JP2019535030A - Euvリソグラフィ用ミラーアレイのコンポーネント - Google Patents
Euvリソグラフィ用ミラーアレイのコンポーネント Download PDFInfo
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- JP2019535030A JP2019535030A JP2019515283A JP2019515283A JP2019535030A JP 2019535030 A JP2019535030 A JP 2019535030A JP 2019515283 A JP2019515283 A JP 2019515283A JP 2019515283 A JP2019515283 A JP 2019515283A JP 2019535030 A JP2019535030 A JP 2019535030A
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- 238000001900 extreme ultraviolet lithography Methods 0.000 title claims abstract description 19
- 239000011159 matrix material Substances 0.000 claims abstract description 55
- 239000000835 fiber Substances 0.000 claims abstract description 53
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000002245 particle Substances 0.000 claims abstract description 34
- 239000000463 material Substances 0.000 claims abstract description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 claims abstract description 28
- 239000010949 copper Substances 0.000 claims abstract description 28
- 239000012779 reinforcing material Substances 0.000 claims abstract description 27
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 17
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 14
- 239000010439 graphite Substances 0.000 claims abstract description 13
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 13
- 239000002131 composite material Substances 0.000 claims abstract description 12
- 239000000919 ceramic Substances 0.000 claims abstract description 10
- 238000000576 coating method Methods 0.000 claims description 26
- 239000011248 coating agent Substances 0.000 claims description 23
- 239000012783 reinforcing fiber Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 15
- 238000005245 sintering Methods 0.000 claims description 15
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 14
- 229910052750 molybdenum Inorganic materials 0.000 claims description 14
- 239000011733 molybdenum Substances 0.000 claims description 14
- 229910052710 silicon Inorganic materials 0.000 claims description 14
- 239000010703 silicon Substances 0.000 claims description 14
- 230000006835 compression Effects 0.000 claims description 13
- 238000007906 compression Methods 0.000 claims description 13
- 229910044991 metal oxide Inorganic materials 0.000 claims description 13
- 150000004706 metal oxides Chemical class 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 10
- 229910000510 noble metal Inorganic materials 0.000 claims description 10
- 239000002243 precursor Substances 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 9
- 239000003365 glass fiber Substances 0.000 claims description 7
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 6
- 239000002041 carbon nanotube Substances 0.000 claims description 6
- 238000001513 hot isostatic pressing Methods 0.000 claims description 6
- 239000002557 mineral fiber Substances 0.000 claims description 6
- 230000002829 reductive effect Effects 0.000 claims description 6
- 238000001125 extrusion Methods 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 4
- 238000000149 argon plasma sintering Methods 0.000 claims description 4
- 239000004917 carbon fiber Substances 0.000 claims description 4
- 238000007731 hot pressing Methods 0.000 claims description 4
- 239000011236 particulate material Substances 0.000 claims description 4
- 238000004881 precipitation hardening Methods 0.000 claims description 4
- 239000002241 glass-ceramic Substances 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- 238000003801 milling Methods 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 238000009760 electrical discharge machining Methods 0.000 claims description 2
- 238000005286 illumination Methods 0.000 abstract description 13
- 230000005855 radiation Effects 0.000 description 18
- 239000001257 hydrogen Substances 0.000 description 15
- 229910052739 hydrogen Inorganic materials 0.000 description 15
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 13
- 210000001747 pupil Anatomy 0.000 description 11
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 239000007789 gas Substances 0.000 description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 8
- 230000000996 additive effect Effects 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 238000003491 array Methods 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 238000005452 bending Methods 0.000 description 6
- 229910052810 boron oxide Inorganic materials 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 6
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 238000005240 physical vapour deposition Methods 0.000 description 6
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 6
- 229910010271 silicon carbide Inorganic materials 0.000 description 6
- 229910000838 Al alloy Inorganic materials 0.000 description 5
- 229910000881 Cu alloy Inorganic materials 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 239000003575 carbonaceous material Substances 0.000 description 3
- -1 copper Chemical class 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005868 electrolysis reaction Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 239000010425 asbestos Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 150000001722 carbon compounds Chemical class 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 229910052863 mullite Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 238000004663 powder metallurgy Methods 0.000 description 2
- 239000012758 reinforcing additive Substances 0.000 description 2
- 229910052895 riebeckite Inorganic materials 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 239000010456 wollastonite Substances 0.000 description 2
- 229910052882 wollastonite Inorganic materials 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- YZCKVEUIGOORGS-UHFFFAOYSA-N Hydrogen atom Chemical compound [H] YZCKVEUIGOORGS-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000003733 fiber-reinforced composite Substances 0.000 description 1
- 239000003574 free electron Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000006263 metalation reaction Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005289 physical deposition Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000002490 spark plasma sintering Methods 0.000 description 1
- 230000005469 synchrotron radiation Effects 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/702—Reflective illumination, i.e. reflective optical elements other than folding mirrors, e.g. extreme ultraviolet [EUV] illumination systems
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C47/00—Making alloys containing metallic or non-metallic fibres or filaments
- C22C47/02—Pretreatment of the fibres or filaments
- C22C47/04—Pretreatment of the fibres or filaments by coating, e.g. with a protective or activated covering
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/001—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
- C22C32/0015—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides with only single oxides as main non-metallic constituents
- C22C32/0021—Matrix based on noble metals, Cu or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C47/00—Making alloys containing metallic or non-metallic fibres or filaments
- C22C47/14—Making alloys containing metallic or non-metallic fibres or filaments by powder metallurgy, i.e. by processing mixtures of metal powder and fibres or filaments
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C49/00—Alloys containing metallic or non-metallic fibres or filaments
- C22C49/02—Alloys containing metallic or non-metallic fibres or filaments characterised by the matrix material
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C49/00—Alloys containing metallic or non-metallic fibres or filaments
- C22C49/02—Alloys containing metallic or non-metallic fibres or filaments characterised by the matrix material
- C22C49/04—Light metals
- C22C49/06—Aluminium
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
- G03F7/70033—Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70075—Homogenization of illumination intensity in the mask plane by using an integrator, e.g. fly's eye lens, facet mirror or glass rod, by using a diffusing optical element or by beam deflection
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
- G03F7/70116—Off-axis setting using a programmable means, e.g. liquid crystal display [LCD], digital micromirror device [DMD] or pupil facets
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/7015—Details of optical elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
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- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Public Health (AREA)
- Epidemiology (AREA)
- Environmental & Geological Engineering (AREA)
- Health & Medical Sciences (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Optical Elements Other Than Lenses (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
- Powder Metallurgy (AREA)
Abstract
Description
強化材料をマトリクス材料に導入するステップと、
強化材料を含むマトリクス材料からコンポーネントを成形するステップと、
コンポーネントを焼結し且つ/又はコンポーネントの形状を圧縮し且つ/又はコンポーネントを仕上げるステップと
を含み、マトリクス材料は、新鮮な還元金属粉末(freshly reduced metal powder)の形態で導入されるか、又は成形及び/又は焼結及び/又は圧縮は、還元雰囲気中で実行される方法により達成される。
強化材料をマトリクス材料に導入するステップ(ステップ602)と、
強化材料を含むマトリクス材料からコンポーネントを成形するステップ(ステップ604)と、
コンポーネントを焼結し且つ/又はコンポーネントの形状を圧縮し且つ/又はコンポーネントを仕上げるステップ(ステップ606)と
を含む。EUVリソグラフィでの使用に重要な水素脆化に対する耐性に関して、マトリクス材料が新鮮な還元金属粉末の形態で導入されること、又は成形及び/又は焼結及び/又は圧縮が還元雰囲気中で実行されることが重要である。できる限り酸素を含まない材料をこのようにして得ることもできる。両方の措置を組み合わせることも可能である。粉末は、粉末形態の銅合金又はアルミニウム合金である。粉末は、好ましくはアルミニウム粉末、特に好ましくは銅粉末である。
2 プラズマ液滴
3 赤外線レーザ
4 中間焦点
5 絞り
6 放射線
7 放射線
8 放射線
11 照明系
12 折返しミラー
13 レチクル
16 視野ファセットミラーアレイ
17 瞳ファセットミラーアレイ
18 視野ファセット
19 瞳ファセット
100 EUVリソグラフィ装置
102 レーザ源
104 コンデンサレンズ
106 プラズマ
108 供給口
110 コレクタミラー
111 絞り
112 ミラー
114 視野ファセットミラー
116 瞳ファセットミラー
118 ミラー
120 ミラー
122 平面ミラー
124 レチクル
126 走査方向
128 投影レンズ
130 ウェハ
300 基板
302 反射コーティング
304 担持要素
306 作動ロッド
308 エンドピース
310 両矢印
312 ジョイント脚
314 傾斜点
318 熱伝導性繊維
320 ベローズ
373 視野ミラーファセット
396 フレクシャ
398 固定スリーブ
400 構造部品
402 マトリクス材料
404 強化繊維
406 分散質
410 コーティング
500 構造部品
502 マトリクス材料
504 強化繊維
508 粒子
602 ステップ
604 ステップ
606 ステップ
Z 中間焦点
Claims (15)
- EUVリソグラフィ用ミラーアレイのコンポーネントであって、銅含有及び/又はアルミニウム含有マトリクス材料(402、502)を含み且つ繊維の形態の強化材料(404、504)を含む複合材料から少なくとも部分的に製造され、前記複合材料は、黒鉛、ダイヤモンドライクカーボン、及びセラミックの群からの材料のうち1つ又は複数からなる粒子(508)を含むことを特徴とするコンポーネント。
- 請求項1に記載のコンポーネントにおいて、前記複合材料は、カーボンナノチューブ、炭素繊維、鉱物繊維、ガラス繊維、及びセラミック繊維の群からの1つ又は複数を強化材料(404、504)として含むことを特徴とするコンポーネント。
- 請求項1又は2に記載のコンポーネントにおいて、該コンポーネントは、ミラージョイントの構造部品(400、500)として構成されることを特徴とするコンポーネント。
- 請求項1〜3のいずれか1項に記載のコンポーネントにおいて、前記マトリクス材料(502、402)は、分散硬化型であることを特徴とするコンポーネント。
- 請求項1〜4のいずれか1項に記載のコンポーネントにおいて、前記粒子(508)及び/又は強化材料からなる繊維(404、504)は、コーティングされることを特徴とするコンポーネント。
- 請求項5に記載のコンポーネントにおいて、前記粒子(508)及び/又は繊維(404、504)は、貴金属、金属酸化物、モリブデン、及びケイ素の群からの1つ又は複数の繊維でコーティングされることを特徴とするコンポーネント。
- 請求項1〜6のいずれか1項に記載のコンポーネントにおいて、該コンポーネントは、前記マトリクス材料(502)中の配置が該コンポーネント(500)の幾何学的形状に実質的に対応する強化繊維(504)を含むことを特徴とするコンポーネント。
- 請求項1〜7のいずれか1項に記載のコンポーネントにおいて、該コンポーネントは少なくとも部分的にコーティングされることを特徴とするコンポーネント。
- 請求項8に記載のコンポーネントにおいて、該コンポーネントは、貴金属、金属酸化物、モリブデン、及びケイ素の群からの1つ又は複数の材料(410)でコーティングされることを特徴とするコンポーネント。
- 請求項1〜9のいずれか1項に記載のコンポーネントにおいて、該コンポーネントは、20℃で200N/mm2を超える降伏点Rp0.2を有することを特徴とするコンポーネント。
- 請求項1〜10のいずれか1項に記載のコンポーネントにおいて、該コンポーネントは、320W/mKを超える熱伝導率を有することを特徴とするコンポーネント。
- 請求項1〜11のいずれか1項に記載のコンポーネントを製造する方法であって、
強化材料をマトリクス材料に導入するステップと、
前記強化材料を含むマトリクス材料から前記コンポーネントを成形するステップと、
前記コンポーネントを焼結し且つ/又は前記コンポーネントの形状を圧縮し且つ/又は前記コンポーネントを仕上げるステップと
を含み、前記マトリクス材料は、新鮮な還元金属粉末の形態で導入されるか、又は前記成形及び/又は焼結及び/又は圧縮は、還元雰囲気中で実行される方法。 - 請求項12に記載の方法において、前記強化材料の繊維状の前駆体材料及び/又はさらに粒子の前駆体材料が前記マトリクス材料に導入され、前記成形及び/又は焼結及び/又は圧縮中に、前記前駆体材料が反応して強化材料及び/又は粒子材料を形成することを特徴とする方法。
- 請求項12又は13に記載の方法において、前記成形及び/又は焼結及び/又は圧縮は、押出し成形、レーザ焼結、プラズマ焼結、熱間プレス及び/又は熱間静水圧プレスにより実行されることを特徴とする方法。
- 請求項12〜14のいずれか1項に記載の方法において、前記仕上げは、放電加工、フライス削り、研削、研磨、及び/又はコーティングにより実行されることを特徴とする方法。
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DE102016217735.4A DE102016217735A1 (de) | 2016-09-16 | 2016-09-16 | Komponente für eine Spiegelanordnung für die EUV-Lithographie |
DE102016217735.4 | 2016-09-16 | ||
PCT/EP2017/073376 WO2018050876A1 (de) | 2016-09-16 | 2017-09-17 | Komponente für eine spiegelanordnung für die euv-lithographie |
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EP (1) | EP3513250B1 (ja) |
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CN110879199A (zh) * | 2019-11-25 | 2020-03-13 | 中国科学院微电子研究所 | 一种极紫外光辐照致材料氢脆性能的测试系统 |
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