JP2019220676A - Wiring fixing structure and processing device - Google Patents

Abstract

To provide a technique enabling wiring to be arranged on a metal member or a dielectric member with a narrow pitch and fixing the arranged wiring onto the member.SOLUTION: Wiring fixing structure in accordance with an embodiment of the present disclosure comprises: a metal member having a metal surface; wiring in which a plurality of conductive boards having a through-hole penetrating the board to a plate-thickness direction is arranged in parallel at a prescribed interval; a first insulating member that includes, a plurality of first holding parts in which a convex part fittable to the through-hole is formed, a first connection part connecting the plurality of first holding parts at the prescribed interval, and a leg part formed extending in parallel to the first holding part from the first connection part, and fixed to the metal surface; and a second insulating member having a plurality of second holding parts holding the conductive board while being nipped in cooperation with the plurality of first holding parts, and a second connection part connecting the plurality of second holding parts to each other at the prescribed interval. The wiring is held by the first and second insulating members while separated from the metal surface.SELECTED DRAWING: Figure 1

Description

  The present disclosure relates to a wiring fixing structure and a processing device.

  2. Description of the Related Art Conventionally, a structure in which a wiring is present on a metal member via an insulating member is known (for example, see Patent Document 1).

JP 2011-029584 A

  The present disclosure provides a technique capable of arranging and fixing wires at a narrow pitch on a metal member or a dielectric member.

  The wiring fixing structure according to an aspect of the present disclosure includes a wiring in which a plurality of metal members having a metal surface and a plurality of conductive plates having through holes penetrating in a thickness direction are arranged at predetermined intervals in parallel with each other; A plurality of first holding portions formed with protrusions that can be fitted into the first connection portion; a first connection portion that connects the plurality of first holding portions at the predetermined interval; A first insulating member having a leg formed to extend parallel to the first holding portion and fixed to the metal surface; and the conductor cooperating with each of the plurality of first holding portions. A second insulating member having a plurality of second holding portions that sandwich and hold the plate, and a second connection portion that connects the plurality of second holding portions at the predetermined interval; The wiring is held apart from the metal surface by the first insulating member and the second insulating member. .

  According to the present disclosure, wires can be arranged and fixed at a narrow pitch on a metal member or a dielectric member.

Perspective view showing a configuration example of a wiring fixing structure 1. Exploded perspective view of the wiring fixing structure of FIG. 1 is a sectional view taken along line AA of FIG. Perspective view showing another configuration example of the wiring fixing structure FIG. 4 is an exploded perspective view of the wiring fixing structure in FIG. 4. BB sectional drawing of FIG. Sectional view showing a configuration example of a processing apparatus having a wiring fixing structure. FIG. 7 is a plan view showing a configuration example of a high-frequency antenna of the processing device of FIG.

  Hereinafter, non-limiting exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. In all the attached drawings, the same or corresponding members or parts are denoted by the same or corresponding reference numerals, and redundant description will be omitted.

(Wiring fixing structure)
An example of the wiring fixing structure according to the embodiment of the present disclosure will be described. FIG. 1 is a perspective view showing a configuration example of a wiring fixing structure. FIG. 2 is an exploded perspective view of the wiring fixing structure of FIG. FIG. 3 is a sectional view taken along line AA of FIG.

  As shown in FIGS. 1 to 3, the wiring fixing structure 100 includes a metal member 1, a wiring 2, a first insulating member 3, and a second insulating member 4. The first insulating member 3 and the second insulating member 4 function as a wiring holder for holding the wiring 2 in cooperation.

  The metal member 1 has a metal surface 11 that is a fixing surface for fixing the wiring fixing structure 100. The metal member 1 may be, for example, aluminum or an alloy containing aluminum.

  The wiring 2 is formed by a plurality (for example, nine) of the conductor plates 21 arranged in parallel with each other at a predetermined interval (for example, 10 to 15 mm). The wiring 2 is held apart from the metal surface 11 by the first insulating member 3 and the second insulating member 4. The main surface of each conductor plate 21 is orthogonal to, for example, the metal surface 11. Each conductor plate 21 has one or a plurality of through holes 22 penetrating in the plate thickness direction. In the illustrated example, two through holes 22 are formed in each conductor plate 21 along the longitudinal direction of the conductor plate 21. The conductor plate 21 is formed of, for example, copper.

  The first insulating member 3 is formed of an elastic member such as, for example, polyetherimide. The first insulating member 3 has a plurality of first holding parts 31, first connecting parts 32, and legs 33.

  The first holding portion 31 is a portion formed in a substantially rectangular plate shape. On one surface of the first holding portion 31, a convex portion 34 that can be fitted into the through hole 22 is formed. It is preferable that the height of the convex portion 34 be equal to or greater than the thickness of the conductive plate 21, for example.

  The first connection part 32 is a part that connects the plurality of first holding parts 31 at predetermined intervals. The predetermined interval is the same or substantially the same as the arrangement interval of the plurality of conductor plates 21 configuring the wiring 2. The first connection part 32 is formed, for example, in a plate shape whose longitudinal direction is the direction in which the plurality of first holding parts 31 are arranged. The first connection portion 32 is formed with a plurality of openings 35 penetrating in the plate thickness direction at predetermined intervals along the longitudinal direction. The predetermined interval is the same or substantially the same as the arrangement interval of the plurality of conductor plates 21 configuring the wiring 2. The plurality of openings 35 are formed in such a size that the plurality of second holding portions 41 of the second insulating member 4 described later can be inserted. The first connection portion 32 has insertion holes 36 at both ends in the longitudinal direction through which the first fastening member 5 such as a bolt can be inserted.

  The leg 33 is a part fixed to the metal surface 11. The legs 33 are formed to extend downward from the lower surfaces at both ends in the longitudinal direction of the first connecting portion 32 in parallel with the first holding portion 31. An insertion hole 37 through which the second fastening member 6 such as a bolt can be inserted is formed in the leg 33. By fixing the leg portion 33 to the metal surface 11 by the second fastening member 6, the conductor plate 21 is held apart from the metal surface 11.

  The second insulating member 4 is formed of an elastic member such as, for example, polyetherimide. The second insulating member 4 has a plurality of second holding parts 41 and a second connecting part 42.

  The second holding portion 41 is a portion that holds and holds the plurality of conductor plates 21 in cooperation with each of the plurality of first holding portions 31. In one embodiment, the second holding portion 41 is inserted into the opening 35 formed in the first connection portion 32, thereby holding the conductor plate 21 between the first holding portion 31 and the second holding portion 41. I do. A concave portion 43 is formed on one surface of the second holding portion 41 at a position where the concave portion 43 comes into contact with the tip of the convex portion 34. The depth of the concave portion 43 is determined according to the thickness of the conductive plate 21 and the height of the convex portion 34. For example, a portion that projects from the through hole 22 when the convex portion 34 is inserted into the through hole 22 of the conductive plate 21. The height may be the same or substantially the same as the height.

  The second connecting part 42 connects the plurality of second holding parts 41 at predetermined intervals. The predetermined interval is the same or substantially the same as the arrangement interval of the plurality of conductor plates 21 configuring the wiring 2. The second connecting portion 42 has a bent portion 44 that bends in a convex shape in cross section from a connecting portion with one of the adjacent second holding portions 41 to a connecting portion with the other. Accordingly, when the second holding portion 41 is inserted into the opening 35, the second holding portion 41 is elastically deformed and bent in the longitudinal direction of the second connection portion 42, so that the first insulating member 3 and the second Even if the second insulating member 4 has a manufacturing tolerance, it can be easily inserted into the opening 35.

  According to the wiring fixing structure 100 described above, the conductor plate 21 is sandwiched between the first insulating member 3 (first holding portion 31) and the second insulating member 4 (second holding portion 41). Thereby, the plurality of conductor plates 21 are held at predetermined intervals. Thereby, the wirings 2 can be arranged and fixed on the metal member 1 at a narrow pitch. Further, since the structure is sandwiched between a pair of insulating members, assembly is easy, and the number of steps required for assembly can be reduced.

  Further, according to the wiring fixing structure 100, the conductor plate 21 constituting the wiring 2 has the through hole 22 penetrating in the plate thickness direction, and the first insulating member 3 is the convex portion 34 that can be fitted into the through hole 22. Having. Accordingly, when the conductor plate 21 is fixed, the projection 34 is fitted into the through hole 22, so that the conductor plate 21 can be prevented from being displaced.

  Further, according to the wiring fixing structure 100, the height of the protrusion 34 is equal to or greater than the thickness of the conductor plate 21. Thereby, when the conductor plate 21 is sandwiched and held between the first insulating member 3 and the second insulating member 4, the displacement of the conductor plate 21 can be particularly suppressed.

  Further, according to the wiring fixing structure 100, the second insulating member 4 is formed of an elastic member, and the second connecting portion 42 is connected from one of the adjacent second holding portions 41 to the other. And a bent portion 44 that is bent in a convex shape in cross section toward the connection portion with the connecting portion. Accordingly, when the second holding portion 41 is inserted into the opening 35, the second holding portion 41 is elastically deformed and bent in the longitudinal direction of the second connection portion 42, so that the first insulating member 3 and the second Even if the second insulating member 4 has a manufacturing tolerance, it can be easily inserted into the opening 35.

  Another example of the wiring fixing structure according to the embodiment of the present disclosure will be described. FIG. 4 is a perspective view showing another configuration example of the wiring fixing structure. FIG. 5 is an exploded perspective view of the wiring fixing structure of FIG. FIG. 6 is a sectional view taken along line BB of FIG.

  As shown in FIGS. 4 to 6, the wiring fixing structure 100A includes a second insulating member 4A having a second connecting portion 42A formed in a plate shape. In other words, the second connecting portion 42A included in the wiring fixing structure 100A does not have the bent portion 44. The other points are the same as those of the wiring fixing structure 100.

  According to the wiring fixing structure 100A, the conductor plate 21 is sandwiched between the first insulating member 3 (the first holding portion 31) and the second insulating member 4A (the second holding portion 41). Are held at predetermined intervals. Thereby, the wirings 2 can be arranged and fixed on the metal member 1 at a narrow pitch. Further, since the structure is sandwiched between a pair of insulating members, assembly is easy, and the number of steps required for assembly can be reduced.

  Further, according to the wiring fixing structure 100A, the conductor plate 21 forming the wiring 2 has the through-hole 22 penetrating in the thickness direction, and the first insulating member 3 is the convex portion 34 that can be fitted into the through-hole 22. Having. Accordingly, when the conductor plate 21 is fixed, the projection 34 is fitted into the through hole 22, so that the conductor plate 21 can be prevented from being displaced.

  Further, according to the wiring fixing structure 100A, the height of the projection 34 is equal to or greater than the thickness of the conductor plate 21. Thereby, when the conductor plate 21 is sandwiched and held by the first insulating member 3 and the second insulating member 4A, it is possible to particularly suppress the conductor plate 21 from shifting.

[Processing equipment]
An example of a processing apparatus to which the wiring fixing structures 100 and 100A according to the embodiment of the present disclosure can be applied will be described. FIG. 7 is a cross-sectional view illustrating a configuration example of a processing apparatus including a wiring fixing structure. FIG. 8 is a plan view illustrating a configuration example of a high-frequency antenna of the processing device in FIG.

  A processing apparatus 200 shown in FIG. 7 is a vacuum processing apparatus for performing plasma processing on a glass substrate (hereinafter, referred to as “substrate S”) for an FPD (Flat Panel Display) such as a liquid crystal display or an organic EL display. It is.

  The processing apparatus 200 includes a rectangular cylindrical airtight processing container 201 formed of a conductive material. The processing container 201 is grounded. The processing chamber 201 is vertically divided into an antenna chamber 203 and a processing chamber 204 by a metal window 202 which is a window member formed insulated from the processing chamber 201. The metal window 202 forms a ceiling wall of the processing chamber 204 in one embodiment. The metal window 202 is placed on the support shelf 205 and the support beam 211 via an insulator 216. The metal window 202 is made of, for example, a nonmagnetic conductive metal. Examples of the nonmagnetic conductive metal include aluminum and alloys containing aluminum. Insulator 216 may be, for example, ceramic, polytetrafluoroethylene (PTFE).

  Between the side wall 203a of the antenna chamber 203 and the side wall 204a of the processing chamber 204, a supporting shelf 205 protruding inside the processing chamber 201 and a cross-shaped supporting beam 211 also serving as a shower housing for supplying processing gas are provided. Have been. When the support beam 211 also serves as a shower housing, a gas flow path 212 extending parallel to the surface of the substrate S is formed inside the support beam 211, and the gas flow path 212 is provided in the processing chamber 204. A plurality of gas ejection holes 212a for ejecting gas are communicated. A gas supply pipe 220 a is provided above the support beam 211 so as to communicate with the gas flow path 212. The gas supply pipe 220a penetrates from the ceiling of the processing container 201 to the outside, and is connected to a processing gas supply system 220 including a processing gas supply source, a valve system, and the like. Therefore, in the plasma processing, the processing gas supplied from the processing gas supply system 220 is supplied into the support beam 211 via the gas supply pipe 220a, and is discharged from the gas discharge holes 212a into the processing chamber 204. The support shelf 205 and the support beam 211 are made of a conductive material, preferably a metal such as aluminum.

  In the antenna room 203, a high-frequency antenna 213 is provided above the metal window 202 so as to face the metal window 202. The high-frequency antenna 213 is separated from the metal window 202. During the plasma processing, high-frequency power having a frequency of 13.56 MHz, for example, for generating an induced electric field is supplied from the first high-frequency power supply 215 to the high-frequency antenna 213 via the matching unit 214.

  As shown in FIG. 8, the high-frequency antenna 213 has two spiral antennas 213a and 213b. High-frequency power from a first high-frequency power supply 215 is supplied to each of the spiral antennas 213a and 213b via a matching unit 214. A capacitor 218 is connected to the ends of the spiral antennas 213a and 213b, and the spiral antennas 213a and 213b are grounded via the capacitor 218. An induction electric field is formed in the processing chamber 204 by the high-frequency antenna 213 supplied with the high-frequency power in this way, and the processing gas supplied from the plurality of gas discharge holes 212a is turned into plasma by the induction electric field. When the spiral antennas 213a and 213b constituting the high-frequency antenna 213 are held apart from the metal window 202, the above-described wiring fixing structures 100 and 100A can be used.

  A mounting table 223 for mounting the substrate S is provided below the processing chamber 204 so as to face the high-frequency antenna 213 with the metal window 202 interposed therebetween. The mounting table 223 is made of a conductive material, for example, aluminum whose surface is anodized. The substrate S mounted on the mounting table 223 is suction-held by an electrostatic chuck (not shown).

  The mounting table 223 is housed in the insulator frame 224 and supported by the hollow support 225. The support 225 penetrates through the bottom of the processing container 201 while maintaining an airtight state, and is supported by an elevating mechanism (not shown) provided outside the processing container 201. The mounting table 223 is driven in the vertical direction. A bellows 226 that hermetically surrounds the column 225 is disposed between the insulator frame 224 that stores the mounting table 223 and the bottom of the processing container 201. Thereby, the airtightness in the processing chamber 204 is ensured even by the vertical movement of the mounting table 223. On the side wall 204a of the processing chamber 204, a loading / unloading port 227a for loading / unloading the substrate S and a gate valve 227 for opening / closing the loading / unloading port 227a are provided.

  A second high-frequency power supply 229 is connected to the mounting table 223 via a matching unit 228 by a power supply line 225 a provided in the hollow column 225. The second high frequency power supply 229 applies high frequency power for bias, for example, high frequency power having a frequency of 3.2 MHz to the mounting table 223 during the plasma processing. The ions in the plasma generated in the processing chamber 204 are effectively drawn into the substrate S by the high frequency power for bias.

  In the mounting table 223, a temperature control mechanism including a heating means such as a ceramic heater, a coolant flow path, and the like, and a temperature sensor are provided to control the temperature of the substrate S (none is shown). All of the piping and wiring for these mechanisms and members are led out of the processing vessel 201 through the hollow columns 225.

  An exhaust device 230 including a vacuum pump and the like is connected to the bottom of the processing chamber 204 via an exhaust pipe 231. The processing chamber 204 is evacuated by the exhaust device 230, and the inside of the processing chamber 204 is set and maintained at a predetermined vacuum atmosphere (for example, 1.33 Pa) during the plasma processing.

  The processing device 200 includes a control unit 250 that controls the operation of each unit. The control unit 250 has a CPU (Central Processing Unit), a ROM (Read Only Memory), and a RAM (Random Access Memory). The CPU executes a desired process according to a recipe stored in a storage area such as a RAM. In the recipe, control information of the apparatus with respect to the process conditions is set. The control information may be, for example, gas flow rate, pressure, temperature, process time. The program used by the recipe and control unit 250 may be stored in, for example, a hard disk or a semiconductor memory. The recipe or the like may be set at a predetermined position and read out while being stored in a portable computer-readable storage medium such as a CD-ROM or a DVD.

  According to the processing apparatus 200 described above, the conductor plate 21 is placed between the first insulating member 3 (first holding unit 31) and the second insulating members 4 and 4A (second holding unit 41). Wiring fixing structures 100 and 100A that hold the plurality of conductor plates 21 at predetermined intervals by being sandwiched are provided. Thus, the high-frequency antennas 213 can be arranged and fixed at a narrow pitch on the metal window 202, so that the number of turns per unit area can be increased.

  In the above-described processing apparatus 200, the case where the window member is the metal window 202 has been described, but the window member may be a dielectric window. When the high-frequency antenna 213 is directly disposed on the dielectric window, a creeping discharge may occur on the surface of the dielectric window. In such a case, the creeping discharge is prevented by applying the wiring fixing structures 100 and 100A described above. be able to. Also in the case of the dielectric window, it can be supported by the support beam 211 with the same structure as the case of the metal window 202, and the wiring fixing structures 100 and 100A can be fixed to the fixing surface of the dielectric window. Note that, similarly to the case of the metal window 202, the leg 33 of the first insulating member 3 may be directly fixed to the fixing surface of the dielectric window with a bolt or the like, but is indirectly fixed via another member. You may. The material of the dielectric window is made of, for example, ceramics or quartz.

  The embodiments disclosed this time are to be considered in all respects as illustrative and not restrictive. The above embodiments may be omitted, replaced, or modified in various forms without departing from the scope and spirit of the appended claims.

Reference Signs List 100 Wiring fixing structure 1 Metal member 11 Metal surface 2 Wiring 21 Conductor plate 3 First insulating member 31 First holding part 32 First connecting part 33 Leg 34 Convex part 4 Second insulating member 41 Second holding Part 42 Second connection part

Claims (12)

A metal member having a metal surface,
Wiring in which a plurality of conductor plates having through holes penetrating in the thickness direction are arranged in parallel with each other at predetermined intervals,
A plurality of first holding portions each having a projection that can be fitted into the through hole; a first connection portion connecting the plurality of first holding portions at the predetermined interval; and the first connection A first insulating member formed extending from the portion in parallel with the first holding portion and having a leg fixed to the metal surface;
A plurality of second holding portions that sandwich and hold the conductor plate in cooperation with each of the plurality of first holding portions, and a second connecting portion that connects the plurality of second holding portions at the predetermined interval. A second insulating member having:
With
The wiring is held apart from the metal surface by the first insulating member and the second insulating member,
Wiring fixing structure. The first connection portion is formed in a plate shape, and has a plurality of openings penetrating in a plate thickness direction,
By inserting each of the plurality of second holding portions into each of the plurality of openings, the conductor plate is sandwiched.
The wiring fixing structure according to claim 1. The main surface of the conductor plate is orthogonal to the metal surface,
The wiring fixing structure according to claim 1. The height of the protrusion is equal to or greater than the thickness of the conductor plate,
The wiring fixing structure according to claim 1. A concave portion is formed in the second holding portion at a position in contact with the convex portion;
The wiring fixing structure according to claim 1. The second connecting portion has a bent portion that bends in a convex shape in cross section from a connecting portion with one of the adjacent second holding portions toward a connecting portion with the other.
The wiring fixing structure according to claim 1. The second insulating member is formed of an elastic member;
The wiring fixing structure according to claim 1. The elastic member is a polyetherimide,
The wiring fixing structure according to claim 7. The metal member forms a ceiling wall of a processing container that accommodates a substrate and performs processing.
The wiring fixing structure according to claim 1. A processing container including a window member having a fixed surface,
Wiring in which a plurality of conductor plates having through holes penetrating in the thickness direction are arranged in parallel with each other at predetermined intervals,
A plurality of first holding portions each having a projection that can be fitted into the through hole; a first connection portion connecting the plurality of first holding portions at the predetermined interval; and the first connection A first insulating member having a leg portion formed to extend from the portion in parallel with the first holding portion and fixed to the fixing surface;
A plurality of second holding portions that sandwich and hold the conductor plate in cooperation with each of the plurality of first holding portions, and a second connecting portion that connects the plurality of second holding portions at the predetermined interval. A second insulating member having:
With
The wiring is held apart from the fixing surface by the first insulating member and the second insulating member,
Processing equipment.   The processing apparatus according to claim 10, wherein the window member is a metal window.   The processing apparatus according to claim 10, wherein the window member is a dielectric window.

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