JP2020027838A - Semiconductor device for wearable sensor device having sealing layer made of cured product of heat-curable fluoropolyether-based composition - Google Patents

Abstract

To provide a semiconductor device capable of constituting a wearable sensor device that is used in an environment where the wearable sensor device is brought into contact with a human body and that is stably usable for a long period without being affected by stains, etc., due to sweat and sebum of the human body.SOLUTION: There is provided a semiconductor device for a wearable sensor device that has a sealing layer, as a protective material, composed of a cured product of a heat-curable fluoropolyether-based composition containing: (A) a straight-chain polyfluoro compound having two or more alkenyl groups in one molecule and also having a perfluoropolyether structure in a main chain; (B) fluorine-containing organohydrogensiloxane having a univalent perfluoroalkyl group or a univalent perfluorooxyalkyl group or a divalent perfluoroalkylene group or a divalent perfluorooxyalkylene group in one molecule, and further having two or more hydrogen atoms directly bonded to a silicon atom; and (C) a platinum-group metal-based catalyst.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a semiconductor device for a wearable sensor device having a sealing layer made of a cured product of a thermosetting fluoropolyether-based composition as a protective material, and particularly used in an environment that comes into contact with the human body.

  Conventionally, as a fluorine-containing curable composition, a linear fluoropolyether compound having at least two alkenyl groups in one molecule and having a perfluoropolyether structure in the main chain, and a silicon atom in one molecule A composition comprising a fluorine-containing organohydrogensiloxane having two or more hydrogen atoms directly connected to a metal and a platinum group metal compound has been proposed. From the composition, heat resistance, chemical resistance, solvent resistance, mold release, water repellency have been proposed. It is disclosed to obtain a cured product having an excellent balance of oil repellency, low-temperature characteristics, and the like (Patent Document 1: Japanese Patent No. 2990646).

  Further, a composition in which a linear fluoropolyether compound is changed has been proposed as a composition that gives a cured product having improved acid resistance than the cured product obtained from the composition described in Patent Document 1 (Patent Document 1). 2: Japanese Patent No. 5246190).

  By the way, a composition in which an organopolysiloxane having a hydrosilyl group and an epoxy group and / or a trialkoxysilyl group is added to these compositions to provide self-adhesiveness to metal and plastic substrates has been proposed. (Patent Literatures 3 and 4: Japanese Patent Nos. 3233917 and 5459033).

  Further, there has been proposed a composition in which an organosiloxane having a cyclic carboxylic anhydride residue is added to the composition having the self-adhesive property to improve the adhesive property (Patent Document 5: Japanese Patent No. 3556278). ).

  On the other hand, an invention related to a wearable sensor device that can be worn on a living body such as a human body, clothing, and the like is also disclosed (Patent Document 6: JP-A-2017-012674). Here, in a wearable sensor device such as a biocompatible sensor device that is attached to a living body such as a human skin and detects biological information such as an electrocardiogram of the living body and information of an ambient environment such as an ambient temperature and an atmospheric pressure of the living body. It is said that it is preferable to use a highly elastic silicone rubber as a base material. Silicone rubber is harmless even when it comes into contact with the human body, and has the advantage of being liquid and easy to handle before curing.

  However, since silicone rubber has a high water vapor transmission rate, when it is used as a protective material for electronic components, there is a possibility that the internal electronic components may be corroded by the moisture permeating. In addition, there is a concern that malfunction of the sensor or the like due to migration of an ionic substance such as sodium contained in sweat may occur.

Japanese Patent No. 2990646 Japanese Patent No. 5246190 Japanese Patent No. 3239717 Japanese Patent No. 5459033 Japanese Patent No. 3562578 JP 2017-012674 A

  The present invention has been made in view of the above circumstances, and in a wearable sensor device used in an environment that comes into contact with the human body, without being affected by dirt due to sweat or sebum of the human body, can be used stably for a long period of time. An object is to provide a semiconductor device which can constitute a wearable sensor device.

  The present inventor has conducted intensive studies to solve the above problems, and as a result, in a semiconductor device for a wearable sensor device, as a protective material (that is, a protective coating agent for a base material such as a lead frame, a sealing of a semiconductor element) Material, potting material for sensor elements (semiconductor elements), protective potting material for electronic circuits, anti-corrosion coating material for electric wiring, etc.) A sealing layer made of a cured product of a thermosetting fluoropolyether-based composition, at least semiconductor It has been found that by covering the entire surface of the element, a semiconductor device for a wearable sensor device that can be operated stably for a long period of time without being affected by dirt due to sweat or sebum on the human body can be obtained. Was completed.

（式（２）中、Ｒ¹及びＲ²は、アルケニル基、又は非置換若しくは置換の脂肪族不飽和結合を有さない１価の炭化水素基であり、Ｒ¹は互いに独立し、Ｒ²も互いに独立し、Ｒ¹及びＲ²の合計のうち二つ以上はアルケニル基である。Ｒ³は互いに独立して、水素原子、又は非置換若しくは置換の１価の炭化水素基であり、ｃ及びｄはそれぞれ１〜１５０の整数であって、かつｃ＋ｄの平均値は２〜３００であり、ｅは１〜６の整数である。）

（式（３）中、Ｒ⁴は互いに独立して、炭素数１〜６のアルキレン基であり、Ｒ⁵は互いに独立して、水素原子又はフッ素置換されていてもよい炭素数１〜４のアルキル基である。また、Ｒ¹及びＲ²は、アルケニル基、又は非置換若しくは置換の脂肪族不飽和結合を有さない１価の炭化水素基であり、Ｒ¹は互いに独立し、Ｒ²も互いに独立し、Ｒ¹及びＲ²の合計のうち二つ以上はアルケニル基である。ｃ及びｄはそれぞれ１〜１５０の整数であって、かつｃ＋ｄの平均値は２〜３００であり、ｅは１〜６の整数である。）
で表される直鎖状ポリフルオロ化合物である［１］〜［３］のいずれかに記載のウェアラブルセンサーデバイス用半導体装置。
［５］
熱硬化性フルオロポリエーテル系組成物の硬化物からなる封止層が、少なくともリードフレーム上に接着した半導体素子の表面全体を被覆するものである［１］〜［４］のいずれかに記載のウェアラブルセンサーデバイス用半導体装置。
［６］
人体に接触する環境で用いられるものである［１］〜［５］のいずれかに記載のウェアラブルセンサーデバイス用半導体装置。 That is, the present invention provides the following semiconductor device for a wearable sensor device.
[1]
(A) a linear polyfluoro compound having two or more alkenyl groups in one molecule and having a perfluoropolyether structure in the main chain: 100 parts by mass;
(B) one molecule has a monovalent perfluoroalkyl group or a monovalent perfluorooxyalkyl group, or has a divalent perfluoroalkylene group or a divalent perfluorooxyalkylene group, and Fluorinated organohydrogensiloxane having two or more hydrogen atoms (SiH groups) directly bonded to silicon atoms: 0.3 to 3 mol of SiH groups in component (B) per mol of alkenyl groups in component (A) Amount
(C) Platinum group metal-based catalyst: 0.1 to 2,000 ppm by mass of platinum group metal atom based on component (A);
A semiconductor device for a wearable sensor device having a sealing layer made of a cured product of a thermosetting fluoropolyether-based composition containing as a protective material.
[2]
The semiconductor device for a wearable sensor device according to [1], wherein the alkenyl group content of the linear polyfluoro compound as the component (A) is 0.005 to 0.3 mol / 100 g.
[3]
The component (A) has a perfluoropolyether structure represented by the following general formula (1)
_{- (C a F 2a O)} b - (1)
(In the formula (1), a is an integer of 1 to 6, and b is an integer of 1 to 300.)
The semiconductor device for a wearable sensor device according to [1] or [2], including the structure represented by:
[4]
The component (A) is represented by the following general formula (2) and / or the following general formula (3)

(In the formula (2), R ¹ and R ² is a monovalent hydrocarbon group having no alkenyl group, or an unsubstituted or substituted aliphatic unsaturated bonds, R ¹ is independently of one another, R ² also independently of one another, one or more two of the total of R ¹ and R ² is an alkenyl group .R ³ independently of one another are hydrogen atom, or an unsubstituted or substituted monovalent hydrocarbon group, c And d are each an integer of 1 to 150, and the average value of c + d is 2 to 300, and e is an integer of 1 to 6.)

(In formula (3), R ⁴ is independently of each other an alkylene group having 1 to 6 carbon atoms, and R ⁵ is independently of each other a hydrogen atom or a C 1 to C ⁴ optionally substituted with fluorine atom. is an alkyl group. Further, R ¹ and R ² is a monovalent hydrocarbon group having no alkenyl group, or an unsubstituted or substituted aliphatic unsaturated bonds, R ¹ is independently of one another, R ² Are independent of each other, and at least ^two of the total of R ¹ and R ² are alkenyl groups, c and d are each an integer of 1 to 150, and the average value of c + d is 2 to 300; Is an integer of 1 to 6.)
The semiconductor device for a wearable sensor device according to any one of [1] to [3], which is a linear polyfluoro compound represented by the following formula:
[5]
The sealing layer according to any one of [1] to [4], wherein the sealing layer made of a cured product of the thermosetting fluoropolyether composition covers at least the entire surface of the semiconductor element adhered on the lead frame. Semiconductor device for wearable sensor device.
[6]
The semiconductor device for a wearable sensor device according to any one of [1] to [5], which is used in an environment that comes into contact with a human body.

In the present invention, the “linear polyfluoro compound” means that divalent fluorooxyalkylene repeating units constituting a perfluoropolyether structure of the main chain are linearly linked to each other. be one, the individual divalent fluorooxyalkylene units themselves, for _{example, - [CF 2 CF (CF} 3) O] - may be a fluorooxyalkylene units having a branched structure such as.

  According to the present invention, in a semiconductor device for a wearable sensor device, by covering at least the entire surface of the semiconductor element with a sealing layer made of a cured product of the above-described thermosetting fluoropolyether-based composition as a protective material. In addition, a semiconductor device for a wearable sensor device that can be operated stably for a long period of time without being affected by dirt due to sweat or sebum of a human body can be obtained.

FIG. 3 is a schematic cross-sectional view of a sample of a semiconductor device manufactured in an example of the present invention.

  Hereinafter, the present invention will be described in detail.

[(A) component]
The component (A) is a linear polyfluoro compound having two or more alkenyl groups in one molecule and further having a perfluoropolyether structure in the main chain.

The alkenyl group contained in the component (A) is preferably an alkenyl group having 2 to 8 carbon atoms, particularly preferably having 2 to 6 carbon atoms, and having a CH ₂ ＣＨCH— structure at the terminal. Groups, a propenyl group, an isopropenyl group, a butenyl group, a hexenyl group and the like, among which a vinyl group and an allyl group are particularly preferred.

  The content of the alkenyl group contained in the linear polyfluoro compound as the component (A) is preferably 0.005 to 0.3 mol / 100 g, and more preferably 0.007 to 0.2 mol / 100 g. When the alkenyl group content is 0.005 mol / 100 g or more, the degree of crosslinking of the composition according to the present invention is sufficient, and there is no possibility that a curing problem occurs. On the other hand, if the alkenyl group content is 0.3 mol / 100 g or less, there is no possibility that the mechanical properties of a cured product obtained by curing the composition according to the present invention are impaired.

The component (A) has a perfluoropolyether structure,
-C _a F _2a O- (4)
(In the formula (4), a is an integer of 1 to 6.)
And a large number of repeating units represented by the following general formula (1).
_{- (C a F 2a O)} b - (1)
(In the formula (1), a is an integer of 1 to 6, and b is an integer of 1 to 300, preferably an integer of 1 to 200.)

The repeating unit represented by O- above -C _a F _2a, for example, a unit represented by the following formula are exemplified.
-CF ₂ O-
-CF ₂ CF ₂ O-
-CF ₂ CF ₂ CF ₂ O-
-CF (CF ₃₎ CF ₂ O-
_{-CF 2 CF 2 CF 2 CF 2} O-
_{-CF 2 CF 2 CF 2 CF 2} CF 2 CF 2 O-
-C (CF _{3) 2} O-

Among these, a repeating unit represented by the following formula is particularly preferable.
-CF ₂ O-
-CF ₂ CF ₂ O-
-CF ₂ CF ₂ CF ₂ O-
-CF (CF ₃₎ CF ₂ O-

  The perfluoropolyether structure of the component (A) may be composed of one of the above-mentioned repeating units, or may be composed of a combination of two or more.

（式（２）中、Ｒ¹及びＲ²は、アルケニル基、又は非置換若しくは置換の脂肪族不飽和結合を有さない１価の炭化水素基であり、Ｒ¹は互いに独立し、Ｒ²も互いに独立し、Ｒ¹及びＲ²の合計のうち二つ以上はアルケニル基である。Ｒ³は互いに独立して、水素原子、又は非置換若しくは置換の１価の炭化水素基であり、ｃ及びｄはそれぞれ１〜１５０の整数であって、かつｃ＋ｄの平均値は２〜３００であり、ｅは１〜６の整数である。）

（式（３）中、Ｒ⁴は互いに独立して、炭素数１〜６のアルキレン基であり、Ｒ⁵は互いに独立して、水素原子又はフッ素置換されていてもよい炭素数１〜４のアルキル基である。また、Ｒ¹及びＲ²は、アルケニル基、又は非置換若しくは置換の脂肪族不飽和結合を有さない１価の炭化水素基であり、Ｒ¹は互いに独立し、Ｒ²も互いに独立し、Ｒ¹及びＲ²の合計のうち二つ以上はアルケニル基である。ｃ及びｄはそれぞれ１〜１５０の整数であって、かつｃ＋ｄの平均値は２〜３００であり、ｅは１〜６の整数である。） Preferred examples of the component (A) include linear polyfluoro compounds represented by the following general formulas (2) and (3).

(In the formula (2), R ¹ and R ² is a monovalent hydrocarbon group having no alkenyl group, or an unsubstituted or substituted aliphatic unsaturated bonds, R ¹ is independently of one another, R ² also independently of one another, one or more two of the total of R ¹ and R ² is an alkenyl group .R ³ independently of one another are hydrogen atom, or an unsubstituted or substituted monovalent hydrocarbon group, c And d are each an integer of 1 to 150, and the average value of c + d is 2 to 300, and e is an integer of 1 to 6.)

(In formula (3), R ⁴ is independently of each other an alkylene group having 1 to 6 carbon atoms, and R ⁵ is independently of each other a hydrogen atom or a C 1 to C ⁴ optionally substituted with fluorine atom. is an alkyl group. Further, R ¹ and R ² is a monovalent hydrocarbon group having no alkenyl group, or an unsubstituted or substituted aliphatic unsaturated bonds, R ¹ is independently of one another, R ² Are independent of each other, and at least ^two of the total of R ¹ and R ² are alkenyl groups, c and d are each an integer of 1 to 150, and the average value of c + d is 2 to 300; Is an integer of 1 to 6.)

Here, as the alkenyl group contained in R ¹ and R ² , the same ones as those exemplified as the alkenyl group contained in the above-mentioned component (A) can be mentioned. As the monovalent hydrocarbon group having no saturated bond, those having 1 to 12 carbon atoms are preferable, and those having 1 to 10 carbon atoms are particularly preferable. Specifically, methyl group, ethyl group, propyl group, Alkyl groups such as butyl group, hexyl group, cyclohexyl group and octyl group; aryl groups such as phenyl group and tolyl group; aralkyl groups such as benzyl group and phenylethyl group; and some or all of the hydrogen atoms of these groups With a halogen atom such as fluorine. As R ¹ and R ² , a vinyl group, an allyl group, a methyl group and an ethyl group are particularly preferable.

Examples of the unsubstituted or substituted monovalent hydrocarbon group contained in R ³ include the above-mentioned unsubstituted or substituted monovalent hydrocarbon groups having no aliphatic unsaturated bond of R ¹ and R ^2. Similar groups are mentioned. R ³ is preferably a hydrogen atom, a methyl group or an ethyl group.

R ⁴ is independently an alkylene group having 1 to 6 carbon atoms, preferably 2 to 6 carbon atoms, specifically, methylene group, ethylene group, propylene group (trimethylene group, methylethylene group), butylene Groups (tetramethylene group, methylpropylene group), hexamethylene group, and the like, and an ethylene group and a propylene group are particularly preferable.

R ⁵ are each independently a hydrogen atom or an alkyl group having 1 to 4 carbon atoms which may be substituted by fluorine, and specifically, an alkyl group having 1 to 4 carbon atoms which may be substituted by fluorine, And alkyl groups such as a methyl group, an ethyl group, a propyl group, and a butyl group, and groups in which some or all of the hydrogen atoms of these groups are substituted with fluorine atoms, such as a trifluoromethyl group. Among them, a hydrogen atom is preferable.

  Further, c and d are each preferably an integer of 1 to 150, more preferably an integer of 1 to 100, and the average value of c + d is preferably 2 to 300, more preferably 2 to 200. E is preferably an integer of 1 to 6, more preferably an integer of 1 to 4.

（式中、ｃ及びｄはそれぞれ１〜１５０の整数である。）

（式中、ｃ及びｄはそれぞれ１〜１５０の整数である。）

（式中、ｃ及びｄはそれぞれ１〜１５０の整数である。） Specific examples of the linear polyfluoro compound represented by the general formula (2) include those represented by the following formula. Me represents a methyl group and Et represents an ethyl group.

(In the formula, c and d are each an integer of 1 to 150.)

(In the formula, c and d are each an integer of 1 to 150.)

(In the formula, c and d are each an integer of 1 to 150.)

（式中、ｃ及びｄはそれぞれ１〜１５０の整数である。）

（式中、ｃ及びｄはそれぞれ１〜１５０の整数である。） Specific examples of the linear polyfluoro compound represented by the general formula (3) include those represented by the following formula.

(In the formula, c and d are each an integer of 1 to 150.)

(In the formula, c and d are each an integer of 1 to 150.)

  In the present invention, the viscosity can be measured by a rotational viscometer (for example, a BL type, a BH type, a BS type, a cone plate type, a rheometer, etc.), and particularly, the above general formula (2) or (3) The viscosity (23 ° C.) of the linear polyfluoro compound represented by the formula (1) is preferably from 500 to 100,000 mPa · s, particularly preferably from 1,000 to 50,000 mPa · s, as measured by a viscosity measurement specified in JIS K7117-1. . When the viscosity is 500 mPa · s or more, there is no possibility that the storage stability of the composition according to the present invention is deteriorated. When the viscosity is 100,000 mPa · s or less, the extensibility of the obtained composition may be deteriorated. Absent.

  The degree of polymerization (or molecular weight) of the linear polyfluoro compound, which is reflected by the number of repetitions of perfluorooxyalkylene units constituting the perfluoropolyether structure of the main chain, is, for example, determined by using a fluorine-based solvent as a developing solvent. It can be determined as a number average polymerization degree (or number average molecular weight) in terms of polystyrene in gel permeation chromatography (GPC) analysis.

  These linear polyfluoro compounds can be used alone or in combination of two or more. That is, among the linear polyfluoro compounds represented by the general formula (2) or (3), one type can be used alone, or two or more types can be used in combination. The linear polyfluoro compounds represented by (2) and (3) can be used in combination.

[Component (B)]
The component (B) has a monovalent perfluoroalkyl group or a monovalent perfluorooxyalkyl group in one molecule, or has a divalent perfluoroalkylene group or a divalent perfluorooxyalkylene group. And a fluorine-containing organohydrogensiloxane having two or more hydrogen atoms (hydrosilyl groups (SiH groups)) directly bonded to silicon atoms. The fluorinated organohydrogensiloxane is preferably a monovalent or divalent fluorinated organic group (monovalent perfluoroalkyl group, monovalent perfluorooxyalkyl group, divalent perfluoroalkylene) in one molecule. Group or divalent perfluorooxyalkylene group) and two or more hydrogen atoms directly bonded to silicon atoms, and function as a crosslinking agent for the component (A).

  The monovalent perfluoroalkyl group, monovalent perfluorooxyalkyl group, divalent perfluoroalkylene group and divalent perfluorooxyalkylene group are compatible with the component (A), dispersible and cured. This group is introduced from the viewpoint of later uniformity and the like.

（式（６）中、ｇは１〜５０の整数、好ましくは２〜３０の整数である。） Examples of the monovalent perfluoroalkyl group or monovalent perfluorooxyalkyl group include groups represented by the following general formula (5) or (6).
C _f F _{2f + 1} − (5)
(In the formula (5), f is an integer of 1 to 10, preferably an integer of 3 to 7.)

(In the formula (6), g is an integer of 1 to 50, preferably an integer of 2 to 30.)

（式（８）中、ｉ及びｊはそれぞれ１以上の整数、好ましくは１〜１００の整数であり、ｉ＋ｊの平均値は２〜２００、好ましくは２〜１００である。）
−ＣＦ₂Ｏ−（ＣＦ₂ＣＦ₂Ｏ）_k（ＣＦ₂Ｏ）_l−ＣＦ₂− （９）
（式（９）中、ｋ及びｌはそれぞれ１〜５０の整数、好ましくは１〜３０の整数であり、ｋ＋ｌの平均値は２〜１００、好ましくは２〜８０である。各繰り返し単位同士はランダムに結合されていてよい。） Examples of the divalent perfluoroalkylene group or divalent perfluorooxyalkylene group include groups represented by the following general formulas (7) to (9).
-C _h F _2h- (7)
(In the formula (7), h is an integer of 1 to 20, preferably 2 to 10.)

(In the formula (8), i and j are each an integer of 1 or more, preferably an integer of 1 to 100, and the average value of i + j is 2 to 200, preferably 2 to 100.)
—CF ₂ O— (CF ₂ CF ₂ O) _k (CF ₂ O) ₁ —CF ₂ − (9)
(In the formula (9), k and l are each an integer of 1 to 50, preferably an integer of 1 to 30, and the average value of k + 1 is 2 to 100, preferably 2 to 80. They may be randomly combined.)

Further, it is preferable that these perfluoroalkyl group, perfluorooxyalkyl group, perfluoroalkylene group, or perfluorooxyalkylene group and the silicon atom are connected by a divalent linking group. As the divalent linking group, an unsubstituted or substituted C2-C13, particularly C2-C2, which may have one or more selected from an oxygen atom, a nitrogen atom and a silicon atom. It is preferably a divalent hydrocarbon group of from 8 to 8. Specifically, an alkylene group, an arylene group and a combination thereof, or these groups are selected from the group consisting of diorganosilylene groups such as an ether bond oxygen atom, an amide bond, a carbonyl bond, an ester bond, and a dimethylsilylene group. Examples in which one or two or more structures are interposed can be exemplified.
-CH ₂ CH ₂ -,
—CH ₂ CH ₂ CH ₂ —,
—CH ₂ CH ₂ CH ₂ OCH ₂ —,
_{-CH 2 CH 2 CH 2 -NH-} CO-,
_{-CH 2 CH 2 CH 2 -N (} Ph) -CO-,
—CH ₂ CH ₂ CH ₂ —N (CH ₃ ) —CO—,
—CH ₂ CH ₂ CH ₂ —N (CH ₂ CH ₃ ) —CO—,
_{-CH 2 CH 2 CH 2 -N (} CH (CH 3) 2) -CO-,
_{-CH 2 CH 2 CH 2 -O-} CO-,
_{-CH 2 CH 2 -Si (CH 3} ) 2 -Ph'-N (CH 3) -CO-,
_{-CH 2 CH 2 CH 2 -Si (} CH 3) 2 -Ph'-N (CH 3) -CO-
(However, Ph is a phenyl group and Ph 'is a phenylene group.)
And the like having 2 to 13 carbon atoms.

  In the fluorine-containing organohydrogensiloxane of the component (B), the monovalent or divalent fluorine-containing organic group and the monovalent substituent bonded to a silicon atom other than a hydrogen atom directly bonded to a silicon atom have a carbon number of 1 to 20, preferably 1 to 12 unsubstituted or substituted alkyl or aryl groups, such as methyl, ethyl, propyl, butyl, hexyl, cyclohexyl, octyl, decyl, etc. An alkyl group; an aryl group such as a phenyl group, a tolyl group, or a naphthyl group; Examples thereof include a chloropropyl group and a cyanoethyl group. Among them, a methyl group is preferred.

  The structure of the fluorine-containing organohydrogensiloxane of the component (B) may be any of cyclic, chain, three-dimensional network, and a combination thereof. The number of silicon atoms in the fluorinated organohydrogensiloxane is not particularly limited, but is usually about 2 to 60, preferably about 3 to 30, and more preferably about 4 to 30.

  The component (B) has two or more SiH groups in one molecule, and the content of the SiH group is preferably 0.01 to 1 mol / 100 g, more preferably 0.02 to 0.9 mol /. 100 g.

  The fluorine-containing organohydrogensiloxane (B), which is a cross-linking agent, usually has a functional group (for example, an optional component described later) in the molecule other than the hydrosilyl group (SiH group) involved in the hydrosilylation addition reaction. (A functional group such as an alkoxysilyl group, an epoxy group, and / or a carboxylic acid anhydride group, which the adhesiveness imparting agent or the like has in the molecule).

（式（１０）中、Ａは互いに独立して、上記の、酸素原子、窒素原子及びケイ素原子から選ばれる１種又は２種以上を有していてもよい２価の炭化水素基を介してポリシロキサンを構成するケイ素原子に結合した１価のパーフルオロアルキル基又は１価のパーフルオロオキシアルキル基であり、１価のパーフルオロアルキル基又は１価のパーフルオロオキシアルキル基としては、上記一般式（５）又は（６）で表される基が挙げられる。Ｒ⁶は独立して、上記の、炭素数１〜２０、好ましくは炭素数１〜１２の非置換若しくは置換のアルキル基又はアリール基である。また、ｍは２〜６の整数、好ましくは３〜６の整数であり、ｎは１〜４の整数、好ましくは１〜３の整数であり、ｍ＋ｎは４〜１０の整数、好ましくは４〜９の整数である。但し、−（Ｓｉ（Ｈ）（Ｒ⁶）Ｏ）−と−（Ｓｉ（Ａ）（Ｒ⁶）Ｏ）−の結合の順番は限定されない。）

（式（１１）中、Ｄは互いに独立して、上記Ａと同じであり、Ｒ⁷は互いに独立して、上記Ｒ⁶と同じである。またｏは２〜５０の整数、好ましくは３〜３０の整数である。）

（式（１２）中、Ｅは互いに独立して、上記Ａと同じであり、Ｒ⁸は互いに独立して、上記Ｒ⁶と同じである。ｐは２〜５０の整数、好ましくは３〜３０の整数であり、ｑは１〜４０の整数、好ましくは１〜２０の整数であり、ｐ＋ｑは４〜６０の整数、好ましくは４〜５０の整数である。但し、−（Ｓｉ（Ｈ）（Ｒ⁸）Ｏ）−と−（Ｓｉ（Ｅ）（Ｒ⁸）Ｏ）−の結合の順番は限定されない。）

（式（１３）中、Ｇは互いに独立して、上記Ａと同じであり、Ｒ⁹は互いに独立して、上記Ｒ⁶と同じである。ｒは２〜５０の整数、好ましくは３〜３０の整数であり、ｓは１〜４０の整数、好ましくは１〜２０の整数であり、ｒ＋ｓは４〜６０の整数、好ましくは４〜５０の整数である。但し、−（Ｓｉ（Ｈ）（Ｒ⁹）Ｏ）−と−（Ｓｉ（Ｒ⁹）₂Ｏ）−の結合の順番は限定されない。）

（式（１４）中、Ｊは互いに独立して、上記Ａと同じであり、Ｒ¹⁰は互いに独立して、上記Ｒ⁶と同じである。ｔは２〜５０の整数、好ましくは３〜３０の整数であり、ｕは１〜４０の整数、好ましくは１〜２０の整数であり、ｖは１〜４０の整数、好ましくは１〜２０の整数であり、ｔ＋ｕ＋ｖは５〜６０の整数、好ましくは５〜５０の整数である。但し、−（Ｓｉ（Ｈ）（Ｒ¹⁰）Ｏ）−、−（Ｓｉ（Ｊ）（Ｒ¹⁰）Ｏ）−及び−（Ｓｉ（Ｒ¹⁰）₂Ｏ）−の結合の順番は限定されない。）

（式（１５）中、Ｌは、酸素原子、アルキレン基、又は酸素原子あるいは窒素原子を有していてもよい２価の炭化水素基を介してケイ素原子に結合した２価のパーフルオロアルキレン基若しくは２価のパーフルオロオキシアルキレン基であり、２価のパーフルオロアルキレン基又は２価のパーフルオロオキシアルキレン基としては、上記一般式（７）〜（９）で表されるいずれかの基が挙げられる。また、Ｍは互いに独立して、上記Ａと同じであり、Ｒ¹¹は互いに独立して、上記Ｒ⁶と同じである。また、ｗは０〜３の整数であり、ｘは０〜３の整数であり、ｗ＋ｘは２〜６の整数、好ましくは３〜５の整数である。なお、Ｌが酸素原子又はアルキレン基である場合、ｗ＋ｘは２〜５の整数である。）

（式（１６）中、Ｑは上記Ａと同じであり、Ｒ¹²は互いに独立して、上記Ｒ⁶と同じである。） Examples of the component (B) include those represented by the following general formulas (10) to (16).

(In the formula (10), A is independently of each other via the above-mentioned divalent hydrocarbon group which may have one or more kinds selected from an oxygen atom, a nitrogen atom and a silicon atom. A monovalent perfluoroalkyl group or a monovalent perfluorooxyalkyl group bonded to a silicon atom constituting the polysiloxane, and as the monovalent perfluoroalkyl group or the monovalent perfluorooxyalkyl group, R ⁶ is independently an unsubstituted or substituted alkyl group or aryl having 1 to 20 carbon atoms, preferably 1 to 12 carbon atoms, as described above. M is an integer of 2 to 6, preferably 3 to 6, n is an integer of 1 to 4, preferably 1 to 3, m + n is an integer of 4 to 10, It is preferably an integer of 4 to 9. And, - (Si (H) ( R 6) O) - and - (Si (A) (R 6) O) - bond order of is not limited).

(In the formula (11), D is independently the same as the above A, and R ⁷ is independently the same as the above R ^6. Also, o is an integer of 2 to 50, preferably 3 to It is an integer of 30.)

(In the formula (12), E is independently the same as the above A, and R ⁸ is independently the same as the above R ^6. P is an integer of 2 to 50, preferably 3 to 30.) And q is an integer of 1 to 40, preferably 1 to 20 and p + q is an integer of 4 to 60, preferably an integer of 4 to 50, provided that-(Si (H) ( R ⁸⁾ O) - and - (Si (E) (R 8) O) - bond order of is not limited).

(In the formula (13), G is independently the same as the above A, and R ⁹ is independently the same as the above R ^6. R is an integer of 2 to 50, preferably 3 to 30. S is an integer of 1 to 40, preferably an integer of 1 to 20, and r + s is an integer of 4 to 60, preferably an integer of 4 to 50, provided that-(Si (H) ( The order of bonding of R ⁹ ) O)-and-(Si (R ⁹ ) ₂ O)-is not limited.)

(In the formula (14), J is independently of one another are as defined above A, R ¹⁰ independently of one another, are as defined above R ⁶ .t 2-50 integer, preferably from 3 to 30 U is an integer of 1 to 40, preferably an integer of 1 to 20, v is an integer of 1 to 40, preferably an integer of 1 to 20, and t + u + v is an integer of 5 to 60, preferably it is an integer of 5-50 provided that, -. (Si (H) (R 10) O) -, - (Si (J) (R 10) O) - and _{^{- (Si (R 10) 2}} O) - Is not limited.)

(In the formula (15), L is an oxygen atom, an alkylene group, or a divalent perfluoroalkylene group bonded to a silicon atom via a divalent hydrocarbon group which may have an oxygen atom or a nitrogen atom. Or a divalent perfluorooxyalkylene group, and the divalent perfluoroalkylene group or the divalent perfluorooxyalkylene group includes any of the groups represented by the above general formulas (7) to (9). M is independently the same as the above A, R ¹¹ is independently the same as the above R ^6. Also, w is an integer of 0 to 3, and x is 0. And w + x is an integer of 2 to 6, preferably 3 to 5. When L is an oxygen atom or an alkylene group, w + x is an integer of 2 to 5.)

(In formula (16), Q is the same as A above, and R ¹² is independently the same as R ⁶ above.)

（式中、ｙは１〜１０の整数である。）

（式中、ｚは１〜５０の整数である。）

（式中、ｚは１〜５０の整数である。）

（式中、ｙは１〜１０の整数である。）

（式中、ｚは１〜５０の整数であり、ｙは１〜１０の整数である。）

（式中、ｙは１〜１０の整数であり、ｚは１〜５０の整数である。）

（式中、ｙは１〜１０の整数であり、ｚは１〜５０の整数である。）

（式中、ｙは１〜１０の整数であり、ｚは１〜５０の整数である。）

（式中、ｙは１〜１０の整数であり、ａ’は１〜２０の整数である。）

（式中、ｚは１〜５０の整数であり、ａ’は１〜２０の整数である。）

（式中、ｙは１〜１０の整数であり、ｚは１〜５０の整数である。）

（式中、ｙは１〜１０の整数であり、ｚは１〜５０の整数であり、ｂ’及びｃ’はそれぞれ１〜１００の整数であり、ｂ’＋ｃ’は２〜２００の整数である。）

（式中、ｙは１〜１０の整数であり、ｚは１〜５０の整数であり、ｄ’及びｅ’はそれぞれ１〜５０の整数であり、ｄ’＋ｅ’は２〜１００の整数である。） Specific examples of the component (B) include the following compounds. These compounds may be used alone or in combination of two or more. In the following formula, Me represents a methyl group and Ph represents a phenyl group.

(In the formula, y is an integer of 1 to 10.)

(In the formula, z is an integer of 1 to 50.)

(In the formula, z is an integer of 1 to 50.)

(In the formula, y is an integer of 1 to 10.)

(In the formula, z is an integer of 1 to 50, and y is an integer of 1 to 10.)

(In the formula, y is an integer of 1 to 10, and z is an integer of 1 to 50.)

(In the formula, y is an integer of 1 to 10, and z is an integer of 1 to 50.)

(In the formula, y is an integer of 1 to 10, and z is an integer of 1 to 50.)

(In the formula, y is an integer of 1 to 10, and a 'is an integer of 1 to 20.)

(In the formula, z is an integer of 1 to 50, and a ′ is an integer of 1 to 20.)

(In the formula, y is an integer of 1 to 10, and z is an integer of 1 to 50.)

(In the formula, y is an integer of 1 to 10, z is an integer of 1 to 50, b ′ and c ′ are each an integer of 1 to 100, and b ′ + c ′ is an integer of 2 to 200. is there.)

(In the formula, y is an integer of 1 to 10, z is an integer of 1 to 50, d 'and e' are each an integer of 1 to 50, and d '+ e' is an integer of 2 to 100. is there.)

These components (B) may be used alone or in combination of two or more.
The compounding amount of the component (B) is such that the hydrogen atom (SiH group) directly bonded to a silicon atom in the component (B) is 0.3 to 3 mol per 1 mol of the alkenyl group in the component (A). Amount, preferably 0.5 to 2 mol (molar ratio). When the amount of the SiH group is less than 0.3 mol, the degree of crosslinking becomes insufficient. On the other hand, when the amount is more than 3 mol, the storage stability is impaired or the heat resistance of the cured product obtained after curing is reduced.

[(C) component]
The platinum group metal-based catalyst as the component (C) is a hydrosilylation reaction catalyst. The hydrosilylation reaction catalyst comprises an alkenyl group contained in the composition, particularly the alkenyl group in the component (A), and a SiH group contained in the composition, particularly a SiH group in the component (B). It is a catalyst that promotes the addition reaction. This hydrosilylation reaction catalyst is generally a noble metal or a compound thereof, and is expensive, so that platinum or a platinum compound which is relatively easily available is often used.

Examples of the platinum compound include chloroplatinic acid, a complex of chloroplatinic acid with an olefin such as ethylene, a complex of platinum with an alcohol or a vinyl siloxane, and metal platinum supported on silica, alumina, carbon, or the like. Can be. Rhodium, ruthenium, iridium, and palladium compounds are also known as platinum or a platinum group metal catalyst other than the compound thereof. For example, RhCl (PPh ₃ ) ₃ , RhCl (CO) (PPh ₃ ) ₂ , Ru ₃ ( CO) ₁₂ , IrCl (CO) (PPh ₃ ) ₂ , Pd (PPh ₃ ) _{4 and the} like. In the above formula, Ph is a phenyl group.

  When using these catalysts, when they are solid catalysts, they can be used in a solid state, but in order to obtain a more uniform cured product, chloroplatinic acid or a complex such as toluene or ethanol is used. It is preferable to use a solution which is dissolved in a suitable solvent as described above and is compatible with the linear polyfluoro compound as the component (A).

  The compounding amount of the component (C) is an effective amount as a hydrosilylation reaction catalyst, and is usually 0.1 to 2,000 ppm, preferably 0.1 to 500 ppm, and particularly preferably, based on the mass of the component (A). It is 0.5 to 200 ppm (in terms of platinum group metal atom mass), but can be appropriately increased or decreased according to a desired curing speed.

[Other ingredients]
In order to enhance the utility of the thermosetting fluoropolyether composition according to the present invention, in addition to the above-mentioned components (A) to (C), a hydrosilylation addition reaction control agent (( Component (D), an inorganic filler (component (E)), various additives (additives) such as a plasticizer, a viscosity modifier, a flexibility-imparting agent, and an adhesion-imparting agent. it can. The mixing amount of these additives is optional within a range that does not impair the purpose of the present invention.

  Examples of the hydrosilylation addition reaction control agent (component (D)) include 1-ethynyl-1-hydroxycyclohexane, 3-methyl-1-butyn-3-ol, and 3,5-dimethyl-1-hexyne-3-ol. Acetylenic alcohols such as all, 3-methyl-1-penten-3-ol, and phenylbutynol; a monovalent perfluoroalkyl group represented by the general formula (5), or a monovalent perfluoroalkyl group represented by the general formula (6) Reaction product of a chlorosilane having a monovalent perfluorooxyalkyl group and an acetylenic alcohol; 3-methyl-3-penten-1-yne, 3,5-dimethyl-3-hexen-1-yne; triallyl Isocyanurate; polyvinyl siloxane; organic phosphorus compounds; and the like, curing reactivity and storage stability can be appropriately maintained by the addition thereof.

  Examples of the inorganic filler (component (E)) include silica such as fumed silica (fumed silica or dry silica), precipitated silica (wet silica), spherical silica (fused silica), sol-gel method silica, and silica aerogel. Powder or a silica powder obtained by treating the surface of the silica powder with various kinds of organochlorosilane, organodisilazane, cyclic organopolysilazane, etc .; and the surface-treated silica powder is a monovalent compound represented by the above general formula (5). Or a silica-based reinforcing filler such as silica powder re-treated with an organosilane or organosiloxane having a monovalent perfluorooxyalkyl group represented by the above general formula (6) or quartz. Reinforcing or semi-reinforcing fillers such as powder, fused quartz powder, diatomaceous earth, calcium carbonate, titanium oxide, iron oxide, carbon Racks, inorganic pigments such as cobalt aluminate, titanium oxide, iron oxide, carbon black, heat resistance improvers such as cerium oxide, cerium hydroxide, zinc carbonate, magnesium carbonate, manganese carbonate, alumina, boron nitride, silicon carbide, metal powder And the like, a carbon black, a silver powder, and a conductive agent such as conductive zinc white.

  As the plasticizer, viscosity modifier and / or flexibility imparting agent, a linear polyfluoro compound represented by the following general formulas (17) and (18) and / or represented by the following general formula (19) Polyfluoromonoalkenyl compounds can be used.

_{F- (CF 2 CF 2 CF 2} O) f '-X' (17)
(In the formula (17), X ′ is a group represented by C _{g ′} F _{2g ′ + 1} − (g ′ is an integer of 1 to 3), and f ′ is an integer of 1 to 500, preferably 1 to 500. It is an integer of 300.)

Z ′ − {(OCF (CF ₃ ) CF ₂ ) _{h ′} − (OCF ₂ CF ₂ ) _{i ′} − (OCF ₂ ) _{j ′} ｝ −O−Z ′ (18)
(In the formula (18), Z ′ is the same as X ′ above, and h ′ and i ′ are each an integer of 0 to 300, preferably an integer of 0 to 150. However, when both h ′ and i ′ are both Excludes the case of 0. Also, j ′ is an integer of 1 to 300, preferably an integer of 1 to 150. Each repeating unit may be randomly bonded.)

（ｏ位、ｍ位又はｐ位で示されるジメチルフェニルシリレン基であり、左端が窒素原子に、右端が炭素原子に結合される。）

（左端が窒素原子に、右端が炭素原子に結合される。）〕であり、ｋ’は０又は１である。］ _{Rf- (A '') k '} -CH = CH 2 (19)
[In the formula (19), Rf is the following general formula (20)
_{F- [CF (CF 3) CF} 2 O] l '-C m' F 2m '- (20)
(In the formula (20), l ′ is an integer of 1 to 200, preferably 1 to 150, and m ′ is an integer of 1 to 3.)
Wherein A ″ is —CH ₂ —, —OCH ₂ —, —CH ₂ OCH ₂ — or —CO—NR ¹³ —D ″ — (in each of these groups, the left end is Rf , The right end is attached to the carbon atom. R ¹³ is a hydrogen atom, a methyl group, a phenyl group or an allyl group, and D ″ is —CH ₂ —, a group represented by the following structural formula (21) or a group represented by the following structural formula (22). is there.

(A dimethylphenylsilylene group represented by the o-position, m-position or p-position, the left end is bonded to a nitrogen atom, and the right end is bonded to a carbon atom.)

(The left end is bonded to the nitrogen atom and the right end is bonded to the carbon atom.)], And k ′ is 0 or 1. ]

Specific examples of the linear polyfluoro compound represented by the general formula (17) or (18) include the following.
_{F- (CF 2 CF 2 CF 2} O) f '' -CF 2 CF 3
(F ″ is an integer of 1 to 200.)
CF ₃ -｛(OCF (CF ₃ ) CF ₂ ) _{h ″} -(OCF ₂ ) _{j ″} ｝ -O-CF ₃
(H ″ is an integer of 1 to 200, and j ″ is an integer of 1 to 200. Each repeating unit may be randomly bonded.)
CF ₃ -｛(OCF ₂ CF ₂ ) _{i ″} -(OCF ₂ ) _{j ″} ｝ -O-CF ₃
(I ″ is an integer of 1 to 200, and j ″ is an integer of 1 to 200. Each repeating unit may be randomly bonded.)

  The linear polyfluoro compound represented by the general formula (17) or (18) may be used alone or in combination of two or more.

（ここで、ｌ''は１〜２００の整数である。） Specific examples of the polyfluoromonoalkenyl compound represented by the general formula (19) include the following. In the following formula, Me represents a methyl group.

(Here, l ″ is an integer of 1 to 200.)

  The polyfluoromonoalkenyl compounds represented by the general formula (19) may be used alone or in combination of two or more.

  As the adhesion-imparting agent, at least one functional group capable of imparting adhesion in a molecule (for example, an alkoxysilyl group, an epoxy group) other than the above-mentioned fluorine-containing organohydrogensiloxane of the component (B) which is a crosslinking agent. And / or a carboxylic anhydride group) and a hydrosilyl group (SiH group), and a fluorine-containing organohydrogensiloxane containing an adhesive functional group.

  The method for producing the composition according to the present invention is not particularly limited, and is produced by uniformly mixing the components (A) to (C), the optional components (D) to (E), and other optional components. can do. At this time, if necessary, a mixing device such as a planetary mixer, a loss mixer, a Hobart mixer, or a kneading device such as a kneader or a three-roll mill can be used.

  Regarding the composition of the composition according to the present invention, the above-mentioned components (A) to (C) and all other optional components may be treated as one composition, that is, may be constituted as a so-called one-pack type, or You may make it a liquid type and mix both at the time of use.

  In using the composition according to the present invention, the composition may be appropriately used depending on the application and purpose, for example, 1,3-bis (trifluoromethyl) benzene, florinate (manufactured by 3M), It may be used by dissolving it in a desired concentration in perfluorobutyl methyl ether, perfluorobutyl ethyl ether or the like. In particular, it is preferable to use a solvent for thin film coating.

  The curing temperature is from 100 ° C to 200 ° C, preferably from 120 ° C to 180 ° C. When the temperature is 100 ° C. or higher, the composition according to the present invention can exhibit adhesiveness to various substrates in a short time. On the other hand, when the temperature is 200 ° C. or lower, there is no possibility that the composition according to the present invention is decomposed. In addition, the curing time of the composition according to the present invention may be appropriately selected according to the curing temperature, the time for completing the cross-linking reaction and the adhesion reaction with the substrate, and generally, preferably 10 minutes to 60 minutes. , 15 to 60 minutes are more preferable.

  The semiconductor device for a wearable sensor device of the present invention is a semiconductor device having, as a protective material, a sealing layer made of a cured product of the above-described thermosetting fluoropolyether-based composition. A semiconductor device for a wearable sensor device in which a sealing layer made of a cured product of an ether-based composition covers at least the entire surface of a semiconductor element adhered on a lead frame.

  A sealing layer made of a cured product of the above-described thermosetting fluoropolyether-based composition is used as a protective coating agent for a base material such as a lead frame, a sealing material for a semiconductor element, a potting material for a sensor element (semiconductor element), By using it as a protective potting material for circuits, a corrosion-preventing coating material for electrical wiring, etc., especially by covering at least the entire surface of the semiconductor element, it can be used without being affected by sweat or dirt caused by sebum on the human body. A semiconductor device (eg, a temperature sensor, a pressure sensor, an acceleration sensor, a heart rate monitor, etc.) for a wearable sensor device that can operate stably over a period is obtained.

Hereinafter, the present invention will be described specifically with reference to Examples and Comparative Examples, but the present invention is not limited to the following Examples. In addition, in the following examples, a part shows a mass part and Me shows a methyl group. The viscosity of the component (A) is a value measured at 23 ° C. (based on JIS K6249).
The components (A) to (D) used in the following examples are shown below.

（但し、ｃ１及びｄ１は１以上の整数であり、ｃ１＋ｄ１の平均値は９０である。）
（Ａ−２）：下記式（２４）で示される直鎖状ポリフルオロ化合物（粘度１１，０００ｍＰａ・ｓ、ビニル基含有量０．０１２２ｍｏｌ／１００ｇ）

（但し、ｃ２及びｄ２は１以上の整数であり、ｃ２＋ｄ２の平均値は９０である。） (A) Component (A-1): a linear polyfluoro compound represented by the following formula (23) (viscosity: 10,900 mPa · s, vinyl group content: 0.012 mol / 100 g)

(However, c1 and d1 are integers of 1 or more, and the average value of c1 + d1 is 90.)
(A-2): A linear polyfluoro compound represented by the following formula (24) (viscosity 11,000 mPa · s, vinyl group content 0.0122 mol / 100 g)

(However, c2 and d2 are integers of 1 or more, and the average value of c2 + d2 is 90.)

（Ｂ−２）：下記式（２６）で示される含フッ素オルガノ水素シロキサン（ＳｉＨ基含有量０．００３９４ｍｏｌ／ｇ）

(B) Component (B-1): Fluorinated organohydrogensiloxane represented by the following formula (25) (SiH group content: 0.00523 mol / g)

(B-2): a fluorine-containing organohydrogensiloxane represented by the following formula (26) (SiH group content: 0.00394 mol / g)

Component (C): a toluene solution of a platinum-divinyltetramethyldisiloxane complex (platinum concentration 0.5% by mass)

Component (D): 50% by mass toluene solution of 1-ethynyl-1-hydroxycyclohexane

[Example 1]
100 parts of the component (A-1), 2.3 parts of the component (B-1) and 0.2 part of the component (D) are uniformly mixed at room temperature with a planetary mixer, and then 0.2 part of the component (C). Was added and mixed again uniformly to prepare a curable composition 1.
Next, a silicon chip (semiconductor element) having a size of 6 mm × 6 mm on which aluminum wiring was formed was bonded to a 14-pin-DIP frame (42 alloy). An electronic circuit for test, which was wire-bonded with a gold wire, was placed in a glass Petri dish having a diameter of 30 mm, and 3.8 parts of the curable composition 1 was poured therein, and the entire electronic circuit was covered (potted) with the curable composition 1. This was placed in an oven at 150 ° C. and heated for 15 minutes to cure the curable composition 1.
Thus, a sample of the semiconductor device in which the entire surface of the electronic circuit was covered (sealed) with the cured product layer of the curable composition 1 was produced (see FIG. 1).
In FIG. 1, 1 is a silicon chip, 2 is an aluminum electrode, 3 is a lead frame, 4 is a gold wire, and 5 is a cured product (sealing layer) of a curable composition.
This sample was allowed to stand at 23 ° C. for 500 hours while being immersed in a 3.5% by mass saline solution. Thereafter, the sample was taken out, and the appearance of the aluminum electrode of the electronic circuit was observed with a microscope.

[Example 2]
A curable composition 2 was prepared in the same manner as in Example 1, except that 100 parts of the component (A-2) and 3.1 parts of the component (B-2) were used. A sample of a semiconductor device in which the entire surface of the electronic circuit was covered (sealed) with a cured layer of the curable composition 2 was prepared in the same manner as in Example 1 except that it was used, and under the same conditions as in Example 1. The appearance of the aluminum electrode of the electronic circuit was observed with a microscope.

[Comparative Example 1]
Instead of the curable composition 1 in Example 1, an addition-curable silicone rubber composition SYLGARD184 (manufactured by Dow Corning) having polydimethylsiloxane as a main component was used. That is, except that 100 parts of the main ingredient of SYLGARD 184 and 10 parts of the curing agent were weighed into a cup and uniformly mixed to prepare a curable silicone rubber composition 3, and further the curable silicone rubber composition 3 was used. A sample of a semiconductor device in which the entire surface of the electronic circuit was covered (sealed) with the cured product layer of the curable silicone rubber composition 3 was prepared in the same manner as in Example 1, and the electronic circuit was fabricated under the same conditions as in Example 1. The appearance of the aluminum electrode was observed with a microscope.

  As described above, in the semiconductor device using the sealing layer made of the cured product of the thermosetting fluoropolyether composition according to the present invention as a protective material, no corrosion was observed in the electronic circuit even in the salt water immersion test. . Accordingly, the electronic circuit can be stably protected from sweat and the like for a long period of time even in an environment where the electronic circuit comes into contact with the human body.

Reference Signs List 1 silicon chip 2 aluminum electrode 3 lead frame 4 gold wire 5 cured product of curable composition (sealing layer)

Claims (6)

(A) a linear polyfluoro compound having two or more alkenyl groups in one molecule and having a perfluoropolyether structure in the main chain: 100 parts by mass;
(B) one molecule has a monovalent perfluoroalkyl group or a monovalent perfluorooxyalkyl group, or has a divalent perfluoroalkylene group or a divalent perfluorooxyalkylene group, and Fluorinated organohydrogensiloxane having two or more hydrogen atoms (SiH groups) directly bonded to silicon atoms: 0.3 to 3 mol of SiH groups in component (B) per mol of alkenyl groups in component (A) Amount
(C) Platinum group metal-based catalyst: 0.1 to 2,000 ppm by mass of platinum group metal atom based on component (A);
A semiconductor device for a wearable sensor device having a sealing layer made of a cured product of a thermosetting fluoropolyether-based composition containing as a protective material.   The semiconductor device for a wearable sensor device according to claim 1, wherein the linear polyfluoro compound as the component (A) has an alkenyl group content of 0.005 to 0.3 mol / 100 g. The component (A) has a perfluoropolyether structure represented by the following general formula (1)
_{- (C a F 2a O)} b - (1)
(In the formula (1), a is an integer of 1 to 6, and b is an integer of 1 to 300.)
The semiconductor device for a wearable sensor device according to claim 1, wherein the semiconductor device includes a structure represented by: The component (A) is represented by the following general formula (2) and / or the following general formula (3)

(In the formula (2), R ¹ and R ² is a monovalent hydrocarbon group having no alkenyl group, or an unsubstituted or substituted aliphatic unsaturated bonds, R ¹ is independently of one another, R ² also independently of one another, one or more two of the total of R ¹ and R ² is an alkenyl group .R ³ independently of one another are hydrogen atom, or an unsubstituted or substituted monovalent hydrocarbon group, c And d are each an integer of 1 to 150, and the average value of c + d is 2 to 300, and e is an integer of 1 to 6.)

(In formula (3), R ⁴ is independently of each other an alkylene group having 1 to 6 carbon atoms, and R ⁵ is independently of each other a hydrogen atom or a C 1 to C ⁴ optionally substituted with fluorine atom. is an alkyl group. Further, R ¹ and R ² is a monovalent hydrocarbon group having no alkenyl group, or an unsubstituted or substituted aliphatic unsaturated bonds, R ¹ is independently of one another, R ² Are independent of each other, and at least ^two of the total of R ¹ and R ² are alkenyl groups, c and d are each an integer of 1 to 150, and the average value of c + d is 2 to 300; Is an integer of 1 to 6.)
The semiconductor device for a wearable sensor device according to claim 1, wherein the semiconductor device is a linear polyfluoro compound represented by the formula:   The sealing layer made of a cured product of the thermosetting fluoropolyether-based composition covers at least the entire surface of the semiconductor element adhered on the lead frame. Semiconductor device for wearable sensor device.   The semiconductor device for a wearable sensor device according to claim 1, wherein the semiconductor device is used in an environment that comes into contact with a human body.

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