JP2019219732A - Dual interface card and manufacturing method thereof - Google Patents

Abstract

To provide a DIF card that uses conducting wires as an antenna and a contact terminal of the antenna and has improved reliability (particularly, dynamic flexural strength and resistance to high temperature and high humidity), and a manufacturing method thereof.SOLUTION: A dual interface card having a contact communication function and a non-contact communication function includes: a card base material including one or more core sheets; and an IC module embedded from a surface of the card material. A conducting wire is disposed for one of the one or more core sheets. The conducting wire forms a winding antenna section for providing the non-contact communication function and a contact terminal section brought into electrical contact with a terminal of the IC module, and an area ratio of the conducting wire in the contact terminal section is 40% or more.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a dual interface card and a method for manufacturing the same.

  A dual interface card (hereinafter, also referred to as a "DIF card") includes an IC module embedded from the surface thereof and an antenna disposed inside the DIF card and electrically connected to the IC module. A card provided with both contact communication and non-contact communication functions when used together, and is also called a combination card, a combination card, or a composite IC card. Note that the IC module has a built-in IC chip and a terminal of the IC module having a contact communication function.

  As described above, there are an electromagnetic method and an electric method for connecting an antenna for providing a non-contact communication function to a DIF card and an IC module.

  For example, Patent Literature 1 discloses a composite IC card in which an antenna coil and an IC module are connected by an electromagnetic coupling method. However, in such an electromagnetic coupling type composite card in which the antenna coil and the IC module are not directly connected, a loss may occur at the time of electromagnetic coupling, and a problem may occur in communication reliability.

  In contrast, Patent Documents 2 to 4 disclose DIF cards in which an antenna and an IC module are in electrical contact with each other via respective terminals.

  Specifically, in Patent Document 2, the joint between the non-contact communication antenna provided inside the card substrate and the IC module is formed by a lattice-shaped antenna joint pattern formed by etching. The card is disclosed.

  Patent Document 3 discloses a card in which an antenna formed by a conductive wire and an IC module are electrically connected via a conductive plate.

  Patent Document 4 discloses a card in which a coil portion of an antenna formed by a conductive wire and an IC module are electrically connected to each other through a meander-type connecting portion formed by continuously bending a conductive wire, and an etching method. Discloses a card in which an antenna formed by etching is electrically connected to an IC module via a connection portion of the antenna formed by the method.

JP-A-11-149537 JP 2004-280503 A JP 2015-97100 A JP 2012-93952 A

  When the method of manufacturing an antenna by etching is used among the methods of the above-mentioned prior art documents, there is a known problem that the cost of the card increases because the antenna becomes high. Further, even when the antenna is formed by a conductive wire, the use of a plate for a connection portion with an IC module increases the number of manufacturing steps and increases the cost of the card.

  On the other hand, the DIF card in which the antenna and the connection portion between the antenna and the IC module (hereinafter also referred to as “contact terminal portion”) are all formed of conductive wires has an advantage that the antenna is inexpensive.

  However, in the case of such a DIF card in which the antenna and the contact terminal of the antenna are manufactured using a conductive wire, the reliability (for example, dynamic bending strength and moisture resistance) of the DIF card formed by the etching method is limited. There is a problem that it is inferior to the case of a DIF card using a plate as a contact terminal of a card or an antenna.

  Therefore, the present invention has been made to solve the problem in the case of a DIF card using a conductive wire as an antenna and a contact terminal of the antenna, and has high reliability (in particular, dynamic bending strength and high temperature and humidity resistance). And a method for manufacturing the same.

  The present inventors have found that the above problem can be solved by the following means.

<Aspect 1>
A dual interface card having a contact communication function and a contactless communication function,
Having a card substrate including one or more core sheets, and an IC module embedded from the surface of the card substrate,
A conductor is arranged on one of the one or more core sheets,
The conductive wire forms a winding antenna portion for providing the non-contact communication function, and a contact terminal portion in electrical contact with a terminal of the IC module; and the conductive wire in the contact terminal portion Has an area ratio of 40% or more,
Dual interface card.
<Aspect 2>
The dual interface card according to aspect 1, wherein an area ratio of the conductive wire in the contact terminal portion is 44% or more.
<Aspect 3>
The dual interface card according to aspect 1 or 2, wherein the contact terminal portion is formed in a meander shape by the conductive wire.
<Aspect 4>
The dual interface card according to aspect 3, wherein the meander pitch of the contact terminals is 0.3 mm or less.
<Aspect 5>
The dual interface card according to any one of aspects 1 to 4, wherein a diameter of the conductor is 0.08 mm or more and 0.16 mm or less.
<Aspect 6>
The dual interface card according to any one of aspects 1 to 5, wherein the core sheet on which the conductive wires are arranged is a resin sheet having a Vicat softening temperature of 70 ° C or higher.
<Aspect 7>
A method for manufacturing a dual interface card having a contact communication function and a contactless communication function, comprising the following steps (a) to (c):
(A) forming a card substrate comprising one or more core sheets;
(B) cutting, from the surface of the card base material, an area to be embedded in which the IC module is to be embedded; and (c) embedding the IC module in the area to be embedded.
A conductor is disposed on one of the one or more core sheets,
The conductive wire forms a wire antenna portion for providing the non-contact communication function, and a contact terminal portion in electrical contact with a terminal of the IC module; and the conductive wire in the contact terminal portion Has an area ratio of 40% or more,
Method.
<Aspect 8>
The method according to aspect 7, wherein an area ratio of the conductive wire in the contact terminal portion is 44% or more.
<Aspect 9>
The method according to aspect 7 or 8, wherein the contact terminal portion is formed in a meander shape by the conductive wire.
<Aspect 10>
The method according to aspect 9, wherein the meander pitch of the contact terminals is 0.3 mm or less.

  According to the present invention, it is possible to improve the reliability (particularly, dynamic bending strength and resistance to high temperature and humidity) of a DIF card using a conductor as a contact terminal of the antenna and the antenna.

FIG. 1 is a plan view showing one embodiment of a conductive wire arranged on one core sheet included in the card base material of the present invention. FIG. 2 is an enlarged view showing a part of a meander type contact terminal portion. FIG. 3A is a schematic plan perspective view showing one embodiment of a region to be embedded on the card base material according to the present invention. FIG. 3B is a diagram showing the vicinity of a region to be embedded in the cross section taken along the line AA in FIG. FIG. 4 is a schematic cross-sectional view of one embodiment after the IC module is embedded in the area to be embedded. FIG. 5 is a schematic diagram showing the order of lamination of card substrates according to Examples 1 and 2 and Comparative Examples 1 and 2. FIG. 6 is a schematic diagram illustrating a stacking order of card base materials according to Comparative Example 3.

≪DIF card≫
The DIF card of the present invention
A dual interface card having a contact communication function and a contactless communication function,
Having a card substrate including one or more core sheets, and an IC module embedded from the surface of the card substrate;
A conductor is arranged on one of the one or more core sheets,
The conductor forms a winding antenna part for providing a non-contact communication function, and a contact terminal part which is in electrical contact with a terminal of the IC module, and an area ratio of the conductor in the contact terminal part is: 40% or more.

  As described above, the DIF card of the present invention can improve dynamic bending strength and moisture resistance despite using a conductor as an antenna and a contact terminal of the antenna. According to the inventor's intensive research, the dynamic bending strength and the moisture resistance are improved when the area ratio of the conductive wire in the contact terminal portion electrically contacting the terminal of the IC module is 40% or more. This is the result of finding that

  Hereinafter, the components of the DIF card of the present invention will be described in detail.

<Card base material>
In the present invention, the card substrate includes one or a plurality of core sheets.

  The thickness of the card base material is not particularly limited, and may be, for example, 500 μm or more, 550 μm or more, 600 μm or more, 650 μm or more, 680 μm or more, 700 μm or more, 750 μm or more, or 800 μm or more, or 900 μm or less, 850 μm. Or less, or 800 μm or less.

(Conductor)
Conductive wires are arranged on one of one or a plurality of core sheets included in the card base material. The conductor forms a wire-wound antenna section for providing a non-contact communication function and a contact terminal section which is in electrical contact with a terminal of the IC module.

  For example, FIG. 1 is a plan view showing one embodiment of a conductive wire arranged on one core sheet included in the card base material of the present invention. As shown in FIG. 1, a conductor 10 is arranged on a core sheet 20. The conducting wire 10 forms a winding antenna section 11 and contact terminal sections 12a and 12b.

  In addition, the conductive wire may be disposed on the front surface of the core sheet, or may be disposed on the rear surface.

  In this specification, the “front side” refers to the side facing the front side of the obtained DIF card, and the “back side” refers to the side having the opposite direction to the front side. Yes, that is, the surface facing the back side of the obtained DIF card.

  The wire-wound antenna portion is a portion in which a conductive wire is wound in a coil shape (spiral shape) and has a non-contact communication function. For example, in FIG. 1, the winding antenna unit 11 is wound in a coil shape of about three turns. The number of turns of the winding antenna unit is not particularly limited, and can be appropriately set according to the purpose and application.

  The contact terminal portion is a portion formed by bending the conductive wire so that the conductive wire extends from the end of the winding antenna portion and forms a region having a certain area, and has a role of contacting the terminal of the IC module. Part. Here, the region having a certain area is a region formed by bending a conductive wire, and is a region having an area that can contact a terminal of an IC module as a minimum area. For example, in FIG. 1, the contact terminal portion 12a is formed by bending the conductive wire so that the conductive wire 10 extends from one end of the wire antenna portion 11 and forms a region having a certain area. The contact terminal portion 12b is formed by bending the conducting wire so that the conducting wire 10 extends from the other end of the wire antenna portion 11 and forms a region having a certain area.

  In FIG. 1, the contact terminal portions 12a and 12b are formed so as to extend in the direction of the card center line from two ends of the wound antenna portion 11 so as to face each other. The ends may extend in opposite directions to form respective contact terminals.

  The shape of the contact terminal portion is not particularly limited as long as the contact terminal portion can electrically contact the terminal of the IC module. For example, the contact terminal portion may be formed in a meander shape or a spiral shape by a conductive wire. More specifically, for example, the contact terminal portions 12a and 12b shown in FIG. 1 are each formed in a meander shape by a conductive wire.

  The term “electrical contact with the contact terminal portion and the terminal of the IC module” means that the contact terminal portion of the conductive wire and the terminal on the back side of the substrate portion of the IC module are in electrical contact with each other via a conductive adhesive. Alternatively, when the terminal on the back side of the substrate portion of the IC module is protruding, the contact terminal portion of the conductive wire may be in direct electrical contact with the terminal on the back side of the substrate portion of the IC module.

  The meander pitch when the contact terminal portion is formed in a meander shape by a conductive wire is not particularly limited. From the viewpoint of further improving the effect of the present invention, the meander pitch of the contact terminals may be 0.50 mm or less, 0.30 mm or less, 0.28 mm or less, 0.25 mm or less, or 0.20 mm or less.

  In the present invention, the area ratio of the conductive wire in the contact terminal portion may be 40% or more, and is 44% or more, 45% or more, 50% or more, or 55% or more from the viewpoint of more exerting the effects of the present invention. You may. The upper limit of the area ratio of the conductor in the contact terminal portion is not particularly limited, and may be 100%. However, in consideration of the operability in forming the contact terminal portion by bending depending on the type of the conductor, the upper limit is 100%. May be less than.

  When the contact terminal portion is formed in a uniform meander shape by the conductor, for example, as shown in FIG. 2, the area ratio of the conductor 1 in the contact terminal portion is the ratio of the diameter d of the conductor 1 to the meander pitch p. (D / p). In this case, the ratio of the diameter of the conductive wire to the meander pitch may be 40% or more, and is 44% or more, 45% or more, 50% or more, or 55% or more from the viewpoint of more effectively exhibiting the effects of the present invention. You may.

  The material of the conductive wire is not particularly limited as long as it has a communication function and a conductive function, and may be a metal wire such as copper, aluminum, or gold. Further, the conductive wire may be coated with an insulating material such as a resin as necessary.

  The diameter of the conductive wire is not particularly limited as long as the communication function and the conductive function can be ensured. For example, 0.05 mm or more, 0.06 mm or more, 0.07 mm or more, 0.08 mm or more, 0.09 mm or more, 0.10 mm or more , 0.11 mm or more, 0.12 mm or more, 0.13 mm or more, 0.14 mm or more, or 0.15 mm or more, and 0.20 mm or less, 0.19 mm or less, 0.18 mm or less, 0.1 mm or less. It may be 17 mm or less, or 0.16 mm or less.

(Core sheet)
The material of the core sheet is not particularly limited. For example, polyolefin resins such as polyethylene and polypropylene, polystyrene resins, polyvinyl chloride resins (PVC), poly (meth) acrylate resins, acrylic resins, polyacetal resins, crystals Crystalline polyester resins such as crystalline polyethylene terephthalate (PET), polybutylene terephthalate, and polyethylene naphthalate (PEN); and amorphous polyester resins such as a copolymer of terephthalic acid with ethylene glycol and cyclohexanedimethanol (PET-G) , A thermoplastic resin such as a polyamide resin, a polycarbonate (PC) resin, a polyphenylene sulfide resin, and a polyimide resin, or a polymer alloy formed by mixing at least two or more of these resins. .

  The core sheet may be a single layer using these resins, or may be a laminate thereof.

  Further, in consideration of the case where the core sheet on which the above-described conductors are arranged is, for example, arranged on the core sheet by drawing while applying heat, in order to draw a fine pattern in the contact terminal portion, for example, a small meander pitch In order to draw the meander-shaped contact terminal portion, a core sheet having high heat resistance is preferable. Specifically, it is preferable that the core sheet on which the conductive wires are arranged is a resin sheet having a Vicat softening temperature of 70 ° C. or higher. The Vicat softening temperature is, for example, 75 ° C or higher, 80 ° C or higher, 85 ° C or higher, 90 ° C or higher, 95 ° C or higher, 100 ° C or higher, 105 ° C or higher, 110 ° C or higher, 115 ° C or higher, or 120 ° C or higher. The temperature may be 170 ° C. or lower, 160 ° C. or lower, 150 ° C. or lower, 140 ° C. or lower, or 130 ° C. or lower.

  In the present invention, the Vicat softening temperature is measured in accordance with JIS K7206: 2016 (the test load is measured according to the method specified in the A50 method. Specifically, a test piece is placed on a heat transfer medium, and the center of the test piece is measured. The temperature of the heat transfer medium is raised while the end surface of the load bar (cross-sectional area: 1 mm 2) is pressed against the upper surface, and the temperature (° C.) when the load bar enters the test piece by 1 mm is defined as the Vicat softening temperature.

  The thickness of each core sheet is not particularly limited. For example, 50 μm or more, 75 μm or more, 90 μm or more, 100 μm or more, 125 μm or more, 150 μm or more, 175 μm or more, 180 μm or more, 200 μm or more, 250 μm or more, 300 μm or more, 350 μm or more Or 400 μm or more. Further, from the viewpoint of pursuing the thinness of the DIF card, it may be 500 μm or less, 450 μm or less, 400 μm or less, 350 μm or less, 300 μm or less, 280 μm or less, 250 μm or less, or 200 μm or less.

  The number of core sheets included in the card base material according to the present invention is one or more. That is, the number of core sheets may be one or more. For example, the number of core sheets can be freely set in a range of two or more and ten or less according to a desired thickness of the card base material. In addition, the core sheet in which the above-mentioned conductor is arranged in one of these core sheets is indispensable.

(Other layers)
The card base material according to the present invention may further include other layers in addition to the core sheet. For example, an over film or the like can be included.

  The over film has a function of protecting the core sheet and the like, and is preferably located on at least the surface of the card substrate, and more preferably located on the outermost surface on both the front side and the back side of the card substrate.

  The thickness of the over film is not particularly limited, and may be, for example, 30 μm or more, 35 μm or more, 40 μm or more, 45 μm or more, 50 μm or more, or 55 μm or more, and 80 μm or less, 75 μm or less, 70 μm or less, 65 μm or less. Or 60 μm or less.

  The material of the over film is not particularly limited, and for example, the above-described material of the core sheet can be appropriately used.

  In addition, the overfilm may be added with additives such as silica, silicone oil, a lubricant such as wax, a water-proofing agent such as glyoxal, a dispersant, an antifoaming agent, an antioxidant, a fluorescent dye, and an ultraviolet absorber. Good.

<IC module>
The IC module is embedded from the surface of the card base described above. The IC module may have a substrate portion and a sealing portion for sealing the IC chip.

(Board part)
The material constituting the substrate is not particularly limited, and may be, for example, glass-epoxy or polyimide.

  The substrate portion has a terminal on the back side that can be connected to the above-described contact terminal portion of the conductive wire. The material forming the terminal may be a conductive material, for example, a metal such as copper, gold, or aluminum.

  The substrate part may have its front side exposed from the surface of the card base material. Further, an external contact terminal that can make contact with the outside can be provided on the front surface of the substrate unit. The external contact terminal may be, for example, an external contact terminal in which a plating layer made of nickel, gold, silver, or the like is laminated on a pattern made of copper.

(Sealing part)
The sealing portion may be embedded into the card base material. The material of the sealing portion is not particularly limited, and may be, for example, a thermosetting resin such as an epoxy resin, an acrylic resin, a urethane resin, or a phenol resin.

  An IC chip is sealed in the sealing portion. The connection between the IC chip and the terminal can be performed by a connection member such as wire bonding or an anisotropic conductive paste.

  Normally, the above-described substrate, sealing portion, and IC chip are collectively referred to as “Chip On Tape”, or simply as “COT”.

製造 Manufacturing method of DIF card≫
The present invention also provides a method for manufacturing a DIF card.

The method for manufacturing a dual interface card having a contact communication function and a contactless communication function according to the present invention includes the following steps (a) to (c):
(A) forming a card substrate comprising one or more core sheets;
(B) cutting, from the surface of the card base material, an area to be embedded in which the IC module is to be embedded; and (c) embedding the IC module in the area to be embedded.
A conductor is arranged on one of the one or more core sheets,
The conductor forms a winding antenna part for providing a non-contact communication function, and a contact terminal part which is in electrical contact with a terminal of the IC module, and an area ratio of the conductor in the contact terminal part is: 40% or more.

  Hereinafter, each step will be described with reference to the drawings. Note that, for each step, the description of the parts related to the contents in the above-described DIF card of the present invention is omitted.

<Step (a)>
In the step (a), a card base material including one or a plurality of core sheets is formed. Here, a conductive wire is disposed on one of the one or more core sheets, and the conductive wire electrically contacts a wire-wound antenna unit for providing a non-contact communication function and a terminal of the IC module. And the area ratio of the conducting wire in the contact terminal portion is 40% or more.

(Formation of core sheet on which conductive wires are arranged)
As a method of arranging the above-described conductors on the core sheet, specifically, in accordance with the shape of the designed winding antenna portion and the contact terminal portion, the winding is formed into an air-core coil shape using a jig. A method of burying the core sheet in the core sheet may be used, or a method of drawing a conductive line on the core sheet while applying heat may be used.

  From the viewpoint that the shape of the desired contact terminal portion can be easily processed, the conductor drawing method is preferable.

  In the lead drawing method, specifically, the lead can be discharged onto the core sheet while applying heat, ultrasonic waves, or a combination thereof, and the lead can be drawn on the core sheet in a predetermined shape while being pulled. Further, for convenience of operation, it is preferable to draw a lead wire from one contact terminal portion, draw a winding antenna portion, and then draw another contact terminal portion.

  For example, in accordance with the form (shape) of the conductor shown in FIG. 1, the wire drawing method is used to change the winding antenna part and the contact terminal part so that the area ratio of the conductor in the contact terminal part becomes 40% or more. Thus, the conductor can be arranged on the core sheet.

  The core sheet is not particularly limited. For example, a resin serving as a material of the core sheet or a composition thereof may be formed by an extrusion method or the like, or a commercially available product may be used.

  Next, a desired number of other core sheets and / or an over film to be used as necessary are laminated using the core sheet on which the above-described conductive wires are arranged, thereby forming a card base material. it can. Here, the “other core sheet” refers to a core sheet on which a conductor is not arranged, and is distinguished from a core sheet on which a conductor is arranged.

  As an example of forming a card base material, from the front side, a first other core sheet / a second core sheet on which a conductive wire is arranged / a second other core sheet are laminated in this order, and hot pressed. A card substrate can be formed. In the card base material thus formed, for example, the number of the first and second core sheets may be zero (that is, they may not be provided), and may be one or more. Is also good. Further, an over film may be further laminated as the outermost layer on the front side and the back side.

<Step (b)>
In the step (b), an area to be embedded with the IC module is cut from the surface of the card base material.

  The position of the region to be embedded can be appropriately set so that the contact terminal portion of the above-described conductor and the terminal of the IC module can be electrically contacted. For example, when viewed from a direction perpendicular to the surface of the card base material, the area to be embedded can be directly above the contact terminal portion of the conductive wire.

  FIG. 3A is a schematic plan perspective view showing one embodiment of a region to be embedded on the card base material according to the present invention.

  As shown in FIG. 3A, when viewed from a direction perpendicular to the surface of the card base material 30, an embedding area 40 in which the IC module is to be embedded is located directly above the contact terminals 12 a and 12 b of the conductor. Has been cut.

  The size and shape of the area to be embedded can be appropriately set according to the size and shape of the IC module to be used.

  The region to be embedded can be cut so as to include the first recess, the second recess, and the contact opening present in the first recess. Here, the first recess can accommodate a substrate portion of the IC module, and the second recess can accommodate a sealing portion of the IC module. In addition, the contact opening existing in the first concave portion is an opening through which the terminal of the IC module and the contact terminal are in electrical contact.

  Generally, when viewed from a direction perpendicular to the surface of the card substrate, preferably, the area of the first recess is larger than the area of the second recess, and the depth of the first recess is preferably larger. Therefore, the depth of the second concave portion is deeper.

  More specifically, the first concave portion may be cut to a depth that does not expose the contact terminal portion of the conductor present inside the card base material. Further, it is preferable that the contact opening existing in the first recess is cut until the contact terminal is exposed. Here, the shape and size of the contact opening are not particularly limited as long as the area ratio of the conductive wire in the contact terminal portion exposed from the contact opening is 40% or more.

  Further, the second concave portion may be formed by cutting until the second concave portion penetrates the contact terminal portion of the conductive wire existing inside the card base material. That is, when cutting the second concave portion, a part of the conductive wire may be cut. The contact terminal may be cut off.

  For example, as shown in FIG. 3A, the buried region has a first concave portion 40a and a second concave portion 40b. The first concave portion 40a has a contact opening 40c where the contact terminal portion 12a is exposed, and a contact opening 40d where the contact terminal portion 12b is exposed.

  Further, FIG. 3B is a view of the vicinity of a region to be embedded in the cross section taken along the line AA in FIG. As shown in FIG. 3B, the first concave portion 40a is wider than the second concave portion 40b, and the contact terminal portions 12a are respectively formed from the contact openings 40c and 40d in the first concave portion 40a. And 12b are exposed. The second recess 40b is cut deeper than the depth positions of the contact terminals 12a and 12b.

<Step (c)>
In the step (c), the IC module is embedded in the area to be embedded.

  When the contact terminal portion and the terminal on the back side of the substrate portion of the IC module are in electrical contact with each other via a conductive adhesive, a conductive adhesive is applied to the contact opening of the first concave portion in the area to be embedded. Can be filled.

  The conductive adhesive is not particularly limited, and for example, a paste in which metal particles, conductive carbon material particles, or the like are dispersed in a resin can be used. The metal particles may be, for example, gold, silver, copper, platinum, nickel and the like. The conductive carbon material particles may be, for example, carbon black, graphite, or the like. The resin may be, for example, an epoxy resin.

  Before embedding the IC module, an adhesive tape may be attached to the back side of the substrate of the IC module. In this case, it is preferable that the adhesive tape be adhered so as to avoid terminals (IC module terminals that come into contact with the contact terminals of the conductive wires) existing on the back side of the substrate of the IC module. The adhesive tape may be, for example, a thermoplastic or thermosetting adhesive tape.

  FIG. 4 is a schematic cross-sectional view of one embodiment after the IC module is embedded in the area to be embedded.

  As shown in FIG. 4, the IC module 50 is embedded from the surface of the card base material into the area to be embedded. At this time, the front side of the substrate part 51 of the IC module is exposed on the front side surface of the card base material, and the terminals 51a and 51b present on the back side of the substrate part 51 are connected via the conductive adhesives 60a and 60b, respectively. , And the contact terminals 12a and 12b. Further, the IC module is fixed to the first concave portion in the area where the IC module is to be embedded by the adhesive tape 60 on the back surface of the substrate section 51. Note that the IC chip 53 is sealed in the sealing portion 52.

  According to the manufacturing method of the present invention, a DIF card using a conductor as an antenna and a contact terminal of the antenna can be manufactured, and the manufactured DIF card of the present invention has preferable dynamic bending strength and moisture resistance. Can be.

<Examples 1 and 2, and Comparative Examples 1 and 2>
Using the configuration of the card base material shown in Table 1 below, based on the lamination order of the card base material shown in FIG. 5, from the front side, the first over film / the first core sheet / the second , A third core sheet / fourth core sheet / second overfilm were laminated in this order, and hot pressed to produce a card base material.

  At this time, on the back surface of the second core sheet, a conductive wire forming a wound antenna portion and a contact terminal portion was arranged. A copper wire having a wire diameter of 0.11 mm was used as the conductive wire. The meander pitch of the contact terminals of Examples 1 and 2 and Comparative Examples 1 and 2 and the area ratio of the conductor in the contact terminals were as shown in Table 3, respectively.

  Then, using a thermoplastic tape, the IC module was embedded from the surface of the card base material, and DIF cards of Examples 1 and 2 and Comparative Examples 1 and 2 were produced.

<Comparative Example 3>
Using the configuration of the card base material shown in Table 2 below, based on the stacking order of the card base material shown in FIG. 6, from the front side, the first over film / the first core sheet / the second And a spacer / third core sheet / fourth core sheet / second overfilm in this order, and hot-pressed to produce a card base material. In addition, as shown in FIG. 6, the etching antenna is disposed facing the front surface (IC module side) of the antenna sheet.

  At this time, a copper etching antenna was used as the etching antenna. The antenna thickness was 35 μm.

  Then, using a thermoplastic tape, the IC module was embedded from the surface of the card base material to produce a DIF card of Comparative Example 3.

<Evaluation>
For each of the DIF cards manufactured in each of the above Examples and Comparative Examples, four identical samples were prepared, and a dynamic bending test and a high-temperature and high-humidity test were performed as reliability tests.

(Dynamic bending test)
A dynamic bending test was performed according to JIS X6305-1: 2010. However, in this case, a reader / writer was used every time the DIF card was bent 250 times in the long side direction and the short side direction on the front side and 250 times in the long side direction and the short side direction on the back side for a total of 1000 times. To confirm that contactless communication is possible. The minimum standard is that there is no abnormality in the non-contact communication function even after bending 4000 times. If no abnormality occurs in the non-contact communication function even after exceeding 4000 times, the test is continued and the abnormality occurs in the non-contact communication function. Record the minimum number of times The higher the number, the better.

(Result of dynamic bending test)
The results of performing the above-described dynamic bending test are as shown in Table 3 below.

  That is, in the sample of the DIF card of Example 1, there was no abnormality after 10,000 times, and abnormality was confirmed in the non-contact communication function in 2 parts after 11,000 times. In the sample of the DIF card of Example 2, there was no abnormality in the non-contact communication function after 10,000 times, and abnormality was confirmed in three parts after 11,000 times. In the sample of the DIF card of Comparative Example 1, no abnormality was found in the non-contact communication function after 7,000 times, and abnormality was confirmed in one part after 8,000 times. In the sample of the DIF card of Comparative Example 2, no abnormality was found in the non-contact communication function after 5,000 times, and abnormality was confirmed in three parts in 6,000 times. In the sample of the DIF card of Comparative Example 3, no abnormality was found in the non-contact communication function after 10,000 times, and abnormality was confirmed in two parts after 11,000 times.

  Thus, the DIF card of the present invention (Examples 1 and 2) was able to obtain the same high reliability as the etched antenna (Comparative Example 3) in the dynamic bending test.

(High temperature and humidity test)
It is left for 96 hours in an atmosphere at 50 ° C. and a relative humidity of 95%. After removing from the atmosphere, check that there is no abnormality in the non-contact communication function.

(Results of high temperature and high humidity test)
The results of the above-described high-temperature and high-humidity test are shown in Table 3 below.

  That is, it was confirmed that the samples of the DIF cards of Examples 1 and 2 each had no abnormality in the non-contact communication function in all four copies. In the sample of the DIF card of Comparative Example 1, it was confirmed that the non-contact communication function was abnormal in two of the four copies. It was confirmed that the DIF card samples of Comparative Example 2 had abnormalities in the non-contact communication function in all four parts. It was confirmed that the samples of the DIF card of Comparative Example 3 had no abnormality in the non-contact communication function in all four parts.

  As described above, the DIF cards (Examples 1 and 2) of the present invention were able to obtain the same high reliability as the etching antenna (Comparative Example 3) in the high-temperature and high-humidity test.

(Result Summary)
The results of the dynamic bending test and the high-temperature and high-humidity test are summarized in Table 3 below.

<Examples 3 and 4, and Comparative Examples 4 and 5>
In the above Examples 1 and 2 and Comparative Examples 1 and 2, the copolymer (PET-G) of terephthalic acid having a Vicat softening temperature of 120 ° C, ethylene glycol and cyclohexanedimethanol used as the second core sheet was used. Instead, DIF cards for Examples 3 and 4 and Comparative Examples 4 and 5 were prepared in the same manner except that the materials shown in Table 4 below were used, and the same as the reliability test described above. The results are shown in Table 4.

  Table 4 also shows the results of Examples 1 and 2 and Comparative Examples 1 and 2 for the sake of comparison.

  As can be seen from the results in Table 4, the DIF cards of the present invention (Examples 1 to 4) have higher reliability than the DIF cards of the comparative examples.

  In addition, it was found that the reliability test result was improved when a core sheet having a relatively high Vicat softening temperature was used as compared with a core sheet having a relatively low Vicat softening temperature.

DESCRIPTION OF SYMBOLS 1 Lead wire of a contact terminal part 10 Lead wire 11 Winding antenna part 12a, 12b Contact terminal part 20 Core sheet 30 Card base material 40 Expected area for embedding an IC module 40a First concave part 40b Second concave part 40c, 40d Contact opening part Reference Signs List 50 IC module 51 IC module substrate part 51a, 51b IC module terminal 52 IC module sealing part 53 IC chip d: Conductor diameter p: Meander pitch

Claims (10)

A dual interface card having a contact communication function and a contactless communication function,
Having a card substrate including one or more core sheets, and an IC module embedded from the surface of the card substrate,
A conductor is arranged on one of the one or more core sheets,
The conductive wire forms a winding antenna portion for providing the non-contact communication function, and a contact terminal portion in electrical contact with a terminal of the IC module; and the conductive wire in the contact terminal portion Has an area ratio of 40% or more,
Dual interface card.   The dual interface card according to claim 1, wherein an area ratio of the conductive wire in the contact terminal portion is equal to or greater than 44%.   The dual interface card according to claim 1, wherein the contact terminal portion is formed in a meander shape by the conductive wire.   4. The dual interface card according to claim 3, wherein the meander pitch of the contact terminals is 0.3 mm or less.   5. The dual interface card according to claim 1, wherein a diameter of the conductor is 0.08 mm or more and 0.16 mm or less. 6.   The dual interface card according to any one of claims 1 to 5, wherein the core sheet on which the conductive wires are arranged is a resin sheet having a Vicat softening temperature of 70 ° C or higher. A method for manufacturing a dual interface card having a contact communication function and a contactless communication function, comprising the following steps:
(A) forming a card substrate comprising one or more core sheets;
(B) cutting, from the surface of the card base material, an area to be embedded in which the IC module is to be embedded; and (c) embedding the IC module in the area to be embedded.
A conductor is arranged on one of the one or more core sheets,
The conductive wire forms a winding antenna portion for providing the non-contact communication function, and a contact terminal portion in electrical contact with a terminal of the IC module; and the conductive wire in the contact terminal portion Has an area ratio of 40% or more,
Method.   The method according to claim 7, wherein an area ratio of the conductive wire in the contact terminal portion is 44% or more.   The method according to claim 7, wherein the contact terminal portion is formed in a meander shape by the conductive wire.   The method according to claim 9, wherein the meander pitch of the contact terminals is 0.3 mm or less.

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