JP2020041229A - Composite yarn and composite continuous yarn - Google Patents

Abstract

To provide: a soft composite yarn excellent in manufacturability in which a protrusion is hard to be formed by an IC chip on a yarn peripheral surface of the composite yarn; and a composite continuous yarn including the same.SOLUTION: A composite yarn 1 comprises an electrode substrate 2, an IC chip 3, a first conductive yarn 41 and a second conductive yarn 42. The electrode substrate 2 includes a first take-out electrode 21 and a second take-out electrode 22 on a substrate surface 20. The IC chip 3 includes a first electrode 31 and a second electrode 32. The first electrode 31 is electrically connected to the first take-out electrode 21 and the second electrode 32 is electrically connected to the second take-out electrode 22. One end of the first conductive yarn 41 is electrically connected to the first take-out electrode 21 as well as one end of the second conductive yarn 42 is electrically connected to the second take-out electrode 22. A composite continuous yarn 10 is obtained by connecting a plurality of composite yarns 1 to each other seamlessly with or without a non-conductive yarn 50 therebetween.SELECTED DRAWING: Figure 1

Description

  The present invention relates to composite yarns and composite continuous yarns.

  Conventionally, Patent Document 1 discloses a support having a conductive pattern formed at a plurality of locations on the surface of a yarn main body, an IC chip disposed between the conductive patterns, and terminal portions extending on both sides of the IC chip. There has been proposed a composite yarn in which a body is spirally wound around a conductive pattern and adhered and fixed.

JP 2013-189718 A

  However, in the conventional composite yarn, since the IC chip is bonded and fixed to the surface of the yarn main body, a projection by the IC chip is easily formed on the yarn peripheral surface of the composite yarn. In addition, the composite yarn is likely to be hardened by the spirally wound support. In addition, since it is necessary to spirally wind the support around the conductive pattern and fix it by bonding, the productivity of the composite yarn is poor. In particular, when the IC chip is miniaturized, the manufacturability decreases.

  SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and a flexible composite yarn having good manufacturability, in which projections by an IC chip are hardly formed on the yarn peripheral surface of the composite yarn, and a composite continuous yarn including the same. It is intended to provide yarn.

One aspect of the present invention is an electrode substrate having a first extraction electrode and a second extraction electrode on a substrate surface,
An IC chip comprising a first electrode and a second electrode, wherein the first electrode is electrically connected to the first extraction electrode, and the second electrode is electrically connected to the second extraction electrode;
A first conductive yarn having one end electrically connected to the first extraction electrode;
A second conductive yarn having one end electrically connected to the second extraction electrode;
In the composite yarn.

  Another embodiment of the present invention is a composite continuous yarn, in which a plurality of the composite yarns are seamlessly connected to each other.

  Yet another aspect of the present invention is a composite continuous yarn in which the plurality of composite yarns are connected to each other seamlessly via a non-conductive yarn.

  The composite yarn has the above configuration. Therefore, in the composite yarn, it is possible to dispose the IC chip closer to the yarn axis of the composite yarn. Therefore, according to the composite yarn, it is difficult to form a projection by the IC chip on the yarn peripheral surface of the composite yarn.

  Also, unlike the conventional composite yarn, the composite yarn does not require a support to be wound around the yarn peripheral surface, and the end of the first conductive yarn on the IC chip side and the end of the second conductive yarn on the IC chip side. Are connected by an electrode substrate. Therefore, according to the composite yarn, the entire yarn is hardly hardened by the electrode base material, and good flexibility can be exhibited.

  Further, according to the composite yarn, the first conductive yarn may be connected to the first extraction electrode on the base material and the second conductive yarn may be connected to the second extraction electrode on the base material at the time of manufacture. Therefore, there is no need to directly connect the first conductive yarn to the first electrode and the second conductive yarn to the second electrode of the extremely small IC chip. Further, according to the composite yarn, the end of the first conductive yarn on the IC chip side and the end of the second conductive yarn on the IC chip side come into contact with each other on the IC chip, or It is also easy to prevent the end on the IC chip side from contacting the second electrode and the end on the IC chip side of the second conductive yarn from contacting the first electrode. In addition, for example, if an electrode substrate on which an IC chip is mounted in advance is used, the necessary conduction can be achieved simply by connecting the first conductive yarn to the first extraction electrode and connecting the second conductive yarn to the second extraction electrode. Can be secured. Therefore, according to the above-mentioned composite yarn, it is easy to improve manufacturability and it is advantageous for continuous production. Further, according to the composite yarn, since the first conductive yarn may be connected to the first extraction electrode and the second conductive yarn may be connected to the second extraction electrode, the size of the IC chip can be easily reduced.

  The composite continuous yarn according to another aspect described above has the configuration described above. Therefore, by cutting between the electrode substrates in the composite continuous yarn, the end of the first conductive yarn opposite to the IC chip side and the end of the second conductive yarn opposite to the IC chip side However, a plurality of composite yarns at both ends can be obtained.

  The composite continuous yarn according to still another aspect described above has the above configuration. Therefore, by cutting the non-conductive yarn portion of the composite continuous yarn, the end of the first conductive yarn opposite to the IC chip side and the end of the second conductive yarn opposite to the IC chip side are cut. It is possible to obtain a plurality of composite yarns in each of which a non-conductive yarn is connected.

It is the perspective view which showed the composite yarn of Embodiment 1 typically. It is explanatory drawing which showed typically an example of the electrode surface side of the IC chip which the composite yarn of Embodiment 1 has. FIG. 2 is an explanatory diagram of the electrode base material on which the IC chip is mounted as viewed from the IC chip side in the first embodiment. FIG. 4 is a sectional view taken along line IV-IV in FIG. 1. FIG. 4 is an explanatory diagram showing a modification example of an IC chip, a first extraction electrode, and a second extraction electrode corresponding to FIG. 3. It is explanatory drawing which showed the composite yarn of Embodiment 2 typically. It is explanatory drawing which showed the modification of the composite yarn of Embodiment 2 typically, (a) is a figure corresponding to FIG. 7, (b) is VII-VII sectional drawing in (a). It is. It is explanatory drawing which showed the composite yarn of Embodiment 3 typically. It is explanatory drawing which showed some composite continuous yarns of Embodiment 4 partially omitted, and was shown typically. It is explanatory drawing which showed the composite continuous yarn of Embodiment 5 partially omitted, and was shown typically.

(Embodiment 1)
The composite yarn of the first embodiment will be described with reference to FIGS. As illustrated in FIGS. 1 to 4, the composite yarn 1 of the present embodiment includes an electrode substrate 2, an IC chip 3, a first conductive yarn 41, and a second conductive yarn 42. I have.

  The IC chip 3 includes at least a first electrode 31 and a second electrode 32 as illustrated in FIG. The first electrode 31 and the second electrode 32 are paired electrodes. In the present embodiment, the first electrode 31 can be, for example, a positive electrode, and the second electrode 32 can be, for example, a negative electrode. The IC chip 3 may have electrodes other than the first electrode 31 and the second electrode 32. FIG. 2 shows an example in which the IC chip 3 has three inspection electrodes 33 used for inspection. Each of the first electrode 31 and the second electrode 32 can have an electrode shape such as a bump shape. Further, in the present embodiment, an example is shown in which the IC chip 3 does not have an antenna line.

  The outer shape of the IC chip 3 can be generally a square shape such as a regular square shape. In this case, one side of the IC chip 3 can be, for example, 0.2 mm or more and 1 mm or less from the viewpoint of thinning the composite yarn 1 by downsizing the IC chip 3. The thickness of the IC chip 3 can be, for example, 0.2 mm or more and 1 mm or less, from the viewpoint of thinning the composite yarn 1 by downsizing the IC chip 3. The IC chip 3 is preferably not embedded in a resin such as an epoxy resin from the viewpoint of reducing the thickness of the composite yarn 1 by downsizing the IC chip 3 and suppressing the composite yarn 1 from protruding in the yarn diameter direction. Can be used.

  The composite yarn 1 can be suitably used for RFID, for example, by using the first conductive yarn 41 and the second conductive yarn 42 as antenna wires of the IC chip 3. According to this configuration, a thin and flexible composite yarn 1 useful for realizing wireless communication by RFID can be obtained.

  The electrode substrate 2 has a first extraction electrode 21 and a second extraction electrode 22 on the surface of the substrate 20. The first extraction electrode 21 is a part having a function of extracting the first electrode 31 of the IC chip 3 to the surface of the base 20. Further, the second extraction electrode 22 is a part having a function of extracting the second electrode 32 of the IC chip 3 to the surface of the base material 20 and the like. Therefore, the first extraction electrode 21 and the second extraction electrode 22 have main electrode surfaces on the outer peripheral portion of the IC chip 3 mounted on the electrode substrate 2. In the above-described IC chip 3, the first electrode 31 is electrically connected to the first extraction electrode 21, and the second electrode 32 is electrically connected to the second extraction electrode 22. Note that the IC chip 3 can be fixed to the electrode substrate 2 using an adhesive 30 as illustrated in FIG. As the adhesive 30, for example, solder (flow solder, reflow solder, or the like) can be exemplified.

  In the present embodiment, examples of the material of the substrate 20 constituting the electrode substrate 2 include resins such as polyester resin, polyimide resin, polyolefin resin, and polyphenylene sulfide resin. As a material of the substrate 20, a polyester resin can be suitably used from the viewpoint of flexibility, flexibility, cost, and the like of the composite yarn 1, and a polyphenylene sulfide resin can be used from the viewpoint of heat resistance, chemical resistance, and the like. Can be preferably used, and a polyimide resin can be suitably used from the viewpoint of heat resistance and the like. The thickness of the substrate 20 can be, for example, 10 μm or more and 50 μm or less from the viewpoint of the flexibility of the composite yarn 1 and the like.

  In the present embodiment, each of the first extraction electrode 21 and the second extraction electrode 22 includes a narrow portion 23 disposed at an end on the IC chip 3 side, as illustrated in FIGS. And a wide portion 24 which is integrally connected to the narrow portion 23 and has a larger width than the narrow portion 23. According to this configuration, even when the IC chip 3 is provided with a plurality of inspection electrodes 33 other than the first electrode 31 and the second electrode 32, only the first electrode 31 (second electrode 32) is first taken out. Conduction can be reliably made to the narrow portion 23 of the electrode 21 (second extraction electrode 22). On the other hand, the first conductive thread 41 (the second conductive thread 42), which is sufficiently larger in the width direction than the first electrode 31 (the second electrode 32) of the IC chip 3, is connected to the first extraction electrode 21 ( Conduction to the wide portion 24 of the second extraction electrode 22) can be ensured. Therefore, when conducting the first conductive yarn 41 (the second conductive yarn 42) to the first electrode 31 (the second electrode 32) of the IC chip 3, the connection accuracy is not so required, and the productivity of the composite yarn 1 is improved. It will be easier. In the present specification, the direction perpendicular to the yarn axis direction of the composite yarn 1 on the surface of the electrode substrate 2 is defined as the width direction W.

  In the present embodiment, specifically, as illustrated in FIGS. 1 and 3, the narrow portion 23 to which the first electrode 31 (the second electrode 32) is connected, and the first conductive yarn 41 (the second The wide portion 24 to which the conductive thread 42 is connected is integrally connected via an intermediate connection portion 25. 1 and 3 show an example in which the width of the intermediate connecting portion 25 is formed so as to gradually increase from the narrow portion 23 side to the wide portion 24 side. In addition, as illustrated in FIG. 5, a step may be provided in the intermediate connecting portion 25. FIG. 5 shows an example in which one step 250 is formed in the intermediate connecting portion 25. However, the intermediate connecting portion 25 has a step 250, such as a step-like shape whose width is gradually increased. You may have more than one.

  Although FIGS. 1 and 3 show an example in which the first electrode 31 and the second electrode 32 of the IC chip 3 are arranged in the yarn axis direction, as shown in FIG. The first electrode 31 and the second electrode 32 of the chip 3 may be arranged in a direction intersecting with the yarn axis direction.

  In the present embodiment, the maximum width of the first extraction electrode 21 and the maximum width of the second extraction electrode 22 can both be equal to or less than the width of the IC chip 3. According to this configuration, the thickness of the composite yarn 1 is less hindered, which is advantageous for thinning the composite yarn 1.

  Examples of the material of the first extraction electrode 21 and the second extraction electrode 22 include aluminum, aluminum alloy, copper, copper alloy, nickel, gold, gold alloy, silver, silver alloy, tin, tin alloy, zinc, and zinc alloy. Can be exemplified. In the present embodiment, copper or a copper alloy can be preferably used from the viewpoint of lowering the electric resistance. Further, the first extraction electrode 21 and the second extraction electrode 22 can be composed of one layer or a plurality of layers. The first extraction electrode 21 and the second extraction electrode 22 can be formed by, for example, performing electroplating after electroless plating on the base material 20 or printing a conductive paste. In addition, the first extraction electrode 21 and the second extraction electrode 22 can be formed by, for example, etching a copper clad laminate (CCL) or sputtering.

  One end of the first conductive thread 41 is electrically connected to the first extraction electrode 21. Further, one end of the second conductive thread 42 is electrically connected to the second extraction electrode 22. In the present embodiment, the first conductive yarn 41 and the second conductive yarn 42 can be connected to the first extraction electrode 21 and the second extraction electrode 22 by, for example, soldering or a conductive adhesive.

  The length of the first conductive yarn 41 and the second conductive yarn 42 can be appropriately set according to the use of the composite yarn 1. For example, as described above, when the IC chip 3 is used for RFID and the composite yarn 1 is configured to be used for RFID, the length becomes optimal for use as an antenna wire according to the specifications of the IC chip 3 and the like. In addition, the length of the first conductive thread 41 and the second conductive thread 42 can be adjusted. The length of the first conductive yarn 41 and the second conductive yarn 42 can be, for example, not less than 2 cm and not more than 30 cm. Note that the lengths of the first conductive yarn 41 and the second conductive yarn 42 may be the same or different.

  In the present embodiment, each of the first conductive yarn 41 and the second conductive yarn 42 includes a raw yarn bundle portion 43 formed by collecting a plurality of single yarns 430 and a plating portion 44 that covers the surface of the single yarn 430. And a configuration having: According to this configuration, the first conductive yarn 41 and the second conductive yarn 42 are excellent in conductivity and flexibility. Since the first conductive yarn 41 and the second conductive yarn 42 have the yarn bundle portion 43 composed of a plurality of single yarns 430, they can be said to have a so-called multifilament structure.

  In the case where the first conductive yarn 41 and the second conductive yarn 42 have a multifilament structure, if connection without using the first extraction electrode 21 and the second extraction electrode 22 is considered, the first conductive yarn 41 and the second conductive At least one conductive single thread 430 is taken out from the thread 42 and connected to the first electrode 31 and the second electrode 32 of the extremely small IC chip 3. Manufacturing with such connections is difficult. On the other hand, according to the configuration of the composite yarn 1 of the present embodiment, even if the first conductive yarn 41 and the second conductive yarn 42 have a multifilament structure, at least one of the conductive single yarns 430 is formed. The book may be connected to the first extraction electrode 21 and the second extraction electrode 22 that are sufficiently larger in the width direction than the first electrode 31 and the second electrode 32 of the IC chip 3, respectively. Therefore, even when the first conductive yarn 41 and the second conductive yarn 42 have a multifilament structure, the first conductive yarn 41 (the second conductive yarn 42) is connected to the first electrode 31 (the second electrode 32), the connection accuracy is not so required, and the productivity of the composite yarn 1 is easily improved.

  Examples of the yarn bundle 43 include synthetic resin fibers typified by polyester resin fibers and polyamide resin fibers, and natural fibers typified by cotton, silk, wool, and the like. These may be used alone or as a blend. The yarn bundle portion 43 is preferably made of synthetic resin fibers from the viewpoint of productivity, cost, and the like.

  The yarn bundle portion 43 can have, for example, 100 to 1500 denier. According to this configuration, it is easy to balance the handleability when connecting the first conductive yarn 41 and the second conductive yarn 42 to the first extraction electrode 21 and the second extraction electrode 22 and the thinning of the composite yarn 1. Become. The yarn bundle portion 43 can preferably have a denier of 120 denier or more, more preferably 150 denier or more, and still more preferably 200 denier or more. Further, the yarn bundle portion 43 can have a density of preferably 1300 denier or less, more preferably 1000 denier or less, and further preferably 800 denier or less.

  The plating portion 44 covering the surface of the single yarn 430 can be formed, for example, by applying a catalyst (such as palladium) to the raw yarn bundle portion 43 and then performing electroless plating. The plating portion 44 can be configured to cover at least the surface of the single yarn 430 arranged in the outermost layer of the raw yarn bundle portion 43 when viewed in a cross section perpendicular to the yarn axis direction. Furthermore, when the surface of the single yarn 430 disposed inside the outermost layer of the raw yarn bundle portion 43 is covered with the plating portion 44, the first conductive yarn 41 (the second conductive yarn 42) and the first conductive yarn 41 This is advantageous because conductivity with the extraction electrode 21 (second extraction electrode 22) can be easily improved. Note that the plated portion 44 may cover the entire surface of the single yarn 430, or a portion of the surface of the single yarn 430 that is not covered by the plated portion 44 for manufacturing or other reasons.

  Examples of the metal forming the plated portion 44 include copper, copper alloy, nickel, nickel alloy, gold, gold alloy, silver, silver alloy, tin, and tin alloy. These can be used alone or in combination of two or more. According to this configuration, conduction between the first conductive yarn 41 (second conductive yarn 42) and the first extraction electrode 21 (second extraction electrode 22) can be easily ensured. The metal forming the plated portion 44 preferably contains copper or a copper alloy from the viewpoint of the conductivity and flexibility of the first conductive yarn 41 and the second conductive yarn 42. The plating section 44 can be composed of one or more layers.

  The thickness of the plating portion 44 is preferably 0.5 μm or more, more preferably 1 μm or more, and still more preferably, from the viewpoints of the conductivity of the first conductive yarn 41 and the second conductive yarn 42 and suppression of uneven plating. It can be 1.5 μm or more. Further, the thickness of the plated portion 44 is preferably 5 μm or less, more preferably 4.5 μm or less, from the viewpoints of the flexibility of the first conductive yarn 41 and the second conductive yarn 42 and the suppression of peeling and cracking of plating. , More preferably, 4 μm or less.

  In the present embodiment, the composite yarn 1 can have a covering yarn (not shown) on the surface. According to this configuration, there are advantages such as improvement in the slipperiness of the yarn, improvement in the appearance of the yarn, and improvement in durability against rubbing and the like. Specifically, the covering yarn can cover the outer circumferences of the electrode substrate 2, the IC chip 3, the first conductive yarn 41, and the second conductive yarn 42. The covering yarn may be knitted around the outer periphery of the composite yarn 1 or wound around the outer periphery of the composite yarn 1, for example. Specifically, the covering yarn may have a structure knitted around the outer periphery of the composite yarn 1 by Lilian knitting.

  In the composite yarn 1 of the present embodiment, the IC chip 3 can be arranged in a state closer to the yarn axis of the composite yarn 1. For this reason, according to the composite yarn 1 of the present embodiment, it is difficult to form a protrusion by the IC chip 3 on the yarn peripheral surface of the composite yarn 1 of the present embodiment.

  Further, according to the composite yarn 1 of the present embodiment, unlike the conventional composite yarn, there is no need to wind the support around the yarn peripheral surface, and the end of the first conductive yarn 41 on the IC chip 3 side and the second conductive yarn 41 are not required. The electrode 42 is connected to the end of the thread 42 on the IC chip 3 side. Therefore, according to the composite yarn 1 of the present embodiment, the entire yarn is hardly hardened by the electrode base material 2, and excellent flexibility can be exhibited.

  Further, according to the composite yarn 1 of the present embodiment, at the time of manufacture, the first conductive yarn 41 is applied to the first extraction electrode 21 on the base material 20 and the second conductive yarn 42 is applied to the second extraction electrode 22 on the base material 20. May be connected to each other. Therefore, it is not necessary to directly connect the first conductive thread 41 to the first electrode 31 and the second conductive thread 42 to the second electrode 32 of the extremely small IC chip 3. According to the composite yarn 1 of the present embodiment, the end of the first conductive yarn 41 on the IC chip 3 side and the end of the second conductive yarn 42 on the IC chip 3 side are formed on the IC chip 3 during manufacturing. The end of the first conductive thread 41 on the IC chip 3 side contacts the second electrode 32, and the end of the second conductive thread 42 on the IC chip 3 side contacts the first electrode 31. It is easy to prevent that. Further, for example, if the electrode base material 2 on which the IC chip 3 is mounted in advance is used, the first conductive yarn 41 is connected to the first extraction electrode 21 and the second conductive yarn 42 is connected to the second extraction electrode 22. In this way, necessary conduction can be ensured. Therefore, according to the composite yarn 1 of the present embodiment, manufacturability is easily improved, and it is advantageous for continuous production. Further, according to the composite yarn 1 of the present embodiment, the first conductive yarn 41 may be connected to the first extraction electrode 21 and the second conductive yarn 42 may be connected to the second extraction electrode 22, respectively. It is easy to cope with

(Embodiment 2)
The composite yarn according to the second embodiment will be described with reference to FIG. Note that, among the reference numerals used in the second and subsequent embodiments, the same reference numerals as those used in the above-described embodiments denote the same components and the like as those in the above-described embodiments, unless otherwise specified.

  As illustrated in FIG. 6, in the composite yarn 1 of the present embodiment, the pressing base 7 is disposed on the surface of the electrode base 2 on the IC chip 3 side. Then, at least a first connection portion 61 where the first extraction electrode 21 and the first conductive yarn 41 are connected, and a second connection portion 62 where the second extraction electrode 22 and the second conductive yarn 42 are connected. The electrode substrate 2 is sandwiched between the substrate 20 and the pressing substrate 7.

  According to this configuration, even if the first extraction electrode 21 and the first conductive yarn 41 and the second extraction electrode 22 and the second conductive yarn 42 are not connected only by soldering as in Embodiment 1, The take-out electrode 21 and the first conductive yarn 41, the second take-out electrode 22 and the second conductive yarn 42 are brought into contact with each other, and are pressed from above by the pressing base 7, so that the first take-out electrode 21 and the first conductive yarn 41, The conduction between the second take-out electrode 22 and the second conductive yarn 42 can be ensured. Therefore, compared with the case where only solder is used for electrical connection, the amount of solder used is reduced or the use of solder eliminates the swelling of the solder, and the flexibility of the first connection portion 61 and the second connection portion 62 is improved. As a result, the flexibility of the composite yarn 1 is easily improved. Further, compared to the case where only solder is used for electrical connection, it is easier to suppress an increase in the thickness of the first connection portion 61 and the second connection portion 62, and the partial area of the first connection portion 61 and the second connection portion 62 is reduced. It is easy to suppress a large diameter. Therefore, it becomes easy to improve the function as a thread, such as the sewing performance of the composite thread 1.

  Furthermore, when the first conductive yarn 41 and the second conductive yarn 42 have the yarn bundle portion 43, the single yarn 430 constituting the yarn bundle portion 43 is displaced by the pressing force of the pressing base 7. It becomes difficult to do. Therefore, according to the above configuration, it is easy to ensure the electrical conductivity between the first extraction electrode 21 and the first conductive yarn 41 and the second extraction electrode 22 and the second conductive yarn 42. When importance is placed on ensuring the mechanical connection strength between the first extraction electrode 21 and the first conductive yarn 41, and the second extraction electrode 22 and the second conductive yarn 42, soldering is performed as necessary. May be used in combination. Even in this case, the use of the solder can be suppressed by having the holding substrate 7. In addition, by providing a retaining structure so that the first conductive yarn 41 and the second conductive yarn 42 are hooked on the holding substrate 7, the tensile strength of the first conductive yarn 41 and the second conductive yarn 42 can be improved. it can.

  The pressing substrate 7 can be welded to the substrate 20 of the electrode substrate 2, for example. Alternatively, the pressing substrate 7 can be attached to the substrate 20 via an adhesive layer (not shown) provided on the surface of the electrode substrate 2. Preferably, the former is good. According to the former configuration, the base member 20 and the pressing base member 7 are chemically bonded to each other at the welding portion 70 and integrated. Therefore, according to the former configuration, the pressing force of the pressing base material 7 can be easily maintained for a long period, and the above-described operation and effect can be more effectively exerted. The welding of the base material 20 and the pressing base material 7 may be partially performed at the portion where the base material 20 and the pressing base material 7 are in contact with each other, or may be entirely performed. FIG. 6 shows an example in which the welding between the base material 20 and the pressing base material 7 is partially performed at a portion where the base material 20 and the pressing base material 7 are in contact with each other. More specifically, welding portions 70 are present on both outer sides of the first conductive yarn 41 and the second conductive yarn 42 in the width direction. According to this configuration, the first connection portion 61 and the second connection portion 62 can be reliably sandwiched between the base member 20 and the pressing base member 7 with a smaller number of welding portions 70. Also, the heat energy required for welding can be saved.

  The holding substrate 7 may be provided so as to cover the first connection portion 61 and the second connection portion 62, or provided so as to cover the entire surface of the electrode substrate 2 on the IC chip 3 side uniformly. May be. Further, as long as the pressing base 7 can cover the first connecting portion 61 and the second connecting portion 62, the pressing base 7 may be composed of separate members as shown in FIG. 6 or as shown in FIG. May be constituted by one member. Preferably, it is the latter. According to the latter configuration, it is only necessary to supply the pressing base 7 composed of one member onto the electrode base 2 during the production of the composite yarn 1. For this reason, the facility for manufacturing the composite yarn 1 is easily simplified.

  Although not shown, a pressing substrate 7 disposed on the surface of the electrode substrate 2 on the IC chip 3 side and another pressing substrate disposed on the surface of the electrode substrate 2 on the side opposite to the IC chip 3 side (Not shown), the first connection portion 61 and the second connection portion 62 can be sandwiched between the base material 20 and the holding base material 7.

  Examples of the material of the pressing base 7 include a resin such as a polyester resin, a polyolefin resin, and a polyamide resin. When the material of the base material 20 of the electrode base material 2 and the material of the pressing base material 7 are the same, it is easy to improve the weldability. Further, the thickness of the pressing base 7 can be, for example, 10 μm or more and 50 μm or less from the viewpoint of the flexibility of the composite yarn 1 and the like.

  Other configurations and operational effects are the same as those of the first embodiment.

(Embodiment 3)
The composite yarn of the third embodiment will be described with reference to FIG.

  As illustrated in FIG. 8, the composite yarn 1 of the present embodiment has a coating layer 8 formed on the surface. According to this configuration, the IC chip 3, the first connection portion 61 between the first extraction electrode 21 and the first conductive yarn 41, and the second connection portion 62 between the second extraction electrode 22 and the second conductive yarn 42 are coated with a coating layer. 8 can be protected. In addition, according to this configuration, the coating layer 8 makes the IC chip 3 less susceptible to chemicals, and the chemical resistance of the composite yarn 1 can be improved. Further, according to this configuration, the connection between the first extraction electrode 21 and the first conductive yarn 41 and the connection between the second extraction electrode 22 and the second conductive yarn 42 can be reinforced by the coating layer 8.

  Specifically, the coating layer 8 includes the IC chip 3, the electrode substrate 2, the end of the first conductive thread 41 on the IC chip 3 side, and the end of the second conductive thread 42 on the IC chip 3 side. At least. When the coating layer 8 is formed so as to cover the entire yarn peripheral surface of the composite yarn 1 as illustrated in FIG. 8, for example, a coating liquid for forming the coating layer 8 at the time of manufacturing is used. Can be omitted from the masking step for preventing the composite yarn 1 from sticking to the yarn circumferential surface of the composite yarn 1, and accordingly, the productivity of the composite yarn 1 can be improved accordingly. In addition, it becomes easy to improve the chemical resistance of the composite yarn 1 and the slipperiness of the yarn surface.

  When the composite yarn 1 is configured to include both the coating layer 8 and the coating yarn described in the first embodiment, the composite yarn 1 includes the coating yarn on the outer periphery of the coating layer 8. It can be.

  The coating layer 8 can be specifically composed of, for example, a silicone-based coating layer or a fluorine-based coating layer. When the coating layer 8 is formed of a silicone-based coating layer, the thickness of the coating layer 8 is easily increased as compared with the case where the coating layer 8 is formed of a fluorine-based coating layer. Therefore, in this case, the unevenness due to the IC chip or the like is easily absorbed by the silicone-based coating layer, and the smoothness of the yarn surface is easily ensured. In addition, since silicone is rubbery and excellent in elasticity, the flexibility of the composite yarn 1 is not easily damaged, and the adhesion strength of the coating layer 8 is easily ensured. Moreover, since silicone has excellent slip properties, the slip properties of the yarn surface can be improved. On the other hand, when the coating layer 8 is formed of a fluorine-based coating layer, the thickness of the coating layer 8 is easily reduced as compared with the case where the coating layer 8 is formed of a silicone-based coating layer. For this reason, it is possible to protect the yarn surface with a thin film thickness, which is advantageous for reducing the weight of the composite yarn 1 and the like.

  The thickness of the silicone-based coating layer can be, for example, 10 μm or more and 100 μm or less, and preferably 12 μm or more and 30 μm or less. The thickness of the fluorine-based coating layer can be, for example, 0.1 μm or more and 2 μm or less, preferably 0.5 μm or more and 1 μm or less.

  In the present embodiment, the composite yarn 1 has a non-conductive first non-conductive yarn 51 at an end of the first conductive yarn 41 opposite to the IC chip 3 side as illustrated in FIG. A non-conductive second non-conductive thread 52 can be provided at the end of the second conductive thread 42 on the side opposite to the IC chip 3 side. According to this configuration, when the length of the composite yarn 1 is set to the predetermined length, the first non-conductive yarn 51 and the second non-conductive yarn 51 are not changed without changing the lengths of the first conductive yarn 41 and the second conductive yarn 42. By adjusting the length of the yarn 52, the entire length of the composite yarn 1 can be adjusted. As illustrated in FIG. 8, the coating layer 8 described above coats not only the first conductive yarn 41 and the second conductive yarn 42 but also the outer peripheral surfaces of the first non-conductive yarn 51 and the second non-conductive yarn 52. When formed so as to cover, it is possible to suppress the elution of metal from the plating portion 44 constituting the first conductive yarn 41 and the second conductive yarn 42.

  The first non-conductive yarn 51 and the second non-conductive yarn 52 can be constituted by, for example, a non-conductive filament bundle portion 43 in which the plating portion 44 is not formed. That is, the yarn bundle 43 continuously extending from the first conductive yarn 41 is defined as a first non-conductive yarn 51, and the yarn bundle 43 continuously extending from the second conductive yarn 42 is defined as a second non-conductive yarn 52. be able to. According to this configuration, the manufacturability of the composite yarn 1 having the first non-conductive yarn 51 and the second non-conductive yarn 52 is excellent.

  Other configurations and operational effects are the same as those of the first or second embodiment.

(Embodiment 4)
The composite continuous yarn of Embodiment 4 will be described with reference to FIG.

  As illustrated in FIG. 9, in the composite continuous yarn 10 of the present embodiment, a plurality of composite yarns 1 are seamlessly connected to each other. Specifically, the plurality of composite yarns 1 include, for example, those in which the coating layer 8 described in the third embodiment is formed on the surface of the composite yarn 1 of the above-described second embodiment having the holding substrate 7. Can be used. In FIG. 9, the holding substrate 7 and the coating layer 8 are omitted for convenience of drawing.

  According to the composite continuous yarn 10 of the present embodiment, by cutting the composite continuous yarn 10 at the position of the arrow A between the electrode substrates 2 shown in FIG. It is possible to obtain a plurality of composite yarns 1 having the opposite end and the opposite end of the second conductive yarn 42 from the IC chip 3 side.

(Embodiment 5)
The composite continuous yarn of the fifth embodiment will be described with reference to FIG.

  As illustrated in FIG. 10, in the composite continuous yarn 10 of the present embodiment, a plurality of composite yarns 1 are seamlessly connected to each other with a non-conductive yarn 50 interposed therebetween. As the plurality of composite yarns 1, specifically, for example, the composite yarn 1 of the third embodiment having the coating layer 8, the first non-conductive yarn 51, and the second non-conductive yarn 52 will be described in the second embodiment. For example, a substrate on which a pressed holding substrate 7 is formed can be used. In FIG. 10, the coating layer 8 and the holding substrate 7 are omitted for the convenience of drawing. In the composite continuous yarn 10, the non-conductive yarn 50 is formed by connecting the first non-conductive yarn 51 and the second non-conductive yarn 52 of the composite yarn 1 adjacent to each other seamlessly.

  According to the composite continuous yarn 10 of this embodiment, by cutting the composite continuous yarn 10 at the position of the arrow B between the electrode substrates 2 shown in FIG. Can obtain a plurality of composite yarns 1 having the opposite end and the opposite end of the second non-conductive yarn 52 from the IC chip 3 side.

(Experimental example 1)
An electrode substrate 2 having a first extraction electrode 21 and a second extraction electrode 22 having a shape as shown in FIG. 3 on a film-like substrate 20 was prepared. The material of the base material is polyethylene terephthalate, and the size of the base material is 7 mm in length in the thread axis direction, 1 mm in width, and 50 μm in thickness. The maximum width of each of the first extraction electrode and the second extraction electrode is set to be smaller than or equal to the width of the IC chip (same as one side of the IC chip in this experimental example).

  As shown in FIG. 3, the narrow portion 23 of the first extraction electrode 21 and the first electrode 31 of the IC chip 3, the narrow portion 23 of the second extraction electrode 22 and the second portion of the IC chip 3 in the electrode base material 2. The IC chip 3 was bonded to the electrode substrate 2 by reflow soldering so that the electrodes 32 were electrically connected.

  Further, a polyester yarn composed of a bundle of a plurality of single yarns was prepared. The polyester yarn has a denier of 400 and is sufficiently longer than the length of the composite yarn to be produced. After applying a catalyst to the prepared polyester yarn, electroless copper plating was performed to form a copper plating layer (2 μm in thickness) on the surface of the single yarn. Hereinafter, this plated polyester yarn is referred to as a plated yarn as appropriate. When the plating state of the plated yarn was confirmed, the copper plating layer was formed not only on the outermost layer of the single yarn but also on the surface of the single yarn inside the outermost layer.

  Next, the plated yarn was held at two places separated by a predetermined distance, and the plated yarn was cut at the center of the two holding parts. Then, the end of one of the divided plating yarns is brought into contact with the first extraction electrode of the electrode substrate on which the IC chip is mounted, and the end of the other of the divided plating yarns is contacted with the second extraction electrode. The substrate was brought into contact, and a holding substrate made of polyethylene terephthalate was placed thereon. Then, the base material of the electrode base material and the holding base material were thermally welded. The above operation was repeated a plurality of times while shifting the cut position of the plating yarn in the yarn axis direction of the plating yarn. As a result, a continuous yarn was obtained in which a plurality of plating bases were arranged in the yarn axis direction with the electrode bases on which the IC chips were mounted separated from each other.

  Next, the obtained continuous yarn was dipped in a silicone-based coating liquid (“HTV-2000”, manufactured by Engraving Japan) and dried. As a result, a silicone-based coating layer was formed on the entire yarn peripheral surface of the continuous yarn. As the silicone-based coating liquid, for example, "HTV-4000" or the like can be used instead of "HTV-2000".

  Next, the coated yarn was woven by Lilian knitting on the surface of the continuous yarn on which the silicone-based coating layer was formed. Thus, a composite continuous yarn was obtained. Further, the obtained composite continuous yarn was cut between electrode substrates to obtain a plurality of composite yarns. In each of the obtained composite yarns, both ends are the ends of the plating yarn connected to the first extraction electrode and the ends of the plating yarn connected to the second extraction electrode. In each composite yarn, the plating yarn connected to the first extraction electrode corresponds to a first conductive yarn, and the plating yarn connected to the second extraction electrode corresponds to a second conductive yarn. In this experimental example, the length of the first conductive yarn is 70 mm, and the length of the second conductive yarn is 70 mm.

(Experimental example 2)
A composite continuous yarn and a composite yarn were obtained in the same manner as in Experimental Example 1, except that a fluorine coating solution ("RHF-10", manufactured by Hishie Chemical Co., Ltd.) was used instead of the silicone-based coating solution.

(Experimental example 3)
The same polyester yarn as in Experimental Example 1 was prepared. The polyester yarn was impregnated with paraffin wax at predetermined intervals to form a masking portion in a pattern so that plating was not performed in a later step. A composite continuous yarn was obtained in substantially the same manner as in Experimental Example 1 except that the polyester yarn having the masking portion was used. However, the masking portion was dissolved and removed with hot water after forming the plating portion. Further, in the plating yarn, a conductive portion having a plated portion and a non-conductive portion having no plated portion (that is, a portion where the element bundle is exposed) are alternately formed. Therefore, in this experimental example, the plating yarn was cut at the conductive portion where the plated portion was formed, and the electrode substrate on which the IC chip was mounted was connected.

  Further, the obtained composite continuous yarn was cut at a non-conductive portion between the electrode base materials to obtain a plurality of composite yarns. Each of the obtained composite yarns was continuously connected to the end of the raw yarn bundle continuously connected to the plating yarn connected to the first extraction electrode, and to the plating yarn connected to the second extraction electrode. The ends of the yarn bundle are defined as both ends. In each composite yarn, the plating yarn connected to the first take-out electrode corresponds to the first conductive yarn, and the yarn bundle continuously connected thereto corresponds to the first non-conductive yarn. Further, the plating yarn connected to the second extraction electrode corresponds to the second conductive yarn, and the yarn bundle continuously connected thereto corresponds to the second non-conductive yarn. In this experimental example, the length of the first conductive yarn is 70 mm, the length of the second conductive yarn is 70 mm, the length of the first non-conductive yarn is 80 mm, and the length of the second non-conductive yarn is 80 mm It is.

(chemical resistance)
The composite yarn obtained in each experimental example was bleached under the same bleaching conditions as in the bleaching step of surgical gauze. As a result, no damage due to bleaching was observed on the IC chip in the composite yarn obtained in each experimental example, and it was confirmed that the composite yarn obtained in each experimental example had high chemical resistance. . Therefore, even if the composite yarn obtained in each of the experimental examples is used as a warp yarn or a weft yarn of a surgical gauze or sewn into the surgical gauze, the IC chip is damaged in the bleaching process of the surgical gauze. Instead, a surgical gauze corresponding to RFID can be realized. In addition, since the composite yarn does not easily cause the protrusion of the IC chip to protrude from the peripheral surface of the yarn and has high flexibility, it does not impair the original function of the surgical gauze.

  The present invention is not limited to the above embodiments and experimental examples, and various changes can be made without departing from the gist of the invention. In addition, each configuration shown in each embodiment and each experimental example can be arbitrarily combined.

  Specifically, for example, the coating layer described in the third embodiment can be formed on the surface of the composite yarn of the second embodiment. Further, for example, the composite yarn of the third embodiment can have the holding substrate described in the second embodiment.

  Applications of the composite yarn described above include, in addition to surgical gauze, for example, clothing management in cleaning and the like, inventory management, product brand management, room entry / exit management, and the like.

DESCRIPTION OF SYMBOLS 1 Composite yarn 2 Electrode base material 20 Base material 21 First extraction electrode 22 Second extraction electrode 3 IC chip 31 First electrode 32 Second electrode 41 First conductive yarn 42 Second conductive yarn 10 Composite continuous yarn

Claims (13)

An electrode substrate having a first extraction electrode and a second extraction electrode on the substrate surface,
An IC chip comprising a first electrode and a second electrode, wherein the first electrode is electrically connected to the first extraction electrode, and the second electrode is electrically connected to the second extraction electrode;
A first conductive yarn having one end electrically connected to the first extraction electrode;
A second conductive yarn having one end electrically connected to the second extraction electrode;
A composite yarn having: Both the first extraction electrode and the second extraction electrode are:
A narrow portion disposed at the end on the IC chip side;
A wide portion that is integrally connected to the narrow portion and has a width that is larger than the narrow portion;
The composite yarn according to claim 1, comprising:   3. The composite yarn according to claim 1, wherein a maximum width of the first extraction electrode and a maximum width of the second extraction electrode are both equal to or less than the width of the IC chip. 4. A holding substrate is arranged on the surface of the electrode substrate on the IC chip side,
At least a first connection portion where the first extraction electrode and the first conductive yarn are connected and a second connection portion where the second extraction electrode and the second conductive yarn are connected are the electrode base. The composite yarn according to any one of claims 1 to 3, wherein the composite yarn is sandwiched between a base material and the pressing base material.   The composite yarn according to claim 4, wherein the holding substrate is welded to a substrate of the electrode substrate.   The composite yarn according to any one of claims 1 to 5, wherein a coating layer is formed on a surface.   The composite yarn according to claim 6, wherein the coating layer is a silicone-based coating layer or a fluorine-based coating layer. Both the first conductive yarn and the second conductive yarn are:
A yarn bundle portion formed by collecting a plurality of single yarns;
A plating portion covering the surface of the single yarn,
The composite yarn according to any one of claims 1 to 7, comprising:   The composite yarn according to claim 8, wherein the metal constituting the plated portion includes at least one selected from the group consisting of copper, nickel, aluminum, gold, silver, tin, and alloys thereof.   The composite yarn according to claim 8, wherein the yarn bundle portion has a denier of 100 to 1500 denier.   The composite yarn according to any one of claims 1 to 10, wherein the composite yarn is configured to be used for RFID.   A composite continuous yarn, wherein the multiple composite yarns according to any one of claims 1 to 11 are seamlessly connected to each other.   A composite continuous yarn, wherein the multiple composite yarns according to any one of claims 1 to 11 are seamlessly connected to each other via a non-conductive yarn.

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