JP2020038230A - Imaging unit - Google Patents

Abstract

To provide an imaging unit capable of suppressing temperature rise.SOLUTION: The imaging unit including a plurality of imaging apparatuses, a housing for holding the plurality of imaging apparatuses, and a circuit board comprises a heat conduction member provided in contact with the housing or the circuit board. The heat conduction member has heat conductivity larger than the heat conductivity of the housing and includes an attachment part with respect to the member to be installed of the imaging unit.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an imaging unit.

  In recent years, image processing techniques have been significantly improved, and high-performance cameras can be obtained relatively inexpensively, so that camera application techniques have been put to practical use. For example, there is known a stereo ranging technique in which a plurality of cameras are attached to one housing, such as a stereo camera, and a distance to an object to be photographed is measured based on an image photographed by each camera. Currently, application to various fields is under consideration.

  In the case of a stereo camera or the like, it is important to eliminate the influence of temperature as much as possible irrespective of the installation environment. For example, in the following Patent Document 1, from the viewpoint of distance measurement accuracy, a stereo camera accompanying an increase in ambient temperature in the installation environment There is disclosed a configuration for reducing the influence on the image.

  On the other hand, in recent years, the stereo camera has been advanced and downsized, and the problem of temperature rise due to heat generation of components mounted inside the stereo camera is becoming more apparent. If the temperature inside the stereo camera rises, the risk of failure of the mounted components rises. Therefore, from the viewpoint of prolonging the service life, it is required to make a configuration for efficiently conducting or radiating heat.

  The present invention has been made in view of the above problems, and has as its object to provide an imaging unit capable of suppressing a rise in temperature.

  According to one aspect of the present disclosure, there is provided an imaging unit including a plurality of imaging devices, a housing that holds the plurality of imaging devices, and a circuit board, and a transmission provided in contact with the housing or the circuit board. An image pickup unit comprising a heat member, wherein the heat transfer member has a heat conductivity higher than a heat conductivity of the housing, and further includes a mounting portion for the member to be installed of the image pickup unit.

  According to the present disclosure, it is possible to provide an imaging unit capable of suppressing a temperature rise.

FIG. 1 is a perspective view illustrating an example of an overall configuration of an imaging unit according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the imaging unit shown in FIG. FIG. 2 is a perspective view illustrating an example of an overall configuration of a camera provided in the imaging unit illustrated in FIG. 1. FIG. 2 is a diagram illustrating a heat transfer structure of the imaging unit illustrated in FIG. 1. FIG. 5 is a cross-sectional view illustrating a heat transfer structure of the imaging unit illustrated in FIG. 1, and is a cross-sectional view taken along line XX of FIG. 4 illustrating a heat transfer structure of the image sensor. FIG. 6 is a cross-sectional view of an imaging unit according to an embodiment different from the imaging unit shown in FIG. 1, showing an internal structure near an image sensor substrate (FIG. 6A) and an internal structure near an image processing substrate (FIG. 6B). ). FIG. 2 is a perspective view illustrating an overall configuration of an imaging unit according to an embodiment different from the imaging unit illustrated in FIG. 1. FIG. 8 is a diagram illustrating an example of an overall configuration of an imaging unit when the imaging unit illustrated in FIGS. 1 and 7 is applied to an FA. FIG. 2 is a perspective view illustrating an overall configuration of an imaging unit according to an embodiment different from the imaging unit illustrated in FIG. 1. It is YY sectional drawing of the imaging unit shown in FIG. 9, and is a schematic diagram which shows the internal structure of an imaging unit.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the specification and the drawings, components having substantially the same function and configuration are denoted by the same reference numerals, and redundant description is omitted.

[First Embodiment]
<Configuration of imaging unit 1>
The overall configuration of the imaging unit 1 according to the present embodiment will be described with reference to the drawings. FIG. 1 is a perspective view illustrating an example of the entire configuration of an imaging unit according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the imaging unit shown in FIG.

  As shown in FIG. 1, the imaging unit 1 includes a plurality of (two in FIG. 1) monocular cameras (imaging devices) 11 and 12, a housing 15 that holds the monocular cameras 11 and 12, a circuit board, Is provided. The imaging unit 1 includes a heat transfer member provided in contact with the housing 15 or the circuit board. The circuit board is housed inside the housing 15.

  The circuit board includes an image sensor substrate 22a of each of the monocular cameras 11 and 12, and an image processing substrate 30a for processing images captured by the monocular cameras 11 and 12. An image sensor 22b is mounted on the image sensor substrate 22a (see FIG. 3), and an electronic component 30b for image processing is mounted on the image processing substrate 30a (see FIG. 1).

  In the present embodiment, the heat transfer members 38 a and 38 b are arranged one by one on the upper and lower surfaces of the housing 15. Since the case 15 is in contact with the heat transfer members 38a and 38b, surface contact of a larger area is possible, so that the heat of the case 15 can be effectively transferred to the outside.

  The imaging unit 1 further includes an installation member (bracket) 16 for attaching the imaging unit 1 to a member to be installed. The member to be installed is, for example, a windshield F of a vehicle. A flat bracket 16 is installed on the left and right side surfaces of the housing 15.

  The mounting of the bracket 16 is performed by adjusting the position by engaging the convex protrusions 18 provided on the left and right side surfaces of the housing 15 with the concave grooves 19 provided on the bracket 16. Specifically, as shown in FIG. 2, the position is adjusted while moving the projection 18 along the groove 19, and after the position adjustment, the position is fixed to the left and right side surfaces of the housing 15 with the screw 20. The bracket 16 includes a mounting portion 16a for a member to be installed in order to mount the imaging unit 1 on the windshield F. Then, the image pickup unit 1 is installed in the vehicle by fixing the mounting portion 16a of the bracket 16 to the windshield F. The fixing of the mounting portion 16a to the windshield F is performed, for example, by bonding the mounting portion 16a and the surface of the windshield F together with an adhesive or a double-sided tape. Alternatively, the screws may be screwed into the screw holes of the front glass F and fastened.

  Note that the imaging unit 1 may be installed on the windshield F by fixing the heat transfer member 38a to the windshield F. The heat transfer member 38a is fixed to the windshield F by an adhesive, a double-sided tape, a screw, or the like, as described above.

  The housing 15 includes a first housing 15a and a second housing 15b attached to the first housing 15a, and the monocular cameras 11 and 12 are separated from each other by a predetermined distance. It is attached to the housing 15a. Specifically, the monocular camera 11 is attached to one end (the left side in FIG. 1) of the first housing 15a, and the monocular camera 12 is attached to the other end (the right side in FIG. 1).

  The subject is photographed by the two monocular cameras 11 and 12, respectively. The monocular cameras 11 and 12 are fixed to the housing 15 from the back side by screws 35 (in FIG. 2, three places per monocular camera).

  The monocular cameras 11 and 12 are arranged on engaging portions 13 and 14 (see FIG. 2) provided at both ends of the first housing 15a. The monocular cameras 11 and 12 perform position adjustment while engaging with the engagement portions 13 and 14 such that the front surface 15c of the first housing 15a orthogonal to the imaging direction (optical axis) becomes a reference surface, and After the adjustment, the monocular cameras 11 and 12 are attached to the first housing 15a from the back side with the screws 35. In FIG. 1, an xy plane indicates a reference plane, and a z-axis perpendicular to this plane indicates an optical axis direction.

  As described above, the heat transfer member is disposed on the upper and lower surfaces of the housing 15, and in the following description, the heat transfer member disposed on the upper surface of the housing 15 (the first housing 15 a) is referred to as the heat transfer member 38 a. Called. The heat transfer member disposed on the lower surface of the housing 15 (the second housing 15b) is referred to as a heat transfer member 38b.

  The heat transfer member 38a is provided so as to be in contact with the housing 15 (the first housing 15a). The heat transfer member 38a is provided between the monocular camera 11 and the monocular camera 12 so as to be in contact with the housing 15 (see a hatched portion S1 in FIG. 1). Since the first housing 15a is brought into contact with the heat transfer member 38a, surface contact of a larger area is possible, so that the heat of the first housing 15a can be effectively transferred to the outside. it can.

  The heat transfer member 38a is arranged at a position such that the heat transfer member 38a contacts the windshield F when the imaging unit 1 is installed on the windshield F. Specifically, the position in the height direction (the y-axis direction in FIG. 1) of the contact surface of the heat transfer member 38a with the windshield F depends on the height direction of the attachment surface of the attachment portion 16a with the windshield F (see FIG. 1). The heat transfer member 38a is formed so as to be equal to the position (1 in the y-axis direction). Therefore, when fixing the mounting portion 16a of the bracket 16 to the windshield F, the heat transfer member 38a is arranged at a position in contact with the windshield F.

  The position of the mounting portion 16a and the heat transfer member 38a in the height direction (the y-axis direction in FIG. 1) are the same, and by fixing the mounting portion 16a to the windshield F, the heat transfer member 38a is attached to the windshield F. Touch In this case, the heat transfer member 38a only needs to have at least a part of the surface thereof in contact with the front glass F. However, it is preferable that the area in contact with the surface of the windshield F is large because the amount of heat transfer to the windshield F increases.

  The heat transfer member 38a is arranged on the first housing 15a by screws 40 (four places in FIG. 1). Specifically, the position of the heat transfer member 38a is adjusted by aligning the hole 15d with the screw hole 15e (see FIG. 2), and the heat transfer member 38a is fixed by the screw 40 so as to be in contact with the first housing 15a.

  The image sensor substrate 22a is attached to the monocular cameras 11 and 12, respectively. The image processing board 30a is fixed to the first housing 15a with screws (fastening members) 41 (two locations in FIG. 2), and after the image processing board 30a is fixed to the first housing 15a, the second housing 15b is fixed. Is attached to the first housing 15a.

  Then, the image processing board 30a is attached to the first housing 15a with a screw (fastening member) 41 in a region in contact with the second housing 15b. Specifically, the second housing 15b and the image processing board 30a are fixed such that the second housing 15b, the image processing board 30a, and the heat transfer member 38b are integrally fixed to the first housing 15a. And the positions of the holes 15f, 30c, 38c formed in the heat transfer member 38b are adjusted. After this position adjustment, the second housing 15b is attached to the first housing 15a with screws (fastening members) 42 (four places in FIG. 2). At this time, the image processing substrate 30a is attached to the first housing 15a by screws (fastening members) 42 (four places in FIG. 2) so as to be in contact with the second housing 15b inside.

  The image processing board 30a is provided so as to be in contact with the heat transfer member 38b via the second housing 15b. The heat transfer member 38b is provided so as to be in contact with the second housing 15b, and the image processing board 30a is provided so as to be in contact with the second housing 15b inside. Since the heat transfer member 38b comes into contact with the second housing 15b, a surface contact of a larger area becomes possible, so that the heat of the second housing 15b can be effectively transferred to the outside. it can.

  The range in which the heat transfer member 38b is in contact with the second housing 15b is a part of a portion of the back surface where the image processing board 30a is in contact with the second housing 15b (see S2 in FIG. 1). May be present or all. Alternatively, the image processing board 30a may be wider than the entire area where the image processing board 30a is in contact with the second housing 15b.

  In the present embodiment, the imaging unit 1 is mounted on the vehicle such that the direction (z-axis direction) orthogonal to the reference plane is the straight traveling direction of the vehicle, and the distance to the subject in the straight traveling direction of the vehicle is measured.

  In order to accurately recognize the subject in front of the vehicle, the imaging unit 1 is required to have extremely high mounting accuracy. Since the imaging unit 1 generates a distance image from parallax between a pair of captured images captured by the monocular cameras 11 and 12, a shift in the imaging direction (optical axis) directly affects the calculated distance. is there.

  However, the inclination angle of the windshield F differs depending on the vehicle type. Further, in practice, the imaging direction of the vehicle-mounted camera varies from one unit to another due to distortion of the vehicle body itself and limitations on the mounting accuracy of the camera. Therefore, it is preferable to prepare a plurality of types of brackets 16 having different shapes and mounting positions. Thereby, it is possible to provide the imaging unit 1 having the heat transfer structure corresponding to various vehicle types. Only by preparing a plurality of types of brackets 16, it is possible to install the imaging unit 1 that can keep the range of the optical axis shift within an appropriate range for each vehicle type.

  In the above, the case where two monocular cameras 11 and 12 are provided in the imaging unit 1 has been described as an example, but the present invention is not limited to this configuration. Three or more monocular cameras may be provided. Hereinafter, a case in which the imaging unit 1 is provided with two monocular cameras 11 and 12 will be described.

  Further, in the present embodiment, the case where the brackets 16 are separately attached to the left and right side surfaces of the housing 15 has been described as an example, but the present invention is not limited to this configuration. For example, the upper surface and the left and right side surfaces of the imaging unit 1 may be formed as a U-shaped integral type so as to be covered.

<Configuration of imaging device 11>
Next, the overall configuration of the monocular camera (imaging device) provided in the imaging unit 1 will be described with reference to the drawings. FIG. 3 is a perspective view illustrating an example of an overall configuration of a camera provided in the imaging unit illustrated in FIG.

  The monocular camera 11 provided in the imaging unit 1 includes a holder 31, a lens 32 provided on the front side of the holder 31, and a lens fixing member (lens cell) 33 holding the lens 32. The monocular camera 11 is provided with an image sensor substrate 22a, and the image sensor 22b is mounted on the image sensor substrate 22a. In this embodiment, the subject side is the front side. The configuration of the monocular camera 12 is also basically the same as the configuration of the monocular camera 11.

  The imaging element 22b is not limited to a CCD (Charge Coupled Device), but may be a CMOS (Complementary Metal Oxide Semiconductor) or the like. In the imaging unit 1, two monocular cameras 11 and 12 are arranged so that their optical axes are parallel to each other at a distance of a predetermined base line length.

  By providing the two monocular cameras 11 and 12 in this manner, the distance to the subject can be measured using the parallax (base line length) between the left and right monocular cameras 11 and 12.

<Heat transfer structure of imaging unit 1>
Next, the heat transfer structure of the imaging unit 1 will be described with reference to the drawings. FIG. 4 is a diagram illustrating a heat transfer structure of the imaging unit 1 shown in FIG.

  As described above, the housing 15 houses the imaging device substrate 22a and the image processing substrate 30a (circuit board) inside, and the imaging device 22b and the electronic component 30b are mounted on each of the substrates 22a and 30a. ing.

<Heat transfer structure of image sensor 22b>
First, the heat transfer structure of the image sensor 22b mounted on the image sensor substrate 22a will be described. FIG. 5 is a cross-sectional view illustrating the heat transfer structure of the imaging unit 1 illustrated in FIG. 1, and is a cross-sectional view taken along line XX of FIG. 4 illustrating the heat transfer structure of the image pickup device.

  After adjusting the position of the image sensor substrate 22a with respect to the holder 31, the image sensor substrate 22a is fixed in contact with the back surfaces of the holders 31 of the monocular cameras 11, 12 by screws 35 (see FIG. 5). In a state where the imaging element substrate 22a is fixed to the monocular cameras 11 and 12, the monocular cameras 11 and 12 are arranged on the engaging portions 13 and 14 (see FIG. 2) provided at both ends of the housing 15. As a result, the holders 31 of the monocular cameras 11 and 12 come into contact with the housing 15 (first housing 15a). Then, the heat transfer member 38a is fixed to the first housing 15a by screws 40 (see FIG. 5). That is, the heat transfer member 38a is provided in contact with the housing 15 (the first housing 15a).

  The heat transfer member 38a is arranged at a position where it contacts the windshield F when the imaging unit 1 is installed on the windshield F. That is, when the imaging unit 1 is installed on the windshield F, the heat transfer member 38a comes into contact with the windshield F.

  With the above configuration, as shown in FIG. 4, the heat of the image sensor 22 b, which is a heat source, is conducted to the image sensor substrate 22 a and passes through the holders 31 of the monocular cameras 11 and 12 to form the first housing. The heat is transmitted from the heat transfer member 15a to the heat transfer member 38a and released to the outside (see the white arrow).

  More specifically, the heat of the image sensor 22b is conducted to the holder 31 via the image sensor substrate 22a (see arrow A1 in FIG. 5). Next, the heat conducted to the holder 31 is conducted to the first housing 15a in contact with the holder 31 (see arrow A2 in FIG. 5). Next, the heat conducted to the first casing 15a is conducted to the heat transfer member 38a fixed in contact with the first casing 15a (see the arrow A3 in FIG. 5). Further, the imaging unit 1 is installed on the windshield F such that the heat transfer member 38a is in contact with the windshield F. Therefore, the heat inside the housing 15 that has become high temperature due to the heat generated by the imaging element 22b is released to the outside of the vehicle through the windshield F (see arrow A4 in FIG. 5) (see arrow A5 in FIG. 5).

  The imaging element substrate 22a is preferably made of a material having excellent heat conductivity and heat radiation (for example, thick copper).

  Thereby, the heat inside the housing 15 can be efficiently transferred from the inside of the housing 15 having a small heat capacity to the outside of the housing 15 having a large heat capacity.

<Heat transfer structure of electronic component 30b>
Next, a heat transfer structure of the electronic component 30b mounted on the image processing board 30a will be described.

  As described above, the image processing substrate 30a is provided so as to be in contact with the heat transfer member 38b via the second housing 15b. Specifically, the image processing substrate 30a is fixed to the first housing 15a with the screws 41, and after the image processing substrate 30a is fixed, the second housing 15b is attached to the first housing 15a with the screws 42. The heat transfer member 38b is fixed so as to be in contact with the second housing 15b. As a result, the image processing board 30a comes into contact with the inside of the second housing 15b, and the heat transfer member 38b comes into contact with the surface of the second housing 15b. The bracket 16 is attached to the left and right side surfaces of the first housing 15a and the second housing 15b so as to be in contact with the heat transfer member 38b.

  With the above configuration, as shown in FIG. 4, the heat of the electronic component 30b, which is a heat source, is conducted to the image processing board 30a, and from the second housing 15b, through the heat transfer member 38b, to the bracket 16b. Through the heat transfer member 38a, and is discharged to the outside of the vehicle (see the arrow).

  More specifically, the heat of the electronic component 30b is conducted to the image processing board 30a (see the arrow B1 in FIG. 4). Next, the heat conducted to the image processing board 30a is conducted to the second housing 15b (see the arrow B2 in FIG. 4). Next, the heat conducted to the second casing 15b is conducted to the heat transfer member 38b in contact with the second casing 15b (see the arrow B3 in FIG. 4). Next, the heat conducted to the heat transfer member 38b is conducted to the bracket 16 (see arrow B4 in FIG. 4). Next, the heat conducted to the bracket 16 is conducted to the heat transfer member 38a (see arrow B5 in FIG. 4). Next, the heat conducted to the heat transfer member 38a is conducted through the windshield F, so that the heat inside the housing 15 that has become high temperature due to the heat generated by the electronic component 30b is released to the outside of the vehicle.

  Thus, the heat inside the housing 15 can be efficiently transferred from the inside of the housing 15 having a small heat capacity to the outside of the housing 15 having a large heat capacity.

  By transmitting the heat heated by the image pickup device 22b and the electronic component 30b to the heat transfer members 38a and 38b through the respective substrates 22a and 30a, the heat conducted to the heat transfer members 38a and 38b is naturally transferred to the outside of the vehicle. Heat can be dissipated.

  Here, as the material of the heat transfer members 38a and 38b, a material having a thermal conductivity higher than the thermal conductivity of the housing 15 is preferable because heat is easily conducted. The material of the heat transfer members 38a and 38b is not particularly limited as long as it has better heat conductivity than the housing 15. For example, aluminum, copper, and the like are preferable because of their excellent thermal conductivity.

  Since the heat transfer members 38a and 38b have a higher thermal conductivity than the heat conductivity of the housing 15, the heat of the housing 15 escapes to the heat transfer members 38a and 38b, and a rise in temperature can be suppressed. In the present embodiment, since the heat transfer member 38a is provided around the monocular cameras 11 and 12, it is possible to suppress the displacement of the positional relationship between the monocular cameras 11 and 12 due to an increase in temperature. If the distance between the monocular cameras 11 and 12 (the x-axis direction, the y-axis direction, and the z-axis direction in FIG. 1) is increased due to the expansion of the housing 15, the calculation accuracy of the distance may be reduced. Then, the decrease can be suppressed. The lens optical systems of the monocular cameras 11 and 12 are also vulnerable to heat. However, in the present embodiment, optical performance degradation due to a rise in the temperature of the lens optical systems can be suppressed.

  Note that it is preferable to apply heat conduction grease, gel, or the like around the housing 15 and around the fastening of the screw (fastening surface, screw hole, etc.). It is possible to reduce the temperature rise by reducing the thermal resistance of the member, and it is possible to further improve the thermal conductivity of the housing 15.

  In the above-described embodiment, the windshield F of the vehicle has been described as an example of the member to be installed, but the present invention is not limited to this configuration. For example, the imaging unit 1 may be installed on a frame (not shown) of a vehicle body instead of the windshield F. In this case, the heat conducted from the imaging device 22b and the electronic component 30b to the heat transfer member 38a is conducted to the frame of the vehicle body. The imaging unit 1 is installed on a frame of a vehicle body by fixing it with an adhesive, a double-sided tape, a screw, or the like.

[Second embodiment]
The first embodiment exemplifies a case where the heat transfer members 38a and 38b are provided in contact with the imaging element substrate 22a and the image processing substrate 30a via another member such as the holder 31 and the housing 15. Although described, the invention is not limited to this configuration. For example, a configuration may be employed in which the imaging element substrate 22a and the image processing substrate 30a are in direct contact with the heat transfer members 38a and 38b. FIG. 6 is a cross-sectional view of an imaging unit according to an embodiment different from the imaging unit shown in FIG. 1, showing an internal structure near an image sensor substrate (FIG. 6A) and an internal structure near an image processing substrate (FIG. 6 (B)). Each white arrow indicates the direction of heat transfer.

  As shown in FIG. 6A, a heat transfer member 38a may be provided so as to be in direct contact with the imaging element substrate 22a. For example, the position of the imaging element substrate 22a is adjusted with respect to the holder 31. Then, the monocular cameras 11 and 12 are arranged on the engaging portions 13 and 14 (see FIG. 2) provided at both ends of the housing 15 (first housing 15a) in a state where the positions are adjusted. Thereafter, the holes of the image sensor substrate 22a and the holes of the heat transfer member 38a are aligned, the image sensor substrate 22a and the heat transfer member 38a are fixed to the back surface of the holder 31 with screws 35, and the monocular camera is attached to the first housing 15a. 11 and 12 are fixed. A part of the heat transfer member 38a protrudes from the first housing 15a, and when the imaging unit 1 is installed on the windshield F, the protruding portion is attached so as to be in contact with the windshield F. Thereby, the heat of the imaging element substrate 22a is directly transmitted to the heat transfer member 38a without passing through the holder 31 or the housing 15, and heat can be transferred effectively.

  As shown in FIG. 6B, a heat transfer member 38b may be attached to the image processing board 30a so as to be in direct contact with the image processing board 30a. For example, a window 15h is provided on a surface 15g of the second housing 15b in contact with the image processing board 30a, and the heat transfer member 38b is disposed on the window 15h. The heat transfer member 38b and the image processing board 30a are fixed to the first housing 15a by screws 42. The heat of the image processing substrate 30a is directly transmitted to the heat transfer member 38b without passing through the housing 15, and heat can be transferred effectively.

[Third Embodiment]
In the first embodiment, the case where the bracket 16 and the heat transfer members 38a and 38b are configured as separate members has been described as an example, but the present invention is not limited to this configuration. For example, as shown in FIG. 7, by using the heat transfer member 38b as a bracket, the cover 150a may be configured such that the heat transfer member 38b and the bracket are integrally formed. In this case, the heat transfer member 38b can also serve as the heat transfer member 38a. The imaging unit 100 is installed by fixing the mounting portion 150b to the windshield F with an adhesive, a double-sided tape, a screw, or the like. Accordingly, the number of components can be reduced, so that the imaging unit 100 can be provided at low cost and capable of suppressing a rise in temperature.

  At this time, the heat of the image sensor 22b is conducted in the order of the image sensor substrate 22a, the holder 31, the first housing 15a, the cover 150a (the mounting portion 150b), and the windshield F. Further, heat of the electronic component 30b is conducted in the order of the image processing board 30a, the second housing 15b, the cover 150a (the mounting portion 150b), and the windshield F.

  The material of the cover 150a is not particularly limited as long as it has thermal conductivity, rigidity, and workability. Aluminum is preferred as a material having thermal conductivity, rigidity and workability, but is not particularly limited as long as it has properties equivalent to aluminum (high thermal conductivity, low linear expansion coefficient, etc.).

  Alternatively, the heat transfer member 38b may be used as a bracket, and the first housing or the second housing and the bracket may be integrally formed. As a result, the number of components can be further reduced, so that cost reduction can be realized. Further, since the first housing or the second housing and the bracket are formed integrally, the trouble of adjusting the position of the bracket is not required, and the assembling property is excellent. Further, since complicated processing such as projections and grooves is not required for the housing or the bracket, the number of manufacturing steps can be reduced.

  Since the imaging unit according to the first to third embodiments has the above-described heat transfer structure, the heat generated by the image sensor 22b and the electronic component 30b can be efficiently transferred to the outside of the vehicle with a simple configuration. can do.

  Further, in each of the above embodiments, the case where the image sensor substrate 22a, the image sensor 22b, the image processing substrate 30a, the electronic component 30b, and the heat transfer member are attached to the housing 15 with screws is described as an example. The present invention is not limited to this configuration. The fixing method is not particularly limited as long as the above components can be fixed to the housing 15, respectively.

[Fourth embodiment]
In the first to third embodiments, the case where the imaging unit is applied to a vehicle is described, but the present invention is not limited to this configuration. For example, the present invention may be applied to FA (Factory Automation) and used to calculate a distance to a picking target when picking a product or the like conveyed in a production factory.

<Configuration when imaging units 1 and 100 are applied for FA>
FIG. 8 is a diagram illustrating an example of the entire configuration of the imaging unit when the imaging unit illustrated in FIGS. 1 and 7 is applied to FA.

  As shown in FIG. 8, the imaging units 1 and 100 have monocular cameras 11 and 12 on the left and right, and a product (for example, an iron body) 1200 is arranged on a table 1210. The monocular cameras 11 and 12 are arranged at positions where products 1200 arranged on a table 1210 can be photographed.

  When the imaging units 1 and 100 are applied for FA, the imaging units 1 and 100 are fixed to a holding frame (member to be installed) 50. The height of the mounting surface of the holding frame 50 on which the imaging units 1 and 100 are installed is adjusted to a position at which the product 1200 disposed on the table 1210 can photograph. The holding frame 50 is formed by a combination of a plurality of metal plate members 50a. By fixing the mounting portion 16a of the bracket 16 (or the mounting portion 150b of the cover 150a) to the plate member 50a with a screw, a fixing tool, an adhesive, a double-sided tape, or the like, the imaging units 1 and 100 are mounted on the holding frame 50. Install.

  In this case, the heat conducted from the imaging device 22b and the electronic component 30b to the heat transfer member 38a (or the cover 150a and the mounting portion 150b) is conducted to the holding frame 50 and released to the atmosphere.

  The material of the holding frame 50 is not particularly limited as long as it has thermal conductivity, rigidity, and workability. Aluminum is preferred as a material having thermal conductivity, rigidity and workability, but is not particularly limited as long as it has properties equivalent to aluminum (high thermal conductivity, low linear expansion coefficient, etc.).

  As described above, even when the imaging units 1 and 100 are applied for FA, heat inside the housing 15 is transferred from the inside of the housing 15 having a small heat capacity to the outside of the housing 15 having a large heat capacity. Heat can be transferred.

[Fifth Embodiment]
In each of the above embodiments, the case where the heat transfer member is arranged outside the housing 15 has been described as an example. However, the heat transfer member may be arranged inside the housing 15. In addition, by performing surface treatment by radiation on each surface of the housing 15, a rise in the temperature inside the housing 15 can be suppressed.

<Configuration of imaging unit 200>
The schematic configuration of the imaging unit 200 according to the present embodiment will be described with reference to the drawings. FIG. 9 is a perspective view illustrating an overall configuration of an imaging unit according to an embodiment different from the imaging unit illustrated in FIG. FIG. 10 is a YY sectional view of the imaging unit shown in FIG. 9 and is a schematic diagram showing the internal structure of the imaging unit 200.

  As shown in FIG. 9, the imaging unit 200 includes a plurality of (two in FIG. 1) monocular cameras (imaging devices) 11 and 12, a housing 15 that holds the monocular cameras 11 and 12, a circuit board, Is provided. The imaging unit 200 includes a heat transfer member provided in contact with the housing 15 or the circuit board. The circuit board is housed inside the housing 15. The member to be installed is, for example, a windshield F of a vehicle.

  The housing 15 includes a first housing 15a and a second housing 15b attached to the first housing 15a, and the monocular cameras 11, 12 are separated from each other by a predetermined distance. It is attached to the housing 15a. An internal component such as a circuit board is housed inside the housing 15, and the circuit board is provided inside the housing 15 as an intermediate member via a heat transfer member 380. In FIG. 10, a circuit board is an image processing board 300a that processes images captured by the monocular cameras 11 and 12.

  Specifically, an electronic component 300b for image processing is mounted on the image processing board 300a. The electronic component 300b is in contact with the heat transfer member 380, and the heat transfer member 380 is provided so as to be in contact with the housing 15. Heat transfer member 380 is arranged on the upper surface of electronic component 300b, and is attached so as to be in contact with back surface 17d of first housing 15a. As a result, the heat transfer member 380 is provided so as to be sandwiched between the upper surface of the electronic component 300b and the back surface 17d of the housing 15 (first housing 15a). The attachment of the heat transfer member 380 to the upper surface of the electronic component 300b is performed by, for example, applying heat conductive grease, gel, or the like. This is preferable because the heat conductivity of the heat transfer member 380 can be further improved.

  In the present embodiment, the case has been described in which the cross-sectional area of the heat transfer member 380 is formed to have a size having substantially the same cross-sectional area as the electronic component 300b, but the present invention is limited to this configuration. Not something. The cross-sectional area of heat transfer member 380 may be smaller than electronic component 300b. However, it is preferable that the surface area (cross-sectional area) of the heat transfer member 380 is large because the heat transfer amount increases and the heat radiation effect is excellent.

  Other configurations are basically the same as those of the imaging unit 1.

  Then, the imaging unit 200 is arranged on the windshield F of the vehicle such that the surface of the imaging unit 200 facing the windshield F (the upper surface 17a in FIG. 9) is a light receiving surface for sunlight. In addition, when the imaging unit 200 is installed on the windshield F, the upper surface of the housing 15 (first housing 15a) faces the outside of the vehicle body, and the lower surface of the housing 15 (second housing 15b) faces the interior of the vehicle. There is no particular limitation as long as it is suitable. For example, the imaging unit 200 may be installed near the windshield F (for example, near a room mirror). Or you may install so that the upper surface (1st housing | casing 15a) of the housing | casing 15 may contact the windshield F side.

<Heat transfer structure of imaging unit 200>
The heat transfer structure of the imaging unit 200 according to the present embodiment will be described with reference to FIG. In FIG. 10, a thin arrow indicates the direction of sunlight, a thick arrow indicates a direction in which heat moves, and a white arrow indicates a heat radiation direction.

  Each surface of the housing 15 of the imaging unit 200 is subjected to a surface treatment. The surface treatment applied to each surface of the housing 15 will be described with reference to FIG.

  The side surface 17b and the lower surface 17c of the housing 15 are subjected to surface treatment by high radiation. Radiation can be performed efficiently. The surface treatment by high radiation is performed, for example, by alumite treatment. The side surface 17b and the lower surface 17c of the housing 15 may be formed of a high radiation material, or the side surface 17b and the lower surface 17c may be coated with a high radiation paint.

  A rear surface 17d of the housing 15 is subjected to a surface treatment with low radiation. The surface treatment by low radiation is performed, for example, by polishing the metal material. A low radiation paint may be applied to the back surface 17d of the housing 15. The upper surface 17a of the housing 15 is also subjected to surface treatment with low radiation. The upper surface 17a of the housing 15 may be subjected to a surface treatment with low solar transmittance.

  In other words, the surface (upper surface 17a) facing the windshield F is subjected to a surface treatment for lowering the solar absorptivity while being installed on the windshield F of the vehicle. Then, the surface (the side surface 17b and the lower surface 17c) other than the surface facing the windshield F is subjected to a surface treatment for increasing the emissivity.

  Here, the surface treatment by high radiation on the side surface 17b and the lower surface 17c of the housing 15 is performed by transferring heat conducted from the electronic component 300b to the housing 15 through the heat transfer member 380 to the side surface 17b and the lower surface of the housing 15. This is for facilitating release from the 17c side.

  The reason why the surface treatment with low radiation is performed on the back surface 17d of the housing 15 is to prevent heat conducted from the electronic component 300b to the housing 15 from escaping into the housing 15.

  Furthermore, in this embodiment, since the upper surface 17a of the housing 15 is subjected to the low radiation processing, the heat reception to the housing 15 due to solar radiation (see the thin arrow in FIG. 10) can be reduced. In order to suppress heat reception due to solar radiation, it is preferable to perform a surface treatment with a low solar absorptivity on the upper surface 17a of the housing 15. For example, it is preferable to apply white paint to the upper surface 17a of the housing 15. The emissivity and the solar absorptivity can be reduced.

  Since the imaging unit 200 has the above configuration, the heat generated by the electronic component 300b is first conducted to the heat transfer member 380. Next, the heat conducted to the heat transfer member 380 is applied to the side surface 17b and the lower surface 17c of the case 15 subjected to the surface treatment by the high radiation from the back surface 17d subjected to the surface treatment by the low radiation. It is conducted (see the thick arrow in FIG. 10). Thereby, the heat generated by the electronic component 300b is released to the outside of the housing 15 (see the white arrow in FIG. 10).

  At this time, since the rear surface 17 d of the housing 15 has been subjected to the surface treatment with low radiation, the heat conducted from the heat transfer member 380 to the housing 15 does not escape into the housing 15. Therefore, heat does not stay inside the housing 15 and the temperature around the electronic component 300b does not rise rapidly. Further, since the upper surface 17a of the housing 15 is also subjected to surface treatment with low radiation, heat reception to the housing 15 due to solar radiation (see the thin arrow in FIG. 10) can be reduced, and the vicinity of the electronic component 300b can be reduced. Temperature can be further suppressed.

  As described above, according to the imaging unit 200, the heat inside the housing 15 can be efficiently radiated from the inside of the housing 15 having a small heat capacity to the outside of the housing 15 having a large heat capacity.

<Summary>
In the first to fourth embodiments, the imaging unit includes the heat transfer members 38a and 38b.

  More specifically, the heat transfer member 38a is provided so as to be in contact with the first housing 15a. Specifically, the heat transfer member 38a is provided between the monocular camera 11 and the monocular camera 12 so as to be in contact with the housing 15 (see the hatched portion S1 in FIG. 1). Since the first housing 15a is brought into contact with the heat transfer member 38a, surface contact of a larger area is possible, so that the heat of the first housing 15a can be effectively transferred to the outside. it can.

  The heat transfer member 38b is provided so as to be in contact with the second housing 15b. The range in which the heat transfer member 38b is in contact with the second housing 15b is a part of a portion of the back surface where the image processing board 30a is in contact with the second housing 15b (see S2 in FIG. 1). May be present or all. Alternatively, the image processing board 30a may be wider than the entire area in contact with the second housing 15b.

  The imaging element substrate 22a and the image processing substrate 30a may be provided so as to be in contact with the heat transfer members 38a and 38b via another member such as the housing 15. Since the case 15 is in contact with the heat transfer members 38a and 38b, surface contact with a wider area is possible, so that the heat of the case 15 can be effectively transferred to the outside.

  As shown in FIGS. 6A and 6B, the imaging element substrate 22a and the image processing substrate 30a may be configured to directly contact the heat transfer members 38a and 38b. Since the heat of the imaging element substrate 22a and the image processing substrate 30a is directly transmitted to the heat transfer members 38a and 38b without passing through another member such as the housing 15, the heat transfer is performed effectively. Can be.

  According to the first to fourth embodiments, the heat transfer members 38a and 38b are provided so as to come into contact with the windshield F in a state where the imaging unit 200 is installed on the windshield F (member to be installed).

  In the first, third, and fourth embodiments, the imaging device 22b, the imaging device substrate 22a, the holder 31, the housing 15 (the first housing 15a), the heat transfer member 38a (or the cover 150a), It has a first heat transfer path that is conducted in the order of the windshield F (or the holding frame). In the first, third, and fourth embodiments, the electronic component 30b, the image processing board 30a, the housing 15 (second housing 15b), the heat transfer member 38b, the bracket 16, and the heat transfer member 38a (or , Cover 150a), and windshield F in this order.

  Further, according to the second embodiment, the third heat transfer path that is transmitted in the order of the image sensor 22b, the image sensor substrate 22a, the heat transfer member 38a, and the windshield F, the electronic component 30b, the image processing board 30a, It has a fourth heat transfer path that is conducted in the order of the heat transfer member 38b. The heat of the imaging element substrate 22a and the image processing substrate 30a can be directly transmitted to the heat transfer members 38a and 38b without passing through the housing 15, so that heat can be transferred effectively.

  Therefore, the heat inside the housing 15 can be efficiently transferred from the inside of the housing 15 having a small heat capacity to the outside of the housing 15 having a large heat capacity.

  Further, according to the fifth embodiment, the heat transfer member 380 is arranged between the back surface of the housing 15 and the electronic component 300b, and the emissivity, the solar absorptance, and the like are considered on each surface of the housing 15. Various treatments have been applied.

  Therefore, according to the first to fifth embodiments, since the heat generated from the image sensor and the electronic components is released into the atmosphere through the heat transfer member, an image pickup unit capable of suppressing an increase in the internal temperature is provided. be able to. As a result, a decrease in the characteristics of the internal components due to a rise in temperature can be suppressed, and a decrease in the functions of the imaging unit can be suppressed. Therefore, the risk of failure of these internal components is reduced, and the life of the imaging unit is prolonged.

  Further, according to the first to fifth embodiments, even when the temperature inside the vehicle rises remarkably, such as during the daytime in summer, heat transfer to the outside or heat radiation is minimized while minimizing the influence of solar radiation. An imaging unit that can be efficiently performed can be provided.

  Further, according to the first to fifth embodiments, the heat generated by the internal components such as the image sensor can be efficiently released into the atmosphere by forming a heat transfer path utilizing the characteristics of the members. Therefore, a structure such as a heat radiating component such as a heat sink or a fan or a sunshade is not required, and the size and weight of the imaging unit can be reduced.

  Further, according to the first to fifth embodiments, even if the technology for speeding up the system and miniaturizing the stereo camera is further developed in the future, the heat will be trapped inside the housing and the image will be captured. The characteristics of the unit do not deteriorate.

  It should be noted that the present invention is not limited to the configurations shown here, such as combinations of the configurations described in the above embodiments with other elements. These points can be changed without departing from the gist of the present invention, and can be appropriately determined according to the application form.

1, 100, 200 Imaging unit 11, 12 Monocular camera (an example of an imaging device)
15 Housing 15a First housing 15b Second housing 16 Installation member (bracket)
16a Mounting part 22a Image sensor substrate (an example of a circuit board)
22b Image sensor 30a, 300a Image processing board (an example of a circuit board)
30b, 300b Electronic components 38a, 38b, 380 Heat transfer member F Windshield (an example of a member to be installed)

JP 2007-225543 A

Claims (10)

A plurality of imaging devices;
A housing for holding the plurality of imaging devices;
And a circuit board,
A heat transfer member provided in contact with the housing or the circuit board,
The imaging unit, wherein the heat transfer member has a thermal conductivity greater than a thermal conductivity of the housing, and includes an attachment portion for a member to be installed of the imaging unit.   The imaging unit according to claim 1, wherein the heat transfer member is provided in contact with the housing between the plurality of imaging devices.   The imaging unit according to claim 1, wherein the circuit board includes an imaging element substrate of the imaging device, and an image processing substrate that processes a captured image captured by the imaging device. The circuit board,
The imaging unit according to claim 1, wherein the imaging unit is attached to the housing by a fastening member in a region in contact with the housing.   The imaging unit according to any one of claims 1 to 4, wherein installation on the installation target member is possible only with the heat transfer member.   The imaging unit according to claim 1, wherein the circuit board is provided in contact with the housing via the heat transfer member. The installed member is a windshield of a vehicle,
The housing is
The imaging unit according to claim 6, wherein a surface treatment for reducing a solar absorptivity is performed on a surface facing the windshield while being installed on the windshield. The installed member is a windshield of a vehicle,
The housing is
8. The imaging unit according to claim 6, wherein a surface treatment for increasing an emissivity is performed on a surface other than a surface facing the windshield while being installed on the windshield. 9.   The imaging unit according to any one of claims 6 to 8, wherein a rear surface of the housing is subjected to a surface treatment for reducing an emissivity.   The imaging unit according to claim 1, wherein a material of the heat transfer member is aluminum.

Images