JP2019210415A - Adhesive film - Google Patents

Abstract

To provide an adhesive film that keeps the amount of use of conductive particles at a minimum necessary level.SOLUTION: One aspect of the present invention is an adhesive film 1 having a base material 2, a conductive adhesive layer 3 provided on a part of one face of the base material 2, and a non-conductive adhesive layer 4 provided on another part of the one face.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an adhesive film.

  Conventionally, in the fields of semiconductors, liquid crystal displays, and the like, various adhesives are used for fixing electronic components, connecting circuits, and the like. As an example of the use of such an adhesive, there is known a method of electrically connecting electronic components using an adhesive film in which conductive particles are dispersed in an adhesive to impart conductivity (for example, Patent Document 1).

JP2013-207115A

  In electrical connection between electronic components, it may be sufficient to ensure conductivity only with a part of the bonding surface of the electronic components. Conventionally, even in such a case, an adhesive film in which conductive particles are dispersed has been used over the entire adhesive surface of the electronic component. However, conductive particles are also disposed in portions where it is not necessary to ensure conductivity. This results in extra material costs.

  Then, one side of this invention aims at providing the adhesive film which can suppress the usage-amount of electroconductive particle to required minimum.

  One aspect of the present invention includes a base material, a conductive adhesive layer provided on a part of one surface of the base material, and a non-conductive adhesive layer provided on the other part of the one surface. It is an adhesive film provided.

  In this adhesive film, the conductive adhesive layer is provided only on a part of the surface of the base material (the part that needs electrical conductivity), while the other part on the surface of the base material (conductivity is not required). A non-conductive adhesive layer is provided on the part). As a result, the amount of conductive particles used can be minimized.

  The conductive adhesive layer may have isotropic conductivity and may have anisotropic conductivity.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to provide the adhesive film which can suppress the usage-amount of electroconductive particle to the required minimum.

It is a perspective view which shows the adhesive film which concerns on one Embodiment. It is a perspective view which shows the adhesive film which concerns on other one Embodiment. It is a perspective view which shows the adhesive film which concerns on other one Embodiment. It is a perspective view which shows the adhesive film which concerns on other one Embodiment.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as appropriate.

  FIG. 1 is a perspective view showing an adhesive film according to an embodiment. As shown in FIG. 1, an adhesive film 1 according to an embodiment includes a base material 2, a conductive adhesive layer 3 provided on a part of one surface of the base material 2, and one base material 2. And a non-conductive adhesive layer 4 provided in the other part on the surface. That is, the conductive adhesive layer 3 and the non-conductive adhesive layer 4 (hereinafter collectively referred to as “adhesive layers 3 and 4”) are provided on the same surface of the substrate 2. Thus, the adhesive film 1 has a conductive region (a region corresponding to the conductive adhesive layer 3) and a non-conductive region (a region corresponding to the nonconductive adhesive layer 4). doing.

  The planar shapes of the conductive adhesive layer 3 and the nonconductive adhesive layer 4 are, for example, substantially the same as each other, and are rectangular. The conductive adhesive layer 3 and the nonconductive adhesive layer 4 are disposed over substantially the entire surface of the substrate 2 so as to be in contact with each other on one side surface, for example.

  The base material 2 may be a resin film formed of polyethylene terephthalate (PET), polyethylene, polypropylene or the like. The surface of the substrate 2 on which the adhesive layers 3 and 4 are provided may be subjected to mold release treatment, plasma treatment or the like. The thickness of the base material 2 may be, for example, 5 to 200 μm.

  The conductive adhesive layer 3 includes, for example, an adhesive component 5 and a plurality of conductive particles 6 dispersed in the adhesive component 5. The nonconductive adhesive layer 4 is made of, for example, an adhesive component 7. The adhesive components 5 and 7 contained in these adhesive layers 3 and 4 may be the same as or different from each other, and may be adhesive components described below.

  The adhesive components 5 and 7 may be thermosetting adhesive components, for example. The thermosetting adhesive component contains, for example, a thermosetting resin such as an epoxy resin and a curing agent, and may further contain a thermoplastic resin, a coupling agent, a filler, etc., if necessary. .

  Examples of the epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol A novolak type epoxy resin, bisphenol F novolak type epoxy resin. Alicyclic epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, hydantoin type epoxy resin, isocyanurate type epoxy resin, aliphatic chain epoxy resin and the like. These epoxy resins may be halogenated, may be hydrogenated, and may have a structure in which an acryloyl group or a methacryloyl group is added to a side chain.

  The curing agent is not particularly limited as long as it can cure the epoxy resin, and examples thereof include an anionic polymerizable catalyst curing agent, a cationic polymerizable catalyst curing agent, and a polyaddition curing agent. Can be mentioned. Content of a hardening | curing agent may be 0.05-20 mass parts with respect to 100 mass parts of total amounts of a thermosetting resin and the thermoplastic resin mix | blended if necessary.

  Anionic or cationic polymerizable catalyst-type curing agents include, for example, imidazole series, hydrazide series, boron trifluoride-amine complex, onium salts (aromatic sulfonium salts, aromatic diazonium salts, aliphatic sulfonium salts, etc.), amine imides, Diaminomaleonitrile, melamine and derivatives thereof, polyamine salts, dicyandiamide, and the like, and modified products thereof may also be used. Examples of the polyaddition type curing agent include polyamine, polymercaptan, polyphenol, and acid anhydride.

  The adhesive components 5 and 7 may be, for example, a photocurable adhesive component. The photocurable adhesive component may be, for example, a radical curable adhesive component, which contains a radical polymerizable compound and a radical polymerization initiator, and if necessary, a thermoplastic resin, a coupling agent, and a filler. Etc. may further be contained.

  The radical polymerizable compound may be, for example, a compound having a functional group that is polymerized by radicals. The radical polymerizable compound may be, for example, an acrylate (including the corresponding methacrylate; the same shall apply hereinafter) compound, an acryloxy (including the corresponding methacryloxy; the same shall apply hereinafter) compound, a maleimide compound, a citraconic resin, a nadiimide resin, or the like. .

  Examples of the acrylate compound include methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylol propane triacrylate, tetramethylol methane tetraacrylate, 2-hydroxy-1,3-diacrylate. Loxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl] propane, 2,2-bis [4- (acryloxypolyethoxy) phenyl] propane, dicyclopentenyl acrylate, tricyclodecanyl acrylate, tris (Acryloyloxyethyl) isocyanurate, urethane acrylate, phosphoric acid ester diacrylate and the like.

  The radical polymerization initiator may be a compound that decomposes by heating or light irradiation to generate free radicals, for example. The radical polymerization initiator may be, for example, a peroxide compound or an azo compound. The radical polymerization initiator is preferably diacyl peroxide, peroxydicarbonate, peroxyester, peroxyketal, dialkyl peroxide, hydroperoxide, silyl peroxide, or the like. Content of a radical polymerization initiator may be 0.1-10 mass parts with respect to 100 mass parts of total amounts of a radically polymerizable compound and the thermoplastic resin mix | blended if necessary.

  The thermoplastic resin blended as necessary with the thermosetting or photocurable adhesive component is, for example, phenoxy resin, polyvinyl formal resin, polystyrene resin, polyvinyl butyral resin, polyester resin, polyamide resin, xylene resin, polyurethane resin, It may be a polyester urethane resin, a phenol resin, a terpene phenol resin, or the like.

  When blended in the thermosetting adhesive component, the thermoplastic resin content may be 5 to 80 parts by mass with respect to 100 parts by mass of the total amount of the thermosetting resin and the thermoplastic resin. The content of the thermoplastic resin is 5 to 80 parts by mass with respect to 100 parts by mass of the total amount of the radical polymerizable compound and the thermoplastic resin when blended with the photocurable (radical curable) adhesive component. It's okay.

  The conductive particles 6 included in the conductive adhesive layer 3 include, for example, a non-conductive core and a conductive layer provided on the core. The average particle diameter of the conductive particles 6 may be 1 to 30 μm, for example. The average particle diameter is measured by a particle size distribution measuring apparatus (Microtrack (product name, Nikkiso Co., Ltd.)) using a laser diffraction / scattering method.

  The core is made of a nonconductive material such as glass, ceramic, or resin, and is preferably made of resin. Examples of the resin include acrylic resin, styrene resin, silicone resin, polybutadiene resin, and a copolymer of monomers constituting these resins. The average particle diameter of the nucleus may be, for example, 1 to 30 μm.

  The conductive layer is made of, for example, gold, silver, copper, nickel, palladium, or an alloy thereof. The conductive layer is formed by, for example, plating the above metal on the core. The thickness of the conductive layer may be 10 to 400 nm, for example.

  The content of the adhesive component 5 in the conductive adhesive layer 3 may be 75 to 98% by volume based on the total volume of the conductive adhesive layer 3. The content of the conductive particles 6 in the conductive adhesive layer 3 may be 2 to 20% by volume based on the total volume of the conductive adhesive layer 3.

  The conductive adhesive layer 3 may be an isotropic conductive adhesive layer having isotropic conductivity and has anisotropic conductivity (for example, conductive only in the thickness direction of the conductive adhesive layer 3). ) An anisotropic conductive adhesive layer may be used. The conductivity of the conductive adhesive layer 3 is selected according to the purpose of use of the adhesive film 1.

  The thickness of the conductive adhesive layer 3 may be, for example, 5 to 50 μm. The thickness of the nonconductive adhesive layer 4 may be 5 to 50 μm, for example.

  In the adhesive film 1 described above, the conductive adhesive layer 3 is provided only on a part of the surface of the base material 2 (the part that needs conductivity), while the other on the surface of the base material 2 is provided. A non-conductive adhesive layer 4 is provided on the portion (portion where conductivity is not required). As a result, the amount of conductive particles 6 used can be minimized.

  In the said embodiment, although the adhesive film 1 is provided with the electroconductive area | region which consists of the electroconductive adhesive layer 3, and the nonelectroconductive area | region which consists of the nonelectroconductive adhesive layer 4 one each, In the embodiment, one or both of a conductive region and a non-conductive region may be provided. 2 and 3 are perspective views showing an adhesive film according to another embodiment.

  As shown in FIG. 2A, an adhesive film 11 according to another embodiment may include one conductive region and two conductive regions. In this adhesive film 11, the first non-conductive adhesive layer 14a, the conductive adhesive layer 13, and the second non-conductive adhesive layer 14b are arranged in this order on one surface of the substrate 2. Are arranged in a one-dimensional direction. The planar shapes of the first non-conductive adhesive layer 14a, the conductive adhesive layer 13, and the second non-conductive adhesive layer 14b are substantially the same as each other, and are rectangular.

  As shown in FIG.2 (b), the adhesive film 21 which concerns on other one Embodiment may be provided with two electroconductive area | regions and one electroconductive area | region. In this adhesive film 21, the first conductive adhesive layer 23a, the non-conductive adhesive layer 24, and the second conductive adhesive layer 23b are arranged in this order on one surface of the substrate 2. Arranged in a one-dimensional direction. The planar shapes of the first conductive adhesive layer 23a, the nonconductive adhesive layer 24, and the second conductive adhesive layer 23b are substantially the same as each other, and are rectangular.

  As shown in FIG. 3, the adhesive film according to another embodiment may include two conductive regions and two conductive regions. In this case, for example, as shown in FIG. 3A, in the adhesive film 31 according to one embodiment, the conductive adhesive layers 33 a and 33 b and the nonconductive adhesive layer are formed on one surface of the substrate 2. 34a and 34b may be alternately arranged in a one-dimensional direction. Further, for example, as shown in FIG. 3B, in the adhesive film 41 according to another embodiment, the conductive adhesive layers 43 a and 43 b and the nonconductive adhesive are formed on one surface of the base material 2. The layers 44a and 44b may be arranged alternately (staggered) in the two-dimensional direction. In these embodiments, the planar shapes of the conductive adhesive layers 33a and 33b (43a and 43b) and the non-conductive adhesive layers 34a and 34b (44a and 44b) are substantially the same, and are rectangular. Shape.

  In each of the above embodiments, the planar shapes of the conductive adhesive layer and the non-conductive adhesive layer are substantially the same as each other and are rectangular, but the conductive adhesive layer and the non-conductive adhesive The planar shape of the layers may be different from each other, and may be a shape other than a rectangular shape (for example, a circular shape, an elliptical shape, a polygonal shape other than a rectangular shape, etc.). FIG. 4 is a perspective view showing an adhesive film according to another embodiment.

  For example, as shown in FIG. 4A, the adhesive film 51 according to another embodiment is a conductive adhesive having a planar rectangular shape provided on a part (near one end) on one surface of the substrate 2. The adhesive layer 53 and a non-conductive adhesive layer 54 having a planar rectangular shape with a larger area than the conductive adhesive layer 53 provided in the other part may be provided. Moreover, for example, as shown in FIG. 4B, the adhesive film 61 according to another embodiment is a plane substantially circular shape provided on a part (near the center) of one side of the substrate 2. The conductive adhesive layer 63 and a non-conductive adhesive layer 64 provided on the other part may be provided.

  Also in the adhesive film according to each of the above embodiments, the conductive adhesive layer is provided only on a part (necessary part) on the surface of the substrate 2, while the other on the surface of the substrate 2. The part is provided with a non-conductive adhesive layer. As a result, the amount of conductive particles 6 used can be minimized. In addition, as shown in each embodiment, since the size and arrangement of the conductive adhesive layer and the non-conductive adhesive layer can be arbitrarily set, the conductive region and the non-conductive state corresponding to the bonding surface of the electronic component can be set. The degree of freedom in designing the sex region is increased.

  Although not shown, in another embodiment, the conductive adhesive layer and the non-conductive adhesive layer may be formed only on a part of one surface of the substrate (over the entire surface of the substrate). It may not be formed). In another embodiment, the thickness of the conductive adhesive layer and the thickness of the non-conductive adhesive layer may be different from each other. In another embodiment, the conductive adhesive layer and the non-conductive adhesive layer may be provided separately from each other.

  In another embodiment, the adhesive film may further include a cover film provided to cover all or a part of the conductive adhesive layer and the non-conductive adhesive layer. That is, another embodiment of the adhesive film includes a base material, an adhesive layer provided on one surface of the base material, and a cover film provided on the surface of the adhesive layer opposite to the base material. And the adhesive layer has a conductive adhesive layer and a non-conductive adhesive layer.

  The adhesive film described above can be obtained, for example, by laminating a conductive adhesive layer and a non-conductive adhesive layer formed in advance in a film shape having a desired shape and size on a substrate. Lamination is performed by, for example, hot roll lamination.

  1, 11, 21, 31, 41, 51, 61 ... adhesive film, 2 ... base material, 3, 13, 23a, 23b, 33a, 33b, 43a, 43b, 53, 63 ... conductive adhesive layer, 4 , 14a, 14b, 24, 34a, 34b, 44a, 44b, 54, 64 ... non-conductive adhesive layers.

Claims (3)

A substrate;
A conductive adhesive layer provided on a part of one surface of the substrate;
An adhesive film comprising: a non-conductive adhesive layer provided on the other part on the one surface.   The adhesive film according to claim 1, wherein the conductive adhesive layer has isotropic conductivity.   The adhesive film according to claim 1, wherein the conductive adhesive layer has anisotropic conductivity.

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