JP2019537656A5 - - Google Patents
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- Publication number
- JP2019537656A5 JP2019537656A5 JP2019535197A JP2019535197A JP2019537656A5 JP 2019537656 A5 JP2019537656 A5 JP 2019537656A5 JP 2019535197 A JP2019535197 A JP 2019535197A JP 2019535197 A JP2019535197 A JP 2019535197A JP 2019537656 A5 JP2019537656 A5 JP 2019537656A5
- Authority
- JP
- Japan
- Prior art keywords
- ether
- epoxidized
- mercaptan
- inositol
- oil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- RTZKZFJDLAIYFH-UHFFFAOYSA-N diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 194
- 239000000203 mixture Substances 0.000 claims description 100
- -1 cyclic alkene Chemical class 0.000 claims description 76
- 150000003505 terpenes Chemical class 0.000 claims description 46
- 235000007586 terpenes Nutrition 0.000 claims description 37
- XMGQYMWWDOXHJM-UHFFFAOYSA-N (+-)-(RS)-limonene Chemical compound CC(=C)C1CCC(C)=CC1 XMGQYMWWDOXHJM-UHFFFAOYSA-N 0.000 claims description 34
- HRDCVMSNCBAMAM-UHFFFAOYSA-N 3-prop-2-ynoxyprop-1-yne Chemical compound C#CCOCC#C HRDCVMSNCBAMAM-UHFFFAOYSA-N 0.000 claims description 25
- 239000000843 powder Substances 0.000 claims description 23
- 239000004593 Epoxy Substances 0.000 claims description 19
- 239000000600 sorbitol Substances 0.000 claims description 19
- 150000001345 alkine derivatives Chemical class 0.000 claims description 16
- 238000007639 printing Methods 0.000 claims description 16
- GYZLOYUZLJXAJU-UHFFFAOYSA-N Diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 14
- 125000004386 diacrylate group Chemical group 0.000 claims description 11
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims description 10
- 239000004952 Polyamide Substances 0.000 claims description 10
- PEDCQBHIVMGVHV-UHFFFAOYSA-N glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 10
- 229920002647 polyamide Polymers 0.000 claims description 10
- 239000011528 polyamide (building material) Substances 0.000 claims description 10
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-tris(prop-2-enoxy)-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 229920000642 polymer Polymers 0.000 claims description 9
- ZFSLODLOARCGLH-UHFFFAOYSA-N Cyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims description 8
- 239000003999 initiator Substances 0.000 claims description 8
- DLDJFQGPPSQZKI-UHFFFAOYSA-N 1,4-Butynediol Chemical compound OCC#CCO DLDJFQGPPSQZKI-UHFFFAOYSA-N 0.000 claims description 7
- XPTMJJIPRSWBDK-UHFFFAOYSA-N 3-prop-2-ynylsulfanylprop-1-yne Chemical compound C#CCSCC#C XPTMJJIPRSWBDK-UHFFFAOYSA-N 0.000 claims description 7
- HECLRDQVFMWTQS-UHFFFAOYSA-N Dicyclopentadiene Chemical compound C1C2C3CC=CC3C1C=C2 HECLRDQVFMWTQS-UHFFFAOYSA-N 0.000 claims description 7
- ZHOBJWVNWMQMLF-UHFFFAOYSA-N N,N-bis(prop-2-ynyl)prop-2-yn-1-amine Chemical compound C#CCN(CC#C)CC#C ZHOBJWVNWMQMLF-UHFFFAOYSA-N 0.000 claims description 7
- RGSODMOUXWISAG-UHFFFAOYSA-N N-prop-2-ynylprop-2-yn-1-amine Chemical compound C#CCNCC#C RGSODMOUXWISAG-UHFFFAOYSA-N 0.000 claims description 7
- TVDSBUOJIPERQY-UHFFFAOYSA-N Propargyl alcohol Chemical compound OCC#C TVDSBUOJIPERQY-UHFFFAOYSA-N 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- SUNXFMPZAFGPFW-UHFFFAOYSA-N 2-methyl-5-(1-sulfanylpropan-2-yl)cyclohexane-1-thiol Chemical compound SCC(C)C1CCC(C)C(S)C1 SUNXFMPZAFGPFW-UHFFFAOYSA-N 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 5
- 229910052588 hydroxylapatite Inorganic materials 0.000 claims description 5
- 239000011858 nanopowder Substances 0.000 claims description 5
- 239000004576 sand Substances 0.000 claims description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 5
- 229910052721 tungsten Inorganic materials 0.000 claims description 5
- 239000010937 tungsten Substances 0.000 claims description 5
- 239000002202 Polyethylene glycol Substances 0.000 claims description 4
- 229920001223 polyethylene glycol Polymers 0.000 claims description 4
- JKANAVGODYYCQF-UHFFFAOYSA-N prop-2-yn-1-amine Chemical compound NCC#C JKANAVGODYYCQF-UHFFFAOYSA-N 0.000 claims description 4
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-Dimethoxy-2-phenylacetophenone Chemical group C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- SDRZFSPCVYEJTP-UHFFFAOYSA-N 1-ethenylcyclohexene Chemical compound C=CC1=CCCCC1 SDRZFSPCVYEJTP-UHFFFAOYSA-N 0.000 claims description 2
- 239000003054 catalyst Substances 0.000 claims description 2
- 229960000367 Inositol Drugs 0.000 claims 51
- CDAISMWEOUEBRE-GPIVLXJGSA-N Inositol Chemical compound O[C@H]1[C@H](O)[C@@H](O)[C@H](O)[C@H](O)[C@@H]1O CDAISMWEOUEBRE-GPIVLXJGSA-N 0.000 claims 45
- FPIPGXGPPPQFEQ-OVSJKPMPSA-N all-trans-retinol Chemical compound OC\C=C(/C)\C=C\C=C(/C)\C=C\C1=C(C)CCCC1(C)C FPIPGXGPPPQFEQ-OVSJKPMPSA-N 0.000 claims 30
- ATVJXMYDOSMEPO-UHFFFAOYSA-N 3-prop-2-enoxyprop-1-ene Chemical compound C=CCOCC=C ATVJXMYDOSMEPO-UHFFFAOYSA-N 0.000 claims 18
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 claims 18
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 claims 18
- 239000004205 dimethyl polysiloxane Substances 0.000 claims 15
- 125000003700 epoxy group Chemical group 0.000 claims 15
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims 15
- 235000020944 retinol Nutrition 0.000 claims 15
- 239000011607 retinol Substances 0.000 claims 15
- 229960003471 retinol Drugs 0.000 claims 15
- QYKIQEUNHZKYBP-UHFFFAOYSA-N vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims 15
- 229960000834 vinyl ether Drugs 0.000 claims 15
- MOYAFQVGZZPNRA-UHFFFAOYSA-N 1,4(8)-p-menthadiene Chemical compound CC(C)=C1CCC(C)=CC1 MOYAFQVGZZPNRA-UHFFFAOYSA-N 0.000 claims 12
- 150000001336 alkenes Chemical class 0.000 claims 12
- 229930009668 farnesenes Natural products 0.000 claims 12
- DKIDEFUBRARXTE-UHFFFAOYSA-M 3-mercaptopropionate Chemical compound [O-]C(=O)CCS DKIDEFUBRARXTE-UHFFFAOYSA-M 0.000 claims 10
- 229960002747 Betacarotene Drugs 0.000 claims 9
- JFNLZVQOOSMTJK-UHFFFAOYSA-N Norbornene Chemical compound C1C2CCC1C=C2 JFNLZVQOOSMTJK-UHFFFAOYSA-N 0.000 claims 9
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 9
- OENHQHLEOONYIE-VYAWBVGESA-N beta-Carotene Natural products CC=1CCCC(C)(C)C=1\C=C\C(\C)=C/C=C/C(/C)=C\C=C\C=C(\C)/C=C/C=C(/C)\C=C\C1=C(C)CCCC1(C)C OENHQHLEOONYIE-VYAWBVGESA-N 0.000 claims 9
- 235000013734 beta-carotene Nutrition 0.000 claims 9
- 239000011648 beta-carotene Substances 0.000 claims 9
- 229930007907 citral Natural products 0.000 claims 9
- 229940043350 citral Drugs 0.000 claims 9
- 239000002285 corn oil Substances 0.000 claims 9
- 235000005687 corn oil Nutrition 0.000 claims 9
- CERQOIWHTDAKMF-UHFFFAOYSA-M methacrylate group Chemical group C(C(=C)C)(=O)[O-] CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims 9
- WTEVQBCEXWBHNA-YFHOEESVSA-N neral Chemical compound CC(C)=CCC\C(C)=C/C=O WTEVQBCEXWBHNA-YFHOEESVSA-N 0.000 claims 9
- 229930006978 terpinenes Natural products 0.000 claims 9
- OENHQHLEOONYIE-JLTXGRSLSA-N β-Carotene Chemical compound CC=1CCCC(C)(C)C=1\C=C\C(\C)=C\C=C\C(\C)=C\C=C\C=C(/C)\C=C\C=C(/C)\C=C\C1=C(C)CCCC1(C)C OENHQHLEOONYIE-JLTXGRSLSA-N 0.000 claims 9
- DTOSIQBPPRVQHS-PDBXOOCHSA-N α-linolenic acid Chemical compound CC\C=C/C\C=C/C\C=C/CCCCCCCC(O)=O DTOSIQBPPRVQHS-PDBXOOCHSA-N 0.000 claims 8
- CCEFMUBVSUDRLG-BBBLOLIVSA-N (+)-trans-limonene oxide Chemical compound C1[C@H](C(=C)C)CC[C@]2(C)O[C@@H]21 CCEFMUBVSUDRLG-BBBLOLIVSA-N 0.000 claims 6
- AAWZDTNXLSGCEK-WYWMIBKRSA-M (-)-quinate Chemical compound O[C@@H]1C[C@](O)(C([O-])=O)C[C@@H](O)[C@H]1O AAWZDTNXLSGCEK-WYWMIBKRSA-M 0.000 claims 6
- CCEFMUBVSUDRLG-KXUCPTDWSA-N (4R)-limonene 1,2-epoxide Natural products C1[C@H](C(=C)C)CC[C@@]2(C)O[C@H]21 CCEFMUBVSUDRLG-KXUCPTDWSA-N 0.000 claims 6
- WXZMFSXDPGVJKK-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims 6
- PUGOMSLRUSTQGV-UHFFFAOYSA-N 2,3-di(prop-2-enoyloxy)propyl prop-2-enoate Chemical compound C=CC(=O)OCC(OC(=O)C=C)COC(=O)C=C PUGOMSLRUSTQGV-UHFFFAOYSA-N 0.000 claims 6
- HCLJOFJIQIJXHS-UHFFFAOYSA-N 2-[2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOCCOC(=O)C=C HCLJOFJIQIJXHS-UHFFFAOYSA-N 0.000 claims 6
- HIGURUTWFKYJCH-UHFFFAOYSA-N 2-[[1-(oxiran-2-ylmethoxymethyl)cyclohexyl]methoxymethyl]oxirane Chemical compound C1OC1COCC1(COCC2OC2)CCCCC1 HIGURUTWFKYJCH-UHFFFAOYSA-N 0.000 claims 6
- DGVVWUTYPXICAM-UHFFFAOYSA-N 2-mercaptoethanol Chemical compound OCCS DGVVWUTYPXICAM-UHFFFAOYSA-N 0.000 claims 6
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 claims 6
- 229940114079 Arachidonic Acid Drugs 0.000 claims 6
- YZXBAPSDXZZRGB-DOFZRALJSA-N Arachidonic acid Chemical group CCCCC\C=C/C\C=C/C\C=C/C\C=C/CCCC(O)=O YZXBAPSDXZZRGB-DOFZRALJSA-N 0.000 claims 6
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 claims 6
- 239000005792 Geraniol Substances 0.000 claims 6
- GLZPCOQZEFWAFX-YFHOEESVSA-N Geraniol Natural products CC(C)=CCC\C(C)=C/CO GLZPCOQZEFWAFX-YFHOEESVSA-N 0.000 claims 6
- CDOSHBSSFJOMGT-UHFFFAOYSA-N Linalool Chemical compound CC(C)=CCCC(C)(O)C=C CDOSHBSSFJOMGT-UHFFFAOYSA-N 0.000 claims 6
- OYHQOLUKZRVURQ-IXWMQOLASA-N Linoleic acid Natural products CCCCC\C=C/C\C=C\CCCCCCCC(O)=O OYHQOLUKZRVURQ-IXWMQOLASA-N 0.000 claims 6
- DYUWTXWIYMHBQS-UHFFFAOYSA-N N-prop-2-enylprop-2-en-1-amine Chemical compound C=CCNCC=C DYUWTXWIYMHBQS-UHFFFAOYSA-N 0.000 claims 6
- 235000019483 Peanut oil Nutrition 0.000 claims 6
- GHMLBKRAJCXXBS-UHFFFAOYSA-N Resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims 6
- 235000019486 Sunflower oil Nutrition 0.000 claims 6
- 235000019498 Walnut oil Nutrition 0.000 claims 6
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 claims 6
- KNSXNCFKSZZHEA-UHFFFAOYSA-N [3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C KNSXNCFKSZZHEA-UHFFFAOYSA-N 0.000 claims 6
- 239000002253 acid Substances 0.000 claims 6
- VKOBVWXKNCXXDE-UHFFFAOYSA-M arachidate Chemical group CCCCCCCCCCCCCCCCCCCC([O-])=O VKOBVWXKNCXXDE-UHFFFAOYSA-M 0.000 claims 6
- 235000021342 arachidonic acid Nutrition 0.000 claims 6
- 235000021302 avocado oil Nutrition 0.000 claims 6
- 239000008163 avocado oil Substances 0.000 claims 6
- 229930003493 bisabolenes Natural products 0.000 claims 6
- KAKZBPTYRLMSJV-UHFFFAOYSA-N butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims 6
- 235000014113 dietary fatty acids Nutrition 0.000 claims 6
- 239000000194 fatty acid Substances 0.000 claims 6
- 229930008393 geraniol Natural products 0.000 claims 6
- 229940113087 geraniol Drugs 0.000 claims 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims 6
- RRHGJUQNOFWUDK-UHFFFAOYSA-N isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 claims 6
- 150000002596 lactones Chemical class 0.000 claims 6
- 239000000944 linseed oil Substances 0.000 claims 6
- 235000021388 linseed oil Nutrition 0.000 claims 6
- 239000003607 modifier Substances 0.000 claims 6
- 239000000312 peanut oil Substances 0.000 claims 6
- 229920001195 polyisoprene Polymers 0.000 claims 6
- FAIDIRVMPHBRLT-UHFFFAOYSA-N propane-1,2,3-triol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OCC(O)CO FAIDIRVMPHBRLT-UHFFFAOYSA-N 0.000 claims 6
- 239000003549 soybean oil Substances 0.000 claims 6
- 235000012424 soybean oil Nutrition 0.000 claims 6
- 239000002600 sunflower oil Substances 0.000 claims 6
- 239000002383 tung oil Substances 0.000 claims 6
- 235000021122 unsaturated fatty acids Nutrition 0.000 claims 6
- 239000008170 walnut oil Substances 0.000 claims 6
- GLZPCOQZEFWAFX-JXMROGBWSA-N β-Geraniol Chemical compound CC(C)=CCC\C(C)=C\CO GLZPCOQZEFWAFX-JXMROGBWSA-N 0.000 claims 6
- 230000032683 aging Effects 0.000 claims 5
- RBHIUNHSNSQJNG-UHFFFAOYSA-N 6-methyl-3-(2-methyloxiran-2-yl)-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2(C)OC2CC1C1(C)CO1 RBHIUNHSNSQJNG-UHFFFAOYSA-N 0.000 claims 4
- IISBACLAFKSPIT-UHFFFAOYSA-N Bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 4
- 229940040452 Linolenate Drugs 0.000 claims 4
- 229960004488 Linolenic Acid Drugs 0.000 claims 4
- 235000020661 alpha-linolenic acid Nutrition 0.000 claims 4
- 239000011248 coating agent Substances 0.000 claims 4
- 238000000576 coating method Methods 0.000 claims 4
- DTOSIQBPPRVQHS-UHFFFAOYSA-N α-Linolenic acid Chemical compound CCC=CCC=CCC=CCCCCCCCC(O)=O DTOSIQBPPRVQHS-UHFFFAOYSA-N 0.000 claims 4
- MXFQRSUWYYSPOC-UHFFFAOYSA-N (2,2-dimethyl-3-prop-2-enoyloxypropyl) prop-2-enoate Chemical compound C=CC(=O)OCC(C)(C)COC(=O)C=C MXFQRSUWYYSPOC-UHFFFAOYSA-N 0.000 claims 3
- JSNRRGGBADWTMC-UHFFFAOYSA-N (6E)-7,11-dimethyl-3-methylene-1,6,10-dodecatriene Chemical compound CC(C)=CCCC(C)=CCCC(=C)C=C JSNRRGGBADWTMC-UHFFFAOYSA-N 0.000 claims 3
- KTRQRAQRHBLCSQ-UHFFFAOYSA-N 1,2,4-tris(ethenyl)cyclohexane Chemical compound C=CC1CCC(C=C)C(C=C)C1 KTRQRAQRHBLCSQ-UHFFFAOYSA-N 0.000 claims 3
- VYMPLPIFKRHAAC-UHFFFAOYSA-N 1,2-Ethanedithiol Chemical compound SCCS VYMPLPIFKRHAAC-UHFFFAOYSA-N 0.000 claims 3
- ZJLMKPKYJBQJNH-UHFFFAOYSA-N 1,3-Propanedithiol Chemical compound SCCCS ZJLMKPKYJBQJNH-UHFFFAOYSA-N 0.000 claims 3
- JXPOEJRNHGFHCM-UHFFFAOYSA-N 1,3-bis(ethenoxy)benzene Chemical compound C=COC1=CC=CC(OC=C)=C1 JXPOEJRNHGFHCM-UHFFFAOYSA-N 0.000 claims 3
- WAATXSSYRJSCIN-UHFFFAOYSA-N 1,4-bis(prop-2-ynyl)piperazine Chemical compound C#CCN1CCN(CC#C)CC1 WAATXSSYRJSCIN-UHFFFAOYSA-N 0.000 claims 3
- VYXHVRARDIDEHS-UHFFFAOYSA-N 1,5-Cyclooctadiene Chemical compound C1CC=CCCC=C1 VYXHVRARDIDEHS-UHFFFAOYSA-N 0.000 claims 3
- YJMDPBAUFKBWSK-UHFFFAOYSA-N 11-methyldodecyl 3-sulfanylpropanoate Chemical compound CC(C)CCCCCCCCCCOC(=O)CCS YJMDPBAUFKBWSK-UHFFFAOYSA-N 0.000 claims 3
- WSMBBUXEEBUYFE-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol;tetrathiolane Chemical compound C1SSSS1.OCC(CO)(CO)CO WSMBBUXEEBUYFE-UHFFFAOYSA-N 0.000 claims 3
- IVIDDMGBRCPGLJ-UHFFFAOYSA-N 2,3-bis(oxiran-2-ylmethoxy)propan-1-ol Chemical compound C1OC1COC(CO)COCC1CO1 IVIDDMGBRCPGLJ-UHFFFAOYSA-N 0.000 claims 3
- BBBUAWSVILPJLL-UHFFFAOYSA-N 2-(2-ethylhexoxymethyl)oxirane Chemical compound CCCCC(CC)COCC1CO1 BBBUAWSVILPJLL-UHFFFAOYSA-N 0.000 claims 3
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 claims 3
- LSWYGACWGAICNM-UHFFFAOYSA-N 2-(prop-2-enoxymethyl)oxirane Chemical compound C=CCOCC1CO1 LSWYGACWGAICNM-UHFFFAOYSA-N 0.000 claims 3
- SYEWHONLFGZGLK-UHFFFAOYSA-N 2-[1,3-bis(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COCC(OCC1OC1)COCC1CO1 SYEWHONLFGZGLK-UHFFFAOYSA-N 0.000 claims 3
- YIJYFLXQHDOQGW-UHFFFAOYSA-N 2-[2,4,6-trioxo-3,5-bis(2-prop-2-enoyloxyethyl)-1,3,5-triazinan-1-yl]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCN1C(=O)N(CCOC(=O)C=C)C(=O)N(CCOC(=O)C=C)C1=O YIJYFLXQHDOQGW-UHFFFAOYSA-N 0.000 claims 3
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 claims 3
- BXYWKXBAMJYTKP-UHFFFAOYSA-N 2-[2-[2-[2-(3-sulfanylpropanoyloxy)ethoxy]ethoxy]ethoxy]ethyl 3-sulfanylpropanoate Chemical compound SCCC(=O)OCCOCCOCCOCCOC(=O)CCS BXYWKXBAMJYTKP-UHFFFAOYSA-N 0.000 claims 3
- VSRMIIBCXRHPCC-UHFFFAOYSA-N 2-[2-[2-[2-[2-(oxiran-2-ylmethoxy)ethoxy]ethoxy]ethoxy]ethoxymethyl]oxirane Chemical compound C1OC1COCCOCCOCCOCCOCC1CO1 VSRMIIBCXRHPCC-UHFFFAOYSA-N 0.000 claims 3
- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 claims 3
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 claims 3
- 229940058020 2-amino-2-methyl-1-propanol Drugs 0.000 claims 3
- GTELLNMUWNJXMQ-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical class OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(CO)(CO)CO GTELLNMUWNJXMQ-UHFFFAOYSA-N 0.000 claims 3
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 claims 3
- JZQHTTYHPIAPCZ-UHFFFAOYSA-N 2-prop-1-en-2-yloxirane Chemical compound CC(=C)C1CO1 JZQHTTYHPIAPCZ-UHFFFAOYSA-N 0.000 claims 3
- 125000001494 2-propynyl group Chemical group [H]C#CC([H])([H])* 0.000 claims 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-K 2qpq Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 claims 3
- YACFFSVYSPMSGS-UHFFFAOYSA-N 3-methoxyprop-1-yne Chemical compound COCC#C YACFFSVYSPMSGS-UHFFFAOYSA-N 0.000 claims 3
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Description
新規な材料、複合材料及び製品の合成を可能にする、調整可能な化学的官能性と物理的特性とを有する硬化性組成物が開発された。具体的な態様は、以下のものを含む。(1)モノマー又はオリゴマーから形成され、硬化されて充填剤及び/又は添加剤を含有する混合物又は複合材料を形成することができる硬化性組成物;(2)そのような硬化性組成物、それから得られる硬化組成物、及びそれらの複合材料の製造方法;(3)そのような硬化性組成物、それから得られる硬化組成物、及びそれらの複合材料から得られる製品の使用方法及び製造方法;(4)そのような化合物、材料、複合材料、及びそれらの組成物から形成される製品。 Curable compositions with adjustable chemical functionality and physical properties have been developed that allow the synthesis of new materials, composites and products. Specific embodiments include: (1) Curable compositions that are formed from monomers or oligomers and can be cured to form mixtures or composites containing fillers and / or additives; (2) Such curable compositions, and then The resulting cured compositions and methods of producing their composites; (3) methods of using and producing such curable compositions, the cured compositions obtained from them, and the products obtained from those composites; 4) Products formed from such compounds, materials, composites, and compositions thereof.
本明細書において「複素環」又は「複素環式」という用語は、3〜10個(好ましくは5〜6個)の環上原子を有する単環式、二重環式又は多環式の環である環状ラジカルであって、炭素原子と1〜4個のヘテロ原子とからなるものを意味する。各ヘテロ原子は、非過酸化酸素、硫黄及びN(Y)からなる群より選ばれ、Yは、無いか、又は、H、O、(C1−C4)アルキル、フェニル又はベンジルである。環状ラジカルは、任意により1〜3個の二重結合を含んでよいし、任意により1又は2以上の置換基で置換されていてよい。複素環式の環の非限定的な例として、ベンゾイミダゾリル、ベンゾフラニル、ベンゾチオフラニル、ベンゾチオフェニル、ベンゾオキサゾリル、ベンゾオキサゾリニル、ベンゾチアゾリル、ベンゾトリアゾリル、ベンゾテトラゾリル、ベンゾイソオキサゾリル、ベンゾイソチアゾリル、ベンゾイミダゾリニル、カルバゾリル、4aH−カルバゾリル、カルボリニル、クロマニル、クロメニル、シンノリニル、デカヒドロキノリニル、2H,6H−1,5,2−ジチアジニル、ジヒドロフロ[2,3−b]テトラヒドロフラン、フラニル、フラザニル、イミダゾリジニル、イミダゾリニル、イミダゾリル、1H−インダゾリル、インドレニル、インドリニル、インドリジニル、インドリル、3H−インドリル、イサチノイル、イソベンゾフラニル、イソクロマニル、イソインダゾリル、イソインドリニル、イソインドリル、イソキノリニル、イソチアゾリル、イソオキサゾリル、メチレンジオキシフェニル、モルホリニル、ナフチリジニル、オクタヒドロイソキノリニル、オキサジアゾリル、1,2,3−オキサジアゾリル、1,2,4−オキサジアゾリル、1,2,5−オキサジアゾリル、1,3,4−オキサジアゾリル、オキサゾリジニル、オキサゾリル、オキシインドリル、ピリミジニル、フェナントリジニル、フェナントロリニル、フェナジニル、フェノチアジニル、フェノキサチニル、フェノキサジニル、フタラジニル、ピペラジニル、ピペリジニル、ピペリドニル、4−ピペリドニル、ピペロニル、プテリジニル、プリニル、ピラニル、ピラジニル、ピラゾリジニル、ピラゾリニル、ピラゾリル、ピリダジニル、ピリドオキサゾール、ピリドイミダゾール、ピリドチアゾール、ピリジニル、ピリジル、ピリミジニル、ピロリジニル、ピロリニル、2H−ピロリル、ピロリル、キナゾリニル、キノリニル、4H−キノリジニル、キノキサリニル、キヌクリジニル、テトラヒドロフラニル、テトラヒドロイソキノリニル、テトラヒドロキノリニル、テトラゾリル、6H−1,2,5−チアジアジニル、1,2,3−チアジアゾリル、1,2,4−チアジアゾリル、1,2,5−チアジアゾリル、1,3,4−チアジアゾリル、チアントレニル、チアゾリル、チエニル、チエノチアゾリル、チエノオキサゾリル、チエノイミダゾリル、チオフェニル、及びキサンテニルが挙げられる。 The term "heterocycle" or "heterocyclic" as used herein, monocyclic having a ring on the atom of 3 to 10 (preferably 5 or 6), a double or polycyclic ring It means a cyclic radical consisting of a carbon atom and 1 to 4 heteroatoms. Each heteroatom is selected from the group consisting of non-oxygen peroxide, sulfur and N (Y), where Y is either absent or H, O, (C 1- C 4 ) alkyl, phenyl or benzyl. The cyclic radical may optionally contain 1 to 3 double bonds and may optionally be substituted with 1 or 2 or more substituents. Non-limiting examples of heterocyclic rings include benzoimidazolyl, benzofuranyl, benzothiofuranyl, benzothiophenyl, benzoxazolyl, benzoxazolinyl, benzothiazolyl, benzotriazolyl, benzotetrazolyl, benzoiso. Oxazolyl, benzoisothiazolyl, benzoimidazolinyl, carbazolyl, 4aH-carbazolyl, carborinyl, chromanyl, chromenyl, cinnolinyl, decahydroquinolinyl, 2H, 6H-1,5,2-dithiazinyl, dihydroflo [2,3] -B] Tetrahydrofuran, furanyl, frazanyl, imidazolidinyl, imidazolinyl, imidazolyl, 1H-indazolyl, indolenyl, indolinyl, indridinyl, indrill, 3H-indrill, isatinoyl, isobenzofuranyl, isochromanyl, isoindazolyl, isoindolinyl, isoindryl, isoquinolinyl Isooxazolyl, methylenedioxyphenyl, morpholinyl, naphthyldinyl, octahydroisoquinolinyl, oxadiazolyl, 1,2,3-oxadiazolyl, 1,2,4-oxadiazolyl, 1,2,5-oxadiazolyl, 1,3,4- Oxaziazolyl, oxazolidinyl, oxazolyl, oxyindyl, pyrimidinyl, phenanthridinyl, phenanthrolinyl, phenazinyl, phenothiazine, phenoxatinyl, phenoxazinyl, phthalazine, piperazinyl, piperidinyl, piperidonyl, 4-piperidinyl, piperonyl, pteridinyl , Pyraminol, Pyrazineyl, Pyrazolydinyl, Pyrazolinyl, Pyrazolyl, Pyridadinyl, Pyridooxazole, Pyridoimidazole, Pyridothiazole, Pyridinel, Pyridyl, Pyrimidinyl, Pyrrolidinyl, Pyrrolinyl, 2H-Pyrrolyl, Pyrrolyl, Kinazolinyl, Kinolinyl, 4H-Kinolydinyl, Kinoxalinyl , Kinucridinyl, Tetrahydrofuranyl, Tetrahydroisoquinolinyl, Tetrahydroquinolinyl, Tetrazolyl, 6H-1,2,5-Thiadiazinyl, 1,2,3-Thiadiazolyl, 1,2,4-Thiadiazolyl, 1,2,5 Included are thiasiazolyl, 1,3,4-thiazialzolyl, thiantrenyl, thiazolyl, thienyl, thienothiazolyl, thienooxazolyl, thienoimidazolyl, thiophenyl, and xanthenyl.
更に別の態様においては、硬化性組成物は、メルカプタンを含有する環式、多環式又は直鎖脂肪族のアルケン又はアルキンから得られる1種又は2種以上のポリチオール成分を含んでいてよい。これらの基から誘導される代表的なポリチオールの非限定的な例として、トリビニルシクロヘキセンジメルカプタン、トリビニルシクロヘキセントリメルカプタン、ジシクロペンタジエンジメルカプタン、ビニルシクロヘキセンジメルカプタン、トリアリルイソシアヌレートジメルカプタン、トリアリルイソシアヌレートトリメルカプタン、フェニルへプタ−1,3,5−トリインポリメルカプタン、2−ブチン−1,4−ジオールジメルカプタン、プロパルギルアルコールジメルカプタン、ジプロパルギルスルフィドポリメルカプタン、ジプロパルギルエーテルポリメルカプタン、プロパルギルアミンジメルカプタン、ジプロパルギルアミンポリメルカプタン、トリプロパルギルアミンポリメルカプタン、トリプロパルギルイソシアヌレートポリメルカプタン、及びトリプロパルギルシアヌレートポリメルカプタンが挙げられる。 In yet another embodiment, the curable composition, the cyclic containing mercaptan, may include one or more polythiol component obtained from polycyclic or linear aliphatic A Ruken or alkyne .. Non-limiting examples of representative polythiols derived from these groups include trivinylcyclohexene dimercaptan, trivinylcyclohexentrimercaptan, dicyclopentadiene dimercaptan, vinylcyclohexene dimercaptan, triallyl isocyanurate dimercaptan, tri. Allyl isocyanurate trimercaptan, phenylhepta-1,3,5-triinpolymercaptan, 2-butin-1,4-diol dimercaptan, propargyl alcohol dimercaptan, dipropargyl sulfide polymercaptan, dipropargyl ether polymercaptan, Examples thereof include propargylamine dimercaptan, dipropargylamine polymercaptan, tripropargylamine polymercaptan, tripropargyl isocyanurate polymercaptan, and tripropargyl cyanurate polymercaptan.
或る3D印刷の態様においては、印刷工程は、熱エージングされた硬化性組成物を、砂、ポリマー粉末、ヒドロキシアパタイトナノ粉末、タングステン粉末などの1種又は2種以上の粉末に噴射する工程を含む。該組成物は、その後硬化され、粉末に富む複合材料となる。硬化時間は、組成物中の開始剤の量又は触媒の濃度を変更することによって調整することができる。インクジェット堆積によってパターン形成された幾何学的形状を有する複合材料はまた、粉末粒子の周囲を硬化して、その後、粉末を含むガラストレーから取り出すことができる。これらのパターン形成された複合材料は、任意により、更なる印刷による積み重ねをする(3Dインクジェット付加製造工程の場合)こともできるし、及び又は、多数の加工技術において利用することもできる。そのような加工技術の代表例として次のものが挙げられる。
(a)ポリマー粉末の焼結: パターン形成された複合材料を、ポリマー粉末のTg又はTmを超える温度に加熱し、又は、溶媒蒸気(solvent fume)に付して、ポリマー粒子を融合させること。
(b)キャスティング: パターン形成された複合材料の周囲に硬化用液体(たとえば、鋳型材料(investment))を注ぎ、注がれた液体が硬化するのに任せ、その後、ポリマー複合材料を焼却除去して、インクジェット パターン形成された元の幾何学模様の陰画を有する鋳型を提供すること。この鋳型は、金属製品を製造するために用いられる(たとえば、インベストメント鋳造、鋳物生産など)。
(c)セラミック/金属の焼結:パターン形成された複合材料を十分な温度にまで加熱してセラミック粒子又は金属粒子を融合させ、硬化されたチオール−エポキシ ポリマーバインダー成分を焼却除去すること。
In certain 3D printing embodiments, the printing process involves injecting the heat-aged curable composition onto one or more powders such as sand, polymer powder, hydroxyapatite nanopowder , tungsten powder, and the like. Including. The composition is then cured to a powder-rich composite. The curing time can be adjusted by varying the amount of initiator in the composition or the concentration of catalyst. Composites with geometric shapes patterned by inkjet deposition can also be cured around the powder particles and then removed from the glass tray containing the powder. These patterned composites can optionally be stacked by further printing (in the case of a 3D inkjet addition manufacturing process) and / or can be used in a number of processing techniques. The following are typical examples of such processing techniques.
(A) Sintering of polymer powder: Heating a patterned composite material to a temperature above Tg or Tm of the polymer powder or subjecting it to solvent vapor (solvent fume) to fuse the polymer particles.
(B) Casting: A curing liquid (eg, investment) is poured around the patterned composite and left to cure the poured liquid, after which the polymer composite is incinerated and removed. To provide a mold having a negative image of the original geometric pattern formed by the inkjet pattern. This mold is used to make metal products (eg investment casting, casting production, etc.).
(C) Ceramic / metal sintering: Heating the patterned composite material to a sufficient temperature to fuse the ceramic or metal particles and incinerate and remove the cured thiol-epoxy polymer binder component.
原子間力顕微鏡検査:
Asylum 3D-SA 原子間力顕微鏡を、タッピングモード、142kHz、公称駆動電圧500mVの条件で操作して、系の原子間力顕微鏡検査(AFM)による写真を撮影した。窒化シリコンプローブを用い、k=40N/m(Vista Probes)、公称先端直径:10〜15nm(製造者の説明による)であった。サンプルの調製においては、サンプル(PS比率が0%、10%、20%、及び30%)を25体積%エタノール水溶液で素早く(<5秒)洗浄し、直後に、濾過した乾燥窒素ガス流下で約10分間乾燥させ、ガラススライドに固定した。
Atomic force microscopy:
The Asylum 3D-SA atomic force microscope was operated under tapping mode, 142 kHz, and a nominal drive voltage of 500 mV, and photographs were taken by atomic force microscopy (AFM) of the system. Using silicon nitride probes, k = 40 N / m (Vista Probes), nominal tip diameter: 10-15 nm (according to the manufacturer's instructions). In sample preparation, the samples (PS ratios 0%, 10%, 20%, and 30%) were washed quickly (<5 seconds) with a 25% aqueous ethanol solution and immediately immediately under a filtered stream of dry nitrogen gas. It was dried for about 10 minutes and fixed on a glass slide.
以下の23種の組成:
1.ジペンテンジメルカプタン−コ−トリアリルイソシアヌレート(DPDM−コ−TAICと称する)
2.ジペンテンジメルカプタン−コ−1,2,4−トリビニルシクロヘキサン(DPDM−コ−TVCと称する)
3.ジペンテンジメルカプタン−コ−グリオキサルビス(ジアリルアセタール)(DPDM−コ−GLTAと称する)
4.ジペンテンジメルカプタン−コ−ネオペンチルグリコールジアクリレート(DPDM−コ−NPGDAと称する)
5.ジペンテンジメルカプタン−コ−トリシクロデカンジアクリレート(DPDM−コ−TCDDAと称する)
6.ジペンテンジメルカプタン−コ−ポリエチレングリコールジアクリレート,Mn 250/700(DPDM−コ−PEGDA−250/700と称する)
7.ジペンテンジメルカプタン−コ−トリメチロールプロパントリアクリレート(DPDM−コ−TMPTAと称する)
8.ジペンテンジメルカプタン−コ−ペンタエリスリトールテトラアクリレート(DPDM−コ−PETTAと称する)
9.ジペンテンジメルカプタン−コ−シクロヘキサンジメタノールジグリシジルエーテル(DPDM−コ−CHDMDGEと称する)
10.ジペンテンジメルカプタン−コ−ネオペンチルグリコールジグリシジルエーテル(DPDM−コ−NPGDGEと称する)
11.ジペンテンジメルカプタン−コ−エチレングリコールジグリシジルエーテル(DPDM−コ−EGDGEと称する)
12.ジペンテンジメルカプタン−コ−ビスフェノールAジグリシジルエーテル(DPDM−コ−BADGEと称する)
13.ジペンテンジメルカプタン−コ−グリセロールジグリシジルエーテル(DPDM−コ−GDGEと称する)
14.ジペンテンジメルカプタン−コ−1,4−ブタンジオールジグリシジルエーテル(DPDM−コ−BDDGEと称する)
15.ジペンテンジメルカプタン−コ−水素化ビスフェノールAジグリシジルエーテル(DPDM−コ−HBADGEと称する)
16.ジペンテンジメルカプタン−コ−ソルビトールポリグリシジルエーテル(DPDM−コ−SPGEと称する)
17.ジペンテンジメルカプタン−コ−トリフェニロールメタントリグリシジルエーテル(DPDM−コ−TPMTGEと称する)
18.ジペンテンジメルカプタン−コ−N,N−ジグリシジル−4−グリシジルオキシアニリン(DPDM−コ−NGAと称する)
19.ジペンテンジメルカプタン−コ−4,4’−メチレンビス(N,N−ジグリシジルアニリン)(DPDM−コ−4MGAと称する)
20.ジペンテンジメルカプタン−コ−エポキシ化ブタジエンオリゴマー(DPDM−コ−EBDと称する)
21.ジペンテンジメルカプタン−コ−エポキシ化ブタジエン/ニトリルオリゴマー(DPDM−コ−EBDNと称する)
22.ジペンテンジメルカプタン−コ−エポキシ化ポリアミドオリゴマー(DPDM−コ−EPAMと称する);及び
23.ジペンテンジメルカプタン−コ−レゾルシノールジグリシジルエーテル(DPDM−コ−RDGEと称する)
を、メルカプタン化テルペン、ジペンテンジメルカプタン、及び種々の化学的官能性を有する種々の非メルカプタン化成分からワンポット合成方法で調製した。具体的には、諸成分を、定格温度150℃の熱硬化性キャップを有する封止可能ガラス製広口反応瓶(サイズ:40mL〜1L)に加えた。諸成分を封止可能ガラス製広口反応瓶にワンポット添加した後、上記目的産物1〜23の物理的及び熱機械的特性を調整するために、それらに対する化学量論的等量の0.01〜5.00倍で変性剤成分(定義は上記参照)を任意に追加した。
The following 23 compositions:
1. 1. Dipentene dimercaptan-co-triallyl isocyanurate (referred to as DPDM-co-TAIC)
2. Dipentene dimercaptan-co-1,2,4-trivinylcyclohexane (referred to as DPDM-co-TVC)
3. 3. Dipentene dimercaptan-co-glycolbis (diallyl acetal) (referred to as DPDM-co-GLTA )
4 . Dipentene Dimercaptan-co-neopentyl glycol diacrylate (referred to as DPDM-co-NPGDA)
5 . Dipentene dimercaptan-co-tricyclodecanediacrylate (referred to as DPDM-co-TCDDA)
6 . Dipentene Dimercaptan-co-polyethylene glycol diacrylate, Mn 250/700 (referred to as DPDM-co-PEGDA-250 / 700)
7 . Dipentene Dimercaptan-co-trimethylolpropane triacrylate (referred to as DPDM-co-TMPTA)
8 . Dipentene Dimercaptan-co-pentaerythritol tetraacrylate (referred to as DPDM-co-PETTA)
9 . Dipentene dimercaptan-co-cyclohexanedimethanol diglycidyl ether (referred to as DPDM-co-CHDMDGE)
10 . Dipenten Dimercaptan-co-neopentyl glycol diglycidyl ether (referred to as DPDM-co-NPGDGE)
11 . Dipentene dimercaptan-co-ethylene glycol diglycidyl ether (referred to as DPDM-co-EGDGE)
12 . Dipentene dimercaptan-co-bisphenol A diglycidyl ether (referred to as DPDM-co-BADGE)
13 . Dipentene dimercaptan-co-glycerol diglycidyl ether (referred to as DPDM-co-GDGE)
14 . Dipentene dimercaptan-co-1,4-butanediol diglycidyl ether (referred to as DPDM-co-BDDGE)
15 . Dipentene dimercaptan-co-hydrogenated bisphenol A diglycidyl ether (referred to as DPDM-co-HBADGE)
16 . Dipentene Dimercaptan-co-sorbitol polyglycidyl ether (referred to as DPDM-co-SPGE)
17 . Dipentene dimercaptan-co-triphenylol methanetriglycidyl ether (referred to as DPDM-co-TPMTGE)
18 . Dipentene dimercaptan-co-N, N-diglycidyl-4-glycidyloxyaniline (referred to as DPDM-co-NGA)
19 . Dipentene Dimercaptan-co-4,4'-methylenebis (N, N-diglycidylaniline) (referred to as DPDM-co-4MGA)
20 . Dipentene dimercaptan-co-epoxy butadiene oligomer (referred to as DPDM-co-EBD)
21 . Dipentene dimercaptan-co-epoxy butadiene / nitrile oligomer (referred to as DPDM-co-EBDN)
22 . Dipentene dimercaptan-co-epoxy polyamide oligomer (referred to as DPDM-co-EPAM); and
23 . Dipentene dimercaptan-co-resorcinol diglycidyl ether (referred to as DPDM-co-RDGE)
Was prepared by a one-pot synthesis method from mercaptanized terpenes, dipentene dimercaptans, and various non-mercaptanized components having various chemical sensitivities. Specifically, the components were added to a sealable glass wide-mouth reaction bottle (size: 40 mL to 1 L) having a thermosetting cap having a rated temperature of 150 ° C. After one-pot added to a sealable glass wide-mouth reaction bottle the components, in order to adjust the physical and thermomechanical properties of the desired product 1-23, 0.01 stoichiometric equivalent amount to them A denaturant component (see above for definition) was optionally added at 5.00-fold.
フォトジェット製造方法及びステレオリソグラフィー付加(SLA)製造方法で加工されたUV硬化性組成物とUV硬化性混合物:
上記のUV硬化性組成物をフォトジェット製造技術及びステレオリソグラフィー付加(SLA)製造技術に使用した。フォトジェット3D印刷に使用した代表的な組成物の1例は、ジペンテンジメルカプタン(DPDM)−コ−トリアリルイソシアヌレート(即ちDPDM−コ−TAIC)であり、但し、SH:C=Cの化学量論比は1.0:1.0であり、また、2.0重量%のDMPA光開始剤(2,2−ジメトキシ−2−フェニルアセトフェノン)と500ppmまでの4−メトキシフェノール フリーラジカル開始剤を用いた。この硬化性組成物は、50℃での粘度6〜7cPを示し、したがって噴射可能であった。他の1つの噴射可能な組成物は、D−リモネン−コ−[0.50のTMPTMP: 0.50の1,10−デカンジチオール]であり、但し、C=C:SHの化学量論比は1.0:1.0であり、また、5.0重量%のDMPA光開始剤を用いた。この硬化性組成物は、50℃での粘度が20cP以下であり、したがってこれも噴射可能であった。フォトジェット付加製造方法はインクジェット3Dプリンターで行なった。この3Dプリンターは、噴射直後の低粘度の光硬化性樹脂を365nmのUV照射で硬化させるものである。印刷により、上記D−リモネン−コ−[0.50のTMPTMP: 0.50の1,10−デカンジチオール]からなる、約200μmサイズの骨組み支柱構造の解像度(図示しない)を有する骨組み構造体が得られた。
UV curable compositions and UV curable mixtures processed by photolithography and service level agreement (SLA) methods:
The UV curable composition described above was used in photolithography and service level agreement (SLA) manufacturing techniques. An example of a typical composition used for photojet 3D printing is dipentene dimercaptan (DPDM) -co-triallyl isocyanurate (ie DPDM-co-TAIC), provided that SH: C = C chemistry. The quantitative ratio is 1.0: 1.0, and 2.0 wt% DMPA photoinitiator (2,2-dimethoxy-2-phenylacetophenone) and 4-methoxyphenol free radical initiator up to 500 ppm. Was used. The curable composition, a viscosity 6~7cP at 50 ° C., was thus jettable. Another injectable composition is D-limonene-co- [0.50 TMPTMP: 0.50 1,10-decandithiol], provided that the C = C: SH chemical ratio. Was 1.0: 1.0, and 5.0% by weight of DMPA photoinitiator was used. The curable composition, the viscosity at 50 ° C. or less 20 cP, thus it was also possible injection. The photojet addition manufacturing method was carried out with an inkjet 3D printer. This 3D printer cures a low-viscosity photocurable resin immediately after injection by UV irradiation at 365 nm. By printing, a skeleton structure having a resolution (not shown) of a skeleton strut structure having a size of about 200 μm, which is composed of the above D-limonene-co [0.50 TMPTMP: 0.50 1,10-decandithiol], is obtained. Obtained.
Claims (58)
ポリチオール成分;
アルケン含有成分及び/又はアルキン含有成分;及び
エポキシ含有成分
を含む組成物。 It is a curable composition and
Polythiol component;
A composition comprising an alkene-containing component and / or an alkyne-containing component; and an epoxy-containing component.
ポリチオール成分;
アルケン含有成分及び/又はアルキン含有成分;及び
エポキシ含有成分
の反応生成物の1種又は2種以上を含む組成物。 It is a cured composition
Polythiol component;
A composition containing one or more reaction products of an alkene-containing component and / or an alkyne-containing component; and an epoxy-containing component.
(a)ポリチオール成分;アルケン含有成分及び/又はアルキン含有成分;及びエポキシ含有成分を混合する工程;及び
(b)得られた混合物を熱エージングする工程
を含む方法。 The method for producing a curable composition according to claim 1, wherein the following steps:
A method comprising (a) a step of mixing a polythiol component; an alkene-containing component and / or an alkyne-containing component; and an epoxy-containing component; and (b) a step of heat aging the obtained mixture.
(a)ポリチオール成分;アルケン含有成分及び/又はアルキン含有成分;及びエポキシ含有成分を混合する工程;
(b)得られた混合物を熱エージングする工程;
(c)工程(b)の混合物に開始剤又は触媒を加える工程;及び
(d)工程(c)の混合物を硬化する工程
を含む方法。 A method for producing a cured composition, wherein the following steps:
(A) Polythiol component; alkene-containing component and / or alkyne-containing component; and step of mixing the epoxy-containing component;
(B) A step of heat aging the obtained mixture;
A method comprising (c) adding an initiator or catalyst to the mixture of step ( b ); and (d) curing the mixture of step (c).
(a)ポリチオール成分;アルケン含有成分及び/又はアルキン含有成分;及びエポキシ含有成分を含む、熱エージングされた硬化性組成物を印刷する工程;及び
(b)得られた印刷された組成物を硬化する工程
を含み、
但し、該硬化する工程を、工程(a)の熱エージングされた硬化性組成物の印刷と同時に行なう、方法。 A method of printing a curable composition, the following steps:
(A) A step of printing a heat-aged curable composition containing a polythiol component; an alkene-containing component and / or an alkyne-containing component; and an epoxy-containing component; and (b) curing the obtained printed composition. Including the process of
However, a method in which the curing step is performed at the same time as printing of the heat-aged curable composition in step (a).
ポリチオール成分;
アルケン含有成分及び/又はアルキン含有成分;及び
エポキシ含有成分
の反応生成物の1種又は2種以上を含む硬化組成物を含むコーティング。 A coating provided on the substrate
Polythiol component;
A coating comprising a cured composition comprising one or more reaction products of an alkene-containing component and / or an alkyne-containing component; and an epoxy-containing component.
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US15/263,107 US10144840B2 (en) | 2013-03-13 | 2016-09-12 | One-pot, high-performance recycling of polymer waste using renewable polymer synthesis |
US15/263,107 | 2016-09-12 | ||
PCT/US2017/050898 WO2018049302A1 (en) | 2016-09-12 | 2017-09-11 | One-pot, high-performance recycling method for polymer waste using renewable polymer synthesis |
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JP2019537656A JP2019537656A (en) | 2019-12-26 |
JP2019537656A5 true JP2019537656A5 (en) | 2020-11-12 |
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EP (1) | EP3510081A1 (en) |
JP (1) | JP2019537656A (en) |
KR (1) | KR20190052071A (en) |
AU (1) | AU2017322581A1 (en) |
BR (1) | BR112019004816A2 (en) |
CA (1) | CA3036531A1 (en) |
IL (1) | IL265254A (en) |
MX (1) | MX2019002823A (en) |
WO (1) | WO2018049302A1 (en) |
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GB2575793A (en) * | 2018-07-20 | 2020-01-29 | Montanuniv Leoben | Resin composition suitable for printing and printing methods |
CN109535401A (en) * | 2018-11-22 | 2019-03-29 | 广东百川化工有限公司 | Ordor removing, unsaturated polyester resin and preparation method thereof |
CN109988486B (en) * | 2019-04-08 | 2021-01-12 | 沈阳顺风新材料有限公司 | Water-based environment-friendly waterproof coating and preparation method thereof |
JP6620273B1 (en) * | 2019-08-21 | 2019-12-11 | ナミックス株式会社 | Epoxy resin composition |
CN112689652B (en) * | 2019-08-21 | 2021-07-30 | 纳美仕有限公司 | Epoxy resin composition |
DE102019133694A1 (en) * | 2019-12-10 | 2021-06-10 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Light-fixable and moisture-curing compounds based on epoxy resins and thiols |
CN112679667B (en) * | 2020-12-09 | 2022-08-02 | 沧州师范学院 | Flexible polymer needle containing siloxane group and preparation method and application thereof |
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GB1082104A (en) * | 1965-09-23 | 1967-09-06 | Arthur Jack Sackville Evans | Polyepoxides |
US4422914A (en) * | 1981-01-16 | 1983-12-27 | W. R. Grace & Co. | Polymer composition having terminal alkene and terminal carboxyl groups |
US5310826A (en) * | 1989-04-26 | 1994-05-10 | Akzo N.V. | Thiolic compound polymerization cocatalysts |
ES2634531T3 (en) * | 2010-03-23 | 2017-09-28 | Henkel Ag & Co. Kgaa | Epoxy resin composition with reduced toxicity |
JP2016501970A (en) * | 2012-12-21 | 2016-01-21 | ダウ グローバル テクノロジーズ エルエルシー | Thiol cured elastic epoxy resin |
JP6464095B2 (en) * | 2012-12-21 | 2019-02-06 | ダウ グローバル テクノロジーズ エルエルシー | Non-isocyanate sealants for glass sealing |
-
2017
- 2017-09-11 MX MX2019002823A patent/MX2019002823A/en unknown
- 2017-09-11 KR KR1020197010441A patent/KR20190052071A/en not_active Application Discontinuation
- 2017-09-11 AU AU2017322581A patent/AU2017322581A1/en not_active Abandoned
- 2017-09-11 EP EP17784428.9A patent/EP3510081A1/en not_active Withdrawn
- 2017-09-11 JP JP2019535197A patent/JP2019537656A/en active Pending
- 2017-09-11 CA CA3036531A patent/CA3036531A1/en not_active Abandoned
- 2017-09-11 BR BR112019004816A patent/BR112019004816A2/en not_active Application Discontinuation
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