JP2020045435A - Laser light-curable adhesive composition, optical component, and method of manufacturing optical component - Google Patents

Abstract

To provide a laser light-curable adhesive composition which is excellent in storage stability and adhesiveness and can be rapidly cured by laser light.SOLUTION: A laser light-curable epoxy adhesive composition of the present invention contains a light absorbing component (A), an epoxy resin (B), a polythiol compound (C), a microcapsule type latent curing agent (D), and a boric acid ester compound (E). The epoxy resin (B) has two or more epoxy groups in the molecule. The polythiol compound (C) has two or more thiol groups in the molecule.SELECTED DRAWING: None

Description

  The present invention relates to a laser light-curable adhesive composition, an optical component, and a method for producing an optical component. More specifically, the present invention relates to a laser light-curable adhesive composition that can be cured by laser light, an optical component including a cured product of the laser light-curable adhesive composition, and a method for manufacturing an optical component.

  Conventionally, a laser welding technique has been used for joining between resin materials.

  For example, Patent Document 1 discloses a resin material for laser welding that can be used as a laser beam transmitting side molded body. Patent Literature 2 discloses a latent composition containing, as essential components of an adhesive composition, a cyanate ester resin, an epoxy resin, a modified polyamine having at least one amino group having active hydrogen in the molecule, and a phenolic resin. And the use of a non-functional curing agent.

JP-A-2004-250621 JP 2010-180352 A

  However, in the case of Patent Literature 1, since it largely depends on the light transmission / absorption characteristics of the resin material, sufficient adhesiveness may not be obtained depending on the member configuration. Further, in the case of Patent Document 2, since the cyanate ester, the modified polyamine and the phenol resin are contained, the storage stability of the adhesive composition tends to be poor. Such an adhesive composition having reduced storage stability tends to hardly exhibit sufficient adhesiveness. That is, even with the adhesive composition of Patent Document 2, it is difficult to obtain sufficient storage stability and adhesiveness.

  Therefore, an object of the present invention is to provide a laser light-curable adhesive composition, an optical component, and a method for producing an optical component, which are excellent in storage stability and adhesiveness and enable rapid curing by laser light. It is.

  One embodiment according to the present invention is a laser light-curable adhesive composition that is used to bond the two members by being cured with a laser beam while being interposed between the two members. The laser light-curable adhesive composition comprises a light-absorbing component (A), an epoxy resin (B), a polythiol compound (C), a microcapsule-type latent curing agent (D), and a borate compound. (E). The epoxy resin (B) has two or more epoxy groups in the molecule. The polythiol compound (C) has two or more thiol groups in the molecule.

  One embodiment according to the present invention is an optical component. The optical component is a first member having a light-transmitting property, a second member, and an adhesive interposed between the first member and the second member for bonding the first member and the second member. Unit. The bonding portion is a cured product of the laser light-curable adhesive composition.

  One embodiment according to the present invention is a method for manufacturing an optical component. The manufacturing method includes interposing the laser light-curable adhesive composition between a first member having a light-transmitting property and a second member. The manufacturing method further includes bonding the first member and the second member by curing the laser light-curable adhesive composition by irradiating a laser beam to form an adhesive portion.

  ADVANTAGE OF THE INVENTION According to this invention, the storage stability and adhesiveness are excellent, and the laser beam curable adhesive composition which can be rapidly hardened by a laser beam, an optical component, and the manufacturing method of an optical component can be provided.

FIG. 1 is a sectional view schematically showing an example of an optical component according to an embodiment of the present invention. FIG. 2 is a conceptual diagram schematically illustrating an example of a method for manufacturing an optical component according to an embodiment of the present invention.

Hereinafter, embodiments for implementing the present invention will be described.
<Laser curable epoxy adhesive composition>
First, a laser light-curable epoxy adhesive composition (hereinafter, referred to as composition 1) according to one embodiment will be described.

  Composition 1 comprises a light-absorbing component (A), an epoxy resin (B), a polythiol compound (C), a microcapsule-type latent curing agent (D), and a borate ester compound (E). contains.

  The light absorbing component (A) absorbs the light component of the laser light and generates heat. The light-absorbing component (A) only needs to be capable of generating heat upon irradiation with a laser beam, and the specific mode of the light-absorbing component (A) is not particularly limited. The light absorbing component (A) contains, for example, a black light absorbing component. In this case, the light-absorbing component (A) can absorb a wide range of light components of the laser light.

  When the light absorbing component (A) contains a black light absorbing component (A1), examples of the light absorbing component (A1) include titanium black, carbon black, aniline black, anthraquinone-based black pigment, and perylene-based pigment. Black pigments and mixtures of methine dyes and anthraquinone dyes are exemplified. Of these, one or more components may be used, but carbon black is more preferred.

  When the light-absorbing component (A) contains a mixture of a methine dye and an anthraquinone dye, for example, KAYASET BLACK G manufactured by Nippon Kayaku Co., Ltd. may be mentioned as the mixture.

  The epoxy resin (B) is a resin having two or more epoxy groups in a molecule. The epoxy resin (B) enables the composition 1 to be cured. Thereby, adhesiveness can be improved. Examples of the epoxy resin (B) include bisphenol A type epoxy resin, bisphenol F type epoxy resin, biphenyl type epoxy resin, o-cresol novolak type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene ring-containing epoxy resin, and alicyclic ring. Examples include a formula epoxy resin, a bromo-containing epoxy resin, a hydrogenated epoxy resin thereof, and a flexible epoxy resin. Of these, one or two or more can be used. The bisphenol A type epoxy resin is, for example, a liquid bisphenol A type epoxy resin. The flexible epoxy resin is a liquid epoxy resin containing a flexible skeleton. Examples of the flexible skeleton include a polypropylene glycol skeleton and a long hydrocarbon chain skeleton. Examples of the liquid flexible epoxy resin include Epicron EXA-4850-150 and Epicron EXA-4850-1000 manufactured by DIC Corporation. Here, "liquid" means that the mode of the epoxy resin at room temperature is a liquid.

  The polythiol compound (C) is a compound having two or more thiol groups in a molecule. Examples of the polythiol compound (C) include trimethylolpropane tris (thioglycolate), pentaerythritol tetrakis (thioglycolate), ethylene glycol dithioglycolate, trimethylolpropane tris (β-thiopropionate), and pentaerythritol Tetrakis (β-thiopropionate), dipentaerythritol hexakis (β-thiopropionate); thiol compound which is an ester compound of polyol and mercapto organic acid; 1,4-butanedithiol, 1,6-hexane Alkylpolythiol compounds such as dithiol and 1,10-decanedithiol; polyether compounds having thiol groups at both ends; polythioethers having thiol groups at both ends; products of epoxy compounds and hydrogen sulfide Thiol compounds; a product of and polythiol compound and an epoxy compound, a thiol compound having a thiol group at both ends thereof. One or more of these may be used.

  When the polythiol compound (C) contains a thiol compound (C1) which is an ester compound of a polyol and a mercapto organic acid, the polyol is a compound having two or more hydroxyl groups in the molecule. A mercapto organic acid is an organic acid having a mercapto group and a carboxyl group in a molecule. For this reason, an ester reaction occurs between the hydroxyl group of the polyol and the carboxyl group of the mercapto organic acid, whereby the thiol compound (C1) is obtained. Examples of the thiol compound (C1) include pentaerythritol tetrakis (3-mercaptopropionate), trimethylolpropane tris (3-mercaptopropionate), tetraethylene glycol bis (3-mercaptopropionate), and dipentane Erythritol hexakis (β-thiopropionate).

  When the polythiol compound (C) contains a polyether compound (C2) having thiol groups at both ends, the polyether compound (C2) may be a liquid polyether compound. Here, “liquid” means that the embodiment of the polyether compound at room temperature is liquid. Examples of the polythiol compound (C2) include polythiol QE-340M manufactured by Toray Fine Chemical Co., Ltd.

  The microcapsule-type latent curing agent (D) is a particulate component. The particles of the microcapsule-type latent curing agent (D) include a shell constituting the outer shell thereof, and a core surrounded by the shell. There is a curing agent in the core. The shell part is broken by the heat generated by the light-absorbing component (A) at the time of laser light irradiation, and the curing agent is eluted into the composition 1, whereby the curing agent is activated. Thereby, the composition 1 is cured. Particularly, in the composition 1 which has been irradiated with the laser beam, the shell portion is broken because the composition is heated rapidly. Therefore, the dissolution rate of the curing agent into the composition 1 can be increased, and the composition 1 can be rapidly cured. The shell part is made of, for example, polyurethane.

  Examples of the curing agent include an amine-based curing agent.

  When the curing agent is an amine-based curing agent, examples of the microcapsule-type latent curing agent (D) include NOVACURE HX-3722, HX-3748, HX-3088, and HX-3741, manufactured by Asahi Kasei Corporation. HX-3742.

  In addition, when the composition 1 contains the borate ester compound (E), the storage stability of the composition 1 can be improved. The reason is that when the curing agent elutes from a part of the microcapsule-type latent curing agent (D) in the composition 1 before the laser beam irradiation, the curing agent is neutralized with the borate compound (E). Can be considered.

  The borate ester compound (E) is an ester compound of boric acid and a compound having a hydroxyl group. The borate compound (E) may have a hydroxyl group derived from boric acid, or may be a component in which all of the hydroxyl groups of boric acid are esterified. Examples of the borate compound (E) include triethyl borate, tripropyl borate, triisopropyl borate, tributyl borate, triphenyl borate, trihexyl borate, tricyclohexyl borate, trioctyl borate, and trioctyl borate. Isooctyl, and tridecyl borate. One or more of these may be used.

  As described above, the composition 1 contains the light-absorbing component (A), the epoxy resin (B), the polythiol compound (C), and the microcapsule-type latent curing agent (D). 1 is a composition having a property of being cured by irradiation with laser light. When the composition 1 is interposed between the two members 10 and 20 as shown in FIG. 2, the composition 1 is cured by a laser beam to become the bonding portion 4. The bonding portion 4 bonds the members 10 and 20 (for example, see FIG. 1). Composition 1 cures rapidly with laser light. In this case, it is not necessary to heat the entirety of the members 10 and 20, so that the members 10 and 20 can be hardly deformed when the composition 1 is cured. In addition, since the composition 1 is irradiated with laser light only at a certain position, and the composition 1 is rapidly cured by the irradiation of the laser light, the members 10 and 20 are deformed even if heat is generated by the laser light. Can be difficult.

  The amount of the light absorbing component (A) is preferably in the range of 0.01 to 5.0 parts by mass with respect to 100 parts by mass of the laser light curable adhesive composition. In this case, the composition 1 that has been irradiated with the laser beam can be rapidly heated. Thereby, the composition 1 can be rapidly cured. The amount of the light absorbing component (A) is more preferably in the range of 0.1 to 4.5 parts by mass. The amount of the light absorbing component (A) is particularly preferably in the range from 1.0 to 4.0 parts by mass.

  The ratio between the equivalent of the epoxy group of the epoxy resin (B) and the equivalent of the thiol group of the polythiol compound (C) is preferably in the range of 1: 0.2 to 1.2. In other words, the equivalent of the thiol group of the polythiol compound (C) is preferably in the range of 0.2 to 1.2 when the equivalent of the epoxy group of the epoxy resin (B) is 1. In this case, the composition 1 can be rapidly cured while causing a reaction between the epoxy resin (B) and the polythiol compound (C) at the time of laser light irradiation. Moreover, good adhesiveness can be obtained. The ratio of the equivalent of the epoxy group of the epoxy resin (B) to the equivalent of the thiol group of the polythiol compound (C) is more preferably in the range of 1: 0.3 to 1.2. The ratio of the equivalent of the epoxy group of the epoxy resin (B) to the equivalent of the thiol group of the polythiol compound (C) is particularly preferably in the range of 1: 0.7 to 1.1.

  Further, the total amount of the epoxy resin (B) and the polythiol compound (C) is preferably in the range of 50.0 to 95.0 parts by mass with respect to 100 parts by mass of the laser-curable adhesive composition. . In this case, the composition 1 can be rapidly cured while causing a reaction between the epoxy resin (B) and the polythiol compound (C) at the time of laser light irradiation. Moreover, good adhesiveness can be obtained. The amount of the polythiol compound (C) is more preferably in the range of 60.0 to 95.0 parts by mass. The amount of the polythiol compound (C) is particularly preferably in the range of 70.0 to 90.0 parts by mass.

  The amount of the microcapsule-type latent curing agent (D) is preferably in the range of 0.1 to 50.0 parts by mass with respect to 100 parts by mass of the epoxy resin (B). In this case, since the shell part is broken at the time of laser light irradiation, the composition 1 can be rapidly cured. Moreover, good adhesiveness can be obtained. The amount of the microcapsule-type latent curing agent (D) is more preferably in the range of 1.0 to 40.0 parts by mass. The amount of the microcapsule-type latent curing agent (D) is particularly preferably in the range of 5.0 to 30.0 parts by mass.

  The amount of the borate compound (E) is preferably in the range of 0.01 to 3.0 parts by mass with respect to 100 parts by mass of the laser-curable adhesive composition. In this case, it is possible to improve the storage judgment property of the composition 1 before the laser light irradiation. The amount of the borate compound (E) is more preferably in the range of 0.1 to 2 parts by mass. The amount of the borate ester compound (E) is particularly preferably in the range of 0.3 to 1.5 parts by mass.

  In addition, the composition 1 can further contain any additive such as an inorganic filler, an antioxidant, an antifoaming agent, a flame retardant, and a reactive diluent, as long as the effects of the present embodiment can be exerted.

  In preparing the composition 1, the components constituting the composition 1 are kneaded by a kneading method using an arbitrary kneading machine such as a three-roll mill, a ball mill, a sand mill, and a planetary mixer. 1 can be prepared. The composition 1 thus prepared has excellent storage stability and adhesiveness, and enables rapid curing by laser light.

<Optical parts>
Next, an optical component 5 according to one embodiment will be described with reference to FIG. The optical component 5 includes a first member 10 having a light-transmitting property, a second member 20, and the bonding unit 4. The bonding portion 4 is a cured product of the composition 1. As described above, since the optical component 5 includes the cured product of the composition 1, the present embodiment can refer to the description of the composition 1.

  The first member 10 is a member having a light transmitting property. Examples of the constituent material of the first member 10 include an inorganic material such as glass; and a resin material such as polyphenylene sulfide (PPS), polybutylene terephthalate (PBT), and liquid crystal polymer (LCP).

  When the optical component 5 is applied to a camera module, an example of the first member 10 is a lens. Further, the first member 10 is not limited to a lens, and the first member 10 may be applied as a translucent member in a camera module. Further, the first member 10 may be made of the same material as the second member 20, or may be made of a material different from the second member 20.

  The second member 20 is, for example, a member that supports the first member 10. Further, the second member 20 may have translucency or may be opaque. Even if the second member 20 is a light-transmitting member, the first member 10 and the second member 20 are bonded by the bonding portion 4 because the composition 1 contains the light-absorbing component (A). Can be. Examples of the constituent material of the second member 20 include inorganic materials such as metal, ceramics, and glass; and resin materials such as polyphenylene sulfide (PPS), polybutylene terephthalate (PBT), and liquid crystal polymer (LCP). Can be

  The bonding portion 4 is interposed between the first member 10 and the second member 20, and bonds the first member 10 and the second member 20. The thickness and the like of the bonding portion 4 can be arbitrarily adjusted.

  In addition, the optical component 5 can include various members other than the first member 10, the second member 20, and the bonding portion 4.

  The optical component 5 can be employed in, for example, optical devices such as a camera for a smartphone, a camera for a vehicle, a microscope, and a telescope; and a smartphone, a tablet-type terminal, and an electronic device for a vehicle if the purpose can be achieved.

<Production method of optical parts>
Next, a method for manufacturing an optical component according to one embodiment will be described with reference to FIG.

  The manufacturing method is a method for manufacturing the optical member 5. For this reason, in the present embodiment, the description of the optical member 5 and the composition 1 can be referred to.

  The manufacturing method includes an arrangement step and an adhesion step.

  The disposing step is a step of disposing the composition 1 so as to be interposed between the first member 10 and the second member 20.

  In disposing the composition 1, the composition 1 is applied to one of the first member 10 and the second member 20. Then, the other member is arranged so as to cover the applied composition 1. In this case, the composition 1 is in contact with the first member 10 and the second member 20. The application amount of the composition 1 may be arbitrarily adjusted as long as the first member 10 and the second member 20 are hardly deformed at the time of curing and the first member 10 and the second member 20 can be adhered after the curing.

  After the composition 1 is placed, a bonding step is performed.

  The bonding step is a step of bonding the first member 10 and the second member 20 by curing the composition 1 by irradiation with the laser beam 31.

  When the composition 1 is cured, the laser head 30 is disposed above the composition 1, and the composition 1 is irradiated with the laser beam 31 from the laser head 30 through the first member 10. In the case where the second member 20 has a light transmitting property, the composition 1 may be irradiated with the laser beam 31 transmitted from the second member 20 side. Further, both the first member 10 and the second member 20 may have translucency. In this case, the composition 1 may be irradiated with the laser beam 31 through at least one of the first member 10 and the second member 20.

  In the bonding step, the composition 1 may be irradiated with the laser light 31 while fixing the laser head 30, or the composition 1 may be irradiated with the laser light 31 by moving the laser head 30.

During the bonding step, it is preferable to perform the irradiation of the laser beam 31 until the curing rate of the bonding portion 4 becomes 95% or more. When the curing rate is 95% or more, the composition 1 is less likely to remain in the bonding portion 4, so that the adhesiveness and wet heat resistance of the bonding portion 4 can be improved. For this reason, when the bonding part 4 is formed in a frame shape along the outer peripheral edge of the first member 10, moisture and the like hardly permeate between the first member 10 and the second member 20. The curing rate of the bonding portion 4 is calculated from the following equation (1) using the calorific value measured by a DSC (differential scanning calorimetry) device.
Curing rate (%) = (H 2 _O −H _t ) / H 2 _O × 100 (1)
In the formula (1), H 2 _O is a calorific value when the composition 1 before curing is measured by DSC. _Ht is a calorific value when the cured product after laser irradiation is measured by the same method.

  The wavelength of the laser beam 31 can be arbitrarily set according to the absorption wavelength of the light absorbing component (A). The wavelength of the laser light 31 is, for example, in the range of 780 to 1600 nm. A specific example of the wavelength of the laser light 31 is 1064 nm.

  According to the above manufacturing method, the composition 1 having excellent storage stability and adhesiveness can be rapidly cured by the laser beam 31.

  Hereinafter, the present invention will be described specifically with reference to Examples. However, the following examples are merely examples of the present invention and do not limit the scope of the present invention.

<Ingredients>
First, in performing each of Example 1-8 and Comparative Example 1-4, the following components were used.
・ Light absorbing component (A)
(A1): Carbon black <Mitsubishi Carbon Black MA220 (trade name) manufactured by Mitsubishi Chemical Corporation>
(A2): Mixture of methine dye and anthraquinone dye <KAYASET BLACK G (trade name) manufactured by Nippon Kayaku Co., Ltd.>
・ Epoxy resin (B)
(B1): Liquid bisphenol A type epoxy resin <jER828 (trade name) manufactured by Mitsubishi Chemical Corporation> (epoxy equivalent 190)
(B2): Liquid flexible epoxy resin <EPICLON EXA-4850-150 (trade name) manufactured by DIC Corporation> (epoxy equivalent 450)
・ Polythiol compound (C)
(C1): Ester polythiol <PEMP (trade name) manufactured by SC Organic Chemical Co., Ltd.> (SH equivalent: 131)
(C2): Ether-based polythiol <Polythiol QE-340M (trade name) manufactured by Toray Fine Chemical Co., Ltd.> (SH equivalent 250)
・ Cyanate ester compound (C ′)
(C'1): Cyanate ester resin <Cyanate LeCy (trade name) manufactured by Lonza>
・ Microcapsule type latent curing agent (D)
(D1): a microcapsule containing an amine-based curing agent inside <Novacure HX-3722 (trade name) manufactured by Asahi Kasei Corporation) (epoxy equivalent 114)
・ Amine adduct compound (D ')
(D'1): solid dispersion type latent curing agent <AMICURE PN-23 (trade name) manufactured by Ajinomoto Fine Techno Co., Ltd.>
.Borate ester compound (E)
(E1): Triisopropyl borate <manufactured by Tokyo Chemical Industry Co., Ltd.>.

[Example 1-8 and Comparative Example 1-4]
The components were added to the planetary mixer in the amounts shown in Tables 1 and 2 below, and were sufficiently stirred and mixed until the components were uniformly dispersed. The mixture thus obtained was used as a laser light-curable adhesive composition.

[Evaluation]
｛Storage stability test｝
80 g of each of the laser light-curable adhesive compositions 1 of Example 1-8 and Comparative Example 1-4 was placed in a plastic sample bottle having a capacity of 100 cc. Then, the composition was allowed to stand in a thermostat set at a temperature of 25 ° C., and the viscosity of the composition was measured with a BM-type rotational viscometer every day. Based on the measurement results, the storage stability of each of Example 1-8 and Comparative Example 1-4 was evaluated according to the following items.
・ 〇: The number of days until the viscosity is doubled compared to immediately after production is 7 days or more. △: The number of days until the viscosity is doubled compared to immediately after production is 3 days or more and less than 7 days. C: The number of days until the viscosity doubles as compared to immediately after production is less than 3 days

｛Adhesion test｝
As shown in FIG. 1, a part (tip portion) of a coating surface of a second member (length 70 mm × width 20 mm × thickness 1 mm) 20 made of PPS (polyphenylene sulphite) is applied to Examples 1-8 and Comparative Examples. 10 mg of each laser light-curable adhesive composition 1 of 1-4 was applied. After that, a first member (length 70 mm × width 20 mm × thickness 1 mm) 10 made of PBT (polybutylene terephthalate) having a light transmitting property was arranged on the applied composition 1. After the arrangement of the first member 10, the first member 10 and the second member 20 were overlapped with a length of 20 mm. Thereafter, the first member 10 and the second member 20 were adhered by irradiating a laser beam from the first member 10 side using "VL-W1" manufactured by Panasonic SUNX. Laser irradiation conditions were as follows: laser beam wavelength was 1064 nm, output intensity was 10 W, laser beam diameter was 1 mm, and irradiation time was 2 seconds. The tensile shear strength of each of the test pieces of Example 1-8 and Comparative Example 1-4 thus produced was measured by an autograph. Based on the measurement results, the adhesiveness of each of Example 1-8 and Comparative Example 1-4 was evaluated according to the following items.
・ ○: Tensile shear strength is 15 MPa or more ・ △: Tensile shear strength is 5 or more and less than 15 MPa ・ ×: Tensile shear strength is less than 5 MPa

｛Curing rate｝
Each laser light-curable adhesive composition (10 mg) of Example 1-8 and Comparative Example 1-4 was prepared. The composition was irradiated with a laser beam using “VL-W1” manufactured by Panasonic SUNX under the irradiation conditions of a wavelength of 1064 nm, an output intensity of 10 W, a diameter of 1 mm, and an irradiation time of 2 seconds. Was. Thereby, each composition of Example 1-8 and Comparative Example 1-4 was cured. The calorific value was measured by a DSC (differential scanning calorimetry) device using the laser light-curable adhesive composition before curing and the cured product cured by laser irradiation. Then, the respective curing rates of Example 1-8 and Comparative Example 1-4 were calculated from the following equation (1).
Curing rate (%) = (H 2 _O −H _t ) / H 2 _O × 100 (1)
In the formula (1), H 2 _O is the calorific value of the laser light-curable adhesive composition before curing. _Ht is the calorific value of the cured product after laser irradiation.
And each hardening rate of Example 1-8 and Comparative Example 1-4 was evaluated according to the following items.
○: 95% or more. Δ: 85% or more and less than 90%. ×: Less than 85%.

(Summary)
As described above, the first aspect is used for bonding the two members [10, 20] by curing with the laser beam (31) while being interposed between the two members [10, 20]. Laser light curable adhesive composition [1]. The laser light-curable adhesive composition [1] comprises a light-absorbing component (A), an epoxy resin (B) having two or more epoxy groups in a molecule, a polythiol compound (C), and a microcapsule-type latent resin. A curable curing agent (D) and a borate compound (E). The epoxy resin (B) has two or more epoxy groups in the molecule. The polythiol compound (C) has two or more thiol groups in the molecule.

  According to the first aspect, it is possible to provide a laser light-curable adhesive composition [1] which has excellent storage stability and adhesiveness and enables rapid curing by laser light [31].

  A second aspect is the laser light-curable adhesive composition [1] of the first aspect, wherein the light-absorbing component (A) contains carbon black.

  According to the second aspect, since the light component of the laser light [31] having a wide wavelength can be absorbed, the laser light-curable adhesive composition [1] can be rapidly cured by the laser light [31].

  A third aspect is the laser light-curable adhesive composition [1] of the first or second aspect, wherein the polythiol compound (C) is a polythiol compound obtained by an esterification reaction between a polyol and a mercapto organic acid. contains.

  According to the third aspect, the thiol compound reacts with the epoxy resin (B) in an environment where the light-absorbing component (A) absorbs the light component of the laser beam [31] and generates heat. The adhesive composition [1] can be rapidly cured by the laser beam [31].

  A fourth aspect is the laser light-curable adhesive composition [1] according to any one of the first to third aspects, wherein the equivalent of the epoxy group of the epoxy resin (B) and the thiol of the polythiol compound (C) are used. The ratio of the group to the equivalent weight is in the range of 1: 0.2 to 1.2.

  According to the fourth aspect, the polythiol compound (C) sufficiently reacts with the epoxy resin (B) in an environment in which the light absorbing component (A) generates heat, so that the laser light-curable adhesive composition [1] Can be quickly cured with a laser beam [31].

  A fifth aspect is an optical component [5], which includes a first member [10] having a light transmitting property, a second member [20], and an adhesive portion [4]. The bonding portion [4] is interposed between the first member [10] and the second member [20], and bonds the first member [10] and the second member [20]. The bonding part [4] is a cured product of the laser light-curable adhesive composition [1] according to any one of the first to fourth aspects.

  According to the fifth aspect, at the time of producing the optical component [5], the laser light-curable adhesive composition [1] which has excellent storage stability and adhesiveness and enables rapid curing by laser light can be used. .

  A sixth aspect is a method for manufacturing an optical component [5], wherein any one of the first to fourth aspects is provided between a first member [10] having translucency and a second member [20]. The method includes interposing one laser light-curable adhesive composition [1]. The manufacturing method according to the sixth aspect is that the laser beam-curable adhesive composition [1] is cured by irradiation with a laser beam [31] to form an adhesive portion [4], so that the first member [10] and the first member [10] The method further includes bonding the two members [20].

  According to the sixth aspect, a laser light-curable adhesive composition [1] having excellent storage stability and adhesiveness and capable of being rapidly cured by laser light can be used.

Reference Signs List 1 laser light-curable adhesive composition 10 member (first member)
20 members (second member)
Reference Signs List 30 laser head 31 laser beam 4 bonding part 5 optical member

Claims (6)

A laser light-curable adhesive composition used to bond the two members by curing with a laser beam while being interposed between the two members,
A light absorbing component (A);
An epoxy resin (B) having two or more epoxy groups in the molecule,
A polythiol compound (C) having two or more thiol groups in the molecule,
A microcapsule-type latent curing agent (D),
A borate compound (E);
Containing,
Laser light curable adhesive composition. The light absorbing component (A) contains carbon black,
The laser light-curable adhesive composition according to claim 1. The polythiol compound (C) contains a thiol compound obtained by an esterification reaction between a polyol and a mercapto organic acid,
The laser light-curable adhesive composition according to claim 1. The ratio of the equivalent of the epoxy group of the epoxy resin (B) to the equivalent of the thiol group of the polythiol compound (C) is in the range of 1: 0.2 to 1.2.
The laser light-curable adhesive composition according to claim 1. A first member having translucency;
A second member;
An adhesive portion interposed between the first member and the second member, for bonding the first member and the second member;
With
The bonding portion is a cured product of the laser light-curable adhesive composition according to any one of claims 1 to 4,
Optical components. A first member having a light-transmitting property, and the laser-curable adhesive composition according to any one of claims 1 to 4, interposed between the second member,
By bonding the first member and the second member by curing the laser light-curable adhesive composition by irradiation with laser light to form an adhesive portion,
And a method for producing an optical component.

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