JP2020005216A - Solid state image pickup device - Google Patents

Abstract

To provide a solid state image pickup device that reduces the size of a sealing fixing part formed of a sealing resin as much as possible to reduce the size of the entire configuration.SOLUTION: A solid state image pickup device is used which comprises: a main substrate having a solid state image pickup element that includes a connection terminal for transmitting and receiving electrical signals on the back of a light receiving surface, the connection terminal for establishing electrical connection with the solid state image pickup element, and a cavity part in which an electronic component is arranged; first conductor patterns that are formed at the ends of the connection terminal; and a sealing resin that is formed on the connection terminals. A solid state image pickup device is used which comprises: a main substrate having a solid state image pickup element that includes a connection terminal for transmitting and receiving electrical signals on the back of a light receiving surface, the connection terminal for establishing electrical connection with the solid state image pickup element, and a cavity part in which an electronic component is arranged via an electrical connection part; a second conductor pattern that is formed at an end of the cavity part; and a sealing resin that covers the electronic component.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a small solid-state imaging device provided in an electronic endoscope or the like.

  2. Description of the Related Art Conventionally, by inserting an elongated insertion portion into a body cavity, an internal organ in the body cavity is observed, and if necessary, a medical endoscope for performing various treatments using a treatment tool inserted into the treatment tool channel. Mirrors are widely used. Also, in the industrial field, industrial endoscopes capable of observing and inspecting internal scratches and corrosion of boilers, turbines, engines, chemical plants, and the like are widely used.

  As the endoscope, for example, a solid-state imaging device such as a solid-state imaging device such as a charge-coupled device (abbreviated as CCD) or an electronic component provided at a distal end portion of an insertion portion is incorporated. An electronic endoscope is used in which a signal that has been photoelectrically converted by the solid-state imaging device is transmitted through a signal cable and displayed in color on a monitor device via a signal processing unit.

  In an endoscope, since it is inserted into a narrow and meandering lumen, it is desired to reduce the diameter of the insertion portion. In the electronic endoscope, there has been a demand for a small-sized and small-diameter solid-state imaging device in order to realize an endoscope with a small turn and good operability.

  For example, as a solid-state imaging device disposed at the tip of an electronic endoscope, Patent Document 1 discloses that the mounting area of a flexible substrate is increased without increasing the external size in order to achieve high density or miniaturization. Shown is a solid-state imaging device that enables it.

JP-A-11-193572

  FIG. 8 is a cross-sectional view of the solid-state imaging device of Patent Document 1, and FIG. 9 is a side view of the solid-state imaging device of Patent Document 1.

  However, in the solid-state imaging device of Patent Document 1, the light-receiving surface 22a of the solid-state imaging device 22, the cover plate 21 which is a transparent member adhered on the light-receiving surface 22a, and the connection terminal 22b at the end of the solid-state imaging device 22 And a pad portion disposed on the connection terminal 22b, a protruding electrode formed on the pad portion, an inner lead of the flexible substrate 32 connected via the protruding electrode, and Electronic components 33 and 34 are arranged, a peripheral portion of the connection terminal 22b and the solid-state imaging device 22, and a sealing resin 26 sealed at a connection portion with the inner lead.

  For this reason, in the solid-state imaging device 22, the proportion of the light receiving surface 22a occupied by the connection terminal 22b decreases, and as a result, the performance efficiency of the solid-state imaging decreases.

  Further, the range of the sealing and fixing portion formed by the sealing resin 26 has been widened, which has hindered miniaturization of the solid-state imaging device.

  An object of the present invention is to solve the above-mentioned conventional problems, and to provide a module structure that can minimize the area without impairing the performance efficiency of solid-state imaging and that can be miniaturized. .

(Independent claims only)
To achieve the above object, a solid-state imaging device including a connection terminal for transmitting and receiving an electric signal on a back surface with respect to a light receiving surface, and a connection terminal for making an electrical connection with the solid-state imaging device, A solid-state imaging device including: a main substrate having a cavity in which an electronic component is arranged; a first conductor pattern formed at an end of the connection terminal; and a sealing resin formed at the connection terminal. Used.

  Also, a solid-state imaging device having a connection terminal for transmitting and receiving an electric signal on the back surface with respect to the light receiving surface, a connection terminal for making an electrical connection with the solid-state imaging device, and an electronic component being electrically connected Using a solid-state imaging device including a main substrate having a cavity portion disposed through the portion, a second conductor pattern formed at an end portion of the cavity portion, and a sealing resin covering the electronic component. .

  As described above, according to the solid-state imaging device of the present invention, by forming the connection terminals on the back surface of the light-receiving surface, the occupancy of the light-receiving surface is increased, and as a result, the performance efficiency of the solid-state imaging is not impaired.

  Furthermore, a fillet is formed up to the end of the main substrate without the sealing resin flowing down to the side surface of the main substrate by the conductor pattern, so that a highly reliable, small, and high-performance solid-state imaging device can be provided.

(A)-(b) Sectional views showing the configuration of the solid-state imaging device according to Embodiment 1 of the present invention. (A)-(b) Plan views showing the configuration of the solid-state imaging device according to Embodiment 1 of the present invention. Sectional view showing wet spreading of sealing resin according to Embodiment 1 of the present invention. (A)-(f) Sectional drawing which shows the formation process of the solid-state imaging device in Embodiment 1 of this invention. Sectional drawing which shows the structure of the solid-state imaging device in Embodiment 2 of this invention. (A)-(b) Plan views showing the configuration of the solid-state imaging device according to Embodiment 2 of the present invention. (A)-(b) Plan views showing the configuration of the solid-state imaging device according to Embodiment 3 of the present invention. Sectional view showing the configuration of a conventional solid-state imaging device Plan view showing the configuration of a conventional solid-state imaging device

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
FIGS. 1A and 1B are cross-sectional views of a solid-state imaging device according to Embodiment 1 of the present invention. FIGS. 2A and 2B are diagrams illustrating Embodiment 1 of the present invention. FIG. 2A is a plan view of the solid-state imaging device taken along a dashed line A in FIG. 1, in which FIG.

  FIG. 3 is a cross-sectional view showing the spreading of the sealing resin in region B of FIG. 1A in the first embodiment of the present invention.

<Structure>
As shown in FIGS. 1A and 1B, the structure of the solid-state imaging device according to the first embodiment of the present invention includes a solid-state imaging device 3, and one surface of the solid-state imaging device 3 has a light receiving surface. 3a, a plurality of first connection terminals 9 are arranged on the other surface.

  The cover glass 1 is arranged so as to face the light receiving surface 3 a, and the solid-state imaging device 3 and the cover glass 1 are fixed with an adhesive 2.

  The main substrate 8 is disposed so as to face the surface 3 b of the solid-state imaging device 3, and the first connection terminal 9 of the solid-state imaging device 3 and the second connection terminal 11 of the main substrate 8 are connected via the protruding electrode 10. The connection portion between the solid-state imaging device 3 and the main substrate 8 is fixed by the sealing resin 4.

  Then, as shown in FIG. 1A, the sealing resin 4 spreads without flowing to the outside of the first conductive pattern 5a formed at the end of the joint.

  Here, the first conductor pattern 5a is also used as an alignment recognition mark in a mounting machine used when connecting the main substrate 8 and the solid-state imaging device 3. The first conductor pattern 5a has a shape different from that of the second connection terminal 11.

  Further, as shown in FIG. 1B, a plurality of electronic components 6 are arranged in cavities 7 formed on both sides of the junction between the main substrate 8 and the solid-state imaging device 3, and the third connection of the main substrate 8 is performed. It is electrically connected to the terminal 13 via the bonding material 12.

Further, a plurality of cable connection terminals 14 are formed on the main board 8.
<Production method>
Such a solid-state imaging device can be manufactured by the steps shown in FIGS.

  First, as shown in FIG. 4A, the first connection terminal 9 is formed on the solid-state imaging device 3, the cover glass 1 is arranged on the light receiving surface of the solid-state imaging device, and fixed with the adhesive 2.

  On the other hand, as shown in FIG. 4B, the first conductor pattern 5a, the second connection terminal 11, the third connection terminal 13, and the cable connection terminal 14 are formed on the main board 8 in which the cavity 7 is formed.

  The first conductor pattern 5a is formed in the same process as the second connection terminal 11, the third connection terminal 13, and the cable connection terminal 14.

  Next, as shown in FIG. 4C, the protruding electrodes 10 are formed on the second connection terminals 11, and the electronic component 6 and the bonding material 12 are arranged on the third connection terminals 13 of the cavity 7.

  Next, as shown in FIG. 4D, the bonding material 12 is melted by heating, and the electronic component 6 and the third connection terminal 13 are electrically connected via the bonding material 12.

  Next, as shown in FIG. 4E, the surface of the main substrate 8 on which the protruding electrodes 10 are formed and the surface of the solid-state imaging device 3 on which the first connection terminals 9 are formed are arranged facing each other, and the first connection is established. The terminal 9 and the second connection terminal 11 are electrically connected via the protruding electrode 10.

Finally, as shown in FIG. 4F, the joint between the first connection terminal 9 and the second connection terminal 11 is sealed with the sealing resin 4 to fix the connection, thereby completing the solid-state imaging device. .
<Operation>
In FIG. 1A, the solid-state imaging device 3 receives light on a light receiving surface 3a via a cover glass 1, and is converted into an electric signal.

  The converted electric signal is transmitted to the main board 8 electrically connected to the solid-state imaging device 3.

  The electric signal transmitted to the main board 8 is transmitted to the electronic component 6 electrically connected to the main board 8.

  The electronic component 6 performs processing incorporated in the electronic component 6 on the transmitted electric signal, and transmits the signal to the main board 8 again.

After passing through all the electronic components 6, the electric signal is transmitted from the cable connection terminal 14 to the external device.
<Each element>
The size of each member is as follows: main board 8 is 1 mm × 1 mm × thickness 0.6 mm, electronic component 6 is 0.6 mm × 0.3 mm × thickness 0.3 mm or less, and cover glass 1 is 1 mm × 1 mm × thickness. The thickness is 0.3 mm, and the solid-state imaging device 3 is 1 mm × 1 mm × 0.1 mm in thickness.

<Electronic components 6>
The electronic component 6 is, for example, a capacitor, but may be a resistor.
<Cover glass 1>
The cover glass 1 is a transparent rectangular parallelepiped optical member.

  Further, in order to make the width of the solid-state imaging device the same as that of the solid-state imaging device 3 and to reduce the size, the width of the cover glass 1 is not more than the solid-state imaging device 3.

<Solid-state imaging device 3>
The solid-state imaging device 3 is a CCD image sensor or a CMOS image that detects light and converts it into an electric signal. A circuit for performing signal processing may be incorporated. It may be stacked with an element having a function of performing signal processing. A first connection terminal 9 for transmitting and receiving electric signals is provided.

<First connection terminal 9, second connection terminals 11, 13, 14>
The first connection terminals 9, 11, 13, and 14 are formed of, for example, aluminum or the like, but may be formed of metal such as copper or tungsten having higher conductivity than aluminum. Further, the copper may be subjected to a nickel / gold plating treatment so that the copper is hardly oxidized.

<Cable connection terminal 14>
The cable connection terminal 14 is made of, for example, aluminum or the like, but may be made of a metal such as copper, which has higher conductivity than aluminum, or tungsten. Further, the copper may be subjected to a nickel / gold plating treatment so that the copper is hardly oxidized.

<Protrusion electrode 10>
The protruding electrode 10 is formed of, for example, solder or the like, but may be formed of a metal such as copper or gold.

<Main board 8>
The main substrate 8 is formed of, for example, a ceramic substrate, but may be a build-up substrate, an aramid epoxy substrate, a glass epoxy substrate, or the like.

<Cavity part 7>
The size of the cavity portion 7 is 1.0 mm × 0.35 mm × thickness 0.35 mm. When the electronic component 6 is accommodated in the cavity portion 7, the width of the solid-state imaging device is reduced to the width of the solid-state imaging device 3. And can be kept the same.

  Two cavities 7 are formed symmetrically on the surface of the main substrate 8 connected to the solid-state imaging device 3, and the heat radiation of the solid-state imaging device 3 is symmetrical, so that the characteristics vary in-plane. Can be held down.

<Adhesive 2>
The adhesive 2 is a transparent adhesive such as an ultraviolet curing type, and has a width dimension equal to or less than that of the solid-state imaging device.
<Sealing resin 4>
The sealing resin 4 is an epoxy-based adhesive, and has a width equal to or smaller than that of the solid-state imaging device 3.

  Also, as shown in FIG. 2A, by forming the first conductor pattern 5a at the end of the main substrate 8, the sealing resin 4 is joined to the bonding portion as shown in FIGS. 2B and 3. Is prevented from flowing out of the first conductor pattern 5a formed at the end of the first conductor pattern 5a. Further, by applying plating to the first conductor pattern 5a, the sealing resin 4 spreads to the end of the first conductor pattern 5a to form a fillet C.

  Further, the sealing resin 4 may be formed in the region of the cavity portion 7 as long as it does not flow outside the main substrate 8.

<First conductor pattern 5a>
The first conductor pattern 5a is formed of, for example, aluminum or the like, but may be a metal such as copper or a tungsten having a higher conductivity than aluminum. Further, the copper may be subjected to a nickel / gold plating treatment so that the copper is hardly oxidized.

  The first conductor pattern 5a is also used as a recognition mark for alignment in a mounting machine used when connecting the main substrate 8 and the solid-state imaging device 3. It is desirable that the shape of the first conductive pattern 5a is different from the shape of the second connection terminal 11 and that the sealing resin 4 does not flow down to the outside of the main substrate 8, and the size is 0.1 mm in the longitudinal direction. The corner mark is 3 mm × 0.1 mm, and the short side direction is 0.15 mm × 0.1 mm.

(Embodiment 2)
FIG. 5 is a cross-sectional view of the solid-state imaging device according to Embodiment 2 of the present invention. FIGS. 6A and 6B are diagrams illustrating solid-state imaging at wavy line A in FIG. 5 according to Embodiment 2 of the present invention. 6A is a plan view of the device, FIG. 6A is before sealing, and FIG. 6B is after sealing. Items not described are the same as in the first embodiment.
<Structure>
As shown in FIG. 5, the structure of the solid-state imaging device according to the second embodiment of the present invention includes a solid-state imaging device 3 having a light-receiving surface 3a on one surface and a light-receiving surface 3a on the other surface. And a plurality of first connection terminals 9.

  The cover glass 1 is arranged so as to face the light receiving surface 3 a, and the solid-state imaging device 3 and the cover glass 1 are fixed with an adhesive 2.

  The main substrate 8 is disposed so as to face the surface 3 b of the solid-state imaging device 3, and the first connection terminal 9 of the solid-state imaging device 3 and the second connection terminal 11 of the main substrate 8 are connected via the protruding electrode 10. The connection portion between the solid-state imaging device 3 and the main substrate 8 is fixed by the sealing resin 4.

  A plurality of electronic components 6 are arranged in a cavity 7 formed on one side of a joint between the main board 8 and the solid-state imaging device 3, and are electrically connected to the third connection terminals 13 of the main board 8 via the joining material 12. Connected.

Further, a plurality of cable connection terminals 14 are formed on the main board 8.
<Cavity part 7>
The size of the cavity portion 7 is 1.0 mm × 0.7 mm × thickness 0.35 mm. When the electronic component 6 is accommodated in the cavity portion 7, the width of the solid-state imaging device is reduced to the width of the solid-state imaging device 3. And can be kept the same.

One cavity 7 is formed on one side of the second connection terminal 11 of the solid-state imaging device 3 of the main substrate 8, and the manufacturing process of the main substrate 8 can be shortened by reducing the number of cavities 7. it can.
<Sealing resin 4>
The sealing resin 4 is an epoxy-based adhesive, and has a width dimension equal to or less than that of the solid-state imaging device 3.

  6A, first conductor patterns 5a and 5b are formed at the ends of the main substrate 8 and the second connection terminals 11 of the solid-state imaging device 3, and the second conductor patterns 5a and 5b are formed at the ends of the cavity 7. By forming the conductive pattern 5c, the sealing resin 4 is prevented from flowing out of the main substrate 8 as shown in FIG. The second conductor pattern 5c has a shape different from that of the third connection terminal 13.

<First conductor pattern 5a, 5b, second conductor pattern 5c>
The first conductor patterns 5a and 5b and the second conductor pattern 5c are made of, for example, aluminum or the like, but may be made of metal such as copper or tungsten having higher conductivity than aluminum. Further, the copper may be subjected to a nickel / gold plating treatment so that the copper is hardly oxidized.

  It is preferable that the first conductor patterns 5a and 5b and the second conductor pattern 5c are formed in the same process as the second connection terminal 11 and the third connection terminal 13.

  The first conductor patterns 5a, 5b and the second conductor pattern 5c are also used as alignment recognition marks in a mounting machine used when connecting the main substrate 8 and the solid-state imaging device 3. It is desirable that the first conductor patterns 5a, 5b and the second conductor pattern 5c have a shape different from that of the second connection terminal 11 and a shape such that the sealing resin 4 does not flow outside the main substrate 8; The size of the first conductor patterns 5a and 5b is a corner mark of 0.3 mm × 0.1 mm in the longitudinal direction and 0.15 mm × 0.1 mm in the transverse direction, and the size of the first conductor pattern 5b is 0.1 mm. It becomes a rectangle of × 0.08 mm, and the size of the second conductor pattern 5c is a rectangle of 0.7 mm × 0.08 mm.

  The first conductor patterns 5a and 5b of the first embodiment may not be provided, and only the second conductor pattern 5c may be provided.

(Embodiment 3)
7 (a) and 7 (b) are plan views of a solid-state imaging device according to Embodiment 3 of the present invention. FIG. 7 (a) is before sealing, and FIG. 7 (b) is after sealing. is there. Items not described are the same as in the first and second embodiments.

<Sealing resin 4>
The sealing resin 4 is an epoxy-based adhesive, and has a width equal to or smaller than that of the solid-state imaging device 3.

  Also, as shown in FIG. 7A, by forming the first conductor pattern 5a at the end of the main substrate 8, as shown in FIG. To prevent the first conductive pattern 5a from flowing down to the outside.

  Further, by applying plating to the first conductive pattern 5a, the sealing resin 4 spreads to the end of the conductive pattern 5 to form a fillet C.

  Here, the second conductor pattern 5c is also used as an alignment recognition mark in a mounting machine used when connecting the main substrate 8 and the solid-state imaging device 3. The shape of the first conductor pattern 5a is a circle larger than the second connection terminal 11.

  Further, the sealing resin 4 may be formed in the region of the cavity portion 7 as long as it does not flow outside the main substrate 8.

<First conductor pattern 5a>
The first conductor pattern 5a is formed of, for example, aluminum or the like, but may be a metal such as copper or a tungsten having a higher conductivity than aluminum. Further, the copper may be subjected to a nickel / gold plating treatment so that the copper is hardly oxidized.

  The first conductor pattern 5a is also used as a recognition mark for alignment in a mounting machine used when connecting the main substrate 8 and the solid-state imaging device 3. The shape of the first conductive pattern 5a is desirably a circle larger than the second connection terminal 11 and a shape such that the sealing resin 4 does not flow out of the main substrate 8. Has a diameter of 0.1 mm, whereas the size of the first conductor pattern 5a has a diameter of 0.2 mm.

<Effect>
By forming the connection terminal on the back surface of the light receiving surface as in the above structure, the occupancy of the light receiving surface of the solid-state imaging device is increased, and the performance efficiency of the solid-state imaging is not impaired. By forming a fillet up to the end of the main substrate without the sealing resin flowing down to the side surface of the main substrate by the formed conductor pattern, it is possible to provide a highly reliable, compact, and high-performance solid-state imaging device. .

(as a whole)
Embodiments 1 to 3 can be combined.

  The solid-state imaging device of the present application is widely used as a small-sized solid-state imaging device such as a solid-state imaging device for an endoscope.

REFERENCE SIGNS LIST 1 cover glass 2 adhesive 3 solid-state imaging device 3 a light receiving surface 3 b surface 4 sealing resin 5 conductive pattern 5 a first conductive pattern 5 b first conductive pattern 5 c second conductive pattern 6 electronic component 7 cavity 8 main board 9 first connection Terminal 10 Protrusion electrode 11 Second connection terminal 12 Bonding material 13 Third connection terminal 14 Cable connection terminal 21 Cover plate 22 Solid-state image sensor 22a Light receiving surface 22b Connection terminal 26 Sealing resin 32 Flexible substrate 33 Electronic component

Claims (8)

A solid-state imaging device including a first connection terminal for transmitting and receiving an electric signal on a back surface with respect to a light receiving surface;
A main board having a second connection terminal for electrical connection with the solid-state imaging device, and a cavity in which electronic components are arranged;
A first conductor pattern formed at an end of the first connection terminal;
A sealing resin formed on the first connection terminal;
A solid-state imaging device including: The solid-state imaging device according to claim 1, wherein a shape of the second connection terminal is different from a shape of the first conductor pattern. The solid-state imaging device according to claim 1, wherein the sealing resin is spread over the first conductor pattern but does not protrude from a side surface of the solid-state imaging device. 4. The solid-state imaging device according to claim 1, wherein the first conductor pattern is a recognition mark for alignment between the main substrate and the solid-state imaging device. 5. A solid-state imaging device including a first connection terminal for transmitting and receiving an electric signal on a back surface with respect to a light receiving surface;
A main board having a second connection terminal for making an electrical connection with the solid-state imaging device, and a cavity in which an electronic component is arranged via the third connection terminal;
A second conductor pattern formed at an end of the cavity,
A sealing resin covering the electronic component,
A solid-state imaging device including: The solid-state imaging device according to claim 4, wherein the sealing resin is spread over the second conductor pattern. The solid-state imaging device according to claim 4, wherein the sealing resin is spread over the second conductor pattern, but does not protrude from a side surface of the solid-state imaging device. The solid-state imaging device according to claim 1, wherein the two cavities are bilaterally symmetric.

Images