputs each pixel included in the inspection image IM. It is possible to appropriately determine an effective pixel to be used for inspection from the luminance information DM and generate the inspection data XD. Therefore, the inspection based on the luminance information of the effective pixel (that is, the luminance information included in the inspection data XD generated based on the effective pixel) does not affect the luminance information of the peripheral region B (that is, the non-inspection part). The inspection result can be obtained with desired accuracy.

[Another form]
With the above-described configuration, when the brightness value of the bright portion of the chip body C is higher than that of the dark portion of the peripheral region B, the influence of the luminance information of the peripheral region B (that is, the non-inspection site) is reduced, and the desired accuracy is obtained. Can obtain the inspection result.

  However, when the peripheral area B of the inspection image IM includes a wiring pattern having a higher reflectivity than the chip body C, if the upper 36 pixels from the maximum luminance value are set as effective pixels, the chip body C , The brightness value of the bright portion is not correctly reflected, and a new inspection problem occurs that a desired inspection result cannot be obtained. In order to solve such a problem, when embodying the present invention, when the maximum luminance value exceeds a pre-registered threshold, the effective pixel determination unit 62 exceeds the pre-registered reference value. It is configured to perform a process of not including a pixel having a given luminance value as an effective pixel.

  Specifically, if there is a pixel whose maximum luminance value exceeds 220, the effective pixel determination unit 62 does not treat the luminance value of the pixel as effective luminance (that is, does not include it in the effective pixel), and Are processed as effective pixels for the upper 36 pixels of the luminance of the pixels. Then, the processing unit 6 performs a process of generating the inspection data XD based on the effective pixels.

  By doing so, even if a wiring pattern having a higher reflectance than the chip body C is included, a desired inspection can be performed based on the effective pixels corresponding to the number of pixels with respect to the area of the chip body C, Inspection accuracy can be improved.

[Modification]
In the above description, the effective pixels included in the inspection data XD are the same as the number of pixels corresponding to the area of the inspection target portion of the chip body C on the basis of the maximum luminance value of the pixels in the inspection area R, and are equivalent to the upper 36 pixels of the luminance. The configuration for acquiring (vertical and horizontal 6 × 6) luminance information has been described. With such a configuration, of the 329 pixels (18 × 18) in the inspection image IM, 288 pixels for the dark part are omitted from the effective pixels, so that the influence of the luminance information of the non-inspection part is greatly reduced, and This is preferable because the accuracy of the average luminance value of 36 pixels with respect to the bright portion is improved.

  Focusing on the inspection image IM acquired by the image acquisition unit 5, the pixels that image the outermost periphery of the chip body C become bright parts, dark parts, or have luminance values between them. The value may become unstable. Therefore, when embodying the present invention, the processing unit 6 is not limited to the configuration described above, but may be configured as described below.

  FIG. 5 is a conceptual diagram of an inspection image and effective pixels according to a modification of the embodiment embodying the present invention. FIGS. 5A and 5B show the positional relationship between the chip body C and each pixel in the inspection image IM obtained by imaging the inspection area R, and the range of each effective pixel is shown by a broken line. .

  For example, as shown in FIG. 5A, the number of effective pixels included in the inspection data XD is equal to the number of pixels corresponding to the area of the inspection target portion of the rectangular chip body C (that is, 36 pixels; 6 × 6 in length and width). The number of pixels is lower than the number of pixels, that is, the number of upper 25 pixels (5 × 5).

  In this case, the effective pixel information determination unit 62 preferentially selects a pixel (range indicated by a broken line) obtained by imaging the central portion of the chip body C having a higher luminance value than the peripheral part of the chip body C as an effective pixel. Then, the effective pixel information determination unit 62 acquires the luminance information of the effective pixels of the upper 25 luminance pixels, and processes the acquired luminance information as the effective pixel information in the inspection area R.

  With such a configuration, when the pixel of the inspection image IM extends over both the chip body C (that is, the bright portion) and the peripheral region B (that is, the dark portion) that is the inspection target portion (so-called sub-pixels). Even in the case where there is a position shift), the outermost pixel of the bright portion can be excluded from the valid pixels of the inspection data XD. Therefore, it is not affected by the luminance information of the non-inspection part, and the accuracy of the average luminance value is further improved, and the variance value is reduced, which is preferable in some cases.

  Alternatively, as shown in FIG. 5B, for example, the number of pixels is larger than the number of pixels corresponding to the area of the inspection target portion of the chip body C (that is, 36 pixels; 6 × 6 in length and width). A configuration in which 49 pixels (7 × 7 in length and width) are set as effective pixels may be used.

  In this case, the effective pixel information determination unit 62 gives priority to the pixel that has imaged the central portion of the chip body C and the pixel that has imaged the portion that spans the outermost periphery of the chip body C and the peripheral region B (the range indicated by the broken line). As effective pixels. Then, the effective pixel information determining unit 62 acquires the luminance information of the effective pixels for the 49 upper luminance pixels, and processes the acquired luminance information as the effective pixel information in the inspection area R.

  With such a configuration, even if there is a misalignment of the sub-pixels, the outermost pixel that straddles the bright part and the dark part is processed as an effective pixel of the inspection data XD. Therefore, the outermost pixels of the inspection data XD are not trimmed. In addition, it is possible to eliminate the variation in the average luminance due to the positional deviation of the sub-pixels, and to greatly reduce the influence of the luminance information of the non-inspection part.

In the above description, in the inspection image IM obtained by imaging the rectangular chip body C to be inspected, the inspection area R corresponds to 18 × 18 pixels in the vertical and horizontal directions, and the area of the chip body C corresponds to 36 pixels (6 × 6 in the vertical and horizontal directions). A detailed description has been given by exemplifying a case corresponding to. In this case, the positioning allowable error range (so-called error margin) of the chip body C is ± 6 pixels in both the vertical and horizontal directions.
However, in embodying the present invention, the allowable positioning error range of the chip body C is not limited to the number of pixels described above, and may be set as appropriate based on the magnification of the objective lens, the positioning accuracy of the relative moving unit MT, and the like. good.

  In the above description, the case where the bright portion of the chip body C is rectangular has been described as an example, but the specific shape (rectangular, circular, cross, other shapes) and the vertical and horizontal directions of the pixels constituting the inspection image IM are described. The number of pixels may be appropriately determined according to the size, pitch, and the like.

  In implementing the present invention, the illumination unit 3 and the imaging unit 4 described above are not indispensable components in the chip body inspection apparatus 1, but acquire an inspection image IM captured by an external imaging unit. A configuration for performing the above-described inspection (for example, a configuration including the image acquisition unit 5, the processing unit 6, and the inspection unit 7; a so-called offline method) may be employed. In this case, in the above-described inspection image acquisition step S2, the above-described steps s21 to s24 are not essential elements for embodying the present invention, and the computer CN acquires the inspection image IM previously captured by an external device. (Including step s25).

  In the above description, an example in which the same chip body C is imaged under one imaging condition and the inspection image IM is obtained is illustrated. However, the same chip body C as described in Patent Document 1 is imaged under two imaging conditions. The present invention can also be applied to other forms (inspection of the emission wavelength of the chip body). In this case, the inspection images IM1 and IM2 may be acquired, the effective pixels may be determined according to the above-described configuration and procedure, and the inspection data XD1 and XD2 may be generated. By doing so, it is possible to reduce the influence of the luminance information of the non-inspection site included in the inspection images IM1 and IM2, and obtain an inspection result with desired accuracy.

DESCRIPTION OF SYMBOLS 1 Inspection apparatus of chip body 2 Work holding part 3 Illumination part 4 Imaging part 5 Image acquisition part 6 Processing part 7 Inspection part 20 Work placement table 30 Lens tube 31 Light source 33a, 33b Objective lens 41 Imaging camera 61 Brightness information storage part 62 Effective Pixel information determination unit CN computer MT relative movement unit M1 X-axis stage M2 Y-axis stage M3 θ-axis stage W Work (wafer on which many chip bodies are arranged)
F Field of view R Inspection area C Chip body B Peripheral area IM Inspection image DM Luminance information XD Inspection data

Claims (2)

A chip body inspection apparatus for processing an inspection image obtained by imaging an inspection area including a chip body and a peripheral area thereof and inspecting the chip body,
An inspection image acquisition unit that acquires the inspection image,
A processing unit that generates inspection data from the inspection image,
An inspection unit that inspects the chip body based on the inspection data and a pre-registered criterion,
The processing unit includes:
A luminance information storage unit that stores luminance information for each pixel in the inspection area of the inspection image,
From the luminance information, the luminance information of the luminance upper pixels for the number of pixels corresponding to the area of the inspection target portion of the chip body of the chip body is acquired based on the maximum luminance value, and the acquired luminance information is obtained in the inspection area. Determined as effective pixel information, comprising an effective pixel information determination unit,
An inspection apparatus for a chip body, wherein the inspection data is generated based on the effective pixel information. In the valid pixel determining unit, when the maximum luminance value exceeds a pre-registered threshold value, a pixel having a luminance value exceeding a pre-registered reference value is not included in the effective pixel. An inspection device for a chip body according to claim 1.

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