JP2020004233A - Electronic device, control program, and control method - Google Patents

Abstract

To reduce power consumption for cooling.SOLUTION: Fans 11, 12, 13 are arranged in line to cool multiple areas in a housing. A processing unit 18 acquires component information D1 which indicates components 14, 15, 16 mounted on each of the areas and quantity of heat generated by the components 14, 15, 16, and load information D2 indicating loads of the components 14, 15, 16. The processing unit 18 evaluates, for each fan, a first cooling effect of the fan in a current direction and a second cooling effect of the fan to be obtained when facing different areas from the area the fan faces, on the basis of the component information D1 and the load information D2. The processing unit 18 selects the fan 11 of which the second cooling effect is higher than the first cooling effect, to direct the fan 11 to face another area, and reduces a rotation speed of the fan 12 facing the other area.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic device, a control program, and a control method.

  At present, electronic components are incorporated in various products. The electronic components generate heat by consuming power as they operate. The amount of heat generated can increase due to the power consumption according to the load of the electronic component, the density of arrangement of the electronic component, and the like. If heat is accumulated in the product housing, the temperature inside the housing may increase. The high temperature of the product may cause a failure, injury to a user, a fire accident, and the like. Therefore, a fan is provided in the product housing, and an electronic component is air-cooled by the fan to suppress an excessive rise in temperature inside the housing, thereby improving the reliability and safety of the product in some cases.

  For example, adjusting the angle of the louver attached to the cooling fan reduces the airflow to the file bay where no device is mounted, and increases the airflow to the file bay where the device is actually mounted. There is a method proposal.

  In addition, the temperature of each module mounted on the electronic device is individually detected, and the direction of the cooling air from multiple cooling fans that cool each module is varied so that all detected temperature values are the same. There is also a proposal for a cooling mechanism to be set. The proposed cooling mechanism adjusts the temperature of the module by changing the wind direction, so that the cooling efficiency is improved without increasing the rotation speed of each cooling fan.

  Furthermore, it has a plurality of cooling devices that cool electronic devices at a uniform rotation speed, and changes the flow of air flowing through the area divided into blocks including the object to be cooled according to the presence or absence of the object. There is also a proposal for a server device that performs this.

JP-A-11-177265 JP 2009-117472 A JP-A-2006-157237

  As in the above proposal, a method of realizing a predetermined cooling performance as a whole of a plurality of fans by changing the direction of the wind by the fans while keeping the rotation speed of each fan uniform can be considered. However, according to this method, there is a possibility that the power consumption for cooling by each fan cannot be sufficiently reduced depending on the load imbalance of the electronic components in the housing. For example, the difference in load between a high-load location and a low-load location in a housing may be relatively large. In this case, if the rotation speed of each fan is set uniformly so as to sufficiently cool the high-load location, the rotation speed of the fan that cools the vicinity of the low-load location becomes excessive, and the power is excessively increased by the fan. May be consumed. In addition, since each fan is directed to a high-load location, the high-load location is excessively cooled, and the power may be excessively consumed by each fan.

  In one aspect, an object of the present invention is to provide an electronic device, a control program, and a control method that reduce power consumption for cooling.

  In one aspect, an electronic device is provided. The electronic device has a plurality of fans and a processing unit. The plurality of fans are arranged in a row and cool a plurality of areas in the housing. The processing unit acquires component information indicating a component mounted on each of the plurality of areas and a heat value of the component, and load information indicating a load of the component, and based on the component information and the load information, obtains a current orientation. The first cooling effect of the fan and the second cooling effect of the fan when the fan is directed to another area different from the area to which the fan is directed are evaluated for each fan, and the second cooling effect is determined as the first cooling effect. The first fan having a higher cooling effect is selected, the first fan is directed to another area, and the rotation speed of the second fan directed to another area among the plurality of fans is reduced.

In one aspect, a control program is provided.
In one aspect, a control method is provided.

  In one aspect, power consumption for cooling can be reduced.

FIG. 1 is a diagram illustrating an electronic device according to a first embodiment. FIG. 6 illustrates a storage device according to a second embodiment. FIG. 3 is a block diagram illustrating an example of hardware of a CM. FIG. 2 is a diagram illustrating a configuration example of a storage device. FIG. 4 is a diagram illustrating an example of the flow of air in the housing of the storage device. It is a figure showing an example of a cooling area for a fan. It is a figure showing an example of a relation between a wind direction and a direction of a fan. It is a figure showing an example of a parts management table. FIG. 7 is a diagram illustrating an example of a load management table. It is a figure showing an example of a cooling effect management table. It is a figure showing the example (the 1) of wind direction control. It is a figure showing the example (the 2) of the wind direction control. 9 is a flowchart illustrating an example of a monitoring process. FIG. 4 is a diagram illustrating an example of power consumption for cooling. It is a figure showing the example of the wind speed in a case. It is a figure showing the example of the influence of wind direction control. It is a figure showing an example of a wind direction table. FIG. 9 is a diagram illustrating another example (part 1) of the device configuration. FIG. 9 is a diagram illustrating another example (part 2) of the device configuration.

Hereinafter, the present embodiment will be described with reference to the drawings.
[First Embodiment]
A first embodiment will be described.

FIG. 1 is a diagram illustrating the electronic device according to the first embodiment.
The electronic device 10 includes fans 11, 12, 13, components 14, 15, 16, a storage unit 17, and a processing unit 18.

  The fans 11, 12, and 13 cool a plurality of areas in the housing of the electronic device 10 so that the temperature inside the housing of the electronic device 10 does not excessively increase. For example, the cooling medium (refrigerant) is air. The fans 11, 12, and 13 blow air to the area to be cooled. The fans 11, 12, and 13 are arranged in a line in the housing of the electronic device 10. Specifically, the direction from the lower side to the upper side in FIG. 1 is defined as the positive direction of the Y axis, and the direction from the left side to the right side is defined as the positive direction of the X axis. The Z axis is an axis orthogonal to the XY axes.

  The positive direction of the X axis is defined as the front direction of the fans 11, 12, and 13. The initial setting of the wind direction by the fans 11, 12, 13 is the positive direction (front direction) of the X axis. That is, the fans 11, 12, and 13 are initially oriented in the positive direction of the X axis. The fans 11, 12, and 13 are arranged in a line in the Y-axis direction. The fan 11 is arranged next to the fan 12. The fan 12 is arranged next to the fans 11 and 13. The fan 13 is arranged next to the fan 12.

  The direction of the fan 11 (the wind direction by the fan 11) can be changed by changing the direction of the fan 11. For example, the fan 11 has fins that guide the wind in a predetermined direction. The fin has a rotation axis along the Z axis. The fan 11 can realize a wind direction according to the rotation angle of the fin by setting the rotation angle of the fin. The directions of the fans 12 and 13 can be changed in the same manner as the fan 11. Further, the rotation speeds of the fans 11, 12, and 13 can be individually changed. For example, the processing units 18 initially control the fans 11, 12, and 13 to operate at a predetermined number of revolutions in accordance with a result of temperature detection by a temperature sensor provided in the electronic device 10. The directions and the rotation speeds of the fans 11, 12, and 13 are controlled by the processing unit 18.

  Here, the space inside the housing of the electronic device 10 is divided into a plurality of areas. The plurality of areas include a first area 20, a second area 30, and a third area 40. The first area 20 is adjacent to the second area 30. The second area 30 is adjacent to the first area 20 and the third area 40. The third area 40 is adjacent to the second area 30. For example, the first area 20 is an area (an area adjacent to the fan 11) facing the exhaust-side surface (front) of the fan 11. The second area 30 is an area (an area adjacent to the fan 12) facing the exhaust-side surface (front) of the fan 12. The third area 40 is an area (an area adjacent to the fan 13) facing the exhaust-side surface (front) of the fan 13.

  The components 14, 15, 16 are electronic components of the electronic device 10. For example, the components 14, 15, and 16 may be a processor such as a CPU (Central Processing Unit), a RAM (Random Access Memory), or an electronic circuit that implements other functions. The component 14 is mounted in the first area 20. The component 15 is mounted in the second area 30. The component 16 is mounted in the third area 40. Two or more components may be mounted in each area.

  The storage unit 17 may be a volatile storage device such as a RAM or a non-volatile storage device such as a flash memory. The processing unit 18 may include a CPU, a DSP (Digital Signal Processor), an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array), and the like. The processing unit 18 may be a processor that executes a program. The “processor” may be a set of a plurality of processors (multiprocessor). The storage unit 17 and the processing unit 18 may be mounted in any of the first area 20, the second area 30, and the third area 40.

  The storage unit 17 stores the component information D1. The component information D1 indicates a component mounted in each of the plurality of areas and a calorific value of the component per unit time (unit is watt (W)). For example, the component information D1 includes information indicating the component 14 mounted in the first area 20 and the maximum heat generation amount (unit: W) per unit time of the component 14. Further, the component information D1 includes information indicating the component 15 mounted in the second area 30 and the maximum heat generation amount of the component 15 per unit time. Further, the component information D1 includes information indicating the component 16 mounted in the third area 40 and the maximum heat generation amount of the component 16 per unit time. The component information D1 is changed by the processing unit 18 according to a change in the component mounting status in each area. For example, information provided by each component or the vendor of the electronic device 10 is stored in advance in the storage unit 17 as information on the heat generation amount (maximum heat generation amount) per unit time of each component.

  The processing unit 18 acquires the component information D1 stored in the storage unit 17 and the load information D2 indicating the load of the component. The processing unit 18 acquires the load information D2 from each of the components 14, 15, and 16. For example, the processing unit 18 executes the following processing when there is a change in the component mounting status or when the load on the component has changed by a certain amount or more.

  Based on the component information D1 and the load information D2, the processing unit 18 determines whether or not the first cooling effect of the fan in the current direction and the direction of the fan to another area different from the area to which the fan is directed. The second cooling effect of the fan is evaluated for each fan. The other area for a certain fan is, for example, an adjacent area further adjacent to an area adjacent to the fan (for example, an adjacent area to the first area 20 is a second area 30).

  Here, the cooling effect is an index indicating the degree of contribution of the corresponding fan to cooling in the housing. For example, the cooling effect is represented by the amount of heat per unit time (unit: watt (W)) that the refrigerant sent from the fan takes from the cooling area corresponding to the fan. In this case, the cooling effect increases as the amount of heat per unit time taken by the fan from the cooling area increases, and the cooling effect decreases as the amount of heat decreases. Hereinafter, when the amount of heat (calorific value) is simply referred to, it indicates the calorific value (calorific value) per unit time.

  Further, the cooling area is an area obtained by combining an area adjacent to the fan and an area adjacent to the area (adjacent area) among the plurality of areas. For example, the cooling area A1 of the fan 11 is an area obtained by combining the first area 20 and the second area 30. FIG. 1 illustrates the cooling area A1. The cooling area of the fan 12 is an area obtained by combining the first area 20, the second area 30, and the third area 40. The cooling area of the fan 13 is an area in which the second area 30 and the third area 40 are combined.

  However, the cooling area for each of the fans 11, 12, and 13 may be the entirety of the plurality of areas (that is, the area combining the first area 20, the second area 30, and the third area 40). On the other hand, regarding the fan 11, the contribution of the cooling to the third area 40 is smaller than the contribution of the cooling to the first area 20 and the second area 30. Therefore, as described above, the third area 40 in which the contribution of cooling by the fan 11 is estimated to be relatively small may be excluded from the cooling area of the fan 11. Further, regarding the fan 13, since the contribution of cooling to the first area 20 is smaller than the contribution of cooling to the second area 30 and the third area 40, the first area 20 is It may be excluded from the cooling area.

For example, the processing unit 18 evaluates the first cooling effect and the second cooling effect for each of the fans 11, 12, and 13 (step S1).
For example, it is assumed that the wind direction of each fan can be changed in three stages: front (S), right (R), and left (L). The right direction (R) is a direction inclined 45 degrees from the front direction to the minus direction of the Y axis. The left direction (L) is a direction inclined 45 degrees from the front direction to the plus direction of the Y axis. When a fan is facing front, directing the fan to another area means changing the direction of the fan to right or left. In addition, when a certain fan is facing right, directing the fan to another area means changing the direction of the fan to front or left. Furthermore, when a fan is facing left, directing the fan to another area means changing the direction of the fan to the front or right.

  The cooling effect C (S) when a certain fan is directed in the front direction is expressed by Expression (1).

Here, a indicates an area belonging to the cooling area of the corresponding fan (in the example of FIG. 1, the first area 20, the second area 30, or the third area 40). A is an entire set of areas belonging to the cooling area of the fan. Ha is the calorific value in the area a. The processing unit 18 calculates Ha based on the maximum heat value H of the component mounted in the area a and the load f (the ratio of the current load to the allowable maximum load). For example, Ha = H × f. When a plurality of components can be mounted in the area a, the processing unit 18 may correct Ha based on the mounting rate r of the components in the area a (for example, Ha may be set to H = f × r). . Ca (S) is a ventilation air flow q (S) (m) determined by a fan wind direction (in this case, a front direction) and a rotation speed with respect to a required ventilation air flow Q (m ³ / min) proportional to a heat generation amount Ha of the area a. ³ / min) (Ca (S) = q (S) / Q).

  The cooling effect C (R) when a certain fan is turned rightward is expressed by Expression (2).

Ca (R) is a ventilation air volume q (R) (m) determined by a fan air direction (in this case, rightward direction) and a rotation speed with respect to a required ventilation air volume Q (m ³ / min) which is proportional to the heat generation amount Ha of the area a. ³ / min) (Ca (R) = q (R) / Q).

  Further, the cooling effect C (L) when a certain fan is directed leftward is expressed by Expression (3).

Ca (L) is a ventilation air volume q (L) (m) determined by a fan air direction (in this case, leftward direction) and a rotation speed with respect to a required ventilation air volume Q (m ³ / min) proportional to the heat generation amount Ha of the area a. ³ / min) (Ca (L) = q (L) / Q).

  However, the first area 20 has no adjacent area in the plus Y direction. For this reason, the processing unit 18 does not need to evaluate the cooling effect C (L) for the fan 11. The third area 40 has no adjacent area in the minus Y direction. For this reason, the processing unit 18 does not need to evaluate the cooling effect C (R) for the fan 13.

  As described above, the processing unit 18 calculates the calorific value of the area in which the component is mounted from the calorific value of the component, and corrects the calorific value of the area based on the load of the component mounted in the area. Then, the processing unit 18 evaluates the first cooling effect and the second cooling effect based on the corrected heat value of the area. Further, the processing unit 18 may further correct Ha based on the component mounting ratio r of the area a. As a result, the calorific value for each area can be appropriately calculated, and the accuracy of the evaluation of the cooling effect can be improved.

  As described above, the first cooling effect and the second cooling effect are the amounts of heat taken by the refrigerant sent from the fans in a group of areas (cooling areas) corresponding to the fans. The processing unit 18 calculates the calorific value based on the corrected calorific value for each area.

  FIG. 1 shows the evaluation of the cooling effect of the fan 11 as an example. The first cooling effect for the fan 11 is referred to as a cooling effect C1. The processing unit 18 obtains the cooling effect C1 (= C (S)) using Expression (1). The second cooling effect for the fan 11 is referred to as a cooling effect C2. The processing unit 18 obtains the cooling effect C2 (= C (R)) using Expression (2).

  The processing unit 18 similarly obtains a first cooling effect (C (S)) and a second cooling effect for the fan 12. Here, the processing unit 18 obtains both C (R) and C (L) as the second cooling effect for the fan 12. Further, the processing unit 18 obtains a first cooling effect (C (S)) and a second cooling effect (C (L)) for the fan 13.

  The processing unit 18 selects a first fan whose second cooling effect is higher than the first cooling effect (Step S2). For example, the processing unit 18 determines that the cooling effect C2 obtained for the fan 11 is higher than the cooling effect C1. Then, the processing unit 18 selects the fan 11 as a first fan.

  The processing unit 18 directs the first fan to another area, and lowers the rotation speed of the second fan directed to the other area among the plurality of fans (step S3). For example, another area for the fan 11 is a second area 30 further adjacent to the first area 20 adjacent to the fan. The processing unit 18 directs the fan 11 to the second area 30 by changing the wind direction by the fan 11 to the right (R).

  Then, the processing unit 18 decreases the rotation speed of the fan 12 (second fan) directed to the second area 30. For example, the processing unit 18 monitors the temperature measured by the temperature sensor of the component 15 mounted on the second area 30, and when the temperature of the component 15 is lower than a predetermined temperature, the airflow of the second area 30. May be determined to be excessive, and the rotation speed of the fan 12 may be reduced in accordance with the determination.

  According to the electronic device 10, the plurality of areas in the housing are cooled by the plurality of fans arranged in a line. Component information indicating a component mounted on each of the plurality of areas and a heat value of the component, and load information indicating a load of the component are acquired. Based on the component information and the load information, the first cooling effect of the fan in the current direction and the second cooling effect of the fan when the fan is directed to another area different from the area to which the fan is directed are determined. It is evaluated for each fan. A first fan having a second cooling effect higher than the first cooling effect is selected. The first fan is directed to another area, and the rotation speed of the second fan directed to another area among the plurality of fans is reduced.

Thereby, power consumption for cooling can be reduced.
For example, a method is conceivable in which a predetermined cooling performance is realized as a whole of a plurality of fans by changing the wind direction of the fans while keeping the rotation speed of each fan uniform. However, according to this method, there is a possibility that the power consumption for cooling by each fan cannot be sufficiently reduced depending on the load imbalance of the electronic components in the housing.

  In the example in which the fans 11, 12, and 13 of FIG. 1 face front, the second area 30 has a relatively high load, and the first area 20 and the third area 40 have a relatively low load. Consider a case where the difference between the load in the high load area and the load in the low load area is large. In this case, if the rotation speeds of the fans 11, 12, and 13 are uniformly set so that the second area 30 having a high load can be sufficiently cooled, the first area 20 and the third area 40 having a low load can be cooled. The number of rotations of the fans 11 and 13 that mainly cool the cooling device may be excessive. For this reason, electric power may be excessively consumed by the fans 11, 12, and 13.

  It is also conceivable to set both the rotation speeds of the fans 11, 12, and 13 uniformly, and then direct both or one of the fans 11 and 13 to the second area 30 where the load is high. In this case, the second area 30 may be excessively cooled, and power may be excessively consumed by the fans 11, 12, and 13.

  Therefore, as illustrated, the electronic device 10 individually controls the rotation speeds of the fans 11, 12, and 13 to increase the cooling effect by directing the fan 11 to another area different from the current area. To direct the fan to the other area. At this time, the electronic device 10 can appropriately evaluate the cooling effect of each fan by using the heat generation amount according to the component mounting status and the component load in each area to evaluate the cooling effect of each fan. It is possible to appropriately select the fan 11 whose wind direction is to be changed.

  For example, by directing the fan 11 toward the second area 30, the air flow from the fan 11 to the second area 30 increases, and the total air flow flowing into the second area 30 increases. Then, the air volume in the second area 30 becomes excessive. For this reason, the processing unit 18 can reduce the rotation speed of the fan 12. Thus, the electronic device 10 can reduce the power consumption of the fans 11, 12, and 13 as a whole.

  That is, the electronic device 10 does not need to uniformly increase the rotation speeds of the fans 11, 12, and 13 in accordance with the cooling of the second area 30, which has a high load, and can suppress overcooling of the low-load area. In addition, the electronic device 10 directs the plurality of fans to the second area 30 so that when the second area 30 is excessively cooled, the rotation speed of the fan 12 directed to the second area 30 is increased. , The supercooling of the second area 30 can be suppressed. The electronic device 10 can reduce power consumption by each fan by suppressing overcooling of each area.

  Although FIG. 1 shows a configuration example in which a cooling area exists on the exhaust side of the fans 11, 12, and 13, other configurations may be used. For example, a cooling area may exist on the intake side of the fans 11, 12, and 13 (in this case, for example, the directions of the fans 11, 12, and 13 are changed by changing the angle of the fin on the intake side of the fans 11, 12, and 13). May be changed). Alternatively, cooling areas may be present on both the exhaust side and the intake side of the fans 11, 12, and 13.

  Further, the example in which the wind direction by the fan is changed in three stages has been described, but the wind direction may be changed in two stages or four or more stages. In the case where the change can be made in four or more steps, "pointing the fan to another area" corresponds to "changing the direction of the fan to a direction different from the current direction". In this case, it is possible to reduce the rotation speed of the fan that blows air to the blow destination area of the fan whose direction has been changed.

  Further, the processing unit 18 evaluates the first cooling effect and the second cooling effect for each of the plurality of fans when detecting a change in component configuration or a change in component load in the housing of the electronic device 10, for example. And selecting the first fan according to the evaluation. Accordingly, appropriate cooling can be performed following changes in the heat generation state in the housing.

  Further, as the electronic device 10, various devices capable of mounting a plurality of fans can be considered. For example, the electronic device 10 is an HPC (High Performance Computing) computer, a blade server on which a plurality of blades are mounted, a chassis-type switch, a storage device, or the like. Hereinafter, the function of the cooling control will be described in more detail by exemplifying a storage device as the electronic device 10.

[Second embodiment]
Next, a second embodiment will be described.
FIG. 2 illustrates a storage device according to the second embodiment.

  The storage device 100 can mount a plurality of storage devices (called drives) such as a hard disk drive (HDD) and a solid state drive (SSD), and provide a large-capacity storage area. The storage device 100 includes controller modules (CMs) 110 and 130, a fan unit 150, a drive unit 170, and an outside air temperature sensor 190.

  The CMs 110 and 130 are storage control devices that receive data access from a server computer (not shown) or the like and access data stored in the drive unit 170. The CMs 110 and 130 perform access control for writing and reading data to and from a drive housed in the drive unit 170. The CMs 110 and 130 are assigned identification numbers. The identification number of the CM 110 is “# 0”. The CM 110 may be described as “CM # 0”. The identification number of the CM 130 is “# 1”. The CM 130 may be described as “CM # 1”.

  The fan unit 150 is a mounting unit for a plurality of fans arranged in a line. The plurality of fans include fans 151, 152, 153,... The plurality of fans cool the inside of the housing of the storage device 100 by air cooling. Each of the plurality of fans can individually control the wind direction and the rotation speed. The wind direction and rotation speed of each fan are controlled by the CMs 110 and 130. For example, the wind direction of the fan can be changed to a plurality of predetermined directions. Further, for example, the rotation speed of the fan can be changed to a predetermined number of rotation speeds.

  The drive unit 170 is a mounting unit on which a plurality of drives can be mounted. The plurality of drives include drives 171, 172, 173,... The drives 171, 172, 173,... Are, for example, HDDs. However, the drives 171, 172, 173,... May be SSDs or a combination of HDDs and SSDs. The drive section 170 has a plurality of slots for mounting drives. Drives can be attached to and removed from each slot depending on the operation.

  The outside air temperature sensor 190 is a temperature sensor that measures the temperature around the storage device 100 (outside air temperature). The outside air temperature measured by the outside air temperature sensor 190 is provided to the CMs 110 and 130.

FIG. 3 is a block diagram illustrating an example of hardware of a CM.
The CM 110 includes a CPU 111, a RAM 112, an SSD 113, a CA (Channel Adapter) 114, a NA (Network Adapter) 115, a medium reader 116, a CPU temperature sensor 117, a monitoring unit 118, a DI (Drive Interface) 119, and a CM-IF (InterFace) 120. Having. The CM 130 is also realized by the same hardware as the CM 110.

  The CPU 111 is a processor that executes instructions of a program. The CPU 111 loads at least a part of the programs and data stored in the HDD 103 into the RAM 112 and executes the programs. Note that the CPU 111 may include a plurality of processor cores. Further, the CM 110 may include a plurality of processors. Also, a set of a plurality of processors may be referred to as a “multiprocessor” or simply as a “processor”.

  The RAM 112 is a main storage device of the CM 110. The RAM 112 is a volatile semiconductor memory that temporarily stores programs executed by the CPU 111 and data used by the CPU 111 for calculations. Note that the CM 110 may include a memory of a type other than the RAM, or may include a plurality of memories.

  The SSD 113 is an auxiliary storage device of the CM 110. The SSD 113 is a nonvolatile semiconductor memory, and stores programs including firmware of the CM 110, various data, and the like.

  The CA 114 is a communication interface that is connected to a SAN (Storage Area Network) 101 and communicates with a server computer via the SAN 101. As the CA 114, for example, an FC (Fibre Channel) interface can be used. The CM 110 may include a plurality of CAs 114.

  The NA 115 is a communication interface connected to a LAN (Local Area Network) 102 and performing communication with a server computer via the LAN 102. As the NA 115, for example, an Ethernet (registered trademark) interface can be used.

  The medium reader 116 is a device that reads programs and data stored in the recording medium 103. As the recording medium 103, for example, a nonvolatile semiconductor memory such as a flash memory card can be used. The medium reader 116 can also store programs and data read from the recording medium 103 in a storage device such as the RAM 112 and the SSD 113 in accordance with, for example, an instruction from the CPU 111.

The CPU temperature sensor 117 is a temperature sensor that measures the temperature of the CPU 111.
The monitoring unit 118 is a processor that controls the operation of each fan in the fan unit 150 according to the operation of the storage device 100. The monitoring unit 118 may be realized by a CPU, a DSP, an ASIC, an FPGA, or the like. The monitoring unit 118 monitors the temperature measured by the outside air temperature sensor 190 and the CPU temperature sensor 117, and controls the operation of each fan in the fan unit 150 according to the monitoring of the temperature. Further, the monitoring unit 118 monitors the mounting status and load of each electronic component in the CM 110, and controls the operation of each fan in the fan unit 150 according to the monitoring of the mounting status and load of the electronic component.

  The monitoring unit 118 has a memory 118a. The memory 118a stores various kinds of information used for controlling the fan by the monitoring unit 118. The memory 118a may include a volatile memory and a non-volatile memory. The monitoring unit 118 is an example of the processing unit 18 according to the first embodiment. The memory 118a is an example of the storage unit 17 according to the first embodiment.

  However, the function of the monitoring unit 118 may be realized by the CPU 111 executing a program stored in the RAM 112. In this case, the CPU 111 can be considered as an example of the processing unit 18 according to the first embodiment. Further, the RAM 112 or the SSD 113 can be considered as an example of the storage unit 17 of the first embodiment.

  The monitoring unit 118 controls the fan in cooperation with the monitoring unit of the CM 130. For example, the monitoring unit 118 may be a master and the monitoring unit of the CM 130 may be a slave, and the monitoring unit 118 may control the control of each fan.

  The DI 119 is an interface connected to the drive unit 170. For example, as the DI 119, an interface such as SAS (Serial Attached SCSI) (SCSI is an abbreviation for Small Computer System Interface) can be used.

  The CM-IF 120 is an interface for connecting to the CM 130. The CM 130 can perform data access in cooperation with the CM 130 using the CM-IF 120. For example, the CM 110 may be the active system, and the CM 130 may be the standby system. Alternatively, data access may be performed in a distributed manner by using both the CMs 110 and 130 as the active system. In either case, when one of the failures occurs, the other can take over the data access, thereby preventing the user's business from being stopped.

FIG. 4 is a diagram illustrating a configuration example of a storage device.
FIG. 4A is a plan view of the storage device 100. FIG. FIG. 4B is a side view of the storage device 100.

  On the front side of the storage device 100, a drive unit 170 is arranged. On the back side of the storage device 100, CMs 110 and 130 and a power supply unit 104 (not shown in FIGS. 2 and 3) are arranged. The CM 130 is arranged above the power supply unit 104. The fan unit 150 is arranged between the drive unit 170 and the CMs 110 and 130. The fan unit 150 is mainly used for cooling the CMs 110 and 130 and the drive unit 170. The power supply unit 104 includes an individual fan in addition to the fan unit 150, and is cooled by the fan. In this example, it is assumed that the power supply unit 104 is not a target of cooling by the fan unit 150 (however, the power supply unit 104 may be a target of cooling of the fan unit 150).

  Here, an axis representing the depth of the storage device 100 is defined as an X axis. The positive direction of the X axis is a direction from the front side to the rear side of the storage device 100 along the X axis. The plurality of drives included in the drive unit 170, the plurality of fans included in the fan unit 150, and the CMs 110 and 130 are arranged in a line in the width direction of the storage device 100. The axis representing the width of the storage device 100 is the Y axis. An identification number is assigned to each drive, each fan, and the CMs 110 and 130. The positive direction of the Y axis is the descending direction of the identification number. The drives of the drive unit 170 are arranged in a line in the Y-axis direction. The fans of the fan unit 150 are arranged in a line in the Y-axis direction. The CMs 110 and 130 are arranged side by side in the Y-axis direction. Further, an axis indicating the height of the storage device 100 is defined as a Z axis. The positive direction of the Z axis is a direction from the lower side to the higher side along the Z axis.

  For example, the drive unit 170 has 24 drives. Each drive is identified by an identification number of “# 00” to “# 23”. The fan section 150 has ten fans. Each fan is identified by an identification number of “# 0” to “# 9”. The side view in FIG. 4B shows an example in which the storage device 100 is viewed from the drive # 23, the fan # 9, and the CM 130.

  Inside the CM 110, hardware (electronic components) such as the CPU 111, the RAM 112, the SSD 113, and various communication interfaces illustrated in FIG. 3 are arranged. Similarly, inside the CM 130, hardware (electronic components) such as a CPU, a RAM, an SSD, and various interfaces constituting the CM 130 are arranged.

FIG. 5 is a diagram illustrating an example of the flow of air in the housing of the storage device.
The fans # 0 to # 9 take in air from the front side of the storage device 100 and exhaust air to the back side of the storage device 100. The housing of the storage device 100 has an inlet on the front side and an outlet on the back side. Except for the intake port and the exhaust port of the storage device 100, the case is covered. For this reason, the flow of air due to the ventilation of the fans # 0 to # 9 is in the direction (+ X direction) from the front side to the back side of the storage device 100. The directions of the fans # 0 to # 9 are initially in the + X direction. The + X direction is the front direction of fans # 0 to # 9.

FIG. 6 is a diagram illustrating an example of a cooling area for a fan.
The entire space to be cooled by the fan unit 150 in the housing of the storage device 100 (that is, the space occupied by the drive unit 170 and the CMs 110 and 130) is divided into a plurality of subspaces having the same width in the width direction. . The subspace is referred to as a “divided area”. For example, the monitoring unit 118 divides the width (the length in the Y direction) of the entire space to be cooled by the fan unit 150 into ten for the number of ten fans, and Each divided area is managed by distinguishing it from the exhaust side (the CMs 110 and 130 side). Each divided area is adjacent to one of the fans.

  The intake-side divided area is identified by an identifier of “# N-0” (N is an integer of 0 to 9). The "0" at the end of "# N-0" indicates that it is on the intake side. The exhaust-side divided area is identified by an identifier of “# N−1”. "1" at the end of "# N-1" indicates that it is on the exhaust side. “N” is assigned in descending order toward the positive direction of the Y axis.

  The monitoring unit 118 sets a combination of divided areas for one fan as a cooling area of the fan. Specifically, an area obtained by combining an intake-side divided area adjacent to a certain fan and another divided area adjacent to the divided area is defined as an intake-side cooling area. The combined area of the exhaust-side divided area adjacent to the fan and another divided area adjacent to the divided area is defined as an exhaust-side cooling area. Then, the combined area of the intake side cooling area and the exhaust side cooling area is set as the cooling area of the fan.

  FIG. 6 illustrates a cooling area for the fan 152 (the fan with the identification number “# 1”). The fan 152 is arranged between the intake side divided area # 1-0 and the exhaust side divided area # 1-1. It can be said that the fan 152 is adjacent to the divided area # 1-0 and the divided area # 1-1. The intake-side cooling area 201 for the fan 152 is an area obtained by combining the divided areas # 0-0, # 1-0, and # 2-0. The exhaust-side cooling area 202 for the fan 152 is an area obtained by combining the divided area # 0-1, the divided area # 1-1, and the divided area # 2-1. An area in which the intake-side cooling area 201 and the exhaust-side cooling area 202 are combined (an area in which six divided areas are combined) is a cooling area of the fan 152.

  The cooling areas of the other fans are determined in the same manner as the fan 152. However, since the fan # 0 has no divided area on the + Y direction side with respect to the fan # 0, the area obtained by combining the four divided areas, two each on the intake side and the exhaust side, is the fan # 0. Cooling area. Further, since the fan # 9 has no divided area on the −Y direction side with respect to the fan # 9, the area obtained by combining the four divided areas, two each on the intake side and the exhaust side, is the fan # 9. 9 cooling areas.

  In this example, a case is shown in which a cooling area is formed by combining divided areas adjacent to one fan area. However, a cooling area may be formed by combining divided areas adjacent to two fan areas. For example, it is conceivable that two fans are collectively controlled as a first set of fans # 0 and # 1 and a second set of fans # 2 and # 3. In this case, for example, an area obtained by combining a total of eight divided areas # 0-0 to # 3-0 and divided areas # 0-1 to # 3-1 adjacent to the first set of fans is defined as This is the cooling area for the first set. Similarly, an area obtained by combining a total of twelve divided areas # 0-0 to # 5-0 and divided areas # 0-1 to # 5-1 adjacent to the second set of fans is defined as the second area. Is a cooling area for the set of. In this manner, a plurality of fans can be collectively regarded as one fan, and control similar to the method described below can be performed.

FIG. 7 is a diagram illustrating an example of a relationship between a wind direction and a fan direction.
The monitoring unit 118 changes the direction of the fan 152 by changing the angle of the fin 152a included in the fan 152. The fin 152a has a rotation axis in the Z-axis direction and is rotatable around the Z-axis. The direction of the fan 152 determines the wind direction of the fan 152. When the fan 152 faces the front (that is, the + X direction), the angle of the fin 152a is 0 degree. The wind direction 210 when the fan 152 faces the front is directed in the + X direction along the X axis. The front direction of the fan 152 is represented by the letter “S”.

  When the fan 152 is facing right with respect to the front, the rotation angle of the fin 152a is represented by -θ using the sign of-. Here, θ is 0 degree <θ <90 degrees. The wind direction 211 when the fan 152 is facing right is a direction rotated by −θ with respect to the wind direction 210. The rightward direction of the fan 152 is represented by the letter “R”.

  When the fan 152 is facing left with respect to the front, the rotation angle of the fin 152a is represented by + θ using a + sign. The wind direction 212 when the fan 152 is facing left is a direction rotated by + θ with respect to the wind direction 210. The leftward direction of the fan 152 is represented by the letter “L”.

  Here, as an example, it is assumed that the direction of the fan 152 can be set in three stages: frontward (S), rightward (R), and leftward (L). When the fan 152 is facing right, the rotation angle of the fin 152a is assumed to be −θ = −45 degrees. When the fan 152 is facing left, the rotation angle of the fin 152a is + θ = + 45 degrees.

FIG. 8 is a diagram illustrating an example of the component management table.
The component management table 121 is component information for managing the components arranged in the divided area and the maximum heat generation per unit time of the components. The parts management table 121 is stored in the memory 118a. The component management table 121 includes items of a divided area, a mounted component name, a component mounting rate, and a maximum heat generation amount at the time of all mounting.

  In the item of the divided area, an identifier of the divided area is registered. In the item of the mounted component name, a component name or component identification information mounted in the corresponding divided area is registered. In the item of the component mounting ratio, the mounting ratio of the component in the corresponding divided area is registered. The item of the maximum heat value at full mounting includes the maximum heat value per unit time of all components existing in the divided area when the component mounting rate in the corresponding divided area is 100% (the maximum heat value per unit time). (The sum of the maximum heat generation of each component). The unit of calorific value (calorific value) per unit time is watt (W). Hereinafter, when the amount of heat (calorific value) is simply referred to, it indicates the calorific value (calorific value) per unit time.

  Here, the component mounting rate is mainly used for the drive unit 170. The maximum number of drives mounted for each divided area on the intake side is determined in advance, for example, by the width of the divided area (length in the Y-axis direction) and the width of the drive (length in the Y-axis direction). The maximum number of drives mounted in the divided area is represented by a positive real number. In the drive unit 170, there may be a place where a drive is not mounted according to operation. For this reason, the monitoring unit 118 changes the component mounting ratio of the divided area on the intake side according to the presence or absence of the drive.

  On the other hand, in this example, it may be considered that both the CMs 110 and 130 are mounted and operated, and the electronic components inside the CMs 110 and 130 are not individually removed or attached. For this reason, the component mounting rate of the divided area on the exhaust side may be considered to be 100%. However, if the mounting state of the exhaust-side electronic components can change, such as when the RAM 112 or the like is removed or added, the monitoring unit 118 changes the component mounting rate of the exhaust-side divided area according to the change in the mounting state. May be changed.

  For example, in the component management table 121, a record in which the divided area is “# 0-0”, the mounted component name is “HDD”, the component mounting rate is “100%”, and the maximum heat generation amount during all mounting is “Q1” is registered. Is done. In this record, the HDD is mounted as a drive in the divided area # 0-0, the current component mounting rate is 100%, and when all the electronic components (HDD) are mounted in the divided area # 0-0 (component mounting). At the rate of 100%) is Q1 (W).

  Further, in the component management table 121, a record in which the divided area is “# 7-0”, the mounted component name is “HDD”, the component mounting rate is “80%”, and the maximum heat generation amount in all mounting is “Q2” is registered. Is done. In this record, the HDD is mounted as a drive in the divided area # 7-0, the current component mounting rate is 80%, and the maximum heat generation when all the electronic components (HDDs) are mounted in the divided area # 7-0. Indicates that the quantity is Q2 (W).

  Further, in the component management table 121, a record is registered in which the divided area is “# 8-0”, the mounted component name is “HDD”, the component mounting rate is “0%”, and the maximum heat generation during all mounting is “Q3”. You. In this record, the HDD is mounted as a drive in the divided area # 8-0, the current component mounting rate is 0%, and the maximum heat generation when all the electronic components (HDDs) are mounted in the divided area # 8-0. Indicates that the quantity is Q3 (W).

  In the component management table 121, the divided area is “# 0-1”, the mounted component name is “RAM,. Is registered. In this record, the electronic components such as the RAM 112 are mounted in the divided area # 0-1, the current component mounting rate is 100%, and the maximum heat value when all the electronic components are mounted in the divided area # 1-0. Is Q4 (W).

  Further, in the component management table 121, the divided area is “# 2-1”, the mounted component name is “CPU,...”, The component mounting rate is “100%”, and the maximum heat generation amount at full mounting is “Q5”. Is registered. This record indicates that the electronic components such as the CPU 111 are mounted in the divided area # 2-1, the current component mounting rate is 100%, and the maximum heat generation when all the electronic components are mounted in the divided area # 2-1. Is Q5 (W).

In the component management table 121, similarly, for the divided areas other than the exemplified ones, records indicating the mounted component name, the component mounting rate, and the maximum heat generation at all mounting times are registered.
Note that the monitoring unit 118 acquires information on the mounted component name, the component mounting ratio, and the maximum heat generation amount at full mounting from the monitoring unit of the CM 130 in the divided area in the CM 130, and registers the information in the component management table 121.

FIG. 9 is a diagram illustrating an example of the load management table.
The load management table 122 is load information for managing the current load of the components arranged in the divided area. The load management table 122 is stored in the memory 118a. The load management table 122 includes items of a divided area and a load factor.

  In the item of the divided area, an identifier of the divided area is registered. In the item of the load factor, an average value of the current load factor of each component arranged in the divided area is registered. Here, the load factor of the electronic component is, for example, a ratio of the current calculation execution amount per unit time to the maximum calculation execution amount per unit time in the case of a calculation electronic component such as the CPU 111. In the case of an electronic component such as a drive, a memory, and an interface, for example, it is represented by the ratio of the current access frequency to the maximum allowable access frequency from the CPU 111 or the like.

  For example, a record in which the divided area is “# 0-0” and the load factor is “75%” is registered in the load management table 122. This record indicates that the average of the load factors of the electronic components (HDDs) arranged in the divided area # 0-0 is 75%.

  In the load management table 122, a record in which the divided area is “# 2-1” and the load factor is “10%” is registered. This record indicates that the average of the load factors of the electronic components (such as the CPU 111) arranged in the divided area # 2-1 is 10%.

  Further, in the load management table 122, a record in which the divided area is “# 7-1” and the load ratio is “100%” is registered. This record indicates that the average of the load factors of the electronic components arranged in the divided area # 7-1 is 100%.

In the load management table 122, similarly, a record indicating the load factor is registered for the divided areas other than the exemplified areas.
The monitoring unit 118 collects the load of each electronic component, and determines which divided area each electronic component belongs to by using the component management table 121. Then, the monitoring unit 118 updates the load management table 122 by calculating the average of the load factors of the electronic components belonging to each divided area. The monitoring unit 118 acquires the load factor in the divided area in the CM 130 from the monitoring unit of the CM 130 and registers the load factor in the component management table 121.

FIG. 10 is a diagram illustrating an example of the cooling effect management table.
The cooling effect management table 123 is information for managing the cooling effect for each fan evaluated by the monitoring unit 118. The cooling effect management table 123 is stored in the memory 118a. The cooling effect management table 123 includes items of a fan, a cooling effect C (S), a cooling effect C (R), and a cooling effect C (L).

  In the item of fan, a fan identification number is registered. In the item of cooling effect C (S), a cooling effect when the corresponding fan is facing front is registered. In the item of cooling effect C (R), a cooling effect when the corresponding fan is facing right is registered. In the item of cooling effect C (L), a cooling effect when the corresponding fan is facing left is registered. The unit of the cooling effect is watts (W).

  Here, the cooling effect C (S) is represented by the above-described equation (1). Further, the cooling effect C (R) is represented by Expression (2). The cooling effect C (L) is represented by Expression (3). In the second embodiment, a in each expression indicates a divided area belonging to the cooling area of the corresponding fan. A in each equation is the entire set of divided areas belonging to the cooling area of the corresponding fan.

  Further, Ha in each formula is obtained from the component management table 121 and the load management table 122 as Ha = (maximum heat generation at full mounting) × (load ratio) × (component mounting ratio). For example, the cooling effects C (S), C (R), and C (L) for the fan 152 are the sum of the cooling effects of the fan 152 for each divided area belonging to the cooling area of the fan 152, and are expressed by the following equation (4). To (6) (the content substituted for a is indicated by the symbol “<>”).

C (S) = H <Area # 0-0> × C <Area # 0-0> (S) +... + H <Area # 2-1> × C <Area # 2-1> (S) ·・ ・ (4)
C (R) = H <Area # 0-0> .times.C <Area # 0-0> (R) +... + H <Area # 2-1> .times.C <Area # 2-1> (R).・ ・ (5)
C (L) = H <Area # 0-0> × C <Area # 0-0> (L) +... + H <Area # 2-1> × C <Area # 2-1> (L) ·・ ・ (6)
As described above, Ca (S), Ca (R), and Ca (L) are the wind direction and rotation speed of the corresponding fan with respect to the required ventilation airflow Q (m ³ / min) of each divided area in proportion to the heat generation value Ha. Is the ratio of the ventilation air volumes q (S), q (R) and q (L) determined by Ca (S), Ca (R) and Ca (L) are represented by the following equations (7) to (9).

Ca (S) = q (S) / Q (7)
Ca (R) = q (R) / Q (8)
Ca (L) = q (L) / Q (9)
Information indicating the required ventilation air volume Q = Q (Ha) of each divided area and the ventilation air volume q (S), q (R), q (L) of each divided area according to the wind direction of the fan is stored in the memory 118a in advance. Is done.

  For example, in the cooling effect management table 123, the fan is “# 0”, the cooling effect C (S) is “a”, the cooling effect C (R) is “b”, and the cooling effect C (L) is “c”. Record is registered. This record indicates that the cooling effect when the fan # 0 is facing the front is a (W), the cooling effect when the fan # 0 is facing right is b (W), and the cooling effect when the fan # 0 is facing left is c (W). It indicates that. Similarly, cooling effects C (S), C (R), and C (L) are registered in the cooling effect management table 123 for other fans.

FIG. 11 is a diagram illustrating an example (part 1) of the wind direction control.
As described above, the CM 130 has the same hardware as the CM 110. FIG. 11 illustrates the CPU 131, the CPU temperature sensor 137, and the monitoring unit 138 included in the CM 130. The CPU 131 is an arithmetic unit of the CM 130. The CPU temperature sensor 137 is a sensor that measures the temperature of the CPU 131. In the figure, the CPU 111 is described as “CPU # 0” and the CPU 131 is described as “CPU # 1”. The monitoring unit 138 monitors the temperature measured by the CPU temperature sensor 137 and the outside air temperature sensor 190, and the load of the CPU 131. The monitoring unit 138 provides the load of the CPU temperature sensor 137 and the CPU 131 to the monitoring unit 118.

  The monitoring unit 118 monitors the temperature measured by the CPU temperature sensor 117 and the outside air temperature sensor 190, and the load of the CPU 111. Further, the monitoring unit 118 acquires the temperature measured by the CPU temperature sensor 137 and the load of the CPU 131 from the monitoring unit 138.

  The monitoring unit 118 determines the directions and the rotation speeds of the fans # 0 to # 9 based on the collected information. The monitoring unit 118 changes the direction and the number of rotations of the fans # 0 to # 4. Further, the monitoring unit 118 instructs the monitoring unit 138 to change the directions and the rotation speeds of the fans # 5 to # 9. The monitoring unit 138 receives an instruction from the monitoring unit 118, and changes the directions and rotation speeds of the fans # 5 to # 9 according to the instruction.

  Although the example in which the fans to be controlled are shared by the monitoring units 118 and 138 has been described, the monitoring unit 118 may control the directions of the fans # 0 to # 9. For example, when the CM 110 goes down, the monitoring unit 138 may control the fans # 0 to # 9 instead of the monitoring unit 118.

  As a first example of the wind direction control, consider a case where the drives # 21 to # 23 are not mounted and the fans # 0 to # 9 face front. In this case, for example, among the cooling areas of the fans # 8 and # 9, the heat generation amount of the intake side divided area adjacent to the fans # 8 and # 9 is lower than the other divided areas of the cooling area. Then, according to the expressions (1) to (3), the cooling effect of the fan # 8 is improved when the direction of the fan # 8 is set to the left rather than to the front (+ X direction). According to the expressions (1) to (3), the cooling effect of the fan # 9 is improved when the direction of the fan # 9 is set to the left rather than to the front.

  Therefore, the monitoring unit 118 instructs the monitoring unit 138 to change the direction of the fans # 8 and # 9 from the front to the left. In response to the instruction, the monitoring unit 138 instructs the fans # 8 and 9 to change the directions of the fans # 8 and # 9 from the front to the left. The fans # 8 and # 9 change from the front to the left according to the instruction. Then, the air flow to the cooling area of other fans # 0 to # 7 (especially, fans # 5 to # 7) increases. For this reason, the monitoring units 118 and 138 can reduce the rotation speeds of the other fans. The monitoring units 118 and 138 feedback-control the rotation speed of the fan based on the temperatures measured by the CPU temperature sensors 117 and 137 so that the temperatures fall within a specified temperature range.

FIG. 12 is a diagram illustrating an example (part 2) of the wind direction control.
As a second example of wind direction control, a case where drives # 0 to # 23 are mounted, fans # 0 to # 9 face front, the load on CPU 111 is 10%, and the load on CPU 131 is 100% think of. In this case, for example, of the cooling areas of the fans # 3 and # 4, the heat generation amount of the divided area closer to the CPU 131 is higher than the other divided areas of the cooling area. Then, according to the expressions (1) to (3), the cooling effect of the fan # 3 is improved when the direction of the fan # 3 is set to the right rather than to the front (+ X direction). Further, according to the equations (1) to (3), the cooling effect of the fan # 4 is improved when the direction of the fan # 4 is rightward rather than frontward.

  For this reason, the monitoring unit 118 instructs the fans # 3 and # 4 to change the directions of the fans # 3 and # 4 from the front to the right. The fans # 3 and # 4 change the front direction to the right direction according to the instruction. Then, the airflow to the cooling areas of the other fans # 5 to # 9 increases. For this reason, the monitoring units 118 and 138 can reduce the rotation speeds of the other fans. The monitoring units 118 and 138 feedback-control the rotation speed of the fan based on the temperatures measured by the CPU temperature sensors 117 and 137 so that the temperatures fall within a specified temperature range.

Next, the procedure of the monitoring process by the monitoring unit 118 will be described.
FIG. 13 is a flowchart illustrating an example of the monitoring process.
When the storage device 100 is started, the monitoring units 118 and 138 execute the following procedure.

  (S10) The monitoring unit 118 acquires the device configuration of the storage device 100. Specifically, the monitoring unit 118 acquires the mounting status of the drive in the drive unit 170 and the mounting status of various electronic components in the CMs 110 and 130. The monitoring unit 118 registers the acquired device configuration in the component management table 121 in association with the divided area. Further, the monitoring unit 118 calculates the component mounting ratio of each divided area and registers the component mounting ratio in the component management table 121. As the maximum heat generation amount at the time of mounting all electronic components, information provided by a vendor of the electronic components is stored in the memory 118a in advance. Note that fans # 0 to # 9 are mounted in the fan unit 150 in advance. For example, in the initial stage (immediately after the storage device 100 is started), the fans # 0 to # 9 rotate at a predetermined predetermined rotation speed to blow air. Further, the monitoring unit 118 sets, for example, 100% as a load factor of each divided area in the load management table 122.

  (S11) The monitoring unit 118 acquires the outside air temperature measured by the outside air temperature sensor 190, and instructs each fan of the wind direction according to the device configuration based on the outside air temperature. As described above, when the control of the fan is performed by sharing with the monitoring unit 138 of the CM 130, the monitoring unit 118 may perform the control of some of the fans via the monitoring unit 138 (the same applies to the subsequent steps). ). The monitoring unit 118 calculates the cooling effects C (S), C (R), and C (L) for each fan using Expressions (1) to (3), and calculates the cooling effects C (S) and C (R). ), C (L), the fan is set in the direction corresponding to the maximum cooling effect. At this stage, the monitoring unit 118 calculates the cooling effects C (S), C (R), and C (L) for each fan based on the load management table 122, for example, with the load factor of each divided area being 100%. I do.

  (S12) The monitoring unit 118 determines whether there is a change in the device configuration. If there is a change in the device configuration, the process proceeds to step S13. If there is no change in the device configuration, the process proceeds to step S14. For example, the monitoring unit 118 periodically checks whether or not a drive has been added to or removed from the drive unit 170, and makes the determination in step S12.

  (S13) The monitoring unit 118 instructs each fan of the wind direction according to the device configuration. The monitoring unit 118 calculates the cooling effects C (S), C (R), and C (L) for each fan using Expressions (1) to (3), and calculates the cooling effects C (S) and C (R). ), C (L), the fan is set in the direction corresponding to the maximum cooling effect. At this stage, the monitoring unit 118 controls the cooling effects C (S), C (R), C (R) for each fan based on the load management table 122, for example, based on the load factor currently obtained for each divided area. L) is calculated. Then, the process proceeds to step S15.

(S14) The monitoring unit 118 maintains the current wind direction of each fan. Then, the process proceeds to step S15.
(S15) The monitoring unit 118 determines whether there is a change in the load state for the load ratio of each divided area. If there is a change in the load state, the process proceeds to step S16. If there is no change in the load state, the process proceeds to step S17. For example, the monitoring unit 118 periodically acquires the load of each electronic component, calculates a load factor for each divided area based on the component management table 121, and registers the load factor in the load management table 122. In the load management table 122, when there is a change in the load ratio within a predetermined width (for example, a load ratio difference of 20%) or more from the previous load ratio in at least one of the divided areas in the load management table 122, the load state changes. May be determined to exist. On the other hand, the monitoring unit 118 may determine that there is no change in the load state in any of the divided areas when there is no change in the load ratio by a predetermined width or more from the previous load ratio.

  (S16) The monitoring unit 118 instructs each fan of the wind direction according to the load state. The monitoring unit 118 calculates the cooling effects C (S), C (R), and C (L) for each fan using Expressions (1) to (3), and calculates the cooling effects C (S) and C (R). ), C (L), the fan is set in the direction corresponding to the maximum cooling effect. At this stage, the monitoring unit 118 determines the cooling effects C (S), C (R), C (R) for each fan based on the load management table 122, for example, based on the load factor currently obtained for each divided area. L) is calculated. Then, the process proceeds to step S18.

(S17) The monitoring unit 118 maintains the current wind direction of each fan. Then, the process proceeds to step S18.
(S18) The monitoring unit 118 determines whether the temperature (monitored temperature) measured by the CPU temperature sensor 117 or the CPU temperature sensor 137 is less than the first specified value. If the monitored temperature measured by the CPU temperature sensor 117 or the CPU temperature sensor 137 is lower than the first specified value, the process proceeds to step S19. If the monitored temperatures measured by the CPU temperature sensors 117 and 137 are equal to or higher than the first specified value, the process proceeds to step S20.

  (S19) The monitoring unit 118 specifies, from the component management table 121, the divided area to which the CPU temperature sensor whose monitored temperature is lower than the first specified value belongs. The monitoring unit 118 lowers the rotation speed of the fan including the divided area as a cooling area by one step. Alternatively, the monitoring unit 118 lowers the rotational speed of some of the fans including the divided area as the cooling area by one step. Here, as described above, the rotation speed of the fan can be changed to a predetermined number of stages of rotation speed. Then, the process proceeds to step S23. The monitoring unit 118 may lower the rotation speed of the fan whose wind direction has been changed from the front direction to another direction.

  (S20) The monitoring unit 118 determines whether or not the monitored temperature measured by the CPU temperature sensor 117 or the CPU temperature sensor 137 exceeds a second specified value (whether or not is larger than the second specified value). . Here, the second prescribed value is greater than the first prescribed value. If the monitored temperature measured by the CPU temperature sensor 117 or the CPU temperature sensor 137 exceeds the second specified value, the process proceeds to step S21. If the monitored temperatures measured by the CPU temperature sensor 117 and the CPU temperature sensor 137 are lower than or equal to the second specified value, the process proceeds to step S22.

  (S21) The monitoring unit 118 specifies, from the component management table 121, the divided area to which the CPU temperature sensor whose monitored temperature exceeds the second specified value belongs. The monitoring unit 118 increases the rotation speed of the fan including the divided area as a cooling area by one step. Alternatively, the monitoring unit 118 increases the rotation speed of some of the fans including the divided area as the cooling area by one level. Then, the process proceeds to step S23. The monitoring unit 118 may increase the rotation speed of the fan whose wind direction has been changed from the front direction to another direction.

(S22) The monitoring unit 118 maintains the current rotation speed of each fan. Then, the process proceeds to step S23.
(S23) The monitoring unit 118 determines whether an instruction to stop the storage device 100 has been received. When the device stop instruction is received, the monitoring process ends. If a device stop instruction has not been received, the process proceeds to step S12 after a predetermined time (time determined as a period for performing the monitoring process) has elapsed.

FIG. 14 is a diagram illustrating an example of power consumption for cooling.
Table 300 illustrates power consumption for cooling for two patterns. The first example is a comparative example, in which the wind direction control by the monitoring units 118 and 138 is not performed (that is, when all the fans are facing front). The second example is a case where the wind direction control is performed by the monitoring units 118 and 138 (that is, a case where the wind direction of some fans is changed from the front direction to another direction).

First, at a certain timing, consider a case where all of the fans # 0 to # 9 are operating in a frontal direction (a case where there is no wind direction control). In this case, the set air volume of fans # 0 to # 4 is 0.18 (m ³ / min), and the set air volume of fans # 5 to # 9 is 0.54 (m ³ / min). Further, the fans # 0 to # 9 have no wind direction control (that is, they are all facing the front). Here, when the set air volume of the fan is 0.18 (m ³ / min), the power consumption of the fan is normalized to 1.0. The power consumption of each of the fans # 0 to # 4 is 1.0. The power consumption of each of the fans # 5 to # 9 is 27.0. Therefore, in the first example, the total air volume of the fans # 0 to # 9 is 3.6 (m ³ / min), and the total power consumption of the fans # 0 to # 9 is 140. It is generally known that the power consumption of a fan is proportional to the cube of the air volume.

  Next, the case where the wind direction control is performed by the monitoring units 118 and 138 in the same situation as the comparative example will be considered. For example, the monitoring unit 118 tilts the directions of the fans # 3 and # 4 to −45 degrees, thereby turning them to the right. For the other fans # 0 to # 2 and fans # 5 to # 9, there is no wind direction control (that is, facing the front).

Then, since the monitoring temperature measured by the CPU temperature sensor 137 has become less than the first specified value, for example, the monitoring unit 118 lowers the rotation speed of the fans # 5 to # 9, and thereby the fans # 5 to # 9. Decrease the air volume. Specifically, the monitoring unit 118 reduces the air volume of the fans # 5 to # 9 from the above-described 0.54 (m ³ / min) to 0.47 (m ³ / min). By changing the directions of the fans # 3 and # 4, the monitored temperature measured by the CPU temperature sensor 137 may temporarily fall below the first specified value. The monitoring unit 118 continuously monitors the monitored temperature measured by the CPU temperature sensors 117 and 137.

  After that, the monitoring unit 118 increases the rotation speed of the fans # 3 and # 4 because the monitoring temperature measured by the CPU temperature sensor 137 has become higher than the second specified value without any change in the device configuration and the load state. As a result, the airflow of fans # 3 and # 4 is increased. In this way, the monitoring unit 118 performs feedback control of the rotation speed of the fan such that the monitored temperature measured by the CPU temperature sensor 137 falls within the range from the first specified value to the second specified value. .

  In addition, the monitoring unit 118 is configured to control any one of the fans # 3 and # 4 whose wind direction has been changed, or the fans # 5 to # 9 for cooling the divided area including the CPU temperature sensor 137 and the divided areas adjacent to the divided area. It is possible to select in any manner whether to increase the airflow of the fan.

  For example, the monitoring unit 118 increases the rotation speed (air volume) by one step in the order of fans # 3, # 4,..., And when the monitored temperature of the CPU temperature sensor 137 falls within the above range, May be completed. Further, a plurality of (for example, two) fans may be collectively set as one rotation speed adjustment target. For example, the monitoring unit 118 sequentially increases the rotation speed by one stage for each fan set, such as a set of fans # 3 and # 4, a set of fans # 5 and # 6,. Adjustment of the rotation speed of the fan may be completed when the monitored temperature of the temperature sensor 137 falls within the above range.

When increasing the rotation speed of each fan, the monitoring unit 118 calculates the sum of the cube of the air volume v raised for each fan with respect to the sum of the cube of the air volume w reduced for each fan (= Σw ³ = F1). The rotation speed of each fan may be increased so that (= Σv ³ = F2) satisfies F2 <F1.

By controlling each fan by the monitoring unit 118 in this way, the state in which the monitored temperature falls within the specified range continually continues (becomes a steady state). At this time, it is assumed that the air volume of fans # 3 and # 4 has been increased from 0.18 (m ³ / min) to 0.36 (m ³ / min). The power consumption of each of the fans # 0 to # 2 in this state is 1.0. The power consumption of each of the fans # 3 and # 4 is 8.0. The power consumption of each of the fans # 5 to # 9 is 17.6. Therefore, in the second example, the total air volume of the fans # 0 to # 9 is 3.6 (m ³ / min), and the total power consumption of the fans # 0 to # 9 is 106.9.

  Here, in the first example without the wind direction control (Comparative Example) and in the second example with the wind direction control, the total air volume of the fans # 0 to # 9 is substantially the same. On the other hand, the power consumption of the second example with the wind direction control is about 20% smaller than that of the first example without the wind direction control (comparative example). As described above, the monitoring unit 118 controls the airflow direction and the number of revolutions of the fans, so that the required cooling performance can be satisfied and the power consumption for cooling by each fan can be reduced.

  In the above example, after changing the directions of the fans # 3 and # 4 and reducing the rotation speeds of the fans # 5 to # 9, the monitoring temperature measured by the CPU temperature sensor 137 is lower than the second specified value. It was shown to be higher. On the other hand, depending on the rotation speed of each fan, the device configuration, and the load, the direction of the fans # 3 and # 4 is changed to reduce the rotation speed of the fans # 5 to # 9, and then the monitoring measured by the CPU temperature sensor 137 is performed. The temperature may be lower than the first specified value. In this case, the monitoring unit 118 may reduce the rotation speed of any one of the fans # 3 to # 9 (for example, the fans # 3 and # 4). Thus, further power saving can be achieved.

Here, the distribution of the wind speed in the housing of the storage device 100 when the wind direction control is indicated by the table 300 is, for example, as follows.
FIG. 15 is a diagram illustrating an example of the wind speed in the housing.

In FIG. 15, the shade of the hatched color indicates the wind speed in the housing of the storage device 100, and the darker the shade, the faster the wind speed. FIG. 15A shows a case without wind direction control. Fans # 0 to # 9 face front. As illustrated in FIG. 14, the set air volume of fans # 0 to # 4 is 0.18 (m ³ / min). The set air volume of fans # 5 to # 9 is 0.54 (m ³ / min). In this case, the wind speed in the region 410 is about 2.84 (m / s). The wind speed in the region 420 is about 5.64 (m / s).

FIG. 15B shows a case where the wind direction control is performed. The fans # 0 to # 2 and # 5 to # 9 face front. Fans # 3 and # 4 are facing right (in a state inclined at -45 degrees). As illustrated in FIG. 14, the set air volume of fans # 0 to # 2 is 0.18 (m ³ / min). The set air volume of fans # 3 and # 4 is 0.36 (m ³ / min). The set air volume of fans # 5 to # 9 is 0.47 (m ³ / min). In this case, the wind speed in the region 430 is about 2.80 (m / s). The wind speed in the region 440 is about 5.60 (m / s).

  15 (A) and FIG. 15 (B), when the rotation speeds of fans # 5 to # 9 are reduced by setting the directions of fans # 3 and # 4 to the right, the area corresponding to area 420 It can be seen that the wind speed of each fan at 440 can be maintained.

FIG. 16 is a diagram illustrating an example of the influence of the wind direction control.
In FIG. 16, as in FIG. 15, the shade of the hatched color indicates the wind speed in the housing of the storage device 100, and the darker the color, the faster the wind speed. FIG. 16A shows a case without wind direction control. FIG. 16B shows a case where the wind direction control is performed.

  When comparing FIG. 16 (A) and FIG. 16 (B), the wind speed of the region 441 of FIG. 16 (B) is higher than that of FIG. 16 (A), and the fans # 3 and # 4 are directed rightward. The effect of wind direction control is apparent. In this way, the winds sent from the fans # 3 and # 4 blow into the cooling areas of the fans # 5 to # 9, so that the total air volume in the cooling areas increases and the rotation speed of the fans # 5 to # 9 decreases. Can be. By reducing the rotation speed of the fans # 5 to # 9, power consumption for cooling in the storage device 100 can be reduced.

  In the above example, the monitoring unit 118 calculates the cooling effects of the equations (1) to (3) according to the component configuration of the storage apparatus 100 and fluctuations in the load, and based on the calculation results, calculates the cooling effect of each fan. The direction and the number of rotations are controlled. On the other hand, the monitoring unit 118 may calculate the direction of the fan in advance for each component configuration of the storage device 100 and each load pattern of the CPUs 111 and 131, and store the wind direction table indicating the calculation result in the memory 118a in advance. Good. Alternatively, the monitoring unit 118 may previously acquire a wind direction table generated by another computer or the like, and store the wind direction table in the memory 118a. Therefore, an example of the wind direction table will be described.

FIG. 17 is a diagram illustrating an example of the wind direction table.
The wind direction table 124 is stored in the memory 118a. The wind direction table 124 includes items of a drive mounted state, a CPU load factor, and a fan wind direction.

  The presence or absence of each of the drives # 00 to # 23 in the drive unit 170 is registered as the drive mounting state. “Yes” indicates that the corresponding drive is present. “None” indicates that there is no corresponding drive. In the item of the CPU load factor, the load factors (%) of the CPU 111 (CPU # 0) and the CPU 131 (CPU # 1) are registered. The direction of each of the fans # 0 to # 9 is registered in the item of the fan wind direction. As described above, the front direction is “S”, the right direction is “R”, and the left direction is “L”.

  For example, in the wind direction table 124, the drive mounting state is “Yes” for all the drives # 00 to # 23, the CPU load factor of the CPU 111 is “100%”, the CPU load factor of the CPU 131 is “100%”, and the fan wind direction is , All records of “S” are registered for fans # 0 to # 9. This record indicates the directions of the fans # 0 to # 9 when all the drives # 00 to # 23 are mounted on the drive unit 170 and the CPU load rates of the CPUs 111 and 131 are both “100%”. Indicates that they are all facing front.

Similarly, the fan direction for the fans # 0 to # 9 is registered in the wind direction table 124 for other combinations of the drive mounting state and the CPU load factor.
For example, in steps S13 and S16 in FIG. 13, the monitoring unit 118 refers to the wind direction table 124 and specifies the direction of each fan corresponding to the pattern that matches the device configuration and the load state at the time of execution of the step. . Then, the monitoring unit 118 instructs each fan to be in the direction specified for each fan.

In the example of FIG. 17, the CPU load factor is used, but the load factor of each divided area (the average load factor of each electronic component arranged in the corresponding divided area) may be used.
In addition, as a control method other than the above, the monitoring unit 118 performs a steady state wind direction and rotation according to the pattern of the component configuration, the load factor of each divided area, and the outside air temperature while performing the monitoring process illustrated in FIG. It is conceivable to record the number for each fan. For example, the monitoring unit 118 may perform the recording using a predetermined table stored in the memory 118a. In this way, the monitoring unit 118 learns the wind direction and the rotation speed of each fan suitable for each pattern, thereby omitting the feedback control and quickly setting an appropriate rotation speed for the fan.

  In the above description, an example is shown in which electronic components are mounted on both the intake side and the exhaust side of the fan unit 150. However, electronic components are mounted on only one of the intake side and the exhaust side. You may. Therefore, another example of the device configuration of the storage device 100 will be described below.

FIG. 18 is a diagram illustrating another example (part 1) of the device configuration.
The storage device 100a differs from the storage device 100 in that the drive unit 170 does not exist on the intake side of each fan. In this case, the cooling area of each fan is a combination of the divided areas on the exhaust side of each fan. That is, the monitoring unit 118 applies the formulas (1), (2), and (3) by setting the entire set A of the cooling area to only the divided area on the exhaust side. Wind direction control and rotation speed control can be performed.

  For example, assume that each fan is initially facing the front. When the load on the CPU 111 is relatively small and the load on the CPU 131 is relatively large, the monitoring unit 118 changes the direction of the fans # 3 and # 4 to the right among the fans # 0 to # 9, and The number of rotations of # 5 to # 9 is reduced. As a result, power consumption for cooling in the storage device 100a can be reduced.

FIG. 19 is a diagram illustrating another example (part 2) of the device configuration.
The storage device 100b differs from the storage device 100 in that CMs 110 and 130 are provided on the intake side of each fan and no other electronic components are present on the exhaust side of each fan. In this case, the cooling area of each fan is a combination of the divided areas on the intake side of each fan. That is, the monitoring unit 118 applies Expressions (1), (2), and (3) by setting the entire set A of the cooling area to only the divided area on the intake side, and similarly to the storage apparatus 100, Wind direction control and rotation speed control can be performed.

  In order to change the direction of the fan on the intake side, for example, each of the fans # 0 to # 9 has a fin having a Z axis as a rotation axis on the intake side, and changes the direction of the fan by rotating the fin. You may. In this case, for example, the case where the fins are rotated clockwise by 45 degrees (-45 degrees) with respect to the direction opposite to the front (-X direction) is defined as the right direction (R) of the fan. A case where the fins are rotated counterclockwise by 45 degrees (+45 degrees) with respect to a direction opposite to the front (-X direction) is defined as a leftward direction (L) of the fan.

  For example, assume that each fan is initially facing the front. When the load on the CPU 111 is relatively small and the load on the CPU 131 is relatively large, the monitoring unit 118 changes the direction of the fans # 3 and # 4 to the left among the fans # 0 to # 9, and The number of rotations of # 5 to # 9 is reduced. As a result, power consumption for cooling in the storage device 100b can be reduced.

  By the way, in recent years, in the storage apparatuses 100, 100a, and 100b, a plurality of CMs and a plurality of drives are often built in one housing due to high integration. As a result, the deviation in the number of units (parts such as drives) mounted in the housing may increase depending on the intended use. In addition, as a result of the diversification of the functions of the storage devices 100, 100a, and 100b, the operation (application, workload) differs for each CM in many cases. In such a case, since the QoS (Quality of Service) for each application is important, it may be difficult to uniformly distribute the load for each CM.

  And, depending on the uneven load of the electronic components in the housing, the power consumption for cooling by each fan may not be sufficiently reduced. For example, the difference in load between a high-load location and a low-load location in a housing may be relatively large. In this case, if the rotation speed of each fan is set uniformly so as to sufficiently cool the high-load location, the rotation speed of the fan that cools the vicinity of the low-load location becomes excessive, and the power is excessively increased by the fan. May be consumed. In addition, since each fan is directed to a high-load location, the high-load location is excessively cooled, and the power may be excessively consumed by each fan.

  Therefore, as illustrated, the CMs 110 and 130 individually control the rotation speed of each fan, and select a fan having a higher cooling effect when directed to another divided area different from the currently directed divided area. To direct the fan to the other divided area. Then, the CMs 110 and 130 reduce the rotation speed of another fan directed to the another divided area. Thus, power consumption for cooling the storage device 100 (or the storage devices 100a and 100b) can be reduced.

  The information processing according to the first embodiment can be realized by causing the processing unit 18 to execute a program. The information processing according to the second embodiment can be realized by causing a processor included in the monitoring unit 118 or the CPU 111 to execute a program. The program can be recorded on a computer-readable recording medium 103.

  For example, the program can be distributed by distributing the recording medium 103 on which the program is recorded. Alternatively, the program may be stored in another computer, and the program may be distributed via a network. The computer may, for example, store (install) a program recorded on the recording medium 103 or a program received from another computer in a storage device such as the RAM 112, the SSD 113, and the memory 118a. Then, the computer may read and execute the program from the storage device.

Reference Signs List 10 electronic device 11, 12, 13 fan 14, 15, 16 parts 17 storage unit 18 processing unit 20 first area 30 second area 40 third area D1 part information D2 load information

Claims (7)

A plurality of fans arranged in a line and cooling a plurality of areas in the housing,
A component mounted on each of the plurality of areas and component information indicating a heat generation amount of the component, and load information indicating a load of the component are obtained, and based on the component information and the load information, The first cooling effect of the fan and the second cooling effect of the fan when the fan is directed to another area different from the area to which the fan is directed are evaluated for each fan, and the second cooling effect is evaluated. Selecting a first fan having a cooling effect higher than the first cooling effect, directing the first fan to the other area, and selecting a second fan directed to the other area of the plurality of fans; A processing unit for reducing the number of rotations of the fan,
An electronic device having: The processing unit calculates a calorific value of the area where the component is mounted from the calorific value of the component, corrects the calorific value of the area by a load of the component mounted on the area, and corrects the corrected calorific value of the area. Evaluating the first cooling effect and the second cooling effect based on the heat value of
The electronic device according to claim 1. The processing unit further corrects the calorific value of the area according to a mounting rate of the component in the area,
The electronic device according to claim 2. The first cooling effect and the second cooling effect are amounts of heat taken by refrigerant sent from the fan in a group of areas corresponding to the fan,
The processing unit calculates the calorific value based on the calorific value after the correction for each area,
The electronic device according to claim 2. When the processing unit detects a change in the component configuration in the housing or a change in the load on the component, the processing unit evaluates the first cooling effect and the second cooling effect for each of the plurality of fans, and performs the evaluation. Selecting the first fan according to
The electronic device according to claim 1. A component mounted on each of a plurality of areas cooled by a plurality of fans arranged in a line and component information indicating a calorific value of the component and load information indicating a load of the component are obtained,
Based on the component information and the load information, the first cooling effect of the fan in the current direction and the second direction of the fan when the fan is directed to another area different from the area to which the fan is directed The cooling effect of each fan,
Selecting a first fan whose second cooling effect is higher than the first cooling effect;
Directing the first fan to the other area, and lowering the rotation speed of a second fan directed to the other area among the plurality of fans;
A control program that causes a computer to execute processing. Computer
A component mounted on each of a plurality of areas cooled by a plurality of fans arranged in a line and component information indicating a calorific value of the component and load information indicating a load of the component are obtained,
Based on the component information and the load information, the first cooling effect of the fan in the current direction and the second direction of the fan when the fan is directed to another area different from the area to which the fan is directed The cooling effect of each fan,
Selecting a first fan whose second cooling effect is higher than the first cooling effect;
Directing the first fan to the other area, and lowering the rotation speed of a second fan directed to the other area among the plurality of fans;
Control method.

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