JP2010108324A - Physical computer, method for controlling cooling device, and server system - Google Patents

Physical computer, method for controlling cooling device, and server system Download PDF

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Publication number
JP2010108324A
JP2010108324A JP2008280698A JP2008280698A JP2010108324A JP 2010108324 A JP2010108324 A JP 2010108324A JP 2008280698 A JP2008280698 A JP 2008280698A JP 2008280698 A JP2008280698 A JP 2008280698A JP 2010108324 A JP2010108324 A JP 2010108324A
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Japan
Prior art keywords
temperature
fan
cooling
server
processor
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JP2008280698A
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Japanese (ja)
Inventor
Shinichi Hayashi
Takeshi Kato
Yoko Shiga
Yoshifumi Takamoto
猛 加藤
陽子 志賀
真一 林
良史 高本
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Hitachi Ltd
株式会社日立製作所
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    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 – G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/206Cooling means comprising thermal management
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 – G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 – G06F13/00 and G06F21/00
    • G06F1/26Power supply means, e.g. regulation thereof
    • G06F1/32Means for saving power
    • G06F1/3203Power management, i.e. event-based initiation of power-saving mode
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836Thermal management, e.g. server temperature control
    • Y02D10/16

Abstract

PROBLEM TO BE SOLVED To determine cooling control for reducing power consumption of the entire system.
A control method of a management computer connected to a server device having a processor and a fan and a cooling device, the temperature and operating rate of the processor, the rotation speed of the fan, and the intake air to the server from the server Obtaining a temperature, and calculating an estimated temperature of the processor after a predetermined period from the temperature and operating rate of the processor, the rotation speed of the fan, and the intake air temperature; When the estimated temperature is equal to or higher than a first predetermined value, a target rotational speed of the fan at which the estimated temperature after the period has elapsed is equal to or lower than the predetermined value is determined as the target rotational speed. The control method is characterized by instructing the server device.
[Selection] Figure 2

Description

  The present invention relates to a control method for a physical computer and a cooling device, and more particularly to a method for controlling the fan of the physical computer and the output of the cooling device according to the operating rate of a CPU.

  The increase in power consumption of IT systems has become a major problem due to the high performance of processors and the appearance of high-density IT (Information Technology) equipment such as blade servers. In response to this problem, development of technologies that reduce power consumption, such as low-power consumption processors and high-efficiency cooling methods, is underway, but there is a limit to the power-saving of a single device, and a greater power-saving effect is obtained Therefore, it is necessary to work on the entire computer room including the IT system and the cooling device.

  The cooling of the current IT system will be described. As the operating rate of the server increases, components such as the CPU and memory generate heat. The server is provided with a cooling fan, detects the temperature in the server casing, and generates an air current to cool the heat-generating component when the temperature exceeds a certain threshold value. Heat is discharged out of the housing by this airflow. Regarding the control of the cooling fan, Patent Document 1 discloses an invention in which the fan is controlled based on the temperature of the heat-generating component and the temperature change to improve the cooling efficiency. Further, Patent Document 2 discloses an invention in which a fan is controlled based on the temperature of a heat-generating component and a temperature change to improve cooling efficiency.

  On the other hand, a cooling device for cooling the heat generated by the equipment is installed in the computer room in which the server is installed, and the output is determined based on the temperature of a fixed sensor to keep the room temperature constant. However, it is difficult to make the temperature of the computer room uniform due to the bias of heat generated by IT equipment and the arrangement of equipment. Regarding the control of the cooling device, Patent Document 3 discloses an invention in which an air flow in a machine room is monitored and ventilation is performed according to the air flow.

  If there is a large amount of heat in the computer room, the equipment in the heat pool becomes unstable due to CPU thermal runaway, and the CPU temperature control circuit is activated to forcibly reduce processing performance or shut down. There are things to do. Patent Document 4 discloses an invention that avoids failure and shutdown by controlling heat dissipation by hibernation when the temperature exceeds a certain value in order to avoid occurrence of a malfunction due to forced shutdown.

  Also, predict the temperature after a certain period of time based on the current processing contents of the CPU, the temperature characteristics of the CPU, and user instructions input from the outside.If the predicted temperature exceeds the reference value, the CPU A method for moving the above process to another CPU is disclosed in Patent Document 5.

JP 2002-268775 A JP 2008-84173 A JP 2006-208000 JP2008-158787A JP2007-241376

  In the future, it will be important to provide a cooling device that can control the temperature locally rather than uniformly cooling the entire computer room with a large-scale cooling device in order to eliminate the unevenness of heat. For example, directional cooling devices and rack-based cooling devices attached to the back of the rack have already been shipped. In addition, in the case of equipment that cools with cold air from under the floor, the opening and closing of the grating plate (perforated tile) on the floor is controlled to change the air blowing area from the under floor and to cool the high temperature area intensively It becomes like this.

  Further, heat is generated after the operating rate of the heat generating component is increased, and there is a delay until the heat is detected by the temperature sensor. In addition, there is a further delay before the temperature rise is detected and the fan and air conditioning output increases and the cooling effect is actually produced. For this reason, when a bursty load occurs, the temperature temporarily rises even if the fan output increases, and then settles to a temperature at which stable operation is possible. However, as the temperature of the CPU rises, the leakage current increases exponentially, and more cooling power is required.

  As a result, there is a case where the cooling capacity is insufficient and the operation becomes unstable due to the CPU thermal runaway, or the CPU temperature control circuit operates to forcibly reduce the processing performance or shut down. Even if a forced shutdown is avoided by hibernation, the process must be interrupted.

  Also, even if the server cooling fan increases its rotation speed, if the air flow at the back of the server is insufficient, heat will not be transferred to the exhaust holes but will be diffused to surrounding equipment, causing other equipment to rise in temperature and causing trouble. May be incurred. Since the current cooling system adjusts the output based on the temperature information measured at one point, air conditioning does not work until the heat generated by a certain server reaches the measurement point, so this may occur. .

In order to achieve the above object, a control method of the present invention is a control method of a management computer connected to a server device having a processor and a fan and a cooling device, and the temperature and operating rate of the processor from the server The rotation speed of the fan and the intake air temperature to the server are acquired, and a predetermined period has elapsed from the temperature and the operating rate of the processor, the rotation speed of the fan, and the intake air temperature. The estimated temperature of the subsequent processor is calculated, and when the estimated temperature is equal to or higher than a first predetermined value, the target rotational speed of the fan at which the estimated temperature after the period elapses is equal to or lower than the predetermined value. The control method is characterized by determining and instructing the server device to set the target rotational speed.

  The server system of the present invention has a processor and a fan, and measures the temperature and operating rate of the processor, the rotational speed of the fan, and the intake air temperature, the server device, and the cooling device. And calculating an estimated temperature of the processor after a predetermined period from the temperature and the operating rate of the processor, the rotation speed of the fan, and the intake air temperature, and calculating the estimated A management computer for determining a target rotational speed of the fan at which the estimated temperature is less than or equal to the predetermined value after the period when the temperature is greater than or equal to a first predetermined value. Server system.

  According to the present invention, by cooling the CPU in advance and maintaining the optimum temperature, power consumption due to leakage current can be minimized and the cooling efficiency can be increased.

Hereinafter, embodiments of the present invention will be described.

(First embodiment)
An embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a diagram showing a system configuration of an embodiment of the present invention. The system configuration of this embodiment is an information processing system or a storage system. For example, the computer room in which one management computer 100, one or more physical computers 200, one or more storage devices 230, the management computer 100, the physical computers 200, and the storage devices 230 are installed is cooled. A cooling device 151 and a cooling device control unit 150 that controls the cooling device 151 are provided. The management computer 100, the physical computer 200, and the cooling device 151 are connected via the management network 225. Further, the physical computer 200 and the storage device 230 are connected by, for example, a fiber channel network 226. Here, the cooling device control unit 150 may be stored as a program in the memory of the physical computer so as to collectively control the cooling device 151. Further, the cooling device control unit 151 may be stored as a program in a memory in the management computer.

  FIG. 2 is a diagram showing the management computer 100 in one embodiment of the present invention.

  An outline of the operation of the management computer 100 will be described. Details will be described below with reference to the drawings. The management computer 100 manages the physical computer 200, the storage device 230, and the cooling device control unit 150. Then, information is exchanged with the plurality of physical computers 200 to detect the operation status of the plurality of physical computers 200. The cooling device 151 is individually controlled via the cooling device control function 151 according to the detected operating status of the plurality of physical computers 200. Further, the fan rotation speed and the cooling device of the plurality of physical computers 200 are controlled according to the detected operating status of the plurality of physical computers 200.

  The management computer 100 includes a central processing unit CPU (Central Processing Unit) 101, a storage device 105 such as a hard disk device or a flash memory, a memory 102, a bus 107, a network interface 104, and a disk interface 103.

  A server program 110 is stored in the memory 102. The server program includes an operation information monitoring unit 111, a temperature monitoring unit 112, a CPU temperature estimation unit 113, a fan rotation speed determination unit 115, a fan monitoring / control unit 116, and a cooling control unit 117. These programs are initially stored in the magnetic disk 105, transferred to the memory 102 as necessary, and then executed by the CPU 101. The operation information / power monitoring unit 111 collects operation information and power consumption information of the physical computer 200. The temperature monitoring unit 112 acquires the intake air temperature, CPU temperature, and exhaust temperature of the physical computer. The fan monitoring / control unit 116 acquires information on the fan rotation speed and issues an instruction to change the fan rotation speed. The CPU temperature estimation unit 113 estimates the temperature after a certain time of the CPU built in the physical computer. The fan rotation speed determination unit 115 determines a fan rotation speed that lowers the temperature of the CPU after a predetermined time to a target value. The cooling control determination unit 114 acquires the rack / cooling map 126 and determines the output of the cooling device 151. The cooling control unit 117 issues an instruction to control the output of the cooling device 151.

  Then, the operation information history 124, the server configuration information 121, the heat generation profile 122, the fan profile 123, the CPU temperature profile 125, the cooling device profile 127, the CPU temperature range 128, and the CPU optimum are stored in the storage device 105. The temperature 129, the rack / cooling map 126, and the cooling device profile 2010 are stored.

  FIG. 3 is a diagram showing a hardware configuration of the physical computer 200 in an embodiment of the present invention.

  The physical computer 200 includes a central processing unit CPU 201, a memory 202, a storage device 205 such as a hard disk device or a flash memory, a bus 207, a network interface 204, a disk interface 203, a fan 208, and a BMC (Baseboard Management Controller) 207. .

  The BMC 207 performs monitoring of server inlet temperature, exhaust temperature, CPU temperature, monitoring / control of fan rotation speed, and power supply control.

  The memory 202 stores an OS 222, a measurement agent program 223 that collects operation information of the physical computer, and a business service program 224. These programs are first stored in the magnetic disk 205, transferred to the memory 202 as necessary, and then executed by the CPU 201. Note that these programs are stored in the magnetic disk 205 by being read from a portable recording medium or downloaded from another computer or storage device via a network connected to each device. It may be a thing.

  In addition, each process of the server program 110 of the management computer is realized by executing each program by a CPU. However, these are integrated into a processing unit that performs each process, such as a measurement agent determination unit and a measurement unit. Can also be realized in hardware.

  The measurement agent 223 is a software program that runs on the computer 200 and collects operation information such as a CPU usage rate, a memory usage rate, and a network interface usage rate of a device on which it operates, and records it as a measurement counter. The operation information / power monitoring unit 111 of the server program 110 of the management computer transmits an operation information collection request by SNMP (Simple Network Management Protocol) to the measurement agent 223. The measurement agent 223 receives this operation information collection request, and transmits the value of the measurement counter designated by the object ID (Identification) in the request to the operation information / power monitoring unit 111. The server program 110 can centrally manage the operation information of a plurality of management targets by receiving the value of the measurement counter and recording it as operation information.

  FIG. 4 is a diagram showing a device arrangement of the computer room 400 in which the physical computer 200, the storage device 230, the cooling device 151, and the like are installed according to an embodiment of the present invention.

  In the computer room 400, four racks 401a, 401b, 401c, 401d and cooling devices 151a, 151b are arranged. Each rack 401 and the cooling devices 151a and 151b are fixed on the floor. A plurality of air outlets 431 to 435 are installed on the floor. For example, as shown in FIG. 4B, the air outlets 431 to 435 have a motor 440 fixed thereto, and the motor rotating shaft 441 has opening / closing plates 442 that open and close the air outlets according to the rotational drive of the motor 440. It is a fixed configuration.

  The physical computer 200 and the storage device 230 are accommodated in the rack 401a. The racks 401b to 401c similarly house the physical computer 200 and the storage device 230 (not shown).

  The cooling devices 151 a and 151 b are attached to the side surface of the computer room 400 and are configured as one element of the cooling device 151 for keeping the temperature of the computer room 400 constant. The cooling devices 151 a and 151 b remove the heat discharged from each server by sending cold air under the floor and blowing out the cold air from the air outlet (perforated tile) 431. At this time, in accordance with an instruction from the management computer 100, control is performed to open one of the outlets 431 to 435 and close the other outlets. For example, when the operation rate of the servers stored in the racks 401a and 401d is high and the servers stored in the racks 401b and 401c are in an idle state, the blower outlet 431 is driven by the rotation of the motor 440 as a control for the cooling device 151. ˜435, the outlet 433 is closed, and the other outlets 431, 432, 434, 435 are opened.

  In addition, when the operation rate of the servers stored in the racks 401b and 401c is high and the servers stored in the racks 401a and 401d are in an idle state, the air outlets 431 to 431 are driven by the rotation of the motor 440 as a control for the cooling device 151. Control is performed such that the air outlets 431 and 435 out of 435 are closed and the other air outlets 432, 433, and 434 are opened.

  The cooling device in the present embodiment is a general computer room air conditioner (CRAC: Computer Room Air Conditioner), but is not limited thereto. The cooling facility may be a liquid cooling device that removes heat discharged from each server by circulating the cooled liquid refrigerant through the pipes and circulating through each rack. In the liquid cooling device, there is a valve in front of the pipe that leads to each rack, and the cooling output is adjusted by opening and closing the valve in the same manner as the outlet. Further, the cooling facility may be an outside air cooling device that removes heat discharged from each server by taking in outside cold air and sending cool air from under the floor in the same manner as the computer room cooling device.

  FIG. 5 is a diagram showing the server configuration information 121 in one embodiment of the present invention.

  The server configuration information 121 includes a rack / physical computer map 500 (FIG. 5 (a)) and a physical computer list 510 (FIG. 5) showing the correspondence between racks installed in the computer room 400 and physical computers stored in the racks. 5 (b)).

  The rack / physical computer map 500 (FIG. 5A) includes a rack ID 501 that is an identifier of the rack and a physical computer ID 502 that is an identifier of the physical computer 200 stored in each rack.

  The physical computer list 510 (FIG. 5B) is one or more records including a physical computer ID 511, a chassis number 512, a component identifier (item) 513, and a component value 514 that the physical computer 200 has. Configured and represents the processing capability of the physical computer 200. The physical computer ID 501 stores an identifier of each physical computer. The chassis number 512 is used to specify the chassis that stores the blade server when the physical computer is a blade server. In the case of a non-modular type server such as a 1U server, “-” is recorded. A blade server shares a fan and a power source among a plurality of servers, and may have a management processor that manages server configuration and power on / off. When the management target physical computer is a blade server, it is possible to obtain the CPU temperature and the shared fan rotation speed by connecting to this management processor instead of individual servers. It is assumed that the IP address and the port number necessary for connecting to the management processor are managed as server configuration information (not shown).

  The server configuration information 121 is often determined by the designer of the management target system at the time of system construction and is managed by a document or software. The physical computer configuration information may be created based on such managed configuration information, or may be created from dynamically collected information.

  FIG. 6 is a diagram showing a rack / cooling device map 126 according to an embodiment of the present invention.

  The rack / cooling device map 126 includes one or more records including a rack identifier 601, an identifier 602 of the cooling device 151, an outlet 603 located on the front of the rack, and an outlet 604 located on the rear of the rack. Consists of. Each record represents a correspondence between a rack, a cooling device 151 that cools each rack, and an identification number of an outlet that blows and ventilates the rack.

  FIG. 7 is a diagram showing operation information 710 (FIG. 7A) and power information 720 (FIG. 7B) according to an embodiment of the present invention.

  The operation information 710 (FIG. 7A) indicates the resource usage status of one physical computer 200. As an example, it is composed of one or more records including a measurement date 711, a measurement day 712, a measurement time 713, and a CPU operation rate 714. The unit of the CPU operation rate is%. The operation information shown here can be acquired by WMI (Windows Management Interface) if it is Windows (registered trademark) and by a Top command if it is Linux.

  The power information 720 (FIG. 7B) indicates the power consumption status of each physical computer 200. The measurement date 721, the measurement day 722, the measurement time 723, the physical computer power amount 724, and the chassis power amount. 726 is composed of one or more records. When the physical computer 200 is a blade server, the power amount of a plurality of physical computers and the power amount of the chassis are managed in one table. On the other hand, when the physical computer 200 is not a blade server, only the power amount of one physical computer is managed.

  FIG. 8 is a diagram showing a heat generation profile 122 in one embodiment of the present invention.

  The heat generation profile 122 is composed of one or more records including a CPU operation rate 801 and a heat generation amount 802. Here, the operation rate 811 is the operation rate of the CPU, and the heat generation amount and 802 are the heat generation amount of the CPU. That is, each record represents the amount of heat generated with respect to the operating rate of the CPU of the physical computer 200.

  The heat generation profile 122 is different for each type of CPU included in the physical computer 200. There are various methods for obtaining the heat generation profile. For example, it is possible to record a past operating rate and a calorific value history of the CPU, and obtain from the history. Moreover, the process by CPU can be performed in advance and the relationship between an operation rate and the emitted-heat amount can also be measured. It is also possible to record the relationship between the operating rate provided by the CPU vendor and the heat generation amount.

  FIG. 9 shows the CPU temperature profile 125 (FIG. 9A), the CPU temperature range 128 (FIG. 9B), the CPU optimum temperature 129 (FIG. 9C), the temperature rise in one embodiment of the present invention. It is a figure which shows the relationship of the power consumption by leak current, and the relationship (FIG.9 (d)) of temperature rise and fan power consumption.

  The CPU temperature profile 125 (FIG. 9A) is composed of one or more records including a CPU heat generation amount 901 and a CPU temperature change 902 per fixed time. That is, each record represents a temperature change amount after a certain time with respect to the heat generation amount of the CPU.

  Generally, the temperature change of an object is a value obtained by dividing the amount of heat given from the outside by the heat capacity, but the ease of heat transfer differs depending on the nature of the object. That is, even when the same amount of heat is given, the temperature finally reached and the rate of temperature change differ depending on the material and structure of the CPU. Therefore, the CPU temperature profile is a table determined for each CPU type.

  As described above, the CPU temperature profile 125 is different for each type of CPU included in the physical computer 200. There are various methods for obtaining the CPU temperature profile. For example, the past heat generation amount and temperature change history of the CPU can be recorded and acquired from the history. Further, it is possible to measure the relationship between the heat generation amount and the temperature change by executing processing by the CPU in advance. It is also possible to record the relationship between the amount of heat generated by the CPU vendor and the temperature change.

  The CPU temperature range 128 (FIG. 9B) includes an upper limit value 911 and a lower limit value 912, and indicates a temperature range where the CPU operates safely. Usually, the upper and lower limits of the temperature at which the CPU operates normally are determined by the manufacturing vendor. In many servers, when the CPU temperature exceeds this range due to a rise in room temperature or a fan failure, a program for monitoring the hardware state of the server issues a warning to the outside of the server.

  The CPU optimum temperature 129 is a temperature that minimizes the sum of the power consumed by the leakage current of the CPU and the power consumed by the fan that cools the CPU. Since the CPU optimum temperature 129 varies depending on the intake air temperature, the CPU optimum temperature 129 is composed of one or more records including the intake air temperature 921 and the CPU optimum temperature 922.

  The CPU optimum temperature 129 will be described. A small amount of current (leakage current) flows through the CPU even when it is in an OFF state due to miniaturization of the semiconductor, but this leakage current has a characteristic that it rises exponentially as the temperature rises. For this reason, even in the idle state, when the temperature of the CPU increases, the power consumption also increases exponentially. In order to suppress CPU power consumption due to this leakage current, it is better not to raise the CPU temperature, but cooling power is required to maintain the temperature. Generally, fan power consumption is proportional to the fan wind speed and power consumption, and inversely proportional to the square of the CPU temperature rise. Therefore, as shown in FIG. 9D, the leakage current can be suppressed if the temperature is kept low, but the power consumption of the fan increases. If the temperature rise is allowed, the leakage current increases, but the power consumption of the fan is low. It is a trade-off relationship that can be done. The CPU optimum temperature 129 is a temperature at which the sum of the power consumed by the leak current and the power consumed by the fan is minimized, can be measured by the administrator, and can be disclosed by the server vendor.

  FIG. 10 is a diagram showing the fan profile 123 in one embodiment of the present invention.

  The fan profile 123 is composed of one or more records each including a fan rotation speed 1001 of the physical computer 200 and a CPU temperature change 1002 that can be changed per unit time by cooling the CPU by blowing air from the fan. . And the cooling efficiency of CPU by a fan changes with inlet temperature. Therefore, the temperature change of the CPU that can be changed per certain time by the fan differs depending on the intake air temperature. Although the fan profile of the present embodiment shows the case of the inlet air temperature of 21 ° C., 22 ° C., and 23 ° C. (1003), it is not limited to this.

  Further, the relationship between the CPU and the fan of the server is not necessarily one-to-one. For example, in a blade server in which a plurality of servers are stored in one casing, the plurality of servers may be cooled by a shared fan. Even in such a case, the fan is configured to cool each CPU uniformly, and the fan profile 123 as described above can be defined.

  FIG. 20 is a diagram showing a cooling device profile 2010 and a cooling control pattern 2010 in one embodiment of the present invention.

  The cooling control profile 2010 is divided for each cooling device, and includes one or more records including a cooling device output stage 2011, an inlet air temperature change 2012 of each cooling target rack at the output stage, and power consumption 2013. Consists of.

  The cooling control pattern 2020 represents the combination of the outputs of the plurality of cooling devices and the power consumption, and includes a combination number 2021, the output 2022 of each cooling device, and the power consumption 2023 of the entire cooling device at that time. Consists of the above records.

  The information shown in FIGS. 5 to 10 is described in the definition file by the administrator. However, these pieces of information may be input from a GUI (Graphical User Interface) instead of a definition file, or may be acquired from another server via a network.

  Next, the control of the physical computer and the cooling device by the management computer in one embodiment of the present invention will be described with reference to the drawings.

  FIG. 11 is a diagram showing a control flow of the physical computer and the cooling device by the management computer in one embodiment of the present invention.

  First, the operation information monitoring unit 111 of the server program 110 of the physical computer reads the server configuration information 121 from the storage device 105 (S1101). Then, the physical computer 200 to be managed is grasped, and the operation information monitoring unit 111 collects operation information and power consumption of the physical computer 200 (S1102) and stores them in the server operation history 124.

  Then, the CPU temperature estimation unit 113 estimates the CPU temperature of each physical computer 200 after a certain period of time based on the stored operation history, the heat generation profile 122 and the CPU temperature profile 125 stored in the storage device ( S1103). This estimation process will be described with reference to FIG.

  FIG. 12 is a diagram showing a CPU temperature estimation flow in one embodiment of the present invention. This process is executed by the CPU temperature estimation unit.

  The CPU temperature estimation unit 113 refers to the server operation history 124 and acquires the CPU operation rate 714 of the physical computer 200 that is the processing target (S1201).

  Then, the amount of heat generated with respect to the CPU operating rate is obtained with reference to the heat generation profile 122 (S1202). At this time, first, the CPU type of the physical computer 200 is obtained by referring to the server list 510 of the server configuration information 121, and the CPU temperature profile corresponding to the CPU type is used.

  Next, the CPU temperature change with respect to the generated heat quantity is obtained with reference to the CPU temperature profile 125 (S1203). Specifically, the CPU temperature estimation unit 113 acquires the current CPU temperature and the inlet temperature to the server device using the temperature monitoring unit, and uses the fan monitoring / control unit 116 to determine the current fan rotation speed. get. Then, referring to the fan profile 123, the CPU temperature change (cooling effect) in the case where the current fan speed is maintained from the current time until a certain time has elapsed is obtained (S1204). The fan monitoring / control unit 116 is connected to the BMC 207 by SSH (Secure Shell) or the like, executes a command for acquiring the fan rotation speed, and acquires the value of the fan rotation speed.

  Finally, the CPU temperature change with respect to the amount of heat generated is added to the current CPU temperature, and the temperature change by the fan is subtracted to obtain the CPU temperature after a certain time has elapsed (S1205).

  When the estimated value of the CPU temperature after the lapse of a certain time is calculated, it is confirmed whether the estimated temperature after the lapse of the certain time exceeds a set threshold value (S1104). When the set threshold value is exceeded (in the case of Y), the temperature monitoring unit acquires the intake air temperature to the physical computer, and the fan rotation speed determination unit 115 refers to the acquired intake air temperature and the fan profile 123. Then, the number of fan rotations necessary to keep the CPU temperature within the upper limit value within a certain time is calculated (S1105).

  An example of determining the fan speed is shown in FIG. That is, FIG. 13 is a diagram showing a fan rotational speed determination flow in one embodiment of the present invention.

  When the estimated value of the CPU temperature exceeds the threshold value, the fan rotational speed determination unit 115 obtains the difference between the estimated CPU temperature and the threshold value of the CPU temperature after the elapse of a predetermined time, and the CPU temperature change amount to be realized. (S1301).

  Then, referring to the current inlet temperature to the physical computer acquired when estimating the CPU temperature after a certain period of time and the fan profile 123, the CPU temperature change amount to be realized after a certain period of time The number of fan rotations to obtain is determined (S1302).

  If the threshold value is not exceeded, the process waits for the elapse of a certain time (S1108), and returns to the monitoring of operation information, temperature, and rotation speed (S1102). Here, the threshold value may be an upper limit value of the CPU temperature range 128. The threshold value may be a value obtained by subtracting a certain value from the upper limit value. By setting a value obtained by subtracting a constant value from the upper limit value as a threshold value, the upper limit value can be operated even when the operation amount suddenly increases.

  In the present embodiment, whether or not to control the rotational speed of the fan is determined depending on whether or not the threshold value after a certain time has elapsed, but the present invention is not limited to this. As another embodiment, the inlet temperature is acquired by the temperature monitoring unit 112, and the CPU optimum temperature 129 that is a value that minimizes the sum of the CPU leakage current and the fan power consumption is determined from the acquired inlet temperature. Then, the determination 1104 may be made based on whether the value obtained by subtracting the constant temperature from the CPU optimum temperature is within the range of the value obtained by adding the constant temperature to the CPU optimum temperature.

  Next, the server program 110 confirms whether or not the physical computer 200 can change the rotational speed of the fan to the calculated rotational speed (S1106). For example, it is confirmed whether the fan rotation speed obtained in the process 1105 exceeds the maximum value. If it can be changed (S1106: Y), the fan monitoring / control unit 116 instructs the physical computer 200 to change the rotational speed of the fan (S1107). Then, after a predetermined time has elapsed (S1108), the process returns to monitoring of operation information, temperature, and rotation speed (S1102).

  When the fan of the physical computer 200 cannot realize the fan rotation speed determined by the fan rotation speed determination unit 115 (S1106: N), the cooling control unit 117 sets the cooling facilities 151a and 151b installed in the computer room 400. And the inlet temperature of the physical computer 200 is lowered (S1520). This process will be described with reference to FIG.

  FIG. 21 is a diagram for explaining the cooling control flow in one embodiment of the present invention.

  The cooling control unit 117 refers to the fan profile 123 to obtain a target inlet temperature that achieves the CPU temperature change amount to be realized (S2101). Here, the fan rotation speed is the maximum value that can be realized. That is, if the 5000 revolutions in FIG. 10 is the maximum value and the CPU temperature change is −3.0 ° C., the target inlet air temperature is obtained as 21 ° C.

  Then, a difference between the current inlet temperature and the target inlet temperature is obtained and set as an inlet temperature change target value (S2102).

  Next, the cooling control unit 117 refers to the server configuration information 121 and identifies the rack in which the physical computer 200 to be controlled is stored. Then, referring to the rack / cooling map 126, the cooling facility responsible for cooling the specified rack is specified. Multiple racks may be specified. And the cooling control part 117 instruct | indicates to change the output of this cooling device according to the said difference.

  A specific method for determining the output of the cooling device refers to the cooling device profile 2010, and selects an output stage in which the rack temperature change amount is equal to or greater than the intake air temperature change target value.

  However, when a plurality of cooling devices cool the same rack as in this embodiment, the power consumption of the entire computer room differs depending on which cooling device output is changed. Therefore, in order to set the inlet temperature of the rack to be managed to the target inlet temperature, a cooling control pattern list 2030 listing the combinations of outputs that the cooling equipment 151a and the cooling equipment 151b can take is created (S2103).

  Then, the combination that minimizes the sum of the power consumption of the cooling equipment 151a and the cooling equipment 151b is selected (S2104).

For example, in the combination, the cooling equipment 151a is set to stage 1, the cooling equipment 151a is set to stage 3, the both outputs are set to stage 2, the cooling equipment 151a is set to stage 3, and the cooling equipment 151b is set to stage 1. There are patterns such as. Here, the power consumption of the cooling device with respect to the temperature change, that is, the cooling temperature varies depending on the characteristics of the device and the distance to the rack, and therefore the power consumption of each pattern differs. Then, the output of the cooling equipment 151a, 151b is changed to lower the inlet temperature of the physical computer 200 (S2105).
Then, after a predetermined time has elapsed (S1108), the operation information / temperature / revolution speed monitoring is resumed (S1102).

  Although the physical computer profile 124 of the present embodiment focuses only on the CPU that is the main heat generating component, the heat generation profile may be information according to the utilization rate of other components in addition to the CPU.

  In the present embodiment, the case where the IT apparatus is a server has been described. However, the IT apparatus may be a storage apparatus or a network device. When the IT device is a storage device, the amount of heat generated by the device changes not only with the CPU operation rate but also with IOPS (Input Output Per Second) indicating the number of data input / output to the device. The calorific value can be estimated based on the above. Similarly, when the IT device is a network device, the heat generation amount can be estimated based on the port usage rate.

  As described above, the power saving control server 110 includes the operation information monitoring unit 111 that collects the operation information and power consumption information of the physical computer 200, and the temperature that collects the inlet temperature, CPU temperature, and exhaust temperature of the managed server. The monitoring unit 112 monitors the fan rotation speed of the management target server, reads the fan monitoring / control unit 116 that changes the rotation speed of the fan, the heat generation profile 122, and the CPU temperature profile 125, and the management target server A CPU temperature estimation unit 113 that estimates the temperature after a certain time of the built-in CPU, and a fan rotation number determination unit 115 that reads the fan profile 123 and determines a fan rotation number that lowers the temperature after a certain time of the CPU to a target value. And the cooling device profile 127 and the rack / cooling map 126 are received. Consists of a cooling control determination unit 114 that determines the output of 151 and a cooling control unit 117 that instructs control of the cooling device 151, thereby cooling the CPU in advance to maintain the optimum temperature and consuming power due to leakage current. The cooling efficiency can be increased. In addition, by controlling the server fan and air conditioning in cooperation, even if the CPU temperature cannot be within the specified range by controlling the fan alone, the air conditioning temperature is adjusted in advance to lower the intake air temperature. As a result, the temperature of the CPU is kept within a specified range, and the occurrence of a failure due to heat can be avoided.

In this embodiment, the BMC in the server device controls the fan according to an instruction from the management computer. However, the present invention is not limited to this. The server program 110 is stored in the memory of the physical computer, and the operation information history is recorded. 124, server configuration information 121, heat generation profile 122, fan profile 123, CPU temperature profile 125, cooling device profile 127, CPU temperature range 128, CPU optimum temperature 129, rack / cooling map 126 The cooling device profile 2010 may be stored in the storage device, and the fan control and the air conditioning device control in this embodiment may be performed in the physical computer.
(Second embodiment)
Hereinafter, a second embodiment of the present invention will be described with reference to the drawings. For the same components as those in the first embodiment, the drawings and description are omitted as appropriate.

  The system configuration of an embodiment of the present invention is the same as that shown in FIG. The physical computer is the same as that shown in FIG.

  FIG. 14 is a diagram showing a management computer according to an embodiment of the present invention. The difference from the management computer of the first embodiment is that the operation history information 124 is not held, but the job execution schedule 132 and the server / job map 131 are held. Description of the server configuration information 121, the heat generation profile 122, the fan profile 123, the CPU temperature profile 125, the rack / cooling map 126, the CPU temperature range 128, and the CPU optimum temperature 129 already described in the first embodiment will be omitted.

  The operation of the management computer will be briefly described. Detailed description will be given below with reference to the drawings. The server program 110 obtains the CPU operating rate in a certain period from the job execution schedule (load fluctuation) of the business executed by the managed server, and based on the CPU operating rate and the heat generation amount for the operating rate determined for each CPU type. When the temperature of the CPU after a certain time is estimated and it is confirmed that the CPU temperature exceeds the upper limit value of the temperature range in which the CPU operates stably, the fan speed of the managed server and the output of the cooling device as necessary To control.

  FIG. 15 is a configuration diagram showing a server / job map 131 (FIG. 15A) and a job execution schedule 132 (FIG. 15B) according to an embodiment of the present invention.

  The server / job map 131 (FIG. 15A) is composed of one or more records including a physical computer ID 1401 that is an identifier of a physical computer and a business type 1402 that indicates the type of business. Each record indicates which business is being executed on which physical computer.

  The job execution schedule 132 (FIG. 15B) is one or more records including a day 1411, a day of the week 1412, a start time 1413, an end time 1414, a job ID 1415, and an average CPU operation rate 1416 for each physical computer. Composed. Each record indicates the average value of the CPU operation rate generated by the business for each day of the week and time zone. The CPU operation rate of the server is predicted based on the batch job execution schedule, the time variation of the business request, or the server On / Off schedule. The job execution schedule 132 is obtained from the server operation history when processing equivalent to the batch job execution schedule, the time variation of the business request, or the server On / Off schedule is executed.

  FIG. 16 is a flowchart showing the control flow of the second embodiment of the present invention. First, the operation information monitoring unit 111 of the server program 110 acquires server configuration information 121 (S1601), and acquires information on the physical computer 200 to be managed. Then, the job execution schedule information of the physical computer to be managed is acquired.

  Next, the server program 110 confirms the job execution schedule and confirms whether the end time of the job executed by the physical computer 200 has been reached (S1603). If it is the job end time (S1603: Y), the server / job map 131 is referenced to identify the next job to be executed by the physical computer 200, and the job execution schedule 132 corresponding to the job is referred to. The start and end times of jobs executed by the physical computer 200 and the average CPU operating rate are acquired (S1604).

  Then, the CPU temperature estimation unit 113 estimates the CPU temperature of each physical computer 200 after a certain period of time based on the average CPU operation rate, the heat generation profile 122, and the CPU temperature profile 125 (S1604). The temperature estimation process is the same as in the first embodiment.

  Here, for example, when the average CPU operating rate of the load section starting from now is 0, the power consumption can be suppressed by reducing or stopping the rotation speed of the fan.

  Further, the process 1606 is the same as that of the first embodiment.

In this embodiment, the job to be executed and the CPU operation rate for processing the job are acquired from the job execution schedule. However, it is not limited to this, for example, storing data such as jobs processed in the past and CPU utilization rate, predicting CPU utilization rate for a certain time based on the stored data, CPU utilization may be acquired.
(Third embodiment)
Hereinafter, a third embodiment of the present invention will be described with reference to the drawings. For the same components as those in the first embodiment, the drawings and description are omitted as appropriate.

  The system configuration of an embodiment of the present invention is the same as that shown in FIG. The physical computer is the same as that shown in FIG.

  FIG. 17 is a diagram showing a management computer according to an embodiment of the present invention. The difference from the management computer of the first embodiment is that the server program holds the rule determination unit 133 and the storage device holds the cooling control rule. Regarding the server configuration information 121, heat generation profile 122, fan profile 123, operation history information 124, CPU temperature profile 125, rack / cooling map 126, CPU temperature range 128, and CPU optimum temperature 129 already described in the first embodiment, Description is omitted.

  FIG. 18 is a configuration diagram showing a cooling control rule 131 according to the third embodiment of this invention.

  The cooling control rule 131 includes a rule 1010 and an action 1020. The rule 1010 includes one or more records including an evaluation item 1011 and a threshold value 1012. Each record represents one condition. The condition is satisfied when the value of the evaluation item is equal to or greater than the threshold value, and is specified by the action 1020 when the condition expressed by all the records is satisfied. Control is executed. Further, when the condition of one item is satisfied, the control designated by the action 1020 may be executed.

  The cooling control rule is a condition for determining that an abnormal temperature rise has started, and is defined in advance by an administrator of the computer room.

  For example, in the cooling control rule 131 shown in FIG. 18, the CPU temperature of all the physical computers 200 stored in a certain rack exceeds 60 ° C., the exhaust temperature exceeds 40 ° C., and the fan rotation speed Is more than 10,000 revolutions / second, it is considered that a heat pool is generated on the rear surface of the rack where the exhaust of the physical computer 200 stored in the rack is discharged. Then, action 1020 is executed to discharge this heat. It is instructed to maximize the output of the cooling device 151 for cooling the rack and to open 100% of the grating plate at the outlet located on the back of the rack.

  In addition to the above, when the total power consumption of the physical computers 200 stored in the same rack exceeds a certain value from the power information shown in FIG. 5B, it is generated from the physical computer group stored in the rack. It is also effective to increase the output of the cooling device that cools the rack by one step, judging that the amount of heat to be exceeded exceeds a certain value.

  Further, when the intake air temperature of all the physical computers 200 stored in the same rack exceeds a certain threshold value, it is considered that a heat accumulation has occurred on the front surface of the rack, and the cooling device 151 for cooling the rack. It is also effective to open the grating plate at the outlet located in front of the rack 100%.

  FIG. 19 is a flowchart showing the control flow of the third embodiment of the present invention.

  First, the operation information monitoring unit 111 of the power saving control server 110 acquires server configuration information 121 (S1901).

  Information on the physical computer 200 to be managed is acquired, and the operation information monitoring unit 111 collects operation information and power consumption of the physical computer 200 and stores them in the server operation history 124. The temperature monitoring unit 112 collects the current CPU temperature and exhaust temperature. The fan monitoring / control unit 116 collects the fan rotation speed (S1902).

  Next, the rule determination unit 133 compares the value of each item of the rule 1010 of the cooling control rule 131 with the threshold value 1012 for the physical computer 200 stored in each rack based on the collected information (S1903). ). When the values of all items are equal to or greater than the threshold value 1012 and the rule 1010 is established (S1904: Y), the rack / cooling map 126 is referred to, the cooling device 151 that cools the rack, and the The air outlet located on the back of the rack is specified, and the cooling control designated by action 1020 is executed (S1905). Then, waiting for elapse of a fixed time (S1906), the process returns to monitoring of operation information and the like (S1902).

  According to the present embodiment, it is possible to save the installation cost of the sensor as compared with a method of detecting a temperature rise by installing a large number of sensors around the management target device.

It is an example of the system block diagram which shows the system configuration | structure of the 1st Example of this invention. It is an example of the block diagram which shows the hardware constitutions of the power saving control server of 1st Example of this invention. It is an example of the block diagram which shows the physical computer hardware structure which is the management object of the 1st Example of this invention. (A) is an internal block diagram of the computer room of 1st Example of this invention, (b) is an example of principal part sectional drawing which shows the relationship between the motor installed in the floor of the computer room, and a blower outlet. is there. It is an example of the block diagram which shows the server structure information of the 1st Example of this invention. It is an example of the block diagram which shows the rack and cooling map of 1st Example of this invention. It is an example of the block diagram which shows the operation information and power consumption information in 1st Example of this invention. It is an example of the block diagram which shows the heat generation profile in the 1st Example of this invention. It is an example of the block diagram which shows CPU temperature profile in 1st Example of this invention. It is an example of the block diagram which shows the fan profile in the 1st Example of this invention. It is an example of the flowchart which shows the power saving control flow in the 1st Example of this invention. It is an example of the flowchart which shows the CPU temperature estimation flow in the 1st Example of this invention. It is an example of the flowchart which shows the fan rotation speed determination flow in 1st Example of this invention. It is an example of the system block diagram which shows the system configuration | structure of the 2nd Example of this invention. It is an example of the block diagram which shows the job execution schedule and server job map of 2nd Example of this invention. It is an example of the flowchart which shows the power saving control flow of the 2nd Example of this invention. It is an example of the system configuration | structure figure which shows the system configuration | structure of the 3rd Example of this invention. It is an example of the block diagram which shows the cooling control rule of the 3rd Example of this invention. It is an example of the flowchart which shows the power saving control flow of the 3rd Example of this invention. It is an example of the cooling device profile of the 1st Example of this invention. It is an example of the flowchart of the cooling device part of the 1st Example of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 110 ... Power saving control server, 111 ... Operation information monitoring part, 112 ... Temperature monitoring part, 113 ... CPU temperature estimation part, 114 ... Cooling control determination part, 115 ... Fan rotation speed determination part, 116 ... Fan monitoring / control part, 117: Cooling control unit, 121: Server configuration information, 122: Heat generation profile, 123 ... Fan profile, 124 ... Server operation history, 125 ... CPU temperature profile, 126 ... Rack / cooling map, 127 ... Cooling profile, 200 ... Physical Computer, 223 ... Measurement agent

Claims (15)

  1. A control method by a management computer connected to a server device having a processor and a fan and a cooling device,
    Obtaining the temperature and operating rate of the processor, the rotational speed of the fan and the inlet temperature to the server from the server,
    From the temperature and the operating rate of the processor, the rotation speed of the fan, and the intake air temperature, an estimated temperature of the processor after a predetermined period has elapsed,
    When the estimated temperature is equal to or higher than a first predetermined value, a target rotational speed of the fan at which the estimated temperature after the period has elapsed is equal to or lower than the predetermined value;
    A control method characterized by instructing the server device to set the target rotational speed.
  2. The control method according to claim 1, comprising:
    The management computer has a memory for storing an operation information monitoring unit, a fan monitoring unit, a fan control unit, a temperature estimation unit, and a cooling control unit,
    The operation information monitoring unit acquires the operation rate of the processor from the server,
    The fan monitoring unit obtains the rotation speed of the fan;
    The temperature estimation unit obtains the intake air temperature and the temperature of the processor, calculates an elevated temperature of the processor from the temperature and the operation rate of the processor, and from the rotation speed of the fan and the intake air temperature Calculate the cooling temperature, subtract the cooling temperature from the rising temperature to calculate the estimated temperature,
    The fan control unit issues an instruction to the server to change the fan to the target rotational speed,
    Even if the rotation speed of the fan is maximized, when the estimated temperature after the period does not become the predetermined value or less, when the cooling control unit sets the rotation speed of the fan to a specified value, Determining the target inlet temperature at which the estimated temperature after a period of time is less than or equal to the predetermined value, determining an output of the cooling device for achieving the target inlet temperature, and supplying the output to the cooling device It is characterized by issuing instructions to change
  3. The control method according to claim 1, comprising:
    Even if the number of rotations of the fan is maximized, the output of the cooling device is increased when the estimated temperature after the period does not become the predetermined value or less.
  4. The control method according to claim 3, wherein
    When increasing the output of the cooling device,
    When the rotation speed of the fan is set to a specified value, the target intake air temperature at which the estimated temperature after the period has elapsed is less than or equal to the predetermined value is determined,
    A control method comprising: determining an output of the cooling device for achieving the target inlet temperature.
  5. The control method according to claim 4, comprising:
    When there are a plurality of the cooling devices, calculate a plurality of combinations of outputs of the cooling devices,
    For each of the plurality of combinations, calculate power consumption by the plurality of cooling devices,
    Based on the power consumption, select a combination from the plurality of combinations,
    A control method characterized by determining the outputs of the plurality of cooling devices based on the selected combination.
  6. The control method according to claim 1, comprising:
    When calculating the estimated temperature, the temperature of the processor is calculated from the temperature and the operating rate of the processor, the cooling temperature is calculated from the rotation speed of the fan and the intake air temperature, and the temperature is calculated from the increased temperature. A control method, wherein the estimated temperature is calculated by subtracting a cooling temperature.
  7. The control method according to claim 6, comprising:
    Recognizing the processor type of the server device;
    A control method characterized in that, when calculating the temperature rise, calculation is performed using a relationship between an operation rate corresponding to the type of the processor and a heat generation amount.
  8. The control method according to claim 1, comprising:
    When the estimated temperature is equal to or higher than the first predetermined value and further equal to or lower than the second predetermined value, the target rotational speed of the fan at which the estimated temperature after the period has elapsed is equal to or lower than the predetermined value. Decide
    The first predetermined value is a value obtained by adding the first temperature to the optimum processor temperature, and the second predetermined value is a value obtained by subtracting the second temperature from the optimum processor temperature. Control method.
  9. The control method according to claim 8, comprising:
    The control method, wherein the optimum processor temperature is calculated from power consumption of the processor and power consumption of the fan.
  10. A control method by a management computer connected to a server device having a processor and a fan and a cooling device,
    Obtaining the temperature of the processor, the rotational speed of the fan and the inlet temperature to the server from the server;
    Obtaining information about a job executed by the processor from the server;
    Get the availability from the information about the job,
    From the temperature and the operating rate of the processor, the rotation speed of the fan, and the intake air temperature, an estimated temperature of the processor after a predetermined period has elapsed,
    When the estimated temperature is equal to or higher than a first predetermined value, a target rotational speed of the fan at which the estimated temperature after the period has elapsed is equal to or lower than the predetermined value;
    A control method characterized by instructing the server device to set the target rotational speed.
  11. A server system,
    A processor and a fan, connected to the server device and the server device and the cooling device for measuring a temperature and an operating rate of the processor, a rotation speed of the fan, and an intake air temperature; An estimated temperature of the processor after elapse of a predetermined period is calculated from the operating rate, the rotation speed of the fan, and the intake air temperature, and the estimated temperature exceeds the first predetermined value. In some cases, the server system includes: a management computer that determines a target rotational speed of the fan at which the estimated temperature after the period has elapsed is equal to or less than the predetermined value.
  12. The server system according to claim 11,
    Furthermore, it has a cooling device,
    The management computer issues an instruction to increase the output of the cooling device when the estimated temperature after the period does not become the predetermined value or less even when the rotation speed of the fan is maximized. Server system.
  13. The server system according to claim 12,
    The management computer determines the target inlet temperature at which the estimated temperature after the period has passed is less than or equal to the predetermined value when the rotation speed of the fan is a specified value, and sets the target inlet temperature to the target inlet temperature. And determining an output of the cooling device to perform.
  14. The server system according to claim 11,
    When the management computer calculates the estimated temperature, it calculates the rising temperature of the processor from the temperature and the operating rate of the processor, calculates the cooling temperature from the rotational speed of the fan and the inlet temperature, The server system, wherein the estimated temperature is calculated by subtracting the cooling temperature from the increased temperature.
  15. 15. The server system according to claim 14, wherein
    The management computer recognizes the type of the processor of the server device, and calculates the increased temperature using a relationship between an operation rate corresponding to the type of the processor and a heat generation amount, Server system.
JP2008280698A 2008-10-31 2008-10-31 Physical computer, method for controlling cooling device, and server system Pending JP2010108324A (en)

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Cited By (21)

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Publication number Priority date Publication date Assignee Title
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US10253780B2 (en) 2016-03-24 2019-04-09 Nec Platforms, Ltd Fan control apparatus and fan control method for computer equipment

Families Citing this family (6)

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JP5707716B2 (en) * 2010-03-19 2015-04-30 富士通株式会社 Air conditioning system and air conditioning method
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US10180665B2 (en) 2011-09-16 2019-01-15 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Fluid-cooled computer system with proactive cooling control using power consumption trend analysis
US9354126B2 (en) 2012-11-30 2016-05-31 International Business Machines Corporation Calibrating thermal behavior of electronics
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Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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US20060168975A1 (en) * 2005-01-28 2006-08-03 Hewlett-Packard Development Company, L.P. Thermal and power management apparatus
JP2007041739A (en) * 2005-08-02 2007-02-15 Nec Access Technica Ltd Fan drive control method and device
US8374730B2 (en) * 2005-08-25 2013-02-12 Apple Inc. Methods and apparatuses for dynamic thermal control

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JP2013073413A (en) * 2011-09-28 2013-04-22 Hitachi Ltd Load allocation method for data center and information processing system
JP2015507786A (en) * 2011-12-29 2015-03-12 インテル コーポレイション Adaptive temperature throttling with user configuration features
WO2013145273A1 (en) * 2012-03-30 2013-10-03 富士通株式会社 Information processing device, control method and program
EP2833238A1 (en) * 2012-03-30 2015-02-04 Fujitsu Limited Information processing device, control method and program
EP2833238A4 (en) * 2012-03-30 2015-03-11 Fujitsu Ltd Information processing device, control method and program
US9732972B2 (en) 2012-03-30 2017-08-15 Fujitsu Limited Information processing device and controlling method
JP2013213635A (en) * 2012-04-03 2013-10-17 Nippon Telegr & Teleph Corp <Ntt> Air conditioning control method, and air conditioning control system
US9341190B2 (en) 2012-10-18 2016-05-17 International Business Machines Corporation Thermal control system based on nonlinear zonal fan operation and optimized fan power
US9360021B2 (en) 2012-10-18 2016-06-07 International Business Machines Corporation Thermal control system based on nonlinear zonal fan operation and optimized fan power
JP2014183062A (en) * 2013-03-18 2014-09-29 Fujitsu Ltd Electronic apparatus cooling system and electronic apparatus cooling method
JP2014192192A (en) * 2013-03-26 2014-10-06 Fujitsu Ltd Electronic apparatus cooling system
JP2014203321A (en) * 2013-04-08 2014-10-27 富士通株式会社 Electronic device cooling system
JP2015021698A (en) * 2013-07-23 2015-02-02 日本電信電話株式会社 Air conditioning control method and air conditioning control system
US9851781B2 (en) 2014-02-27 2017-12-26 Fujitsu Limited System, control method of system, and storage medium
JP2015185059A (en) * 2014-03-26 2015-10-22 日本電気株式会社 temperature control device, temperature control method, and temperature control program
US10095204B2 (en) 2014-12-26 2018-10-09 Fujitsu Limited Method, medium, and system
US10253780B2 (en) 2016-03-24 2019-04-09 Nec Platforms, Ltd Fan control apparatus and fan control method for computer equipment

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