JP2020001091A - Flux, resin flux cored solder, flux coated solder and soldering method - Google Patents

Abstract

To provide a flux that has reduced residue and excellent processability, and to provide a resin flux cored solder using the flux, a flux coated solder and a soldering method.SOLUTION: A flux includes: 70 wt% or more and 99.5 wt% or less of a solid solvent; and 0.5 wt% or more and 30 wt% or less of an activator. In addition, a flux includes: 70 wt% or more and 100 wt% or less of a phenolic solid solvent; and 0 wt% or more and 30 wt% or less of an activator. Furthermore, a flux includes: more than 0 wt% and 30 wt% or less of a phenolic solid solvent; 70 wt% or more and 99.5 wt% or less of a solid solvent other than the phenolic solid solvent; and 0 wt% or more and 30 wt% or less of an activator.SELECTED DRAWING: None

Description

  The present invention relates to flux for flux cored solder, flux cored solder using flux for flux cored solder, flux for flux coated solder, flux coated solder and flux using flux for flux coated solder. About the attachment method.

  Generally, the flux used for soldering chemically removes the metal oxides present on the metal surface of the solder and the joining object to be soldered, and enables the movement of metal elements at the boundary between the two. It has the effect of doing. For this reason, by performing soldering using a flux, an intermetallic compound can be formed between the solder and the metal surface of the joining object, and a strong joining can be obtained.

  As a solder used in soldering, a solder in which a linear solder is filled with a flux and is called a cored solder is known. A flux that is supposed to be used in such a flared solder has been proposed (for example, see Patent Document 1).

  The flux used for the flux solder is required to have a high viscosity even if it is solid or liquid in terms of workability.

  As a soldering method using a cored solder, it is known to use a heating member called a soldering iron. On the other hand, a technique has been proposed in which a through hole is provided in the center axis of a soldering iron, and solder is supplied by entering the through hole and solder is supplied (for example, see Patent Document 2). In addition, in the flux used in the soldering iron described in Patent Document 2, in order to solve the soldering failure caused by the flux residue remaining after being carbonized, a low residue is obtained by using a rosin-based flux. A realized technique has been proposed (for example, see Patent Document 3).

JP 2017-113776 A JP 2009-195938 A JP 2018-61978 A

  The flux used in the cored solder is required to have a predetermined viscosity in order to prevent the flux from flowing out of the solder at room temperature. Conventionally, the flux contains a predetermined amount of rosin. Rosin is less likely to volatilize due to the thermal history assumed during soldering and becomes a main component of the residue.

  When soldering is performed using a soldering iron as described in Patent Literature 2, the flux of the solder supplied to the through hole becomes a residue after heating and may adhere to the inner surface of the through hole. . In the soldering using a soldering iron described in Patent Document 2, in a state where the soldering iron is controlled to maintain a predetermined temperature exceeding the melting point of the solder, the solder is supplied to the through hole. Soldering is performed continuously. As a result, the deposits such as residues are continuously heated to become carbides, which causes scorching in the through holes. Then, carbides are deposited in the through holes of the soldering iron, and the diameter of the through holes becomes small, so that there is a possibility that the solder cannot be supplied. In the flux described in Patent Document 3, low residue is realized by selecting rosin. However, at the time of heating, it has been required to secure fluidity more quickly than when rosin is used.

  The present invention has been made in order to solve such problems, and a flux for a cored solder having low residue and excellent workability, a cored solder using the flux for a cored solder, and a flux. An object of the present invention is to provide a flux for coat solder, a flux coat solder using the flux for flux coat solder, and a soldering method.

  Solid solvents and phenolic solid solvents can give the flux a predetermined viscosity and are hardly volatile when heated up to the temperature range expected for soldering, and have the effect of removing metal oxides. In addition, it has been found that the heat history assumed in soldering has volatility, and carbonization by continuous heating is suppressed.

  Therefore, the present invention provides a flux for soldering, in which a flux containing 70% by weight or more and 99.5% by weight or less of an active agent, 0.5% by weight or more and 30% by weight or less of an activator, and containing no liquid solvent is filled in the solder. It is. Further, the flux is a flux for soldering a flux coat solder containing a solid solvent of 70 wt% to 99.5 wt%, an activator of 0.5 wt% to 30 wt% and a flux containing no liquid solvent.

  Further, the present invention is a flux for a cored solder in which a flux containing 70% to 100% by weight of a phenolic solid solvent and 0% to 30% by weight of an activator and containing no liquid solvent is filled in the solder. . Further, the flux is a flux for a flux coat solder in which a phenolic solid solvent is contained in an amount of 70% by weight or more and 100% by weight or less, and an activator is contained in an amount of 0% by weight or more and 30% by weight or less.

  Further, the present invention includes a phenolic solid solvent of more than 0 wt% and 30 wt% or less, a solid solvent other than the phenolic solid solvent of 70 wt% or more and 99.5 wt% or less, and an activator of 0 wt% or more and 30 wt% or less. It is a flux for solder that is filled with solder and contains no flux. In addition, the present invention includes a phenolic solid solvent of more than 0 wt% to 30 wt% or less, a solid solvent other than the phenolic solid solvent of 70 wt% to 99.5 wt%, an activator of 0 wt% to 30 wt%, and a liquid solvent. This flux is for flux-coated solder coated with solder that does not contain flux.

  In the present invention, it is preferable that the flux be a solid at 25 ° C. or a liquid having a viscosity of 3500 Pa · s or more. The activator is any one of an organic acid, an amine, an organic halogen compound, and an amine hydrohalide, or a combination of two or more of an organic acid, an amine, an organic halogen compound, and an amine hydrohalide. Is preferred.

  Further, the present invention is a flux-coated solder in which the above-described flux for soldering is filled into the solder, and the solder is coated with the flux for flux-coating solder described above.

  In addition, the present invention uses a solder having a solid solvent content of 70 wt% or more and 99.5 wt% or less, an activator of 0.5 wt% or more and 30 wt% or less, and a flux-filled solder that does not contain a liquid solvent. This is a soldering method in which the solder is heated with a soldering iron to a temperature exceeding the melting point of the solder, thereby heating the joining object and melting the solder.

  Furthermore, the present invention uses a immersion solder made of a solder filled with a flux containing 70% by weight or more and 100% by weight or less of a phenolic solid solvent, 0% by weight or more and 30% by weight or less of an activator, and not containing a liquid solvent, This is a soldering method in which a solder core is heated with a soldering iron to a temperature exceeding the melting point of the solder to heat an object to be joined and to melt the solder core.

  Further, the present invention includes a phenolic solid solvent of more than 0 wt% and 30 wt% or less, a solid solvent other than the phenolic solid solvent of 70 wt% or more and 99.5 wt% or less, and an activator of 0 wt% or more and 30 wt% or less. Use flux cored solder made of solder filled with flux that is not included, heat the flux cored solder with a soldering iron until the temperature exceeds the melting point of the solder, heat the joining object, and This is a soldering method that melts the solder.

  The solid solvent or the phenol-based solid solvent, or the flux containing the solid solvent and the phenol-based solid solvent, has a solid or predetermined viscosity at room temperature.

  When a phenol-based solid solvent is not contained, an activator is contained.When a phenol-based solid solvent is contained, an activator is not contained. In the course of heating up to a temperature range exceeding the melting point of, the viscosities of the solid solvent and the phenolic solid solvent decrease and flow.

  As a result, in the present invention, sufficient activity for removing metal oxides can be obtained by using the flux-coated solder and the flux-coated solder. In addition, since it does not flow at room temperature, it is suitable as a flux for fluxed solder. Further, the solid solvent and the phenol-based solid solvent have volatility in a heat history assumed in soldering, and thus are suitable for use in low residue.

It is explanatory drawing which shows an example of the soldering iron used by the soldering method of this Embodiment. It is an explanatory view showing a soldering method of the present embodiment. It is an explanatory view showing a soldering method of the present embodiment. It is an explanatory view showing a soldering method of the present embodiment. It is an explanatory view showing a soldering method of the present embodiment.

<Example of flux of the present embodiment>
The flux of the present embodiment contains a solid solvent or a phenolic solid solvent, or a solid solvent and a phenolic solid solvent.

  The flux containing the solid solvent has a predetermined viscosity such that it does not solidify or flow out at room temperature. In addition, even a flux containing a phenolic solid solvent has a predetermined viscosity so as not to solidify or flow out at room temperature. Furthermore, solid solvents and phenolic solid solvents whose boiling points are in the vicinity of the temperature range assumed for soldering have volatility in the heat history assumed for soldering.

  The flux containing such a solid solvent has a function of removing a metal oxide by containing an activator such as an organic acid. Further, the phenolic solid solvent can also function as an activator. Thus, the flux containing the phenolic solid solvent has a function of removing metal oxides without containing other activators such as organic acids.

  In the case of a flux-filled solder in which the flux is filled, the flux is required to have a predetermined viscosity in order to prevent the flux from flowing out of the solder. In the case where the flux of the present embodiment is applied to the flux-hardened solder, if the amount of the solid solvent is small, it is necessary to increase the amount of rosin in order to secure the viscosity. However, rosin is hardly volatile when heated to a temperature range assumed for soldering, and the amount of rosin increases when the amount of rosin is increased, and is not suitable for low residue applications.

  Therefore, the flux of the first embodiment contains the solid solvent in an amount of 70 wt% to 99.5 wt% and the activator in an amount of 0.5 wt% to 30 wt%.

  When the flux contains a phenolic solid solvent, it can function as a flux without containing an activator. Therefore, the flux of the second embodiment contains a phenolic solid solvent in an amount of 70% by weight or more and 100% by weight or less, and an activator in an amount of 0% by weight or more and 30% by weight or less.

  The flux of the third embodiment contains a solid solvent of 70 wt% to 99.5 wt%, a phenolic solid solvent of more than 0 wt% to 30 wt%, and an activator of 0 wt% to 30 wt%. The flux of each embodiment is preferably a solid at 25 ° C. or a liquid having a viscosity of 3500 Pa · s or more.

  Examples of the solid solvent include neopentyl glycol (2,2-dimethyl-1,3-propanediol), dioxane glycol and the like. Examples of the phenol-based solid solvent include 4- (1,1,3,3-tetramethylbutyl) phenol and catechol.

  The flux of each embodiment may contain rosin in an amount of 0 wt% or more and 30 wt% or less. In the flux of each embodiment, the activator contains 0% to 30% by weight of an organic acid, 0% to 5% by weight of an amine, 0% to 4% by weight of an amine hydrohalide, and an organic halogen compound. From 0 wt% to 10 wt%. When an organic acid and an amine are added to the flux, a predetermined amount of the organic acid and the amine react to form a salt. Therefore, the reaction between the organic acid and the amine may be suppressed by reacting two or more of the organic acid and the amine to form a salt and then adding the salt.

  Furthermore, the flux of each embodiment contains, as additives, 0 wt% to 5 wt% of silicone, 0 wt% to 10 wt% of an organic phosphorus compound, and 0 wt% to 3 wt% of an antifoaming agent. Further, a surfactant or a colorant may be contained.

  Examples of the rosin include natural rosins such as gum rosin, wood rosin and tall oil rosin, and derivatives obtained from the natural rosin. Examples of the rosin derivative include purified rosin, polymerized rosin, hydrogenated rosin, disproportionated rosin, hydrogenated disproportionated rosin, acid-modified rosin, phenol-modified rosin, and α, β unsaturated carboxylic acid-modified products (acrylated rosin , Maleated rosin, fumarated rosin, etc.), and purified, hydrogenated and disproportionated products, esterified products of the polymerized rosin, and purified, hydrogenated and disproportionated products of the modified α, β unsaturated carboxylic acid. And one or more of these can be used.

  The flux of each embodiment may further contain another resin such as an acrylic resin in addition to rosin, and as other resins, an acrylic resin, a terpene resin, a modified terpene resin, a terpene phenol resin, a modified terpene phenol resin, Styrene resin, modified styrene resin, xylene resin, modified xylene resin, polyethylene, polypropylene, polyvinyl acetate, polyvinyl alcohol, polyethylene polypropylene copolymer, and at least one or more resins selected from polyethylene polyvinyl acetate copolymer Can be included. As the modified terpene resin, an aromatic modified terpene resin, a hydrogenated terpene resin, a hydrogenated aromatic modified terpene resin, or the like can be used. As the modified terpene phenol resin, a hydrogenated terpene phenol resin or the like can be used. As the modified styrene resin, a styrene acrylic resin, a styrene maleic resin, or the like can be used. As the modified xylene resin, phenol-modified xylene resin, alkylphenol-modified xylene resin, phenol-modified resol-type xylene resin, polyol-modified xylene resin, polyoxyethylene-added xylene resin, and the like can be used. The amount of the other resin is 15% by weight or less of rosin, preferably 10% by weight or less of rosin, more preferably 5% by weight or less of rosin when the total amount of rosin is 100.

  Organic acids include glutaric acid, adipic acid, azelaic acid, eicosantioic acid, citric acid, glycolic acid, succinic acid, salicylic acid, diglycolic acid, dipicolinic acid, dibutylaniline diglycolic acid, suberic acid, sebacic acid, and thioglycol. Acid, phthalic acid, isophthalic acid, terephthalic acid, dodecanedioic acid, parahydroxyphenylacetic acid, picolinic acid, phenylsuccinic acid, fumaric acid, maleic acid, malonic acid, lauric acid, benzoic acid, tartaric acid, tris isocyanurate (2- Carboxyethyl), glycine, 1,3-cyclohexanedicarboxylic acid, 2,2-bis (hydroxymethyl) propionic acid, 2,2-bis (hydroxymethyl) butanoic acid, 4-tert-butylbenzoic acid, 2,3- Dihydroxybenzoic acid, 2,4-diethylglutaric acid, 2-ki Phosphoric acid, 3-hydroxybenzoic acid, malic acid, p- anisic acid, palmitic acid, stearic acid, 12-hydroxystearic acid, oleic acid, linoleic acid, and linolenic acid.

  As organic acids, hydrogen was added to dimer acid which is a reaction product of oleic acid and linoleic acid, trimer acid which is a reaction product of oleic acid and linoleic acid, and dimer acid which is a reaction product of oleic acid and linoleic acid. Either hydrogenated dimer acid or hydrogenated trimer acid obtained by adding hydrogen to trimer acid which is a reaction product of oleic acid and linoleic acid, or dimer acid which is a reaction product of oleic acid and linoleic acid, or oleic acid and linoleic acid Hydrogenated dimer acid obtained by adding hydrogen to dimer acid which is a reaction product of oleic acid and linoleic acid, and hydrogenated trimer obtained by adding hydrogen to trimer acid which is a reaction product of oleic acid and linoleic acid Acids and the like. Further, as organic acids, hydrogen was added to dimer acids other than the reaction product of oleic acid and linoleic acid, trimer acid other than the reaction product of oleic acid and linoleic acid, and dimer acid other than the reaction product of oleic acid and linoleic acid. Hydrogenated trimer acids obtained by adding hydrogen to trimer acids other than hydrogenated dimer acid or a reaction product of oleic acid and linoleic acid, such as dimer acid which is a reactant of acrylic acid, trimer acid which is a reactant of acrylic acid, and methacrylic acid Dimer acid which is a reaction product of methacrylic acid, dimer acid which is a reaction product of acrylic acid and methacrylic acid, trimer acid which is a reaction product of acrylic acid and methacrylic acid, and a reaction product of oleic acid Certain dimer acid, oleic acid reactant trimer acid, linoleic acid reactant dimer acid, linoleic acid reactant Meric acid, dimer acid which is a reactant of linolenic acid, trimer acid which is a reactant of linolenic acid, dimer acid which is a reactant of acrylic acid and oleic acid, trimer acid which is a reactant of acrylic acid and oleic acid, acrylic Dimer acid which is a reaction product of acid and linoleic acid, trimer acid which is a reaction product of acrylic acid and linoleic acid, dimer acid which is a reaction product of acrylic acid and linolenic acid, and trimer acid which is a reaction product of acrylic acid and linolenic acid , Dimer acid which is a reaction product of methacrylic acid and oleic acid, trimer acid which is a reaction product of methacrylic acid and oleic acid, dimer acid which is a reaction product of methacrylic acid and linoleic acid, and a reaction product of methacrylic acid and linoleic acid Trimer acid, dimer acid which is a reaction product of methacrylic acid and linolenic acid, trimer which is a reaction product of methacrylic acid and linolenic acid , Dimer acid which is a reaction product of oleic acid and linolenic acid, trimer acid which is a reaction product of oleic acid and linolenic acid, dimer acid which is a reaction product of linoleic acid and linolenic acid, and a reaction product of linoleic acid and linolenic acid Trimer acid, hydrogenated dimer acid obtained by adding hydrogen to dimer acid other than the above-described reaction product of oleic acid and linoleic acid, hydrogenated trimer acid obtained by adding hydrogen to trimer acid other than the reaction product of oleic acid and linoleic acid, and the like. No.

  Examples of the amine include monoethanolamine, diphenylguanidine, ethylamine, triethylamine, ethylenediamine, triethylenetetramine, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, and 2-ethyl-4. -Methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2 -Undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellite G, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-s-triazine, 2,4-diamino-6 [2'-Undecylimidazolyl- (1 ')]-ethyl-s-triazine, 2,4-diamino-6- [2'-ethyl-4'-methylimidazolyl- (1')]-ethyl-s- Triazine, 2,4-diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5- Dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo [1,2-a] benzimidazo 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, 2-phenylimidazoline, 2,4-diamino-6-vinyl-s-triazine, 2,4-diamino-6-vinyl -S-triazine isocyanuric acid adduct, 2,4-diamino-6-methacryloyloxyethyl-s-triazine, epoxy-imidazole adduct, 2-methylbenzimidazole, 2-octylbenzimidazole, 2-pentylbenzimidazole, 2- (1-ethylpentyl) benzimidazole, 2-nonylbenzimidazole, 2- (4-thiazolyl) benzimidazole, benzimidazole, 2- (2'-hydroxy-5'-methylphenyl) benzotriazole, 2- (2 ' -Hydroxy-3'-tert- Butyl-5'-methylphenyl) -5-chlorobenzotriazole, 2- (2'-hydroxy-3 ', 5'-di-tert-amylphenyl) benzotriazole, 2- (2'-hydroxy-5'- tert-octylphenyl) benzotriazole, 2,2′-methylenebis [6- (2H-benzotriazol-2-yl) -4-tert-octylphenol], 6- (2-benzotriazolyl) -4-tert- Octyl-6'-tert-butyl-4'-methyl-2,2'-methylenebisphenol, 1,2,3-benzotriazole, 1- [N, N-bis (2-ethylhexyl) aminomethyl] benzotriazole, Carboxybenzotriazole, 1- [N, N-bis (2-ethylhexyl) aminomethyl] methylbenzotria , 2,2 '-[[(methyl-1H-benzotriazol-1-yl) methyl] imino] bisethanol, 1- (1', 2'-dicarboxyethyl) benzotriazole, 1- (2, 3-dicarboxypropyl) benzotriazole, 1-[(2-ethylhexylamino) methyl] benzotriazole, 2,6-bis [(1H-benzotriazol-1-yl) methyl] -4-methylphenol, 5-methyl Benzotriazole, 5-phenyltetrazole and the like can be mentioned.

  Amine hydrohalide is a compound obtained by reacting an amine with hydrogen halide, and examples thereof include aniline hydrochloride and aniline hydrobromide. As the amine of the amine hydrohalide, the above-mentioned amines can be used, and examples thereof include ethylamine, ethylenediamine, triethylamine, methylimidazole, 2-ethyl-4-methylimidazole, and the like.Examples of hydrogen halide include chlorine, Bromine, iodine, and hydrides of fluorine (hydrogen chloride, hydrogen bromide, hydrogen iodide, hydrogen fluoride) can be given. Further, a borofluoride may be contained in place of the amine hydrohalide or in combination with the amine hydrohalide, and examples of the borofluoride include borofluoric acid.

  Examples of the organic halogen compound include trans-2,3-dibromo-1,4-butenediol which is an organic bromo compound, triallyl isocyanurate hexabromide, 1-bromo-2-butanol, 1-bromo-2-propanol, -Bromo-1-propanol, 3-bromo-1,2-propanediol, 1,4-dibromo-2-butanol, 1,3-dibromo-2-propanol, 2,3-dibromo-1-propanol, 2, 3-dibromo-1,4-butanediol, 2,3-dibromo-2-butene-1,4-diol, trans-2,3-dibromo-2-butene-1,4-diol, cis-2,3 -Dibromo-2-butene-1,4-diol, tetrabromophthalic acid, bromosuccinic acid, 2,2,2-tribromoethanol and the like. Examples of the organic chloro compound include chloroalkane, chlorinated fatty acid ester, hetic acid, and hetic anhydride. Further, a fluorine-based surfactant which is an organic fluoro compound, a surfactant having a perfluoroalkyl group, and polytetrafluoroethylene are exemplified.

  Silicones include dimethyl silicone oil, cyclic silicone oil, methylphenyl silicone oil, methyl hydrogen silicone oil, higher fatty acid modified silicone oil, alkyl modified silicone oil, alkyl / aralkyl modified silicone oil, amino modified silicone oil, epoxy modified silicone oil And polyether-modified silicone oils, alkyl / polyether-modified silicone oils, and carbinol-modified silicone oils.

  Examples of the organic phosphorus compound include methyl acid phosphate, ethyl acid phosphate, isopropyl acid phosphate, monobutyl acid phosphate, butyl acid phosphate, dibutyl acid phosphate, butoxyethyl acid phosphate, and 2-ethylhexyl acid phosphate. Fate, bis (2-ethylhexyl) phosphate, monoisodecyl acid phosphate, isodecyl acid phosphate, lauryl acid phosphate, isotridecyl acid phosphate, stearyl acid phosphate, oleyl acid phosphate, tallow phosphate, Coconut oil phosphate, isostearyl acid phosphate, alkyl acid phosphate, tetracosyl acid phosphate, ethylene glycol Lumpur acid phosphate, 2-hydroxyethyl methacrylate acid phosphate, dibutyl pyrophosphate acid phosphate, 2-ethylhexyl phosphonic acid mono-2-ethylhexyl, alkyl (alkyl) phosphonates, and the like.

  Examples of the antifoaming agent include an acrylic polymer, a vinyl ether polymer, and a butadiene polymer.

<Example of the configuration of the cored solder of the present embodiment>
In addition to the above-mentioned linear solder filled with the flux, the cored solder of the present embodiment may have a columnar shape such as a column called a pellet, disk, ring, chip, ball, or column. The flux used for the cored solder is required to be solid at room temperature so as not to flow out in the step of processing the solder, or to have a predetermined high viscosity so as not to flow out. In addition, the viscosity required for the flux when it is used as a cored solder is, for example, 3500 Pa · s or more. The wire diameter of the cored solder is 0.1 mm or more and 1.6 mm or less, preferably 0.3 mm or more and 1.3 mm or less, and more preferably 0.6 mm or more and 1.0 mm or less. The content of the flux filled in the cored solder is 0.5 wt% or more and 6 wt% or less, and preferably 1.5 wt% or more and 3 wt% or less, when the fluxed solder is 100.

  Solder is Sn alone, or Sn-Ag system, Sn-Cu system, Sn-Ag-Cu system, Sn-Bi system, Sn-In system, Sn-Zn system, Sn-Pb system, or these. It is composed of an alloy in which Sb, Bi, In, Cu, Zn, As, Ag, Cd, Fe, Ni, Co, Au, Ge, P, Pb, Zr, etc. are added to the alloy.

<Structural example of flux coat solder of the present embodiment>
The flux coat solder of the present embodiment is a solder coated with the above-described flux. The flux coat solder may have a columnar shape such as a column, such as a pellet, a disk, a ring, a chip, a ball, and a column, other than a linear solder. The flux coated with the solder is a solid attached to the surface of the solder at room temperature.

  Solder is Sn alone, or Sn-Ag system, Sn-Cu system, Sn-Ag-Cu system, Sn-Bi system, Sn-In system, Sn-Zn system, Sn-Pb system, or these. It is composed of an alloy in which Sb, Bi, In, Cu, Zn, As, Ag, Cd, Fe, Ni, Co, Au, Ge, P, Pb, Zr, etc. are added to the alloy.

<Functional effect example of flux, flux cored solder and flux coat solder of the present embodiment>
The solid solvent or the phenol-based solid solvent, or the flux containing the solid solvent and the phenol-based solid solvent, has a solid or predetermined viscosity at room temperature.

  When a phenol-based solid solvent is not contained, an activator is contained.When a phenol-based solid solvent is contained, an activator is not contained. In the course of heating up to a temperature range exceeding the melting point of, the viscosities of the solid solvent and the phenolic solid solvent decrease and flow.

  As a result, the flux of the present embodiment can be used for a flux-coated solder or a flux-coated solder, and can obtain sufficient activity for removing metal oxides. In addition, since it does not flow at room temperature, it is suitable as a flux for fluxed solder. Further, the solid solvent and the phenol-based solid solvent have volatility in a heat history assumed in soldering, and thus are suitable for use in low residue.

<Example of soldering method according to present embodiment>
FIG. 1 is an explanatory view showing an example of a soldering iron used in the soldering method of the present embodiment, and FIGS. 2A, 2B, 2C and 2D are explanatory views showing a soldering method of the present embodiment. FIG.

  The soldering method of the present embodiment is applied to through-hole mounting, a single-sided board, and the like. The soldering iron 1A used in the soldering method of the present embodiment has a through hole 2 formed along the central axis of the soldering iron 1A, and includes a heater 3 as a heating means for heating the soldering iron 1A.

Soldering iron 1A, the diameter D of the through-holes 2 is greater than the diameter d ₁ of the solder H cored, can be supplied solder H enters the distal portion 10 near-soldering iron 1A via the through-holes 2 It is. In the soldering iron 1 </ b> A, the diameter D of the through hole 2 is larger than the diameter d ₂ of the lead terminal 101 of the electronic component 100, and the lead terminal 101 can be inserted into the tip 10 of the through hole 2.

  In the soldering method according to the present embodiment, as shown in FIG. 2A, lead terminals 101 of electronic component 100 are inserted into through holes 201 formed in substrate 200. Further, the soldering iron 1A is heated by the heater 3 until the temperature exceeds the melting point of the solder, and the soldering iron 1A is controlled to maintain a predetermined temperature exceeding the melting point of the solder. Next, as shown in FIG. 2B, the leading end 10 of the soldering iron 1A is brought into contact with or close to the through hole 201 into which the lead terminal 101 is inserted, and the lead terminal 101 is inserted into the through hole 2 of the soldering iron 1A. I do.

  Next, the solder H cut into a predetermined length into the through hole 2 of the soldering iron 1A is supplied with the solder H, and the lead H is inserted into the lead terminal 101 inserted into the through hole 2 to make the solder H contact.

  By controlling the soldering iron 1A to maintain a predetermined temperature exceeding the melting point of the solder, as shown in FIG. 2C, the solder is heated, the solder is melted, and the through holes 201 and the lead terminals are formed. 101 is heated.

  When the solder H is heated by the soldering iron 1A to a temperature exceeding the melting point of the solder, the viscosity of the flux in the solder is reduced, and the flux flows through the through-hole 201 and the lead terminal 101. Then, the metal oxide on the surface of the through hole 201 and the lead terminal 101 is removed, and the molten solder spreads.

  Next, as shown in FIG. 2D, by separating the soldering iron 1A from the through hole 201, the solder wetted and spread to the through hole 201 and the lead terminal 101 is cured.

  In the above-mentioned soldering method, when the flux used for the flux solder H is the flux of the present embodiment, the flux contains a solid solvent or a phenolic solid solvent, or a solid solvent and a phenolic solid solvent. Thus, the flux can be made solid or have a predetermined high viscosity. Thereby, it is suitable as a flux for the cored solder.

  Further, the solid solvent and the phenol-based solid solvent have volatility in a heat history assumed in soldering. On the other hand, even when rosin is not contained or rosin is contained, the amount of rosin can be reduced to 30 wt% or less, and the flux can be made solid or have a predetermined high viscosity, and the rosin content can be reduced.

  Thereby, the amount of flux in the solder H supplied to the through hole 2 of the soldering iron 1A and remaining as a residue after heating is suppressed. Therefore, in a state where the soldering iron 1A is controlled to maintain a predetermined temperature exceeding the melting point of the solder, the solder H is supplied to the through hole 2 and the soldering is continuously performed. Accumulation of the residual carbide in the through-hole 2 is suppressed, and the occurrence of problems such as clogging of the through-hole 2 of the soldering iron 1A with the residual carbide can be suppressed.

  Fluxes of Examples and Comparative Examples were prepared with the compositions shown in Tables 1 and 2 below, and the amount of residues and workability were verified. The composition ratios in Tables 1 and 2 are wt (% by weight)% when the total amount of flux is 100.

<Evaluation of residue amount>
(1) Verification method As a test evaluation method by the TG method (thermogravimetry), an aluminum pan was packed with 10 mg of the flux of each example and each comparative example, and 25 ° C. under N ₂ atmosphere using a TGD9600 manufactured by ULVAC. The heating was performed at a heating rate of 10 ° C./min to 350 ° C. It was measured whether the weight of each flux after heating was 15% or less of that before heating.

(2) Criteria ：: Weight decreased to 15% or less before heating X: Weight was greater than 15% before heating

  It can be said that, in a flux whose weight after heating is 15% or less of that before heating, the components in the flux are sufficiently volatilized by heating. It can be said that the flux whose weight was larger than 15% before heating was insufficient in volatilization of the components in the flux. When flux with insufficient volatilization is used for the solder that enters the solder and is applied to the above-mentioned soldering method, a large amount of residual carbide deposits in the through holes of the soldering iron, and the solder cannot be supplied normally. It causes the troubles such as.

<Evaluation of workability>
(1) Verification Method Using the fluxes of Examples and Comparative Examples as samples, the state at 25 ° C. was observed to determine whether the flux was solid or liquid. When the flux was a liquid, the flux was sandwiched between plates of a rheometer (Thermo Scientific HAAKE MARS III ™), and the viscosity of the flux was measured by rotating the plate at 6 Hz. Then, the workability in producing the flux cored solder was evaluated according to the following criteria.

(2) Evaluation Criteria: The state at 25 ° C. was solid. Alternatively, although the state at 25 ° C. is a liquid, the viscosity measured by a rheometer was 3500 Pa · s or more. Although the state of the flux at 25 ° C. was solid or the state at 25 ° C. was liquid, if the viscosity measured by a rheometer was 3500 Pa · s or more, the flux was able to form a solder.
×: The liquid at 25 ° C. was liquid, and the viscosity measured with a rheometer was less than 3500 Pa · s. When the state of the flux at 25 ° C. was a liquid and the viscosity measured by a rheometer was less than 3500 Pa · s, the flux flowed, and the flux was not able to be formed to form a solder.

<Comprehensive evaluation>
〇: Both the residue amount and the evaluation of workability were 〇. X: Any or all of the residue amount and the evaluation of workability were ×.

  In Example 1, which contained 95 wt% of neopentyl glycol as a solid solvent within the range specified by the present invention and 5 wt% of adipic acid as the organic acid within the range specified by the present invention, the state at 25 ° C. was solid. Alternatively, even when the liquid at 25 ° C. was liquid, the viscosity was 3500 Pa · s or more, and a sufficient effect was obtained on the workability in producing a solder paste. Further, when the amount of the residue was 15 wt% or less, a sufficient effect of suppressing the amount of the residue and reducing the residue was obtained.

  A combination of two or more organic acids containing neopentyl glycol as a solid solvent in a reduced amount within the range specified in the present invention and containing 70 wt%, adipic acid as an organic acid 5 wt% and eicosane diacid 25 wt%. Also in Example 2, which was within the range defined by, a sufficient effect on workability was obtained. In addition, a sufficient effect of suppressing the amount of the residue and reducing the residue was obtained.

  As a solid solvent, neopentyl glycol is included in the range specified in the present invention in an increased amount of 99.5 wt%, and N, N-diethylaniline hydrobromide is specified as the amine hydrohalide in the range specified in the present invention. In Example 3 containing 0.5 wt% of the above, a sufficient effect on workability was obtained. In addition, a sufficient effect of suppressing the amount of the residue and reducing the residue was obtained.

  Even in Example 4, which contains 95% by weight of dioxane glycol as a solid solvent within the range specified by the present invention and 5% by weight of adipic acid as the organic acid within the range specified by the present invention, it has a sufficient effect on processability. was gotten. In addition, a sufficient effect of suppressing the amount of the residue and reducing the residue was obtained.

  95% by weight of 4- (1,1,3,3-tetramethylbutyl) phenol as a phenolic solid solvent within the range specified by the present invention, and adipic acid as an organic acid within the range specified by the present invention. In Example 5 containing 5 wt%, a sufficient effect on workability was obtained. In addition, a sufficient effect of suppressing the amount of the residue and reducing the residue was obtained.

  Even in Example 6, which contains 95% by weight of catechol as the phenolic solid solvent within the range specified by the present invention and 5% by weight of adipic acid as the organic acid within the range specified by the present invention, sufficient for workability. The effect was obtained. In addition, a sufficient effect of suppressing the amount of the residue and reducing the residue was obtained.

  Example 7 containing 100% by weight of 4- (1,1,3,3-tetramethylbutyl) phenol as a phenolic solid solvent within the range specified in the present invention and containing no other activator such as an organic acid. Sufficient effects were obtained on workability. In addition, a sufficient effect of suppressing the amount of the residue and reducing the residue was obtained.

  In Example 8, which contained 100 wt% of catechol as a phenolic solid solvent within the range specified in the present invention and did not contain other activators such as organic acids, a sufficient effect on processability was obtained. In addition, a sufficient effect of suppressing the amount of the residue and reducing the residue was obtained.

  70% by weight of neopentyl glycol as a solid solvent within the range specified in the present invention, and 4- (1,1,3,3-tetramethylbutyl) phenol as a phenolic solid solvent within the range specified by the present invention. In Example 9 which contained 30% by weight of the same and no other activator such as an organic acid, a sufficient effect on the processability was obtained. In addition, a sufficient effect of suppressing the amount of the residue and reducing the residue was obtained.

  Even in Example 10 containing 95 wt% of neopentyl glycol as a solid solvent within the range specified in the present invention and 5 wt% of pimelic acid as the organic acid within the range specified in the present invention, sufficient for workability. The effect was obtained. In addition, a sufficient effect of suppressing the amount of the residue and reducing the residue was obtained.

  Even in Example 11, which contains 95 wt% of neopentyl glycol as a solid solvent within the range specified in the present invention and 5 wt% of suberic acid as the organic acid within the range specified in the present invention, sufficient workability can be obtained. The effect was obtained. In addition, a sufficient effect of suppressing the amount of the residue and reducing the residue was obtained.

  Even in Example 12, which contains 95% by weight of neopentyl glycol as a solid solvent within the range specified in the present invention and 5% by weight of dodecane diacid as the organic acid within the range specified in the present invention, sufficient workability can be obtained. Effect was obtained. In addition, a sufficient effect of suppressing the amount of the residue and reducing the residue was obtained.

  95% by weight of 4- (1,1,3,3-tetramethylbutyl) phenol as a phenolic solid solvent within the range specified in the present invention, and 2-phenylimidazole as an amine within the range specified in the present invention. In Example 13 containing 5 wt%, a sufficient effect on workability was obtained. In addition, a sufficient effect of suppressing the amount of the residue and reducing the residue was obtained.

  Contains 96% by weight of neopentyl glycol as a solid solvent within the range specified in the present invention, and 4% by weight of N, N-diethylaniline hydrobromide as the amine hydrohalide in the range specified by the present invention. In Example 14 including the above, a sufficient effect on workability was obtained. In addition, a sufficient effect of suppressing the amount of the residue and reducing the residue was obtained.

  90% by weight of 4- (1,1,3,3-tetramethylbutyl) phenol as a phenolic solid solvent within the range specified in the present invention, and 2,2,2-tribromoethanol as an organic halogen compound. Even in Example 15 containing 10 wt% within the range specified by the invention, a sufficient effect on workability was obtained. In addition, a sufficient effect of suppressing the amount of the residue and reducing the residue was obtained.

  99% by weight of 4- (1,1,3,3-tetramethylbutyl) phenol as a phenolic solid solvent within the range specified in the present invention, and trans-2,3-dibromo-2-butene as an organic halogen compound In Example 16 containing 1 wt% of -1,4-diol within the range specified in the present invention, a sufficient effect on the processability was obtained. In addition, a sufficient effect of suppressing the amount of the residue and reducing the residue was obtained.

  99% by weight of 4- (1,1,3,3-tetramethylbutyl) phenol as a phenolic solid solvent within the range specified in the present invention, and triallyl isocyanurate hexabromide as an organic halogen compound specified in the present invention. Even in Example 17 containing 1 wt% within the range, a sufficient effect on workability was obtained. In addition, a sufficient effect of suppressing the amount of the residue and reducing the residue was obtained.

  90% by weight of neopentyl glycol as a solid solvent within the range specified by the present invention, 5% by weight of adipic acid as an organic acid within the range specified by the present invention, and dimethyl silicone oil as a silicone specified by the present invention. Also in Example 18 containing 5 wt% within the range, a sufficient effect on workability was obtained. In addition, a sufficient effect of suppressing the amount of the residue and reducing the residue was obtained.

  It contains 85% by weight of neopentyl glycol as a solid solvent within the range specified by the present invention, contains 5% by weight of adipic acid as an organic acid within the range specified by the present invention, and contains isodecyl acid phosphate as an organic phosphorus compound. Even in Example 19 containing 10 wt% within the range specified by the invention, a sufficient effect on workability was obtained. In addition, a sufficient effect of suppressing the amount of the residue and reducing the residue was obtained.

  Contains 92% by weight of neopentyl glycol as a solid solvent within the range specified by the present invention, contains 5% by weight of adipic acid as an organic acid within the range specified by the present invention, and specifies an acrylic polymer as an antifoaming agent by the present invention. Even in Example 20 containing 3 wt% within the range to be obtained, a sufficient effect on workability was obtained. In addition, a sufficient effect of suppressing the amount of the residue and reducing the residue was obtained.

  90% by weight of neopentyl glycol as a solid solvent within the range specified in the present invention, 5% by weight of hydrogenated rosin as a rosin derivative within the range specified in the present invention, and eicosaninic acid as an organic acid in the present invention. Even in Example 21 containing 5 wt% within the range, a sufficient effect on workability was obtained. In addition, a sufficient effect of suppressing the amount of the residue and reducing the residue was obtained.

  It contains 85% by weight of neopentyl glycol as a solid solvent within the range specified by the present invention, contains 10% by weight of hydrogenated rosin as a rosin derivative within the range specified by the present invention, and specifies eicosaninic acid as an organic acid by the present invention. Also in Example 22 containing 5 wt% in the range to be performed, a sufficient effect on workability was obtained. In addition, a sufficient effect of suppressing the amount of the residue and reducing the residue was obtained.

  70% by weight of 4- (1,1,3,3-tetramethylbutyl) phenol as a phenolic solid solvent within the range specified in the present invention, and hydrogenated rosin as a rosin derivative within the range specified in the present invention. In Example 23 containing 30 wt%, a sufficient effect on workability was obtained. In addition, a sufficient effect of suppressing the amount of the residue and reducing the residue was obtained.

  Contains 90 wt% of 4- (1,1,3,3-tetramethylbutyl) phenol as a phenolic solid solvent within the range specified by the present invention, and 5 wt% of natural rosin within the range specified by the present invention. Also, in Example 24 containing eicosaninic acid as an organic acid in an amount of 5 wt% within the range specified in the present invention, a sufficient effect on workability was obtained. In addition, a sufficient effect of suppressing the amount of the residue and reducing the residue was obtained.

  90% by weight of 4- (1,1,3,3-tetramethylbutyl) phenol as a phenolic solid solvent within the range specified in the present invention, and polymerized rosin as a rosin derivative within a range specified in the present invention. Even in Example 25 containing 5 wt% and eicosanoic acid as an organic acid at 5 wt% within the range specified in the present invention, a sufficient effect on workability was obtained. In addition, a sufficient effect of suppressing the amount of the residue and reducing the residue was obtained.

  4- (1,1,3,3-tetramethylbutyl) phenol is contained as a phenolic solid solvent in an amount specified in the present invention at 90 wt%, and disproportionated rosin as a rosin derivative is specified in the present invention. In Example 26 containing 5% by weight of eicosanoic acid as the organic acid within the range specified in the present invention, a sufficient effect on workability was obtained. In addition, a sufficient effect of suppressing the amount of the residue and reducing the residue was obtained.

  4- (1,1,3,3-tetramethylbutyl) phenol is contained as a phenolic solid solvent in an amount of 90 wt% within the range specified in the present invention, and hydrogenated disproportionated rosin is specified in the present invention as a rosin derivative. Also in Example 27 containing 5 wt% in the range specified in the above and eicosaninic acid as the organic acid in the range specified in the present invention in 5 wt%, a sufficient effect on workability was obtained. In addition, a sufficient effect of suppressing the amount of the residue and reducing the residue was obtained.

  4- (1,1,3,3-tetramethylbutyl) phenol is contained as a phenolic solid solvent in an amount specified in the present invention by 90 wt%, and acrylic acid-modified rosin is specified in the present invention as a rosin derivative. In Example 28, which contained 5 wt% of the organic acid and 5 wt% of eicosanoic acid as the organic acid within the range specified in the present invention, a sufficient effect on workability was obtained. In addition, a sufficient effect of suppressing the amount of the residue and reducing the residue was obtained.

  4- (1,1,3,3-tetramethylbutyl) phenol is contained as a phenolic solid solvent in an amount of 90 wt% within the range specified in the present invention, and acrylic acid-modified hydrogenated rosin is specified in the present invention as a rosin derivative. Also in Example 29 containing 5 wt% within the range specified in the range and 5 wt% eicosanoic acid as the organic acid within the range specified in the present invention, a sufficient effect on workability was obtained. In addition, a sufficient effect of suppressing the amount of the residue and reducing the residue was obtained.

  As a phenolic solid solvent, 4- (1,1,3,3-tetramethylbutyl) phenol is contained in an amount specified in the present invention at 90 wt%, and a rosin ester is used as a rosin derivative in an amount specified in the present invention. In Example 30 containing 5 wt% and eicosaninic acid as an organic acid in a range specified in the present invention, 5 wt% also showed a sufficient effect on workability. In addition, a sufficient effect of suppressing the amount of the residue and reducing the residue was obtained.

  4- (1,1,3,3-tetramethylbutyl) phenol is contained as a phenolic solid solvent in an amount of 75 wt% within the range specified in the present invention, 5 wt% of natural rosin, 5 wt% of polymerized rosin as a rosin derivative, 5 wt% of disproportionated rosin and 5 wt% of acrylic acid-modified rosin, a combination of two or more rosins is within the range specified in the present invention, and eicosaninic acid as an organic acid is within the range specified in the present invention. In Example 31 containing 5 wt%, a sufficient effect on workability was obtained. In addition, a sufficient effect of suppressing the amount of the residue and reducing the residue was obtained.

  75% by weight of 4- (1,1,3,3-tetramethylbutyl) phenol as a phenolic solid solvent within the range specified in the present invention; 5% by weight of hydrogenated rosin as a rosin derivative; A combination of two or more rosins containing 5 wt% of rosin, 5 wt% of acrylic acid-modified hydrogenated rosin, and 5 wt% of rosin ester is within the range specified in the present invention, and eicosaninic acid as an organic acid in the present invention. Even in Example 32 containing 5 wt% within the specified range, a sufficient effect on workability was obtained. In addition, a sufficient effect of suppressing the amount of the residue and reducing the residue was obtained.

  On the other hand, neopentyl glycol is contained as a solid solvent in an amount of 50 wt% below the range specified in the present invention, and as a rosin derivative, acrylic acid-modified rosin is contained in an amount of 45 wt% exceeding the range specified in the present invention. In Comparative Example 1 containing 5 wt% of eicosanoic acid within the range specified in the present invention, the effect of reducing the residue was obtained, but the liquid at 25 ° C. had a viscosity of less than 3500 Pa · s. No sufficient effect was obtained on the workability when producing solder.

  4- (1,1,3,3-tetramethylbutyl) phenol is contained as a phenolic solid solvent at 50 wt% below the range specified in the present invention, and polymerized rosin as a rosin derivative exceeds the range specified in the present invention. In Comparative Example 2 containing 45% by weight and eicosanoic acid as an organic acid at 5% by weight within the range specified in the present invention, the residue amount exceeded 15% by weight, and the effect of reducing the residue amount was not obtained because the residue amount could not be suppressed. Did not. In addition, a sufficient effect on workability was not obtained.

  In Comparative Example 3 which does not contain a solid solvent or a phenolic solid solvent, contains 40 wt% of hexyldiglycol as a solvent, contains 50 wt% of natural rosin, and contains 10 wt% of eicosaninic acid as an organic acid, the effect of reducing the residue is obtained. However, a sufficient effect on workability was not obtained.

  From the above, a flux containing 70 wt% to 99.5 wt% of the solid solvent, 0.5 wt% to 30 wt% of the activator, 70 wt% to 100 wt% of the phenolic solid solvent, and 0 wt% or more of the activator A flux containing 30 wt% or less, a solid solvent of 70 wt% or more and 99.5 wt% or less, a phenolic solid solvent of more than 0 wt% to 30 wt% or less, and an activator of 0 wt% or more and 30 wt% or less. With the used cored solder and flux coat solder, the effect of suppressing the amount of residue was obtained. Further, an effect of improving workability was obtained.

  These effects were not inhibited even when rosins and additives were contained within the range specified in the present invention.

Therefore, the present invention is directed to a flux for a solder which is filled with a flux and contains a solid solvent in an amount of 70 wt% to 99.5 wt%, an activator in an amount of 0.5 wt% to 30 wt%, It is a flux for soldering that contains no solvent and has a weight of 15% or less of the weight before heating at a heating rate of 10 ° C./min from 25 ° C. to 350 ° C. in an N ₂ atmosphere. . Also, a flux for a flux-coated solder coated with a solder, comprising a solid solvent of 70 wt% or more and 99.5 wt% or less, an activator of 0.5 wt% or more and 30 wt% or less, and no liquid solvent , It is a flux for a flux coat solder that weighs 15% or less of the weight before heating after heating at a rate of 10 ° C./min from 25 ° C. to 350 ° C. in an N ₂ atmosphere .

Further, the present invention is a flux for a cored solder in which a flux is filled in a solder, which contains a phenol-based solid solvent in an amount of 70 wt% to 100 wt%, an activator in an amount of 0 wt% to 30 wt%, and a liquid solvent. excluding, to 25 ° C. to 350 ° C. under a N ₂ atmosphere, the weight after heating at a Atsushi Nobori rate 10 ° C. / min is a flux for solder enters at most 15% of the pre-heating or. Further, a flux for flux coated solder solder is coated with a flux, phenolic solid solvent or 70 wt% 100 wt% or less, comprising an active agent or less 0 wt% or more 30 wt%, excluding the liquid solvent, _{N 2} It is a flux for soldering a flux coat solder that weighs 15% or less of that before heating at a rate of 10 ° C./min from 25 ° C. to 350 ° C. in an atmosphere .

Further, the present invention relates to a flux for a cored solder in which a flux is filled in a solder, wherein the phenol-based solid solvent is more than 0 wt% to 30 wt% or less, and the solid solvent other than the phenol-based solid solvent is 70 wt% to 99 wt%. 5% by weight or less, 0% by weight or more and 30% by weight or less of an activator, not containing a liquid solvent, and heated from 25 ° C. to 350 ° C. in a N ₂ atmosphere at a rate of 10 ° C./min. It is a flux for cored solder that is 15% or less of the previous . Further, the present invention relates to a flux for soldering a flux-coated solder, wherein the flux is coated with a phenol-based solid solvent in an amount of more than 0 wt% to 30 wt% or less and a solid solvent other than the phenol-based solid solvent in a content of 70 wt% to 99.5 wt%. %, An activator is contained in an amount of 0 wt% or more and 30 wt% or less, a liquid solvent is not contained , and the weight after heating at a temperature increasing rate of 10 ° C / min from 25 ° C to 350 ° C in an N ₂ atmosphere is before heating. 15% or less of the flux for a flux coat solder.

Further, the present invention includes a solid solvent of 70 wt% or more and 99.5 wt% or less, an activator of 0.5 wt% or more and 30 wt% or less, no liquid solvent, and a temperature rise from 25 ° C. to 350 ° C. under N ₂ atmosphere. The flux after heating at a temperature rate of 10 ° C./min is less than 15% of the weight before heating. This is a soldering method in which solder is heated by a soldering iron to heat an object to be joined and to melt the solder.

Furthermore, the present invention includes a phenolic solid solvent of 70 wt% to 100 wt%, an activator of 0 wt% to 30 wt%, no liquid solvent, and a heating rate of 25 ° C. to 350 ° C. under N ₂ atmosphere. Using a flux-filled solder consisting of a flux-filled solder whose weight after heating at 10 ° C./min is 15% or less of that before heating, using a flux-hardened solder until the temperature exceeds the melting point of the solder. This is a soldering method in which a soldering iron is used to heat an object to be joined and melt the solder.

Further, the present invention includes a phenolic solid solvent of more than 0 wt% and 30 wt% or less, a solid solvent other than the phenolic solid solvent of 70 wt% or more and 99.5 wt% or less, and an activator of 0 wt% or more and 30 wt% or less. Not included , the flux after heating at a rate of 10 ° C./min from 25 ° C. to 350 ° C. in an N ₂ atmosphere is less than 15% of the weight before heating. This is a soldering method in which the solder is heated with a soldering iron to a temperature exceeding the melting point of the solder using a solder to heat the joining object and to melt the solder.

Claims (15)

70 wt% or more and 99.5 wt% or less of a solid solvent,
An activator containing 0.5 wt% or more and 30 wt% or less,
Flux for flux cored solder, characterized in that flux containing no liquid solvent is filled into the solder. Phenol-based solid solvent is 70 wt% or more and 100 wt% or less,
Containing 0 wt% or more and 30 wt% or less of an activator,
Flux for flux cored solder, characterized in that flux containing no liquid solvent is filled into the solder. More than 0 wt% and less than 30 wt% phenolic solid solvent,
70 wt% or more and 99.5 wt% or less of a solid solvent other than the phenolic solid solvent,
Containing 0 wt% or more and 30 wt% or less of an activator,
Flux for flux cored solder, characterized in that flux containing no liquid solvent is filled into the solder. The flux for a cored solder according to any one of claims 1 to 3, wherein the flux is a solid or a liquid having a viscosity of 3500 Pa · s or more at 25 ° C. The activator is any one of an organic acid, an amine, an organic halogen compound, and an amine hydrohalide, or a combination of two or more of an organic acid, an amine, an organic halogen compound, and an amine hydrohalide. The flux according to any one of claims 1 to 4, wherein the flux is for a solder for soldering. 70 wt% or more and 99.5 wt% or less of a solid solvent,
An activator containing 0.5 wt% or more and 30 wt% or less,
A flux for flux-coated solder, wherein the solder is coated with a flux that does not contain a liquid solvent. A phenolic solid solvent of 70 wt% to 100 wt%,
Containing 0 wt% or more and 30 wt% or less of an activator,
A flux for flux-coated solder, wherein the solder is coated with a flux that does not contain a liquid solvent. More than 0 wt% to 30 wt% or less of phenolic solid solvent,
70 wt% or more and 99.5 wt% or less of a solid solvent other than the phenolic solid solvent,
Containing 0 wt% or more and 30 wt% or less of an activator,
A flux for flux-coated solder, wherein the solder is coated with a flux that does not contain a liquid solvent. The flux for a flux coated solder according to any one of claims 6 to 8, wherein the flux is a liquid having a solid or a viscosity of 3500 Pa · s or more at 25 ° C. The activator is any one of an organic acid, an amine, an organic halogen compound, and an amine hydrohalide, or a combination of two or more of an organic acid, an amine, an organic halogen compound, and an amine hydrohalide. The flux for a flux-coated solder according to any one of claims 6 to 9, wherein: A flux cored solder, wherein the flux for flux cored solder according to any one of claims 1 to 5 is filled in the solder. A flux coat solder, wherein the solder is coated with the flux coat solder flux according to any one of claims 6 to 10. A flux cored solder containing 70 wt% to 99.5 wt% of solid solvent, 0.5 wt% to 30 wt% of activator, and not containing a liquid solvent is used. A soldering method, wherein the solder is heated with a soldering iron to a temperature exceeding the temperature of the soldering iron to heat the joining object and to melt the solder. A flux cored solder containing a phenolic solid solvent of 70 wt% to 100 wt%, an activator of 0 wt% to 30 wt%, and containing no liquid solvent is used. A soldering method, wherein the solder is heated to a temperature by a soldering iron to heat an object to be joined and to melt the solder. Flux containing more than 0 wt% of phenolic solid solvent and less than 30 wt%, 70 wt% to 99.5 wt% of solid solvent other than phenolic solid solvent, 0 wt% to 30 wt% of activator, and no liquid solvent Using a cored solder made of solder, the cored solder is heated with a soldering iron until the temperature exceeds the melting point of the solder, and the joining object is heated and the cored solder is melted. A soldering method characterized by performing the following.

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