JP2020042763A - 計算装置及びPCIe基板 - Google Patents
計算装置及びPCIe基板 Download PDFInfo
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- JP2020042763A JP2020042763A JP2019055340A JP2019055340A JP2020042763A JP 2020042763 A JP2020042763 A JP 2020042763A JP 2019055340 A JP2019055340 A JP 2019055340A JP 2019055340 A JP2019055340 A JP 2019055340A JP 2020042763 A JP2020042763 A JP 2020042763A
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- pcie
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/184—Mounting of motherboards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/189—Power distribution
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
- H01R12/735—Printed circuits including an angle between each other
- H01R12/737—Printed circuits being substantially perpendicular to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
- H05K7/1487—Blade assemblies, e.g. blade cases or inner arrangements within a blade
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
- H05K7/1488—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
- H05K7/1489—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures characterized by the mounting of blades therein, e.g. brackets, rails, trays
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
- H05K7/1488—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
- H05K7/1492—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures having electrical distribution arrangements, e.g. power supply or data communications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/16—Indexing scheme relating to G06F1/16 - G06F1/18
- G06F2200/163—Indexing scheme relating to constructional details of the computer
- G06F2200/1638—Computer housing designed to operate in both desktop and tower orientation
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
11:前側
12:後側
15:第1のGPUモジュール
16:第2のGPUモジュール
17:PCIeカードスロット
18:PCIe基板
19:分電盤
20:ファンモジュール
25、30:気流
31:電源コードコネクター
32:PCIe信号線
200A:サーバGPUシステム
200B:デスクトップGPUシステム
210:ハウジング
211:前側
212:後側
215:第1のGPUモジュール
216:第2のGPUモジュール
217:PCIeカードスロット
218:PCIe基板
219:分電盤(PDB)
220:ファンモジュール
221、222:GPUスロット
224:PCIeスイッチ
226、228:GPUファン
300A:サーバGPUシステム
300B:デスクトップGPUシステム
400:PCIeのトポロジー
401、402、403、404:内部ケーブル
417:PCIeスロット
417A:左PCIeスロット
417B:右PCIeスロット
418、419、420、421:PCIeスイッチ
430:第1グループのI/Oポート
431:第2グループのI/Oポート
500:PCIeのトポロジー
501、502、503、504、505:ボード
517A:第1のPCIeスロット
517B:第2のPCIeスロット
518、520:PCIeスイッチ
540:第1のMUX
541:第2のMUX
600:PCIeのトポロジー
601、602、603、604、605、606:ボード
617A:第1のPCIeスロット
617B:第2のPCIeスロット
618、620:PCIeスイッチ
640:第1の切り替え式容量抵抗回路
641:第2の切り替え式容量抵抗回路
700:PCIeのトポロジー
701、702、703、704、709、710:ボード
705、706、707、708:高速ケーブル
717A:第1のPCIeスロット
717B:第2のPCIeスロット
718、720:PCIeスイッチ
736:第4のSlimSASコネクター
737:第3のSlimSASコネクター
738:第2のSlimSASコネクター
739:第1のSlimSASコネクター
740:第1のスイッチ−SlimSASコネクター
818:PCIe基板
900A:サーバGPUシステム
900B:デスクトップGPUシステム
901、902、903、904:フレーム
912:後側
915:第1のGPUモジュール
916:第2のGPUモジュール
918:PCIe基板
C1:第1の容量
C2:第2の容量
H:ネジ取り付け穴
Claims (10)
- 第1の端と第2の端を有するハウジングと、
前記ハウジングの前記第1の端に設置される複数のファンモジュールと、
前記ハウジングの前側に設置され、前記ハウジング内の第1の位置及び前記第1の位置から180度回転された第2の位置の配置に対応できるように配置され、画像処理ユニットファンを含む複数の画像処理ユニットを取り付けることに用いられる複数の画像処理ユニットスロットを含むPCIe基板と、
を含む計算装置。 - 前記ファンモジュール及び前記PCIe基板の間に収納される分電盤を更に含む請求項1に記載の計算装置。
- 前記PCIe基板は、
前記複数の画像処理ユニットにおける複数の第1の画像処理ユニット及び複数の第2の画像処理ユニットを仕切り、少なくとも1つのPCIeスイッチに接続される少なくとも1つのPCIeスロットを更に含む、
請求項2に記載の計算装置。 - 前記分電盤と前記画像処理ユニットファン、前記第1の画像処理ユニット、前記第2の画像処理ユニット及び前記少なくとも1つのPCIeスロットを接続する複数の電源コードコネクターを更に含む請求項3に記載の計算装置。
- 前記電源コードコネクターは、前記PCIe基板の1つの中心線に向かって、又は前記PCIe基板の外縁に沿って配線される請求項4に記載の計算装置。
- 前記少なくとも1つのPCIeスロットを前記少なくとも1つのPCIeスイッチに接続する複数のPCIe信号線を更に含む請求項3に記載の計算装置。
- 前記PCIe信号線の、前記PCIe基板の前記第2位置での長さは、前記PCIe基板の前記第1位置での長さより短い、請求項6に記載の計算装置。
- ハウジングの前側に設置され、前記ハウジング内の第1の位置及び前記第1の位置から180度回転された第2の位置の配置に対応できるように配置され、画像処理ユニットファンを含む複数の画像処理ユニットを取り付けることに用いられる複数の画像処理ユニットスロットを含むPCIe基板。
- 前記複数の画像処理ユニットにおける複数の第1の画像処理ユニット及び複数の第2の画像処理ユニットを仕切り、少なくとも1つのPCIeスイッチに接続される少なくとも1つのPCIeスロットを更に含む請求項8に記載のPCIe基板。
- 前記少なくとも1つのPCIeスロットを前記少なくとも1つのPCIeスイッチに接続する複数のPCIe信号線を更に含む請求項9に記載の計算装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/124,345 US10595444B1 (en) | 2018-09-07 | 2018-09-07 | Rotatable board configuration to improve cooling |
US16/124,345 | 2018-09-07 |
Publications (2)
Publication Number | Publication Date |
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JP2020042763A true JP2020042763A (ja) | 2020-03-19 |
JP6754461B2 JP6754461B2 (ja) | 2020-09-09 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2019055340A Active JP6754461B2 (ja) | 2018-09-07 | 2019-03-22 | 計算装置及びPCIe基板 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10595444B1 (ja) |
EP (1) | EP3620892B1 (ja) |
JP (1) | JP6754461B2 (ja) |
CN (1) | CN110888498B (ja) |
TW (1) | TWI676885B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111966175A (zh) * | 2020-08-14 | 2020-11-20 | 苏州浪潮智能科技有限公司 | 一种gpu固定结构及其安装方法 |
US20220240408A1 (en) * | 2021-01-22 | 2022-07-28 | Nvidia Corporation | Static data center power balancing and configuration |
US11573615B2 (en) * | 2021-03-05 | 2023-02-07 | Baidu Usa Llc | Rotational power delivery module for servers |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7382616B2 (en) * | 2005-01-21 | 2008-06-03 | Nvidia Corporation | Cooling system for computer hardware |
JP2010251620A (ja) | 2009-04-17 | 2010-11-04 | Sony Corp | 電子機器 |
US9223361B2 (en) * | 2013-01-28 | 2015-12-29 | Origin Pc | Configurable computer housing |
US9144179B2 (en) * | 2013-02-01 | 2015-09-22 | Dell Products, L.P. | System and method for powering multiple electronic devices operating within an immersion cooling vessel |
US9870333B1 (en) | 2014-09-12 | 2018-01-16 | Keysight Technologies, Inc. | Instrumentation chassis including integrated accelerator module |
US9582366B2 (en) * | 2014-11-21 | 2017-02-28 | International Business Machines Corporation | Detecting and sparing of optical PCIE cable channel attached IO drawer |
US10162786B2 (en) | 2014-12-01 | 2018-12-25 | SK Hynix Inc. | Storage node based on PCI express interface |
US9807901B2 (en) * | 2015-03-06 | 2017-10-31 | Facebook, Inc. | Multiple graphics processing unit platform |
CN104657317B (zh) | 2015-03-06 | 2017-12-26 | 北京百度网讯科技有限公司 | 服务器 |
US20170262029A1 (en) * | 2016-03-14 | 2017-09-14 | Intel Corporation | Data storage system with parallel array of dense memory cards and high airflow |
US10387346B2 (en) * | 2016-05-06 | 2019-08-20 | Quanta Computer Inc. | Dynamic PCIE switch reconfiguration mechanism |
US10356934B2 (en) * | 2016-09-30 | 2019-07-16 | Quanta Computer Inc. | Server rack system and bidirectional power inlet |
-
2018
- 2018-09-07 US US16/124,345 patent/US10595444B1/en active Active
- 2018-12-10 TW TW107144381A patent/TWI676885B/zh active
- 2018-12-28 CN CN201811654128.4A patent/CN110888498B/zh active Active
-
2019
- 2019-03-12 EP EP19162172.1A patent/EP3620892B1/en active Active
- 2019-03-22 JP JP2019055340A patent/JP6754461B2/ja active Active
Also Published As
Publication number | Publication date |
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TW202011148A (zh) | 2020-03-16 |
JP6754461B2 (ja) | 2020-09-09 |
US10595444B1 (en) | 2020-03-17 |
EP3620892B1 (en) | 2022-05-11 |
US20200084919A1 (en) | 2020-03-12 |
TWI676885B (zh) | 2019-11-11 |
EP3620892A1 (en) | 2020-03-11 |
CN110888498B (zh) | 2021-08-13 |
CN110888498A (zh) | 2020-03-17 |
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