JP2020040546A - Heat medium heating device and vehicle air conditioner - Google Patents

Abstract

To suppress the deviation in the temperature of a heat medium.SOLUTION: A heat medium heating device 25 includes a PTC heater which is arranged in a casing 31 having a heat medium channel formed therein to heat the heat medium. The casing 31 includes: a first channel formation member 46 which is formed with a plurality of first channel grooves 70A forming a portion of a first heat medium channel 48; and a substrate storage member 45 which is provided so as to face the first channel groove 70A and is joined to the outer peripheral part of the first channel formation member 46 through a liquid gasket 80A. A first outer channel groove 71 located on the most outer side in the width direction among the plurality of first channel grooves 70A has the shallower channel depth than the first inner channel groove 72 located on the inner side in the width direction with respect to the first outer channel groove 71. When the channel width of the first channel groove 70A is defined as W, and the channel depth is defined as d, the first outer channel groove 71 has the larger value of W/d than the first inner channel groove 72. The channel cross-sectional area of the first outer channel groove 71 is equal to or larger than the channel cross-sectional area of the first inner channel groove 72.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a heat medium heating device and a vehicle air conditioner.

  2. Description of the Related Art Some heat medium heating devices constituting a conventional vehicle air conditioner include a PTC (Positive Temperature Coefficient) element having a PTC heater having a heating element as a heating element.

  Patent Literature 1 discloses a heat medium heating device including a PTC heater and first and second heat medium distribution boxes which are in close contact with both surfaces of the PTC heater and have heat medium circulation paths formed therein. It has been disclosed. In the heat medium heating device having such a configuration, the first heat medium circulation box includes the substrate storage box and the upper heat medium circulation box. The second heat medium distribution box includes a lower heat medium distribution box and a lid. The PTC heater is in close contact with the lower surface of the upper heat medium distribution box and the upper surface of the lower heat medium distribution box. A plurality of fins are formed on the upper surface of the upper heat medium distribution box. A heat medium circulation path is formed between the upper heat medium circulation box and the substrate housing box. A plurality of fins are formed on the lower surface of the lower heat medium distribution box. A heat medium flow path is formed between the lower heat medium flow box and the lid. The heat medium flow path has a plurality of flow paths defined by the plurality of fins. The heat medium flowing through the heat medium flow paths in the first and second heat medium flow boxes is heated by heat radiation from the PTC heater. In such a configuration, the upper heat medium distribution box and the substrate accommodating box, and the lower heat medium distribution box and the lid are respectively joined by liquid gaskets.

JP 2014-129090 A

  By the way, the liquid gasket between the upper heat medium distribution box and the substrate accommodating box and the liquid gasket between the lower heat medium distribution box and the lid have a plurality of heat medium flow paths which are heat medium flow paths through which the heat medium flows. May protrude into the outermost heat medium flow passages. When the liquid gasket protrudes into the heat medium flow path, the flow path cross-sectional area of only the heat medium flow path formed outside is reduced. When the heat medium flow path is narrowed, the flow of the heat medium is hindered, and the amount of the heat medium that can flow is reduced. As a result, the heat medium flowing through the heat medium flow path formed outside may be heated more rapidly by the PTC heater than the heat medium flowing through the heat medium flow path formed inside. . In such a state, the temperature of the heat medium to be heated is biased between the inside and the outside.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a heat medium heating device and a vehicle air conditioner that can suppress uneven temperature of a heat medium.

The present invention employs the following means in order to solve the above problems.
A heat medium heating device according to a first aspect of the present invention includes a casing in which a heat medium flow path through which a heat medium flows is provided, and a PTC heater disposed in the casing and heating the heat medium. A casing formed with a plurality of passage grooves forming a part of the heat medium passage, and the passage groove formed so as to form the heat medium passage together with the passage formation member. And a facing member joined to an outer peripheral portion of the flow path forming member via a liquid gasket, the plurality of flow path grooves being orthogonal to a direction in which the heat medium flow path extends. The outer channel groove, which is formed at an interval in the width direction and is positioned at the outermost side in the width direction among the plurality of the channel grooves, is located inside the outer channel groove in the width direction. The channel depth is smaller than the other channel grooves, and the channel of the channel groove Where W is the depth of the flow path and d is the depth of the flow path, the outer flow path groove has a larger value of W / d than the other flow path grooves, and the cross-sectional area of the flow path of the outer flow path groove Is larger than the cross-sectional area of the other flow channel.

  With such a configuration, even if the liquid gasket protrudes into the outer passage groove, it is possible to secure a sufficient space for the heat medium to flow in the outer passage groove. As a result, it is possible to suppress the flow of the heat medium in the heat medium flow path formed by the outer flow path grooves. Therefore, a rapid temperature rise such as boiling of the heat medium due to a decrease in the flow rate of the heat medium in the outer channel groove is suppressed. Thus, in the heat medium flow channel, the heat medium flowing in the outer flow channel and the heat medium flowing in the other flow channel can be heated under the same conditions.

  Further, in the heat medium heating device according to the second aspect of the present invention, in the first aspect, the outer passage groove may have the largest passage width among a plurality of the passage grooves.

  With this configuration, even if the separation depth cannot be increased, it is possible to reliably secure a sufficient space for the heat medium to flow.

  In the heat medium heating device according to a third aspect of the present invention, in the first aspect or the second aspect, a joint between the flow path forming member and the facing member is formed on an outer peripheral portion of the flow path forming member. The first seal surface, formed on the facing member, a second seal surface facing the first seal surface, and formed continuously to one of the first seal surface and the second seal surface, Along with approaching the outer flow channel, having a separation surface extending away from the other of the first seal surface and the second seal surface, the flow channel cross-sectional area of the outer flow channel, other With respect to the flow channel cross-sectional area of the flow channel, the separation surface is formed to be larger than the cross-sectional area of a gap formed between the other of the first sealing surface and the second sealing surface. Is also good.

  With such a configuration, the liquid gasket that has been filled in the gap between the separation surface and the other of the first sealing surface and the second sealing surface is positioned in the outermost channel groove in the width direction. Even if the entire amount protrudes, it is possible to suppress the flow of the heat medium from being hindered.

  Further, a vehicle air conditioner according to a fourth aspect of the present invention is the vehicle air conditioner according to any one of the first aspect to the third aspect, a blower that causes a flow of outside air or air in a vehicle cabin, and the blower A cooler provided downstream of the cooler for cooling the outside air or the air, and a cooler provided downstream of the cooler and heating the outside air or the air by the heat medium heated by the heat medium heating device A radiator.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to suppress the temperature deviation of the heated heat medium.

1 is a schematic diagram illustrating a schematic configuration of a vehicle air conditioner according to an embodiment of the present invention. It is a perspective view showing the appearance of the above-mentioned heating medium heating device. It is a figure which shows the internal structure of the said heat medium heating apparatus, and is an AA arrow sectional drawing in FIG. It is a figure which shows the internal structure of the said heat medium heating apparatus, and is BB arrow sectional drawing in FIG. FIG. 5 is a diagram illustrating an internal structure of the heat medium heating device, and is an enlarged sectional view of a main part of FIG. 4. It is a top view showing the channel groove formed in the above-mentioned heating medium heating device. It is a top view showing the PTC heater provided in the above-mentioned heating medium heating device.

  Hereinafter, embodiments of a heating medium heating device and a vehicle air conditioner according to the present invention will be described with reference to the accompanying drawings. Note that the present invention is not limited to only these embodiments.

FIG. 1 is a schematic diagram illustrating a schematic configuration of a vehicle air conditioner according to an embodiment of the present invention.
As shown in FIG. 1, the vehicle air conditioner 10 includes a housing 11, a blower 13, a cooler 15, a radiator 16, an air mix damper 17, and a heat medium circulation circuit 19. The vehicle air conditioner 10 is, for example, an air conditioner applicable to a hybrid vehicle, an electric vehicle, and the like.

  The housing 11 has an inlet 11A, an outlet 11B, and a channel 11C. The intake 11 </ b> A is provided at one end of the housing 11. The intake port 11 </ b> A takes outside air or air in the vehicle compartment (hereinafter simply referred to as “air”) into the housing 11. The discharge port 11B is provided at the other end of the housing 11. The discharge port 11B discharges the air in the housing 11. The outlet 11B is connected to a plurality of outlets provided in the vehicle interior. The flow path 11C communicates between the intake port 11A and the discharge port 11B. In the flow path 11C, the air taken in from the intake port 11A flows toward the discharge port 11B.

  The blower 13 is provided at a position near the intake port 11A in the flow path 11C. The blower 13 sucks air from the intake port 11A into the flow path 11C and sends the air toward the discharge port 11B. In the flow path 11C, a flow of air is generated by the blower 13 from the intake port 11A toward the discharge port 11B.

  The cooler 15 is provided in the flow path 11C on the downstream side of the blower 13 (on the side of the discharge port 11B). The cooler 15 is arranged so as to close a part of the flow path 11C. The cooler 15 forms a refrigerant circuit together with a compressor, a condenser, and an expansion valve (not shown). The cooler 15 cools the air passing through the cooler 15 by evaporating the refrigerant adiabatically expanded by the expansion valve.

  The radiator 16 is provided downstream of the cooler 15 in the flow path 11C. The radiator 16 heats the air by exchanging heat between the air cooled by the cooler 15 and a heat medium supplied from a heat medium circulation circuit 19 described later. The radiator 16 has an inlet 16A and an outlet 16B. The inlet 16A and the outlet 16B are connected to the heat medium circulation circuit 19. A heat medium is introduced from the heat medium circulation circuit 19 to the inlet 16A. The heat medium having passed through the radiator 16 is led out to the heat medium circulation circuit 19 from the outlet 16B.

  The air mix damper 17 is provided in parallel with the radiator 16 in the flow path 11C. The air mix damper 17 adjusts the amount of air flowing bypassing the radiator 16. The air that has passed through the air mix damper 17 is mixed with the air that has passed through the radiator 16 on the downstream side of the radiator 16 and the air mix damper 17. The air mix damper 17 adjusts the temperature of the mixed air of the air passing through the radiator 16 and the air flowing bypassing the radiator 16.

  The heat medium circulation circuit 19 includes a circulation line 21, a tank 23, a pump 24, and a heat medium heating device 25. The circulation line 21 is arranged outside the housing 11. The circulation line 21 connects the inlet 16A and the outlet 16B of the radiator 16, the tank 23, the pump 24, and the heat medium heating device 25. The circulation line 21 circulates the heat medium between the radiator 16, the tank 23, the pump 24, and the heat medium heating device 25.

  When the vehicle air conditioner 10 is applied to a hybrid vehicle, for example, engine cooling water of the hybrid vehicle is used as the heat medium. When the vehicle air conditioner 10 is applied to an electric vehicle without an engine, the heat medium may be, for example, an aqueous solution of calcium chloride, an aqueous solution of sodium chloride, an aqueous solution of magnesium chloride, ethylene, which is used as brine for a refrigerator. A glycol aqueous solution or the like is used.

  The tank 23 is provided downstream of the radiator 16 (on the outlet 16B side) in the circulation line 21. A heat medium is stored in the tank 23.

  The pump 24 is provided in the circulation line 21 on the downstream side of the tank 23. The pump 24 supplies the heat medium in the tank 23 to the heat medium heating device 25.

  The heat medium heating device 25 is provided between the pump 24 and the radiator 16 in the circulation line 21. The heat medium heating device 25 heats the heat medium with a PTC heater 33 described later.

Hereinafter, the configuration of the heating medium heating device 25 will be described in detail.
FIG. 2 is a perspective view illustrating the appearance of the heat medium heating device according to the present embodiment. FIG. 3 is a diagram showing the internal structure of the heat medium heating device, and is a cross-sectional view taken along the line AA in FIG. FIG. 4 is a diagram showing the internal structure of the heat medium heating device, and is a cross-sectional view taken along line BB in FIG. FIG. 5 is a diagram showing an internal structure of the heat medium heating device, and is an enlarged sectional view of a main part of FIG. FIG. 6 is a plan view showing a flow channel formed in the heat medium heating device. FIG. 7 is a plan view showing a PTC heater provided in the heat medium heating device.

  As shown in FIG. 2, the heat medium heating device 25 has a substantially rectangular parallelepiped shape as a whole. In the following description, the X direction is the longitudinal direction of the heat medium heating device 25 (the direction in which the heat medium flow path extends), the Y direction is the short direction (width direction) of the heat medium heating device 25 orthogonal to the X direction, The Z direction indicates a thickness direction of the heat medium heating device 25 orthogonal to the XY plane (a virtual plane through which the X direction and the Y direction pass). As shown in FIGS. 2 to 4, the heat medium heating device 25 includes a casing 31, a PTC heater 33 (see FIGS. 3 and 4), and a control board 37 (see FIG. 3).

  The casing 31 has a first casing part 41 and a second casing part 42.

  As shown in FIGS. 3 and 4, the first casing portion 41 has a substrate housing member (opposing member) 45, a first flow path forming member (flow path forming member) 46, and a first lid member 47. . The first lid member 47, the substrate housing member 45, and the first flow path forming member 46 are provided to be stacked in the thickness direction Z.

  The substrate housing member 45 forms, together with the first flow path forming member 46, a first heat medium flow path 48 to be described later. The substrate housing member 45 is provided between the first flow path forming member 46 and the first lid member 47 in the thickness direction Z. The substrate housing member 45 has a substrate housing space 45A, a first channel forming recess 45B, a heat medium inlet 45C, and a heat medium outlet 45D.

  The substrate housing space 45A is formed on the side of the substrate housing member 45 facing the first lid member 47. The substrate housing space 45A is formed so as to be surrounded by a plate-shaped bottom plate portion 45e and a housing outer peripheral wall portion 45f rising from the outer peripheral portion of the bottom plate portion 45e to the first lid member 47 side. The bottom plate portion 45e is a member that extends inside the casing 31 along the XY plane. The housing outer peripheral wall 45f is a member that forms a part of the side surface of the casing 31. Thereby, the substrate housing space 45A is formed as a concave portion that is depressed from the side facing the first lid member 47 toward the first flow path forming member 46.

  As shown in FIG. 3, a control board 37 is housed in the board housing space 45A. The control board 37 controls the operation of a PTC heater 33 described later. The control board 37 has a board body 66 and electronic components 68 and 69.

  The substrate main body 66 is fixed to the substrate housing member 45. The substrate main body 66 has a plate shape and is arranged in parallel with the bottom plate portion 45e of the substrate housing member 45. The substrate main body 66 is electrically connected to the PTC heater 33 via a connection (not shown).

  The electronic component 69 is mounted on a surface 66 a of the board body 66 facing the first lid member 47. The electronic component 68 is mounted on a surface 66b of the board main body 66 facing the bottom plate 45e. The electronic component 68 is provided so as to be in contact with the bottom plate 45e. The electronic component 68 is an electronic component that generates heat more easily than the electronic component 69. As the electronic component 68, for example, an IGBT (Insulated Gate Bipolar Transistor: an insulated gate bipolar transistor), a FET (Field Effect Transistor), and the like can be exemplified.

  The first flow passage forming recess 45B is formed on the first flow passage forming member 46 side of the substrate housing member 45. The first flow path forming recess 45B is formed so as to be surrounded by a bottom plate part 45e and a housing outer peripheral wall part 45i rising from the outer peripheral part of the bottom plate part 45e to the first flow path forming member 46 side. The housing outer peripheral wall 45i is a member that forms a part of the side surface of the casing 31 together with the housing outer peripheral wall 45f. The housing outer peripheral wall 45i is formed integrally with the housing outer peripheral wall 45f and extends in the thickness direction Z. The first flow passage forming recess 45B is formed to be recessed toward the first lid member 47 from the side facing the first flow passage forming member 46. That is, the first channel forming recess 45B is a recess formed on the opposite side in the thickness direction Z with respect to the substrate housing space 45A with the bottom plate 45e interposed therebetween.

  The heat medium inlet 45C is provided on one end side of the casing 31 in the longitudinal direction X. The heat medium inlet 45C is connected to the circulation line 21 (see FIG. 1) that circulates the heat medium. As shown in FIG. 4, an introduction-side flow path 45p is formed between the heat medium introduction port 45C and the first flow path forming recess 45B. The introduction-side flow path 45p communicates the heat medium introduction port 45C with the first flow path forming recess 45B. The heat medium introduction port 45C introduces the heat medium from the circulation line 21 into the first flow path forming recess 45B via the introduction-side flow path 45p.

  As shown in FIG. 3, the heat medium outlet 45D is provided at the other end of the casing 31 in the longitudinal direction X. The heat medium outlet 45D is connected to the circulation line 21 (see FIG. 1) that circulates the heat medium. As shown in FIG. 4, an outlet-side channel 45q is formed between the heat medium outlet 45D and the first channel forming recess 45B. The heat medium outlet 45D guides the heat medium in the first channel forming recess 45B to the circulation line 21 through the outlet channel 45q.

  As shown in FIGS. 3 and 4, the first flow path forming member 46 forms a part of a first heat medium flow path 48 through which the heat medium flows. The first flow path forming member 46 has a first plate-shaped portion 46A, a plurality of first fins 46B, a heater accommodating concave portion 46C, and a first outer peripheral wall portion 46f. The first outer peripheral wall portion 46f is a member provided along the outer peripheral portion of the first flow path forming member 46 and forming a part of the side surface of the casing 31. The first outer peripheral wall portion 46f extends in the thickness direction Z.

  The first plate-shaped portion 46A is provided at an interval in the thickness direction Z with respect to the bottom plate portion 45e of the substrate housing member 45. The first plate-shaped portion 46A is a member that extends along the XY plane inside the casing 31 in parallel with the bottom plate portion 45e. Both ends in the short direction Y of the first plate-shaped portion 46A are connected to the first outer peripheral wall portion 46f. Both ends in the longitudinal direction X of the first plate-shaped portion 46A are spaced apart from the first outer peripheral wall 46f. A first heat medium passage (heat medium passage) 48 is formed between the first plate portion 46A and the bottom plate portion 45e of the substrate housing member 45. The first heat medium flow path 48 is a space defined by the first plate portion 46A, the outer peripheral wall portion 45i, and the bottom plate portion 45e. In the first heat medium flow path 48, the heat medium introduced from the heat medium inlet 45C into the first flow path forming recess 45B flows toward the heat medium outlet 45D along the longitudinal direction X.

  The plurality of first fins 46B are provided on the first plate-shaped portion 46A on the side facing the bottom plate 45e of the substrate housing member 45. The plurality of first fins 46B are provided at intervals in the short direction Y. Each first fin 46B protrudes toward the bottom plate 45e. Each first fin 46B extends in the longitudinal direction X. The plurality of first fins 46B form a passage in which the heat medium flows in the first heat medium flow path 48.

  As shown in FIGS. 4 to 6, in the first flow path forming member 46, a plurality of first fins 46 </ b> B are spaced apart in the short direction Y between the first outer peripheral wall portions 46 f on both sides in the short direction Y. As a result, a plurality of first flow channel grooves 70A are formed on the first plate-shaped portion 46A. That is, the first flow path groove 70A forms a part of the first heat medium flow path 48. The plurality of first flow path grooves 70A extend in the longitudinal direction (the direction in which the heat medium flow path extends) X along the plurality of first fins 46B. The plurality of first flow path grooves 70A are provided at intervals in the short direction (width direction orthogonal to the direction in which the heat medium flow path extends) Y. In the first heat medium flow path 48, the heat medium flows in the first flow grooves 70A in the longitudinal direction X.

  As shown in FIG. 5, among the plurality of first flow channel grooves 70 </ b> A, the first outer flow channel groove 71 located on the outermost side in the short direction Y is the other first inner channel located on the inner side in the short direction Y. The flow channel 72 has the following differences. Note that, in the present embodiment, the first inner channel grooves 72 disposed on the inner side with respect to the first outer channel grooves 71 on both sides in the lateral direction Y are formed so as to have the same cross-sectional shape. I have.

  Here, the length in the short direction Y of the flow channel is referred to as a flow channel width W, and the length in the thickness direction Z is referred to as a flow channel depth d. The channel width W in the first channel groove 70A of the present embodiment is, for example, the length at a position where the interval in the shortest direction Y is wide. The flow channel depth d in the first flow channel groove 70A of the present embodiment is a surface on which the first fin 46B of the first plate-shaped portion 46A extends from the tip of the first fin 46B forming the first flow channel groove 70A. Is the distance to

  The first outer channel groove 71 has a smaller channel depth d than the first inner channel groove 72. That is, the flow depth d1 of the first outer flow groove 71 is smaller than the flow depth d2 of the first inner flow groove 72 (d1 <d2). Therefore, the first outer channel groove 71 of the present embodiment is formed to be the shallowest of all the first channel grooves 70A.

  In addition, the first outer channel groove 71 has a larger channel width W than the first inner channel groove 72. That is, the channel width W2 of the first inner channel groove 72 is smaller than the channel width W1 of the first outer channel groove 71 (W2 <W1). Therefore, the first outer channel groove 71 of the present embodiment is formed so as to have the largest width among all the first channel grooves 70A.

  Further, the value of the ratio W / d of the channel width W to the channel depth d of the first outer channel groove 71 is larger than all other first inner channel grooves 72. That is, the value of the ratio W1 / d1 of the channel width W1 of the first outer channel groove 71 and the channel depth d1 is equal to the channel width W2 and the channel depth of all other first inner channel grooves 72. It is larger than the value of the ratio W2 / d2 to d2.

  As shown in FIG. 3, the heater accommodating concave portion 46C is formed on the second casing portion 42 side opposite to the substrate accommodating member 45 with respect to the first plate-shaped portion 46A. At both ends in the longitudinal direction X of the first plate-shaped portion 46A, a peripheral wall portion 46w that rises toward the second casing portion 42 is formed. The peripheral wall portion 46w extends parallel to the first outer peripheral wall portion 46f at a position apart from the first outer peripheral wall portion 46f in the longitudinal direction X. The heater accommodating concave portion 46C is formed so as to be surrounded by the first plate portion 46A and the peripheral wall portion 46w. The heater accommodating concave portion 46C is formed as a concave portion that is depressed toward the substrate accommodating member 45 from the side facing the second casing portion 42.

  The first lid member 47 is fixed to the housing outer peripheral wall 45f with a plurality of screws (not shown). The first lid member 47 closes the substrate housing space 45A. The first lid member 47 faces the control board 37 disposed in the board accommodation space 45A.

  The second casing part 42 has a second flow path forming member (flow path forming member) 53 and a second lid member (opposing member) 54. The second flow path forming member 53 and the second lid member 54 are provided to be stacked in the thickness direction Z.

  The second flow path forming member 53 forms a part of the second heat medium flow path 56 through which the heat medium flows. The second flow path forming member 53 is provided on the first flow path forming member 46 so as to be stacked in the thickness direction Z. The second flow path forming member 53 integrally includes a second plate-shaped part 53A, a second flow path forming concave part 53B, a plurality of second fins 53C, and a second outer peripheral wall part 53f.

  The second plate-shaped portion 53A is provided at a predetermined interval in the thickness direction Z with respect to the first plate-shaped portion 46A. In the second plate-like portion 53A, a groove 53m that is continuous in the circumferential direction is formed on the side facing the first plate-like portion 46A. An insulating member 34 provided on an outer peripheral portion of a PTC heater 33 described later is accommodated in the groove 53m. The groove 53m is formed over the entire outer periphery of the second plate-shaped portion 53A.

  A heater accommodating portion (accommodating space) 50 which is an accommodating space for accommodating the PTC heater 33 is formed between the second plate-shaped portion 53A and the first plate-shaped portion 46A by the heater accommodating recess 46C and the groove 53m. ing. The heater accommodating portion 50 is a space surrounded and isolated by the second plate-shaped portion 53A, the second outer peripheral wall 53f, the first plate-shaped portion 46A, the first outer peripheral wall 46f, and the peripheral wall 46w. is there. Thus, the heater accommodating portion 50 is formed between the first heat medium flow path 48 and the second heat medium flow path 56 in the thickness direction Z.

  The second flow path forming recess 53B is formed on the second lid member 54 side of the second flow path forming member 53 opposite to the first casing section 41 side. The second flow path forming recess 53B is formed by being surrounded by the second plate-shaped portion 53A and a second outer peripheral wall 53f rising from the outer peripheral portion of the second plate-shaped portion 53A to the second lid member 54 side. I have. The second flow passage forming recess 53B is a recess formed in the second flow passage forming member 53 by being recessed from the second lid member 54 side to the first casing portion 41 side.

  As shown in FIGS. 3 and 4, a second heat medium flow path 56 is formed between the second lid member 54 and the second flow path forming recess 53B. The second heat medium flow path 56 is a space defined by the second plate-like portion 53A, the second outer peripheral wall 53f, and the second lid member 54.

  As shown in FIG. 4, the plurality of second fins 53C are arranged in the second heat medium flow path 56. The plurality of second fins 53C are provided on the second lid member 54 side in the second plate-shaped portion 53A. The plurality of second fins 53C are provided at intervals in the short direction Y. Each of the second fins 53C is formed to protrude from the second plate-shaped portion 53A toward the second lid member 54. Each second fin 53C extends in the longitudinal direction X. The plurality of second fins 53C form a passage through which the heat medium flows in the second heat medium flow path 56.

  As shown in FIG. 4, in the second flow path forming member 53, a plurality of second fins 53C are provided at intervals in the short direction Y between the second outer peripheral wall portions 53f on both sides in the short direction Y. As a result, a plurality of second channel grooves 70B are formed on the second plate-shaped portion 53A. That is, the second flow path groove 70B forms a part of the second heat medium flow path 56. The plurality of second channel grooves 70B extend in the longitudinal direction X along the plurality of second fins 53C. The plurality of second channel grooves 70B are provided at intervals in the short direction Y. In the second heat medium flow path 56, the heat medium flows in the plurality of second flow path grooves 70B in the longitudinal direction X.

  As shown in FIG. 5, the second outer channel groove 76 located on the outermost side in the short direction Y among the plurality of second channel grooves 70 </ b> B is another second outer channel groove 76 located on the inner side in the short direction Y. There is the following difference from the inner channel groove 77. Note that, in the present embodiment, the second inner channel grooves 77 arranged on the inner side with respect to the second outer channel grooves 76 on both sides in the short direction Y are formed so as to have the same cross-sectional shape in the present embodiment. I have. The second inner channel groove 77 has the same cross-sectional shape as the first inner channel groove 72.

  The flow path width W in the second flow path groove 70B of the present embodiment is, for example, a length at a position where the interval in the shortest direction Y is wide, as in the first flow path groove 70A. Further, the channel depth d in the second channel groove 70B of the present embodiment is such that the second fin 53C in the second plate-like portion 53A extends from the tip of the second fin 53C forming the second channel groove 70B. It is the distance to the plane where you are.

  The second outer passage groove 76 has a smaller passage depth d than the second inner passage groove 77. That is, the channel depth d3 of the second outer channel groove 76 is smaller than the channel depth d4 of the second inner channel groove 77 (d3 <d4). Therefore, the second outer channel groove 76 of the present embodiment is formed to be the shallowest of all the second channel grooves 70B.

  In addition, the second outer channel groove 76 has a larger channel width W than the second inner channel groove 77. That is, the channel width W4 of the second inner channel groove 77 is smaller than the channel width W3 of the second outer channel groove 76 (W4 <W3). Therefore, the second outer channel groove 76 of the present embodiment is formed so as to have the largest width among all the second channel grooves 70B.

  Further, the value of the ratio W / d of the channel width W to the channel depth d of the second outer channel groove 76 is larger than all other second inner channel grooves 77. That is, the ratio W3 / d3 of the channel width W3 and the channel depth d3 of the second outer channel groove 76 is equal to the channel width W4 and the channel depth d4 of all other second inner channel grooves 77. Is larger than the ratio W4 / d4.

  The second lid member 54 forms a second heat medium flow path 56 together with the second flow path forming member 53. The second lid member 54 is fixed to the second outer peripheral wall 53f with a plurality of screws (not shown).

  As shown in FIGS. 3 to 5, the heat medium heating device 25 has a first joint J1 as a joint between the first flow path forming member 46 and the substrate housing member 45. As shown in FIG. 5, the first joining portion J1 joins the first outer peripheral wall 46f and the housing outer peripheral wall 45i with a liquid gasket 80A. The first joint portion J1 has an upper first seal surface 461, an upper second seal surface 451, and an upper separation surface (separation surface) 452.

  The upper first seal surface 461 is formed on the first flow path forming member 46. Specifically, the upper first sealing surface 461 is formed at the tip of the first outer peripheral wall 46f as a plane orthogonal to the thickness direction Z.

  The upper second sealing surface 451 is formed on the substrate housing member 45. Specifically, the upper second seal surface 451 is formed at the tip of the housing outer peripheral wall 45i as a plane orthogonal to the thickness direction Z so as to face the upper first seal surface 461.

  The upper separation surface 452 is formed on the substrate housing member 45. Specifically, the upper separation surface 452 is formed so as to be continuous with the upper second seal surface 451 on the inner peripheral side of the casing 31 in the housing outer peripheral wall portion 45i. The upper separation surface 452 is inclined so as to gradually separate from the upper first seal surface 461 toward the inside of the casing 31. Accordingly, in the first joint portion J1, the first flow path forming member 46 and the substrate housing member 45 are in contact with each other, and are perpendicular to the longitudinal direction X between the upper first sealing surface 461 and the upper separating surface 452. A first void portion 81 having a substantially triangular cross section is formed.

  The liquid gasket 80A is provided so as to be interposed between the upper first seal surface 461, the upper second seal surface 451, and the upper separation surface 452.

  Further, the heat medium heating device 25 has a second joint J2 as a joint between the second flow path forming member 53 and the second lid member 54. The second joint portion J2 joins the second outer peripheral wall portion 53f and the outer peripheral portion of the second lid member 54 with the liquid gasket 80B. The second joint J2 has a lower first seal surface 541, a lower second seal surface 531 and a lower separation surface (separation surface) 532.

  The lower first sealing surface 541 is formed on the second lid member 54. Specifically, the lower first sealing surface 541 is formed as a plane orthogonal to the thickness direction Z on the surface facing the tip of the second outer peripheral wall 53f. The lower first sealing surface 541 is a part of the inner surface of the second lid member 54 facing the second flow path forming member 53 in the thickness direction Z.

  The lower second seal surface 531 is formed on the second flow path forming member 53. Specifically, the lower second sealing surface 531 is formed at the tip of the second outer peripheral wall 53f as a plane orthogonal to the thickness direction Z so as to face the lower first sealing surface 541.

  The lower separation surface 532 is formed on the second flow path forming member 53. Specifically, the lower separation surface 532 is formed in the second outer peripheral wall 53f so as to be continuous with the lower second seal surface 531 on the inner peripheral side of the casing 31. The lower separating surface 532 is inclined so as to gradually separate from the lower first sealing surface 541 toward the inside of the casing 31. Accordingly, in the second joint portion J2, in a state where the second flow path forming member 53 and the second lid member 54 are in contact with each other, the longitudinal direction is formed between the lower first seal surface 541 and the lower separation surface 532. A second void portion 82 having a substantially triangular cross section orthogonal to the direction X is formed.

  The liquid gasket 80B is provided so as to be interposed between the lower first sealing surface 541, the lower second sealing surface 531 and the lower separation surface 532.

  As the liquid gaskets 80A and 80B, for example, an organic solvent type liquid gasket, a solventless type liquid gasket, an aqueous type liquid gasket, or the like can be used. As the organic solvent type liquid gasket, for example, a modified alkyd type, cellulose ester type, or synthetic rubber type liquid gasket can be used. As the solvent-free liquid gasket, for example, a phenol-based, modified ester-based, silicone-based, acrylic-based liquid gasket can be used. As the aqueous type liquid gasket, for example, an aqueous acrylic liquid gasket can be used.

  The cross-sectional area of the first outer channel groove 71 is larger than the cross-sectional area of the first inner channel groove 72. Here, the channel cross-sectional area is a cross-sectional area of the first channel groove 70A orthogonal to the longitudinal direction X (for example, a value represented by a product of a channel depth d and a channel width W). Specifically, the channel cross-sectional area of the first outer channel groove 71 may be at least the same as the channel cross-sectional area of the first inner channel groove 72. It is preferably larger than the area. The flow path cross-sectional area of the first outer flow path groove 71 of the present embodiment is formed to be larger than the flow path cross-sectional area of the first inner flow path groove 72 by the value of the cross-sectional area of the first void portion 81 or more. .

  Similarly, the flow path cross-sectional area of the second outer flow path groove 76 is larger than the flow path cross-sectional area of the second inner flow path groove 77. Specifically, the channel cross-sectional area of the second outer channel groove 76 may be at least the same as the channel cross-sectional area of the second inner channel groove 77. It is preferably larger than the area. The flow path cross-sectional area of the second outer flow path groove 76 of the present embodiment is formed to be larger than the flow path cross-sectional area of the second inner flow path groove 77 by the value of the cross-sectional area of the second gap portion 82 or more. .

  As shown in FIG. 3, the second heat medium flow path 56 communicates with the first heat medium flow path 48 through the upstream communication part 43A and the downstream communication part 43B. The upstream communication portion 43A is formed by a first upstream communication port 51A and a second upstream communication port 55A. The downstream communication portion 43B is formed by a first downstream communication port 51B and a second downstream communication port 55B.

  As shown in FIG. 3, the first upstream communication port 51A and the first downstream communication port 51B are formed at both ends in the longitudinal direction X of the first plate-shaped portion 46A. The first upstream communication port 51A and the first downstream communication port 51B are openings between the first plate-shaped portion 46A and the first outer peripheral wall portion 46f in the longitudinal direction X. The first upstream communication port 51A and the first downstream communication port 51B have a long hole shape that extends long in the short direction Y when viewed from the thickness direction Z.

  The second upstream communication port 55A and the second downstream communication port 55B are formed at both ends in the longitudinal direction X of the second plate-shaped portion 53A. The second upstream communication port 55A and the second downstream communication port 55B are openings between the second plate portion 53A and the second outer peripheral wall portion 53f in the longitudinal direction X. The second upstream communication port 55A and the second downstream communication port 55B are formed in the same shape at the same position as the first upstream communication port 51A and the first downstream communication port 51B when viewed from the thickness direction Z. .

  Thus, the heat medium introduced from the heat medium inlet 45C into the first heat medium flow path 48 flows into the second heat medium flow path 56 through the upstream communication portion 43A. The heat medium flows in the second heat medium flow path 56 in the longitudinal direction X along the plurality of second fins 53C, passes through the downstream communication portion 43B, passes through the first heat medium flow path 48 to the heat medium outlet 45D. Flowing towards.

  The PTC heater 33 is housed in the heater housing 50. An insulating member 34 is provided on an outer peripheral portion of the PTC heater 33. The insulating member 34 is fitted in the groove 53m.

  As shown in FIGS. 3 and 4, the PTC heater 33 is disposed between the first heat medium flow path 48 and the second heat medium flow path 56 in the thickness direction Z. The PTC heater 33 is arranged between the upstream communication part 43A and the downstream communication part 43B in the longitudinal direction X. The PTC heater 33 has a plurality of first electrode plates 62, a second electrode plate 63, and a PTC element 61.

  The plurality of first electrode plates 62 are stacked on the surface of the PTC element 61 facing the first plate-shaped portion 46A. The first electrode plate 62 has a plate shape parallel to the first plate portion 46A. An insulating sheet (not shown) is provided between the first electrode plate 62 and the first plate portion 46A.

  As shown in FIG. 7, in the present embodiment, the plurality of first electrode plates 62 have terminals 62d to 62f, respectively. The terminals 62d to 62f protrude outward from the outer peripheral portion of the first electrode plate 62. The terminals 62d to 62f are electrically connected to the control board 37.

  As shown in FIG. 3, the second electrode plate 63 is laminated on the surface of the PTC element 61 facing the second plate-shaped portion 53A. The second electrode plate 63 has a plate shape parallel to the first electrode plate 62. An insulating sheet (not shown) is provided between the second electrode plate 63 and the second plate portion 53A.

  As shown in FIG. 7, in the present embodiment, the second electrode plate 63 has a terminal 63d. The terminal 63 d protrudes outward from the outer peripheral portion of the second electrode plate 63. The terminal 63d is electrically connected to the control board 37.

  As shown in FIG. 3, the PTC element 61 is sandwiched between the first electrode plate 62 and the second electrode plate 63. The PTC element 61 has, for example, a rectangular plate shape.

  The PTC heater 33 applies a voltage to the first electrode plate 62 through the terminals 62d to 62f under the control of the control board 37. When a voltage is applied to the first electrode plate 62, the PTC element 61 generates heat. The heat generated by the PTC element 61 is transmitted to the first plate portion 46A and the second plate portion 53A, and to the first fin 46B and the second fin 53C. Thereby, the heat medium flowing through the first heat medium flow path 48 and the second heat medium flow path 56 is heated. Further, the heat medium flowing through the first heat medium flow path 48 is also heated by the heat of the electronic component 68 that easily generates heat via the bottom plate portion 45e of the substrate housing member 45. The heat medium thus heated by the heat medium heating device 25 is discharged to the circulation line 21 via the heat medium outlet 45D. Thereafter, the heated heat medium is supplied to the radiator 16 through the inlet 16A of the radiator 16.

  According to the heating medium heating device 25 as described above, in the first casing portion 41, the first outer channel groove 71 has a channel depth d shallower than the first inner channel groove 72, and Channel width W / channel depth d is large. Further, the first outer channel groove 71 is formed to have a channel cross-sectional area equal to or greater than the first inner channel groove 72. Therefore, even if the liquid gasket 80A that bonds the upper first seal surface 461 and the upper second seal surface 451 protrudes from the first gap portion 81 into the first outer channel groove 71, the first outer channel groove A sufficient space for the circulation of the heat medium can be secured in 71. As a result, it is possible to suppress the flow of the heat medium in the first heat medium flow path 48 formed by the first outside flow path groove 71. Therefore, an abrupt temperature rise such as boiling of the heat medium due to a decrease in the flow rate of the heat medium in the first outer channel groove 71 is suppressed. Accordingly, in the first heat medium flow path 48, the heat medium flowing in the first outer flow path groove 71 and the heat medium flowing in the first inner flow path groove 72 can be heated under the same conditions.

  Similarly, in the second casing portion 42, the second outer channel groove 76 has a smaller channel depth d than the second inner channel groove 77, and has a channel width W / channel depth d. Is big. Further, the second outer channel groove 76 is formed to have a channel cross-sectional area equal to or greater than that of the second inner channel groove 77. Therefore, like the first heat medium flow path 48, in the second heat medium flow path 56, the heat medium flowing in the second outer flow path groove 76 and the heat medium flowing in the second inner flow path groove 77 are separated. It can be heated under the same conditions. Therefore, the bias of the temperature of the heated heat medium in the heat medium heating device 25 can be suppressed.

  The first outer channel groove 71 has a smaller channel depth d than the first inner channel groove 72. Similarly, the second outer channel groove 76 has a smaller channel depth d than the second inner channel groove 77. In other words, the bottoms of the adjacent grooves (the first inner channel groove 72 with respect to the first outer channel groove 71 and the second inner channel groove 77 with respect to the second outer channel groove 76) have the first fin 46B and the second The two fins 53C are shifted in the extending direction. This is because the region where the first outer channel groove 71 and the second outer channel groove 76 are formed corresponds to the region where the insulating member 34 provided on the outer peripheral portion of the PTC heater 33 is arranged. . Specifically, a groove 53m is formed on a surface of the first plate-shaped portion 46A or the second plate-shaped portion 53A on the side opposite to the first heat medium flow path 48 or the second heat medium flow path 56 in the thickness direction Z. As described above, it is necessary to form a space for accommodating the insulating member 34. Therefore, like the first outer channel groove 71 and the second outer channel groove 76, in the channel groove formed outside in the width direction Y, the first inner channel groove 72 and the second inner channel groove 77 are provided. Therefore, it is not possible to secure the same flow path depth d as that described above, and it becomes shallow. However, in the present embodiment, the channel width W / the channel depth of the first outer channel groove 71 and the second outer channel groove 76 with respect to the first inner channel groove 72 and the second inner channel groove 77. By making d larger and making the flow path cross-sectional area equal to or more than that, even if the flow path depth d is shallow, a sufficient space for flowing the heat medium can be secured. Accordingly, it is possible to prevent the protruding liquid gaskets 80A and 80B from hindering the flow of the heat medium in the first outer channel groove 71 and the second outer channel groove 76.

  Further, the first outer channel groove 71 has the largest channel width W among the first channel grooves 70A. Further, the second outer passage groove 76 has the largest passage width W among the second passage grooves 70B. Therefore, even if the flow path depth d cannot be increased, it is possible to reliably secure a sufficient space for the flow of the heat medium.

  The cross-sectional area of the first outer passage groove 71 is formed to be larger than the cross-sectional area of the first inner passage groove 72 by the value of the cross-sectional area of the first gap 81 or more. . Similarly, the flow path cross-sectional area of the second outer flow path groove 76 is formed to be larger than the flow path cross-sectional area of the second inner flow path groove 77 by the value of the cross-sectional area of the second gap portion 82 or more. I have. Therefore, the liquid gaskets 80A and 80B, which have been filled in the first gap 81 and the second gap 82, all spill out into the first outer channel groove 71 and the second outer channel groove 76. Also, it is possible to suppress the flow of the heat medium in the first outer channel groove 71 and the second outer channel groove 76 from being hindered.

  As described above, the embodiments of the present invention have been described in detail with reference to the drawings. However, each configuration in each embodiment and a combination thereof are merely examples, and addition and omission of configurations are not deviated from the scope of the present invention. , Substitutions, and other changes are possible. The present invention is not limited by the embodiments, but is limited only by the claims.

  The first fin 46B and the second fin 53C extend in a rectangular shape perpendicular to the thickness direction with respect to the first plate-shaped portion 46A and the second plate-shaped portion 53A as in the present embodiment. It is not limited to this. The first fin 46B and the second fin 53C may be formed in such a shape that the fin thickness in the short direction Y gradually decreases toward the tip. At this time, the first fin 46B and the second fin 53C may have an R-shape such that the corner is rounded at the tip or the base on the first plate-shaped portion 46A or the second plate-shaped portion 53A side.

  For example, in this specification, the flow path width W is not limited to the length at the position where the interval in the short direction Y is the widest as in the present embodiment. The channel width W is long at the uppermost portion in the thickness direction Z (the position farthest from the first plate-shaped portion 46A and the second plate-shaped portion 53A) in the first channel groove 70A and the second channel groove 70B. The length of the lowermost portion in the thickness direction Z (the position closest to the first plate-shaped portion 46A or the second plate-shaped portion 53A), the length at an intermediate position in the thickness direction Z, or from the uppermost portion to the lowermost portion May be any of the average values of the lengths. Further, the channel width W may be the length of the first channel groove 70A or the second channel groove 70B at the position of the center of gravity of the first fin 46B or the second fin 53C in the thickness direction Z.

  Further, in the present specification, the flow path depth d is not limited to the distance from the tip of the fin to the bottom surface on which the fin extends. The flow channel depth d may be, for example, a virtual flow channel depth which is a value obtained by dividing a flow channel cross-sectional area in a flow channel by a flow channel width W.

DESCRIPTION OF SYMBOLS 10 Vehicle air conditioner 11 Housing 11A Intake 11B Outlet 11C Flow path 13 Blower 15 Cooler 16 Radiator 16A Inlet 16B Outlet 17 Air mix damper 19 Heat medium circulation circuit 21 Circulation line 23 Tank 24 Pump 25 Heat medium Heating device 31 Casing 33 PTC heater 34 Insulating member 37 Control board 41 First casing portion 42 Second casing portion 43A Upstream communication portion 43B Downstream communication portion 45 Substrate housing member (opposing member)
45A Substrate accommodation space 45B First flow path forming recess 45C Heat medium introduction port 45D Heat medium discharge port 45e Bottom plate part 45f, 45i Storage outer peripheral wall part 45p Introduction side flow path 45q Derivation side flow path 46 First flow path forming member (flow path formation Element)
46A First plate-shaped portion 46B First fin 46C Heater accommodating concave portion 46f First outer peripheral wall portion 46w Peripheral wall portion 47 First lid member 48 First heat medium flow path 50 Heater accommodating portion (accommodating space)
51A First upstream communication port 51B First downstream communication port 53 Second flow path forming member (flow path forming member)
53A second plate-like portion 53B second flow passage forming concave portion 53C second fin 53f second outer peripheral wall portion 53m groove portion 54 second lid member (opposing member)
55A Second upstream communication port 55B Second downstream communication port 56 Second heat medium channel 61 PTC element 62 First electrode plates 62d, 62e, 62f Terminal 63 Second electrode plate 63d Terminal 66 Substrate bodies 66a, 66b Surfaces 68, 69 Electronic component 70A First passage groove 70B Second passage groove 71 First outside passage groove 76 Second outside passage groove 72 First inside passage groove 77 Second inside passage groove 80A, 80B Liquid gasket 81 First gap Part 82 second gap 461 upper first sealing surface 541 lower first sealing surface 451 upper second sealing surface 531 lower second sealing surface 452 upper separating surface 532 lower separating surface d, d1, d2, d3, d4 Channel depth W, W1, W2, W3, W4 Channel width J1 First joint J2 Second joint X Longitudinal direction Y Short direction (width direction)
Z Thickness direction

Claims (4)

A casing in which a heat medium flow path through which the heat medium flows is formed,
A PTC heater arranged in the casing and heating the heat medium,
The casing,
A flow path forming member in which a plurality of flow path grooves forming a part of the heat medium flow path are formed,
A facing member provided to face the flow channel so as to form the heat medium flow channel together with the flow channel forming member, and joined to an outer peripheral portion of the flow channel forming member via a liquid gasket. And
The plurality of flow channel grooves are formed at intervals in a width direction orthogonal to a direction in which the heat medium flow channel extends,
Outer flow grooves located most outward in the width direction among the plurality of flow grooves are deeper than other flow grooves located inside the outer flow grooves in the width direction. It is shallow,
When the channel width of the channel groove is W and the channel depth is d, the outer channel groove has a larger value of W / d than the other channel grooves,
The heat medium heating device, wherein a flow path cross-sectional area of the outer flow path groove is equal to or larger than the flow path cross-sectional area of another flow path groove.   The heating medium heating device according to claim 1, wherein the outer channel groove has the largest channel width among a plurality of the channel grooves. The joint between the flow path forming member and the facing member,
A first seal surface formed on an outer peripheral portion of the flow path forming member,
A second sealing surface formed on the facing member and facing the first sealing surface;
A separation surface formed continuously with one of the first sealing surface and the second sealing surface, and extending away from the other of the first sealing surface and the second sealing surface as approaching the outer channel groove. And having
The flow path cross-sectional area of the outer flow path groove is, with respect to the flow path cross-sectional area of the other flow path groove, between the separation surface and the other of the first seal surface and the second seal surface. The heat medium heating device according to claim 1, wherein the heat medium heating device is formed to be larger than the cross-sectional area of the gap formed in the heat medium. A heat medium heating device according to any one of claims 1 to 3,
A blower that creates a flow in the outside air or the air in the passenger compartment;
A cooler that is provided downstream of the blower and cools the outside air or the air,
A radiator that is provided downstream of the cooler and heats the outside air or the air with the heat medium heated by the heat medium heating device,
A vehicle air conditioner comprising:

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