JP2020014003A - Electronic equipment and heat spreader - Google Patents

Abstract

To realize a novel electronic device having a function of processing heat generated in an electronic element.SOLUTION: An electronic device 1 includes a circuit board 4 on which mounted components including a heat generating electronic element 5A are mounted, housings 3A, 3B for holding a circuit board therein, and a heat diffusing body 6 held together with the circuit board in the housing. The heat diffusing body 6 is formed by sealing a liquid or creamy heat conducting medium 9 in a deformable pack container 8 and is deformed following a three-dimensional shape of the heat generating electronic element 5A of the circuit board and its peripheral region.SELECTED DRAWING: Figure 7

Description

  The present invention relates to an electronic device and a heat spreader.

Various types of “electronic devices” are known as imaging devices such as personal computers, digital cameras, and video cameras.
Many of such electronic devices have a structure in which a circuit board on which “a mounting component including an electronic element” is mounted is held by a housing.
The mounting components mounted on the circuit board include, for example, heat-generating electronic elements that generate heat when used, such as arithmetic processing chips.
Since heat-generating electronic elements generate heat during operation, if the generated heat is not properly processed, the elements themselves will become high temperature, hindering the functions of the elements themselves, or affecting the functions of mounted components around the elements. .

  As a method of treating heat generated in a heat-producing electronic element, there is known a method of “conducting the generated heat to the outside by a heat conducting means and radiating the heat” (Patent Documents 1 and 2).

  An object of the present invention is to realize a novel electronic device having a function of processing heat generated in an electronic element.

  An electronic device according to an aspect of the invention includes a circuit board on which a mounting component including a heat-generating electronic element is mounted, a housing that holds the circuit board, and a heat spreader that is held in the housing together with the circuit board. Wherein the heat spreader is formed by sealing a liquid or cream-like heat transfer medium in a deformable pack container, so that the heat generating electronic element of the circuit board and the three-dimensional shape of the peripheral area thereof are formed. It is a configuration that deforms following the image.

  According to the present invention, it is possible to realize a novel electronic device provided with a function of processing heat generated in an electronic element.

It is an outline view showing an imaging device. FIG. 2 is a diagram illustrating a circuit board mounted on an imaging device and mounted components mounted on the circuit board. It is a figure which shows the state which removed the housing | casing part 3A, integrated the imaging part and the circuit board in the housing | casing part 3B, and fixed it with the screw. It is a figure for explaining a heat spreader. It is a figure for explaining a heat spreader. It is a figure showing the state where the heat spreader was mounted on the circuit board. It is a figure showing the state where another circuit board was arranged on the surface of the heat spreader placed on the circuit board, and the side opposite to the circuit board. FIG. 4 is a diagram showing an embodiment in which a sheet-like heat conductor is interposed in a processing chip that generates heat.

Hereinafter, embodiments will be described.
FIG. 1 is a diagram illustrating an appearance of the imaging device 1.
The portion indicated by reference numeral 2A is "one of the lenses included in the imaging unit".

  Reference numeral 3 indicates a “housing”. The housing 3 includes a housing portion 3A and a housing portion 3B.

  FIG. 2 shows the circuit board 4 mounted on the imaging device 1 and the mounted components 51, 52, 53, 54, 55 and the like mounted on the circuit board 4. These mounted components include arithmetic processing chips 5A and 5B. The operation processing chips 5A and 5B are hereinafter also referred to as “operation processing chips 5A and the like”, and the mounted components 51 to 55 and the like are also referred to as “mounted components 51 and the like”.

The mounting components 51 and the like including the arithmetic processing chip 5A and the like become convex portions with respect to the mounting surface of the circuit board 4, and have a “three-dimensional uneven shape” on the mounting surface of the circuit board 4.
FIG. 3 shows a state where the housing portion 3A is removed from the housing 3. An imaging unit including the lens 2A and the like and the circuit board 4 are incorporated in the housing portion 3B and fixed with screws.

The arithmetic processing chip 5A and the like mounted on the circuit board 4 shown in FIGS. 2 and 3 generate heat during the operation of the imaging apparatus 1, that is, at the time of photographing, and become hot when photographing is performed for a long time.
Therefore, it is necessary to process heat generated in the arithmetic processing chip 5A and the like.

  This “heat treatment” is performed by a “heat diffuser” described below.

  FIG. 4 is a diagram showing the heat spreader 6.

  The heat spreader 6 has a shape as shown in FIG. This shape is determined according to the state of the “portion where the heat spreader 6 is to be disposed” in the housing portion in which the circuit board 4 is incorporated.

  As shown in FIG. 5, the heat spreader 6 is formed by sealing a heat transfer medium 9 in a pack container 8. The heat transfer medium 9 does not fill the inside of the pack container 8 to the limit but is filled with a margin, and the unfilled portion inside is degassed. In FIG. 5, a portion indicated by reference numeral 10 indicates a state in which the pack container 8 is degassed and the inside surfaces of both sides are stuck, and there is no heat transfer medium 9 in this portion.

  After the heat transfer medium 9 is filled, the portion indicated by reference numeral 7 in FIG. 5 is fixed by heat welding, and the inside is sealed.

  FIG. 5B is a cross-sectional view taken along line AA of FIG. 5A. The portion filled with the heat transfer medium 9 is thick, and the portion 10 degassed is thin.

The heat transfer medium 9 is in a liquid or cream state, but is assumed to be “cream” in the example described.
The “cream-like heat transfer medium” does not have fluidity like a liquid, but is freely deformed according to external force when a mechanical external force acts. The image is close to "cosmetic cream".

  The pack container 8 is deformable, and is made of “thin polyethylene” in the example described. The thickness of the polyethylene constituting the pack container 8 is preferably, for example, 0.01 mm to 0.05 mm, and is 0.03 mm in the example described.

  The heat-conducting medium 9 is creamy and deforms freely in response to a mechanical external force. When the pack container 8 is made of polyethylene, it is "soft and deformable".

  That is, the thermal diffusion body 6 is easily deformed by the action of the external force.

  FIG. 6 shows a state where the heat spreader 6 is mounted on the circuit board 4. FIG. 6A is a perspective view, and FIG. 6B is a BB cross-sectional view of FIG.

  In the state shown in FIG. 6, the heat spreader 6 has not been deformed yet and is mounted in a plate shape. In FIG. 6B, the “lower surface in the figure” of the heat spreader 6 is shown. Are in contact with the arithmetic processing chip 5A. Of course, the lower surface of the heat spreader 6 is also in contact with the arithmetic processing chip 5B and other mounted components 51 mounted on the circuit board 4 shown in FIG.

  FIG. 7 shows a state in which another circuit board 11 is arranged on the surface of the heat spreader 6 placed on the circuit board as shown in FIG. FIG. 7A is a perspective view, and FIG. 7B is a cross-sectional view taken along the line CC of FIG.

  When the circuit board 11 is assembled, the circuit board 11 presses the heat spreader 6 in the “thickness direction”.

  When this pressing force “acts as an external force”, the cream-like heat transfer medium 9 in the pack container of the thermal diffusion body 6 moves in the pack container 8. Since the pack container is freely deformable, it allows the heat transfer medium 9 inside to move while deforming itself.

  As the heat transfer medium 9 moves in the pack container, the heat spreader 6 is freely deformed, and as shown in FIG. 7B, the arithmetic processing chip 5A which is a heat-generating electronic element of the circuit board 4 and its surroundings. Deforms following the three-dimensional shape of the area.

  As shown in FIG. 7B, the heat spreader 6 contacts not only the arithmetic processing chip 5A and the like, but also the surface of the circuit board 4. Note that the heat spreader 6 is deformed in accordance with the three-dimensional shape of the concavo-convex structure formed by other mounted components mounted on the circuit board 11.

  As described above, since the heat spreader 6 is deformed following the three-dimensional shape of the arithmetic processing chip 5A and the like and its peripheral region, the heat spreader 6 comes into surface contact with a portion whose temperature rises due to heat generation, and rises in temperature. Heat from the portion is effectively conducted to the heat spreader 6 and diffused throughout the heat spreader 6.

  Therefore, "localization of heat" is effectively prevented in a portion where the temperature rises due to heat generation, and the "time until the temperature reaches a high temperature" of the arithmetic processing chip 5A or the like can be effectively extended. It can be operated continuously for a long time.

  In FIG. 7, reference numeral 12 denotes a connector for connecting the circuit boards 4 and 11.

The supplementary description of the “imaging device” described above as an example of the “electronic device” is added.
This imaging apparatus is a spherical imaging apparatus. In FIG. 1, an “imaging unit” showing a lens 2A has a lens 2B together with a lens 2A as shown in FIG. 6 and FIG. The lenses 2A and 2B are included in two optical systems, respectively.

  Each of the optical systems including the lenses 2A and 2B is a "wide-angle lens having an angle of view of 180 degrees or more", and an image formed by these wide-angle lenses is acquired by an imaging unit, and the obtained images are connected to form an all-sky lens. A spherical image is obtained.

  In the embodiment described above with reference to FIG. 7, the heat spreader 6 is in direct contact with the arithmetic processing chip 5A or the like that generates heat. However, as in the embodiment shown in FIG. A sheet-like heat conductor 7 may be interposed between the chip 5A and the like and the heat diffuser 6.

  In this way, even when the heat spreader 6 cannot be brought into direct contact with the arithmetic processing chip 5A or the like, heat can be reliably conducted to the heat spreader 6 by the heat conductor 7.

  As the sheet-like heat conductor 7, an aluminum sheet, a graphite sheet, or the like can be suitably used.

  Further, when the size of the sheet-shaped heat conductor 7 is “larger than the arithmetic processing chip 5A or the like”, the calorific value of the arithmetic processing chip 5A or the like can be diffused over a wide range. Can be transmitted.

Supplement about heat spreader.
As described above, the heat spreader 6 is in direct surface contact with the portion where the temperature rises due to heat generation or directly through a heat conductor, effectively absorbs the heat from the portion where the temperature rises, and diffuses the entire heat spreader.

  Therefore, it is preferable that the heat transfer medium and the pack container constituting the heat diffusion body 6 have high thermal conductivity, and also that the “heat capacity as the heat diffusion body 6” is large.

  As for the material of the pack container, "polyethylene having a thickness of 0.03 mm" has been exemplified above, but the material is not limited thereto, and is a deformable soft material having chemical resistance to a heat transfer medium and heat resistance. Any material can be used as appropriate.

  The heat transfer medium is not limited to the cream-like medium described above, but may be a liquid one. When a liquid heat conducting medium is used, even if the heat spreader is simply placed on the substrate, the heat diffuser is deformed according to the “three-dimensional shape on the substrate” by its own weight.

  In addition, since the liquid heat transfer medium also generates heat conduction by convection, heat absorbed from a portion where the temperature rises can be efficiently diffused throughout the heat spreader.

  As the liquid heat transfer medium, alcohol, water, glycerin and the like can be suitably used, and various sol solutions such as hydrosol, organosol and alcosol can also be used.

  Since the heat spreader of the present invention is freely deformable, a large external force is not required for "deformation following the three-dimensional shape on the substrate". Therefore, no excessive mechanical force acts on the electronic element or the like during the deformation, and the electronic element or the like is not damaged.

  Also, since the heat transfer medium is sealed in the pack container, workability during repair is good. That is, the heat transfer medium can be easily taken out together with the pack container at the time of repair.

  The heat spreader is deformed following the three-dimensional shape on the substrate, and the heat transfer medium spreads to every corner of the pack container, so that “the maximum amount of heat transfer medium that can be filled” can be filled in the electronic device.

  When the heat spreader is incorporated in the electronic device, it deforms according to the three-dimensional shape of the circuit board, but once incorporated and deformed, no further deformation occurs. Therefore, "deformability" once incorporated is not required.

  In the specific example of the embodiment described above, a creamy heat transfer medium that is “constituted by a plurality of types of materials and solidified over time” is used. Therefore, those which "solidify over time" were used.

  That is, a product of Polymertech Group: CGW-3 (trade name) was used as a heat transfer medium. The heat transfer medium is a mixture of two kinds of grease-like substances obtained by adding additives to silicone, aluminum oxide, and aluminum hydroxide.

  Assuming that these two grease-like substances are substance A and substance B, they have different “viscosity”. The viscosity of substance A is 490 and the viscosity of substance B is 420.

  The substance A and the substance B are mixed at a mixing ratio of 1: 1, and the viscosity after mixing is 470.

  The heat transfer medium obtained by mixing the substance A and the substance B hardens and solidifies in about 5 hours after the mixing.

  Thus, even after solidification, thermal properties such as thermal conductivity do not change.

  Of course, after mixing, it is sealed in a pack container in a creamy state and mounted on a circuit board.

  The use of the solidified heat transfer medium prevents the heat transfer medium from leaking into the housing in the event that "the pack container is damaged".

  The heat conductivity of the heat transfer medium is 3 W / mK in both a creamy state and a solidified state, which is about six times the heat conductivity of "water" and has high heat conductivity.

  As described above, according to the present invention, the following electronic device and heat diffuser can be realized.

[1]
Circuit boards 4 and 11 on which mounting components including heat-generating electronic elements 5A and the like are mounted, housing 3 holding circuit boards 4 and 11 inside, and heat held together with the circuit board in the housing. And a heat spreader 6 in which a liquid or cream-like heat transfer medium 9 is sealed in a deformable pack container 8, and the heat-producing electronic elements 5A and the like of the circuit board and An electronic device 1 configured to deform according to the three-dimensional shape of a peripheral region.

[2]
The electronic device according to [1], wherein the heat spreader 6 directly contacts at least the heat-producing electronic element 5A or the like.

[3]
[1] The electronic device according to [1], wherein the thermal diffuser 6 contacts at least the heat-producing electronic element 5A or the like via a sheet-like heat conductor 7.

[4]
A heat spreader 6 in which a liquid or cream-like heat transfer medium 9 is sealed in a deformable pack container 8 and deformed in accordance with the three-dimensional shape of a heat-generating article and its surrounding area.

[5]
[4] The heat spreader according to [4], wherein the heat transfer medium 9 sealed in the pack container 8 is a liquid.

[6]
[4] The heat spreader according to [4], wherein the heat transfer medium 9 sealed in the pack container 8 is cream-like.

[7]
[6] The heat diffuser according to [6], wherein the cream-like heat transfer medium is made of a plurality of types of materials, and solidifies with time.

[8]
The heat diffuser according to any one of [4] to [7], which is used in the electronic device according to any one of [1] to [3].

[9]
The electronic device according to any one of [1] to [3], including an imaging unit including lenses 2A and 2B and configured as the imaging device 1.

  As described above, the preferred embodiments of the present invention have been described. However, the present invention is not limited to the specific embodiments described above, and unless otherwise specified in the above description, the invention described in the claims. Various modifications and changes are possible within the scope of the spirit of the present invention.

  For example, the opening 7 of the heat dissipation pack 6 described above may be made “open with a fastener (zip lock)” so that it can be opened and closed. In this case, sealing after filling with the heat conductive medium is easy, Further, the exchange of the heat transfer medium is easy.

  The effects described in the embodiments of the present invention merely enumerate preferable effects resulting from the invention, and the effects according to the invention are not limited to those described in the embodiments.

1 Imaging device
3A, 3B Housing part (constituting a housing)
4,11 circuit board
5A, 5B, 5C arithmetic processing chip (heat-generating electronic element)
6 Thermal diffuser
8 pack container
9 Heat transfer medium

JP-A-11-97869 Japanese Patent No. 540220

An electronic device according to an embodiment of the present invention includes an imaging unit having two lenses included in two systems of optical systems, is an electronic device configured as an imaging device, and has a mounting component including a heat-generating electronic element mounted thereon. One or two circuit boards, a housing for holding the circuit boards therein, and a heat spreader held in the housing together with the circuit boards, wherein the two lenses are mounted on the circuit board. The heat diffusion medium is filled in a deformable pack container, and the heat diffusion medium is formed in a three-dimensional shape of the heat-generating electronic element of the circuit board and the peripheral area thereof. configuration der to follow deformation is, is arranged so as to be positioned between the two lenses.

[1]
An electronic apparatus having an imaging unit having two lenses 2A and 2B included in two systems of optical systems and configured as the imaging apparatus 1, in which a mounting component including an exothermic electronic element 5A and the like is mounted. It has circuit boards 4 and 11, a housing 3 for holding the circuit board inside, and a heat spreader 6 held together with the circuit board in the housing, and the two lenses 2A and 2B provided one on both sides of the circuit board, said thermal diffuser 6 is made by filling a heat conducting medium 9 in deformable pack container 8, wherein the heat-generating electronic element 5A Oyo originator of the circuit board configuration der to deform following the three-dimensional shape of the peripheral region is, the two lenses 2A, are arranged so as to be positioned between 2B.

[4]
A heat spreader used as a heat spreader in the electronic device according to any one of [1] to [3], wherein a liquid or cream-like heat conductive medium 9 is filled in a deformable pack container 8. And a heat diffusion body 6 configured to deform according to the three-dimensional shape of the heat-generating article and its peripheral region.

Claims (9)

A circuit board mounted with mounting components including a heat-generating electronic element, a housing holding the circuit board inside, and a heat spreader held together with the circuit board in the housing,
The heat spreader is configured such that a liquid or cream-like heat conductive medium is hermetically sealed in a deformable pack container, and is deformed according to the three-dimensional shape of the heat-generating electronic element of the circuit board and its peripheral region. Is an electronic device. The electronic device according to claim 1,
An electronic device in which the heat spreader is in direct contact with at least the heat-producing electronic element. The electronic device according to claim 1,
An electronic device in which a heat diffuser contacts at least an exothermic electronic element via a sheet-like heat conductor.   A heat spreader comprising a liquid or cream-like heat-conducting medium sealed in a pack container and deformed according to the three-dimensional shape of the heat-generating article and its peripheral area. The heat spreader according to claim 4, wherein
A heat diffuser in which the heat transfer medium sealed in the pack container is liquid. The heat spreader according to claim 4, wherein
A heat spreader in which a heat conductive medium sealed in a pack container is cream-like. The heat spreader according to claim 6, wherein
A heat spreader in which a cream-like heat transfer medium is composed of multiple types of materials and solidifies over time. The heat spreader according to any one of claims 4 to 6, wherein
A heat spreader used as a heat spreader in the electronic device according to claim 1.   The electronic device according to claim 1, further comprising an imaging unit including a lens, and configured as an imaging device.

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