JP2020027923A - Wafer cassette - Google Patents

Abstract

To provide a wafer cassette capable of fixing a wafer container to the wafer cassette.SOLUTION: The external size of a wafer cassette 100 is the same as the external size of a second wafer cassette that can accommodate a second wafer larger than a first wafer. The wafer cassette 100 is provided with an accommodating portion 20 capable of accommodating the first wafer. An opening H1 is formed in the wafer cassette 100. On the opening H1 side of the wafer cassette 100, a fitting portion XV1 for fitting with a wafer container C5 is provided.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a wafer cassette for storing semiconductor wafers.

  A conventional semiconductor manufacturing line is configured based on the diameter (diameter) of a single semiconductor wafer and the material constituting the semiconductor wafer. Hereinafter, a semiconductor wafer is also referred to as a “wafer”. The shape of the wafer is a disk shape. Hereinafter, the wafer having a diameter of n inches is also referred to as “n inch wafer” or “n inch wafer”. “N” is a positive real number. In recent years, the diameter of wafers has been increasing.

  When the material forming the wafer is changed from Si to SiC or the like, it may be necessary to reduce the diameter of the wafer depending on the trend of the diameter of the wafer made of Si. In this case, the wafer cannot be manufactured on the semiconductor manufacturing line in the latest manufacturing support system. Therefore, there is a problem that it is necessary to use a manual production line of one generation before to manufacture the wafer.

  Further, in a FA (Factory Automation) line as a semiconductor manufacturing line corresponding to a standardized wafer diameter, a wafer cassette conforming to industry standards is used. Hereinafter, a semiconductor manufacturing apparatus used for manufacturing a semiconductor is also referred to as a “manufacturing apparatus”. The wafer cassette is mainly used in a semiconductor manufacturing process. Note that specifications of handling of wafers in each manufacturing apparatus are determined based on a wafer pitch, a wafer position, and the like that match the wafer cassette. The wafer pitch is, for example, a pitch (interval) of a groove, a slit, or the like. In addition, a jig of a batch apparatus is often designed based on a wafer pitch, a wafer position, and the like.

  More specifically, in a conventional semiconductor manufacturing line using a Si wafer, the configuration of the wafer accommodating portion, the wafer pitch, and the like are standardized according to the size of the diameter of the wafer. As described above, the FA line is operated by using the wafer cassette formed based on the standardized parameters. The outer size of the wafer cassette varies depending on the size of the diameter of the wafer.

  Therefore, an FA line in which a manufacturing apparatus conforming to various wafer standards is installed. The manufacturing apparatus, the jig inside the manufacturing apparatus, and the like are adjusted so that the handling is performed in accordance with the standard corresponding to the size of the diameter of the wafer. Therefore, for example, even if a 6-inch wafer compatible device is installed on an FA line dedicated to an 8-inch wafer, the 6-inch wafer compatible device can be used unless the wafer diameter and the wafer pitch of the wafer cassette are adjusted. There is a problem that can not be done.

  To cope with this problem, Patent Document 1 discloses a configuration (hereinafter, also referred to as “related configuration A”) in which a small-diameter wafer can be stored in a wafer cassette corresponding to a large-diameter wafer. In the related configuration A, an apparatus corresponding to a large-diameter wafer performs processing on a small-diameter wafer.

  Hereinafter, the diameter of the wafer is also referred to as “size Sz” or “Sz”. In the following, two types of wafers having different sizes Sz are also referred to as a small wafer and a large wafer. Large wafers are larger than small wafers.

JP-T-2013-518404

  In some cases, an FA line for performing processing on a small wafer using a wafer cassette corresponding to a large wafer is used. In the FA line, it is necessary to perform a process of moving the wafer contained in a wafer container capable of containing the wafer to a wafer cassette. In order to perform the processing as reliably as possible, it is necessary to fix the wafer container to the wafer cassette. The related configuration A cannot satisfy this requirement.

  The present invention has been made to solve such a problem, and has as its object to provide a wafer cassette capable of fixing a wafer container to the wafer cassette.

  In order to achieve the above object, a wafer cassette according to one embodiment of the present invention has a structure in which a wafer case or a wafer container, which is a first wafer cassette, capable of storing a first wafer is mounted. The size of the outer shape of the wafer cassette is the same as the size of the outer shape of the second wafer cassette capable of storing a second wafer larger than the first wafer, and the size of the outer shape of the second wafer cassette is The wafer cassette has a standardized size corresponding to the size of the second wafer, the wafer cassette is provided with an accommodation portion capable of accommodating the first wafer, and the wafer cassette has an opening formed therein. A first fitting portion for fitting with the wafer container is provided on the opening side of the wafer cassette.

  According to the present invention, an opening is formed in the wafer cassette. A first fitting portion for fitting with the wafer container is provided on the opening side of the wafer cassette. Thus, the wafer container can be fixed to the wafer cassette.

FIG. 2 is a perspective view showing a configuration of a wafer cassette according to the first embodiment. FIG. 2 is a front view of the wafer cassette according to the first embodiment. FIG. 3 is a top view of the wafer cassette according to the first embodiment. It is a figure for explaining another form of an identification part. FIG. 3 is an enlarged view showing a configuration around a plate according to the first embodiment. FIG. 9 is a diagram for explaining a wafer cassette according to a first modification. FIG. 3 is a perspective view showing a configuration of a wafer container as a wafer case.

  Hereinafter, embodiments will be described with reference to the drawings. In the following drawings, the same components are denoted by the same reference numerals. The components having the same reference numerals have the same names and functions. Therefore, a detailed description of some of the components having the same reference numerals may be omitted.

  Note that dimensions, materials, shapes, relative arrangements of the components, and the like of the components exemplified in the embodiment may be appropriately changed depending on the configuration of the apparatus to which the present invention is applied, various conditions, and the like. In addition, dimensions of each component in each drawing may be different from actual dimensions.

<First Embodiment>
FIG. 1 is a perspective view showing a configuration of a wafer cassette 100 according to the first embodiment. The wafer cassette 100 is a cassette for storing wafers.

  In FIG. 1, an X direction, a Y direction, and a Z direction are orthogonal to each other. The X, Y, and Z directions shown in the following figures are also orthogonal to each other. Hereinafter, a direction including the X direction and a direction opposite to the X direction (−X direction) is also referred to as “X-axis direction”. Hereinafter, a direction including the Y direction and a direction opposite to the Y direction (−Y direction) is also referred to as a “Y-axis direction”. Hereinafter, a direction including the Z direction and a direction opposite to the Z direction (−Z direction) is also referred to as a “Z-axis direction”.

  In the following, a plane including the X-axis direction and the Y-axis direction is also referred to as an “XY plane”. In the following, a plane including the X-axis direction and the Z-axis direction is also referred to as “XZ plane”. In the following, a plane including the Y-axis direction and the Z-axis direction is also referred to as a “YZ plane”.

  FIG. 2 is a front view of wafer cassette 100 according to the first embodiment. FIG. 3 is a top view of the wafer cassette 100 according to the first embodiment.

  In the present embodiment, description will be made using two types of wafers having different sizes Sz (diameters). Hereinafter, two types of wafers having different sizes Sz are also referred to as a wafer W1a and a wafer W1b. Wafer W1b is larger than wafer W1a. The size Sz of the wafer W1b is, for example, 8 inches. The size Sz of the wafer W1a is, for example, 6 inches.

  Hereinafter, a wafer cassette that can accommodate wafer W1b is also referred to as “wafer cassette Csb”. In the following, the size in the X-axis direction is also referred to as “size Szx”. In the following, the size in the Y-axis direction is also referred to as “size Szy”. In the following, the size in the Z-axis direction is also referred to as “size Szz”.

  In the following, the outer size of the wafer cassette is also referred to as “outer size Se”. Generally, the outer size Se of the wafer cassette is standardized in the semiconductor industry based on the size Sz of the wafer.

  Hereinafter, the outer size Se standardized in the semiconductor industry is also referred to as “standard outer size”. Note that the outer size Se of the wafer cassette 100 in the present embodiment is different from the standard outer size.

  Hereinafter, the outer size Se of the wafer cassette Csb is also referred to as “outer size Seb”. The outer size Seb of the wafer cassette Csb is a standard outer size corresponding to the size Sz of the wafer W1b. That is, the outer size Seb is a size standardized in the semiconductor industry.

  The outer size Seb has sizes Szx, Szy, and Szz. That is, the outer size Seb of the wafer cassette Csb is defined by the sizes Szx, Szy, and Szz of the outer size Seb.

  Referring to FIGS. 1, 2 and 3, the shape of wafer cassette 100 is substantially cylindrical. The outer size of the wafer cassette 100 is the same as the outer size (outer size Seb) of the wafer cassette Csb (not shown). That is, the size of the outer shape of the wafer cassette 100 is defined by the sizes Szx, Szy, and Szz of the outer size Seb.

  An opening H1 is formed in the wafer cassette 100. Hereinafter, the opening H1 side of the wafer cassette 100 is also referred to as an “opening”. The opening corresponds to the upper portion of wafer cassette 100 shown in FIGS.

  The wafer cassette 100 is provided with an accommodating portion 20 capable of accommodating the wafer W1a. The accommodation section 20 has a space Sp1. The space Sp1 is a space that can accommodate the wafer W1a. The space Sp1 is a space that is exposed to the outside of the wafer cassette 100 via the opening H1.

  The storage section 20 has a plurality of slit sections SL1. Each slit portion SL1 is a groove for holding one wafer W1a. The number of slits SL1 included in the storage unit 20 is a number corresponding to one lot which is a unit in production management. The number of the slit portions SL1 included in the housing portion 20 is 25 as an example.

  Each slit portion SL1 includes a slit SL1a and a slit SL1b. The interval between two adjacent slit portions SL1 included in the plurality of slit portions SL1 is a standard interval (hereinafter, also referred to as “interval Ia”) corresponding to the size Sz of the wafer W1a. The standard interval (interval Ia) is an interval standardized in the semiconductor industry based on the wafer size Sz. That is, the plurality of slit portions SL1 in the housing portion 20 are arranged with an interval Ia.

  Hereinafter, the container capable of accommodating the wafer W1a is also referred to as “wafer container C5”. The wafer container C5 is, for example, a wafer case (shipping case). The wafer case is a case used by a wafer manufacturer for carrying a wafer. FIG. 7 is a perspective view showing a configuration of a wafer container C5 as a wafer case.

  The wafer container C5 (wafer case) has a space Sp2 that can accommodate the wafer W1a. Further, the wafer container C5 has a plurality of slit portions SL2. Each slit portion SL2 is a groove for holding one wafer W1a. Each slit portion SL2 includes a slit SL2a and a slit SL2b.

  The plurality of slit portions SL2 are arranged with a standard interval (interval Ia) corresponding to the size Sz of the wafer W1a. Hereinafter, the width of each slit portion SL2 is also referred to as “width Wd2”. The width Wd2 is a width corresponding to the size Sz of the wafer W1a.

  The configuration for storing the wafer W1a in the storage unit 20 is the same as the configuration for storing the wafer W1a in the wafer container C5. Specifically, the interval between two adjacent slit portions SL1 in the storage section 20 is the same as the interval between two adjacent slit portions SL2 in the wafer container C5. Further, the width of each slit portion SL1 in the storage section 20 is the same as the width Wd2 of each slit portion SL2 of the wafer container C5.

  A fitting portion XV5 is provided on the upper part of the wafer container C5. The fitting portion XV5 is a fitting portion for performing positioning of the wafer container C5 (wafer case). The fitting portion XV5 has two projections X5 and two depressions V5.

  The wafer container C5 is not limited to a wafer case, and may be a wafer cassette.

  Referring again to FIGS. 1, 2 and 3, wafer cassette 100 has a structure in which wafer container C5 is attached to wafer cassette 100. On the opening H1 side (opening) of the wafer cassette 100, a fitting portion XV1 for fitting with the wafer container C5 is provided. The fitting portion XV1 is a fitting portion for aligning the position of the wafer cassette 100.

  The fitting portion XV1 is configured to fit with the fitting portion XV5 of the wafer container C5. The fitting portion XV1 has two projections X1 and two depressions V1. Each of the two protrusions X1 is configured to fit with two recesses V5 (fitting portion XV5). Each of the two depressions V1 is configured to be fitted with two projections X5 (fitting portions XV5).

  Hereinafter, the state of wafer cassette 100 in a state where fitting portion XV1 is fitted with wafer container C5 is also referred to as a “fitted state”. That is, the wafer cassette 100 has a fitting state. In the fitted state, the fitted portion XV1 is fitted with the fitted portion XV5 of the wafer container C5. Specifically, in the fitted state, each of the two projections X1 of the fitted portion XV1 is fitted with two recesses V5 (fitted portion XV5). In the fitted state, the two recesses V1 of the fitted portion XV1 are fitted with the two protrusions X5 (fitted portion XV5).

  Thus, the fitting portion XV1 is configured so that the fitting portion XV1 fits with the fitting portion XV5 of the wafer container C5. Therefore, rattling of the wafer cassette 100 and the wafer container C5 in the fitted state can be suppressed.

  In the fitted state, the fitting portion XV1 is provided such that the space Sp1 of the wafer cassette 100 and the space Sp2 of the wafer container C5 face each other.

  The wafer cassette 100 has side surfaces Sda, Sdb, Sdc, and Sdd. The side surfaces Sda and Sdb are two side surfaces parallel to each other. The identification unit 6 is provided on the side surface Sda.

  The identification unit 6 is a component for identifying the size of the outer shape of the wafer cassette 100. Hereinafter, the size of the outer shape of the wafer cassette 100 is also referred to as “outer size Se1”. The identification unit 6 is configured by, for example, a circular portion provided on the side surface Sda in FIG. The circular part is a circular hole. The circle may be a component other than the hole. The circle forming the identification unit 6 is, for example, a circular depression. In addition, the circular portion forming the identification unit 6 is, for example, a circular protrusion.

  In addition, the identification unit 6 may be configured by a linear portion provided on the side surface Sda in FIG. The linear portion that constitutes the identification unit 6 is, for example, a linear protrusion or a linear depression.

  In addition, the identification unit 6 may be configured by, for example, two parallel linear portions provided on the side surface Sda in FIG. Each of the two linear portions is a linear projection or a linear depression.

  Further, a fitting portion XV2 is provided on the opening H1 side (opening) of the wafer cassette 100 (see FIG. 1). Wafer cassette 100 further has an upper surface Sra and a lower surface Srb (see FIGS. 1 and 2). The bottom surface Srb is a surface of the wafer cassette 100 opposite to the upper surface Sra. The upper surface Sra is a part of the opening. The fitting portion XV2 is provided on the upper surface Sra (see FIG. 1). The fitting portion XV2 has two protrusions X2 and two depressions V2.

  Hereinafter, the center of wafer cassette 100 in plan view (XY plane) is also referred to as “center C1” or “C1”. The center C1 is the center of the wafer cassette 100 shown in FIG. In a plan view (XY plane), the fitting portion XV2 is provided outside the fitting portion XV1. That is, the distance from the center C1 to the fitting portion XV2 in plan view (XY plane) is longer than the distance from the center C1 to the fitting portion XV1 in plan view (XY plane). For example, the distance from the center C1 to the projection X2 (fitting portion XV2) in plan view (XY plane) is greater than the distance from the center C1 to the projection X1 (fitting portion XV1) in plan view (XY plane). Longer.

  In the following, another wafer cassette 100 having the same shape as that of wafer cassette 100 is also referred to as “wafer cassette K1”. The configuration of wafer cassette K1 is the same as the configuration of wafer cassette 100.

  Wafer cassette 100 is configured to fit with wafer cassette K1 (not shown). Specifically, a fitting portion XV3 is provided on the bottom surface Srb of the wafer cassette 100.

  The fitting portion XV3 of the wafer cassette 100 is configured to fit with the fitting portion XV2 of the wafer cassette K1. The fitting portion XV3 has two protrusions X3 and two depressions V3. Specifically, each of the two protrusions X3 of the fitting portion XV3 is configured to fit with two recesses V3 (the fitting portion XV3 of the wafer cassette K1). Each of the two recesses V3 is configured to be fitted with two projections X3 (fitting portions XV3 of the wafer cassette K1).

  Thus, a plurality of wafer cassettes 100 can be stacked in the vertical direction (Z-axis direction). For example, the wafer cassettes 100 can be stacked above the wafer cassette K1.

  Further, four plates 8 are provided above the side surface Sdc of the wafer cassette 100 (see FIG. 1). Each plate 8 has a fin shape. FIG. 5 is an enlarged view showing a configuration around plate 8 according to the first embodiment. The wafer cassette 100 is provided with a protrusion X4. The protrusion X4 is formed by a part of the upper part of the side surface Sdc. Each plate 8 is joined to the protrusion X4 and the side surface Sdc. Note that the number of plates 8 provided on the upper side of the side surface Sdc is not limited to four, and may be any one of 1 to 3 or 5 or more.

  Note that a plate 8 is also provided above the side surface Sdd of the wafer cassette 100, similarly to the side surface Sdc.

  Next, the position where the storage unit 20 is provided will be described with reference to FIG. Hereinafter, a region sandwiched between side surfaces Sda and Sdb in wafer cassette 100 is also referred to as “region Rg1”. In the following, the direction that intersects the side surface Sda and the second side surface Sdb is also referred to as “direction Dr1”. The direction Dr1 is the X-axis direction.

  Referring to FIG. 3, the length of accommodation section 20 in direction Dr1 is shorter than the length of region Rg1 in direction Dr1. The accommodation portion 20 is provided on one of the side surface Sda and the side surface Sdb in the region Rg1. In the configuration shown in FIG. 3, the housing section 20 is provided on the side surface Sda side of the region Rg1. Note that the accommodation section 20 may be provided on the side surface Sdb side of the region Rg1.

(Summary)
As described above, according to the present embodiment, opening H1 is formed in wafer cassette 100. On the opening H1 side of the wafer cassette 100, a fitting portion XV1 for fitting with the wafer container C5 is provided. Thus, the wafer container can be fixed to the wafer cassette.

  Further, according to the present embodiment, accommodation portion 20 of wafer cassette 100 has a configuration corresponding to wafer W1a. The fitting portion XV1 of the wafer cassette 100 is configured to fit with the fitting portion XV5 of the wafer container C5 as a wafer case (shipping case). Thereby, the rattling of the wafer cassette 100 and the wafer container C5 in the fitted state can be suppressed.

  In addition, the presence of the recess V1 in the fitting portion XV1 makes it possible to realize the movement of the wafer from the wafer case to the wafer cassette, which has been difficult due to the presence of the projection of the wafer case (shipping case). Therefore, according to the present embodiment, the state of the wafer cassette 100 is in the fitted state, so that the above-mentioned rattling is suppressed, and the wafer accommodated in the wafer container C5 serving as the wafer case is replaced with the wafer. The effect of being able to be easily moved to the cassette 100 is obtained.

  Hereinafter, a standardized wafer cassette that can accommodate the wafer W1b is also referred to as a “large wafer cassette”. In the following, a standardized wafer cassette that can accommodate the wafer W1a is also referred to as a “small wafer cassette”.

  Further, according to the present embodiment, the outer size of wafer cassette 100 is the same as the outer size (outer size Seb) of the large wafer cassette (wafer cassette Csb). Therefore, for example, a conventional FA line automatic transfer system corresponding to a large wafer cassette (wafer W1b) can be used as it is. The accommodation section 20 of the wafer cassette 100 has a configuration corresponding to the wafer W1a. Therefore, for example, in an FA line corresponding to a large wafer cassette, it is possible to easily perform the respective steps from the loading of the wafer W1a to the completion of the manufacture of the semiconductor.

  Further, in the FA system, handling adjustment is mainly performed based on the outer shape of the wafer cassette. The external size of the wafer cassette 100 of the present embodiment is the external size of the large wafer cassette. Therefore, in the FA system used for transferring a large wafer cassette, the transfer of the wafer cassette 100 can be realized.

  As described above, an apparatus used for manufacturing a semiconductor is also referred to as a “manufacturing apparatus”. The manufacturing apparatus is an apparatus used in each step in manufacturing a semiconductor. The manufacturing apparatus is, for example, an apparatus having a function of injecting carriers. The manufacturing apparatus is, for example, an apparatus having a function of cleaning the surface of a wafer.

  Further, in the FA system, after the wafer W1a is transported to each manufacturing apparatus corresponding to the wafer W1a, the wafer W1a is transported into the manufacturing apparatus by handling of each manufacturing apparatus.

  The handling of each manufacturing apparatus is adjusted mainly based on the interval between the slits in the wafer accommodating section. The interval between slit portions SL1 in accommodation portion 20 of wafer cassette 100 of the present embodiment corresponds to wafer W1a. Therefore, handling of each manufacturing apparatus corresponding to the wafer W1a can be utilized.

  There is also a manufacturing apparatus (hereinafter, also referred to as “manufacturing apparatus Pa”) that transports the entire wafer cassette into the manufacturing apparatus. Even in such a situation where the manufacturing apparatus Pa is used, the wafer can be moved from the wafer cassette 100 to a wafer cassette dedicated to the wafer W1a. Note that a fitting portion XV5 is provided in the wafer cassette dedicated to the wafer W1a, similarly to the wafer container C5 (wafer case). Therefore, by fitting the fitting portion XV1 of the wafer cassette 100 with the fitting portion XV5 of the wafer cassette dedicated to the wafer W1a, it is possible to move the wafer without rattling.

  If the manufacturing apparatus Pa in which the wafer cassette is accommodated inside the manufacturing apparatus Pa is used, it is effective to identify the outer size of the wafer cassette by the identification unit provided on the side surface of the wafer cassette.

  The manufacturing apparatus Pa is provided with a mounting table on which the wafer cassette 100 is mounted. The wafer cassette 100 is mounted on the mounting table of the manufacturing apparatus Pa such that the surface of the wafer W1a accommodated in the accommodation section 20 of the wafer cassette 100 extends in the horizontal direction (lateral direction). That is, the wafer cassette 100 is mounted on the mounting table so that the side surface Sda (opening H1) of the wafer cassette 100 extends in the horizontal direction (lateral direction). That is, the wafer cassette 100 is mounted on the mounting table such that the side surface Sda of the wafer cassette 100 faces the upper surface of the mounting table. In addition, on the upper surface of the mounting table of the manufacturing apparatus Pa, a fitting portion for identification (hereinafter, also referred to as “fitting portion for identification”) is provided. The identification fitting portion is provided at a position where it can be fitted with the identification portion 6. The identification fitting portion has a shape that can be fitted to the identification portion 6.

  Thus, for example, it is possible to identify whether the wafer cassette 100 is a wafer cassette corresponding to, for example, a small wafer cassette or a large wafer cassette, based on the shape of the identification unit 6. The identification unit 6 is configured in association with the outer size Se of the wafer cassette 100.

  Specifically, the manufacturing apparatus Pa can specify the outer size Se of the wafer cassette 100 based on whether or not the identification unit 6 is fitted with the identification fitting unit. Here, it is assumed that the fitting portion for identification has a configuration corresponding to the outer size Se of the large wafer cassette described above. In this case, when the identification section 6 is fitted with the identification fitting section, the manufacturing apparatus Pa specifies that the outer size Se of the wafer cassette 100 is the outer size Se of the large wafer cassette.

  Note that a configuration may be employed in which the outer size Se of the wafer cassette is specified using laser light instead of fitting.

  By providing the identification unit 6 in the wafer cassette 100, the manufacturing apparatus Pa in each process can specify the outer size Se (shape) of the wafer cassette. Therefore, handling by the manufacturing apparatus Pa in each step can be performed. That is, it is possible to realize the correspondence from the loading of the wafer to the transfer and the manufacturing in the FA line. That is, the transfer of the wafer cassette in each step can be facilitated.

  In addition, the identification part 6 is comprised by a protrusion, a hollow, or a hole. Therefore, erroneous installation of the wafer cassette or the like can be easily detected by simply changing the fitting portion for identification without providing a special configuration.

  Further, according to the present embodiment, fitting portion XV2 is provided on upper surface Sra of wafer cassette 100, and fitting portion XV3 capable of fitting with fitting portion XV2 of wafer cassette K1 is provided on bottom surface Srb. I have. Thereby, a plurality of wafer cassettes 100 can be stacked.

  Further, according to the present embodiment, a plurality of fin-shaped plates 8 are provided above the side surfaces Sdc and Sdd of the wafer cassette 100. Each plate 8 functions as a plate-like support plate for increasing the distortion strength of the wafer cassette. Note that the large wafer cassette dedicated to the wafer W1b is not provided with a plate-like support plate. Due to the presence of the plate 8, the occurrence of distortion in the wafer cassette 100 can be suppressed.

  In addition, when the outer size Se of the wafer cassette 100 is the outer size Se of the large wafer cassette corresponding to the wafer W1b, and the accommodating portion 20 inside the wafer cassette 100 has a configuration corresponding to the wafer W1a, the wafer W1a Reinforcement is required due to the difference in the size of the wafer W1b. Each plate 8 is provided for the reinforcement.

  Further, according to the present embodiment, accommodation portion 20 is provided on side surface Sda in region Rg1.

  The manufacturing apparatus is provided with a wafer detection sensor. The wafer detection sensor is a sensor for detecting whether or not a wafer exists in the wafer cassette. That is, the wafer detection sensor is a sensor for detecting the presence or absence of a wafer.

  When the manufacturing apparatus is used, the wafer cassette 100 is set such that the side surface Sda of the wafer cassette 100 is below the wafer cassette 100. Further, the wafer detection sensor is provided at a position facing the side surface Sda of the installed wafer cassette 100. In this case, the distance between the wafer detection sensor and the housing 20 can be reduced. Therefore, the manufacturing apparatus can determine the presence or absence of a wafer in a short time.

  Note that the wafer cassette in the related configuration A is used only in a limited device. For this reason, in the related configuration A, there is a problem that it is difficult to perform handling in a plurality of manufacturing apparatuses included in the FA line and performing a plurality of processes from wafer input to completion of semiconductor manufacturing.

  Therefore, wafer cassette 100 of the present embodiment has a configuration for achieving the above effects. Therefore, the above problem can be solved by wafer cassette 100 of the present embodiment.

<Modification 1>
In addition, the position of the accommodation unit 20 is not limited to the position in FIG. FIG. 6 is a view for explaining a wafer cassette 100 according to the first modification. In the wafer cassette 100 according to the first modification, for example, as illustrated in FIG. 6, the storage unit 20 is provided at the center of the region Rg1 in the direction Dr1.

  As described above, according to the present modification, the storage section 20 is provided at the center of the wafer cassette 100. Therefore, the weight balance of the wafer cassette 100 can be improved. As a result, the strength of the wafer cassette may be increased, and reinforcement of the wafer cassette may not be required. For this reason, the configuration for reinforcing the wafer cassette (for example, the plate 8) can be reduced. Further, when the manufacturing apparatus needs to be remodeled, the degree of freedom of the remodeling range of the manufacturing apparatus can be improved, and the investment in the manufacturing apparatus can be reduced.

  Note that, depending on the position of the wafer detection sensor, there is a situation in which it is desirable that the storage unit 20 be provided at the center of the region Rg1 instead of the end of the region Rg1. In such a situation, the configuration of the present modified example is effective.

  In the present invention, the embodiments and the modified examples can be freely combined, and the embodiments and the modified examples can be appropriately modified and omitted within the scope of the invention.

  For example, the size Sz of the wafer W1b is 8 inches and the size Sz of the wafer W1a is 6 inches, but the present invention is not limited to this. As an example, the size Sz of the wafer W1b may be 12 inches, and the size Sz of the wafer W1a may be 8 inches. In this configuration, the outer size Se of the wafer cassette 100 is the outer size Se of the wafer cassette corresponding to 12-inch wafers. In this configuration, the storage section 20 of the wafer cassette 100 has a configuration capable of storing 8-inch wafers.

  Further, for example, the fitting portion XV1 is not limited to the configuration having the protrusion X1 and the recess V1. The fitting portion XV1 may be configured to have, for example, a plurality of protrusions X1 without the recess V1. Further, the fitting portion XV1 may be configured to have, for example, a plurality of depressions V1 without the projection X1.

  Further, for example, the fitting portion XV2 is not limited to the configuration having the protrusion X2 and the recess V2. The fitting portion XV2 may be configured to have, for example, a plurality of protrusions X2 without the recess V2. Further, the fitting portion XV2 may be configured to have, for example, a plurality of depressions V2 without having the projection X2.

  8 plates, 20 storage units, 100, K1 wafer cassette, C5 wafer container, SL1, SL2 slit, V1, V2, V3, V5 recess, X1, X2, X3, X5 protrusion, XV1, XV2, XV3, XV5 fitting Department.

Claims (13)

A wafer cassette having a structure in which a wafer container capable of accommodating a first wafer and being a wafer case or a first wafer cassette is mounted,
The size of the outer shape of the wafer cassette is the same as the size of the outer shape of the second wafer cassette that can accommodate a second wafer larger than the first wafer;
The size of the outer shape of the second wafer cassette is a standardized size corresponding to the size of the second wafer,
The wafer cassette is provided with an accommodating portion capable of accommodating the first wafer,
An opening is formed in the wafer cassette,
A wafer cassette provided with a first fitting portion for fitting the wafer container on the opening side of the wafer cassette. The wafer cassette according to claim 1, wherein the first fitting portion has at least one of a first protrusion and a first recess. The storage section is a space that can store the first wafer, and has a space that is exposed to the outside of the wafer cassette through the opening.
In the state of the wafer cassette, there is a fitting state in which the first fitting portion is fitted with the wafer container,
The first fitting portion is provided such that, in the fitted state, the space and another space of the wafer container that can accommodate the first wafer face each other. 2. The wafer cassette according to 1. The wafer cassette according to any one of claims 1 to 3, wherein the storage section has a slit section for holding the first wafer. The wafer cassette has a first side surface,
The wafer cassette according to any one of claims 1 to 4, wherein the first side surface is provided with an identification unit including a protrusion, a depression, or a hole. The wafer cassette according to claim 5, wherein the identification unit is a component for identifying an outer size of the wafer cassette. A second fitting portion is further provided on the opening side of the wafer cassette,
The distance from the center of the wafer cassette to the second fitting portion in plan view is longer than the distance from the center to the first fitting portion in plan view. 2. The wafer cassette according to 1. The wafer cassette according to claim 7, wherein the second fitting portion has at least one of a second protrusion and a second recess. The wafer cassette is configured to be fitted with a third wafer cassette having the same shape as the shape of the wafer cassette,
A third fitting portion is provided on a bottom surface of the wafer cassette,
The wafer cassette according to claim 7, wherein the third fitting portion of the wafer cassette is configured to fit with the second fitting portion of the third wafer cassette. The wafer cassette has a first side surface and a second side surface that are parallel to each other,
The said accommodation part is provided in one side of the said 1st side surface and the said 2nd side surface among the area | regions sandwiched between the said 1st side surface and the said 2nd side surface. The wafer cassette as described. The wafer cassette has a first side surface and a second side surface that are parallel to each other,
In the direction intersecting the first side surface and the second side surface,
The wafer cassette according to any one of claims 1 to 9, wherein the wafer cassette is provided at a central portion of a region sandwiched between the first side surface and the second side surface. The wafer cassette further has a third side surface,
The wafer cassette according to any one of claims 1 to 11, wherein a fin-shaped plate is provided on an upper portion of the third side surface. The wafer cassette is provided with a projection configured by a part of an upper portion of the third side surface,
The wafer cassette according to claim 12, wherein the plate is bonded to the protrusion and the third side surface.