JP2020042954A - Light emission device - Google Patents

Abstract

To provide a light emission device which can attain high safety.SOLUTION: A light emission device 1 includes: a circuit board 4 on which a light source 3 is mounted; a cover 5; and a heat radiation part 9 which is provided at the back surface side of the circuit board 4 and radiates heat of the circuit board 4. The back surface side of the heat radiation part 9 is provided with a cover part 10 which is made of a material having heat conductivity lower than the heat radiation part 9 and covers a part of an outer surface of the heat radiation part 9. Since the part of the outer surface of the heat radiation part 9 is covered with the cover part 10, a user does not contact with the heat radiation part 9 and thus high safety can be secured.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a light emitting device including a semiconductor light emitting element that emits light.

  2. Description of the Related Art In recent years, in a light emitting device that emits light such as a vehicle headlight, an outdoor lighting lamp, and a sterilizing device, a semiconductor light emitting element (for example, LED or It has been proposed to use LD) as a light source.

  The semiconductor light emitting device has many advantages such as long life and instantaneous lighting, but also has a problem that the light conversion efficiency is reduced due to a rise in temperature and the life is shortened. Therefore, when driving the semiconductor light emitting device with a large power (large current) in order to increase the output of the light emitting device, it is necessary to reduce the light exchange efficiency and the life due to self-heating when the semiconductor light emitting device is turned on. In order to prevent this, it is necessary to radiate heat from the semiconductor light emitting device.

  Generally, the heat of the semiconductor light emitting device is radiated into the air by using a heat radiating device such as a heat sink, a heat sink, a fan, or a liquid cooling system.

  For example, in a light emitting device (lamp) described in Patent Literature 1, a mounting base member including a semiconductor light emitting element on a front side is provided, the mounting base member includes a heat mass portion as a heat radiating portion, and the heat mass portion includes a heat mass. A heat mass cover that covers the exposed portion of the portion, has electrical insulation properties, and has lower thermal conductivity than the heat mass portion.

JP 2014-032972 A

  In the light emitting device described in Patent Literature 1, a rise in the surface temperature of the device is suppressed by covering the radiator with a cover. However, the cover is exposed to the outside of the radiator to dissipate heat (radiation). Since the entire portion (exposed portion of the portion) is covered, heat is not dissipated by the heat radiating portion, and there is a problem that the heat radiation performance of the semiconductor light emitting element is poor and safety is low.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a light emitting device that can achieve high security.

  The light emitting device of the present invention is a light source having a semiconductor light emitting element that emits light, a circuit board on which the light source is mounted, and a radiator that contacts the circuit board and dissipates heat of the light source; And a covering portion that covers a part of the outer surface of the heat radiating portion.

  In the present invention, since the covering portion that covers a part of the outer surface of the heat radiating portion has lower thermal conductivity than the heat radiating portion, even if heat is transferred from the heat radiating portion to the covering portion, the covering portion is compared with the heat radiating portion. Temperature does not rise. Furthermore, since the covering portion covers a part of the outer surface of the heat radiating portion, that is, a part of the outer surface of the heat radiating portion is exposed, and the heat is reliably radiated by the exposed portion of the heat radiating portion. be able to. Thereby, high security can be obtained.

  In addition, the covering portion covers a part of an outer surface of the heat radiating portion, and a low thermal conductivity body having a lower thermal conductivity than the heat radiating portion, and is provided outside the low thermal conductivity body, and And a housing portion for housing the low thermal conductivity body between the outer surface and the outer side surface.

  According to this configuration, since the low thermal conductivity member accommodated in the accommodation portion covers a part of the outer surface of the heat radiating portion, the heat of the light source (semiconductor light emitting element) is not easily transmitted to the surface of the accommodation portion (covering portion). can do. Thereby, overheating of the surface of the covering portion can be prevented.

  Further, it is preferable that the low thermal conductivity body is at least one of a heat insulating material and air.

  According to this configuration, it is possible to suppress an increase in the surface temperature of the covering portion with an inexpensive configuration.

  Preferably, the cover has a window structure that can be opened and closed.

  When the covering portion covers a part of the outer surface of the heat radiating portion, a part of the outer surface of the heat radiating portion is exposed. According to the above configuration, since the covering portion has a window structure that can be opened and closed, it is normally opened by the window structure while covering the exposed portion of the outer surface of the heat radiating portion when closed by the window structure. In some cases, by exposing a part of the outer surface of the heat radiating portion, the heat radiating portion can efficiently radiate heat. Further, when the user of the device touches the covering portion and is closed by the window structure, the exposed portion of the heat radiating portion is covered, so that the user does not directly touch the heat radiating portion, and high safety is obtained. be able to.

  Further, it is preferable that the covering portion is configured to protrude from an outer surface of the heat radiating portion with an elastic body and to be deformed by pressing.

  When the covering portion covers a part of the outer surface of the heat radiating portion, a part of the outer surface of the heat radiating portion is exposed. According to the above configuration, while covering the exposed portion of the outer surface of the heat radiating portion when the covering portion is deformed by pressing by the user, the covering portion is normally not deformed when the covering portion is not deformed. By exposing a part of the outer side surface, the heat radiation by the heat radiation unit can be efficiently performed. Furthermore, when the user of the device presses the covering portion and the covering portion is deformed, the exposed portion of the heat radiating portion is covered, so that the user does not directly touch the heat radiating portion, and high safety is obtained. be able to.

  Further, it is preferable that the radiator has a cooling channel for cooling the semiconductor light emitting element.

  According to this configuration, by flowing a medium such as water through the cooling channel, heat generation of the semiconductor light emitting element can be suppressed, and the amount of heat transferred to the surface of the device can be reduced.

  Further, it is preferable that the covering portion has air permeability.

  According to this configuration, since the covering portion has air permeability, heat from the heat radiating portion is transmitted from the ventilation portion of the covering portion to the outside of the covering portion (device) as compared with the case where the covering portion does not have air permeability. Can be reliably dissipated. Thereby, the heat of the light source can be reliably dissipated.

  Further, it is preferable that the covering portion has a mesh structure or a slit structure.

  According to this configuration, the covering portion can have a simple structure and air permeability regardless of the material forming the covering portion.

FIG. 1 is an overall perspective view of a light emitting device according to a first embodiment of the present invention. FIG. 2 is a sectional view taken along line II-II of the light emitting device of FIG. 1. 2 shows data indicating the temperatures of the respective parts when light is emitted by using the light emitting device of FIG. 1 and when light is emitted by a light emitting device having no coating. FIG. 6 is a longitudinal sectional view of a light emitting device according to a second embodiment of the present invention. FIG. 9 is a longitudinal sectional view of a light emitting device according to a third embodiment of the present invention. FIG. 14 is a longitudinal sectional view of a light emitting device according to a fourth embodiment of the present invention. The back side perspective view showing the radiation part and the open covering part of the light emitting device of a 5th embodiment of the present invention. The back side perspective view showing the radiation part and the covering part of the closed state of the light emitting device of a 5th embodiment of the present invention. FIG. 18 is a rear perspective view showing a heat radiating portion and a coating portion before deformation of a light emitting device according to a sixth embodiment of the present invention. FIG. 18 is a rear perspective view showing a heat radiating portion and a deformed covering portion of the light emitting device according to the sixth embodiment of the present invention. The back side perspective view showing the radiation part and the covering part before deformation of the light emitting device of a 7th embodiment of the present invention. The back side perspective view showing the radiation part and the covering part after modification of the light emitting device of a 7th embodiment of the present invention.

  Hereinafter, each embodiment of the light emitting device of the present invention will be described.

[First Embodiment]
FIG. 1 is an overall perspective view (exploded view) of a light emitting device 1 according to a first embodiment of the present invention. The light emitting device 1 is, for example, a device used as a light projector.

  The light emitting device 1 includes a light source 3 having an LED (Light Emitting Diode), a circuit board 4 on which the light source 3 is mounted, and a cover 5.

  The cover 5 is formed in a box shape with a transparent resin that can transmit light, and covers the light source 3 and the front side of the circuit board 4.

  The light emitting device 1 is provided on the back side of the circuit board 4 and radiates a heat of the circuit board 4, and is provided on the back side of the radiator 9, and the back (outer side) of the radiator 9. And a covering portion 10 for covering a part of the cover. The heat radiating section 9 is attached to the inner surface of the cover 5.

  The cover 10 is provided so as to cover a position corresponding to the circuit board 4 on the outer surface of the heat radiator 9. In addition, when the user of the light emitting device 1 touches the light emitting device 1, the covering portion 10 is preferably provided at a position where the user touches. The position where the covering portion 10 is provided may vary depending on the structure of the device. preferable.

  Next, the details of the light emitting device 1 will be described with reference to FIG.

  FIG. 2 is a cross-sectional view taken along line II-II of the light emitting device 1 of FIG. The light from the light source 3 passes through the cover 5 and is emitted outside the cover 5.

  The circuit board 4 is desirably made of a metal such as copper or aluminum having excellent heat dissipation properties, and is screwed to a heat dissipation section 9 described later. Power supply and heat radiation of the light source 3 are performed through the circuit board 4.

  The circuit board 4 is housed inside the cover 5. The heat of the circuit board 4 is conducted to the heat radiating portion 9 disposed on the back side thereof. In addition, you may make it insert a heat conductive sheet for reducing the contact thermal resistance between members between the cover 5 and the heat radiation part 9.

  The heat radiating portion 9 is a plate material such as aluminum or a heat sink having excellent heat radiating properties. Thus, the heat of the circuit board 4 is radiated by the heat radiating portion 9 to the air around the heat radiating portion 9. The heat radiating section 9 may be cooled by a fan.

  The covering portion 10 covering a part of the outer surface of the heat radiating portion 9 is made of a material (for example, urethane resin) having a lower thermal conductivity than the heat radiating portion 9. Thereby, the heat of the heat radiating portion 9 is transferred to the coating portion 10, but the temperature of the coating portion 10 is lower than that of the heat radiating portion 9.

  Next, a description will be given of heat radiation when the light emitting device 1 configured as described above is driven to emit light.

  First, the light source 3 emits light toward the cover 5 according to a command from a control device (not shown). This light is emitted outside through the transparent cover 5.

  The heat of the circuit board 4 generated when the light source 3 emits light is radiated by the radiator 9 to the air around the radiator 9. Thus, overheating of the light source 3 and the circuit board 4 can be prevented, and failure of the light source 3 and the circuit board 4 due to overheating can be prevented.

  The heat of the heat radiating portion 9 is transferred to the cover 5 while being transferred to the cover 10, and the heat of the circuit board 4 is also transferred to the cover 5.

  The heat conducted to the cover 5 is radiated by being transferred around the cover 5.

[Example]
An experiment (Example 1) for measuring the temperatures of the light source 3 (the circuit board 4), the radiator 9, and the cover 10 when the light is emitted using the light emitting device 1 including the cover 10 of the present embodiment, An experiment for measuring the temperature of a light source (substrate) and a heat radiating unit when light is emitted using a light emitting device that does not include a coating portion and is otherwise configured similarly to the light emitting device 1 (Comparative Example 1) ). The result is shown in FIG.

[Example 1]
In Example 1, the temperature of the light source 3 (circuit board 4) was 84 ° C., the temperature of the heat radiating section 9 was 61 ° C., and the temperature of the covering section 10 was 36 ° C.

[Comparative Example 1]
In Comparative Example 1, the temperature of the light source 3 (circuit board 4) was 84 ° C., and the temperature of the radiator 9 was 62 ° C.

  In the first embodiment using the light emitting device 1 including the covering unit 10, even when light is emitted, the temperature of the covering unit 10 is 36 ° C., and the user of the light emitting device 1 touches the covering unit 10. High security in the case can be obtained.

  On the other hand, in the light emitting device of Comparative Example 1 having no covering portion, when light was emitted, the temperature of the heat radiating portion was 62 ° C.

  As described above, in the light emitting device 1 of the present embodiment, the covering portion 10 is made of a material having a lower thermal conductivity than the heat radiating portion 9, and even if heat is transferred from the heat radiating portion 9 to the covering portion 10, The temperature of the part 10 does not rise as compared with the heat radiating part 9. Thereby, overheating of the covering portion 10 can be prevented, and high safety when a user touches the covering portion 10 can be obtained.

  Further, in the light emitting device 1, since the covering portion 10 covers a part of the outer surface of the heat radiating portion 9, that is, a portion of the outer surface of the heat radiating portion 9 is exposed. The heat dissipating portion can reliably dissipate heat.

  Further, since the heat radiating section 9 is covered with the covering section 10, the heat of the heat radiating section 9 is also transferred to the covering section 10.

[Second embodiment]
FIG. 4 shows a longitudinal sectional view of a central portion of the light emitting device 50 of the second embodiment. The light emitting device 50 includes a housing part 51 that covers a part of the outer surface of the heat radiation part 9. The same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

  As shown in FIG. 4, a recess 51 a for accommodating air (low thermal conductivity body) having lower thermal conductivity than the heat radiating portion 9 is formed between the housing portion 51 and the outer surface of the heat radiating portion 9. The light emitting device 50 includes a circuit board 4 on which the light source 3 is provided and a cover 5, similarly to the light emitting device 1 of the first embodiment.

  In the light emitting device 50, since air having a lower thermal conductivity than the heat radiating portion 9 is accommodated in the concave portion 51 a of the accommodating portion 51, the heat of the light source 3 can be hardly transmitted to the surface of the accommodating portion 51. . Thus, overheating of the surface of the housing 51 can be prevented, and safety when the user of the light emitting device 50 touches the housing 51 can be ensured.

  Further, since air is stored in the concave portion 51a of the storage portion 51, overheating of the surface of the storage portion 51 can be prevented with a low-cost configuration.

  In the second embodiment, the same result as in the first embodiment of the first embodiment was obtained.

  Further, what is accommodated in the recess 51a is not limited to air, but may be any low thermal conductivity body having a lower thermal conductivity than the heat radiating portion 9. For example, an insulating material may be accommodated. Material may be accommodated.

[Third embodiment]
FIG. 5 is a longitudinal sectional view of a central portion of a light emitting device 60 according to the third embodiment. The same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

  The light emitting device 60 includes, for example, a heat radiating portion 61 made of aluminum and a covering portion 62 made of a material (for example, urethane resin) having a lower thermal conductivity than the heat radiating portion 61 and covering the heat radiating portion 61. The light emitting device 60 includes the circuit board 4 on which the light source 3 is provided and the cover 5, similarly to the light emitting device 1 of the first embodiment.

  The heat radiating portion 61 is formed in a tank shape and has, for example, an inlet 61 a for flowing cooling water into the heat radiating portion 61 and an outlet for flowing cooling water flowing through the cooling flow channel 61 c of the heat radiating portion 61. 61b.

  The covering portion 62 is a part of the outer surface of the heat radiating portion 61 and covers a portion between the inflow port 61a and the outflow port 61b of the radiating portion 61.

  In the light emitting device 60, the light source 3 is cooled by the cooling water flowing from the inflow port 61a and flowing through the cooling channel 61c of the radiator 61. Thus, the amount of heat transferred to the cover 5 can be reduced, and the rise in the surface temperature of the cover 5 can be suppressed.

  In the third embodiment, the same result as in the first embodiment of the first embodiment was obtained.

[Fourth embodiment]
FIG. 6 is a longitudinal sectional view of a central portion of a light emitting device 70 according to the fourth embodiment. The same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

  As shown in FIG. 6, the light emitting device 70 includes a covering portion 71 that covers a part of the outer surface of the heat radiating portion 9. The covering portion 71 is made of a material (for example, urethane resin) having a lower thermal conductivity than the heat radiation portion 9. The light emitting device 70 includes the circuit board 4 on which the light source 3 is provided and the cover 5, similarly to the light emitting device 1 of the first embodiment.

  The covering portion 71 has an opening 71a formed therein and is formed in a mesh shape having air permeability, covers a part of the outer surface of the heat radiating portion 9, and exposes a part of the outer surface of the heat radiating portion 9. Thereby, the heat radiation by the heat radiation unit 9 can be performed more efficiently than in the case where the entire outer surface of the heat radiation unit 9 is covered. The opening 71a is preferably formed in a size that does not allow the operator's finger to enter.

  Since a part of the outer surface of the heat radiating portion 9 is covered with the covering portion 71, the user does not touch the heat radiating portion 9 through the opening 71 a of the covering portion 71, and high safety can be obtained.

  As described above, according to the fourth embodiment, the heat radiation by the heat radiation unit 9 can be secured while obtaining high safety when the user touches the covering unit 71 (light emitting device).

  In the fourth embodiment, as a result of performing the same experiment as the first embodiment of the first embodiment (Example 2), in the second embodiment, the temperature of the light source 3 (circuit board 4) is 83 ° C. The temperature of the heat radiating section 9 was 61 ° C., and the temperature of the covering section 91 was 34 ° C.

  Since the covering portion 71 of the fourth embodiment is formed in a mesh shape having air permeability, the heat radiation efficiency of the heat radiating portion 9 is higher than that of the covering portion 10 of the first embodiment having no air permeability. . Thereby, in Example 2 (the temperature of the coating portion 91 was 34 ° C.), the temperature of the coating portion was lower than in Example 1 (the temperature of the coating portion 10 was 36 ° C.).

  The covering portion 71 is not limited to the mesh shape, and may be any material having air permeability. For example, the cover portion 71 may have air permeability by forming an elongated slit or a round hole in the plate-shaped covering portion. Good. Further, the covering portion 71 may be formed in a size smaller than the heat radiating portion 9, and in this case, it is preferable to form at least a position corresponding to the circuit board 4 on the outer surface of the heat radiating portion 9.

[Fifth Embodiment]
FIG. 7A is a rear perspective view showing the open covering portion 81 and the heat radiating portion 82 of the light emitting device 80 according to the fifth embodiment, and FIG. 7B is a diagram illustrating the closed covering portion 81 and the heat radiating portion 82. FIG. The same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

  As shown in FIGS. 7A and 7B, the heat radiating portion 82 is formed in a rectangular shape, and is made of, for example, aluminum. The covering portion 81 has flexibility and is made of a material (for example, urethane foam) having a lower thermal conductivity than the heat radiation portion 82. The light emitting device 80 includes the circuit board 4 on which the light source 3 is provided and the cover 5 as in the light emitting device 1 of the first embodiment, but is not shown in FIGS. 7A and 7B. Omitted. In the fifth embodiment, the opening of the cover 5 is formed in a rectangular shape so that the rectangular heat radiating portion 82 can be inserted into the cover 5.

  The covering portion 81 covers the outer surface of the heat radiating portion 82, and has a first opening 81a and a second opening 81b.

  The covering portion 81 includes a first opening / closing portion 81c that can be opened and closed between an open position (see FIG. 7A) for opening the first opening portion 81a and a closed position (see FIG. 7B) for closing.

  The covering portion 81 includes a second opening / closing portion 81d that can be opened and closed between an open position (see FIG. 7A) for opening the second opening 81b and a closed position (see FIG. 7B) for closing. With such a configuration, the covering portion 81 has a window structure that can be opened and closed.

  As shown in FIG. 7A, the covering portion 81 normally has the first and second opening / closing portions 81c and 81d at the open positions and the first and second openings 81a and 81b are open, as shown in FIG. 7A. In this state, a part of the outer side surface of 82 is exposed. Thereby, heat radiation by the heat radiation part 82 can be performed efficiently.

  On the other hand, when the user touches the covering portion 81, as shown in FIG. 7B, the first and second opening / closing portions 81c and 81d are closed from the open position to the closed position, and the first and second open / close portions 81c and 81d are closed. The openings 81a and 81b are closed.

  When the first and second openings 81a and 81b are closed, the exposed portion of the outer surface of the heat radiating portion 82 is covered. Thereby, the user does not touch the heat radiating portion 9 through the first and second openings 81a and 81b of the covering portion 81, and high safety can be obtained.

  Here, when the user releases his / her hand from the covering portion 81, the first and second opening / closing portions 81c and 81d return to the original shape from the closed position to the open position, and the first and second opening portions 81a and 81b are moved. It is released, and a part of the outer surface of the heat radiating part 82 is exposed. Thereby, heat radiation by the heat radiation part 82 can be performed efficiently.

  As described above, according to the fifth embodiment, it is possible to secure the heat radiation property of the heat radiation part 82 while obtaining high safety when the user touches the covering part 81 (light emitting device).

  In the fifth embodiment, the same result as in the first embodiment of the first embodiment was obtained.

[Sixth embodiment]
FIG. 8A is a rear perspective view showing the covering portion 91 and the heat radiating portion 92 of the light emitting device 90 according to the sixth embodiment before deformation, and FIG. 8B is a diagram showing the covering portion 91 and the heat radiating portion 92 after deformation. FIG. The same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

  As shown in FIGS. 8A and 8B, the heat radiating portion 92 is formed in a rectangular shape, and is made of, for example, aluminum. The covering portion 91 is made of a material having flexibility and lower thermal conductivity than the heat radiation portion 92 (for example, urethane foam). The light emitting device 90 includes a circuit board 4 on which the light source 3 is disposed and the cover 5 as in the light emitting device 1 of the first embodiment, but is not shown in FIGS. 8A and 8B. are doing. In the sixth embodiment, the cover 5 has a rectangular opening so that the rectangular heat radiating portion 92 can be inserted into the cover 5.

  The covering section 91 includes first to fourth deformable sections 91 a to 91 d that can be deformed, and is attached to the outer surface of the heat radiating section 92. The first to fourth deformed portions 91a to 91d are a non-deformed position (see FIG. 8A) for exposing the gap 93 between adjacent ones, and a deformed position (see FIG. 8B) for shielding a part of the gap 93 by deformation. ). Each of the first to fourth deformed portions 91a to 91d has an opening 91e formed at a central portion, and when deformed, the shape of the opening 91e is also deformed. With such a configuration, the covering unit 91 has a window structure that can be opened and closed (deformed).

  Normally, the first to fourth deformed portions 91a to 91d are located at the non-deformed position and the gap 93 is exposed as shown in FIG. is there. Thereby, heat radiation by the heat radiation part 92 can be performed efficiently.

  On the other hand, when the user touches the first to fourth deformed portions 91a to 91d, as shown in FIG. 8B, the first to fourth deformed portions 91a to 91d are deformed from the non-deformed position to the deformed position. Thus, a part of the gap 93 is shielded.

  When a part of the gap 93 is shielded, a part (most part) of the exposed part of the outer surface of the heat radiation part 92 is covered. In the present embodiment, when the first to fourth deformed portions 91a to 91d are deformed to the deformed positions, the gap 93 has a size in which the user's finger cannot enter. Thereby, the user does not touch the heat radiating portion 92 through the gap 93, and high safety can be obtained.

  Here, when the user releases his / her hand from the first to fourth deformed portions 91a to 91d, the first to fourth deformed portions 91a to 91d are deformed from the deformed position to the non-deformed position (return to the original shape). The gap 93 widens and a part of the outer surface of the heat radiating portion 92 is exposed. Thereby, heat radiation by the heat radiation part 92 can be performed efficiently.

  As described above, according to the sixth embodiment, the heat radiation by the heat radiation unit 92 can be secured while obtaining high safety when the user touches the covering unit 91 (light emitting device).

  In the sixth embodiment, the same result as in the first embodiment of the first embodiment was obtained.

[Seventh embodiment]
FIG. 9A is a rear perspective view showing the covering portion 101 and the heat radiating portion 102 of the light emitting device 100 according to the seventh embodiment before deformation, and FIG. 9B is a diagram illustrating the covering portion 101 and the heat radiating portion 102 after deformation. FIG. The same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

  As shown in FIGS. 9A and 9B, the heat radiation section 102 is formed in a rectangular shape, and is made of, for example, aluminum. The covering portion 101 is made of a material (for example, urethane foam) having elasticity and flexibility and having lower thermal conductivity than the heat radiation portion 102.

  Note that the light emitting device 100 includes a circuit board 4 on which the light source 3 is disposed and a cover 5 as in the light emitting device 1 of the first embodiment, but is not shown in FIGS. 9A and 9B. are doing. In the seventh embodiment, the cover 5 has a rectangular opening so that the rectangular heat radiating portion 102 can be inserted into the cover 5.

  The covering portion 101 includes first to fifth deformable portions 101 a to 101 e that can be deformed, and is attached to an outer surface of the heat radiating portion 102. The first to fifth deformed portions 101a to 101e include a non-deformed position (see FIG. 9A) for exposing the gap 103 between adjacent ones and a deformed position for shielding a part of the gap 103 by deformation (see FIG. 9B). ) Is provided so as to be deformable. With such a configuration, the covering unit 91 has a window structure that can be opened and closed (deformed).

  Normally, the first to fifth deformed portions 101a to 101e are located at the non-deformed position and the gap 103 is exposed as shown in FIG. is there. Thereby, the heat radiation by the heat radiation part 102 can be performed efficiently.

  On the other hand, when the user touches the first to fifth deformed portions 101a to 101e, as shown in FIG. 9B, the first to fifth deformed portions 101a to 101e are deformed from the non-deformed position to the deformed position. Then, a part of the gap 103 is shielded.

  When a part of the gap 103 is shielded, a part (most part) of the exposed part of the outer surface of the heat radiation part 102 is covered. In the present embodiment, when the first to fifth deformation portions 101a to 101e are deformed to the deformation positions, the gap 103 has a size that does not allow the user's finger to enter. Thereby, the user does not touch the heat radiating portion 102 through the gap 103, and high safety can be obtained.

  Here, when the user releases his / her hand from the first to fifth deformed portions 101a to 101e, the first to fifth deformed portions 101a to 101e are deformed from the deformed position to the non-deformed position (return to the original shape). The gap 103 widens and a part of the outer surface of the heat radiating portion 102 is exposed. Thereby, the heat radiation by the heat radiation part 102 can be performed efficiently.

  As described above, according to the seventh embodiment, the heat radiation by the heat radiating unit 102 is also ensured while obtaining high safety when the user touches the first to fifth covering parts 101a to 101e (light emitting devices). can do.

  In the seventh embodiment, the same result as in the first embodiment of the first embodiment was obtained.

  The above-described embodiment is merely an example, and can be appropriately changed depending on the application, and may be implemented by combining the first to seventh embodiments.

  Further, the present invention is not limited to the light projector, but can be implemented as long as it is a light emitting device. May be.

  1, 50, 60, 70, 80, 90, 100: light emitting device, 3: light source, 4: circuit board, 5: cover, 9, 82, 92, 102: heat radiating section, 10, 62, 71, 81, 91, 101: covering portion, 51: housing portion, 61c: cooling channel, 91a to 91d: first to fourth deformed portions, 93, 103: gap, 101a to 101e: first to fifth deformed portions

Claims (8)

A light source having a semiconductor light emitting element that emits light,
A circuit board on which the light source is mounted,
A radiator that contacts the circuit board and dissipates heat of the light source;
A covering portion that covers a part of the outer surface of the heat radiating portion,
A light emitting device comprising: The light emitting device according to claim 1,
The coating portion,
A low thermal conductivity body that covers a part of the outer surface of the heat radiating portion and has a lower thermal conductivity than the heat radiating portion,
An accommodating portion that is provided outside the low thermal conductivity body and accommodates the low thermal conductivity body between the heat radiation portion and an outer surface thereof,
A light emitting device comprising: The light emitting device according to claim 2,
The light emitting device, wherein the low thermal conductivity body is at least one of a heat insulating material and air. The light emitting device according to any one of claims 1 to 3,
The light emitting device, wherein the covering portion has a window structure that can be opened and closed. The light emitting device according to any one of claims 1 to 3,
The light emitting device is characterized in that the covering portion is made of an elastic body and protrudes from an outer surface of the heat radiating portion and is deformed by pressing. The light emitting device according to any one of claims 1 to 5,
The light emitting device, wherein the heat radiating section has a cooling channel for cooling the semiconductor light emitting element. The light emitting device according to any one of claims 1 to 6,
The light emitting device, wherein the covering portion has air permeability. The light emitting device according to claim 7,
The light emitting device according to claim 1, wherein the covering portion has a mesh structure or a slit structure.